CN109903680B - Heat dissipation structure, display panel, manufacturing method of display panel and display device - Google Patents
Heat dissipation structure, display panel, manufacturing method of display panel and display device Download PDFInfo
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- CN109903680B CN109903680B CN201910329113.9A CN201910329113A CN109903680B CN 109903680 B CN109903680 B CN 109903680B CN 201910329113 A CN201910329113 A CN 201910329113A CN 109903680 B CN109903680 B CN 109903680B
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Abstract
The application relates to the technical field of display, in particular to a heat dissipation structure, a display panel, a manufacturing method of the display panel and a display device. This heat radiation structure includes: a first face for connection with a display area of a display substrate; the second surface is opposite to the first surface and comprises a first area and a second area, the distance between any point on the first area and the first surface is smaller than the distance between any point on the second area and the first surface, and the second area is used for being connected with a binding area of the display substrate. Among this technical scheme, heat radiation structure can still improve the radiating effect of binding district department of display substrate when guaranteeing display substrate's crooked radian and bending stability to can reduce the temperature with the display region that binds the district and correspond, avoid the display region to produce bad such as whitewashed burn, improve product quality.
Description
Technical Field
The application relates to the technical field of display, in particular to a heat dissipation structure, a display panel, a manufacturing method of the display panel and a display device.
Background
With the development of display devices such as mobile phones toward full-screen narrow frames, many display devices begin to use COP (Chip on panel) packaging technology, that is: the bonding area of the display substrate is bent to the back of its display area in order to obtain a narrower bezel.
It is to be noted that the information disclosed in the above background section is only for enhancement of understanding of the background of the present application and therefore may include information that does not constitute prior art known to a person of ordinary skill in the art.
Disclosure of Invention
An object of the application is to provide a heat radiation structure, a display panel, a manufacturing method of the display panel and a display device, which can ensure the bending radian and the bending stability of the display substrate and can improve the heat radiation efficiency of a binding region.
The present application provides in a first aspect a heat dissipation structure, which includes:
a first face for connection with a display area of a display substrate;
the second surface is opposite to the first surface and comprises a first area and a second area, the distance between any point on the first area and the first surface is smaller than the distance between any point on the second area and the first surface, and the second area is used for being connected with a binding area of the display substrate.
In an exemplary embodiment of the present application, includes:
the adhesive layer comprises a first adhesive surface and a second adhesive surface opposite to the first adhesive surface, and the first adhesive surface is the first surface;
the heat dissipation layer is arranged on one side, deviating from the first bonding surface, of the second bonding surface, and the surface, deviating from the bonding layer, of the heat dissipation layer is the second surface.
In an exemplary embodiment of the present application, a surface of the heat dissipation layer adjacent to the adhesive layer is a flat surface.
In an exemplary embodiment of the present application, further comprising:
and the buffer layer is positioned between the second bonding surface and the heat dissipation layer.
In an exemplary embodiment of the present application, the heat dissipation layer is a metal layer.
A second aspect of the present application provides a display panel, comprising:
the display substrate comprises a display area and a binding area connected with the display area;
the heat dissipation structure is any one of the heat dissipation structures, the first surface is connected with the display area, and the second area of the second surface is connected with the binding area.
In an exemplary embodiment of the present application, further comprising:
the chip is arranged in the binding region.
In an exemplary embodiment of the present application, further comprising:
a flexible circuit board, a portion of which is connected to the first region of the second face and another portion of which is connected to the bonding region.
The third aspect of the present application further provides a method for manufacturing a display panel, including:
providing a display substrate, wherein the display substrate comprises a display area and a binding area connected with the display area;
forming a heat dissipation structure on a display area of the display substrate, wherein the heat dissipation structure is any one of the heat dissipation structures;
connecting the binding region with the second region.
In one exemplary embodiment of the present application, the display substrate is a flexible substrate,
the connecting the binding region with the second region includes:
bending the binding region of the display substrate to the second region, and connecting the binding region and the second region.
