CN109899728B

CN109899728B - LED lamp

Info

Publication number: CN109899728B
Application number: CN201811492241.7A
Authority: CN
Inventors: 王名斌; 江涛; 熊爱明; 周林
Original assignee: Jiaxing Super Lighting Electric Appliance Co Ltd
Current assignee: Jiaxing Super Lighting Electric Appliance Co Ltd
Priority date: 2017-12-08
Filing date: 2018-12-07
Publication date: 2023-06-30
Anticipated expiration: 2038-12-07
Also published as: CN211010828U; CN109899728A; CN111520652B; CN110513627A; CN211475541U; CN212456342U; CN213237005U; CN111520652A; CN214147459U; CN212156699U; CN212156709U; CN110513627B; CN212461721U; CN111520653B; CN212456343U; CN111520653A; CN214675778U; WO2019109991A1

Abstract

The invention discloses an LED lamp, which is characterized by comprising: a lamp housing; the passive heat dissipation assembly comprises a radiator, wherein the radiator comprises heat dissipation fins and a heat dissipation base, and the radiator is connected with the lamp shell; the power supply is positioned in the lamp housing; the lamp panel is connected to the radiator and comprises an LED chip, and the power supply is electrically connected with the LED chip; a first heat dissipation channel is formed in the inner cavity of the lamp housing, one end of the first heat dissipation channel is provided with a first air inlet hole, and the other opposite end of the lamp housing is provided with a heat dissipation hole; the heat dissipation fins and the heat dissipation base form a second heat dissipation channel, the second heat dissipation channel is provided with a second air inlet, and air flows out of the space between the heat dissipation fins through the second heat dissipation channel after entering from the second air inlet.

Description

LED lamp

Technical Field

The invention relates to an LED lamp, in particular to a high-power LED lamp, and belongs to the field of illumination.

Background

The LED lamp is widely used in various lighting fields because of the advantages of energy saving, high efficiency, environmental protection, long service life and the like. The LED lamp is an energy-saving green light source, and the heat dissipation problem of the high-power LED is paid attention to, because the light-emitting efficiency is attenuated due to the excessively high temperature, and if the waste heat generated by the operation of the high-power LED cannot be effectively dissipated, the life of the LED is directly and fatally affected, so in recent years, the solution of the heat dissipation problem of the high-power LED becomes an important subject for research and development of many related people.

In some applications, there may be weight limitations for the entire LED lamp. For example, when LED lamps employ certain specific specifications of lamp caps and are used in a hanging manner, the maximum weight of the LED lamps is limited to a certain range. Therefore, the weight of the heat sink for heat dissipation of the LED lamp is limited to a limited range after removing necessary components such as a power source, a lamp housing, and the like. For some high-power LED lamps, for example, 150W to 300W, the luminous flux can reach about 20000 lumen to 45000 lumen, that is, the heat sink is required to dissipate heat generated from the LED lamp generating 20000 lumen to 45000 lumen within its weight limit.

The heat dissipation components of the current LED lamp mostly adopt the design of a fan, a heat pipe, a heat dissipation fin, or a combination thereof, so as to dissipate the heat energy generated by the LED lamp in a heat conduction, convection and/or radiation manner. Under the condition of only adopting passive heat dissipation (without a fan), the quality of the whole heat dissipation effect depends on the heat conduction coefficient and the heat dissipation area of the material of the heat radiator, under the condition of the same heat conduction coefficient, no matter which heat radiator can only dissipate heat by means of two methods of convection and radiation, and the heat dissipation capacity of the two methods is in direct proportion to the heat dissipation area of the heat radiator, so that on the premise that the weight limit exists in the heat radiator, how to improve the heat dissipation efficiency of the heat radiator is a way of improving the quality of the LED lamp and reducing the cost of the whole LED lamp.

The LED lamp in the prior art generally includes a light source, a radiator, a power supply, a lamp housing and a lamp cover, wherein the light source is fixed with the radiator, the power supply is arranged in the lamp housing, the lamp housing is connected with the radiator, and the lamp housing includes a lamp cap for connecting with a lamp holder. The LED lamp of the related art has the following drawbacks.

1. The design of the radiator is unreasonable: under the condition of only adopting passive heat dissipation, and under certain weight limiting conditions, the heat dissipation problem of the LEDs of the high-power LED lamp cannot be solved by the heat radiator, so that heat generated during the working of the LEDs cannot be dissipated in time, and the service life of the LEDs can be influenced for a long time. Specifically, for example, the radiator includes heat radiation fins, and the relative positional relationship between the heat radiation fins and the LED is unreasonable, which results in heat generated by the LED during operation, and when the heat is conducted to the heat radiation fins, the heat conduction path is too long, which results in untimely heat radiation to the LED.

For example, the convection design between the heat dissipation fins of the radiator is unreasonable, for example, the fanless LED spotlight disclosed in the chinese patent of the publication No. CN 204717489U, the fins of the radiator do not have bottom-to-top convection, so that after the heat of the fins radiates to the air, the heat of the air cannot be timely dissipated, so that the temperature of the air around the fins rises, and an important factor affecting the heat radiation efficiency of the fins is the temperature difference between the fins and the surrounding air, and therefore, the rise of the air temperature affects the subsequent heat radiation of the fins.

For example, the structural design of the heat dissipating fins of the heat sink is unreasonable, for example, the chinese patent publication No. CN107345628A discloses an LED lamp, in which the heat dissipating fins have the same width in the height direction of the LED lamp, but for the heat dissipation of the LED lamp, the heat dissipating fins close to the LED in the height direction of the LED lamp mainly conduct the heat generated by the LED to the heat dissipating fins, while the heat dissipating fins relatively far from the LED need to dissipate the heat to the surrounding environment through heat radiation and convection, that is, the heat dissipating fins far from the LED mainly dissipate the heat through heat radiation and convection, so that no excessive fin area is required, and the design of the heat dissipating fins of the LED lamp disclosed in the above patent may lead to an increase in the overall weight of the LED lamp, but the heat dissipating efficiency cannot be improved accordingly.

In addition, the radiating fins of the radiator have some structural problems, such as a high-power LED lamp, the size of the radiating fins is larger, the width of the radiating fins can reach more than 150mm, the height of the radiating fins can reach more than 180mm, and the radiating fins also have larger length and width sizes, so that the radiating fins are easy to deflect when being processed and molded if the radiating fins lack corresponding support; for another example, the design of the outer contour of the radiating fin in the radial direction of the LED lamp is unreasonable, so that the radiating effect of the radiating fin is reduced, and the radiating fin cannot be well adapted to the lamp matched with the radiating fin.

2. The setting of the power supply is unreasonable: for some high-power LED lamps, for example, when the power reaches 150W-300W, the heat dissipation of the power supply is also important, and if the heat generated by the power supply cannot be dissipated in time when the LED lamp works, the service life of some electronic components (particularly components with high heat sensitivity, such as a capacitor) can be influenced, so that the service life of the whole lamp is influenced. Generally, no effective heat management between the radiator and the power supply in the prior art will cause the mutual influence between the heat of the radiator and the heat of the power supply, for example, in the chinese patent of patent publication No. CN 203190364U, a dual-channel air convection lamp radiating structure and a PAR lamp using the same are disclosed, wherein the radiating fins are located between the radiating fins and a cavity (a part of the cavity is directly formed on the radiator) containing the power supply, no effective heat isolation exists between the light source and the cavity containing the power supply, and the heat generated by the radiating fins and the light source is easy to directly enter the cavity through heat conduction, thereby influencing the power supply in the cavity.

In addition, the layout of the electronic components of the power supply is unreasonable, for example, the heating components (such as resistors, inductors and transformers) are arranged together, so that the formation of the temperature gradient between the heating components and the surrounding air is not facilitated, and the efficiency of heat radiation to the air of the heating components is affected. In addition, it should be noted that when external air is convected to the power supply, insects, dust, etc. are easily attached to the power supply if not specifically designed, thereby affecting heat dissipation of the power supply.

In addition to the heat dissipation problem, the high power LED lighting products themselves are relatively heavy, and because of the relatively high temperatures during operation, the need for high mechanical strength structural members at high temperatures is a concern. In a general high-power LED lighting product assembly mode, all parts are mainly connected in a screw mode, a plastic part is usually adopted in a lamp neck part above a radiator in consideration of the requirement of insulation creepage distance, the most common structure is that a shell of the plastic part is screwed with a lamp cap, the lamp cap is rotationally locked on the shell, and positioning connection is realized by adding a riveting pinhole. The use of screw connections not only requires a more cumbersome process in the manufacturing flow, but also results in higher costs. Therefore, the combination of the mechanism of the high-power LED lighting product is also one of the important directions of the research and development of the product.

When the packaging and transportation of the LED lamp are involved, the lampshade of the LED lamp is protruded outside the lamp panel, for example, in the chinese patent application publication No. CN 107345628A, the lampshade of the LED lamp may contact and collide with the outside to become a stress point, and the lampshade is generally made of glass or plastic, which has a problem of fragility. Therefore, during packaging and transportation, special protection is required for the lampshade to avoid damage caused by collision, and the operation can increase the packaging cost certainly.

When the light emitting effect of the LED lamp is concerned, it is generally desirable to project the light of the LED lamp into a certain area below the LED lamp to ensure the brightness of the area. In practice, however, a large portion of the light may be directed to the regions on both sides, resulting in a waste of the portion of the light and a reduction in the light output efficiency. For example, in chinese patent application publication No. CN 107345628A, a solid state lamp is disclosed, which includes a solid state light source mounted on a circuit board, and a part of the solid state light source is laterally disposed, and in use, is usually used in combination with a lamp. That is, the portion of the solid-state light source that is laterally disposed needs to emit light to the lower side through the lamp, and the light emitting efficiency of the whole lamp is affected because a certain light loss is generated during the reflection process by the manner of emitting light.

In addition, it is described in the prior art that the bias voltage of the driving circuit is generally generated by dividing the voltage on the bus bar. However, in the application of high power LED lamps (HID-LED, high intensity Discharge-LED), in order to avoid excessive power waste, a bias circuit is usually designed with a large capacitor, which results in a slower HID-LED lighting speed, and a starting speed of the bias mode is about 1 second, which affects the use experience.

In view of the above problems, the present invention and its embodiments are presented below.

Disclosure of Invention

The invention mainly solves the technical problem of providing an LED lamp so as to solve the problem.

The invention provides an LED lamp, which is characterized by comprising:

a lamp housing;

the passive heat dissipation assembly comprises a radiator, wherein the radiator comprises heat dissipation fins and a heat dissipation base, and the radiator is connected with the lamp shell;

the power supply is positioned in the lamp housing; and

the lamp panel is connected to the radiator and comprises an LED chip, and the power supply is electrically connected with the LED chip;

a first heat dissipation channel is formed in the inner cavity of the lamp housing, one end of the first heat dissipation channel is provided with a first air inlet hole, and the other opposite end of the lamp housing is provided with a heat dissipation hole;

a second heat dissipation channel is formed in the heat dissipation fins and the heat dissipation base, the second heat dissipation channel is provided with a second air inlet hole, and air flows out of the space between the heat dissipation fins through the second heat dissipation channel after entering from the second air inlet hole;

optionally, the lamp panel is provided with a third opening, and the third opening is respectively communicated with the first heat dissipation channel and the second heat dissipation channel.

Optionally, the third opening is disposed in a region at the center of the lamp panel, and the first air inlet and the second air inlet respectively enter from the third opening.

Optionally, the weight of the heat sink is more than 50% of the weight of the LED lamp, and the volume of the heat sink is more than 20% of the total volume of the LED lamp.

Optionally, the volume of the radiator accounts for 20% -60% of the total volume of the LED lamp.

Optionally, the heat dissipation fins include first heat dissipation fins and second heat dissipation fins, first heat dissipation fins and second heat dissipation fins are all connected with the heat dissipation base in the bottom of LED lamp axial direction, first heat dissipation fins with second heat dissipation fins alternate each other and set up, the shape of second heat dissipation fins is the Y shape of bisection.

Optionally, the LED lamp further comprises a lamp shade, the lamp shade comprises a light output surface and an end face, the end face is provided with ventilation holes, air enters the first heat dissipation channel and the second heat dissipation channel through the ventilation holes, the first air inlet holes are projected to an area occupied by the end face in the axial direction of the LED lamp to form a first part, other areas on the end face form a second part, and the area of the ventilation holes on the first part is larger than that of the ventilation holes on the second part.

The beneficial effects of the invention are as follows: compared with the prior art, the invention comprises any one or any combination of the following effects:

(1) Through the setting of first heat dissipation passageway, can take away the heat in the first heat dissipation passageway this (the power during operation produces, through the setting of second heat dissipation passageway, can increase the convection heat dissipation to the radiator, and through the setting of first heat dissipation passageway and second heat dissipation passageway, increased the efficiency of whole lamp natural convection for the corresponding required radiating area of radiator reduces.

(2) The third opening is respectively communicated with the first heat dissipation channel and the second heat dissipation channel, and is arranged in the area of the center of the lamp panel, and the third opening is arranged in the area of the center of the lamp panel, so that the first air inlet hole and the second air inlet hole can share an inlet for air intake, and the situation that the lamp panel is occupied in too many areas can be avoided, and the area of the lamp panel, where the LED chip is arranged, is reduced due to the fact that a plurality of holes are arranged.

(3) The weight of the radiator accounts for more than 50% of the weight of the LED lamp, the volume of the radiator accounts for more than 20% of the total volume of the LED lamp, and under the condition that the heat conductivity coefficients of the radiator are the same, the larger the volume of the radiator is, the larger the area of the radiator which can be used for heat dissipation is. Therefore, to a certain extent, when the volume of the radiator accounts for more than 20% of the total volume of the LED lamp, the radiator can have more available space to increase the heat dissipation area thereof.

(4) By dividing the shape of the second heat dissipation fin into two Y shapes, the radiator 1 has more heat dissipation area under the condition of occupying the same volume.

(5) The area of the air holes on the first part is larger than that of the air holes on the second part, so that most air can enter the first heat dissipation channel, the power supply can be better dissipated, and the electronic components of the power supply can be prevented from being heated to accelerate aging.

Drawings

Fig. 1 is a schematic diagram of a front view structure of an LED lamp in the present embodiment;

FIG. 2 is a schematic cross-sectional structural view of the LED lamp of FIG. 1;

FIG. 3 is an exploded schematic view of the LED lamp of FIG. 1;

FIG. 4 is a schematic cross-sectional view of an LED lamp, showing a first heat dissipation channel and a second heat dissipation channel;

FIG. 5 is a schematic perspective view of the LED lamp of FIG. 1;

FIG. 6 is a schematic view of the structure of FIG. 5 with the light output surface removed;

fig. 7 is a light transmission schematic diagram of the present embodiment;

FIG. 8 is a view of the light pattern of FIG. 7;

FIG. 9 is an exploded schematic view of an LED lamp in some embodiments, showing a light blocking ring;

FIG. 10 is a schematic perspective view of an LED lamp in some embodiments;

FIG. 11 is a schematic view of FIG. 10 with the light output surface removed;

FIG. 12 is a cross-sectional view of an LED lamp in some embodiments, showing a flat light output surface;

FIG. 13a is a schematic diagram of the cooperation of a lamp panel and a lamp cover in some embodiments;

FIG. 13b is a schematic diagram of the cooperation of a lamp panel and a lamp cover in some embodiments;

FIG. 13c is a schematic diagram of the cooperation of a lamp panel and a lamp cover in some embodiments;

FIG. 14 is a schematic diagram of the mating of a lamp panel and a lamp cover in some embodiments;

fig. 15 is a schematic view of an end face of the lamp cover in the present embodiment;

figure 16 is a schematic view of an end face of a lamp housing in some embodiments;

FIG. 17 is a schematic view of the end face of FIG. 16 in another direction;

figure 18a is a schematic view of a lamp shade in some embodiments;

figure 18b is a schematic view of a lamp shade in some embodiments;

figure 18c is a schematic view of a lamp shade in some embodiments;

figure 18d is a schematic view of a lamp shade in some embodiments;

figure 18e is a schematic diagram of a lamp shade in some embodiments;

figure 18f is a schematic view of a lamp shade in some embodiments;

figure 18g is a schematic view of a lamp shade in some embodiments;

figure 18h is a schematic diagram of a lamp shade in some embodiments;

figure 18i is a schematic view of a lamp shade in some embodiments;

FIG. 19a is a schematic cross-sectional view of a heat sink in some embodiments;

FIG. 19b is a schematic view of an LED lamp employing the heat sink of FIG. 19 a;

FIG. 20 is a schematic cross-sectional view of an LED lamp with a lampshade removed in some embodiments;

Fig. 21 is a perspective view of the LED lamp of the present embodiment;

fig. 22 is a sectional view of the LED lamp in the present embodiment;

fig. 23 is a plan view of the heat sink in the present embodiment;

FIG. 24 is an enlarged schematic view at E in FIG. 23;

fig. 25 is a schematic view of air forming a vortex at the second heat fins 112;

FIG. 26 is a partial schematic view of a heat sink in some embodiments;

FIG. 27 is a front view of an LED lamp in some embodiments;

FIG. 28 is a front view of an LED lamp in some embodiments;

FIG. 29 is a bottom view of the LED lamp of FIG. 1 with the lamp cover removed;

FIG. 30 is an enlarged schematic view at A in FIG. 29;

fig. 31 is a sectional view of the LED lamp in the present embodiment;

FIG. 32 is an enlarged schematic view at C in FIG. 31;

fig. 33 is a perspective view of the lamp housing in the present embodiment;

FIG. 34 is a schematic diagram of the mating of a lamp cover with a lamp panel in some embodiments;

FIG. 35 is a bottom view of FIG. 34;

FIG. 36a is a schematic diagram of a heat sink in some embodiments;

FIG. 36b is a schematic diagram of a heat sink in some embodiments;

FIG. 36c is a schematic diagram of a heat sink in some embodiments;

FIG. 36d is a schematic diagram of a heat sink in some embodiments;

FIG. 36e is a schematic diagram of a heat sink in some embodiments;

FIG. 36f is a schematic diagram of a heat sink in some embodiments;

FIG. 36g is a schematic view of a heat sink in some embodiments;

FIG. 36h is a schematic diagram of a heat sink in some embodiments;

FIG. 36i is a schematic diagram of a heat sink in some embodiments;

FIG. 36j is a schematic diagram of a heat sink in some embodiments;

FIG. 36k is a schematic diagram of a heat sink in some embodiments;

FIG. 36l is a schematic diagram of a heat sink in some embodiments;

FIG. 36m is a schematic diagram of a heat sink in some embodiments;

FIG. 37a is a schematic diagram of a heat sink in some embodiments;

FIG. 37b is a schematic diagram of a heat sink in some embodiments;

FIG. 37c is a schematic diagram of a heat sink in some embodiments;

FIG. 37d is a schematic diagram of a heat sink in some embodiments;

FIG. 38a is a top view of a heat sink in some embodiments;

FIG. 38b is a top view of a heat sink in some embodiments;

FIG. 38c is a top view of a heat sink in some embodiments;

FIG. 38d is a top view of a heat sink in some embodiments;

FIG. 38e is a top view of a heat sink in some embodiments;

FIG. 38f is a top view of a heat sink in some embodiments;

FIG. 38g is a top view of a heat sink in some embodiments;

FIG. 38h is a top view of a heat sink in some embodiments;

FIG. 38i is a top view of a heat sink in some embodiments;

fig. 39 is a plan view of the heat sink of the present embodiment;

fig. 40 is a schematic diagram illustrating the matching of the heat dissipation fins and the LED chip in the present embodiment;

FIG. 41 is a schematic diagram of the mating of heat fins with an LED chip in some embodiments;

FIG. 42 is a schematic view of a light panel in some embodiments;

FIG. 43 is a schematic view of a lamp panel in the present embodiment;

FIG. 44a is a schematic view of a light panel in some embodiments;

FIG. 44b is a schematic view of a light panel in some embodiments;

FIG. 44c is a schematic view of a light panel in some embodiments;

FIG. 44d is a schematic view of a light panel in some embodiments;

FIG. 44e is a schematic view of a light panel in some embodiments;

FIG. 44f is a schematic view of a light panel in some embodiments;

FIG. 45a is a front view of a light panel in some embodiments;

FIG. 45b is a front view of a light panel in some embodiments;

FIG. 45c is a front view of a light panel in some embodiments;

FIG. 45d is a front view of a light panel in some embodiments;

FIG. 45e is a front view of a light panel in some embodiments;

FIG. 45f is a front view of a light panel in some embodiments;

FIG. 45g is a front view of a light panel in some embodiments;

fig. 46a is a perspective view of the power supply in the present embodiment;

Fig. 46b is a second perspective view of the power supply in the present embodiment;

fig. 46c is a perspective view III of the power supply in the present embodiment;

fig. 46d is a front view of the power supply in the present embodiment;

FIG. 47 is a schematic diagram of a power supply in some embodiments;

FIG. 48 is a front view of the weight of FIG. 47;

FIG. 49 is an illustration of FIG. 48;

FIG. 50 is a schematic diagram of a transformer;

FIG. 51 is a schematic diagram of a power supply in some embodiments;

FIG. 52 is a schematic diagram of a power supply in some embodiments;

FIG. 53a is a schematic diagram of a power strip in some embodiments;

FIG. 53b is a schematic diagram of a power strip in some embodiments;

FIG. 53c is a schematic diagram of a power strip in some embodiments;

FIG. 54 is a cross-sectional view of an LED lamp in this embodiment;

FIG. 55 is a cross-sectional view of an LED lamp in this embodiment;

FIG. 56 is a schematic illustration of the mating of the power supply with the inner sleeve in some embodiments;

fig. 57 is an enlarged view at B in fig. 2;

FIG. 58 is a partial schematic view of an LED lamp;

fig. 59a is a schematic perspective view of the neck in the present embodiment;

fig. 59b is a second perspective view of the neck in the present embodiment;

FIG. 59c is a schematic perspective view of a neck in some embodiments;

fig. 60 is a perspective view of the inner sleeve in this embodiment;

FIG. 61 is a cross-sectional view of an LED lamp in some embodiments;

FIG. 62 is a schematic view of an arrangement of convection channels within the LED lamp of FIG. 61;

FIG. 63 is a front view of an LED lamp with a heatsink removed in some embodiments;

FIG. 64 is an exploded schematic view of FIG. 63;

FIG. 65a is an exploded schematic view of a lamp housing of an LED lamp in some embodiments;

FIG. 65b is an assembled schematic view of FIG. 65 a;

FIG. 65c is an exploded schematic view of an LED lamp incorporating the lamp housing of FIG. 65 a;

fig. 65d is an exploded view of a second embodiment of an LED lamp incorporating the lamp housing of fig. 65a

FIG. 65e is a cross-sectional view of an LED lamp incorporating the lamp housing of FIG. 65 a;

fig. 66 is a front view of the LED lamp in the present embodiment;

FIG. 67 is a schematic diagram showing the cooperation of the LED lamp and the lamp in the present embodiment;

FIG. 68 is a schematic diagram of an LED lamp in some embodiments;

fig. 69 is a front view of the LED lamp in the present embodiment;

FIG. 70a is a schematic diagram illustrating the cooperation between an LED lamp and a lamp in the present embodiment;

FIG. 70b is a schematic diagram illustrating the cooperation between the LED lamp and the lamp in the present embodiment;

FIG. 70c is a schematic diagram illustrating the cooperation between the LED lamp and the lamp in the present embodiment;

FIG. 71 is a schematic diagram of a circuit layout of an LED module in some embodiments;

FIG. 72 is an enlarged schematic view of FIG. 71 at D;

FIG. 73 is a second schematic circuit diagram of an LED module in some embodiments;

FIG. 74 is a schematic diagram of a power module according to an embodiment of the present application;

FIG. 75 is a schematic diagram of an EMI suppression circuit according to an embodiment of the present application;

FIG. 76 is a schematic diagram of a rectifying circuit and a filtering circuit according to an embodiment of the present application;

FIG. 77 is a schematic diagram of a PFC circuit according to an embodiment of the present application;

FIG. 78 is a schematic diagram of a power conversion circuit according to an embodiment of the present application;

FIG. 79 is a schematic diagram of a bias voltage generating circuit according to a first embodiment of the present application;

FIG. 80 is a schematic diagram of a bias voltage generating circuit according to a second embodiment of the present application;

FIG. 81 is a schematic diagram of a temperature detection circuit according to an embodiment of the present application;

FIG. 82 is a schematic diagram of a temperature compensation circuit according to an embodiment of the present application.

Detailed Description

In order that the invention may be readily understood, a more complete description of the invention will be rendered by reference to the appended drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete. The directions such as "axial direction", "above", "below", etc. are hereinafter for the sake of clarity of the structural positional relationship, and are not limiting of the present invention. In the present invention, the terms "vertical", "horizontal", "parallel" are defined as: including + -10% cases based on standard definition. For example, vertical generally refers to an included angle of 90 degrees with respect to the reference line, but in the present invention, vertical refers to a case including 80 degrees to 100 degrees or less. In addition, the use condition and the use state of the LED illuminating lamp refer to the use situation of the hanging mode of the LED illuminating lamp with the lamp cap vertically upwards, and the use situation is described otherwise if other exceptional conditions exist.

Fig. 1 is a front view of an LED lamp in an embodiment of the present invention. Fig. 2 is a cross-sectional view of the LED lamp of fig. 1. Fig. 3 is an exploded view of fig. 1. As shown in fig. 1, 2 and 3, the LED lamp includes: radiator 1, lamp body 2, lamp plate 3, lamp shade 4 and power 5. In this embodiment, the lamp panel 3 is connected to the heat sink 1 in a bonding manner, so that heat generated during operation of the lamp panel 3 is quickly transferred to the heat sink 1. Specifically, in some embodiments, the lamp panel 3 is riveted to the heat sink 1, in some embodiments, the lamp panel 3 is connected to the heat sink by a bolt, in some embodiments, the lamp panel 3 is welded to the heat sink 1, and in some embodiments, the lamp panel 3 is adhesively fixed to the heat sink 1. In this embodiment, the heat sink 1 is connected to the lamp housing 2, the lamp cover 4 is covered outside the lamp panel 3, so that the light generated by the light source of the lamp panel 3 is emitted through the lamp cover 4, the power supply 5 is located in the inner cavity of the lamp housing 2, and the power supply 5 is electrically connected to the LED chip 311 to supply power to the LED chip 311.

As shown in fig. 4, a sectional view of the LED lamp in the present embodiment is shown. As shown in fig. 2 and 4, a first heat dissipation channel 7a is formed in the inner cavity of the lamp housing 2 in the present embodiment, and the first heat dissipation channel 7a has a first air inlet 2201 at one end of the lamp housing 2, and a heat dissipation hole 222 (specifically, open at the upper portion of the lamp neck 22) at the opposite end of the lamp housing 2. Air enters from the first air inlet 2201 and is discharged from the heat dissipating holes 222, so that heat (mainly heat generated when the power supply 5 is operated) in the first heat dissipating channel 7a can be taken away. Specifically, from the heat dissipation path, heat generated when the heat generating component in the power supply 5 works is transferred to air in the first heat dissipation channel 7a (air near the heat generating component) in a heat radiation manner, and external air enters the first heat dissipation channel 7a in a convection manner, so that the internal air is taken away to dissipate heat. In other embodiments, the heat dissipation may be directly performed by forming the heat dissipation holes 222 on the lamp neck 22.

As shown in fig. 1, 2 and 4, the heat dissipation fins 11 and the heat dissipation base 13 form a second heat dissipation channel 7b, the second heat dissipation channel 7b has a second air inlet hole 1301, and air enters from the second air inlet hole 1301, passes through the second heat dissipation channel 7b, and finally flows out from the space between the heat dissipation fins 11. Therefore, heat on the radiating fins 11 can be taken away, and the radiating of the radiating fins 11 is accelerated. Specifically, in the heat dissipation path, the heat generated by the LED chip 311 is thermally conducted to the heat sink 1, and the heat dissipation fins 11 of the heat sink 1 radiate the heat to the surrounding air, and when the second heat dissipation channel 7b dissipates the heat by convection, the air in the heat sink 1 is taken away to dissipate the heat.

As shown in fig. 1 and 4, the radiator 1 is provided with a third heat dissipation channel 7c, the third heat dissipation channel 7c is formed between two heat dissipation fins 11 or between two sheets extending from the same heat dissipation fin 11, a radially outer portion between the two heat dissipation fins 11 forms an inlet of the third heat dissipation channel 7c, air enters the third heat dissipation channel 7c from a radially outer region of the LED lamp, and heat radiated to the air by the heat dissipation fins 11 is taken away.

Fig. 5 is a schematic perspective view of the LED lamp in the present embodiment, showing the combination of the heat sink 1 and the lamp cover 4. Fig. 6 is a schematic view of the structure of fig. 5 with the light output surface 43 removed. As shown in fig. 5 and 6, in the present embodiment, the lamp housing 4 includes a light output surface 43 and an end surface 44, and ventilation holes 41 are provided in the end surface 44, and air is introduced into the first heat dissipation path 7a and the second heat dissipation path 7b through the ventilation holes 41. When the LED chip 311 (shown in fig. 6) emits light, the light passes through the light output surface 43 and exits the lamp housing 4. In this embodiment, the light output surface 43 may be made of a light-transmitting material in the prior art, such as glass, PC material, etc. The term "LED chip" in all embodiments of the present invention refers to all light sources mainly including, but not limited to, LED beads, LED strips, or LED filaments, so that the LED chip set referred to in the present specification may be also equivalent to an LED bead set, an LED strip set, or an LED filament set. As shown in fig. 5, in the present embodiment, the ratio of the area of the light output surface 43 to the area of the end surface 44 is 1:4 to 7. Preferably, the ratio of the area of the light output surface 43 (the area of the surface on the side of the light output surface 43, i.e., the area of the surface on the side away from the LED chip 311) to the area of the end surface 44 (the area of the surface on the side of the end surface 44, i.e., the area of the surface on the side away from the LED chip 311, including the area of the ventilation holes 41) is 1:5 to 6. Most preferably, the ratio of the area of the light output surface 43 to the area of the end surface 44 is 1:5.5. the end surface 44 is used for air to pass through and enter the first heat dissipation channel 7a and the second heat dissipation channel 7b, and the light output surface 43 uses the light emitted from the light source, so that the light emission and the heat dissipation can be balanced. In this embodiment, in order to meet the air intake requirements of the first heat dissipation channel 7a and the second heat dissipation channel 7b, the ratio of the area of the lamp housing 4 to the area of the end surface 44 is 5-8. Preferably, the ratio of the area of the lamp housing 4 to the area of the end surface 44 is 6 to 7. In this way, a balance is achieved between the range of light output and the air required for heat dissipation.

In the present embodiment, the area of the light output surface 43 (the area of the surface on the one side of the light output surface 43, i.e., the area of the surface on the side away from the LED chip 311) is 3 times or more and not more than 10 times the area of the surface of all the LED chips 31 in the light emitting direction, and the width dimension thereof is controlled while providing a sufficient light emitting area.

