CN109904149A - A kind of integrating optical sensor - Google Patents
A kind of integrating optical sensor Download PDFInfo
- Publication number
- CN109904149A CN109904149A CN201910018619.8A CN201910018619A CN109904149A CN 109904149 A CN109904149 A CN 109904149A CN 201910018619 A CN201910018619 A CN 201910018619A CN 109904149 A CN109904149 A CN 109904149A
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- Prior art keywords
- aperture
- groove
- optical
- circuit substrate
- optical sensor
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- 230000003287 optical effect Effects 0.000 title claims abstract description 62
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000012536 packaging technology Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The present invention relates to sensor fields, more particularly to a kind of integrating optical sensor, it is characterized in that, including a circuit substrate, cover of meter hood is set on the circuit substrate, the first groove and the second groove are provided on the circuit substrate, optical transmitting set is provided in first groove, optical receiver is provided in second groove, the first aperture and the second aperture are provided on the cover of meter hood, the direction of the launch of the transmitter is towards first aperture, and the receiving direction of the optical receiver is towards second aperture；The present invention is cheap and more slim by designing a kind of integrating optical sensor；Plate washer is lacked compared with prior art and has been easy to integrated with existing MEMS microphone, i.e., has integrated optical module in traditional MEMS microphone and packaging technology is compatible.
Description
Technical field
The present invention relates to sensor field more particularly to a kind of integrating optical sensors.
Background technique
In recent years, with universal and 5G the development of notebook, smart phone etc., optical sensor has obtained rapid popularization.
In traditional optical sensor, as shown in Figure 1, include an optical transmitter 2, an optical receiver 3, an intermediate baffle 1, carry out light every
From, it is infrared by sending, after the reflection point outside one, received by optical receiver；It is huge that there are costs, and stacked package lacks
It falls into.
Summary of the invention
The object of the present invention is to provide a kind of integrating optical sensors, solve the above technical problem.
Technical problem solved by the invention can be realized using following technical scheme:
A kind of integrating optical sensor, which is characterized in that including a circuit substrate, metal cap is set on the circuit substrate
Lid is provided with the first groove and the second groove on the circuit substrate, is provided with optical transmitting set in first groove, and described the
It is provided with optical receiver in two grooves, the first aperture and the second aperture, the hair of the transmitter are provided on the cover of meter hood
Direction is penetrated towards first aperture, the receiving direction of the optical receiver is towards second aperture.
Preferably, the depth of first groove is not less than the height of the optical transmitting set, the depth of second groove
Not less than the height of the optical receiver.
Preferably, the optical transmitting set is set in first groove by bonding mode, and the optical receiver passes through
Bonding mode is set in second groove.
Preferably, the optical transmitting set is connect with the circuit substrate routing, the optical receiver and the circuit substrate
Routing connection.
Preferably, the cover of meter hood is made of the material of not reflected light.
Preferably, a kind of integrating optical sensor, which is characterized in that it is integrated in MEMS microphone structure,
The cover of meter hood uses the cover of meter hood of MEMS microphone structure, and the circuit substrate uses the microelectromechanicpositioning
The circuit substrate of system microphone structure.
Preferably, first aperture use the MEMS microphone structure the first aperture, described second
Aperture uses the second aperture of the MEMS microphone structure.
The beneficial effect is that:
The present invention is cheap and more slim by designing a kind of integrating optical sensor.It is few compared with prior art
Plate washer.And be easy to integrated with existing MEMS microphone, i.e., it is integrated in traditional MEMS microphone
Optical module and packaging technology compatibility.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the prior art；
Fig. 2 is structural schematic diagram figure of the invention；
Fig. 3 is the present invention and the integrated schematic diagram of MEMS microphone structure.
Appended drawing reference indicates explanation in description above:
1, baffle；2, infrared launcher；3, infrared receiving device；
4, cover of meter hood；41, the first aperture；42, the second aperture；
5, circuit substrate；51, the first groove；52, the second groove；
53, optical transmitting set；54, optical receiver；55, processing of circuit unit.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art without creative labor it is obtained it is all its
His embodiment, shall fall within the protection scope of the present invention.
It should be noted that in the absence of conflict, the feature in embodiment and embodiment in the present invention can phase
Mutually combination.
The present invention will be further explained below with reference to the attached drawings and specific examples, but not as the limitation of the invention.
As shown in Fig. 2, a kind of integrating optical sensor, including a circuit substrate 5, cover of meter hood is set on circuit substrate 5
4, the first groove 51 and the second groove 52 are provided on circuit substrate 5, are provided with optical transmitting set 53 in the first groove 51, second is recessed
It is provided with optical receiver 54 in slot 52, the first aperture 41 and the second aperture 42, the transmitting of transmitter 53 are provided on cover of meter hood 4
Direction the first aperture 41 of direction, receiving direction the second aperture 42 of direction of optical receiver 54.
In preferred embodiments of the present invention, the depth of the first groove 51 is not less than the height of optical transmitting set 53, the second groove
52 depth is not less than the height of optical receiver 54.Optical transmitting set 53 is set in the first groove 51 by bonding mode, and light connects
It receives device 54 to be set in the second groove 52 by bonding mode, optical transmitting set 53 and optical receiver 54 is made not to generate shaking, shadow
It rings and works normally.