In an exemplary embodiment of the present application, forming a heat dissipation structure on a display area of a display substrate includes:
forming a protective layer on the second surface of the heat dissipation structure to obtain a heat dissipation module;
forming the heat dissipation module on a display area of the display substrate;
removing the protective layer from the second side.
In an exemplary embodiment of the present application, forming the heat dissipation module in a display area of the display substrate includes:
placing the heat dissipation module in a display area of the display substrate;
and rolling the heat dissipation module by using a roller so that the heat dissipation module is tightly pressed on the display area of the display substrate.
In an exemplary embodiment of the present application, a surface of the protective layer facing away from the heat dissipation structure is a plane.
A fourth aspect of the present application provides a display device comprising the display panel of any one of the above.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
FIG. 1 is a schematic diagram of a display panel according to the related art;
fig. 2 is a schematic structural diagram of a heat dissipation structure according to an embodiment of the present application;
fig. 3 is a schematic structural diagram of a display panel according to an embodiment of the present application;
fig. 4 is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of the present application;
fig. 5 is a schematic diagram after completion of step S4022;
fig. 6 is a schematic diagram after step S4024 is completed.
Reference numerals:
10. a display substrate; 100. a display area; 101. a binding region; 11. a heat dissipation structure; 110. a first side; 111. a second face; 1111. a first region; 1112. a second region; 1113. a connection region; 112. an adhesive layer; 113. a buffer layer; 114. a heat dissipation layer; 12. a PET structure; 13. a chip; 14. a flexible circuit board; 15. a protective layer; 16. a roller; 17. a glass cover plate.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed description will be omitted.
Although relative terms, such as "upper" and "lower," may be used in this specification to describe one element of an icon relative to another, these terms are used in this specification for convenience only, e.g., in accordance with the orientation of the examples described in the figures. It will be appreciated that if the device of the icon were turned upside down, the element described as "upper" would become the element "lower". When a structure is "on" another structure, it may mean that the structure is integrally formed with the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure via another structure.
The terms "a," "an," "the," "said" are used to indicate the presence of one or more elements/components/etc.; the terms "comprising" and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. other than the listed elements/components/etc.; the terms "first," "second," and the like are used merely as labels, and are not limiting on the number of their objects.
In the related art, since the luminescent material of the display substrate is prone to generate defects such as powder burning under high temperature conditions, in order to improve the display effect of the display substrate, a heat dissipation structure is usually disposed on the back of the display area of the display substrate to improve the heat dissipation efficiency and avoid the display area from having too high temperature.
As shown in fig. 1, the heat dissipation structure 11 is generally a flat plate structure. And the heat dissipation structure 11 is thinner, which is beneficial to thinning the display product. However, since the heat dissipation structure 11 is relatively thin, when a product is packaged in the COP packaging technology, that is: when bending the bonding region 101 of the display substrate 10 to the back side of the display region 100, a PET (Polyethylene terephthalate) structure 12 is usually required to be disposed on the heat dissipation structure 11 to increase the distance between the bonding region 101 and the display region 100, so as to ensure the curvature and stability of the display substrate 10. However, the PET structure 12 has poor thermal conductivity, so that the bonding area 101 binds the structure, for example: the chip 13 is difficult to dissipate heat generated during operation in time, so that the heat is accumulated at the binding region 101, the heat is easily attenuated by the luminescent material at the display region 100 after being conducted to the display region 100, and the G (green) pixel and the B (blue) pixel have attenuation rates higher than that of the R (red) pixel, so that the display region 100 corresponding to the binding region 101 has defects such as powder generation and the like, and can generate black burn in severe cases.