As shown in fig. 5 and 6, in the present embodiment, an inner reflection surface 4301 is provided on the inner side of the light output surface 43 of the lamp housing 4 in the radial direction of the LED lamp, the inner reflection surface 4301 being opposite to the LED chip 311 on the lamp panel 3, and the inner reflection surface 4301 being located on the inner side of the radial direction of the LED lamp with respect to any one of the LED chips 311. In one embodiment, the light output surface 43 is provided with an outer reflective surface 4302 on the outer side of the LED lamp in the radial direction, the outer reflective surface 4302 being opposite to the LED chips 311 on the lamp panel 3, and the outer reflective surface 4302 being opposite to any one of the LED chips 311 and being located further on the outer side of the LED lamp in the radial direction. The inner reflective surface 4301 and the outer reflective surface 4302 are configured to adjust the light emitting range of the LED chip set 31, so that light is more concentrated, thereby improving the local brightness, that is, the illuminance of the LED lamp under the same luminous flux. Specifically, when the LED chip 311 is disposed on the lower surface of the lamp panel 3 (in use state), that is, the LED chip 311 has no lateral light emission, and when the LED chip 311 is in operation, the main light emitting surface of the LED chip 311 is downward, at least 60% of the light of the LED chip 311 is directly emitted from the light output surface 43 without being reflected, so that the LED lamp of the present embodiment has higher illuminance than the LED lamp having the main light emitting surface for lateral light emission (lateral light is reflected by the lamp or the lamp cover and then emitted downward and reflected with a certain proportion of light loss). By arranging the inner reflective surface 4301 and the outer reflective surface 4302, the light can be more concentrated, and the illuminance in a region, for example, a region between 120 degrees and 130 degrees below the LED lamp (a light emitting angle range between 120 degrees and 130 degrees below the LED lamp) can be improved. When the height of the LED lamp is higher, the irradiation range of the LED lamp still meets the requirement under the light emitting angle, and the LED lamp can have higher illumination in the range. Fig. 7 is a light transmission schematic diagram of the present embodiment, and fig. 8 is a light pattern diagram of fig. 7. As shown in fig. 6, 7 and 8, in terms of the light emitting effect, there is a light projecting area M in the projecting direction of the LED lamp, that is, below the LED lamp, and the light transmitting area M has a light condensing area M therein, and the LED lamp includes a reflecting surface, so that at least part of the light emitted from the LED chip 311 is reflected to the light condensing area M, so as to increase the brightness of the light condensing area M. The reflective surfaces include an inner reflective surface 4301 and an outer reflective surface 4302, and each of the inner reflective surface 4301 and the outer reflective surface 4302 reflects light of the LED chip 311 at least partially to the light condensing area m. In this embodiment, it is preferable that at least 5% of the luminous flux of the light source is reflected by the inner reflective surface 4301 and the outer reflective surface 4302 and emitted from the light output surface 43, and in practice, the total amount of light emitted from the light output surface after being reflected by the inner reflective surface 4301 and the outer reflective surface 4302 is at least 1000 lumens, and preferably the total amount of light emitted from the light output surface after being reflected by the inner reflective surface 4301 and the outer reflective surface 4302 is at least 1500 lumens. Whereas the total amount of light reflected by the outer reflective surface 4302 is greater than the total amount of light reflected by the inner reflective surface 4302, it can be seen that, regarding the glare problem, for high lumen LED lamps, the provision of the outer reflective surface 4302 can reflect a significant portion of the lateral luminous flux, which is of importance for reducing glare. The condensing area m in this embodiment is an annular area, the central angle formed by the inner boundary and the axis of the LED lamp is 20 °, and the central angle formed by the outer boundary and the axis of the LED lamp is 50 °. In this embodiment, the luminous flux of the LED lamp projected to the light-gathering area m accounts for 35% -50% of the total luminous flux, so that the light-gathering area m has a better illumination effect. In addition, by providing the inner reflective surface 4301 and the outer reflective surface 4302, on the one hand, unnecessary lateral light emission can be reduced to prevent glare from occurring, and on the other hand, at least part of the light of the LED chip 311 can be reflected to the light transmissive region M, thereby increasing illuminance in the light transmissive region M.

The inner reflective surface 4301 is configured to reflect a portion of light emitted from the LED chips 311 of the innermost LED chip set 31, and the outer reflective surface 4302 is configured to emit a portion of light emitted from the LED chips 311 of the outermost LED chip set 31. Wherein the number of LED chips 311 included in the outermost LED chip set 31 is greater than the number of LED chips 311 included in the innermost LED chip set 31. The area of the outer reflective surface 4302 is greater than the area of the inner reflective surface 4301 because the outermost LED chip set 31 includes more LED chips 311, thus requiring more reflective area to accommodate light extraction.

In this embodiment, the inner reflecting surface has a first area A1, the outer reflecting surface has a second area A2, the number of LED chips 311 included in the outermost LED chip group 31 is N2, and the number of LED chips 311 included in the innermost LED chip group 31 is N1; the following relationship is satisfied:

(A1/N1): (A2/N2) is 0.4-1.

When the ratio of the area of the inner emission surface 4301 corresponding to the single LED chip 311 in the innermost LED chip set 31 to the area of the outer emission surface 4302 corresponding to the single LED chip 311 in the outermost LED chip set 31 falls within the above range, the LED chips 311 of the innermost LED chip set 31 and the LED chips 311 of the outermost LED chip set 31 have a better light emitting effect.

As shown in fig. 6, the inner reflection surface 4301 is adjacent to one end of the lamp panel 3 and abuts against the lamp panel 3, so that light is prevented from passing through a gap between the inner reflection surface 4301 and the lamp panel 3, and a part of light is prevented from being lost. Similarly, the outer reflective surface 4302 abuts the lamp plate 3 at one end thereof close to the lamp plate 3, so as to prevent light from passing through a gap between the outer reflective surface 4302 and the lamp plate 3, thereby avoiding loss of the light.

As shown in fig. 2, in this embodiment, the inner reflective surface 4301 and the outer reflective surface 4302 form an included angle a between 80 degrees and 150 degrees, preferably between 90 degrees and 135 degrees, and more preferably between 100 degrees and 120 degrees. A reflective cup-like structure is formed between the inner reflective surface 4301 and the outer reflective surface 4302, thereby controlling the light emitting range of the LED chip or improving the local brightness. In this embodiment, the angle between the outer reflective surface 4302 and the lamp panel 2 is 30 to 60 degrees, and in some embodiments, 40 to 50 degrees.

As shown in fig. 2, in the present embodiment, the height of the inner reflective surface 4301 is lower than the height of the outer reflective surface 4302. The height refers to the relative height of both in the axial direction of the LED lamp. By setting the height of the inner reflective surface 4301 to be lower than the height of the outer reflective surface 4302, it is possible to avoid reducing the light distribution in the area directly under the LED lamp, preventing the formation of a dark area in the middle partial area of the light distribution area of the LED lamp. In this embodiment, the height of the outer reflective surface 4302 in the axial direction of the LED lamp is not more than 20mm, and preferably, the height of the outer reflective surface 4302 in the axial direction of the LED lamp is not more than 15mm. From another perspective, to control the overall height dimension of the LED lamp, the height of the outer reflective surface 4302 is not more than 9% of the overall height of the LED lamp, preferably, the height of the outer reflective surface 4302 is not more than 6% of the overall height of the LED lamp, and from the aspect of the function of the outer reflective surface 4302, it is ensured that the height of the outer reflective surface 4302 is more than 2% of the overall height of the LED lamp, preferably, the height of the outer reflective surface 4302 is more than 3% of the overall height of the LED lamp. That is, the height of the outer reflective surface 4302 needs to be set to 2% to 9% of the total height of the LED lamp in consideration of the functions of controlling the height dimension of the LED lamp, reflecting, condensing, anti-glare, and the like. Preferably, the height of the outer reflective surface 4302 is set to be between 3% and 6% of the height of the entire LED lamp.

The lamp housing 4 of the LED lamp in some embodiments may eliminate the arrangement of the inner reflective surface or the outer reflective surface, for example, only the light blocking ring 47 is arranged, specifically, as shown in fig. 9, the light blocking ring 47 is arranged on the outer circumference of the lamp housing 4 to improve the light emitting efficiency of the lamp, the inner surface of the light blocking ring 47 has a reflective effect (similar to the outer reflective surface), when the lamp housing 4 is fastened on the heat sink 1, the light blocking ring 47 is close to the periphery of the lamp panel 3, for example, the peripheral diameter of the light blocking ring 47 is equal to or slightly larger than the peripheral diameter of the lamp panel 3.

As shown in fig. 2, 5 and 6, in the present embodiment, in order to prevent dust from depositing on the surface of the LED chip 311 and reduce the light efficiency of the LED chip 311 or affect the heat dissipation of the LED chip 311, the LED chip 311 may be disposed in an enclosed space to prevent dust from entering and depositing on the surface of the LED chip 311. For example, a sealed cavity 9 is formed between the lamp housing 4 and the lamp panel 3, and in particular, a sealed cavity 9 is formed between the light output surface 43, the inner reflective surface 4301, the outer reflective surface 4302 and the lamp panel 3 (sealing herein may refer to no obvious holes, excluding unavoidable gaps during assembly). In some embodiments, the provision of the inner and outer

reflective surfaces

4301, 4302 may be omitted, and the cavity 9 may be formed between the lamp panel 3, the light output surface 43, or between the lamp panel 3, the light output surface 43, and the heat sink 1.

Fig. 10 is a perspective view of an LED lamp in some embodiments, which is different from the present embodiment in that a hole is formed in the cavity 9. Fig. 11 is a schematic view of fig. 10 with the light output surface 43 removed. As shown in fig. 10 and 11, in some embodiments, a cavity 9 is formed between the lamp housing 4 and the lamp panel 3, specifically, a cavity 9 is formed between the light output surface 43, the inner reflective surface 4301, the outer reflective surface 4302 and the lamp panel 3, and the LED chip 311 of the lamp panel 3 is located in the cavity 9. The cavity 9 has a first opening 91 and a second opening 92, the first opening 91 being configured to communicate with the outside, and the second opening 92 being configured to communicate with the first heat dissipation channel 7a and the second heat dissipation channel 7 b. From the heat dissipation perspective, on the one hand, the cavity 9 can form gas convection so as to take away part of heat generated by the LED chip 311, on the other hand, outside air enters the LED lamp through the cavity 9, which can play a role in increasing convection for the first heat dissipation channel 7a and the second heat dissipation channel 7b, and improve heat dissipation efficiency. In other embodiments, the arrangement of the inner reflective surface 4301 and the outer reflective surface 4302 may be omitted, that is, a cavity 9 may be formed between the light output surface 43 and the lamp panel 3.

As shown in fig. 10, in some embodiments, the light output surface 43 is provided with a hole, so that the first opening 91 is formed, and preferably, the first opening 91 is provided at a position radially outside the light output surface 43, so that the light transmission effect of the light output surface 43 is not affected. Structurally, the light output surface 43 may be thermally deformed by heat when the LED lamp is in operation, and the arrangement of the first opening 91 allows the light output surface 43 to have a deformable space at the first opening 91, preventing the light output surface 43 from pressing against the heat sink due to thermal deformation, resulting in damage to the light output surface 43. In the present embodiment, the first openings 91 are provided in number in the circumferential direction of the light output surface 43. In this way, on the one hand, convection of air may be increased and, on the other hand, the structural strength of the light output surface 43 when heated may be further improved.

In some embodiments, as shown in FIG. 11, a notch is provided in the inner reflective surface 4301 to form the second opening 92 described above. In the present embodiment, the second openings 92 are provided in the circumferential direction of the inner reflective surface 4301. The relationship between the number of second openings 92 and the number of first openings 91 is approximately that the ratio of the number of second openings 92 to the number of first openings 91 is 1:1-2, preferably 1:1.5. Thus, a balance can be formed between the air inlet and the air outlet. In other embodiments, the first opening 91 and the second opening 92 may be formed on other components of the lamp housing 4, such as the lamp panel 3 or the heat dissipation base 13 of the heat sink 1.

As shown in fig. 10 and 11, in some embodiments, a cavity 9 is formed between the lamp housing 4 and the lamp panel 3, specifically, a cavity 9 is formed between the light output surface 43, the inner reflective surface 4301, the outer reflective surface 4302 and the lamp panel 3, the LED chip 311 is located in the cavity 9, and the cavity 9 has a pressure release hole to avoid a temperature rise in the cavity 9 due to heat generated during operation of the LED chip 311 in the cavity 9, thereby raising the pressure. The pressure release hole may be a first opening 91 formed on the light output surface 43, a second opening 92 formed on the inner reflecting surface 4301, or a hole formed on the lamp panel 3 or the heat sink 1 and corresponding to the cavity 9, so long as the pressure release effect is achieved.

As shown in fig. 4, the light output surface 43 gradually increases in distance from the LED lamp panel 3 in the radially outward direction of the LED lamp, so that the light output surface 43 is concave. In this way, the structural strength of the light output surface 43 is improved compared with a flat surface, and in addition, the light output surface 43 does not form an included angle in the above-mentioned smoother transition manner, so that the thickness of the light output surface 43 is relatively uniform, and the light emitting effect is not affected. Finally, in terms of the use state, the lamp panel 3 generates heat due to the light source when the LED lamp is operated, and if the light output surface 43 is a flat surface and parallel to the horizontal plane (in the use state of the hanging installation), the light output surface expands outward along the horizontal when heated, and thus may be crushed by the heat sink 1 to be broken. In this embodiment, when the light output surface 43 is concave, the expansion direction of the lamp housing 4 changes when it is heated and expands (in the use state of the hanging installation, if the light output surface 43 is a flat surface, the light output surface 43 expands mainly in the horizontal direction after being heated, and if the light output surface 43 is concave, the expansion direction is decomposed into a horizontal direction portion and a downward direction portion), so that the expansion of the lamp housing 4 in the horizontal outward direction is reduced, and the lamp housing 4 is prevented from being broken by being pressed by the heat sink 1.

As shown in fig. 12, in some embodiments, the light output surface 43 may be provided as a flat surface, but the thermal expansion coefficient of the material of the light output surface 43, the distance between the light output surface 43 and the heat sink 1, and the deformation resistance of the light output surface 43 need to be considered. For example, when the light output surface 43 is a flat surface, the light output surface 43 may be radially spaced from the heat sink 1 to ensure that the light output surface 43 is not compressed by the heat sink 1 due to expansion of the light output surface 43.

In some embodiments, the light output surface 43 is provided with an optical coating, such as a diffusion film 431 provided on the light output surface 43, and light generated by the led chip 311 passes through the diffusion film 431 and out of the lamp housing 4. The diffusion film 431 plays a role in diffusing light emitted from the LED chip 311, and thus, as long as light can be transmitted through the diffusion film 431 and then out of the lamp housing 4, the diffusion film 431 can be arranged in various forms, for example: the diffusion film may be coated or covered on the inner surface of the light output surface 43 (as shown in fig. 13 a), or a diffusion coating coated on the surface of the LED chip 311 (as shown in fig. 13 b), or a diffusion membrane covering (or covering) the outside of the LED chip 311 as a cover (as shown in fig. 13 c).

Fig. 14 is a schematic diagram of the cooperation of the lamp housing 4 and the lamp panel 3. As shown in fig. 14, in some embodiments, the light output surface 43 is provided with an anti-reflection coating 432 on a side close to the LED chip 311, that is, on an inner side of the light output surface 43, so as to reduce reflection of light from the LED chip 311 on the light output surface 43, so as to improve light transmittance at the light output surface 43. The refractive index of the anti-reflective coating 432 in this embodiment is between that of air and glass. The anti-reflection coating 432 includes metal oxide, the content of the metal oxide accounts for 1% -99% of the material of the anti-reflection coating 432, and the reflectivity of the anti-reflection coating 432 is less than 2%. The metal oxide in this embodiment may be zirconia, tin oxide, alumina, or the like.

The diffusion film 431 and the anti-reflective coating 432 described above may be used simultaneously or alternatively. Specifically, the light-emitting device can be selected according to actual light-emitting requirements.

Fig. 15 shows a schematic view of the end face 44 of the lamp housing 4 in this embodiment. As shown in fig. 15, the ratio of the sum of the cross-sectional areas of the ventilation holes 41 to the entire area of the end face 44 (the area of the single side of the end face 44, e.g., the side away from the LED chip 311) is 0.01 to 0.7, preferably, the ratio of the sum of the cross-sectional areas of the ventilation holes 41 to the entire area of the end face 44 is 0.3 to 0.6, more preferably, the ratio of the sum of the cross-sectional areas of the ventilation holes 41 to the entire area of the end face 44 is 0.4 to 0.55, and by limiting the ratio of the area of the ventilation holes 41 to the area of the end face 44 within the above-mentioned range, on the one hand, the intake air amount of the ventilation holes 41 can be ensured, and on the other hand, the area size of the ventilation holes 41 can be ensured to be adjusted while maintaining the structural strength of the end face 44. When the ratio of the area of the ventilation holes 41 to the area of the end face 44 is 0.4-0.55, the air inflow of the ventilation holes 41 can be ensured to meet the heat dissipation requirement of the LED lamp, the ventilation holes 41 can not influence the structural strength of the end face 44, and the end face 44 is prevented from being easily damaged due to collision or extrusion after the ventilation holes 41 are formed.

Figure 16 shows a schematic view of the end surface 44 of the lamp housing 4 in other embodiments. Fig. 17 shows a schematic view of the end face 44 of fig. 16 in another direction. As shown in fig. 16 and 17, the edge of the airing 41 has an increased thickness, thereby forming the rib 411, and the air guide 412 is formed between adjacent ribs 411 in the air inlet direction of the airing 41. The edge of the air hole 41 has increased thickness, which can increase the structural strength of the end surface 44 and prevent the overall structural strength from decreasing due to the air hole 41, and the air guide 412 has air guiding function, so that the air is guided by the air guide 412 and has certain directivity. In addition, when the end face 44 is molded, the rib 411 reduces the influence of the decrease in strength of the end face 44 due to the ventilation holes 41 being formed in the end face 44, so that the end face 44 is less likely to be deformed due to the ventilation holes 41, and the yield of production can be improved. In the present embodiment, the rib 411 is formed on a surface of the end surface 44 close to the lamp panel 3.

As shown in fig. 17, the edge of the ventilation hole 41 increases in thickness more than the thickness at the rest of the end surface 44. Thus, the strength of the air holes 41 and the air guiding effect can be further increased.

As shown in fig. 15, the maximum inscribed circle diameter of the ventilation holes 41 is less than 2mm, preferably 1 to 1.9mm. In this way, on the one hand, insects can be prevented from entering, and most of dust can be prevented from passing through, and on the other hand, the ventilation holes 41 can maintain good ventilation efficiency. In other words, the ventilation holes 41 may define a length direction and a width direction, that is, the ventilation holes have a length and a width, the length dimension is greater than the width dimension, and the width of the ventilation holes at the widest point is less than 2mm, and in one embodiment, the width at the widest point is 1mm to 1.9mm. In addition, the width of the largest portion of the ventilation holes 41 is greater than 1mm, and if it is less than 1mm, air requires a greater pressure to enter the ventilation holes 41, so that ventilation is not facilitated.

Fig. 18a to 18g show the shape of various ventilation holes 41 in some embodiments. As shown in fig. 18a to 18g, specifically, the ventilation holes 41 may be selected from a shape of a circle, an elongated shape, an arc shape, a trapezoid shape, and a diamond shape, or a combination of one or more groups. As shown in fig. 18a, if the ventilation holes 41 are selected to be circular, the diameter thereof is less than 2mm, so as to prevent insects from entering, prevent most dust from passing therethrough, and maintain good gas circulation efficiency. As shown in fig. 18b and 18c, if the ventilation holes 41 are selected to be long or arc-shaped, the width thereof is less than 2mm to achieve the above technical effect. As shown in FIG. 18d, if the ventilation holes 11d are trapezoidal, the lower bottom is smaller than 2mm, so as to achieve the above technical effect. As shown in fig. 18e, if the ventilation holes 41 are rounded rectangle, the width is smaller than 2mm to achieve the above technical effect. As shown in fig. 18f and 18g, the ventilation holes 41 may be triangular or drop-shaped, and the maximum inscribed circle is less than 2mm.

In some embodiments, the ventilation holes 41 are distributed in a plurality on the end surface 44. For example, the ventilation holes 41 may be circumferentially distributed along the end face 44 in a plurality of annular shapes, so that the air flow can be more uniformly introduced. As another example, the ventilation holes 41 may be distributed in a plurality in the radial direction of the end surface 44. The ventilation holes 41 may also be distributed in an asymmetric manner.

In some embodiments, the air hole 41 may be disposed inclined to the axial direction of the LED lamp in the axial direction of the LED lamp, that is, the axis of the air hole 41 forms an angle with the axial direction of the LED lamp. As shown in fig. 18h, at least part of the axis of the ventilation holes 41 is inclined to the axis of the LED lamp, and the inclined direction of the ventilation holes 41 is towards the first air inlet holes 2201 of the first heat dissipation channel 7a, so that after the air passes through the ventilation holes 41, the air will convect towards the first air inlet holes 2201 of the first heat dissipation channel 7a, so as to facilitate more air to enter the first heat dissipation channel 7a and dissipate heat from the power supply 6 therein. As shown in fig. 18i, at least part of the axis of the air vent 41 is inclined to the axis of the LED lamp, and the inclined direction of the air vent 41 is towards the second air inlet 1301 of the second heat dissipation channel 7b, so that after the air passes through the air vent 41, the air will flow towards the second air inlet 1301 of the second heat dissipation channel 7b, so as to facilitate more air to enter the second heat dissipation channel 7b, thereby dissipating heat from the radiator 1.

Taking fig. 18a as an example, in fig. 18a, two dotted lines are provided on the end surface 44, the dotted line of the inner ring represents the position where the first air inlet hole 2201 projects onto the end surface 44, the area in the dotted line of the inner ring is a first portion (first opening area 433), the area between the outer ring and the inner ring is a second portion (second opening area 434), in this embodiment, the area where the first air inlet hole 2201 projects onto the end surface 44 in the axial direction of the LED lamp forms the first portion (first opening area 433), and the other areas on the end surface 44 form the second portion (second opening area 434), and the area of the air holes 41 on the first portion is larger than the area of the air holes 41 on the second portion. By the arrangement mode, most air can enter the first heat dissipation channel 7a, so that heat dissipation of the power supply 5 is better achieved, and the electronic components of the power supply 5 are prevented from being heated to accelerate aging. The same features apply to the ventilation holes 41 in the other embodiments described above.

In other embodiments, the area occupied by the first air intake hole 2201 projected onto the end surface 44 in the axial direction of the LED lamp forms a first portion (first opening area 433), while the other area on the end surface 44 forms a second portion (second opening area 434), and the area of the air hole 41 on the first portion is smaller than the area of the air hole 41 on the second portion. Therefore, the heat dissipation fin 11 can be better dissipated, so that the heat dissipation of the LED chip 311 is facilitated, and the formation of a local high-temperature area at the LED chip 311 is prevented. Specifically, the areas of the first portion and the second portion may be selected according to the actual heat dissipation requirement.

In some applications, there may be weight limitations for the entire LED lamp. For example, when an E39 cap is used for the LED lamp, the maximum weight of the LED lamp is limited to within 1.7 kg. Thus, after removing the power source, lamp housing, etc., in some embodiments, the weight of the heat sink is limited to within 1.2 kg. For some high power LED lamps, the power is 150W to 300W, and the lumens may reach 20000 lumens to 45000 lumens, i.e. the heat sink is required to dissipate heat generated from the LED lamp generating 20000 to 45000 lumens within its weight limit. In the case of natural convection heat dissipation, a power of typically 1W requires a heat dissipation area of 35 square centimeters or more. The following embodiments are designed to reduce the heat dissipation area required for 1W power while ensuring the installation space and heat dissipation effect of the power supply 5, and to achieve the best heat dissipation effect under the conditions of weight limitation of the heat sink 1 and limitation of the power supply 5.

As shown in fig. 1 and 2, in the present embodiment, the LED includes or only uses a passive heat dissipating component, which dissipates heat only by natural convection, radiation, or the like, and does not use an active heat dissipating component, such as a fan, or the like. The passive heat dissipation assembly in this embodiment includes a heat sink 1, where the heat sink 1 includes heat dissipation fins 11 and a heat dissipation base 13, and the heat dissipation fins 11 are radially and uniformly distributed along the circumference of the heat dissipation base and are connected with the heat dissipation base 13. When the LED lamp is in use, the heat generated by the LED chip 311 thermally conducts at least a portion of the heat to the heat sink 1, and at least a portion of the heat sink 1 is dissipated to the outside air by heat radiation and convection. The radially outer contour of the heat sink 1 has a decreasing or substantially decreasing diameter when its diameter is directed upwards in the height direction. Thus, the lamp can be matched with the lamp better. The radiator 1 in the present embodiment radiates at least part of heat by radiating the heat to the surrounding air at the time of radiating the heat. An important factor affecting the heat radiation is the emissivity or emissivity of the object itself. In order to increase the emissivity or the emissivity of the radiator 1, the surface of the radiator 1 in this embodiment is correspondingly treated, for example, a radiation heat dissipation paint or an electrophoresis coating is disposed on the surface of the radiator 1 to increase the radiation heat dissipation efficiency, so that the heat of the radiator 1 is rapidly dissipated, or a nano-structured porous alumina layer is formed on the surface of the heat dissipation fins 11 through anodic oxidation in an electrolyte, so that a layer of alumina nano-pores can be formed on the surface of the heat dissipation fins 11, the heat dissipation capacity of the heat dissipation fins is enhanced while the number of the heat dissipation fins 11 is not increased, for example, the surface of the heat dissipation fins 11 is coated with a heat radiation resistant layer to reduce the heat radiation between the heat dissipation fins 11 and the heat dissipation fins 11, so that the heat of the heat dissipation fins 11 is radiated into the air more, the heat radiation resistant layer can adopt paint or an oxidation coating, and the paint can adopt common paint or radiation paint. To further enhance the heat dissipation effect of the heat sink 1, for example, the heat sink 1 in some embodiments includes the following components in percentage by mass: 0.5 to 0.7 part of silicon, 0.5 to 0.6 part of iron, 0.05 to 0.3 part of copper, 0.3 to 0.7 part of manganese, 2.1 to 2.9 parts of magnesium, 0.18 to 0.28 part of chromium, 5.1 to 6.1 parts of zinc and 0.2 to 0.3 part of titanium; preferably, aluminum is also included, such as small or trace amounts of aluminum. By adopting the zinc and the magnesium in the mass percentage, mgZn2 with obvious strengthening effect can be formed, so that the heat treatment effect of the radiator 1 is far superior to that of a zinc binary alloy, the tensile strength is greatly improved, the stress corrosion resistance and the peeling corrosion resistance are also improved, the heat conductivity is also larger, and the heat dissipation performance of the radiator 1 is better. In addition, the heat sink 1 may be made of a material with low thermal resistance/high thermal conductivity, such as an aluminum alloy. In some embodiments, the heat spreader 1 may be made of anodized 6061T6 aluminum alloy having a thermal conductivity k=167W/m.k., a emissivity e=0.7. In other embodiments, other materials may be used, such as 6063T6 or 1050 aluminum alloy with thermal conductivity k=225W/m.k., thermal emissivity e=0.9. In other embodiments, other alloys may still be used, such as AL 1100, and the like. In other embodiments, a die casting alloy having thermal conductivity is used. In other embodiments, the heat spreader 1 may comprise other metals such as copper. Fig. 19a is a schematic cross-sectional view of a heat sink 1 in some embodiments. As shown in fig. 19a, in some embodiments, the heat sink 1 has a heat dissipation post 12 added to the heat sink 1 of the present embodiment, specifically, the heat sink 1 includes a heat dissipation post 12, heat dissipation fins 11 and a heat dissipation base 13, the heat dissipation post 12 is connected to the heat dissipation base 13, the heat dissipation fins 11 are disposed on the outer circumference of the heat dissipation post 12 and are uniformly distributed in a radial shape, and the root parts of the heat dissipation fins 11 are connected to the outer circumference of the heat dissipation post 12 and the heat dissipation base 13. The heat dissipation column 12 is arranged to support the heat dissipation fins 11, so that the heat dissipation fins 11 are prevented from deflecting in the processing process. When the LED lamp is used, the heat dissipation post 12 or the heat dissipation base 13 transfers the heat generated by the LED chip 311 to the heat dissipation fins 11, the heat dissipation post 12 has a hollow structure with openings at two ends, for example, the heat dissipation post 12 has a cylindrical structure; the heat dissipation column 12 is made of a material which is consistent with the heat dissipation device 1, and is preferably made of a material with good heat conductivity, such as an aluminum alloy material, so that the heat dissipation device 1 has the effects of light weight and low cost. In other embodiments of the present invention, the heat dissipation post 12 may be made of copper material, so as to enhance the heat conduction performance of the heat sink 1 and achieve the effects of heat transfer and heat dissipation. In other embodiments of the present invention, a heat-conducting layer may be disposed on the inner side wall of the heat-dissipating stud 12, and the thickness of the heat-conducting layer is 0.1 mm-0.5 mm, so as to further enhance the heat-dissipating effect. The specific surface area of the heat radiation fins 11 is 4 to 10 times, preferably 6 to 8 times, the specific surface area of the heat radiation post 12. Fig. 19b is a top view of an LED lamp employing the heat sink of fig. 19 a. As shown in fig. 19b, when the LED lamp is a high-power lighting device, the bottom inner diameter r of the heat dissipation post 12 may be 10 to 15mm, i.e., the distance from the center axis XX of the heat dissipation post to the inner surface of the heat dissipation post may be 10 to 15mm. Because the outer surface of the heat radiation column is radially distributed with the heat radiation fins, the range of the inner diameter R taking the edges of the heat radiation fins as the circumference can be more than or equal to 15 to less than 20mm, namely the distance from the edges of the heat radiation fins to the central axis of the heat radiator is more than or equal to 15 to less than 20mm. The inner diameters defined by the heat fins may be the same or different from the bottom to the top of the heat sink. That is, the length (i.e., R-R) of each fin extending toward the center axis XX of the heat sink may be constant along the height direction of the heat sink 1 or may vary along the height direction of the heat sink 1. The lengths of the respective heat radiation fins 11 extending along the inner surface of the heat sink 1 may be the same or different, i.e., the lengths of the respective heat radiation fins 11 may be equal or different. The heat radiation fins 11 may extend along the inner surface of the heat sink 1 in a direction parallel to the central axis of the heat sink 1, or may extend in a spiral shape along the inner surface of the heat sink 1.

As shown in fig. 2, 4 and 5, the heat dissipation base 13 of the heat sink 1 has a lower end surface 133, and the lower end surface 133 is located on the other side of the heat dissipation base 13 opposite to the heat dissipation fins 11, that is, the lower end surface 133 is located on the same side as the lamp panel 3. In this embodiment, the lower end face 133 extends beyond the lamp panel 3 in the axial direction of the LED lamp, that is, when the lamp panel 3 is disposed downward in the use state, the position of the lower end face 133 is lower than the position of the lamp panel 3. In this way, the position of the lower end face 133 can protect the LED lamp panel 3, and when the LED lamp panel collides, the LED lamp panel can firstly collide with the lower end face 133, but not directly collide with the lamp panel 3. As shown in fig. 2 and 4, from another angle, the heat dissipation base 13 has a concave area 132, the lamp panel 3 is placed in the concave area 132, and the concave area 132 is a cylinder or a substantially cylindrical structure, or a truncated cone structure, and if it is a cylinder structure, the diameter of the cylinder is smaller than the diameter of the heat dissipation base 13. The concave area 132 is arranged in the heat dissipation base 13, which is helpful to reduce the glare effect of the LED lamp, and promote the direct vision and comfort of the user when the product is used (the side wall of the inner part of the concave area 132 shields the lateral luminescence of at least part of the LED chip 311, thereby reducing the glare). In some embodiments, the heat dissipation base 13 may not have a concave area, so that the lamp panel 3 and the heat sink 1 have the largest contact area, and the heat dissipation effect is ensured, and preferably, the surface of the heat dissipation base 13 is a flat surface.

Fig. 20 is a schematic cross-sectional view of the LED lamp with the lamp cover 4 removed in some embodiments. As shown in fig. 20, in some embodiments, the lower end face 133 is configured as an inclined surface (inclined with respect to the horizontal plane when the LED lamp is vertically hung), and when the inclined surface is inclined straight in the radial direction of the LED lamp, the inclined surface forms an angle of 3 to 4 degrees with the horizontal plane, and in other embodiments, the included angle is greater than 0 degrees and less than or equal to 6 degrees. When the inclined surface is inclined in a curved surface shape in the radial direction of the LED lamp, an included angle between a tangential plane of the curved surface and a horizontal plane is 3 to 4 degrees, and in other embodiments, the included angle is greater than 0 degrees and less than or equal to 6 degrees. When the lower end surface 133 is inclined at a certain angle (e.g., when the end surface 133 is inclined at an angle of 120 degrees to 180 degrees with respect to the outer reflective surface 4302), it may serve as an extension of the outer reflective surface 4302 to perform a certain reflection function.

Fig. 21 is a perspective view of the LED lamp of the present embodiment. As shown in fig. 2 and 21, the other side of the heat dissipation base 13 opposite to the lower end face 133 of the heat dissipation device 1 has a back face 134, and one end of the heat dissipation fin 11 extends to abut against the back face 134, so that at least a portion of the heat dissipation fin 11 extends beyond the LED lamp panel 3 in the axial direction. In other words, in the axial direction of the LED lamp, the heat dissipation fins 11 form an extension 1101 at a position between the back surface 134 of the heat dissipation base 13 and the lamp panel 3. By adding the extension 1101, the heat dissipation area of the heat dissipation fins 11 can be increased, the heat dissipation effect is improved, and in addition, the overall height of the LED lamp is not additionally increased due to the arrangement of the extension 1101, so that the overall height of the LED lamp is conveniently controlled.

Fig. 22 is a sectional view of the LED lamp in the present embodiment. As shown in fig. 22, in the present embodiment, the back surface 134 of the heat dissipation base 13 is disposed obliquely, that is, in a state where the LED lamp is hung, the back surface 134 is disposed obliquely upward in a radially inward direction of the LED lamp. From another angle, in the radial direction of the LED lamp, the distance from the back surface 134 to the lamp panel 3 in the axial direction of the LED lamp gradually increases in the direction toward the axis of the LED. In this arrangement, convective air is advantageously directed along the back 134 to carry away heat from the back 134, preventing the back 134 from impeding air ingress.