In preferred embodiments of the present invention, optical transmitting set 53 is connect with optical receiver 54 by routing signal；Routing is also named
Pressure welding refers to using wire, using hot pressing or the ultrasonic energy, completes solid-state circuit intraconnection wiring in microelectronic component
Connection, i.e. connection between chip and circuit or lead frame.
In preferred embodiments of the present invention, cover of meter hood 4 is made of the material of not reflected light.
In preferred embodiments of the present invention, as shown in figure 3, a kind of integrating optical sensor, is integrated in Micro Electro Mechanical System
In microphone structure, cover of meter hood 4 is using the cover of meter hood of MEMS microphone structure, and circuit substrate 5 is using miniature
The circuit substrate of Mechatronic Systems microphone structure, the first aperture 41 use the first aperture of MEMS microphone structure,
Second aperture 42 uses the second aperture of MEMS microphone structure；Optical transmitting set 53 is launched by the first aperture 41
Go, when meet with obstruction object when reflect, by the second aperture 42 and being received by optical receiver 54 when reflecting.Microelectromechanicpositioning
Processing of circuit unit 55 is additionally provided in system microphone structure, integrating optical sensor is in MEMS microphone structure
In integrate optical module so that packaging technology is compatible.
The foregoing is merely preferred embodiments of the present invention, are not intended to limit embodiments of the present invention and protection model
It encloses, to those skilled in the art, should can appreciate that all with made by description of the invention and diagramatic content
Equivalent replacement and obviously change obtained scheme, should all be included within the scope of the present invention.
Claims (7)
1. a kind of integrating optical sensor, which is characterized in that including a circuit substrate, metal cap is arranged on the circuit substrate
Lid is provided with the first groove and the second groove on the circuit substrate, is provided with optical transmitting set in first groove, and described the
It is provided with optical receiver in two grooves, the first aperture and the second aperture are provided on the cover of meter hood, the optical transmitting set
The direction of the launch is towards first aperture, and the receiving direction of the optical receiver is towards second aperture.
2. a kind of integrating optical sensor according to claim 1, which is characterized in that the depth of first groove is not low
In the height of the optical transmitting set, the depth of second groove is not less than the height of the optical receiver.
3. a kind of integrating optical sensor according to claim 1, which is characterized in that the optical transmitting set passes through bonding side
Formula is set in first groove, and the optical receiver is set in second groove by bonding mode.
4. a kind of integrating optical sensor according to claim 1, which is characterized in that the optical transmitting set and the circuit
The connection of substrate routing, the optical receiver are connect with the circuit substrate routing.
5. a kind of integrating optical sensor according to claim 1, which is characterized in that the cover of meter hood is by not reflected light
Material be made.
6. a kind of integrating optical sensor, which is characterized in that be integrated in MEMS microphone structure, the metal cap
Lid uses the cover of meter hood of MEMS microphone structure, and the circuit substrate uses the MEMS microphone
The circuit substrate of structure.
7. a kind of integrated type sensor according to claim 6, which is characterized in that first aperture is using described miniature
First aperture of Mechatronic Systems microphone structure, second aperture use the second of the MEMS microphone structure
Aperture.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910018619.8A CN109904149A (en) | 2019-01-08 | 2019-01-08 | A kind of integrating optical sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910018619.8A CN109904149A (en) | 2019-01-08 | 2019-01-08 | A kind of integrating optical sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109904149A true CN109904149A (en) | 2019-06-18 |
Family
ID=66943677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910018619.8A Pending CN109904149A (en) | 2019-01-08 | 2019-01-08 | A kind of integrating optical sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109904149A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102620822A (en) * | 2012-04-16 | 2012-08-01 | 昆山同心金属塑料有限公司 | Brightness and proximity multi-chip integrated sensor and packaging method thereof |
| WO2018007641A1 (en) * | 2016-07-08 | 2018-01-11 | Robert Bosch Gmbh | Hybrid galvanic connection system for a mems sensor device package |
| WO2018097071A1 (en) * | 2016-11-28 | 2018-05-31 | 京セラ株式会社 | Sensor wiring board, sensor package, and sensor device |
| CN108966103A (en) * | 2018-08-29 | 2018-12-07 | 汤小贾 | MEMS microphone package method, structure and electronic product |
| CN209947838U (en) * | 2019-01-08 | 2020-01-14 | 钰太芯微电子科技（上海）有限公司 | Integrated optical sensor |
-
2019
- 2019-01-08 CN CN201910018619.8A patent/CN109904149A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102620822A (en) * | 2012-04-16 | 2012-08-01 | 昆山同心金属塑料有限公司 | Brightness and proximity multi-chip integrated sensor and packaging method thereof |
| WO2018007641A1 (en) * | 2016-07-08 | 2018-01-11 | Robert Bosch Gmbh | Hybrid galvanic connection system for a mems sensor device package |
| WO2018097071A1 (en) * | 2016-11-28 | 2018-05-31 | 京セラ株式会社 | Sensor wiring board, sensor package, and sensor device |
| US20190376889A1 (en) * | 2016-11-28 | 2019-12-12 | Kyocera Corporation | Sensor wiring substrate, sensor package, and sensor device |
| CN108966103A (en) * | 2018-08-29 | 2018-12-07 | 汤小贾 | MEMS microphone package method, structure and electronic product |
| CN209947838U (en) * | 2019-01-08 | 2020-01-14 | 钰太芯微电子科技（上海）有限公司 | Integrated optical sensor |
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