In order to solve the above technical problem, the present embodiment provides a heat dissipation structure 11, and the heat dissipation structure 11 can be disposed on the back side of the display substrate 10. As shown in fig. 2, fig. 3, fig. 5 and fig. 6, the heat dissipation structure 11 may include a first surface 110 and a second surface 111 opposite to the first surface 110. Wherein:
the first surface 110 may be a plane surface for connecting with the display area 100 of the display substrate 10.
And the second face 111 may be a stepped face. Specifically, the second surface 111 may include a first region 1111 and a second region 1112. The first region 1111 and the second region 1112 are both planar regions and are parallel to the first surface 110. The distance between any point on the first region 1111 and the first surface 110 is smaller than the distance between any point on the second region 1112 and the first surface 110, that is, the thickness of the portion of the heat dissipation structure 11 corresponding to any point on the second region 1112 is greater than the thickness of the portion of the heat dissipation structure 11 corresponding to any point on the first region 1111. Since the thickness of the portion of the heat dissipation structure 11 corresponding to any point on the second region 1112 is relatively thick, the second region 1112 can be connected to the bonding region 101 of the display substrate 10, which not only can ensure the bending curvature and the bending stability of the display substrate 10, but also can increase the distance between the bonding region 101 and the display region 100, thereby reducing the influence of the temperature at the bonding region 101 on the display region 100.
Wherein, through setting second face 111 to the ladder face, namely: by providing the heat dissipation structure 11 as a stepped structure, the use of the PET structure 12 in the related art can be eliminated while ensuring the bending radian and the bending stability of the display substrate 10, so that the processing steps of the display panel can be reduced, the processing efficiency can be improved, and the production cost can be reduced. In addition, since the bonding region 101 of the display substrate 10 is directly connected to the heat dissipation structure 11, heat generated by the bonding structure at the bonding region 101 can be rapidly dissipated to the outside through the heat dissipation structure 11, so that the situation that heat is accumulated at the bonding region 101 and conducted to the display region 100 can be avoided, the situation that the display region 100 is burnt due to over-high temperature is alleviated, and the product quality is improved.
Note that the first region 1111 of the second surface 111 can be used for connection with an FPC (Flexible Printed Circuit Board, Flexible Circuit Board 14) in the display panel. Further, this second face 111 includes not only the aforementioned first region 1111 and second region 1112, but also a connection region 1113 connecting the first region 1111 and second region 1112.
The specific structure of the heat dissipation structure 11 according to the embodiment of the present application will be described in detail below with reference to the accompanying drawings.
The heat dissipation structure 11 may be a multi-layer structure, but is not limited thereto, and may also be a single-layer structure. Taking the heat dissipation structure 11 as a multi-layer structure, as shown in fig. 2, the heat dissipation structure 11 may include an adhesive layer 112 and a heat dissipation layer 114. Wherein:
the adhesive layer 112 may include a first adhesive surface and a second adhesive surface opposite to the first adhesive surface. The first bonding surface and the second bonding surface may both be planar. The first bonding surface may be the aforementioned first surface 110, that is, the heat dissipation structure 11 may be connected to the display area 100 of the display substrate 10 by bonding. For example, the adhesive layer 112 may be made of a material such as silicon gel, which has a certain buffering property while having an adhesive property, so as to protect the display substrate 10. However, the adhesive layer 112 is not limited to a material such as silicone, and may be made of other materials.
And the heat spreading layer 114 is arranged on the side of the second adhesive side facing away from the first adhesive side. The surface of the heat dissipation layer 114 facing away from the adhesive layer 112 is the aforementioned second surface 111, and the second surface 111 is a stepped surface; the surface of the heat dissipation layer 114 close to the adhesive layer 112 is a plane, that is, the thickness of the portion of the heat dissipation layer 114 corresponding to any point of the second region 1112 is greater than the thickness of the portion of the heat dissipation layer 114 corresponding to any point of the first region 1111. The thickness of the portion of the heat dissipation layer 114 corresponding to any point of the second region 1112 is increased, so that the heat dissipation structure 11 is formed into a step structure, which can ensure the curvature and the bending stability of the display substrate 10 and improve the heat dissipation efficiency.