As shown in fig. 2 and 5, in the use state, when the lamp panel 3 is disposed downward, the position of the lower end face 133 is lower than the positions of the end face 44 and the light output surface 43 of the lamp housing 4. In this way, in the packaging, transportation or use state, if a collision occurs, the lower end face 133 collides, so that the lamp housing 3 can be prevented from being collided, and the end face 44 or the light output surface 43 can be prevented from being damaged.

As shown in fig. 2 and 5, a space (recess 132) is defined between the lower end surfaces 133, and the lamp housing 4 is disposed in the space, so that the height of the lamp housing 4 does not exceed the lower end surfaces 133 after the lamp housing is disposed in the space. The height of the LED lamp generally includes the height of the lamp housing 2, the height of the heat sink 1 and the height of the lamp cover 4, in this embodiment, the lamp cover 4 is disposed at a position not exceeding the lower end face 133 of the heat sink 1, so that the height of the whole lamp can be controlled, and the lamp cover 4 is disposed so as not to increase the height of the whole lamp additionally, and on the other hand, the heat sink 1 is additionally provided with a heat dissipation portion (a portion of the lower end face 133 protruding downward relative to the lamp panel 3). In other embodiments, the lamp housing 4 may be partially extended beyond the lower end surface 133.

As shown in fig. 2, 4 and 5, the end surface 44 is spaced from the lamp panel 3 to form a cavity 8, and the cavity 8 is respectively communicated with the first air inlet 2201 of the first heat dissipation channel 7a and the second air inlet 1301 of the second heat dissipation channel 7b, and after air enters the cavity 8 from the air holes 41 of the end surface 44, the air enters the first heat dissipation channel 7a and the second heat dissipation channel 7b. The cavity 8 is arranged, so that after air enters, a process of mixing in the cavity exists, and then the air is distributed according to the negative pressure (negative pressure generated by temperature difference) condition of the first heat dissipation channel 7a and the second heat dissipation channel 7b, so that the distribution of air flow is more reasonable.

In this embodiment, in the case of passive heat dissipation (without fan), the ratio of the power (watt) of the LED lamp to the heat dissipation area (square centimeter) of the heat sink 1 is 1: between 20 and 30, that is, a heat dissipation area of 20 square centimeters to 30 square centimeters is required per watt to dissipate heat. Preferably, the ratio of the power of the LED lamp to the heat dissipation area of the heat sink 1 is between 1:22 and 26. More preferably, the ratio of the power of the LED lamp to the heat dissipation area of the heat sink 1 is 25. The first heat dissipation channel 7a is formed in the inner cavity of the lamp housing 2, and the first heat dissipation channel 7a has a first air inlet 2201 at one end of the lamp housing 2, and a heat dissipation hole 222 at the opposite end of the lamp housing 2. Air enters from the air inlet 2201 and is discharged from the heat dissipation holes 222, so that heat in the first heat dissipation channel 7a can be taken away. The heat dissipation fins 11 and the heat dissipation base 13 form a second heat dissipation channel 7b, the second heat dissipation channel 7b is provided with a second air inlet hole 1301, and air enters from the second air inlet hole 1301, passes through the second heat dissipation channel 7b and finally flows out from the space between the heat dissipation fins 11. Therefore, the heat radiated to the surrounding air by the heat radiating fins 11 can be taken away, and the heat radiation of the heat radiating fins 11 is accelerated. By arranging the first heat dissipation channel 7a and the second heat dissipation channel 7b, the natural convection efficiency is increased, the corresponding required heat dissipation area of the heat sink 1 is reduced, and the ratio of the power of the LED lamp to the heat dissipation area of the heat sink 1 is between 20 and 30. In this embodiment, the entire LED lamp weighs less than 1.7kg, and when the LED lamp is supplied with about 200W (300W or less, preferably 250W or less) of power, the LED chip 311 is lit and emits at least 25000 lumens of light.

As shown in fig. 1, in the present embodiment, the weight of the heat sink 1 is more than 50% of the weight of the LED lamp, in some embodiments, the weight of the heat sink 1 is 55-65% of the weight of the LED lamp, and at this time, the volume of the heat sink 1 is more than 20% of the total volume of the LED lamp, and in the case that the heat conductivity coefficients of the heat sinks 1 are the same (that is, the heat sinks 1 are made of the same material as a whole or two different materials with the same heat conductivity coefficients tend to be used), the larger the volume occupied by the heat sink 1 is, the larger the heat dissipation area can be used. Therefore, to a certain extent, when the volume of the heat sink 1 occupies more than 20% of the total volume of the LED lamp, the heat sink 1 may have more available space to increase the heat dissipation area thereof. After the arrangement space of the power supply 5, the lampshade 4 and the lamp housing 2 is considered, preferably, the volume of the radiator 1 accounts for 20% -60% of the total volume of the LED lamp, more preferably, the volume of the radiator 1 accounts for 25% -50% of the total volume of the LED lamp, so that when the total size of the LED lamp is limited and the arrangement space of the power supply 5, the lampshade 4 and the lamp housing 2 is required to be ensured, the volume of the radiator 1 is maximized, and the design on the whole heat dissipation of the LED lamp is facilitated.

Fig. 23 is a plan view of the heat sink 1 in the present embodiment. As shown in fig. 23, under the limitation of the above-mentioned volume of the heat sink 1, at least a part of the heat dissipation fins 11 extend outwardly in the radial direction of the LED lamp to form at least two fins, and the two fins are disposed at intervals, so that the heat dissipation fins 11 have a larger heat dissipation area in a fixed space, and the two extending fins support the heat dissipation fins 11, so that the heat dissipation fins 11 are supported on the heat dissipation base 13 more firmly, and the heat dissipation fins 11 are prevented from deflecting.

Specifically, as shown in fig. 23, the heat dissipation fins 11 include a first heat dissipation fin 111 and a second heat dissipation fin 112, the bottoms of the first heat dissipation fin 111 and the second heat dissipation fin 112 in the axial direction of the LED lamp are connected to the heat dissipation base 13, and the first heat dissipation fin 111 and the second heat dissipation fin 112 are alternately arranged at intervals. The second heat dissipation fins 112 are in a Y shape divided into two, and by arranging the second heat dissipation fins 112 in a structure divided into two, the heat dissipation area of the heat sink 1 is larger under the condition of occupying the same volume. In the present embodiment, the first heat dissipation fins 111 and the second heat dissipation fins 112 are disposed at intervals, each first heat dissipation fin 111 is uniformly distributed on the circumference, each second heat dissipation fin 112 is uniformly distributed on the circumference, and two adjacent second heat dissipation fins 112 are symmetrically disposed with a first heat dissipation fin 111. In the present embodiment, the distance between the first heat dissipation fins 111 and the second heat dissipation fins 112 is 8-12 mm, and in general, in order to make the air in the radiator 1 circulate smoothly, and further make the radiator 1 exert the maximum heat dissipation effect, the design stress of the distance between the heat dissipation fins tends to be uniform.

Fig. 27 is a front view of an LED lamp in some embodiments. In the LED lamp shown in fig. 27, the heat radiation fins 11 are divided into two parts in the radial direction of the LED lamp, that is, the first part 111a has a smaller arc than the second part 111b, and the first part 111a has a smaller arc than the second part 111b (the arc herein refers to the arc thereof on the outline of the LED lamp). In other embodiments, the curvature of the first portion 111a is greater than or equal to the curvature of the second portion 111b.

Fig. 28 is a front view of an LED lamp in some embodiments. As shown in fig. 28, the heat dissipation strips 16 are disposed on two sides of the heat dissipation fin 11, wherein the heat dissipation strips 16 on one side are located between two adjacent heat dissipation strips 16 on the other side, that is, the heat dissipation strips 16 on the two sides do not overlap in the transverse projection direction. In this embodiment, the distance between two adjacent heat dissipating strips 16 on one side is equal to the distance between two adjacent heat dissipating strips 16 on the other side. The heat dissipating strips 16 can increase the surface area of the whole heat dissipating fins 11, so that the heat dissipating fins 11 have more area for heat radiation, thereby improving the heat dissipating performance of the heat sink 1. In other embodiments, to increase the surface area of the heat sink fins 11, the surface of the heat sink fins 11 may be configured to have a wavy shape.

As shown in fig. 23, at least one heat dissipation fin 11 is divided into two parts in the radial direction of the LED lamp, and the two parts are spaced apart, so that a flow channel can be formed at the above-mentioned interval, so that air can be convected at the above-mentioned interval. In addition, the above-mentioned interval corresponds to the area of the lamp panel 3 where the LED chip 311 is disposed when the LED lamp is projected onto the lamp panel 3 in the axial direction, and thus, the increased convection can improve the heat dissipation effect on the LED chip 311. From the standpoint of the overall weight limitation of the LED lamp, the heat radiating bass 11 is partially arranged at intervals, so that the consumption of the heat radiating bass 11 is reduced, the overall weight of the radiator 1 is reduced, and the allowance of design space for other parts of the LED lamp is provided. In other embodiments, such as the LED lamp in fig. 27, the heat dissipation fins 11 may not have the above-mentioned spacing, that is, the heat dissipation fins 11 are integrally formed in the radial direction of the LED lamp.

Fig. 24 is an enlarged schematic view at E in fig. 23. As shown in fig. 23 and 24, specifically, the heat radiation fin 11 includes a first heat radiation fin 111 and a second heat radiation fin 112, the first heat radiation fin 111 is divided into two parts in the radial direction of the LED lamp, namely, a first part 111a and a second part 111b, and the two parts are disposed at intervals in the radial direction of the LED lamp, and a spacer 111c is formed at the intervals. The first portion 111a is located radially inward of the second portion 111 b. The second heat sink fin 112 has a third portion 112a and a fourth portion 112b, the fourth portion 112b extends from the third portion 112a, the fourth portion 112b is changed in position in the circumferential direction compared to the third portion 112a, and the fourth portion 112b is located radially outside the heat sink 1 relative to the third portion 112a to improve space utilization, so that there is more area of the heat sink fin 11 that can dissipate heat. As shown in fig. 24, the third portion 112a and the fourth portion 112b are connected by a transition section 113, the transition section 113 has a buffer section 113a and a guide section 113b, both the buffer section 113a and the guide section 113b are arc-shaped, and both form an "S" shape or an inverted "S" shape. The buffer section 113a is provided to avoid the vortex formation caused by the blocking of the air flowing radially outward on the surface of the second radiator fin 112 as shown in fig. 25, thereby preventing the convection, but the guide section 113b guides the air flowing continuously along the surface of the second radiator fin 112 to flow radially outward.

As shown in fig. 24, a second heat sink fin 112 includes a third portion 112a and two fourth portions 112b, and the two fourth portions 112b are symmetrically disposed with the third portion 112a as a symmetry axis. In other embodiments, a second heat sink fin 112 may also include a third portion 112a and a plurality of fourth portions 112b, such as three or four fourth portions 112b (not shown), and the fourth portions 112b of the second heat sink fin 112 on two sides of the LED lamp in the circumferential direction are adjacent to the first heat sink fin 111.

As shown in fig. 24, the direction of any tangential line of the guiding section 113b is offset from the space 111c, so that the convective air is prevented from entering the space 111c by guiding the guiding section 113b, and the convective path is lengthened to affect the heat dissipation efficiency. Preferably, the direction in which any tangential line of the guide section 113b is directed is located radially outward of the spacer 111 c. In other embodiments, at least a portion of the tangent line of the guide segment 113b is directed radially inward of the spacer 111 c.

As shown in fig. 26, in other embodiments, the direction in which at least a portion of the tangent line of the guiding segment 113b points falls into the spacing region 111c, so that convection is more complete, but the path of convection is correspondingly increased.

As shown in fig. 21, the radiator fin 11 has a protrusion 1102, the protrusion 1102 protruding with respect to the surface of the radiator fin 11, the protrusion 1102 extending in the axial direction of the lamp and contacting the radiator base 13. In addition, the surface of the boss 1102 may alternatively be in the form of a circumferential surface, or may alternatively be in the form of regular or irregular polygonal columns. The protrusion 1102 can increase the surface area of the heat dissipation fin 11 and increase the heat dissipation efficiency, and in addition, the protrusion 1102 also supports the heat dissipation fin 11 to prevent the heat dissipation fin 11 from being deflected during processing and molding. In some embodiments, the same heat dissipation fin 11 is divided into two parts in the radial direction of the LED lamp, and at least one corresponding protrusion 1102 is disposed on each part to support the two parts. In the present embodiment, the protruding portion 1102 is provided at an end of the heat radiation fin 11 in the radial direction of the LED lamp, for example, at an end of the

first portions

111a and 111b (an end near the spacer 111 c).

In some embodiments, when the heat dissipation fins 11 are integral, i.e. without the above-mentioned spacing portions, the protruding portions 1102 can also be disposed on the surface (not shown) of the heat dissipation bass 11 to increase the surface area of the heat dissipation fins 11 and support the heat dissipation fins 11, so as to prevent the heat dissipation fins 11 from being deflected during processing and molding.

Fig. 29 is a bottom view of the LED lamp of fig. 1 with the lamp cover 4 removed. Fig. 30 is an enlarged view at a in fig. 29. As shown in fig. 29 and 30, the heat sink 1 is sleeved on the radial periphery of the inner sleeve 21, and the inner side wall of the heat sink fins 11 in the radial direction of the LED lamp is spaced from the inner sleeve 21 of the lamp housing 2, so that, on one hand, the inner sleeve is prevented from being heated and expanded and being extruded by the inner side wall of the heat sink fins 11 to be damaged during operation, and on the other hand, the inner side wall of the heat sink fins 11 is prevented from directly contacting the inner sleeve 21 to form heat conduction, so that the heat of the heat sink fins 11 is conducted into the inner sleeve 21 to affect the electronic components of the power supply 5 in the lamp housing 2, and finally, the inner side wall of the heat sink fins 11 in the radial direction of the LED lamp and the inner sleeve of the lamp housing 2 have air in the space therebetween, and the air has a heat insulation function, so that the heat of the heat sink 1 is further prevented from affecting the power supply 5 in the inner sleeve 21. In other embodiments, in order to make the heat dissipation fins 11 radially support the inner housing 21, a portion of the radially inner sidewalls of the heat dissipation fins 11 may contact and support the outer peripheral surface of the inner housing 21, and a portion of the heat dissipation fins 11 may be spaced from the inner housing 21, which may be applied to the LED lamp of fig. 29. As shown in fig. 29, the lamp panel 3 includes a third opening 32 to expose the first air intake holes 2201 and the second air intake holes 1301. In some embodiments, to rapidly discharge the heat energy generated by the power source 5, the ratio of the cross-sectional area of the first air inlet hole 2201 to the cross-sectional area of the second air inlet hole 1301 is greater than 1 and less than or equal to 2. In some embodiments, in order to rapidly discharge the heat energy generated by the LEDs of the lamp panel 3, the ratio of the cross-sectional area of the second air inlet hole 1301 to the cross-sectional area of the first air inlet hole 2201 is greater than 1 and less than or equal to 1.5.

As shown in fig. 21 and 22, the innermost position of the heat radiation fins 11 in the radial direction of the LED lamp is located further outside the heat radiation holes 222 in the radial direction of the LED lamp, that is, the innermost position of the heat radiation fins 11 in the radial direction of the LED lamp is spaced from the position of the heat radiation holes 222 in the radial direction of the LED lamp. In this way, when the heat emitted by the heat dissipation fins 11 is upward, the heat will not gather at the heat dissipation holes 222, so that a certain distance is kept between the heat dissipation fins and the heat dissipation holes 222, so that the influence of the hot air is avoided, and the temperature near the heat dissipation holes 222 is increased to influence the convection speed of the first heat dissipation channel 7a (the convection speed depends on the temperature difference at two sides of the first heat dissipation channel 7a, and when the temperature near the heat dissipation holes 222 is increased, the convection speed is correspondingly reduced).

Fig. 31 is a sectional view of the LED lamp in the present embodiment. Fig. 32 is an enlarged view at C in fig. 31. As shown in fig. 31 and 32, the heat sink 1 includes the heat radiation fins 11 and the heat radiation base 13, the heat radiation base 13 has the convex portion 135, the convex portion 135 is provided downward in the axial direction of the LED lamp, the convex portion 135 exceeds the lamp panel 3 in the axial direction of the LED lamp, and the lowest position (lower end face 133) of the convex portion 135 substantially coincides with the height of the light output surface 43 of the lamp housing 4 (in the axial direction of the LED lamp), or the lowest position of the convex portion 135 slightly exceeds the light output surface 43 of the lamp housing 4, for example, the lowest position of the convex portion 135 exceeds the light output surface 43 of the lamp housing 4 by about 1 to 10 mm, so that the heat sink 1 increases in volume with the overall height dimension of the LED lamp unchanged, or slightly enlarged, so that the heat radiation fins 11 and the heat radiation base 13 have a larger heat radiation area.

The convex portion 135 in this embodiment is annular, and defines a concave structure with the heat dissipation base 13, in which the light source and the lamp shade 4 are disposed, and protect the light source and the lamp shade 4, and the concave structure can play a role in anti-glare (the concave structure blocks the lateral light of the light source).

As shown in fig. 32, the heat dissipation base 13 has a first inner surface 136, the lamp housing 4 has an outer peripheral wall 45, and after the lamp housing 4 is correctly mounted on the LED lamp, the first inner surface 136 corresponds to the outer peripheral wall 45 of the lamp housing 4 (radially outside the lamp housing 4), and a gap is maintained between the first inner surface 136 and the outer peripheral wall 45, so as to prevent the lamp housing 4 from being expanded by heat due to heat generation and being crushed by the first inner surface 136 when the LED lamp is operated. By maintaining the first inner surface 136 in clearance with the outer peripheral wall 45, the occurrence of the above-described pressing can be reduced or avoided. In other embodiments, a portion of the peripheral wall 45 of the lamp housing 4 may be disposed in contact with the first inner surface 136 such that the first inner surface 136 supports the radial direction of the lamp housing 4, while other portions of the peripheral wall 45 of the lamp housing 4 remain in clearance with the first inner surface 136.

As shown in fig. 32, the first inner surface 136 is configured as an inclined surface, which forms an included angle with the lamp panel 3, and the included angle may be an obtuse angle. Therefore, when the outer peripheral wall 45 of the lamp housing 4 is pressed against the inclined surface when the lamp housing 4 is expanded by heat, the pressing force of the first inner surface 136 to the radially outer side of the lamp housing 4 is decomposed into a downward component force and a horizontal component force, which contributes to reduction of the pressing of the lamp housing 4 in the horizontal direction (the pressing in the horizontal direction is the main cause of breakage of the lamp housing 4). In other embodiments, the peripheral surface of the peripheral wall 45 may be abutted against the first inner surface 136 (not shown), so as to support or limit the lampshade 4, and since the first inner surface 136 is an inclined surface, the probability of damage of the lampshade 4 due to extrusion caused by thermal expansion can be reduced, and the end of the peripheral wall 45 may be abutted against the first inner surface 136, so that the contact area between the whole peripheral wall 45 and the heat dissipation base 13 can be reduced, and excessive heat conduction can be avoided.

As shown in fig. 32, the heat dissipation base 13 further has a second inner surface 137, the lamp housing 4 has an outer peripheral wall 45, the outer peripheral wall 45 and the first inner surface 136 keep a gap, and the end of the outer peripheral wall 45 abuts against the second inner surface 137, the angle between the first inner surface 136 and the lamp panel 3 is smaller than the angle between the second inner surface 137 and the lamp panel 3, that is, the second inner surface 137 is flatter than the first inner surface 136, so that the end of the outer peripheral wall 45 abuts against the second inner surface 137, and when the lamp housing 4 is expanded by heat, the horizontal extrusion of the second inner surface 137 against the lamp housing 4 is smaller. In this embodiment, the included angle between the second inner surface 137 and the lamp panel 3 is 120 ° to 150 °, if the included angle is too large, the lamp shade 4 cannot be effectively supported in the radial direction of the LED lamp, and if the included angle is too small, the effect of reducing the horizontal force applied to the lamp shade 4 after the thermal expansion of the lamp shade 4 cannot be achieved, and the effect of limiting and supporting the lamp shade 4 in the axial direction of the LED lamp cannot be achieved, and when the above-mentioned interval is provided, the balance can be well performed. In other embodiments, the second inner surface 137 and the first inner surface 136 may be curved, with the distance of the second inner surface 137 and the first inner surface 136 from the axis of the LED lamp increasing as it goes down, but, overall, the second inner surface 137 is flatter than the first inner surface 136.

As shown in fig. 33, the end of the outer peripheral wall 45 is provided with the protruding walls 451, the protruding walls 451 are arranged at intervals in the circumferential direction of the outer peripheral wall 45, the protruding walls 451 are the portions where the end of the outer peripheral wall 45 actually contacts the second inner surface 137, and by the arrangement of the protruding walls 451, the contact area between the outer peripheral wall 45 of the lamp housing 4 and the heat dissipation base 13 can be reduced, so that the heat of the radiator 1 is prevented from being conducted to the lamp housing 4, and the temperature of the lamp housing 4 is excessively high.

As shown in fig. 31 and 32, a gap is formed between the peripheral wall 45 of the lamp housing 4 and the heat dissipation base 13, and a hole is formed in the heat dissipation base 13, one side of the hole is communicated with the gap, and the other side of the hole corresponds to the heat dissipation fin 11, that is, air can enter from the gap and reach the heat dissipation fin 11 through the hole, so that convection is increased, and a convection path is formed, as shown by an arrow in fig. 32, to form a fourth heat dissipation channel 7d of the LED lamp of the present embodiment. At this time, since the convex walls 451 are arranged at intervals in the circumferential direction of the outer circumferential wall 45, air can pass through the gaps between the convex walls 451, thereby completing the above-described convection. As shown in fig. 34 and 35, in other embodiments, the fourth heat dissipation channel 7d may be disposed at other positions, and only the area between the lower portion of the LED lamp and the heat dissipation fins 11 needs to be communicated. For example, the through holes 315 are disposed between the adjacent LED chip sets 31 on the lamp panel 3, and in this case, the lamp housing 4 may be formed as a separate body, i.e. including a plurality of portions, to cover the different LED chip sets 31, and the through holes 315 are disposed between the two portions of the lamp housing 4, so that the through holes 315 communicate with the space between the heat dissipation fins 11 below the LED lamp and above.

The radiator 1 in the present embodiment is of an integral structure, so that it is advantageous to reduce the thermal resistance between the heat dissipation fins 11 and the heat dissipation base 13. In other embodiments, the heat dissipation fins 11 and the heat dissipation base 13 may be designed to be detachable for easy processing and molding.

In this embodiment, the heat sink fins 11 have different temperatures at different positions, for example, the portion near the LED chip 311 is 80 ℃, and the temperature above the heat sink fins 11 is slightly reduced. With the difference of the temperature distribution inside the heat sink fins, the heat dissipation capacity is reduced to several percent of the uniform temperature of the heat sink fins 11, which is called the efficiency of the heat sink fins, and the efficiency of the heat sink fins 11 can be calculated by the heat conductivity and the size. The efficiency of the heat sink fins 11 is related to the heat transfer coefficient, thickness, width, and height of the heat sink fins 11.

In this embodiment, in order to enhance the efficiency of the heat radiation fins 11, the thickness of the heat radiation fins 11 is set to 0.8 to 2mm, preferably 1 to 1.5mm. The ratio of the thickness to the length of the heat dissipation fins 11 is not less than 1:80, preferably, the ratio of the thickness to the length of the heat dissipation fins 11 is not less than 1:70, more preferably, the ratio of the thickness to the length of the heat dissipation fins 11 is 1:60-80. Therefore, the weight and the heat dissipation area of the whole radiator 1 are balanced in the heat dissipation effect of the heat dissipation fins 11, so that the heat dissipation fins 11 have better efficiency. Here, the length of the heat radiation fin 11 refers to the height in the axial direction of the LED lamp. In this embodiment, the ratio of the width to the length of the heat dissipation fins 11 is set to be greater than 1:1.5, preferably, the ratio of the width to the length of the heat dissipation fins 11 is greater than 1:1.3, so that the heat transfer coefficient of the heat dissipation fins 11 is better, and the efficiency of the heat dissipation fins 11 is improved. Here, the length of the heat radiation fins 11 refers to the height in the axial direction of the LED lamp, and the width refers to the length of the heat radiation fins 11 in the radial direction of the LED lamp. If the radiator fins 11 are not of a regular directional structure, the width of the radiator fins 11 may be averaged or half of the maximum value plus half of the minimum value of the width, and the length may be averaged or half of the maximum value plus half of the minimum value of the width.

h represents the heat transfer coefficient of the heat radiation fin, and the unit is [ W/(m) ² ·℃)]；

V represents the flow rate of convection air;

l represents the length of the radiating fins in the convection direction;

as can be seen from the above formula, when at least a part of heat of the radiator fins 11 is dissipated by convection, the heat transfer coefficient is greatly affected by the arrangement condition of the radiating surface. In addition, the thickness (cross-sectional area) of the fin 11 is also an important factor in heat transfer. The downstream air temperature in the air flow direction increases and the cooling capacity decreases accordingly, so that the heat dissipation amount increases if the heat dissipation fins 11 are arranged in a short length and wide width in the air flow direction on the heat dissipation fins 11 of the same area, and in addition, the present embodiment controls the height of the heat dissipation fins 11 so that the heat dissipation fins 11 have an area closer to the LED chip 311 to accelerate the heat conduction from the LED chip 311 to the heat dissipation fins 11 under the same heat dissipation area. The thickness of the heat dissipation fins 11 also affects the efficiency of the heat dissipation fins 11, and the greater the thickness of the heat dissipation fins 11, the higher the efficiency, but the weight and heat dissipation area are required to be balanced. In summary, the ratio of the thickness to the length of the heat sink fins 11 is set to be not less than 1:80, and the ratio of the width to the length of the heat sink fins 11 is set to be greater than 1:1.5.

Fig. 36 a-36 m are schematic diagrams of various heat sinks 10 in some embodiments, applicable to LED lamps to replace the heat sink 1 of the LED lamp shown in fig. 1.

Fig. 36a shows a radiator 10 according to a first preferred embodiment of the present invention. The heat sink includes a first heat sink fin 101 and a second heat sink fin 102. The heat sink 1 defines a first circumference R1 and a second circumference R2 projected on the heat dissipation base 130, and the second circumference R2 is larger than the first circumference R1. On the heat dissipation base 130, the first heat dissipation fins 101 extend to the outer periphery of the cylindrical accommodating space (the portion for accommodating the inner sleeve 21, the cylindrical accommodating space is defined by the cylindrical accommodating space in this embodiment in the following description), and do not exceed the second circumference R2, for example, the first heat dissipation fins 101 extend from the outer periphery of the cylindrical accommodating space to exactly the first circumference R1. The second heat sink fins 102 extend over the first circumference R1, but not over the second circumference R2, e.g. just over the second circumference R2. The first heat dissipation fins 101 and the second heat dissipation fins 102 are alternately arranged in the circumferential direction in the radial direction, and every two second heat dissipation fins 102 are symmetrically arranged by one first heat dissipation fin 101. The first radiator fins 101 and the second radiator fins 102 have a gap therebetween so that the air flow can pass therethrough, and the path of the air flow flowing between the first radiator fins 101 and the second radiator fins 102 is prolonged to increase the amount of heat exchange between the

radiator fins

101, 102 and the air flow.

As shown in fig. 36b, a radiator 10 according to a second preferred embodiment of the present invention is provided. The difference between the radiator 1 according to the second preferred embodiment and the first embodiment is that the radiator 10 further includes the spacing heat dissipation fins 108, the heat dissipation base 130 extends from the periphery of the cylindrical accommodating space to the second circumference R2, and is staggered with the first heat dissipation fins 101 in the circumference direction, and is staggered with the second heat dissipation fins 102 between the first circumference R1 and the second circumference R2, so that each two first heat dissipation fins 101 are symmetrically arranged with one spacing heat dissipation fin 108, and each two second heat dissipation fins 102 are symmetrically arranged with one spacing heat dissipation fin 108.

As shown in fig. 36c, a radiator 10 according to a third preferred embodiment of the present invention is provided. The difference between the radiator 10 according to the third preferred embodiment and the second preferred embodiment is that the radiator 10 further includes the third heat dissipation fins 103, and the radiator 10 further defines a third circumference R3 projected on the heat dissipation base 103, and the third circumference R3 is larger than the second circumference R2. On the heat dissipation base 103, the first heat dissipation fins 101 extend from the outer periphery of the cylindrical accommodating space to the first circumference R1, the second heat dissipation fins 102 extend from the first circumference R1 to the second circumference R2, and the third heat dissipation fins 103 extend from the second circumference R2 to the third circumference R3. The second heat dissipation fins 102 and the third heat dissipation fins 103 are alternately arranged in the circumferential direction in the radial direction, and every two third heat dissipation fins 103 are symmetrically arranged by one second heat dissipation fin 102.

The heat dissipation fins of the third preferred embodiment can be further extended to an nth fin, where n is an integer greater than two. That is, the heat dissipation base 130 defines a first circumference R1 to an nth circumference from a small to a large, the first heat dissipation fins 101 extend from the outer circumference of the cylindrical accommodating space to the first circumference R1, and the nth heat dissipation fins extend from the n-1 circumference to the nth circumference. In the radial direction, the n-1 th radiating fins and the n-th radiating fins are alternately arranged in the circumferential direction, and every two n-th radiating fins are symmetrically arranged by one n-1 th radiating fin. In addition, at least a portion of the first through nth heat dissipation fins 101 through n heat dissipation fins overlap the LED lamp panel 3 (projection of the LED lamp in the axial direction) on the heat dissipation base 130, so as to ensure that the LED lamp panel 3 has a direct heat conduction path to the heat dissipation fins.

As shown in fig. 36c, the nth radiator fins and the nth radiator fins are not overlapped in a staggered manner in the circumferential direction, that is, as shown in fig. 36c, the outer edges of the nth radiator fins do not exceed the nth circumference of the nth radiator fins, and the nth radiator fins extend from the nth circumference of the nth radiator fins. For example, the outer edge of the second heat sink fin 102 does not exceed the second circumference R2, and the third heat sink fin 103 extends from the second circumference R2 and does not exceed the third circumference R3.

As shown in fig. 36d, in the radiator fins of the third preferred embodiment, the n-th radiator fins and the n-1-th radiator fins may be alternately overlapped in the circumferential direction. That is, as shown in fig. 36d, the outer edges of the n-1 th fin extend beyond the n-1 th circumference but do not reach the n-th circumference, and the n-th fin extends from the n-1 th circumference. For example, the outer edges of the second radiator fins 12 extend beyond the second circumference R2 but do not reach the third circumference R3, and the third radiator fins 13 extend from the second circumference R2.

In the embodiment of fig. 1 to 2, the outer edges of the radiator fins 11 are rounded. In other embodiments, the outer edges of the heat sink fins may be wavy, or the outer edges of the heat sink fins may be straight or stepped.

As shown in fig. 36e, a radiator 10 according to a fourth preferred embodiment is provided. The difference between the radiator 10 according to the fourth embodiment and fig. 1 is that the outer edges of the radiating fins of the radiator 1, such as the first radiating fins 101, are perpendicular to the radiating base 130, so that the first radiating fins 101 are rectangular (rectangular or square) when viewed from the direction perpendicular to the axial direction, and the outer edges are not in the shape of upwardly tapered curves. The rectangular first heat dissipation fins 101 can effectively increase the area of the first heat dissipation fins 101 and increase the heat exchange with the air flow under the same limitation of the height and the width.

As shown in fig. 36f, in one embodiment, the heat sink fins of the heat sink 1 include first heat sink fins 101 to n heat sink fins, each of the first heat sink fins 101 to n heat sink fins has a hole 101a, and the hole 101a penetrates through two sides of the heat sink fins. For example, the first heat sink fin 101 shown in fig. 36f has holes 101a penetrating through both sides. Holes 101a penetrating through the two sides of the heat dissipation fins can promote the flow of air flow to accelerate heat dissipation, and simultaneously reduce the weight of the heat sink 1.

As shown in fig. 36g, in an embodiment, the heat sink fins of the heat sink 1, including the first heat sink fin 101 to the nth heat sink fin, may be configured as a two-stage drop. The first stage 1011 extends above the heat sink base 130, and the second stage 1012 extends above the first stage 1011. The length of the first stage 1011 in the radial direction of the LED lamp is greater than the length of the second stage 1012 in the radial direction of the LED lamp, and the height of the first stage 1011 in the axial direction of the LED lamp is lower than the height of the second stage 1012 in the axial direction of the LED lamp. Therefore, the first radiator fin 101 is formed in a stepped shape as viewed from a direction perpendicular to the axial direction. This arrangement ensures that the heat sink 1 has sufficient fin area in the lower portion for conducting heat generated by operation of the LED chip 311, while the upper portion is mainly by radiation and convection, so that the fin area can be properly reduced from a weight reduction perspective.

As shown in fig. 36h, a radiator 10 according to a fifth preferred embodiment of the present invention is provided. The heat sink 10 of the fifth preferred embodiment is based on the fourth preferred embodiment, and further configured with the second heat sink fins 102, wherein the outer edges of the second heat sink fins 102 are perpendicular to the heat sink base 130, such that the second heat sink fins 102 are rectangular (rectangular or square). Meanwhile, the height of the second heat dissipation fins 102 on the heat dissipation base 130 is smaller than the height of the first heat dissipation fins 101, and the second heat dissipation fins 102 and the first heat dissipation fins 101 are arranged alternately. Accordingly, the second radiator fins 102 can increase the heat exchange area with the airflow, but can reduce the heat radiation exchange between the first radiator fins 101 and the second radiator fins 102 due to the smaller height. In the present embodiment, if the total number of the first heat radiation fins 101 and the second heat radiation fins 102 is the same as the number of the heat radiation fins in the fourth preferred embodiment (i.e., in the case where the number of the fins is the same), the design of the present embodiment is more advantageous for weight reduction of the entire heat sink 10, and heat radiation exchange between the first heat radiation fins 11 and the second heat radiation fins 102 can be reduced.

As shown in fig. 36i, a radiator 1 according to a sixth preferred embodiment of the present invention is provided. The radiator 10 of the sixth preferred embodiment is based on the previous embodiment, and further comprises an outer support wall 106 and an inner support wall 105. The outer support wall 106 is connected to the outer side edge of the first radiator fin 101, and the inner support wall 105 is connected to the inner side edge of the first radiator fin 101, thereby preventing deflection of the first radiator fin 101. As shown in fig. 36i, when the heat sink 10 is viewed from above, the outer support wall 106 and the inner support wall 105 each have a circular shape, so that the first radiator fins 101 can be connected from the radial direction. The outer support wall 106 and the inner support wall 105 may be connected to the heat dissipation base 130, that is, may extend vertically to the upper surface of the heat dissipation base 130, and the outer support wall 106 and the inner support wall 105 may be connected to only the first heat dissipation fin 101, and may be spaced apart from the upper surface of the heat dissipation base 130. In the axial direction, the heights of the outer support wall 106 and the inner support wall 105 are smaller than the height of the first radiator fins 11, so that the air flow is maintained clear in the radial direction. The outer support wall 106 and the inner support wall 105 may be configured only alternatively, and it is not necessary to configure the outer support wall 106 and the inner support wall 105 at the same time. As shown in fig. 36j, the outer supporting wall 106 and the inner supporting wall 105 may also be arranged in a segmented manner, that is, the outer supporting wall 106 may be, for example, provided with a plurality of arc segments 1061 arranged at equal intervals or unequal intervals on the same circumference, and the arc segments 1061 are connected with at least two groups of the first heat dissipation fins 101, so as to further reduce the influence on convection.

As shown in fig. 36k, a radiator 10 according to a seventh preferred embodiment of the present invention is provided. The radiator 10 of the seventh preferred embodiment is based on the first embodiment described above, and the form of the first radiator fins 101 is modified. In the seventh preferred embodiment, the first heat sink fin 101 includes a first portion 101a, a second portion 101b and a connecting portion 101c. The first portion 101a and the second portion 101b extend in the radial direction and are connected to each other by a connecting portion 101c. Wherein the first portion 101a extends outward from the outer periphery of the cylindrical accommodating space, and the second portion 101b is connected to the first portion 101a through the connection portion 101c to further extend outward. The connection portion 101c is not parallel to the radial direction, and in one embodiment, the connection portion 101c extends substantially along the circumferential direction or is perpendicular to the radial direction, such that the first portion 101a and the second portion 101b are staggered in the radial direction, and not on the same radial extension line. The arrangement of the connection portion 101c can increase the area of the first radiator fins 11, thereby improving the heat exchange amount between the air flow and the first radiator fins 11, and in addition, the arrangement of the connection portion 101c can play a supporting role, thereby preventing the deflection of the first radiator fins 11.

Fig. 36l and 36m show a radiator 1 "according to an eighth preferred embodiment of the present invention. The radiator 10 of the eighth preferred embodiment is based on the foregoing embodiment, and the form of the first radiator fins 101 is modified. In the eighth preferred embodiment, a plurality of concentric circles with different radii are defined on the heat dissipation base plate 130, and the first heat dissipation fins 101 are respectively on the heat dissipation base plate 130 and extend vertically from the concentric circles to the heat dissipation base plate 130.

In fig. 36l, the first heat dissipation fins 101 on each concentric circle are continuous, that is, the first heat dissipation fins 101 are annular, and each concentric circle is provided with one first heat dissipation fin 101.

In fig. 36m, the first heat dissipation fins 101 on each concentric circle are discontinuous, that is, the first heat dissipation fins 101 are arc-shaped, and a plurality of arc-shaped first heat dissipation fins 101 are disposed on each concentric circle, and gaps are formed between adjacent first heat dissipation fins 101 on the same concentric circle so as to enable air flow to flow in the radial direction.

In some embodiments, the heat sink 1 has a central axis XX, and a plane A-A with the central axis XX as a normal line intersects with the central axis XX at an intersection point 91, and the intersection point 91 is located in the column-shaped accommodating space of the heat sink 1. In some embodiments, the distance from the central axis XX to the edge of the heat sink fin 11 along the plane A-A is greater than zero, as shown in fig. 37a to 37 d. In the example of fig. 37a, a virtual circle (shown by a dotted line in fig. 37 a) is established on the plane A-A with the intersection point 91 as a center and the distance D1 as a radius, and the heat spreader 1 has at least one heat dissipation fin 11, and the virtual circle and the edge of the heat dissipation fin 11 are staggered. When the heat sink 1 has a plurality of heat dissipation fins 11, the edges of the plurality of heat dissipation fins 1 have the same distance D1 from the central axis of the heat sink 1, and the virtual circles and the edges of the plurality of heat dissipation fins 11 are staggered. In some embodiments, the heat sink 1 has a plurality of heat dissipation fins 11, the distances D1 and D2 from the edges of at least two heat dissipation fins 1 to the central axis XX of the heat sink along the plane A-A are unequal, the distance D1 is smaller than the distance D2, the intersection point 91 is used as a center, the shorter distance D1 is used as a radius, a virtual circle (as shown by a dotted line in fig. 37 b) is established on the plane A-A, and the edges of the heat dissipation fins 11 with the distance D2 are not staggered, and an exemplary illustration of this embodiment is shown in fig. 37b.

In some embodiments, the heat spreader 1 has a plurality of heat dissipation fins 11, the distances D1, D2, D3, …, dn (only D1, D2 and D3 are shown in fig. 37 c) from the edges of the plurality of heat dissipation fins 11 to the central axis XX of the heat spreader 1 are not equal, the distance D1 is smaller than the distance D2, the distance D2 is smaller than the distance D3, a virtual circle (as shown by a dashed line in fig. 37 c) is established on the plane A-A with the intersection point 91 as a center and the shortest distance D1 as a radius, and the virtual circle 30 and other edges of the heat dissipation fins 11 greater than the shortest distance D1 are not staggered, which is shown in fig. 37c.

In some embodiments, the heat spreader 1 has a plurality of heat dissipation fins 11, the distances D1, D2 and D3 from the edges of the plurality of heat dissipation fins 11 to the central axis XX of the heat spreader 1 are unequal, the distance D1 is smaller than the distance D2, the distance D2 is smaller than the distance D3, a plurality of virtual circles (as shown by the dotted line in fig. 37D) are established on the plane A-A with the intersection point 91 as the center, the distances D1, D2 and D3 as the radius, part of the virtual circles and the edges of the part of the heat dissipation fins 11 are not staggered, part of the virtual circles penetrate through part of the heat dissipation fins 11, the exemplary illustration of this embodiment is shown in fig. 16 with the distance D1 as the radius, the virtual circles established on the plane A-A, and the heat dissipation fins 11 with the distance greater than D1 are not staggered; taking the distance D2 as a radius, a virtual circle established on the plane A-A penetrates through the radiating fins 11 with the distance less than D2 and is not staggered with the radiating fins 11 with the distance greater than D2; with the distance D3 as a radius, a virtual circle established on the plane A-A penetrates the heat radiation fins 11 with a distance greater than D3.

Fig. 38 a-38 i are top views of heat sink 1 in some embodiments, replacing heat sink 1 in fig. 1 for ease of illustration. As shown in fig. 1 and 38a, the heat sink 1 includes heat dissipation units and a heat dissipation base 13, each heat dissipation unit extends along an axial direction of the LED lamp and is disposed on the heat dissipation base 13, the heat dissipation units are implemented by heat dissipation fins 11, and the heat dissipation units are uniformly distributed radially along a circumferential direction of the heat dissipation base 13. The root of each heat radiating unit is connected with a heat radiating base 13. The inner side edge of the heat dissipation unit defines a cylindrical accommodating space 14, and the accommodating space 14 is used for setting the inner sleeve 21. When the LED lamp is in use, the heat dissipation base 22 transfers heat generated from the lamp panel 3 to the heat dissipation unit, and further transferred from the heat dissipation unit to the outside air to enhance heat dissipation. The lamp housing 1 is connected to the heat sink 1 and is substantially connected to the upper edge of the heat dissipating unit. The upper edges of the plurality of heat dissipating units are cut flat along the radial direction at least at the part near the axis of the LED lamp to define a flat connection surface, and corresponding buckles can be arranged on the upper edges of the lamp housing 2 and the heat dissipating units, so that the lower end of the lamp housing 2 is connected with the connection surface and connected with the heat sink 1.

As shown in fig. 1, 2 and 38a, the aforementioned connection surface defines a first section A1 along the radial direction of the LED lamp, and the connection surface of the heat sink 1 and the lamp panel 3 defines a second section A2 along the radial direction of the LED lamp. In an embodiment, the number of the heat dissipating units projected on the first section A1 in the axial direction of the LED lamp is smaller than the number of the heat dissipating units projected on the second section in the axial direction of the LED lamp. That is, in the axial direction, since the air is upwardly convected, the heat dissipating unit is prevented from being blocked by the lamp housing 2 as much as possible, so that the upper edges of most heat dissipating units can be exposed to the air in an open manner, thereby forming a heat dissipating channel which is not blocked by the lamp housing 2, and enhancing the convection effect of the heat dissipating unit. In other angles, the number of the radiating units projected on the first section A1 in the axial direction of the LED lamp is smaller than the number of the radiating units projected on the outside of the first section A1 in the axial direction of the LED lamp, so that the technical effect is achieved. The area of the axial projection of the heat radiating unit on the first section A1 is smaller than the area of the axial projection of the heat radiating unit on the outside of the first section A1 so as to achieve the technical effect.

As shown in fig. 38a, the heat sink 1 defines a plurality of ring areas from inside to outside in the radial direction, the ring areas being defined as areas having the same number of heat dissipating units in the circumferential direction, in other words, different ring areas have different numbers of heat dissipating units therein, for example, the number of heat dissipating units in the ring area located inside is smaller than the number of heat dissipating units in the ring area located outside, and the number or area of ring areas overlapping with the first section A1 projection in the axial direction of the LED lamp is smaller than the number or area of ring areas overlapping with the second section A2 projection in the axial direction of the LED lamp.

More specifically, as shown in fig. 38b, the heat dissipating unit may include a plurality of first heat dissipating units 15 and a plurality of second heat dissipating units 16 (where the first heat dissipating units 15 and the second heat dissipating units 16 use different naming rules and different classifications for the first heat dissipating fins 111 and the second heat dissipating fins 112 in fig. 23 and 24), and in fig. 38b, the first heat dissipating units 15 are radially inner heat dissipating fins, and the second heat dissipating units 16 are radially outer heat dissipating fins. The first heat dissipating units 15 are mainly projected on the ring area located at the inner side, and the second heat dissipating units 16 are mainly projected on the ring area located at the outer side, and the outer side edge of each first heat dissipating unit 15 is radially bifurcated to form two second heat dissipating units 16 (when the outer side edge of the first heat dissipating unit 15 is radially bifurcated to form the second heat dissipating units 16, the first heat dissipating units 15 and the second heat dissipating units 16 may be connected or disconnected, i.e. the first heat dissipating units 15 and the second heat dissipating units 16 are radially spaced apart, so that the number of the second heat dissipating units 16 is greater than that of the first heat dissipating units 15. Meanwhile, the first section A1 is projected to the ring area located at the inner side, and the second section A2 is projected to the ring area located at the outer side, so that the first heat dissipating unit 111 is projected to the ring area located at the inner side in the axial direction of the LED lamp, and the second heat dissipating unit 16 is projected to the ring area located at the outer side in the axial direction of the LED lamp. Therefore, the number or area of the first heat dissipating units 15 projected on the first section A1 in the axial direction of the LED lamp is smaller than the number or area of the second heat dissipating units 16 projected on the first section A1 in the axial direction of the LED lamp.

As shown in fig. 38c and 38d, if the thickness of the first heat dissipating unit 15 is greater than that of the second heat dissipating unit 16, the distance between the first heat dissipating units 15 near the LED lamp axis is smaller than that between the second heat dissipating units 16 far from the LED lamp axis because of the radial arrangement. In a proper configuration of the thickness values of the first heat dissipating unit 15 and the second heat dissipating unit 16, any circumferential length (Δx1 sum) of the first heat dissipating unit 15 in the first section A1 is equal to any circumferential length (Δx2 sum) of the second heat dissipating unit 16 in the second section A2. The circumferential length refers to the total length of an arc cut through the first heat dissipating unit 15 or the second heat dissipating unit 16 by using the LED axis (also the axis of the heat sink 2) as a center.

More specifically, the first heat dissipating unit 15 or the second heat dissipating unit 16 are heat dissipating fins, which are radially distributed in the radial direction of the heat sink 1. The radiator 1 is divided into a first annular region C1 and a second annular region C2 from inside to outside in the radial direction, the radiator 1 further comprises a columnar accommodating region 14 located at the inner side of the first annular region C1, and the columnar accommodating region 14 is mainly used for accommodating a part of the power panel and providing a heat dissipation channel. The axis of the radiator 1 is taken as the center of a circle to establish a virtual circle, when the virtual circle falls into the first ring area C1, the total length of the arc cut through the radiating fins is X1 (delta X1 sum), when the virtual circle falls into the second ring area C2, the total length of the arc cut through the radiating fins is X2 (delta X2 sum), X1 is less than X2, and the ratio of the total length of the arc cut through the radiating fins by the virtual circle to the circumference of the virtual circle can be 0.06-0.2, so that the radiating fins can have enough sectional area for heat conduction, but can still maintain the interval value between the radiating fins to maintain the size of a convection channel, and ensure that the radiating fins with the same weight have enough surface area for radiating.

Further, if the heat dissipation fins need a larger cross-sectional area in the first ring area C1 for heat conduction, for example, the density of the LED chips 311 of the lamp panel 3 projected on the first ring area C1 is greater than the density of the LED chips 311 projected on the second ring area C2 (the density refers to the distribution number of the LED chips 311 in the unit area of the ring area), and the ratio Ra1 and Ra2 of X1 and X2 respectively occupy the perimeter of the virtual circle, ra1> Ra2 or X1 > X2 can be set so that the heat dissipation fins have a larger cross-sectional area in the first ring area C1 for heat conduction, and the distance between the heat dissipation fins can be maintained in the second ring area C2 to maintain the size of the convection channel.

Conversely, if the heat dissipation fins need a larger cross-sectional area in the second ring area C2 for heat conduction, for example, the density of the LED chips 311 of the lamp panel 3 projected on the first ring area C1 is greater than the density of the LED chips projected on the second ring area C2, and the ratio Ra1 and Ra2 of X1 and X2 respectively occupy the perimeter of the virtual circle, ra1< Ra2 or X1 < X2 may be set, so that the heat dissipation fins have a larger cross-sectional area in the second ring area C2 for heat conduction, and the distance between the heat dissipation fins may be maintained in the first ring area C1 to maintain the size of the convection channel.

If the density of the LED chips 311 of the lamp panel 3 projected on the first ring area C1 is equal to the density of the LED chips projected on the second ring area C2, ra 1=ra 2 or x1=x2 may be set, so that the heat dissipation fins have similar heat conduction efficiency in the first ring area C1 and the second ring area C2, and a too large temperature difference on the lamp panel 3 is avoided.

As shown in fig. 38e, in some embodiments, only a part of the outer edges of the first heat dissipating units 15 are branched to form two second heat dissipating units 16 along the radial direction, or the first heat dissipating units 15 and the second heat dissipating units 16 are respectively and independently arranged with different arrangement densities. In the heat sink 1 of fig. 38f, the number or area of the first heat dissipating units 15 projected on the first cross section A1 in the axial direction of the LED lamp is larger than the number or area of the second heat dissipating units 16 projected on the first cross section A1 in the axial direction of the LED lamp. In view of the projection condition of the plurality of annular regions, the number or area of the annular regions projected on the inner side in the axial direction of the LED lamp by the first heat dissipating unit 15 is larger than the number or area of the annular regions projected on the outer side in the axial direction of the LED lamp by the second heat dissipating unit 16.

Similarly, in fig. 38f, if the thickness value of the first heat dissipating unit 15 is smaller than the thickness value of the second heat dissipating unit 16, the pitch value of the first heat dissipating unit 15 may be larger than the pitch value of the second heat dissipating unit 16. In the configuration where the thickness values of the first heat dissipating unit 15 and the second heat dissipating unit 16 are appropriate, any circumferential length of the first heat dissipating unit 15 in the first section A1 is equal to any circumferential length of the second heat dissipating unit 16 in the second section A2.

As shown in fig. 38f, in an embodiment, only a portion of the outer edges of the first heat dissipating units 15 are radially branched to form two second heat dissipating units 16, or the first heat dissipating units 15 and the second heat dissipating units 16 are respectively and independently disposed, but are in a one-to-one correspondence configuration extending along the same radial line, so that the number of the first heat dissipating units 15 projected on the first section A1 in the axial direction of the LED lamp is equal to the number of the second heat dissipating units 16 projected on the first section A1 in the axial direction of the LED lamp. The radiator 1 is also divided into two annular areas from inside to outside in the radial direction, and the number or area of the annular areas of the first radiating unit 15 projected on the inner side in the axial direction of the LED lamp is equal to the number or area of the annular areas of the second radiating unit 16 projected on the outer side in the axial direction of the LED lamp.

As shown in fig. 38f, more specifically, if the thickness of the first heat dissipating unit 15 is equal to the thickness of the second heat dissipating unit 16, and the pitch of the first heat dissipating unit 15 is equal to the pitch of the second heat dissipating unit 16, then the length of any circumference of the first heat dissipating unit 15 in the first section A1 is equal to the length of any circumference of the second heat dissipating unit 16 in the second section A2.

As shown in fig. 38a and 38g, the ring area of the heat spreader 1 can be further expanded from two to more, for example, the heat spreader 1 further includes a third ring area C3, which is located outside the second ring area C2, and the virtual circle cuts through the total arc length X3 (Δx3) of the heat sink fins when it falls into the third ring area C3, and X1< X2< X3. If the ratio Ra1, ra2 and R3 of X1, X2 and X3 respectively occupy the perimeter of the virtual circle, ra1 = 0.06-0.13, ra2 = 0.1-0.18, ra3 = 0.12-0.16, and Ra1, ra2 and Ra3 all fall within the interval of 0.06-0.2, so that the heat dissipation fins can have sufficient cross-sectional area to conduct heat conduction, but still can maintain the distance between the heat dissipation fins to maintain the size of the convection channel, and ensure that the heat dissipation fins under the same weight have sufficient surface area to dissipate heat.

As shown in fig. 11, 38h and 38i, a chip mounting region (a region where the LED chip 311 is substantially located) is defined on the lamp panel 3, and the LED chip 311 is mounted on the chip mounting region on the lamp panel 3. The chip placement area at least partially falls into the projection of the second ring area C2 or the third ring area C3, specifically, the chip placement area is overlapped on the radiator 1 as much as possible in the outer ring area, so that the corresponding heat dissipating fins (the first heat dissipating unit 111 or the second heat dissipating unit 112) are located at the outer edge of the heat dissipating base 13, which has better convection cooling effect, and can correspond to more heat dissipating units (the number of the heat dissipating units on the outer side is greater than that of the heat dissipating units on the inner side). In one embodiment, at least 80% of the chip placement area falls into the projection of the second ring area C2 and/or the third ring area C3; preferably, the chip placement areas all fall into the projection of the second ring area C2 and/or the third ring area C3, as shown in fig. 38 i.

If the heat dissipation fins are radially distributed in the radial direction of the heat sink 1 and have uniform thickness, the number N1 of the heat dissipation fins cut when the virtual circle falls into the first annular region C1, the number N2 of the heat dissipation fins cut when the virtual circle falls into the second annular region C2, and N1 is smaller than N2, at this time, X1< X2 can be substantially achieved. Similarly, considering that the third ring region C3 is located outside the second ring region C2, the virtual circle falls into the third ring region C3 by the number N3 of heat dissipation fins, and N1< N2< N3, and X1< X2< X3 is substantially achieved. With this configuration, the chip set-up area can still be configured as shown in fig. 38 h.

Fig. 39 is a plan view of the heat sink 1 in the present embodiment. As shown in fig. 39, the heat sink 1 includes a plurality of first heat dissipating units 15 and a plurality of second heat dissipating units 16 (here, the first heat dissipating units 15 and the second heat dissipating units 16 use different naming rules and use different classification manners with respect to the first heat dissipating fins 111 and the second heat dissipating fins 112 in fig. 23 and 24). The first heat dissipation unit 15 and the second heat dissipation unit 16 are heat dissipation fins. Each first heat dissipating unit 15 includes first heat dissipating fins 15a radially distributed in the radial direction of the heat sink 1 and a first passage 15b in the radial direction, the first passage 15b being a gap between the pieces of the two first heat dissipating units 15 a. The heat sink 1 defines a plurality of annular regions, i.e., a first annular region C1, a second annular region C2 and a third annular region C3, from inside to outside in the radial direction, and the first passages 111b located in different annular regions have different widths. In the same annular region, the width of the first channel 15b located on the outer side is larger than that of the first channel 15b located on the inner side.

In fig. 39, the first heat dissipating units 15 may take different density configurations in different ring areas, and the first heat dissipating fins of the first heat dissipating units 15 may actually extend between at least two ring areas, so that the first heat dissipating units 15 take a staggered configuration, so that the first channels 15b located in different ring areas have different widths. Or, the first heat dissipation fin extends between at least two annular regions and is discontinuous at the juncture of the two annular regions.

As shown in fig. 39, each second heat dissipating unit 16 includes two second heat dissipating fins 16a and a second channel 16b formed between the two second heat dissipating fins, and the second channel 16b is opened or closed toward one side of the central axis of the heat sink 1. The first heat dissipating unit 15 and the second heat dissipating unit 16 may be located in different ring areas, and the ring area where the second heat dissipating unit 16 is located outside the ring area where the first heat dissipating unit 15 is located.

In the case where the second channels 16b are closed on the side facing the central axis of the radiator 1, as shown in fig. 39, the two second heat radiation fins 16 may extend from the outer edges of the first heat radiation fins 15, and the closed ends of the second heat radiation fins and the outer edges of the first heat radiation fins are located on the same radial line, but are not connected with each other with a gap therebetween, so as to form an additional channel.

The LED generates heat when it emits light. In the design of heat conduction of an LED, one of the key parameters is thermal resistance, which is smaller, which means better heat conduction. The influence factors of the thermal resistance are approximately the length of the heat conduction path, the heat conduction area and the heat conduction coefficient of the heat conduction material. The formula is as follows:

thermal resistance = thermal conduction path length L/(thermal conduction area S).

That is, the smaller the heat conduction path, the larger the heat conduction area, and the higher the heat conduction coefficient, the lower the thermal resistance.

As shown in fig. 29, in the present embodiment, the lamp panel 3 includes at least one LED chip set 31, and the LED chip set 31 includes an LED chip 311.

As shown in fig. 29, in the present embodiment, the lamp panel 3 is divided into an inner peripheral ring, an intermediate ring, and an outer peripheral ring in the radial direction thereof, and the LED chip groups 31 are provided correspondingly to the inner peripheral ring, the intermediate ring, and the outer peripheral ring, that is, the inner peripheral ring, the intermediate ring, and the outer peripheral ring are provided with the corresponding LED chip groups 31. In another aspect, the light panel 3 includes three LED chip sets 31, and the three LED chip sets 31 are disposed on an inner peripheral ring, a middle ring, and an outer peripheral ring of the light panel 3, respectively. The LED chip sets 31 on the inner, middle and outer peripheral rings each include at least one LED chip 311. As shown in fig. 29, 4 broken lines are defined, the range defined between the outermost two broken lines is the range of the outer peripheral ring, the range defined between the innermost two broken lines is the range of the inner peripheral ring, and the range defined between the middle two broken lines is the range of the middle ring. In other embodiments, the lamp panel 3 may be divided into two circles, and the LED chip set 31 is correspondingly disposed in the two circles.

As shown in fig. 29, several LED chips 311 disposed on the same circumference or substantially on the same circumference form an LED chip group, and several groups of LED chip groups 31 are disposed on the lamp panel 3, in the same LED chip group 31, the center distance between two adjacent LED chips 311 is L2, and the center distance between any LED chip 311 in any group of LED chip groups 31 and the closest LED chip 311 in the adjacent LED chip group 31 is L3, which conforms to the following relationship: l2: l3 is 1:0.8-2, preferably L2: l3 is 1:1-1.5. Therefore, the LED chips 311 are distributed more uniformly, so as to achieve the purpose of uniform light emission.

Fig. 40 is a schematic diagram illustrating the cooperation between the heat sink 11 and the LED chip 311 in the present embodiment. As shown in fig. 29 and 40, in the present embodiment, when at least one heat dissipation fin 11 is projected onto the plane of the LED chip set 31 along the axial direction of the LED lamp, the projection of the heat dissipation fin 11 contacts at least one LED chip 311 in the LED chip set 31. Specifically, when at least one heat dissipation fin 11 is projected onto the plane of the LED chip set 31 along the axial direction of the LED lamp, the projection of the heat dissipation fin 11 contacts at least one LED chip 311 in the LED chip set 31 with an inner circumference, an intermediate circumference or an outer circumference. As shown in fig. 40, the projection of the heat dissipation fin 11 contacts with an LED chip 311, as indicated by the arrow in the drawing, and is the heat dissipation path between the LED chip 311 and the heat dissipation fin 11, as shown in fig. 41, the projection of the heat dissipation fin 11 in the drawing does not contact with the LED chip 311 in the drawing, as indicated by the arrow in the drawing, and is the heat dissipation path between the LED chip 311 and the heat dissipation fin 11, it is obvious that the latter heat dissipation path is farther than the former, so that by making the projection of the heat dissipation fin contact with at least one LED chip 311 in the LED chip group 31 of at least the inner circumference, the middle circumference or the outer circumference, the heat conduction path of the LED chip 311 is shortened, thereby reducing the thermal resistance and facilitating the heat conduction. Preferably, when the heat dissipation fins 11 are projected onto the plane of the LED chip set 31 along the axial direction of the LED lamp, the projection of any one heat dissipation fin 11 (the first heat dissipation fin 111 or the second heat dissipation fin 112) contacts at least one LED chip 311 in the LED chip set 31.

In the present embodiment, the number of the heat dissipation fins 11 corresponding to the LED chip group 31 of the outer circumference is larger than the number of the heat dissipation fins 11 corresponding to the LED chip group 31 of the inner circumference. The correspondence referred to herein refers to the LED lamp axial direction projection relationship, for example, when the LED chip set 31 of the outer circumference is projected onto the heat radiation fins 11 in the axial direction of the LED lamp, the LED chip set 31 of the outer circumference corresponds to the heat radiation fins 11 of the heat radiator 1 on the opposite outer side. The LED chip group 31 of the outer periphery here has a larger number of LED chips 311, and therefore requires a larger number of heat dissipation fins 11 (area) for heat dissipation.

As shown in fig. 1 and 29, the lamp panel 3 has an inner boundary 3002 and an outer boundary 3003, and after the inner boundary 3002 and the outer boundary 3003 extend upward along the axial direction of the LED lamp, a region is formed, and the area of the heat dissipation fins 11 located in the region is larger than the area located outside the region. In this way, most of the heat dissipation fins 11 of the heat sink 1 correspond to the lamp panel 3 (the heat conduction path is short), so that the utilization rate of the heat dissipation fins 11 can be improved, and the effective heat conduction area of the heat dissipation fins 11 to the LED chip 311 can be increased.

As shown in fig. 3, 5 and 29, the light reflection area 3001 is disposed between the inner periphery and the outer periphery of the lamp panel 3, and the light reflection area 3001 can reflect upward light to the light output surface 43, so as to reduce the loss of light in the direction opposite to the light emitting direction in the axial direction of the LED lamp and increase the overall light emitting intensity.

As shown in fig. 4 and 9, the lamp panel 3 is provided with a third opening 32, and the third opening 32 is respectively communicated with the first heat dissipation channel 7a and the second heat dissipation channel 7b, that is, the third opening 32 is simultaneously communicated with the space between the heat dissipation fins 11 of the heat sink 1 and the cavity of the lamp housing 2, so that the space between the heat dissipation fins 11 and the cavity of the lamp housing 2 form an air convection path with the outside of the LED lamp. The third opening 32 is located further inside the inner peripheral ring in the radial direction of the LED lamp. Therefore, the space of the light reflection area 3001 is not occupied, and reflection efficiency is affected. Specifically, the third opening 32 is disposed in a central region of the light panel 3, and the first air intake holes 2201 and the second air intake holes 1301 respectively intake air from the same opening (the third opening 32), that is, after the convection air passes through the third opening 32, the convection air enters the first air intake holes 2201 and the second air intake holes 1301. The third opening 32 is formed in the central area of the light panel 3, so that the first air inlet 2201 and the second air inlet 1301 can share an inlet for air, and thus, the excessive area of the light panel 3 can be prevented from being occupied, and the area of the light panel 3 where the LED chip 311 is arranged is prevented from being reduced due to the plurality of holes. On the other hand, the inner case 21 corresponds to the third opening 32, so that the air of convection plays a role of heat insulation, i.e., preventing the temperature inside and outside the inner case 21 from affecting each other at the time of air intake. In other embodiments, if the first air intake hole 2201 and the second air intake hole 1301 are located at different positions, a plurality of third openings 32 may be disposed corresponding to the first air intake hole 2201 and the second air intake hole 1301, specifically, as shown in fig. 42, the third openings 32 may be disposed in a region between the middle, the outer side, or the LED chip 311 of the light panel 3, so as to correspond to the first air intake hole 2201 and the second air intake hole 1301.

As shown in fig. 29, in one embodiment, in the inner ring, two adjacent LED chips 311 form a central angle a with the axis of the LED lamp, and in the middle ring, two adjacent LED chips 311 form a central angle B with the axis of the LED lamp, and the angle of the central angle B is smaller than the angle of the central angle a. In the outer ring, two adjacent LED chips 311 and the axle center of the LED lamp form a central angle C, and the angle of the central angle C is smaller than that of the central angle B. For example, the outer ring has more LED chips 311 than the middle ring, so the spacing between adjacent LED chips 311 in the outer ring is not much larger than the spacing between adjacent LED chips 311 in the middle ring, and even the spacing between the adjacent LED chips 311 can be close to or equal to each other, so the arrangement of the LED chips 311 can be more uniform, and the light emission can be more uniform. In other words, the LED chip sets 31 are provided with a plurality of groups, and each group is disposed on the lamp panel 3 in a ring shape, and an angle of a center angle formed by two adjacent LED chips 311 of the LED chip set 31 on the inner side and the axis of the LED lamp is larger than an angle of a center angle formed by two adjacent LED chips 311 of the LED chip set 31 on the outer side and the axis of the LED lamp. That is, the more outer LED chip sets 311 have more LED chips 311 than the more inner LED chip sets 311, so that the spacing between the adjacent two LED chips 311 of the more outer LED chip sets 31 is closer to the spacing between the adjacent two LED chips 311 of the opposite more inner LED chip sets 31, and thus, the arrangement of the LED chips 311 is more uniform, and the light emission is more uniform.