For example, the heat dissipation layer 114 can be a metal layer, that is, the heat dissipation layer 114 can be made of a metal material, such as: copper, stainless steel, and the like, to improve the heat dissipation efficiency of the heat dissipation structure 11. In addition, the heat dissipation layer 114 can also be made of a non-metal heat dissipation material, such as graphite.
Alternatively, the aforementioned heat dissipation layer 114 may be disposed on a side of the second adhesive surface facing away from the first adhesive surface, and the arrangement mentioned herein may be a direct arrangement or an indirect arrangement. That is, the heat dissipation layer 114 may be directly bonded to the second bonding surface, or other structures may be disposed between the second bonding surface and the heat dissipation layer 114, as shown in fig. 2, a buffer layer 113 may be disposed between the second bonding surface and the heat dissipation layer 114, and the buffer layer 113 may be foam, but is not limited thereto, and by disposing the buffer layer 113 between the second bonding surface and the heat dissipation layer 114, the buffering performance of the heat dissipation structure 11 may be improved, so as to effectively protect the display substrate 10.
In an embodiment of the present invention, as shown in fig. 3, the display panel may include a display substrate 10 and a heat dissipation structure 11, where the display substrate 10 may be an OLED (Organic Light-Emitting Diode) display substrate; the heat dissipation structure 11 may be the heat dissipation structure 11 mentioned in any of the above embodiments, and is not described herein again. The display substrate 10 may include a display area 100 and a binding area 101 connected to the display area 100; the heat dissipation structure 11 may be disposed at the back side of the display substrate 10; the first side 110 of the heat dissipation structure 11 can be connected to the display area 100, and the second region 1112 of the second side 111 thereof is connected to the bonding area 101.
It should be noted that the display substrate 10 may be a flexible substrate, that is, the bonding region 101 may be bent to the back side of the display region 100 and connected to the second region 1112 of the heat dissipation structure 11.
In an embodiment, as shown in fig. 3, the display panel may further include a chip 13, and the chip 13 is disposed in the bonding region 101. For example, the chip 13 may be disposed on the bonding region 101 by bonding or soldering. In this embodiment, the heat generated by the chip 13 bound to the binding region 101 can be rapidly dissipated through the heat dissipation structure 11, so that the situation that the heat is accumulated at the binding region 101 and conducted to the display region 100 can be avoided, the situation that the part of the display region 100 opposite to the binding region 101 is burnt due to over-high temperature is alleviated, and the product quality is improved.
As shown in fig. 3, the display panel may further include a flexible circuit board 14, and a portion of the flexible circuit board 14 is connected to the first region 1111 of the second surface 111, and another portion is connected to the bonding area 101. In this embodiment, a part of the flexible circuit board 14 is located in the first region 1111 of the second surface 111 of the heat dissipation structure 11, so that the space utilization rate can be improved, and the overall thinning of the display panel is facilitated. For example, but not limited to, a portion of the flexible circuit board 14 may be connected to the first region 1111 of the second surface 111 by an adhesive, and another portion of the flexible circuit board 14 may be connected to the bonding region 101 by a soldering method.
Based on the above structure, in the manufacturing process of the display panel, the chip 13 and the flexible circuit board 14 may be connected to the bonding area 101, and then the bonding area 101 of the display substrate 10 is bent to the back side of the display area 100, and the bonding area 101 is connected to the second area 1112 of the second surface 111 of the heat dissipation structure 11, so that another portion of the flexible circuit board 14 is connected to the first area 1111 of the second surface 111 of the heat dissipation structure 11.
It should be noted that, as shown in fig. 3, the display panel may further include a glass cover 17, and the glass cover 17 is disposed on the display side of the display substrate 10.