As shown in fig. 40, the upper surface of the lamp panel 3 is provided with an insulating coating 34, and the insulating coating 34 is configured to have high reflectivity, and materials with high reflectivity in the prior art, such as heat-conductive silicone grease, can be used. When the insulating coating 34 is provided, the insulating coating 34 is applied to the edge of the lamp panel 3, and the distance from the outermost LED chip 311 on the lamp panel 3 to the edge of the lamp panel 3 in the radial direction is greater than 4mm, preferably, the distance from the outermost LED chip 311 on the lamp panel 3 to the edge of the lamp panel 3 is greater than 6.5mm and less than 35mm. Therefore, the creepage distance between the outermost LED chip 311 and the radiator 1 can be ensured, and the influence on personal safety caused by the ignition between the outermost LED chip 311 and the radiator 1 is prevented. In addition, the insulating coating 34 plays a certain role of heat insulation, and deformation of the lamp housing 4 in contact with it due to excessive temperature is avoided.

Fig. 43 is a schematic view of the lamp panel 3 in the present embodiment. As shown in fig. 43, in this embodiment, at least two groups of LED chip sets 31 are disposed, at least two groups of LED chip sets 31 are sequentially arranged in the radial direction of the lamp panel 3, each group of LED chip sets 31 includes at least one LED chip 311, any one LED chip 311 of one group of LED chip sets 31 in the radial direction of the lamp panel 3 and any one LED chip 311 of another group of LED chip sets 31 adjacent in the radial direction of the lamp panel are staggered in the radial direction of the lamp panel 3, that is, between the LED chips 311 of different LED chip sets 31, in different directions in the radial direction of the LED lamp, that is, any line starting from the axis of the LED lamp and extending in the radial direction of the LED lamp, such as cutting to two or more LED chips 311, will cut to different positions of the two or more LED chips 311, that is, will not cut to the same position of the two or more LED chips 311. In this way, when the surface of the lamp panel 3 has convection and the air is convected in the radial direction of the lamp panel 3, the air is in contact with the LED chip 311 more fully in the air flow path due to the relationship of the air flow path, so that the heat dissipation effect is better. In addition, the arrangement of the LED chips 311 is more beneficial to uniformity of light emission from the aspect of light emitting effect.

In this embodiment, an open area 312 is provided between two adjacent LED chips 311 in the same LED chip set 31 to allow air to flow between the LED chips 311, thereby removing heat generated during operation of the LED chips 311. And two sets of LED chip sets 31 radially adjacent to the lamp panel 3, wherein an open area 312 between any two adjacent LED chips 311 in one set of LED chip sets 31 and an open area 312 between any two adjacent LED chips 311 in the other set of LED chip sets 31 are staggered in the radial direction of the lamp panel 3 and are mutually communicated. In this way, it is assumed that air is convected in the radial direction of the lamp panel 3, and the air is more fully contacted with the LED chip 311 in the air flow path due to the relationship of the air flow path, so that the heat dissipation effect is better. If two sets of LED chips 31 radially adjacent to each other on the lamp panel 3, wherein an open area 312 between any two adjacent LED chips 311 in one set of LED chips 31 and an open area 312 between any two adjacent LED chips 311 in the other set of LED chips 31 are in the same direction in the radial direction of the lamp panel 3, air directly flows along the radial direction of the lamp panel, and on the flow path, the contact between the air and the LED chips 311 is reduced, which is unfavorable for heat dissipation of the LED chips 311.

For example, the LED chip sets 31 are provided with three groups, and are sequentially arranged along the radial direction of the lamp panel 3, and any open areas 312 in the respective three groups of LED chip sets are not in the same direction in the radial direction of the lamp panel 3. Therefore, the convection flow path of the surface of the lamp panel 3 is optimized, and the heat dissipation efficiency is improved.

In some applications, the LED emits light with a light distribution area below the LED lamp that represents the light intensity distribution of the light source in each space. In designing a light source of an LED lamp, it is desirable to concentrate a light distribution area in a certain area to increase local brightness.

Fig. 44 a-44 f are schematic views of the light panel 3 in some embodiments. As shown in fig. 44a and 44b, the lamp panel 3 includes a first region 35 configured for disposing the LED chip set 31, a second region 36 located further inside the first region 35 in the radial direction of the lamp panel 3, and a third region 37 located further outside the first region 35 in the radial direction of the lamp panel 3, the first region 31 defining a mounting region of the LED chip 31. An insulating coating 34 having reflectivity may be disposed on the first, second and

third regions

35, 36, 37 of the lamp panel 3.

As shown in fig. 44a and 44b, when the third region 37 is far from the first region 35 in the radial direction of the lamp panel 3, the distance between the third region 37 and the first region 35 gradually increases in the axial direction, so that an external reflection region 371 located outside the LED chip set 31 is formed on the surface of the third region 37, so that at least part of the light generated during the operation of the LED chip set 31 is guided to the light output surface 43, and thus, the light can be concentrated to a certain region.

As shown in fig. 44b, when the second region 36 is away from the first region 35 in the radial direction of the lamp panel 3, the distance between the second region 36 and the first region 35 gradually increases in the axial direction, so that an internal reflection region 361 located inside the LED chip set 31 is formed on the surface of the second region 36, so that at least part of the light generated during the operation of the LED chip set 31 is guided to the light output surface 43, and thus the light can be concentrated to a certain region.

The inner reflective area 361 and the outer reflective area 371 on the lamp panel 3 and the inner reflective surface 4301 and the outer reflective surface 4302 on the lamp cover 4 in the above embodiment can be arbitrarily matched to realize various optical effects. For example, only the outer

reflective surface

371 or 4302, only the inner

reflective surface

361 or 4301, or one of the outer

reflective surfaces

371 or 4302 and one of the inner

reflective surfaces

361 or 4301 may be provided.

As shown in fig. 44a and 44b, the inner reflective region 361 or the outer reflective region 371 is a flat surface and is angled with respect to the first region 35, or is an arc surface.

In some embodiments, the specific light emitting direction of the LED chip 311 can be further adjusted by adjusting the setting direction thereof. Specifically, the structure of the lamp panel 3 may be adjusted to have different light emitting effects of the LED chip 311. For example, as shown in fig. 44c, in some embodiments, the lamp panel 3 includes a first region 35 configured for disposing the LED chip set 31, a second region 36 located further inward of the first region 35 in the radial direction of the lamp panel 3, and a third region 37 located further outward of the first region 35 in the radial direction of the lamp panel 3. The lamp panel 3 has a plurality of LED chip sets 31 thereon, and the plurality of LED chip sets 31 are arranged in the radial direction of the lamp panel 3. In this embodiment, at least one group of LED chip sets 31 is disposed on the third area 37, and the third area 37 forms an included angle with respect to the first area 36, and after at least one group of LED chip sets 31 is disposed in the third area 37, the light emitting angle is changed, so as to display different light emitting effects, thereby changing the light intensity distribution.

Similarly, at least one group of the LED chip sets 31 is disposed on the second region 36, and the second region 36 forms an included angle with respect to the first region 36, and after the at least one group of LED chip sets 31 are disposed in the second region 36, the light emitting angle is changed, so as to exhibit different light emitting effects, thereby changing the light intensity distribution.

Taking the lamp panel 3 shown in fig. 44c as an example, the LED chip sets 31 are provided with three groups, the outermost LED chip set 31 in the radial direction of the lamp panel 3 is provided on the third region 37, the LED chip set 31 in the middle position of the three groups of LED chip sets 31 in the radial direction of the lamp panel 3 is provided on the first region 35, and the innermost LED chip set 31 in the radial direction of the lamp panel 3 is provided on the second region 36.

In the above embodiment, the second region 36 and the third region 37 may be specific regions for disposing the LED chips 311, and each LED chip 311 corresponds to one of the second region 36 or the third region 37. The second region 36 and the third region 37 may be an entire region, and the LED chips 311 of the same group of LED chip sets 31 are all disposed in the second region 36 or the third region 37.

As shown in fig. 44d, in some embodiments, in order to improve the light efficiency of the LED chips 311, a silica gel layer 313 may be disposed on the surface of the LED chips 311, each LED chip 311 is provided with an independent silica gel layer 313, and the surface of the silica gel layer 313 away from the LED chips 311 is disposed as an arc surface protruding outwards, so that the silica gel layer 313 acts like a lens, and focuses the light emitted from the LED chips 311, so that the light emitting effect is better and the illumination is improved. In addition, the arrangement of the silica gel layer 313 can improve the heat radiation efficiency (increase the radiation area) of the LED chip 311, so as to facilitate the heat dissipation of the LED chip 311.

As shown in fig. 44e, in some embodiments, the light source includes a lamp panel 3, an LED chip 311, and a silica gel layer 313, and the silica gel layer 313 includes a first silica gel layer 3131 disposed on a surface of the lamp panel 3 and a second silica gel layer 3132 disposed on a surface of the LED chip 311. The first silica gel layer 3131 is disposed to prevent the lamp panel 3 from being exposed and isolate the lamp panel 3 from the outside, thereby realizing insulation treatment of the lamp panel 3. The second silica gel layer 3132 has an arc surface of evagination to make second silica gel layer 3132 play the effect of similar lens, play the effect of spotlight to LED chip 311, make the light-emitting effect better, do benefit to the promotion of illuminance. When the silica gel layer 313 is arranged, the first silica gel layer 3131 and the second silica gel layer 3132 are formed into an integral structure, so that dust can be prevented from entering, at the moment, the arrangement of the lampshade 4 can be omitted, and meanwhile, the improvement of the light effect (the lampshade 4 is arranged to inevitably reflect a part of light to cause light loss) is facilitated. In the case of LED package, including a chip, a phosphor, and a silica gel, the chip, the phosphor, and the silica gel layer are disposed from inside to outside, as shown in fig. 44f, in some embodiments, the silica gel layer 313 is directly disposed outside the phosphor 314, that is, the phosphor 314 is disposed outside the chip 3111, and the silica gel layer 313 is directly disposed outside the phosphor 314. In addition, the arrangement of the silica gel layer 313 can improve the heat radiation efficiency (increase the radiation area) of the LED chip 311.

Fig. 45 a-45 g are schematic views of the lamp panel 3 according to some embodiments, showing different arrangements of the LED chips 311. In fig. 45a, the LED chips 311 of a single LED chip set 31 are arranged directly on the substrate 33 at equal intervals, i.e. the distance between any two adjacent LED chips 311 is the same, so that the entire LED lamp panel 3 emits light uniformly. In fig. 45b and 45c, the LED chips 311 of the single LED chip set 31 are arranged in an array, and the array may be a rectangular array as shown in fig. 45b, a triangular array as shown in fig. 45c, or even a circular array arranged concentrically as described above. The array arrangement can concentrate the LED chips 311 on a local area on the substrate 33 to form a concentrated illumination effect, and can achieve uniform light emission in the local area.

In fig. 45d, the LED chips 311 of the LED chip sets 31 are each formed into an array, that is, the LED chips 311 are arranged into a plurality of arrays, and one LED chip set 31 is shown in the triangle dashed line frame. The spacing distance between the arrays is kept larger than the spacing distance between the adjacent LED chips 311 in the arrays, so that air flow channels are formed between the arrays to promote air convection along the surface of the lamp panel 3.

As shown in fig. 45e, in some embodiments, the LED chip 311 of the LED chip set 31 is rectangular with long sides and short sides. As shown in fig. 45e, the LED chips 311 may be arranged along a circumference, and the long sides are arranged along the radial direction of the LED lamp panel 3, so that the LED chips 311 are arranged radially, and thus, more LED chips 311 may be arranged on the circumference, and the LED chips 311 may be concentrated in a small area; at the same time, the long side provides longer diversion path strength in the radial direction, and heat exchange between the air flow and the LED chip 311 is increased. The LED chips 311 may also be arranged along a circumference, and short edges are arranged along the radial direction of the LED lamp panel 3, so that the LED chips 311 can be spread over a large area, and the pitch between the LED chips 311 is shortened, so that the LED chip set 31 resembles a light emitting ring. The two configurations may be alternatively or simultaneously implemented.

Fig. 45f and 45g show partial schematic views of different styles of light panels 3 in some embodiments. As shown in fig. 45f and 45g, in some embodiments, one or more reflective cups 334 are disposed on the substrate 33 of the LED lamp panel 3, and the openings of the reflective cups 334 face away from the substrate 33. An LED chip 311 is disposed on the inside bottom of each reflector cup 334. The inner wall of the reflective cup 334 is made of a material with high reflectance, and the specific embodiments include coating, electroplating, or directly manufacturing the reflective cup 334 with a material with high reflectance and polishing the inner wall of the reflective cup 334. The inner wall of the reflective cup 334 may reflect the laterally divergent light emitted from the LED chip 311, so that the light emitted from the LED chip 311 is concentrated in the direction in which the LED chip 311 is directed. As shown in fig. 25, which is a variation of fig. 24, a plurality of LED chips 311 are disposed on the inner bottom of each reflector cup 334. That is, at least one LED chip 311 is disposed on the inner bottom of each reflector cup 334.

Fig. 46a to 46c are perspective views of the power supply 5 in the present embodiment in various directions, and fig. 46d is a front view of the power supply 5 in the present embodiment. The power supply 5 is electrically connected to the LED chip 311 and is used to supply power to the LED chip 311. As shown in fig. 46a to 46c, the power supply 5 includes a power supply board 51 and electronic components provided on the power supply board 51.

As shown in fig. 46c, the transformer 54 in the electronic component includes a magnetic core 541 and a coil 542, the magnetic core 541 has a cavity, the coil is disposed in the cavity, and the upper side of the cavity in the axial direction of the LED lamp is open, so that when the LED lamp works, the heat generated by the coil can be upward, and the heat dissipation direction of the heat generated by the coil is consistent with the direction of the convection path of the first heat dissipation channel 7a, so as to facilitate heat dissipation.

As shown in fig. 46b and 46c, the cavities are disposed at two sides of the LED lamp in the axial direction, so that the heat dissipation effect on the coil can be further increased. In addition, after the coil is arranged in the cavity, the coil can keep a gap with the inner wall of the cavity, so that air can flow through the gap, and the heat dissipation effect of the coil can be further improved.

As shown in fig. 46b, the transformer 54 has a first surface 5401 and a second surface 5402, and the first surface 5401 and the second surface 5402 are perpendicular to the power supply board, wherein the first surface 5401 is perpendicular to the axial direction of the lamp, and the area of the first surface 5401 is smaller than that of the second surface 5402, so that the obstruction to the convection of the first heat dissipation path 7a can be reduced by providing the surface with a small area.

As shown in fig. 46c, the electronic component includes at least one inductor 55, where the at least one inductor includes a ring-shaped magnetic core 551, and the coil is wound on the ring-shaped magnetic core 551 (not shown), and the axial direction of the ring-shaped magnetic core 551 is parallel to the axial direction of the LED lamp, so that the coil can contact with the air of convection in a larger area, thereby increasing heat dissipation to the inductor. In addition, since the annular magnetic core 551 is annular and corresponds to the convection path of the first heat dissipation path 7a, the air that is convected can pass through the inside of the annular magnetic core 551, and heat dissipation to the inductor 55 can be further increased.

As shown in fig. 46a and 46b, the heat generating components in the electronic component include an Integrated Circuit (IC) 56, a diode, a transistor, a transformer 54, an inductor 55 and a resistor, which are disposed on different surfaces of the power board 51, respectively, so that the heat sources can be separately disposed to avoid formation of local high temperature. In addition, heat dissipation components may be disposed on different surfaces of the power board 51, so as to dissipate heat for the heat generation components, where the corresponding heat generation components thermally contact the heat dissipation components.

As shown in fig. 46a and 46b, at least one integrated circuit 56 and other heat generating components are disposed on different surfaces of the power board 51. Thus, on the one hand, the heat source can be arranged separately, so that the formation of local high temperature is avoided, and on the other hand, the influence of other heating components on the integrated circuit 56 can be avoided.

As shown in fig. 46a and 46b, the above-described integrated circuit 56 does not overlap any heat generating component in the direction perpendicular to the power supply board 51 (i.e., the projected relationship in the direction perpendicular to the power supply board 51), thereby avoiding heat superposition. Preferably, the integrated circuit 56 does not overlap the transformer 54.

As shown in fig. 22, the power panel 51 is parallel to the axial direction of the LED lamp, and therefore, in the axial direction of the LED lamp, the power panel 51 is divided into an upper half and a lower half, and the arrangement spaces of the electronic components of the upper half and the lower half are uniform or substantially uniform, which is advantageous for better arrangement of the electronic components, and in addition, if the power panel 51 is inclined relative to the axial direction of the LED lamp, the circulation of air is hindered to some extent, which is disadvantageous for heat dissipation of the power supply 5.

As shown in fig. 22, the power board 51 divides the lamp housing 2 into a first portion 201 and a second portion 202, and the area of the corresponding heat dissipation hole 222 on the first portion 201 is larger than that of the corresponding heat dissipation hole 222 on the second portion 202, so that most or all of the electronic components can be disposed in the first portion 201 or components with larger heat generation, such as an inductor, a resistor, a transformer, a rectifier bridge, or a transistor, can be disposed in the first portion 201 when the electronic components are disposed.

As shown in fig. 25, the power board 51 divides the inner cavity of the lamp housing 2 into a first portion 201 and a second portion 202, the volume of the first portion 201 is larger than that of the second portion 202, and most or all of the electronic components are disposed in the first portion 201 when the electronic components are disposed, or larger components such as a capacitor, an inductor, a resistor, a transformer, a rectifier bridge, or a transistor are disposed in the first portion 201.

Further, the area of the corresponding first air inlet hole 2201 on the first portion 201 is larger than the area of the corresponding first air inlet hole 2201 on the second portion 202, so that more air enters the first portion 201 to dissipate heat of the electronic component. The relationship with the first air intake hole 2201 herein refers to that the first air intake hole 2201 is substantially divided into two parts by the power board 51, that is, one part corresponds to the first part 201 and the other part corresponds to the second part 202, so that more air enters the first part 201 through the first air intake hole 2201.

As shown in fig. 22, the electronic component includes heat generating components 501, where at least one heat generating component 501 is close to the lamp cap 23 and radiates heat through the lamp cap 23 without occupying the heat radiation resources of the first heat radiation channel 7 a. The at least one heat generating component 501 adjacent to the lamp cap 23 is an inductor, a resistor, a rectifier bridge or a control circuit.

As shown in fig. 22, at least one heat generating component 501 is in the form of heat conduction or heat radiation to the lamp cap 23 and dissipates heat into the air through the lamp cap 23.

As shown in fig. 22, at least one heat generating component 501 is in thermal contact with the lamp cap 23, specifically, at least one heat generating component 501 is located in the lamp cap 23, and the heat generating component 501 is in contact with the lamp cap via a heat conducting material 53, and the heat generating component 501 is fixed to the lamp cap 23 via the heat conducting material 53. Accordingly, by the arrangement of the heat conducting material 53, the effect of heat conduction to the lamp cap can be achieved, the effect of fixing the heating component can be achieved, and the heating component 501 is prevented from loosening. The heat generating component 501 is located in the lamp cap 23, and specifically, the lamp cap 23 and the heat generating component 501 have an overlapping area in a projection perpendicular to the axial direction of the LED lamp.

As shown in fig. 22, the heat conducting material 53 is disposed in the lamp cap 23 by means of glue filling, so as to realize connection between the lamp cap 23 and the heating component 501, the heat conducting material 53 only covers the end area of the power supply 5, and the heat conducting material 53 is located higher than the heat dissipating holes 22, so as to prevent excessive weight increase due to the heat conducting material 53. In addition, the heat conductive material 53 is an insulating material to ensure safety and prevent the electronic components from contacting the metal portion 231 of the base 23. In other embodiments, the heat conductive material 53 may be a conductive wire (not shown) connecting the power supply 5 and the conductive pin of the lamp cap 23.

As shown in fig. 22, the base 23 includes a metal portion 231, and the thermally conductive material 53 thermally contacts the metal portion 231. That is, at least a portion of the inner wall of the metal portion 231 forms a wall of the inner cavity of the lamp housing 2, so that the heat conductive material can be directly connected to the metal portion 231 and the heat dissipation can be performed by the metal portion 231. Part of the metal part 231 radiates heat by air, and part of the metal part 231 radiates heat by a lamp socket connected to the metal part 231.

As shown in fig. 2 and 46a, in the present embodiment, among the electronic components in the power supply 5, the electronic component closest to the first air inlet 2201 of the first heat dissipation channel 7a is a heat labile component, such as a capacitor, and in particular, the electrolytic capacitor 502, and the heat labile component is placed close to the first air inlet 2201, so as to avoid the heat labile component from having too high temperature, which affects the performance thereof.

In addition, in order to reduce the influence of the heat generating component on the electrolytic capacitor 502, a radiation reflecting layer or a heat insulating layer (not shown) may be disposed on the surface of the electrolytic capacitor 502, so as to avoid the influence of the heat radiation of the heat generating component on the electrolytic capacitor 502. The heat insulating layer can be made of plastic materials in the prior art, and the anti-radiation layer can be made of paint, silver coating, aluminum foil or other anti-heat radiation materials in the prior art.

As shown in fig. 46a, in the present embodiment, at least a portion of at least one electrolytic capacitor is not within the range defined by the power supply board 51, that is, at least a portion of the electrolytic capacitor exceeds the power supply board 51 in the axial direction of the LED lamp, and when the same number of electronic components are carried, the length of the power supply board 51 can be reduced, and the material cost of the power supply board 51 can be reduced. In addition, the electrolytic capacitor can be further located near the first air inlet hole 2201, so that the electrolytic capacitor is ensured to be in a relatively low temperature region.

As shown in fig. 22, at least one heat generating component 501 is located higher than the heat dissipating holes 222 in the axial direction of the LED lamp, and most of the heat generating component 501 higher than the heat dissipating holes 222 is dissipated through the base 2 or other means. Therefore, most of the heat generated by it is not dissipated through the heat dissipating holes 222, and the convection speed of the first heat dissipating channels 7a is not affected. The heat generating component 501 is a resistor, inductor, integrated circuit, voltage regulator, or rectifier bridge.

As shown in fig. 22, the power panel 51 has an upper portion and a lower portion in the axial direction of the LED lamp, each of the upper portion and the lower portion being provided with a heat generating component, wherein at least one of the upper portion heat generating components is located above the heat dissipating holes 222, so that a problem that the upper portion is located near the heat dissipating holes 222 can be reduced, so that a temperature difference near the heat dissipating holes 222 of the lower portion and the upper portion increases, thereby accelerating convection.

As shown in fig. 2, 3 and 46a, when the power panel 51 is assembled to the lamp housing 2, it has a portion located in the lamp neck 22 and a portion located in the inner sleeve 21, the portion of the power panel 51 located in the lamp neck 22 is a first portion, the portion of the power panel 51 located in the inner sleeve is a second portion, and the second portion is closer to the first air intake hole 2201 of the first heat dissipation channel 7a than the first portion, and because the second portion is closer to the first air intake hole 2201, the convective air reaches the second portion first, that is, the second portion has a better heat dissipation effect than the first portion, so that at least a part of the heat-labile component (such as an electrolytic capacitor, or a component sensitive to high temperature) is disposed on the second portion. Preferably, all electrolytic capacitors are provided on the second part. The power board 51 of the second portion has a larger area than the first portion, so that the second portion of the power board 51 has more space for disposing electronic components, which is advantageous for disposing more thermolabile components/heat-sensitive components on the second portion. In this embodiment, the thermolabile component/heat sensitive component may be disposed on the front and back sides of the second portion, respectively. In other embodiments, the electronic component with more heat generation may be disposed on the second portion (such as a transformer, an inductor, a resistor, an integrated circuit, or a transistor) so as to dissipate heat more quickly.

Fig. 51 is a schematic diagram of the power supply 5 in some embodiments. As shown in fig. 51, the power panel 51 has a heat insulation board 513, and the power panel 51 is separated into two partial areas by the heat insulation board 513, wherein one partial area is provided with a heat generating component (such as a component generating heat when a transformer, a resistor, an inductor, etc. are in operation), and the other partial area is provided with a heat labile component/heat sensitive component (such as an electrolytic capacitor), that is, the heat insulation board separates the heat generating component and the heat labile component/heat sensitive component, so as to avoid influencing the heat labile component/heat sensitive component due to excessive heat radiation generated by the heat generating component. In other embodiments, the heat insulation board 513 is disposed on the power board 51, and the power board 51 is divided into two areas by the heat insulation board 513, wherein one part is provided with a heating component (such as a component that heats when the transformer, the resistor, the inductor, etc. work), and the other part is also provided with a heating component (such as a component that heats when the transformer, the resistor, the inductor, etc. work), that is, the heat insulation board separates the heating component and the heating component, so as to avoid mutual heat radiation, and the heat is superimposed, and on the other hand, the temperature is an important influencing factor of heat radiation, so that mutual radiation between the heating component and the heating component is avoided, and the temperature difference between the heating component and the nearby air can be improved, so that the heat radiation efficiency can be improved. Preferably, the heat insulation plate 513 is disposed along the axial direction of the LED lamp or along the convection direction of the first heat dissipation path 7a so that heat at both sides is not concentrated by convection in the width direction of the power panel 51 when convection. The heat insulating plate 513 is extended in the convection direction of the first heat dissipating channel 7a, that is, the heat insulating plate 513 is extended in the axial direction of the LED lamp, and thus, does not block the air of convection. In other embodiments, the insulating panel 513 may be angled to provide a certain air-guiding effect.

Further, the heat insulating board 513 may be a circuit board, and thus, electronic components may be disposed on the heat insulating board 513 to increase an area where the electronic components may be disposed.

The function of the heat shield 513 may also be replaced with an electronic component. As shown in fig. 46d, the power board 51 has three electronic components 503, 504,505, and projections of the three electronic components 503, 504,505 in a radial direction of the LED lamp (or a width direction of the power board 51) at least partially overlap, wherein one electronic component 504 is separated between the other two electronic components 503,505, i.e. one electronic component 504 is located between the other two electronic components 503,505, so as to avoid heat radiation of the other two electronic components 503,505, thereby facilitating a larger temperature difference between the heat generating component and the nearby air, and facilitating heat radiation of the heat generating component into the air. The other two

electronic components

503 and 505 are a heat generating component (such as a transformer, a resistor, an inductor, or a transistor) and a heat labile component/heat sensitive component (such as an electrolytic capacitor), respectively, so that when the heat generating component generates heat, at least a portion of the heat is radiated to the middle electronic component 504, thereby reducing the radiation effect of the heat generated by the heat generating component on the heat labile component/heat sensitive component.

In other embodiments, the power board 51 has three electronic components 503, 504,505, and the three electronic components 503, 504,505 are located in the radial direction of the LED lamp (504 is located between the other two electronic components 503,505 to avoid the heat radiation of the other two electronic components 503,505 from each other, so as to facilitate the formation of a larger temperature difference between the heat generating components and the nearby air, so as to facilitate the heat radiation of the heat generating components into the air.

Preferably, the electronic component 504 located in the middle is selected from electronic components that do not generate heat or are heat-resistant, such as temperature sensors, capacitors, etc.

As shown in fig. 46d, the power board 51 has three electronic components 506, 507,508, and the projections of the three electronic components 506, 507,508 in the axial direction of the LED lamp (or in the length direction of the power board 51, i.e. along the convection direction of the first heat dissipation channel 7 a) at least partially overlap, where one electronic component 507 is separated between the other two electronic components 506,508, i.e. where one electronic component 507 is located between the other two electronic components 506,508, so as to avoid the heat radiation of the other two electronic components 506,508, so that a larger temperature difference is formed between the heat generating component and the nearby air, and the heat radiation of the heat generating component is facilitated. The other two

electronic components

506 and 508 are heat generating components (such as transformers, resistors, inductors or transistors), so that when the two

heat generating components

506 and 508 generate heat, at least a portion of the heat is radiated to the middle electronic component 504, thereby reducing the heat radiation between the two heat generating components, avoiding heat superposition, and facilitating the formation of a larger temperature difference between the heat generating components and the nearby air, so as to facilitate the heat radiation of the heat generating components into the air. In this embodiment, due to the arrangement of the electronic components 507, when the convection air is upward, the convection air is blocked within a certain range, that is, after the heat of the electronic components 503 located below dissipates with the convection air, the electronic components 507 need to be bypassed, so as to avoid the direct contact of the convection air with the electronic components 508 above. In this embodiment, the middle electronic component 507 is a non-heat generating component (such as a capacitor). In other embodiments, one of the other two electronic components 506,508 is a heat generating component (e.g., resistor, inductor, transformer, etc.), and the other is a heat labile component (e.g., capacitor, etc.).

Fig. 52 is a schematic diagram of the power supply 5 in some embodiments. As shown in fig. 52, in some embodiments, in order to increase the radiation efficiency of the heat generating component of the power supply 5, a radiation layer 509 may be disposed on the surface of the heat generating component, and the heat generated during operation of the heat generating component may be conducted to the radiation layer 509 in a heat conduction manner, so that the radiation layer 509 radiates the heat to the surrounding air, so that the heat is taken away when the first heat dissipation channel 7a is convected. The radiation efficiency of the radiation layer 509 is greater than that of the heat-generating component, and thus, the heat-dissipating efficiency of the heat-generating component after the radiation layer 509 is provided is greatly improved. The radiation material 509 in this embodiment may be black glue in the prior art to increase the effect of heat radiation to air. When the black glue is disposed, the black glue can be covered on the surface of the power supply 5, and the black glue can be directly in thermal contact with the lamp cap 23, that is, a part of heat of a heating component of the power supply 5 is radiated to ambient air, and the other part of heat is directly conducted to the lamp cap 23 (not shown) through the black glue, and the lamp cap 23 is a metal lamp cap and can be dissipated to the outside through the lamp cap 23. In this embodiment, the black glue is of a thin layered structure, is disposed on the surface of the heat generating component, and does not obstruct convection to the first heat dissipation channel 7a, and has limited added weight, and has less influence on the overall weight of the LED lamp. In other embodiments, the black glue may be selectively disposed, for example, on a heating component with higher heat generation, for example, on a transformer, an inductor, and a transistor.

In addition, in the above embodiment, to further enhance the radiation efficiency of the radiation material 509, the surface of the radiation material 509 may be provided as a roughened surface to increase the surface area of the radiation material 509.

Fig. 47 is a schematic diagram of a power supply 5 in some embodiments, applicable to the LED lamp of fig. 4 to replace the power supply 5 of the LED lamp of fig. 4. As shown in fig. 47, in some embodiments, the power panel 51 is divided into a first setting area 511 and a second setting area 512 by an axis X, the first setting area 511 and the second setting area 512 are bounded by the axis X, and a sum of weights of electronic components on the second setting area 512 is greater than a sum of weights of electronic components on the first setting area 511. The first setting region 511 sets up the balancing weight 52 to balance the weight of power strip 51 both sides, prevent that power strip 51 both sides from causing the influence because of the uneven weight of electronic component, and prevent that the LED lamp from taking place the slope because of the uneven weight of power strip 51 both sides under the LED lamp hangs the state.

Fig. 48 is a front view of the weight of fig. 47. Fig. 49 is a bottom view of fig. 48. As shown in fig. 48 and 49, in some embodiments, the balancing weight 52 is a heat dissipation component with a heat dissipation function, and is disposed on the power board 51. In some embodiments, the heat dissipating component has a heat sink 521 thereon to increase the heat dissipating area. The weight 52 is made of a metal material with high thermal conductivity, such as aluminum, copper, etc. In the present embodiment, the heat dissipation fins 521 are disposed along the axial direction of the LED lamp, and channels are formed between the heat dissipation fins 521 for air passage, and in this way, the heat dissipation area of the balancing weight 52 can be increased. In addition, the balancing weight 52 includes a long side and a short side, and the channel and the long side are parallel to each other, and the long side is disposed parallel to the axial direction of the LED lamp or substantially parallel to the flowing direction of the air flow, so that the air flow is smoother.

As shown in fig. 47, the electronic component includes a heat generating component with a higher temperature that generates heat during operation, and at least one heat generating component is close to the heat dissipating component to dissipate a portion of heat through the heat dissipating component. Preferably, the transformer, inductor, resistor, diode, transistor, or Integrated Circuit (IC) in the heat generating component is proximate to the heat dissipating component. More preferably, the transformer, inductor, resistor, diode, transistor, or Integrated Circuit (IC) in the heat generating component is in direct thermal contact with the heat dissipating component.