Further, as shown in fig. 4, an embodiment of the present application further provides a method for manufacturing a display panel, which includes:
step S400, providing a display substrate 10, wherein the display substrate 10 includes a display area 100 and a binding area 101 connected to the display area 100;
step S402, forming a heat dissipation structure 11 on the display area 100 of the display substrate 10, where the heat dissipation structure 11 may be the heat dissipation structure 11 described in any of the above embodiments, and is not described herein again;
in step S404, the bonding region 101 is connected to the second region 1112 of the heat dissipation structure 11.
The following describes a method for manufacturing the display panel according to this embodiment with reference to the accompanying drawings.
In step S400, a display substrate 10 is provided, wherein the display substrate 10 includes a display area 100 and a bonding area 101 connected to the display area 100.
For example, the display substrate 10 may be a flexible substrate. And the display substrate 10 may be a flat plate structure. The bonding region 101 of the display substrate 10 may be bonded with a chip 13, a flexible circuit board 14, and other structures.
In step S402, the heat dissipation structure 11 is formed on the display area 100 of the display substrate 10. In detail, the step S402 may include a step S4022, a step S4024 and a step S4026. Wherein:
in step S4022, a protective layer 15 is formed on the second surface 111 of the heat dissipation structure 11 to obtain a heat dissipation module, as shown in fig. 5.
In this embodiment, the protective layer 15 is disposed on the second surface 111 of the heat dissipation structure 11, so as to protect the heat dissipation structure 11 and prevent the heat dissipation structure 11 from being damaged when being formed in the display area 100 of the display substrate 10. For example, the protection layer 15 may be a release film, which facilitates the subsequent peeling of the protection layer 15 from the heat dissipation structure 11.
In step S4024, a heat sink module is formed in the display area 100 of the display substrate 10, as shown in fig. 6.
In detail, as shown in fig. 6, the heat dissipation module may be first placed in the display area 100 of the display substrate 10; the first surface 110 of the heat dissipation structure 11 of the heat dissipation module can be bonded to the display substrate 10, but is not limited thereto. The roller 16 may be used to roll the heat dissipation module, specifically, the roller 16 contacts the passivation layer 15, and then the roll pressing is performed on the passivation layer 15 side, so that the heat dissipation module is pressed on the display area 100 of the display substrate 10, thereby improving the connection stability between the heat dissipation structure 11 and the display area 100 of the display substrate 10.
It should be noted that, because the roller 16 is needed to roll the heat dissipation module, in order to improve the rolling efficiency, the surface of the protection layer 15 away from the heat dissipation structure 11 may be designed to be a plane, so that the roller 16 rolls on the protection layer 15, and the surface of the protection layer 15 facing the heat dissipation structure 11 may be a stepped surface, that is, the protection layer 15 may be stepped to match the stepped shape of the heat dissipation structure 11.
In step S4026, the protective layer 15 is removed from the second surface 111.
For example, since the protection layer 15 can be a release film, that is, the bonding strength between the protection layer 15 and the second surface 111 of the heat dissipation structure 11 is weak, the protection layer 15 can be directly peeled off from the second surface 111.
In step S404, the binding region 101 is connected with the second region 1112.
In detail, when the display substrate 10 is the aforementioned flexible substrate, the bonding region 101 of the display substrate 10 may be bent to the second region 1112 of the second surface 111 of the heat dissipation structure 11, and the bonding region 101 is connected to the second region 1112.
The embodiment of the present application further provides a display device, where the display device may be a mobile phone, a tablet or other terminal device, and the display device may include the display panel mentioned in any of the foregoing embodiments.
Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.
Claims (14)
1. A heat radiation structure, has first face and second face, first face is used for being connected with the display area of display substrate, the second face with first face is relative, its characterized in that:
the second surface comprises a first area and a second area, the distance between any point on the first area and the first surface is smaller than the distance between any point on the second area and the first surface, and the second area is used for being connected with a binding area of the display substrate.