As shown in fig. 47, 48 and 49, in some embodiments, the electronic components include heat generating components that generate heat at a relatively high temperature during operation, and at least one of the heat generating components is located close to the heat dissipating component 52 to dissipate a portion of the heat through the heat dissipating component 52. Preferably, the transformer, inductor, resistor, diode, transistor, or Integrated Circuit (IC) in the heat generating component is proximate to the heat dissipating component. More preferably, the transformer, inductor, resistor, diode, transistor, or Integrated Circuit (IC) in the heat generating component is in direct thermal contact with the heat dissipating component. Preferably, the heat dissipation component 52 has heat dissipation fins 521 thereon to increase the heat dissipation area thereof. The heat dissipation member 52 is made of a metal material having high thermal conductivity, such as aluminum, copper, etc. In the present embodiment, the heat dissipation fins 521 are disposed along the axial direction of the LED lamp, and channels are formed between the heat dissipation fins 521 for air passage, and in this way, the heat dissipation area of the balancing weight 52 can be increased. In addition, the heat dissipation component 52 includes a long side and a short side, and the channels and the long sides are parallel to each other, and the long sides are disposed parallel to the axial direction of the LED lamp or substantially parallel to the airflow direction, so that the airflow can flow more smoothly. In some embodiments, the heat dissipation components 52 may be disposed on both sides of the power panel 51, so that heat dissipation may be performed on both sides of the power panel 51, and the weight of both sides of the power panel 51 may be balanced.

As shown in fig. 47, in some embodiments, the power panel 51 is divided into a first setting area 511 and a second setting area 512 by an axis X, the first setting area 511 and the second setting area 512 are defined by the axis X, and the number of electronic components on the second setting area 512 is greater than the number of electronic components on the first setting area 511, so that the air flow at the first setting area 511 is smoother, and the obstruction of the electronic components is reduced. In the present embodiment, the first and

second disposition regions

511 and 512 each have a heat generating component to separate the heat sources.

As shown in fig. 4, 47 and 50, in some embodiments, the first heat dissipation channel 7a includes an inner channel 7a1 and an outer channel 7a2, the outer channel 7a2 is formed between the electronic components at the edge of the power board 51 and the inner wall of the inner cavity of the lamp housing 2, and the inner channel 7a1 is formed in the gap between the electronic components. Thereby improving the heat dissipation effect of the power supply 5. Specifically, the power board 51 in fig. 47 is divided into two parts (left and right parts, not necessarily symmetrical), i.e., a first part and a second part, each having an electronic component thereon, the electronic components on the first part and the second part respectively form an outer channel 7a2 with the inner wall of the lamp housing 2, and an inner channel 7a1 is formed between the electronic components on the first part and the electronic components on the second part. In this embodiment, the transformer 54 of the electronic component includes a magnetic core 541 and a coil 542, the magnetic core 541 has a cavity, the coil 542 is disposed in the cavity, and the cavity is disposed with an opening on at least one side of the radial direction of the LED lamp, so as to expose the coil, and the opening side corresponds to the inner channel 7a1 or the outer channel 7a2, so that the heat generated by the coil 542 is rapidly discharged through the convection of the inner channel 7a1 or the outer channel 7a 2. Preferably, the cavities are arranged with openings on both sides in the radial direction of the LED lamp, wherein one side of the cavities is open corresponding to the inner channel 7a1, and the other side of the cavities is open corresponding to the outer channel 7a2, so that heat dissipation of the transformer is further increased.

Fig. 53a to 53c are schematic views of various different types of power boards 51. The power panel 51 includes a plurality of sub-boards 512 as shown in fig. 53a, and the plurality of sub-boards 512 are electrically connected to each other. As shown in fig. 53a, the plurality of sub-boards 512 are connected by one or more wires 513, and when the plurality of wires 513 are used, the plurality of wires may be combined into a flexible flat cable. By bending the wires 513, the relative positions of the plurality of sub-boards 512 can be changed, for example, the two sub-boards 512 are parallel to each other and keep a distance therebetween, so as to respectively configure different groups of electronic components. As shown in fig. 53b, the plurality of daughter boards 512 are connected by one or more electrical connectors 514. The plurality of sub-boards 512 are connected by the electrical connector 514 to form a fixed structure, and are arranged in parallel or parallel to each other, for example, the two sub-boards 512 are arranged in parallel and spaced apart from each other, so as to respectively arrange different groups of electronic components. As shown in fig. 53c, the power panel 51 includes a first region 51a and a second region 51b. The second region 51b has a larger width than the first region 51a for accommodating more thermolabile electronic components. In this configuration, the second region 51b is disposed adjacent to the air inlet 172 of the heat sink 17, and the first region 51a is disposed adjacent to the heat sink 222 of the neck 22.

Fig. 54 is a sectional view of the LED lamp in the present embodiment. As shown in fig. 54, the power supply board 51 divides the heat dissipation path (the heat dissipation path herein refers to the first heat dissipation path 7 a) into a first path S1 and a second path S2 along the axial direction of the heat dissipation path, the first face corresponds to the first path S1, and the second face corresponds to the second path S2.

When the volume of the electronic component is large, the heat dissipation channel needs to have a large volume, so that after the volume of the heat dissipation channel is subtracted from the total volume of the electronic component, enough channel space is reserved. Therefore, when the volume of the first channel S1 is smaller than the volume of the second channel S2, the volume of the electronic component located on the first side (the sum of the volumes of all the electronic components of the first side) needs to be smaller than the volume of the electronic component located on the second side (the sum of the volumes of all the electronic components of the second side). The ratio of the volume of the first channel S1 to the volume of the second channel S2 is set to R1, and the range of R1 may be 0.3-0.5; the ratio of the volume of the electronic component located on the first surface to the volume of the electronic component located on the second surface is set to be R2, and the range of R2 may be 0.05-0.2. From the ratio, the ratio R1 of the volume of the first channel S1 to the volume of the second channel S2 needs to be smaller than the ratio R2 of the volume of the electronic component on the first side to the volume of the electronic component on the second side. If the weight of the electronic components on the first side is less than the weight of the electronic components on the second side, a counterweight (not shown) may also be provided on the first side to balance the weight of both sides.

Fig. 55 is a sectional view of the LED lamp in the present embodiment. As shown in fig. 55, if the upper and lower relationship is further divided, on the same face (first face or second face), a relationship of heat dissipation paths (here, heat dissipation paths refer to first heat dissipation paths 7 a), that is, air circulation areas (not covered with electronic components) is also considered. Taking the second surface as an example, the first quadrant Q1, the second quadrant Q2, the third quadrant Q3 and the fourth quadrant Q4 are defined on the second surface by using the X axis and the Y axis, the first quadrant Q1, the second quadrant Q2, the third quadrant Q3 and the fourth quadrant Q4 are mutually communicated, the first quadrant Q1 and the second quadrant Q2 correspond to the lamp shell, the third quadrant Q3 and the fourth quadrant Q4 correspond to the radiator 2, the first quadrant Q1 is adjacent to the third quadrant Q3, and the second quadrant Q2 is adjacent to the fourth quadrant Q4. The X axis falls on the upper edge of the radiator 2, and the Y axis is the center axis position in the drawing.

As shown in fig. 55, it is preferable to locate the electronic components on a single side (Y-axis side), for example, the second quadrant Q2 and the fourth quadrant Q4, and locate the lower electronic components (same electronic components) less than the upper electronic components, and locate the lower electronic components (e.g., transformers, electrolytic capacitors) that generate heat or are not heat resistant. Thus, as shown, the volume of the electronic components in the second quadrant Q2 is smaller than the volume of the electronic components in the first quadrant Q1, so that the second quadrant Q2 displays a larger air flow area (uncovered electronic components) than the first quadrant Q1, while maintaining an area that allows air flow to pass through quickly. Thus, taking the second surface as an example, the ratio of the volume of the first channel S1 in the second quadrant Q2 to the volume of the electronic component in the second quadrant Q2 is greater than 3, so that the air circulation area in the second quadrant Q2 has a sufficient size. It is of course also possible to reverse the ratio of the volume of the first channel S1 in the first quadrant Q1 to the volume of the electronic components in the second quadrant Q2 to be greater than 3.

The volume of the electronic component in the second quadrant Q2 is smaller than the volume of the electronic component in the first quadrant Q1, and if the volume of the electronic component in the second quadrant Q2 is in a proportional relationship, the volume ratio of the electronic component in the second quadrant Q2 may be set smaller than the volume ratio of the electronic component in the first quadrant Q1.

Further comparing the lower configuration, the volume of the electronic components located in the fourth quadrant Q4 is smaller than the volume of the electronic components in the third quadrant Q3, so that the fourth quadrant Q4 to the first quadrant Q2 can maintain sufficient airflow channels. Also in terms of the proportional relationship, the ratio of the volume of the electronic component in the fourth quadrant Q4 to the volume of the first channel S1 in the fourth quadrant Q4 is smaller than the ratio of the volume of the electronic component in the third quadrant Q3 to the volume of the first channel S1 in the third quadrant Q3.

If the plurality of electronic components are classified as including heat generating components, the heat generating components are desirably arranged in the upper portions, i.e., the first quadrant Q1 and the second quadrant Q2, so that the heat generating components are arranged in the first quadrant Q1 and the second quadrant Q2, that is, the heat generating components may contact the cooling air flow at the end of the heat dissipation channel, so as to avoid affecting the cooling of other electronic components due to the heating of the cooling air flow. The ratio of the number of the heating elements in the first quadrant Q1 to the number of the heating elements in the second quadrant Q2, which are corresponding to each other, is 0 to 0.5, so as to reduce the number of the heating elements in the same cross section, and facilitate the temperature gradient to be pulled apart on the same cross section, so that the heating elements radiate heat to the surrounding air, specifically, the heating elements radiate the generated heat to the air through heat radiation, and the temperature difference is one of the key factors of the heat radiation, so that the interference between the heating elements needs to be avoided as much as possible, and the temperature difference between the heating elements and the air is ensured, so that the heat radiation efficiency is ensured.

Considering the up-down flow relation of the cooling air flow, the volume of the first channel S1 in the third quadrant Q3 and the fourth quadrant Q4 is larger than the volume of the first channel S1 in the first quadrant Q1 and the second quadrant Q2, so as to avoid that the cooling air flow encounters high flow resistance at the starting point end and influences the flow of the cooling air flow.

Therefore, the ratio of the radial sectional area of the electronic component to the radial sectional area of the heat dissipation channel is preferably 0-0.4, wherein the ratio of 0 means that no electronic component is arranged on the cross section, and the ratio of 0.4 means that the radial sectional area of the electronic component is prevented from exceeding half of the heat dissipation channel.

The ratio of the cross-sectional area of the electronic component in the radial direction in the first channel S1 to the cross-sectional area of the first channel S1 in the radial direction is 0 to 0.3, whereas the ratio of the cross-sectional area of the electronic component in the radial direction in the second channel S2 to the cross-sectional area of the second channel S2 in the radial direction in the second surface is 0 to 0.6. That is, the electronic components of the first surface and the second surface are configured in different proportions, so that one surface has better airflow.

As shown in fig. 54, the foregoing ratio may be achieved by an off-axis configuration process of the power panel 51, wherein an off-axis distance G is provided between the power panel 51 and the axis of the heat dissipation channel, and the ratio of the off-axis distance G to the radius of the heat dissipation channel is between 0.15 and 0.4. The arrangement of the off-axis distance G can also adjust the center of gravity so that the equivalent center of gravity of the power panel 5 falls on the axis of the heat dissipation path.

Fig. 56 is a schematic diagram of the mating of the power supply 5 and the inner housing 21 in some embodiments. As shown in fig. 56, the configuration of the power board 51 may be inclined to the axis Y of the LED lamp, and a face having a large flow resistance, for example, a face having a large number of electronic components, may be configured to incline to a face on which the power board 51 is provided; a side where the flow resistance is small, for example, a side where the number of electronic components is small, may be configured to incline the side under the power board 51; so that the side with the high flow resistance still has sufficient air flow through it. The balancing weight 52 is disposed on the lower surface of the inclined power board 51 according to the inclined state to balance the weight on the axis Y, so as to maintain the center of gravity of the LED lamp on the axis Y.

As shown in fig. 1, 2, 3 and 4, the lamp housing 2 includes a lamp cap 23, a neck 22 and an inner sleeve 21; the lamp cap 23 is connected with the lamp neck 22, and the lamp neck 22 is connected with the inner sleeve 21. The inner sleeve 21 is located inside the heat sink 1 (the LED lamp is axially located, and the entire or most of the inner sleeve 21, for example, 80% or more of the inner sleeve height does not exceed the heat sink 1), and the neck 22 is exposed outside the heat sink 1. By providing the inner sleeve 21 and the neck 22, enough space is provided to accommodate the power supply 5 and dissipate heat, especially the power supply 5 of the high-power LED lamp (the power supply of the high-power LED lamp is relatively low-power LED lamp, the power supply composition is more complex, and the overall size is larger). The lamp neck 22 and the lamp cap 23 each include a portion of the power supply 5, and the sum of the heights of the lamp neck 22 and the lamp cap 23 is larger than the height of the heat sink 1, so that more space is provided for disposing the power supply 5, and the lamp neck 22 and the lamp cap 23 are separated from the heat sink 1 (axially non-overlapping, in contrast, the inner sleeve 21 is wrapped in the heat sink 1), so that the power supply 5 in the lamp neck 22 and the lamp cap 23 is less affected by the heat sink 1 (heat of the heat sink 1 is not conducted into the lamp neck 22 and the lamp cap 23 in the radial direction). In addition, the height of the lamp neck 22 is set to facilitate the chimney effect of the first heat dissipation channel 7a, so that the convection efficiency in the first heat dissipation channel 7a can be ensured. In other embodiments, the height of the neck 22 is at least 80% of the height of the heat sink 1 to achieve the above effects. The inner sleeve 21 is a heat insulating material for preventing heat of the heat radiating fins from being affected by heat of the power supply.

As shown in fig. 2, the second air intake hole 1301 is located at the lower side of the radiator 1 and corresponds to the inner side or the inner side of the radiator 1 in the radial direction, that is, the second air intake hole 1301 corresponds to the inner side or the inner side of the radiator fins 11, and the inner side or the inner side of the radiator fins 11 corresponds to the outer wall of the inner sleeve 21 of the lamp housing 2 (the inner side of the radiator fins 11 in the radial direction is close to or directly abutted against the inner sleeve 21), so that the air convected flows along the outer wall of the inner sleeve 21 during the rising process after entering from the second air intake hole 1301, and simultaneously dissipates heat radially to the inner side or the inner side of the radiator fins 11 and the outer wall of the inner sleeve 21, thereby playing a role of heat insulation, that is, preventing heat of the radiator 1 from being conducted to the inner side of the inner sleeve 21 through the outer wall of the inner sleeve 21, thereby affecting the power supply 5. From the above, the second heat dissipation channel 7b not only accelerates the heat dissipation of the heat dissipation fins 11, but also plays a role in heat insulation. The second air intake hole 1301 is located closer to the inside of the LED lamp than any one of the LED chips 311 than the LED chips 311.

Fig. 57 is an enlarged view at B in fig. 2. As shown in fig. 57, the base 23 includes a metal portion 231 and an insulating portion 232, and a wire of the power supply 5 passes through the insulating portion 232 to be connected to an external power supply unit. The metal part 231 is coupled to the neck 22, and specifically, as shown in fig. 58, the inner surface of the metal part 231 is provided with threads, and the threaded coupling with the neck 22 is achieved by the threads. When the metal portion 231 radiates heat to the power supply 5 in the lamp housing 2 (as in the foregoing embodiment, at least a portion of the inner wall of the metal portion 231 forms the wall of the inner cavity of the lamp housing 2, so that the heat conductive material can be directly connected to the metal portion 231 and radiate heat by the metal portion 231), the protruding structure 2311 (as shown in fig. 58) is provided on the outer surface of the metal portion 231, so that the surface area of the outer surface of the metal portion 231 is increased, and the heat radiation area of the metal portion 231 is increased, thereby improving the heat radiation efficiency. At least a portion of the power supply 5 is located within the lamp cap 23 from the power supply 5, and at least a portion of the power supply 5 dissipates heat via the lamp cap 23. The inner wall of the metal portion 231 may be provided with a convex structure as well to increase the surface area of the inner wall corresponding to the inner cavity of the lamp housing 2. In the present embodiment, the above-mentioned protruding structure is formed by providing the screw thread on the inner surface of the metal portion 231 of the base 23, so as to achieve the purpose of increasing the surface area.

Fig. 59a is a schematic perspective view of the neck 22 in the present embodiment. Fig. 59b is a second perspective view of the neck 22 of the present embodiment. Fig. 60 is a perspective view of the inner sleeve 21 of the present embodiment. As shown in fig. 2, 59a, 59b and 60, the neck 22 is coupled to the inner sleeve 21 by snap-fit engagement. Specifically, the inner sleeve 21 has a first positioning unit 211 thereon, and the neck 22 has a second positioning unit 221 thereon, and the first positioning unit 211 is engaged with the second positioning unit 221 to connect the inner sleeve 21 with the neck 22.

In this embodiment, the first positioning unit 211 is a fastening portion formed on the inner sleeve, and the second positioning unit 221 is a fastener formed on the neck, and the fastening portion is fastened to the fastener. In other embodiments, the first positioning unit 211 may be a buckle provided on the inner sleeve, and the second positioning unit 221 may be a fastening portion provided on the neck, and the fastening portion is fastened and connected with the buckle.

In this embodiment, the inner sleeve 21 has a connection portion 212, the connection portion 212 includes at least two groups of sheet-shaped bodies 2121 in the circumferential direction of the LED lamp, the first positioning unit 211 is formed on the sheet-shaped bodies 2121, when the neck 22 is matched with the inner sleeve 21, the second positioning unit 221 is buckled into the first positioning unit 211, when buckling, the second positioning unit 221 has radial extrusion on the sheet-shaped bodies 2121, when the sheet-shaped bodies 2121 have a plurality of pieces in the circumferential direction, the structural strength in the radial direction is weakened, so that buckling action is more labor-saving, and the connection portion 212 has a deformation space in the radial direction of the LED lamp as a whole. In this embodiment, the fastening portion is a groove or a through hole formed in the sheet 2121.

In this embodiment, there is a gap between the two sets of sheets 2121, and the gap forms the positioning groove 213. And the neck 22 has a third positioning unit 223 matched with the positioning groove 213, and when the inner sleeve 21 is matched with the neck 22, the third positioning unit 223 is inserted into the positioning groove 213 to limit the inner sleeve 21 to rotate relative to the neck 22 in the circumferential direction.

In this embodiment, the connecting portion 212 is sleeved in the neck 22, and through the sleeving manner, the connecting portion 212 and the neck 22 have the functions of guiding and supporting each other, so that the connection is more convenient, and the structural stability after the connection is better.

In other embodiments, the neck 22 and the inner sleeve 21 are integrally formed (not shown) to simplify the structure of the lamp housing 2.

As shown in fig. 59b, the neck 22 has a locking groove 224 formed by two pieces 225, specifically, the locking groove 224 is formed between the two pieces 225, and the power board 51 can be locked into the locking groove 224 to be fixed. In this embodiment, the sheet bodies 225 are arranged in sections in the axial direction of the LED lamp, so that a gap is maintained between the sheet bodies 225 in the axial direction of the LED lamp, and after the power panel 51 is inserted, both sides of the power panel 51 can perform convection through the gap. In this embodiment, when the sheet 225 is arranged in sections in the axial direction of the LED lamp, the ratio of the length L1 of the partial clamping groove 224 formed by the sheet 225 located at the lowest position in the axial direction of the lamp neck 22 to the length L2 of the power board 51 is between 1:14 and 22, and when the ratio is in the above, the power board 51 is inserted into the partial clamping groove 224 formed by the sheet 225 located at the lowest position in the axial direction of the lamp neck 22, and both sides of the power board 51 are limited by the clamping groove 224, which will not generate large deflection, but will not be aligned with the clamping groove 224 formed by the next group of sheet 224, thereby reducing the assembly difficulty.

In this embodiment, the two sheets 225 are formed of two parallel ribs, and the two corresponding ribs are disposed on the inner wall of the neck 22 and extend along the axial direction of the neck 22. After the power board 51 is inserted into the card slot 224, the corresponding two ribs are parallel to the power board 51.

The two sheets 225 in the present embodiment form the third positioning unit 223, and two opposite side surfaces of the two sheets 225 respectively correspond to the positioning grooves 213 to perform positioning guiding function.

Fig. 59c is a perspective view of the neck 22 in some embodiments. As shown in fig. 59c, in some embodiments, the sheet 225 extends in the axial direction of the LED lamp and is a single piece (a single sheet), and the card slot 224 formed by this form of sheet 225 is more stable in cooperation with the power board 51. In this embodiment, the length of the sheet 225 is between 15% and 45% of the length of the power panel 51. Thereby ensuring that the card slot 224 more stably supports the power panel 51.

In other embodiments, the slot 224 may be a slot (not shown) on the inner wall of the neck 22. Thus eliminating the need for the sheet 225, and making the structure simpler.

As shown in fig. 59b and 31, in this embodiment, the lamp neck 22 has a first stop portion 226, the first stop portion 226 is matched with the power panel 51, the power panel 51 is limited by the first stop portion 226 after being inserted, so as to avoid the electronic components at the end of the power panel 51 being damaged by being pressed by the end of the lamp cap 23 after the power panel 51 is further inserted, and on the other hand, the first stop portion 226 is arranged to keep the power panel 51 and the end of the lamp cap 23 in a gap, so as to ensure convection at the gap.

As shown in fig. 31, the inner sleeve 21 has a second stopping portion 215, the second stopping portion 215 cooperates with the power panel 51 to limit the power panel 51 to move in the downward direction of the axial direction of the LED lamp, and by providing the first stopping portion 226 and the second stopping portion 215, both sides of the axial direction of the power panel 51 are limited, so that the power panel 51 is fixed in the axial direction.

As shown in fig. 1 and 31, the lamp housing 2 has a flow-limiting surface 214 extending radially outwardly of the LED lamp and radially distally of the heat-dissipating holes 222, and the flow-limiting surface 214 covers at least a portion of the heat-dissipating fins 11. When the heat dissipation fins 11 dissipate heat, the heat emitted by the heat dissipation fins 11 covered by the flow limiting surface 214 is blocked by the flow limiting surface 214 in the rising process, so that the flow direction of the heat is changed (outwards along the flow limiting surface 214), thereby keeping away from the heat dissipation holes 222 when the heat rises, avoiding the heat from being concentrated near the heat dissipation holes 222 to form high temperature, thereby affecting the convection speed of the first heat dissipation channel 7a, and avoiding the heat from rising and entering the inner cavity of the lamp housing 2 through the heat dissipation holes 222, thereby affecting the power supply 5, and finally avoiding the heat from rising and contacting the metal part 231 of the lamp cap 23, affecting the heat dissipation of the metal part 231, and even avoiding the heat from being directly conducted into the inner cavity of the lamp housing 2 through the metal part 231. The flow restricting surface 214 may be formed on the inner housing 21. In other embodiments, as shown in fig. 12, a flow restricting surface 214 may be formed on the neck 22.

As shown in fig. 31, in the present embodiment, the upper side of the heat radiation fins 11 in the axial direction of the LED lamp at least partially corresponds to the flow limiting surface 214, and the heat radiation fins limit the heat radiation fins when the heat radiation fins 2 are inserted into the heat sink 1. In this embodiment, the heat sink fins 11 are abutted against the current limiting surface 214.

As shown in fig. 31, in the present embodiment, the heat conductivity of the material used for the inner sleeve 21 is smaller than that of the material used for the neck 22, and the current limiting surface 214 is formed on the inner sleeve 21, so that the axial height of the heat sink 1 does not exceed the current limiting surface 214, and the contact area between the heat sink 1 and the neck 22 is reduced. The lower the thermal conductivity of the material of the inner sleeve 21, the less heat is conducted from the heat sink 1 to the interior of the inner sleeve 21, and the less influence is exerted on the power supply 5, while the smaller the contact area between the neck 22 and the heat sink 1 is, the lower the thermal conductivity is, and the material of the neck 22 itself has a higher thermal conductivity than the material of the inner sleeve 21, so that the neck 22 itself can radiate at least a part of the heat generated by the power supply 5 inside through the neck 22. In other embodiments, the material used for the inner sleeve 21 and the material used for the neck 22 may be the same material, for example, materials with low thermal conductivity, such as plastics.

As shown in fig. 31, in the present embodiment, the wall portion of the inner sleeve 21 and the wall portion of the neck 22 together form the wall portion of the inner cavity of the lamp housing 2, and the height of the heat sink 1 in the axial direction does not exceed the height of the inner sleeve 21, so that the heat sink 1 corresponds to the inner sleeve 21 in the radial direction of the LED lamp, that is, the inner sleeve 21 plays a role of heat insulation, so that the heat of the heat sink 1 is prevented from being conducted into the inner sleeve 1 to affect the electronic components of the power supply 5 therein. The neck 22 is entirely higher than the heat sink 1, that is, the heat sink 1 and the neck 22 do not overlap in the radial direction of the LED lamp, so as to avoid heat conduction between the heat sink 1 and the neck 22 as much as possible, and prevent the heat sink 1 from conducting heat to the interior of the neck 22 through heat conduction, thereby affecting the electronic components therein. As such, the heat transfer efficiency of the wall portion of the inner sleeve 21 can be set lower than that of the wall portion of the neck 22, which has the advantages that, on one hand, the heat conduction of the radiator 1 to the inner sleeve 21 can be reduced by setting the inner sleeve 21 to be low in heat transfer efficiency, so that the radiator 1 is prevented from affecting the electronic components in the inner sleeve 21, and on the other hand, the heat transfer efficiency of the neck 22 is improved because the heat conduction of the radiator 1 to the neck 22 is not required to be considered, so that the heat generated during the operation of the electronic components of the internal power supply 5 is facilitated to be dissipated through the neck 22, and the service life of the electronic components is prevented from being influenced by the too high temperature of the power supply 5. In this embodiment, in order to set the heat transfer efficiency of the wall portion of the inner sleeve 21 lower than that of the wall portion of the neck 22, the inner sleeve 21 may be made of a material with a low thermal conductivity, the neck 22 may be made of a material with a relatively high thermal conductivity, and in order to improve the thermal conductivity of the neck 22, the neck 22 may be provided with a heat dissipation hole 222, or a heat conduction portion (not shown) such as a metal material with a high thermal conductivity may be provided on the neck 22.

As shown in fig. 31, the neck 22 has an upper portion and a lower portion, wherein the heat dissipation hole 222 is formed in the upper portion, the cross-sectional area of the upper portion is smaller than that of the lower portion, and the air flow rate of the upper portion is faster than that of the lower portion, so that the initial velocity of the air discharged from the heat dissipation hole 222 is increased, and hot air is prevented from accumulating near the heat dissipation hole 222. In this embodiment, the cross-sectional area of the neck 22 decreases in an axially upward direction of the LED lamp, avoiding obstruction to air flow. In this embodiment, the cross-sectional area of the inlet of the lower portion of the inner housing 21 is larger than the cross-sectional area of the upper portion of the neck 22.

As shown in fig. 1, the heat dissipation holes 222 on the neck 22 are strip-shaped and extend along the axial direction of the LED lamp, and the neck 22 is pulled in the axial direction due to the self-gravity of the LED lamp, and the heat dissipation holes 222 are strip-shaped holes extending along the axial direction of the LED lamp, so that the impact on the strength of the neck 22 caused by the provision of the heat dissipation holes 222 can be avoided. The maximum inscribed circle diameter of the heat dissipation holes 222 is less than 2mm, preferably 1 to 1.9mm. In this way, on the one hand, insects can be prevented from entering, and most of dust can be prevented from passing through, and on the other hand, the ventilation holes 41 can maintain good ventilation efficiency. On the other hand, if the heat dissipating holes are designed to extend along the outer circumferential surface of the neck 22, the neck 22 may be pulled by the weight of the heat sink 1, so that the heat dissipating holes become large, and the heat dissipating holes 222 cannot meet the requirement that the maximum inscribed circle diameter is less than 2 mm.

As shown in fig. 21, the outlet of the heat dissipating hole 222 in the radial direction of the LED lamp exceeds the outer surface of the metal part 231 in the radial direction of the LED, i.e., the outlet of the heat dissipating hole 222 is located outside the outer surface of the metal part 231 in the radial direction of the LED lamp. The influence on the metal part 231 when the heat discharged from the outlet is upward is reduced, and the influence on the electronic components of the power supply caused by the fact that the heat is conducted to the inner cavity of the lamp housing 2 again through the metal part 231 is avoided.

Fig. 61 is a cross-sectional view of an LED lamp in some embodiments. Fig. 62 is a schematic view of the arrangement of convection channels within the LED lamp of fig. 61. As shown in fig. 61 and 62, in some embodiments, the basic structure of the LED lamp is the same as the LED lamp shown in fig. 1. In some embodiments, the inner sleeve 21 has an upper portion and a lower portion, the upper portion and the lower portion are connected by a guiding surface 216, the guiding surface 216 has a radius gradually increasing along the axial direction of the LED lamp (along the convection direction of the first heat dissipation channel 7 a), that is, the guiding surface 216 has a function of guiding the air of the second heat dissipation channel 7b to the radial direction outside the heat sink 1, so that the air contacts with more area of the heat dissipation fins 11, and further takes away more heat on the heat dissipation fins 11. The inner housing 21 includes a first portion and a second portion in the axial direction, the second portion being the inner housing 21 (including the portion of the guide surface 216) of the portion below the guide surface 216, and the first portion being the inner housing 21 (excluding the portion of the guide surface 216) of the portion above the guide surface 216, among the electronic components of the power supply 5, the electronic components located in the second portion of the inner housing 21 include a heat labile component such as a capacitor, particularly an electrolytic capacitor, so that the heat labile component operates at a lower temperature (near the first air intake hole 2201). In other embodiments, the high heat generating component may be disposed on the second portion of the inner housing 21, such as a resistor, an inductor, a transformer, etc. When the convection air enters the second heat dissipation channel 7b, the convection air will be upward against the outer wall of the inner sleeve 21 when the convection air enters the second heat dissipation channel 7b, so as to insulate heat, i.e. prevent the heat of the heat dissipation fins 11 from being conducted into the inner sleeve 21 to affect the heat labile components therein, and when the convection air continues upward, the convection air will flow along the radial outer side of the heat dissipation fins 11 under the action of the guide surface 216, so that the convection air contacts the heat dissipation fins 11 with more area, thereby improving the heat dissipation performance of the surfaces of the heat dissipation fins 11. In the present embodiment, the inner cavity of the inner sleeve 21 has a channel structure with a wide upper portion and a narrow lower portion, so that the chimney effect is greatly enhanced, and the inner sleeve 21 is facilitated to push air to flow. In addition, the heat dissipation hole 222 is disposed at the top end of the lamp neck 22 and is farthest from the air holes, so that the chimney effect is further enhanced.

Fig. 63 is a front view of the LED lamp with the heatsink 1 removed in some embodiments. Fig. 64 is an exploded view of fig. 63. The features mentioned in this embodiment are applicable to the LED lamp of fig. 1. As shown in fig. 63, in some embodiments, a flow passage 219 is provided on the outer circumferential wall of the inner case 21 so that part of the convection air in the inner case 21 can circulate to the radiator 1 through the flow passage 219. In this embodiment, the flow passage 219 may be a slit formed at the lower portion of the outer peripheral wall of the inner sleeve 21, or may be a hole formed at the lower portion of the outer peripheral wall of the inner sleeve 21. The flow passages 219 are provided in plurality, and the plurality of flow passages 219 are distributed along the circumferential direction of the inner housing 21. At this time, the position of the bump 217 is adjusted accordingly.

As shown in fig. 64, the inner sleeve 21 has a wire pressing portion 210, and the wire pressing portion 210 protrudes downward from the lower end of the inner sleeve 21, and a wire pressing groove 2101 is formed in the wire pressing portion 210, so that a wire connecting the power supply 5 and the lamp panel 3 can be clamped into the wire pressing groove 2101, thereby completing the fixation of the wire.

As shown in fig. 64, the inner sleeve 21 has a fourth positioning unit 2102 thereon, and the lamp housing 4 has a fifth positioning unit 46, and the fourth positioning unit 2102 cooperates with the fifth positioning unit 46 to limit rotation of the inner sleeve 21 relative to the lamp housing 4. The fourth positioning unit 2102 is a positioning hole, and the fifth positioning unit 46 is a positioning post, and the positioning post is inserted into the positioning hole to be matched, and it should be noted that the positioning post is not disposed in the axial direction of the inner sleeve 21. The preferred positioning posts and positioning holes are provided in multiple sets. In other embodiments, the fourth positioning unit 2102 is a positioning post, and the fifth positioning unit 46 is a positioning hole, and the positioning post is inserted into the positioning hole to be matched.

As shown in fig. 1, the outer contour of the LED lamp of this embodiment is shown, and a rectangular coordinate system is established, with the axial direction of the LED lamp as the y axis, the radial direction of the LED as the x axis, and the center of the bottom surface of the LED lamp as the origin. The outer contour of the side surface of the LED lamp is rotated 360 degrees around the axis of the LED lamp by a contour line to form the outer contour of the LED lamp (excluding the cap 23), and any point of the outer contour line (the cap 23 is usually a standard cap, and therefore, here, the cap 23 is not included, specifically, the outer contour formed by the radiator 1 and the neck 22) conforms to the following formula:

y＝-ax ³ +bx ² -cx+K

where K is a constant, K ranges from 360 to 450, a ranges from 0.001 to 0.01, b ranges from 0.05 to 0.3, and c ranges from 5 to 20, preferably from 10 to 18, more preferably from 12 to 16.

Hereinafter, a, b, c take the following values as examples:

y＝-0.0012x ³ +0.2235x ² -14.608x+K

and K ranges from 360 to 450.

The above formula can also be understood that any point on the contour line falls within y= -0.0012x ³ +0.2235x ² -14.608x+360 and y= -0.0012x ³ +0.2235x ² -14.608x+450, in the range between these two lines.

In general, the heat dissipation effect, thermodynamic principle, hydrodynamics and other factors are comprehensively considered, and the good heat dissipation effect can be achieved according to the relation of the formula.

Specifically, on the one hand, when any point of the contour line meets the above formula, the LED lamp can be better matched with a lamp (particularly, a cone-shaped lamp) (as shown in fig. 67). On the other hand, when any point of the contour line accords with the formula, the width of the whole LED lamp is approximately in a decreasing shape along the axial upward direction of the bottom of the LED lamp. For the radiator 1, the lower part of the radiator 1 mainly conducts heat energy generated by the LED chip 311 in the operation process of the LED lamp to the radiator 1 for heat dissipation, and the upper part mainly radiates heat of the radiator 1 by radiation, convection and the like. Therefore, the lower portion of the heat sink 1 is designed with a larger area for heat conduction (the lower portion of the heat sink 1 has a large width and a larger heat dissipation area). For the lamp neck 22, the lamp neck 22 is in a shape with a large lower part and a small upper part, that is, when the sectional area of the lamp neck 22 is in a decreasing state when the LED is axially upward, when the lamp neck 22 provides the power supply 5 to dissipate heat in a convection manner, and the heat dissipation holes 222 are arranged at the upper part of the lamp neck 22, when the convection air is upward, the decreasing sectional area of the lamp neck 22 promotes the increase of the convection speed, so that when the convection air is discharged out of the heat dissipation holes 222, the initial speed is higher, and the heat dissipation holes 222 are far scattered when the air is discharged, so that the heat is prevented from being accumulated near the heat dissipation holes 222.

In this embodiment, the contour line is a continuous line. In other embodiments, the contour lines may be multi-segmented lines (as shown in FIG. 68).

In this embodiment, the contour line is a smooth or substantially smooth curve to avoid forming an included angle to cut the hand, and on the other hand, the convection of the air along the outside of the LED lamp can be smoother. The contour line of the LED lamp in this embodiment is a substantially "S" shaped curve including the curve on the neck 22 and the curve on the heat sink 1. The curve on the outer contour of the neck 22 and the curve on the heat sink 1 together form an "S" -shaped curve. It should be noted that, at the junction of the neck 22 and the heat sink 1, an included angle may be formed to break the smoothness of the curved portion, and the contour line is smooth overall. In addition, when the contour line of the LED lamp with the same width dimension is a curve, the LED lamp has an outer contour surface with a larger area than a straight line, so that more area for heat radiation is provided.

As shown in fig. 66, the outer contour of the LED lamp in this embodiment is shown, and a rectangular coordinate system is established, with the axial direction of the LED lamp as the y axis, the radial direction of the LED as the x axis, and the center of the bottom surface of the LED lamp as the origin. The outer contour of the side surface of the LED lamp is rotated 360 degrees around the axis of the LED lamp in a contour line to form the outer contour of the LED lamp (excluding the base 23). The contour lines include the contour line of the lamp neck 22 and the contour line of the heat sink 1.

The lamp neck 22 is used for accommodating the power supply 5, and mainly dissipates heat of the power supply 5 therein in a convection manner, and the contour line of the lamp neck 22 has a slope a, wherein a is a constant. As shown in fig. 66, when the contour of the neck 22 is curved, a straight line may be virtually represented as a rough slope of the contour of the neck 22. For example, a line L1 from the top to the bottom of the contour of the neck 22 is taken to represent the contour of the neck 22, or a line L2 from the center to the bottom of the top of the neck 22 is taken to represent the contour of the neck 22. In this embodiment, a line L1 from the top to the bottom of the contour line of the neck 22 is taken to represent the contour line of the neck 22 for illustration.

The heat sink 1 is mainly used for conducting heat dissipation to the LED chip 311, and the contour line of the heat sink 1 has a slope b, where b is a constant. As shown in fig. 66, when the contour line of the heat sink 1 is a curve, a straight line may be virtually represented by a rough slope of the contour line of the heat sink 1. For example, a line L3 from the top to the bottom of the outline of the radiator 1 is taken to represent the outline of the radiator 1, or a line L4 from the center to the bottom of the top of the radiator 1 is taken to represent the outline of the radiator 1. In this embodiment, a line L3 from the top to the bottom of the outline of the radiator 1 is taken to represent the outline of the radiator 1 for illustration.

In this embodiment, the slope a is greater than the slope b, or the absolute value of the slope a is greater than the absolute value of the slope b. Thus, overall, the contour of the lamp neck 22 is steeper than the contour of the heat sink 1. For the lamp neck 22, in the case where the space where the power supply 5 is required to be provided is uniform, in order to ensure the chimney effect at the time of convection in the lamp neck 22, it is necessary that the lamp neck 22 maintains a certain height, and if the profile of the lamp neck 22 is flatter (the slope is small), the internal volume of the lamp neck 22 is increased with the same height maintained, however, there is no practical help to the actual space of the power supply. In order to control the height of the whole lamp in order to ensure the heat dissipation effect of the heat sink 1, it is necessary to provide the heat sink 1 with a flatter (smaller slope) to control the overall height of the heat sink 1, and when the heat sink 1 is flatter (smaller slope), the lower portion of the heat sink 1 has a larger area for heat dissipation and conduction of the LED chip 311 on the premise that the heat dissipation area is the same.

In this embodiment, the value of the slope a is greater than 2, preferably 2.5 to 5, more preferably 3 to 4, and most preferably 3.2 to 3.8. So that the convective heat dissipation in the neck 22 has a better chimney effect.

In this embodiment, the value of the slope b is less than 3, preferably 1 to 2.5, more preferably 1.4 to 2, and most preferably 1.5 to 1.9. So that the lower part of the heat sink 1 has more area for conduction.

In this embodiment, the contour line of the LED lamp is a continuous line, that is, the bottom of the contour line of the neck 22 is connected to the top of the contour line of the heat sink 1. In other embodiments, the contour may be a multi-segment line (as shown in fig. 68), for example, the bottom of the contour of the neck 22 is spaced from the top of the contour of the heat sink 1, so that the contour is discontinuous as a whole.

In this embodiment, the contour line of the neck 22 is a concave curve, that is, the line connecting the top and bottom points of the contour line of the neck 22 is virtually a straight line, the contour line of the neck 22 is located all inside (on the side close to the LED lamp axis) of the straight line, the contour line of the heat sink 1 is a convex curve, the line connecting the top and bottom points of the contour line of the heat sink 1 is virtually a straight line, and the contour line of the heat sink 1 is located all outside (on the side far from the LED lamp axis) of the straight line. The contour line is a smooth or approximately smooth curve so as to avoid forming an included angle to cut hands, and on the other hand, convection of convection air along the outside of the LED lamp is smoother. The contour line of the LED lamp in this embodiment is a substantially "S" shaped curve or an inverted "S" shaped curve, which includes the curve on the neck 22 and the curve on the heat sink 1. The curve on the neck 22 and the curve on the heat sink 1 together form an "S" or inverted "S" curve. It should be noted that, at the junction of the neck 22 and the heat sink 11, an angle may be formed to break the smoothness of the curved portion, but the outline is generally smooth. In addition, it is also possible that the neck 22 is separated from the heat sink 1 (e.g. the neck 22 is spaced apart from the heat sink 1), i.e. the curve on the neck 22 and the curve on the heat sink 1 are disconnected, but the contour is smooth overall as a whole. The outer contour of the neck 22 is a concave curve, so that the size of the neck 22 increases in a downward process, so that the bottom of the neck 22 eventually has a larger size to be combined with the heat sink 1, that is, a larger size is available at the starting position of the upper portion of the heat sink 1. The outer contour of the heat sink 1 is a convex curve, so that the magnitude of the decrease in the size of the heat sink increases in the upward process, and thus the size of the lower portion of the heat sink 1 decays slower, and thus the lower portion has more area of the heat dissipation fins 11 available for heat dissipation. In other embodiments, the outer contour of the neck 22 may be a straight line segment, while the outer contour of the heat sink 1 is a curved line, and in addition, the straight line may be parallel to the LED lamp. In other embodiments, the contour of the neck 22 and the contour of the heat sink 1 may each be a straight line segment or a combination of multi-point straight line segments.

Any point of the contour line of the neck 22 in this embodiment corresponds to the following formula:

y＝-ax+k1+h，

where k1 is a constant and h is the height of the heat sink 1.

Any point of the contour line of the radiator 1 corresponds to the following formula:

y＝-bx+k2，

where k2 is a constant.

In this embodiment, when the overall width dimension of the LED lamp is controlled to be 100mm to 220mm, the value of k1 is 100 to 200. The value of k2 is 100 to 200. For example, when the width dimension of the LED lamp is 200mm at maximum, the value of k1 is 140 to 150, and the value of k2 is 170 to 200.

In this embodiment, the height of the neck 22 is greater than 80% or more of the height of the heat sink 1. Since the lamp neck 22 and the radiator 1 are separated in the axial direction, the lamp neck 22 and the radiator 1 are not overlapped, so that the power supply 5 in the lamp neck 22 is less influenced by the radiator 1, and therefore, when the height of the lamp neck 22 is more than 80% of the height of the radiator 1, more space is available for setting the power supply 5, and the part of the power supply is less influenced by the radiator 1. In addition, when the power supply 5 in the lamp housing 2 achieves the heat dissipation effect in a convection manner, the height of the lamp neck 22 can be set to ensure the height of the lamp housing 2 so as to ensure the chimney effect during convection heat dissipation.

As shown in fig. 69, the outer contour of the LED lamp in this embodiment is shown, and a rectangular coordinate system is established, where the axial direction of the LED lamp is taken as the y axis, the radial direction of the LED is taken as the x axis, and the center of the bottom surface of the LED lamp is taken as the origin. The outer contour of the side surface of the LED lamp rotates 360 degrees around the axis of the LED lamp in a contour line to form the outer contour (without a lamp cap) of the LED lamp. The contour lines include the contour line of the lamp neck 22 and the contour line of the heat sink 1. As shown in fig. 69, the outer contour of the LED lamp in this embodiment includes a first curved surface and a second curved surface, where the first curved surface and the second curved surface together form the curved surface of the outer contour of the LED lamp, the first curved surface includes the curved surface of the outer contour of the neck 22 or the curved surface of the outer contour of the neck 22 and the outer contour of a part of the radiator 1, and the second curved surface includes the curved surface of the outer contour of the radiator 1 or the curved surface of the outer contour of a part of the radiator 1.

In the present embodiment, the contour line of the neck 22 is a curve or a substantially curve, and the contour line of the heat sink 1 is a curve or a substantially curve, so as to avoid forming an included angle to cut hands, and on the other hand, the convection of the air along the outside of the LED lamp can be smoother. In the present embodiment, the radius of curvature of the contour line of the neck 22 is larger than the radius of curvature of the contour line of the radiator 1, and it should be noted that, here, the radius of curvature of the contour line of the neck 22 is larger than the radius of curvature of the contour line of the radiator 1, and that 60% of the radius of curvature of the contour line of the neck 22 is larger than the radius of curvature of more than 60% of the contour line of the radiator 1 is the radius of curvature of the contour line of the neck 22.

As shown in fig. 69, the radius of curvature of the contour line of the neck 22 in this embodiment is 120mm to 3000mm, preferably 150mm to 200mm, more preferably 160mm to 190mm, and most preferably 170mm to 185mm. The radius of curvature of the contour line of the heat sink 1 is 30mm to 150mm, preferably 70mm to 130mm, more preferably 80mm to 120mm, and most preferably 90mm to 110mm. Based on the above description, if there is a curvature of which the radius of curvature is 60% or more in this range or a curve most coincident with the contour line, it is regarded as the radius of curvature of the contour line of the neck 22 or the heat sink 1. For example, the radius of curvature of the neck 22 is 180mm for 60% or more of the contour line, and the radius of curvature of the neck 22 is considered to be 180mm. Based on the above description, it is also understood that a curve similar to a contour line represents the curvature of the contour line, that is, the contour line itself may not be a curve. In some embodiments, when considering the overall width dimension of the LED lamp, the contour line of the neck 22 and the contour line of the heat sink 1 are related to the width of the LED lamp, and the width dimension of the LED lamp (the dimension of the widest part of the LED lamp) is L, the radius of curvature of the contour line of the neck 22 in this embodiment is 0.6L to 15L, preferably 0.75L to 15L, more preferably 0.8 to 0.95L, and most preferably 0.85L to 0.925L. The radius of curvature of the contour line of the radiator 1 is 0.15L to 0.75L, preferably 0.35L to 0.65L, more preferably 0.4L to 0.6L, and most preferably 0.45L to 0.55L. That is, the curvature of the contour line of the neck 22 and the curvature of the contour line of the heat sink 1 vary with the width of the entire LED lamp. In some embodiments, the outer diameter of the biggest portion of the neck 22 is R, and the radius of curvature of the contour line of the heat sink 1 is larger than L/2-R/2, so as to ensure that the heat sink has a sufficient height to ensure the chimney effect of the second heat dissipation channel 7 b.

In this embodiment, the central angle c occupied by the contour line of the neck 22 is 10 to 50 degrees, preferably 20 to 35 degrees, and more preferably 25 to 30 degrees. Thereby maintaining the neck 22 at a certain height to ensure a chimney effect of convection currents within the neck 22.

In this embodiment, the central angle d occupied by the contour line of the heat sink 1 is 40 to 120 degrees, preferably 55 to 90 degrees, more preferably 65 to 80 degrees, and most preferably 70 to 75 degrees. To control the overall height of the heat sink 1.

In this embodiment, the contour line of the neck 22 is a concave curve, the line connecting the top and bottom points of the contour line of the neck 22 is virtually a straight line, the contour line of the neck 22 is located on the inner side (the side close to the LED lamp axis) of the straight line, the contour line of the radiator is a convex curve, the line connecting the top and bottom points of the contour line of the radiator 1 is virtually a straight line, and the contour line of the radiator 1 is located on the outer side (the side far away from the LED lamp axis) of the straight line. The contour line is a smooth or approximately smooth curve so as to avoid forming an included angle to cut hands, and on the other hand, convection of convection air along the outside of the LED lamp is smoother. The contour line of the LED lamp in this embodiment is a substantially "S" shaped curve or an inverted "S" shaped curve, which includes the curve on the neck 22 and the curve on the heat sink 1. The curve on the neck 22 and the curve on the heat sink 1 together form an "S" or inverted "S" curve. It should be noted that, at the junction of the neck 22 and the heat sink 11, an angle may be formed to break the smoothness of the curved portion, but the outline is generally smooth. In addition, it is also possible that the neck 22 is separated from the heat sink 1 (e.g. the neck 22 is spaced apart from the heat sink 1), i.e. the curve on the neck 22 and the curve on the heat sink 1 are disconnected, but the contour is smooth overall as a whole. The outer contour of the neck 22 is a concave curve, so that the size of the neck 22 increases in a downward process, so that the bottom of the neck 22 eventually has a larger size to be combined with the heat sink 1, that is, a larger size is available at the starting position of the upper portion of the heat sink 1. The outer contour of the heat sink 1 is a convex curve, so that the magnitude of the decrease in the size of the heat sink increases in the upward process, and thus the size of the lower portion of the heat sink 1 decays slower, and thus the lower portion has more area of the heat dissipation fins 11 available for heat dissipation.

As shown in fig. 70a, a schematic diagram of the cooperation between the LED lamp and the lamp 6 in this embodiment is shown. The lamp 6 in the present embodiment has a housing cavity 61, and the led lamp is disposed in the housing cavity 61. The lower part of the accommodating cavity 61 is provided with an opening, so that the LED lamp can be conveniently arranged in the accommodating cavity 61 from the lower part of the lamp 6, and after heat generated by the LED lamp in the working process is diffused into the accommodating cavity 61, the heat can be outwards dispersed from the opening in an air convection mode. In this embodiment, when the LED lamp dissipates heat, a part of heat can be directly transferred to the lamp 6 in a heat radiation manner, the lamp 6 transfers the heat to the outside of the lamp 6, and a part of heat is transferred to the air in the space between the lamp 6 and the LED lamp in a conduction and convection manner, and then transferred to the outside of the lamp 6 in a convection, conduction or radiation manner.

As shown in fig. 70b, a schematic diagram of the cooperation between the LED lamp and the lamp 6 in one embodiment is shown. The lamp 6 in this embodiment is provided with a convection hole 62, and the convection hole 62 is disposed at the upper part of the lamp. In this way, when the heat of the LED lamp is transferred to the air in the accommodating cavity 61, the heat can be convected upwards through the convection hole 62, so that the hotter air is taken away.

As shown in fig. 70c, a schematic diagram of the cooperation between the LED lamp and the lamp 6 in one embodiment is shown. The lamp 6 in this embodiment has a closed housing 61. After the LED lamp is installed in the accommodating cavity 61, the LED lamp is isolated from the outside, so that the LED lamp can play a role in dust prevention, and dust is prevented from accumulating outside or inside the LED lamp. At this time, heat generated when the LED lamp is operated is transferred to the air in the accommodating chamber 61, and then the air circulates in the accommodating chamber 61, and the heat is transferred to the lamp 6 by heat conduction and heat radiation, and then the lamp 6 transfers the heat to the outside.

In the above embodiment, the lamp 6 may be made of metal or plastic, which is more beneficial to heat dissipation, while the lamp 6 is made of plastic, which is lighter in weight and lower in cost, and the lamp 6 is made of plastic, which is light-transmitting. In the case where the lamp 6 is closed, the lamp 6 is preferably made of a metal material in consideration of heat dissipation.

Fig. 65a is an exploded view of the lamp housing 20 of the LED lamp in some embodiments, showing different styles of lamp housing 20. Fig. 65b is an assembled schematic view of fig. 65 a. Fig. 65c is an exploded view of the LED lamp of fig. 65 a. Fig. 65d is an exploded view of the LED lamp of fig. 65 a. Fig. 65e is a cross-sectional view of the LED lamp of fig. 65 a. As shown in fig. 65a, 65b and 65c, in some embodiments, the lamp housing 20 includes a lamp cap 230, a neck 220 and an inner sleeve 210; the lamp cap 230 is in threaded connection with the lamp neck 220, the lamp neck 220 is connected with the inner sleeve 210, the inner sleeve 210 is connected with the radiator 10, specifically, grooves 2230 are formed in the side edges around the lamp neck 220, raised strips 2110 on the inner sleeve 210 are aligned with the grooves 2230, the inner sleeve 210 is pushed towards the direction of the lamp neck 220, and then the lamp neck 220 is clamped with the inner sleeve 210 in a rotating mode; the heat sink 10 is provided with a positioning groove 1210, and the positioning groove 1210 is located on the inner side wall of the heat dissipation column 120. The inner sleeve 210 is provided with a clamping groove 2140, the power supply 50 comprises a power supply board 510, the power supply board 510 is clamped into the clamping groove 2140, so that the power supply 50 is fixed, the number of the clamping grooves 2140 is set according to the shape of the power supply board 510, for example, when the power supply board 510 is in a two-dimensional shape, the number of the clamping grooves 2140 is 2. In addition, in other embodiments, the clamping groove may be configured as a rib, and the power board 510 is fixed in the inner sleeve 210 by using upper and lower ribs or two mutually perpendicular ribs on the inner wall edge of the inner sleeve 210, but the invention is not limited thereto. The power supply 50 may further include electronic components, such as a transformer, a capacitor, a resistor, an inductor, a fuse, a MOS tube, etc., which are more likely to generate heat when the power board 510 is inserted into the inner housing 210, or which generate higher temperature when the LED lamp is operated, such as a transformer, a capacitor, or a MOS tube, which are disposed near the bottom end of the inner housing 210 in the layout design of the power board 510, that is, near the inlet of the airflow channel of the heat sink 10 than other electronic components. Because the paths of the cold air flowing to the electronic components with higher temperature are shortest when the electronic components with higher working temperature, such as a transformer, a capacitor or a MOS tube, are close to the bottom end of the inner sleeve 210, the electronic components with serious heat can be well radiated, the temperature in the cavity of the lamp housing 20 is further reduced, and the working stability of the LED lamp is further improved. The inner sleeve 210 is provided with a positioning post 2120 corresponding to the positioning groove 1210 of the radiator 10, and the positioning post 2120 is inserted into the positioning groove 1210 to push the inner sleeve 210 towards the radiator 10, so as to realize the buckling of the inner sleeve 210 and the radiator 10.

As shown in fig. 65a to 65e, when the LED lamp is assembled, the lamp cap 230 is screwed with the lamp neck 220, then the power board 510 is clamped into the clamping groove 2140 on the inner side of the inner sleeve 210, then the lamp neck 220 is connected with the inner sleeve 210, and the positioning post 2120 on the outer side of the inner sleeve 210 is inserted into the positioning groove 1210 of the radiator 10, so that the inner sleeve 210 penetrates from the central cavity of the radiator 1 to the bottom of the radiator 1; finally, the lamp panel 3 is fixed to the heat sink 1 by, for example, riveting, and then the lamp cover 40 is fastened to the heat sink 10. The lamp body structure is characterized in that the lamp body structure is provided with a plurality of bolts, the bolts are arranged on the bolts, and the bolts are connected with the bolts.

As shown in fig. 65c, the heat dissipation fins include a first heat dissipation fin 1110 and a second heat dissipation fin 1120, the first heat dissipation fin 1110 and the second heat dissipation fin 1120 are alternately arranged at intervals, the second heat dissipation fin 1120 is provided with a clamping groove 150, the clamping groove 150 is correspondingly arranged with a clamping strip 2130 at the outer side of the inner sleeve 210, and the connection strength between the inner sleeve 210 and the heat sink 10 is enhanced.

As shown in fig. 65c and 65b, the shape of the inner sleeve 210 is a hollow column, the inner cavity of the inner sleeve 210 may be a channel structure with a wide bottom and a narrow top (the cross-sectional area of the lower part of the inner sleeve 210 is smaller than that of the upper part), the height-width ratio of the whole inner sleeve structure is greater than 2.5, and the chimney effect is more obvious, preferably 2.5-10. The overall height H of the inner sleeve 210 may be 40-80 mm, according to the standard of the most common a19, a20 and a67 bulb lamps in the market. The structure with the wide lower part and the narrow upper part can strengthen the effect of the chimney effect and help to promote the air flow in the inner sleeve 210. The top end of the inner sleeve 210 is connected with the top dredging channel of the lamp neck 220, and after the hot air in the inner sleeve 210 is collected to the top end of the inner sleeve, the hot air can be transmitted to the heat dissipation holes 2220 of the lamp neck 220 through the top dredging channel of the lamp neck 220 and then discharged out of the lamp housing 20, so that the purpose of heat dissipation is achieved. The dimensions of the inner sleeve 210 described above are merely representative of one manner of implementation and are not intended to limit the scope of what is claimed.

The heat dissipation method of the LED lamp comprises the following steps:

in this embodiment, the heat dissipation method of the LED lamp includes heat dissipation of the LED chip 311 and heat dissipation of the power supply, wherein

As shown in fig. 1, 4 and 6, the heat dissipation of the LED chip 311 (heat generated when the LED chip 311 operates) includes the steps of:

S101, arranging a lamp panel 3, and mounting an LED chip 311 on the lamp panel 3 so as to transfer at least part of heat generated during the operation of the LED chip 311 to the lamp panel 3 in a heat conduction manner;

s102, a radiator 1 is arranged, the lamp panel 3 is arranged on the radiator 1, at least part of heat generated during the operation of the LED chip 311 can be transferred to the radiator 1 in a heat conduction mode through the heat of the lamp panel 3, and the heat is radiated to the surrounding air through the radiator 1, and the hot air is convected out in a convection mode.

The step S102 specifically includes:

a. the radiator 1 is provided with radiating fins 11, the radiator 1b comprises a second radiating channel 7b, the second radiating channel 7b is provided with a second air inlet hole 1301, and convection air enters into the space between the radiating fins 11 through the second air inlet hole 1301 to take away heat radiated to the air by the radiating fins 11, wherein the second air inlet hole 1301 is arranged in the lower area of the radiator 1;

b. the radiator 1 is provided with a third heat dissipation channel 7c, the third heat dissipation channel 7c is formed in a space between two heat dissipation fins 11 or between two sheet bodies extending from the same heat dissipation fin 11, a radially outer part between the two heat dissipation fins 11 forms an inlet of the third heat dissipation channel 7c, air enters the third heat dissipation channel 7c from a radially outer area of the LED lamp, and heat radiated to the air by the heat dissipation fins 11 is taken away.

As shown in fig. 21, in this embodiment, at least one heat dissipation fin 11 is divided into two parts in the radial direction of the LED lamp, and the two parts are arranged at intervals in the radial direction of the LED lamp, so that a flow channel is formed at the intervals, and when the heat dissipation of the heat sink 1 is performed, the air convected can convect at the intervals, so that the convection efficiency is improved.

When the LED chip 311 radiates heat, preferably, the heat radiation area of the radiator 1 with 20 to 30 square centimeters is configured for the power of each watt of the LED lamp, so that the heat radiation effect of the LED chip 311, the volume and the weight of the radiator 1 are balanced better, and the volume and the weight of the radiator 1 are controlled under the condition that the heat radiation effect can be ensured. In this embodiment, in order to provide the LED lamp with a larger heat dissipation area, the weight of the heat sink 1 is configured to be 50% or more, preferably 55% to 65%, of the LED lamp, and the volume of the heat sink 1 is configured to be 20% or more, preferably 25% to 50%, of the volume of the LED lamp.

As shown in fig. 40, when heat dissipation is performed for the LED chips 311, at least a part of the heat dissipation fins 11 are projected in the height direction (axial direction) of the LED lamp (projected to the plane in which the LED chips 311 are located) to contact at least one LED chip 311, that is, in the height direction (axial direction) of the LED lamp, at least a part of the heat dissipation fins 11 are projected to overlap or partially overlap with at least one LED chip 311. Therefore, in the heat dissipation process, the heat conduction path of the LED chip 311 is shorter, so that the thermal resistance can be reduced, and the heat conduction is facilitated. Preferably, the projection of any one of the heat dissipation fins 11 in the height direction (axial direction) of the LED lamp (projection onto the plane of the LED chip 311) contacts at least one LED chip 311.

As shown in fig. 1 and 29, when the LED chip 311 radiates heat, the lamp panel 3 has an inner boundary 3002 and an outer boundary 3003, and after the inner boundary 3002 and the outer boundary 3003 extend along the axial direction of the LED lamp, a region is formed, and the heat dissipation fins 11 are configured such that the area of the heat dissipation fins 11 located in the region is larger than the area of the heat dissipation fins 11 located outside the region, so that most of the heat dissipation fins 11 of the heat sink 1 correspond to the lamp panel 3, thereby improving the utilization rate of the heat dissipation fins 11 and increasing the effective heat conduction area of the heat dissipation fins 11 to the LED chip 311.

As shown in fig. 4, in one embodiment, the method for heat dissipation of the power supply (heat generated by the power supply when the LED lamp is in operation) includes the following steps:

s201, a lamp housing 2 with a first heat dissipation channel 7a is arranged, and a power supply 5 is arranged in the first heat dissipation channel 7a, wherein the first heat dissipation channel 7a is provided with a first air inlet 2201 and a heat dissipation hole 222;

s202, the convection air enters the first heat dissipation channel 7a from the first air intake hole 2201, the heat generated when the power supply 5 operates is radiated to the surrounding air, and the convection air discharges the hot air from the heat dissipation hole 222 by convection. Thus, the power supply 5 can be prevented from working in a high-temperature environment, and the service life and the working quality of the power supply are affected.

As shown in fig. 22, at least one heat generating component 501 (resistor, inductor, integrated circuit, transformer or rectifier bridge, etc.) is provided in the first heat dissipation path 7a at a position close to the lamp cap 23, and when projected in a direction perpendicular to the axial direction of the LED lamp, the at least one heat generating component 501 transfers heat to the lamp cap 23 by heat conduction or heat radiation, and dissipates heat to the air or to a lamp holder connected thereto through the lamp cap 23.

In other embodiments, at least one heat generating component 501 is in thermal contact with the lamp cap 23, at least one heat generating component 501 is located in the lamp cap 23, and the heat generating component 501 is in contact with the lamp cap via a thermally conductive material 53, and the heat generating component 501 is secured to the lamp cap 23 via the thermally conductive material 53. Accordingly, by the arrangement of the heat conducting material 53, the effect of heat conduction to the lamp cap can be achieved, the effect of fixing the heating component can be achieved, and the heating component 501 is prevented from loosening.

In the heat dissipation design of the power supply 5, the position of the at least one heat generating component 501 in the axial direction of the LED lamp is higher than the position of the heat dissipation hole 222, and most of the heat generating component 501 higher than the heat dissipation hole 222 is dissipated through the lamp cap 2 or other means.

In the heat dissipation design of the power supply 5, at least one heat generating component and other heat generating components are disposed on different surfaces of the power supply board 51, and when air is convected, heat radiated to the surrounding air by the heat generating components is taken away along the two side surfaces respectively.

The assembling method of the LED lamp comprises the following steps:

as shown in fig. 2, in an embodiment, the method for assembling the LED lamp includes the following steps:

s301, configuring a lamp panel 3, and arranging an LED chip 311 on the lamp panel 3;

s302, configuring a radiator 1;

s303, configuring a power supply 5;

s304, configuring a lamp housing 2;

the order in the above steps S301 to S304 may be arbitrarily set,

s305, the power supply 5 is arranged in the lamp housing 2;

s306, the lamp housing 2 is arranged on the radiator 1, and the electric connection between the power supply 5 and the lamp panel 3 is realized;

s307, a lampshade 4 is arranged, and the lampshade 4 is fixed on the radiator 1 to cover the lamp panel 3, so that light generated by the LED chip 311 is emitted through the light output surface 43 of the lampshade 4.

In the above steps, the order of the steps may be adjusted according to the actual assembly requirement. In the above step, after step 304, the lamp panel 3 may be connected to the heat sink 1 in a fitting manner, so that the lamp panel 3 is formed integrally with the heat sink 1.

In step S304, when the lamp housing 2 is configured, threads are provided on the base 23 and the neck 22, respectively, so that the base 23 and the neck 22 are directly connected by the threads.

In step S307, the inner sleeve 21 of the lamp housing 2 is first connected to the heat sink 11 by a detachable connection method such as a snap fit or a snap fit. Here, after the lamp housing 2 is mounted, the inner sleeve 21 and the lamp housing 2 may be integrally and directly connected to the heat sink 11, or after the inner sleeve 21 is separately connected to the heat sink 1, other components of the lamp housing 2 and the inner sleeve 21 may be fixed, that is, the neck 22 and the inner sleeve 21 may be connected and fixed.

As shown in fig. 31 and 60, the connection structure and method of the inner case 21 and the heat sink 1 are specifically as follows: the heat sink 1 has a central hole, the surface of the inner sleeve 21 has a bump 217, the bump 217 has a first limit surface 2171, which is protruded on the outer peripheral surface opposite to the outer peripheral surface of the inner sleeve 21, and the space between the heat dissipation fins 11 of the heat sink 1 is larger than the width of the bump 217 in the radial direction, when the inner sleeve 21 is inserted into the central hole of the heat sink 1, the bump 217 is aligned with the space between the two heat dissipation fins 11 and is inserted into the heat sink 1 until the first limit surface 2171 of the bump 217 exceeds the bottom surface of the heat dissipation fins 11 in the axial direction of the LED lamp, at this time, the inner sleeve 21 is rotated to make the first limit surface 2171 abut against the bottom surface of the heat dissipation fins 11, besides, the inner sleeve 21 has a second limit surface 218, when the first limit surface 2171 abuts against the bottom surface of the heat dissipation fins 11, thereby connecting the inner sleeve 21 with the heat sink 1, and having no need of external components such as bolts, and the assembly and disassembly are more convenient. When the inner sleeve 21 is to be removed, the above steps are reversed.