2. The heat dissipation structure according to claim 1, comprising:
the adhesive layer comprises a first adhesive surface and a second adhesive surface opposite to the first adhesive surface, and the first adhesive surface is the first surface;
the heat dissipation layer is arranged on one side, deviating from the first bonding surface, of the second bonding surface, and the surface, deviating from the bonding layer, of the heat dissipation layer is the second surface.
3. The heat dissipating structure of claim 2, wherein the surface of the heat dissipating layer adjacent to the adhesive layer is planar.
4. The heat dissipation structure according to claim 2, further comprising:
and the buffer layer is positioned between the second bonding surface and the heat dissipation layer.
5. The heat dissipation structure of claim 2, wherein the heat dissipation layer is a metal layer.
6. A display panel, comprising:
the display substrate comprises a display area and a binding area connected with the display area;
the heat dissipation structure of any one of claims 1 to 5, the first face being connected to the display area, the second region of the second face being connected to the bonding area.
7. The display panel according to claim 6, further comprising:
the chip is arranged in the binding region.
8. The display panel according to claim 6, further comprising:
a flexible circuit board, a portion of which is connected to the first region of the second face and another portion of which is connected to the bonding region.
9. A method for manufacturing a display panel is characterized by comprising the following steps:
providing a display substrate, wherein the display substrate comprises a display area and a binding area connected with the display area;
forming a heat dissipation structure on a display area of the display substrate, the heat dissipation structure being as claimed in any one of claims 1 to 5;
connecting the binding region with the second region.
10. The method of manufacturing according to claim 9,
the display substrate is a flexible substrate,
the connecting the binding region with the second region includes:
bending the binding region of the display substrate to the second region, and connecting the binding region and the second region.
11. The method of claim 9, wherein forming a heat dissipation structure on the display area of the display substrate comprises:
forming a protective layer on the second surface of the heat dissipation structure to obtain a heat dissipation module;
forming the heat dissipation module on a display area of the display substrate;
removing the protective layer from the second side.
12. The method of claim 11, wherein forming the heat sink module in the display area of the display substrate comprises:
placing the heat dissipation module in a display area of the display substrate;
and rolling the heat dissipation module by using a roller so that the heat dissipation module is tightly pressed on the display area of the display substrate.
13. The method of claim 11, wherein a surface of the protective layer facing away from the heat dissipation structure is planar.
14. A display device characterized by comprising the display panel according to any one of claims 6 to 8.
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| CN201910329113.9A CN109903680B (en) | 2019-04-23 | 2019-04-23 | Heat dissipation structure, display panel, manufacturing method of display panel and display device |
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| CN110459136B (en) * | 2019-08-29 | 2021-08-20 | 上海天马微电子有限公司 | Display panel and display device |
| CN111489660B (en) * | 2020-04-26 | 2022-11-15 | 京东方科技集团股份有限公司 | Display module |
| CN113570975A (en) * | 2020-04-29 | 2021-10-29 | 深圳市柔宇科技有限公司 | Panel assembly and electronic equipment |
| CN114387874A (en) * | 2020-10-21 | 2022-04-22 | 深圳市万普拉斯科技有限公司 | Flexible display panel and mobile terminal |
| CN114495736A (en) * | 2020-11-12 | 2022-05-13 | 深圳市奥拓电子股份有限公司 | Micro LED display panel, display module and LED display screen |
| CN114582223A (en) * | 2020-12-01 | 2022-06-03 | 京东方科技集团股份有限公司 | Display module, display device and heat dissipation assembly |
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| CN107942563A (en) * | 2017-11-28 | 2018-04-20 | 武汉天马微电子有限公司 | Display module and display device |
| CN207409207U (en) * | 2015-11-24 | 2018-05-25 | 株式会社日本显示器 | Display device |
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| CN207409207U (en) * | 2015-11-24 | 2018-05-25 | 株式会社日本显示器 | Display device |
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