Preferably, the inner sleeve is provided with a third limiting surface 2172, the third limiting surface 2172 is located at one side of the protruding block 217 in the circumferential direction of the inner sleeve 21 to limit the rotation of the heat dissipation fins 11, when the inner sleeve 21 is mounted to the heat dissipation device 1, the protruding block 217 is aligned between the two heat dissipation fins 11 and is inserted into the heat dissipation device 1 until the first limiting surface 2171 of the protruding block 217 exceeds the bottom surface of the heat dissipation fins 11 in the axial direction of the LED lamp, at this time, the inner sleeve 21 is rotated to enable the first limiting surface 2171 to abut against the bottom surface of the heat dissipation fins 11 until the side part of the heat dissipation fins 11 abuts against the third limiting surface 2172, so as to prevent the first limiting surface 2171 from being dislocated with the heat dissipation fins 11 due to excessive rotation.

As shown in fig. 59a to 59b, the method of connecting the inner sleeve 21 and the neck of the lamp housing 2 is as follows: the inner sleeve 21 is provided with a first positioning unit 211, and the lamp neck 22 is provided with a second positioning unit 221, wherein the first positioning unit 211 is buckled with the second positioning unit 221. Specifically, the first positioning unit 211 is a fastening portion formed on the inner sleeve, the second positioning unit 221 is a fastener formed on the neck, and the fastening portion is directly fastened to the fastener.

As shown in fig. 31 to 33, in step S308, a specific connection method between the globe 4 and the heat sink 1 is as follows: the lamp shade 4 is provided with a buckling part 46, and the corresponding part of the radiator 1 is provided with a hole, so that the buckling part 46 of the lamp shade 4 passes through the gap and is clamped on the back 134 of the radiating base 13.

Fig. 71 is a schematic diagram of a circuit layout of an LED module in some embodiments. Fig. 72 is an enlarged schematic view at D in fig. 71. Fig. 73 is a second schematic circuit layout of an LED module in some embodiments. Both the LED module in fig. 71 and the LED module in fig. 72 can be applied to the LED lamp of fig. 1. As shown in fig. 71, 72 and 73, the LED module 70 includes at least one LED unit 710. The LED units 710 are two or more, and are connected in parallel. Each LED unit 710 includes at least one LED711. When one LED unit 710 includes a plurality of LEDs 711, the LEDs 711 of the same LED unit 710 are connected in series, the positive terminal of a first LED711 is coupled to the positive terminal of the LED unit 710, and the negative terminal of the first LED711 is coupled to the next or second LED711. While the positive terminal of the last LED711 is coupled to the negative terminal of the previous LED711 and the negative terminal of the last LED711 is coupled to the negative terminal of the LED unit 710.

As shown in fig. 71, in some embodiments, the LED module 70 includes five LED units 710, and in the illustration, the LED modules 70 are distributed on two circumferences, that is, an inner circumference and an outer circumference, wherein two complete LED units 710 are disposed on the inner circumference, and two complete LED units 710 are disposed on the outer circumference, and the fifth LED unit 710 has most of its LEDs 611 disposed on the outer circumference, and a small portion of its LEDs 611 disposed on the inner circumference, that is, the fifth LED unit 710 has fewer LEDs 711 disposed on the inner circumference than the LEDs 711 disposed on the outer circumference.

As shown in fig. 73, in some embodiments, the LED module 70 includes 10 LED units 710, and the LED modules 70 are shown distributed on three circumferences, that is, an inner circumference, a middle and an outer circumference, wherein two complete LED units 710 are disposed on the inner circumference, four complete LED units 710 are disposed on the outer circumference, three complete LED units 710 are disposed on the middle, and a tenth LED unit 710 has most of its LEDs 711 disposed on the inner circumference and a few LEDs 711 disposed on the outer circumference, that is, the tenth LED unit 710 has more LEDs 711 disposed on the inner circumference than LEDs 711 disposed on the outer circumference.

The number of LEDs 711 in the LED unit 710 is preferably 10 to 20, more preferably 12 to 16.

As shown in fig. 71, 72 and 73, the LEDs 711 are disposed on the lamp panel 3 substantially along the circumferential direction of the lamp panel 3, and if the LEDs 711 of the same LED unit 710 are all located on the same circumference, the LEDs 711 are all connected by the first wire 712, in other words, the series connection between the LEDs 711 on the same circumference is realized by the first wire 712. If the LEDs of the same LED unit 710 are divided into two parts, one of which is located on one circumference and the other of which is located on a different circumference, the LEDs 711 on the same circumference of the same LED unit 710 are connected by a first wire 712, and the LEDs 711 on the different circumferences of the same LED unit 710 are connected by a second wire 713, the width of the second wire 713 is smaller than that of the first wire 712, so that the arrangement of the LEDs 711 is better, and if the width of the second wire 713 is too large, the spacing of the related LEDs 711 on the corresponding circumference is affected, so that the spacing is significantly larger than that of the other LEDs 711.

As shown in fig. 71, 72 and 73, the first conductive wire 712 has a width at least greater than the width of the LED711 (LED chip 311), and the first conductive wire 712 is made of a metal material having good heat conduction property, which is beneficial to heat dissipation of the LED711 (LED chip 311), and the width of the first conductive wire 712 is at least greater than the width of the LED711 (LED chip 311), which is more beneficial to mounting of the LED711, so that it is easier to form electrical connection with the first conductive wire 712.

As shown in fig. 71, 72 and 73, the LEDs 711 are distributed on different circumferences on the lamp panel 3, that is, the lamp panel 3 has at least two sets of circumferences on which the LEDs 711 are disposed, the two sets of circumferences being substantially concentric. The first wires 712 are used when the LEDs 711 on the innermost or outermost circumference are connected in series, wherein at least part of the first wires 712 have a larger width than the other first wires 712, and the first wires 712 are used when the LEDs 711 on the innermost or outermost circumference are connected in series, and have no limitation in width because no other LEDs 711 are arranged on the outer or inner side of the first wires 712, so that the first wires 712 are used when the LEDs 711 on the innermost or outermost circumference are connected in series are provided with expansion parts 7121 on the inner or outer side in the radial direction, and the width of the first wires 712 is increased, thereby increasing the area of the first wires 712 and facilitating heat dissipation. Taking fig. 73 as an example, it has three circumferences where LEDs 711 are arranged, wherein the width of the first wire 712 on the innermost and outermost circumferences is significantly larger than the width of the first wire 712 on the circumference of the middle side.

As shown in fig. 71 and 72, the lamp panel 3 is provided with a hole 301 for mounting the lamp panel 3, and the lamp panel 3 is riveted or screwed on the heat dissipation base 13 through the hole 301, and the hole 301 occupies space, so that the first wire 712 corresponding to the hole 301 is located at the inner side or the outer side of the first wire 712 on the same circumference, thereby avoiding the hole 301. And the width of the first wire 712 with the expanding portion 7121 is smaller than the width of the first wire corresponding to the hole site 301, so that the width of the first wire 712 avoiding the hole site 301 can be reduced.

As shown in fig. 71 and 72, in the direction perpendicular to the light panel 3, the area of the single LED711 is M1, and in the direction perpendicular to the light panel 3, the single LED711 is projected onto the light panel 3, and the area covered by the single LED711 includes the first wire 712 having an area of M2, which satisfies the following relationship: m2: m1=1: (0.85 to 0.96), preferably M2: m1=1: (0.9-0.96). So that the LED611 may correspond to more area of the first wire 711 available for heat dissipation.

As shown in fig. 71 and 72, the different LED units 710 are connected by a third wire 714, the third wire 714 being connected to the positive electrode of the first LED711 of the two different LED units 710, or the third wire 714 being connected to the negative electrode of the last LED711 of the two different LED units 710. The third conductive line 714 has a smaller width than the first conductive line 712.

As shown in fig. 71 and 72, the LED module 70 includes two electrode terminals, a positive electrode terminal 701 and a negative electrode terminal 702 as shown in the present embodiment, and the positive electrode terminal 701 and the negative electrode terminal 702 are located further inside in the radial direction of the lamp panel 3 of the LED lamp than either one of the LEDs 711, the first wire 712, the second wire 713, or the third wire 714. In other embodiments, the positive terminal 701 and the negative terminal 702 may be disposed further outside the LED panel in the radial direction than any one of the LED711, the first wire 712, the second wire 713, and the third wire 714. So that the positive terminal 701 and the negative terminal 702 facilitate connection to the power supply 5. In addition, the positive electrode terminal 701 and the negative electrode terminal 702 have different shapes to facilitate discrimination.

Please refer to fig. 74-82. In an embodiment of the present application, a power module for supplying power to an LED lamp is provided, including: an input (ACN, ACL) for receiving an ac drive signal; a first rectifying circuit 100 for converting the ac drive signal into a rectified signal; a filter circuit 200 for converting the rectified signal into a filtered signal; a power conversion circuit 400 for converting the filtered signal into a power signal capable of lighting the LED light source 500; a bias voltage generating circuit 600 connected to the input terminals (ACN, ACL) and the power conversion circuit 400; the bias voltage generating circuit 600 can step down the ac driving signal to form the operating voltage of the power conversion circuit 400.

In the power module provided in this embodiment, the bias voltage generating circuit 600 is provided to step down the ac driving signal to form the operating voltage of the power conversion circuit 400, so as to provide the operating voltage for the power conversion circuit 400, so that the power conversion circuit 400 operates to drive and light the LED light source 500. Therefore, the power module uses the bias voltage generating circuit 600 to perform power conversion on the externally input ac driving signal in an active power conversion manner, so as to quickly form the working voltage required by the power conversion circuit 400, thereby effectively improving the starting speed of the LED lamp.

When the power supply module in the embodiment shown in fig. 75-82 is utilized, the starting speed of the HID-LED can be reduced to about 60ms, which has very high application value and good use experience.

The power supply module may be suitable for use in a high power LED lamp, wherein the output power of the power conversion circuit 400 may be above 30W. As shown in fig. 2, the input terminals may be two pins of the power module: a first pin ACL and a second pin ACN. An ac drive signal is input through two pins. The ac driving signal may be a 220V ac signal or an ac signal having another voltage value. Of course, the input terminal (ACN, ACL) may also have a plurality of pins, for example, four pins, etc., only need to be able to input alternating current, which is not limited in this application.

In the embodiment of the present application, the first rectifying circuit 100 may be a bridge rectifying circuit. As shown in fig. 76, fig. 76 is a schematic diagram of a rectifying circuit and a filtering circuit according to an embodiment of the present application. The first rectifying circuit 100 includes diodes D7, D8, D9, D10. The first rectification circuit 100 may full-wave rectify an alternating current driving signal (alternating current) to generate a direct current driving signal (direct current).

Specifically, as shown in fig. 76, an anode of the diodes D7 and D9 is electrically connected to the first end of the filter circuit 200, cathodes of the diodes D7 and D9 are electrically connected to anodes of the diodes D8 and D10, respectively, and cathodes of the diodes D08 and D10 are electrically connected to the second end of the filter circuit 200. The connection point of the diode D7 and the diode D8 is electrically connected to the first pin ACL. The anodes of the diodes D7 and D9 are electrically connected to one end of the filter circuit 200, the cathodes are electrically connected to the anodes of the diodes D8 and D10, and the cathodes of the diode D8 are electrically connected to the cathodes of the diode D10. The connection point of the diodes D9 and D10 is electrically connected to the second pin ACN.

In addition, the first rectifying circuit 100 may be a full-wave rectifying circuit or a half-wave rectifying circuit of other types, without affecting the functions to be achieved by the scheme of the present invention.

In the present embodiment, the filter circuit 200 includes capacitors C1 and C2 and an inductor L1. The first ends of the capacitor C1 and the inductor L1 are electrically connected to the cathodes of the diodes D8 and D10 as the second ends of the filter circuit 200, the second ends of the inductor L1 are electrically connected to the first ends of the capacitor C1, and the second ends of the capacitor C1 and the capacitor C2 are electrically connected to the anodes of the diodes D7 and D9 as the first ends of the filter circuit 200. The filter circuit 200 receives the direct current (rectified signal) rectified by the first rectifying circuit 100, and filters out high frequency components in the direct current. The waveform of the direct current filtered by the filter circuit 200 is a smooth direct current waveform. The filtered signal is provided to the subsequent stage via

connections

301 and 302.

In some embodiments, the filtering circuit 200 may also include only the capacitor C1 to implement the filtering function without affecting the functions intended in the present application.

In the embodiment of the present application, an electromagnetic interference suppression circuit 900 (may also be referred to as an EMI suppression circuit) as shown in fig. 75 may be further provided between the input terminals ACN and ACL and the rectifier circuit 100. The electromagnetic interference suppression circuit 900 can reduce the influence of the interference magnetic field on the drive signal. In the electromagnetic interference suppression circuit 900, an exciting coil LF2 is connected to a power line (bus or trunk) to which two pins of input terminals ACN and ACL are connected, and a resistor branch (for example, a branch where a resistor R1 is located) and a plurality of capacitor branches (for example, capacitors CX2, CX1, and CX 3) to which the trunk is connected are electrically connected to inductances Li1 and Li2 on the two trunk, respectively.

Of course, the EMI suppression circuit 900 may employ an EMI filter circuit having a plurality of filter components thereon, and in particular, the EMI filter circuit has a differential mode capacitance, a common mode inductance, and a common mode capacitance.

In the present embodiment, the power conversion circuit 400 can convert the filtered signal into a power signal capable of lighting the LED light source 500. The power conversion circuit 400 may change the voltage value of the filtered signal to form a dc drive signal of a target voltage value. The power conversion circuit 400 has an output terminal to output a direct current driving signal of a target voltage to the LED light source 500.

In addition, a fuse F1 may be connected in series to the main line to which the input terminals ACN and ACL are connected. The fuse F1 may be a current fuse or a temperature fuse, and the present embodiment is not limited thereto.

Fig. 78 is a schematic diagram of a power conversion circuit according to an embodiment of the present application. As shown in fig. 74 and 78, the power conversion circuit 400 receives signals supplied from a front stage circuit through

connection terminals

401 and 402, and supplies the generated power signals to a rear stage through

connection terminals

501 and 502, wherein the power conversion circuit 400 can employ a PWM (Pulse Width Modulation) circuit to realize output of a target signal by controlling pulse width. Specifically, the power conversion circuit 400 may include a controller U2, a power switch Q2, a voltage transformer T2, and a diode D10, and output a power signal (dc driving signal) with a desired voltage value and/or current value through cooperation of the controller U2, the power switch Q2, and the diode D10 with an energy storage coil (a coil of the voltage transformer T2 connected in series between the power switch Q2 and the connection terminal 502). The switching controller U2 is started in response to the operating voltage VCC signal supplied by the bias voltage generating circuit 600, so as to output a PWM control signal to control the switching of the power switch Q2, so that the energy storage coil is repeatedly charged and discharged in response to the switching of the power switch Q2, and maintains a freewheeling current through the diode D4, thereby forming a desired power signal between the connection terminal 501 and the connection terminal 502.

The power switch Q2 may be a MOS switch tube. A first terminal (power terminal) of the controller U2 is connected to the output terminal of the bias voltage generating circuit 600, and a second terminal of the controller U2 is connected to one terminal of the induction coil of the voltage transformer T2. One end of the energy storage coil of the voltage transformer T2 is connected to the negative end (i.e., the connection end 502) of the dc output end, and the other end is connected to the anode of the diode D4. The anode of diode D4 is connected to the positive terminal of the dc output (i.e., connection 501). One end of an induction coil of the voltage transformer T2 connected with the second end of the controller U2 is grounded. The third end of the controller U2 is connected with the control end of the power switch Q2 through a resistor R9, the first end of the power switch Q2 is connected with a connection point between the diode D4 and the voltage transformer T2, and the second end of the power switch Q2 is connected with the fourth end of the controller U2. The power conversion circuit 400 may also be provided with a sampling circuit to sample its operating state and serve as a reference for the output signal of the controller U2.

For example, the sampling circuit comprises, for example, an induction coil comprising resistors R8 and R10, a capacitor C6 and a voltage transformer T2, wherein the controller U2 may sample the bus voltage from the resistor R8 and the capacitor C6 through a first terminal, the output current from the induction coil through a second terminal, and the current flowing through the power switch Q2 from one terminal of the resistor R10 through a fourth terminal. The setting of the sampling circuit is related to the control mode of the controller U2, and the disclosure is not limited thereto.

In this embodiment, at least one end of the switch controller U3 is connected to the branch where the inductor L2 is located, and a filtering component and/or a current stabilizing component may be disposed between the switch controller and the inductor, which is not limited in this application.

To mitigate the effects of harmonics on circuit characteristics, conversion losses are reduced. A power factor correction circuit 300 may also be provided between the power conversion circuit 400 and the filter circuit 200. The power factor correction circuit 300 is capable of boosting the power factor of the filtered signal by adjusting signal characteristics (e.g., phase, level, or frequency, etc.) of the filtered signal; the power factor correction circuit 300 is connected to the output of the bias voltage generating circuit 600. Specifically, the PFC circuit is a PFC circuit, and the PFC circuit may be an active PFC circuit 300.

Fig. 77 is a schematic diagram of a power factor correction circuit according to an embodiment of the present application. As shown in fig. 77, the power factor correction circuit 300 may receive signals from the filter circuit 300 through

connection terminals

301 and 302 and transmit corrected signals to a power conversion circuit 400 of a later stage through

connection terminals

401 and 402, and the power factor correction circuit 300 includes a controller U1, a power switch Q1 connected to the controller U1, a voltage transformer T1, and a diode D3. The power switch Q1 may be a MOS switch tube. A first terminal (power terminal) of the controller U1 is connected to the output terminal 607 of the bias voltage generating circuit 600. The second end of the controller U1 is connected with one end of the voltage transformer T1, one coil of the voltage transformer T1 is connected in series on the trunk, and the other end of the coil connected with the second end of the controller U1 is grounded. The main circuit is connected to the positive terminal of the dc output terminal (which may also be referred to as the third pin 501). Diode D3 is connected in series on the trunk. The anode of the diode D3 is connected to one end of the voltage transformer T1 and the filter circuit 200, and the cathode is connected to a connection terminal 401 to connect the end power conversion circuit 400 and the third pin 501. The third end of the controller U1 is connected with the power switch Q1, and one end of the power switch Q1 is connected with a fifth connection point between the diode D3 and the voltage transformer T1. The controller U1 may also be connected with a sampling circuit (a connection point between the resistor R2 and the capacitor C3 is connected with the controller U1, and the capacitor C3 is connected with the resistor R3 in parallel), and other circuits, which may be specifically shown with reference to fig. 5.

Of course, it is considered that the PFC circuit has various implementation forms, and all of them can be cited in the present embodiment, and will not be described in detail here.

Fig. 79 is a schematic diagram of a bias voltage generating circuit of the first embodiment of the present application. Referring to fig. 75 and 79, the bias voltage generating circuit 600a may include a power taking unit 610, a switch controller U3, and a power storing and freewheeling unit 630. The power taking unit 610 is connected to the input terminal (ACN, ACL) and the switch controller U3. The switch controller U3 is connected to the energy storage freewheel unit 630. The energy-storing and freewheeling unit 630 has an output 607 for outputting an operating voltage. The output terminal 607 is connected to the power conversion circuit 400 to supply an operating Voltage (VCC) to the power conversion circuit 400.

The switch controller U3 controls the switching frequency of the energy storage freewheel unit 630 according to the power-taking signal of the power-taking unit 610 to form the working voltage of the power conversion circuit 400, and outputs the working voltage to the power conversion circuit 400 by using the output terminal 607. The switch controller U3 is started in response to the power-taking signal of the power-taking unit 610, and repeatedly charges and discharges energy by controlling the on time of the energy-storing and freewheeling unit 630, and maintains freewheeling by the diode D5, thereby forming the operating voltage of the power conversion circuit 400, and outputs the operating voltage to the power conversion circuit 400 by the output terminal 607.

In a specific embodiment, the power extraction unit 610 is capable of converting the ac driving signal into a dc power extraction signal equal to the voltage of the ac driving signal. As shown in fig. 75 and 79. The power taking unit 610 may be implemented by a second rectifying circuit (hereinafter referred to as a second rectifying circuit 610). The second rectifying circuit 610 includes a first diode D1 and a second diode D2 that are connected in series and have opposite polarities (i.e., cathodes of the first diode D1 and the second diode D2 are connected together). The second rectifying circuit 610 is provided with a power taking end 601 between the first diode D1 and the second diode D2. The power taking end 601 is connected with the switch controller U3. The first diode D1 and the second diode D2 with opposite polarities rectify the ac driving signal, and then output a dc driving signal at the power supply terminal 601.

Specifically, the power-taking terminal 501 is further connected to one end of the first capacitor C9, and the other end of the first capacitor C9 is connected to the ground GND. The switch controller U3 is connected to one end of the inductor L2, and the other end of the inductor L2 is connected to the output end 607. The inductor L2 can play roles of energy storage and energy release freewheeling when the switch controller U3 performs switching.

In this embodiment, the energy storage flywheel unit 630 may include an inductance L2, a third diode D5, and a second capacitor C11. A connection terminal 603 is provided between the switch controller U3 and the inductor L2. The connection terminal 603 is connected to the cathode of the third diode D5, and the anode of the third diode D5 is connected to the ground terminal GND. A second connection point 604 is provided between the inductance L2 and the output 607. The second connection point 604 is connected to one end of the second capacitor C11, and the other end of the second capacitor C11 is connected to the ground GND. A third connection point (not shown in fig. 75) is further provided between the second connection point 604 and the output terminal 607, and the third connection point is connected to one end of a load resistor, and the other end of the load resistor is connected to the ground GND.

Further, the switch controller U3 may be a MOS switch, and specifically may be an IC chip integrated with the MOS switch. Of course, in some embodiments, the switch controller U3 may be a switching transistor such as a triode. The switch controller U3 has a plurality of connection terminals, which may also be referred to as connection ports. Wherein, a power-taking branch is formed between the power-taking end 601 and the ground end GND; the first capacitor C9 is connected in series to the power take-off branch. At least one connection end of the switch controller U3 is connected to the power taking end 601 through a power taking branch, and the power taking branch and a branch where the inductor C9 is located are connected to the power taking end 601 through a fourth connection point 602. The ground GND is connected to the ground line 640, and the third diode D5, the second capacitor C11, and the load resistor are all connected to the ground line 640.

The bias voltage generating circuit 600 may also be provided with a sampling circuit to sample its operating state and serve as a reference for the output signal of the switch controller U3.

For example, the sampling circuit may include a first sampling circuit 650, and a second sampling circuit 620. The first sampling circuit 650 is connected to the power-taking terminal 601 (a connection point 605 is formed in fig. 79) and the switch controller U3. The second sampling circuit 620 is connected to the output end 607 and the switch controller U3. The switching controller U3 controls a switching frequency according to the sampling signals of the first and

second sampling circuits

650 and 620 to output a stable operating voltage. The setting of the sampling circuit is related to the control mode of the switch controller U3, and the disclosure is not limited thereto. FIG. 7 is a schematic diagram of a bias voltage generating circuit according to a second embodiment of the present application;

in a further embodiment, the bias voltage generating circuit may also be used to provide an operating voltage to the temperature detecting circuit 700, wherein fig. 7 is a schematic diagram of the bias voltage generating circuit according to the second embodiment of the present application, and fig. 81 is a schematic diagram of the temperature detecting circuit according to an embodiment of the present application. As shown in fig. 80 and 81, the temperature detection circuit 700 is connected to the power conversion circuit 400 to transmit a temperature detection signal to the power conversion circuit 400. The temperature detection circuit 700 may be provided with a temperature sensor that may be connected to the bias voltage generating circuit 600b, so that the bias voltage generating circuit 600b supplies an operating voltage to the temperature sensor.

In this embodiment, compared with the aforementioned embodiment of fig. 79, the bias voltage generating circuit 600b of the present embodiment further includes the transistor Q3, the diode D6, the resistor R12 and the capacitor C10. The transistor Q3 may be exemplified by a transistor (hereinafter referred to as a transistor Q3), for example. The temperature detection circuit 700 is connected to the transistor Q3 of the bias voltage generation circuit 600 b. Wherein the collector of transistor Q3 is connected to a sixth connection point between said output 607 and said sixth connection point. An emitter of the triode Q3 is connected with a power supply input end of the temperature sensor. The base of transistor Q3 is connected to a ground line having a ground GND.

Wherein the temperature detection circuit 700 is activated in response to the operating voltage supplied from the

connection terminals

701 and 702 by the bias voltage generating circuit 600b, and feeds back temperature information (Vtemp) to the controller U2 of the power conversion circuit 400. When the temperature exceeds the threshold (i.e., the temperature is too high), the controller U2 of the power conversion circuit 400 can reduce the output power, thereby performing cooling control and ensuring the operation safety of the circuit.

Further, as shown in fig. 82, the temperature detection circuit 700 is further connected to a temperature compensation circuit 800, where fig. 82 is a schematic diagram of the temperature compensation circuit according to an embodiment of the present application. The temperature detection circuit 700 is connected between the temperature compensation circuit 800 and the bias voltage generation circuit 600 b. The temperature compensation circuit 800 is connected to the power conversion circuit 400.

The temperature compensation circuit 800 may make the reference temperature of the free end of the temperature sensor more reasonable. The temperature compensation circuit 800 of the present embodiment may be implemented by (but not limited to) a comparator CP, wherein an input terminal of the comparator CP may receive the voltage indicating the temperature information generated by the temperature detection circuit 700 through the connection terminal 801, and compare the voltage indicating the temperature information with a reference voltage Vref on another input terminal of the comparator CP, so as to determine whether the temperature detected by the temperature detection circuit 700 exceeds the threshold value, and generate a temperature detection signal Vtemp indicating whether the temperature exceeds the threshold value on an output terminal of the comparator CP. The output terminal of the temperature compensation circuit 800 is connected to the controller U2 of the power conversion circuit 400, so that the temperature detection signal Vtemp is fed back to the controller U2 of the power conversion circuit 400, so that the controller U2 can adjust the output power in response to the current system environment temperature.

In other embodiments, the temperature compensation circuit 800 may also have a zener diode and a thermistor thereon. After the thermistor, it is connected to an amplifying circuit by an adjustable potentiometer, and the negative end of the amplifying circuit is connected to the output end of the temperature compensation circuit 800.

Specifically, the circuit diagram of the temperature compensation circuit 800 may be shown in fig. 82, and of course, the circuit shown in fig. 82 is not limited in this application, considering that the implementation forms of the temperature compensation circuit have various forms.

The embodiment of the application also provides a high-power LED lamp, which comprises: an LED light source 500; a power module as in any above, connected to the LED light source 500. The high power LED lamp may be any type of LED lamp having an output power of 30W or more, an LED lamp having an output power equivalent to 30W or more of a xenon lamp, or an LED lamp in which the LED light source 500 is a high power bulb (for example, a bulb having a rated current of more than 20 mA).

Any numerical value recited herein includes all values of the lower and upper values that increment by one unit from the lower value to the upper value, as long as there is a spacing of at least two units between any lower value and any higher value. For example, if it is stated that the number of components or the value of a process variable (e.g., temperature, pressure, time, etc.) is from 1 to 90, preferably from 20 to 80, more preferably from 30 to 70, then the purpose is to explicitly list such values as 15 to 85, 22 to 68, 43 to 51, 30 to 32, etc. in this specification as well. For values less than 1, one unit is suitably considered to be 0.0001, 0.001, 0.01, 0.1. These are merely examples that are intended to be explicitly recited in this description, and all possible combinations of values recited between the lowest value and the highest value are believed to be explicitly stated in the description in a similar manner.

Unless otherwise indicated, all ranges include endpoints and all numbers between endpoints. "about" or "approximately" as used with a range is applicable to both endpoints of the range. Thus, "about 20 to 30" is intended to cover "about 20 to about 30," including at least the indicated endpoints.

All articles and references, including patent applications and publications, disclosed herein are incorporated by reference for all purposes. The term "consisting essentially of …" describing a combination shall include the identified component, ingredient, component or step as well as other components, ingredients, components or steps that do not substantially affect the essential novel features of the combination. The use of the terms "comprises" or "comprising" to describe combinations of components, elements, components or steps herein also contemplates embodiments consisting essentially of such components, elements, components or steps. By using the term "may" herein, it is intended that any attribute described as "may" be included is optional.

Multiple components, ingredients, components or steps can be provided by a single integrated component, ingredient, component or step. Alternatively, a single integrated component, ingredient, part or step may be divided into separate plural components, ingredients, parts or steps. The disclosure of "a" or "an" to describe a component, ingredient, component or step is not to be taken as excluding other components, ingredients, components or steps.

It is to be understood that the above description is intended to be illustrative, and not restrictive. Many embodiments and many applications other than the examples provided will be apparent to those of skill in the art upon reading the above description. The scope of the present teachings should, therefore, be determined not with reference to the above description, but instead should be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. The disclosures of all articles and references, including patent applications and publications, are incorporated herein by reference for the purpose of completeness. The omission of any aspect of the subject matter disclosed herein in the preceding claims is not intended to forego such subject matter, nor should the inventors regard such subject matter as not be considered to be part of the disclosed subject matter.

Claims

1. An LED lamp, comprising:

a lamp housing;

the power supply is positioned in the lamp housing; and

the lamp panel is connected to the radiator and comprises an LED chip, the power supply is electrically connected with the LED chip, a third opening is formed in the lamp panel, and the third opening is respectively communicated with the first radiating channel and the second radiating channel;

the radiating fins comprise first radiating fins and second radiating fins, the bottoms of the first radiating fins and the second radiating fins in the axial direction of the LED lamp are connected with the radiating base, the first radiating fins and the second radiating fins are alternately arranged at intervals, and the shape of the second radiating fins is a Y shape which is divided into two parts.

2. The LED lamp of claim 1, wherein the third opening is provided in a central region of the lamp panel, and the first air intake hole and the second air intake hole respectively intake air from the third opening.

3. The LED lamp of claim 1, wherein the weight of the heat sink is greater than 50% of the weight of the LED lamp and the volume of the heat sink is greater than 20% of the total volume of the LED lamp.

4. The LED lamp of claim 3, wherein the heat sink has a volume of 20% to 60% of the total volume of the LED lamp.

5. The LED lamp of claim 1, further comprising a lamp housing including a light output surface and an end surface, the end surface having ventilation holes therein through which air enters the first and second heat dissipation channels, the first air inlet holes forming a first portion in an area occupied by the LED lamp projected onto the end surface in an axial direction thereof, and other areas on the end surface forming a second portion, the ventilation holes on the first portion having an area larger than an area of the ventilation holes on the second portion.

6. An LED lamp, comprising:

a lamp housing;

the passive heat dissipation assembly comprises a radiator, wherein the radiator comprises heat dissipation fins, and the radiator is connected with the lamp shell;

the power supply is positioned in the lamp housing and comprises a power panel and an electronic component; and

The lamp panel is provided with an inner side boundary and an outer side boundary, the inner side boundary and the outer side boundary extend upwards along the axial direction of the LED lamp to form a region, the surface area of the radiating fins in the region is larger than the surface area outside the region, the axial direction of the LED lamp is vertical to the radial direction of the LED lamp, and the outer contour of the side surface of the LED lamp rotates 360 degrees around the axial line of the LED lamp by a contour line to form the outer contour of the LED lamp;

the radiating fins comprise first radiating fins which are divided into a first part and a second part in the radial direction of the LED lamp, and the first part and the second part are arranged at intervals in the radial direction of the LED lamp and form a spacing area;

the second radiating fins are provided with a third part and a fourth part which are connected through a transition section, the transition section comprises a guide section, and the direction pointed by the tangent line of the guide section comprises a direction which is staggered with the spacing area or is positioned at the radial outer side of the spacing area or is positioned at the radial inner side of the spacing area or falls into the spacing area.

7. The LED lamp of claim 6, wherein the spacer region corresponds to a region of the lamp panel where the LED chip is disposed in an axial direction of the LED lamp.

8. The LED lamp of claim 6 or 7, wherein the fourth portion extends from the third portion, the fourth portion changes position in the circumferential direction as compared to the third portion, and the fourth portion is located radially outward of the heat sink relative to the third portion.

9. The LED lamp of claim 8, wherein any one of the second heat sink fins comprises a third portion and two fourth portions, and the two fourth portions are symmetrically disposed about the third portion as an axis of symmetry.

10. The LED lamp of claim 8, wherein the transition section has a buffer section for preventing air from forming a vortex to hinder convection when the second fin surface is convected radially outward, and a guide section for guiding the convected air to flow radially outward along the second fin surface.

11. The LED lamp of claim 10, wherein the buffer segment and the guide segment are each arcuate in shape and form an "S" or inverted "S" shape.