CN109888473B - Wideband patch antenna bonded with chip - Google Patents
Wideband patch antenna bonded with chip Download PDFInfo
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- CN109888473B CN109888473B CN201910091422.7A CN201910091422A CN109888473B CN 109888473 B CN109888473 B CN 109888473B CN 201910091422 A CN201910091422 A CN 201910091422A CN 109888473 B CN109888473 B CN 109888473B
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Abstract
The invention discloses a chip-bonded broadband patch antenna, which comprises a first layer structure, a second layer structure and a third layer structure which are sequentially arranged from top to bottom, wherein the first layer structure comprises a main radiation patch, a plurality of capacitive patches and a side ground; the second layer structure comprises a dielectric substrate, a substrate integrated waveguide cavity is arranged on the dielectric substrate, an accommodating groove is formed in the top of the substrate integrated waveguide cavity, and the main radiation patch and the capacitive patch are located in the accommodating groove; the third layer structure comprises a metal bottom layer; one end of the feed structure is connected with the main radiation patch, and the other end of the feed structure is connected with the chip through a metal bonding wire. The invention can enable the antenna to present high capacitance at the input end in a wider frequency range, and compensate high inductance brought by a bonding wire, thereby solving the problem of performance deterioration such as impedance mismatch, bandwidth reduction and the like after the traditional broadband antenna is bonded with a chip, and having very high application value in practical engineering application.
Description
Technical Field
The invention relates to the technical field of microwave and millimeter wave antennas, in particular to a chip-bonded broadband patch antenna.
Background
A broadband antenna with a well matched input presents a serious mismatch problem after bonding with a chip due to the high inductance value introduced by the metal bond wires. The inductance value additionally introduced is mainly determined by the length and diameter of the bonding wire and is generally difficult to reduce, and in order to compensate for the inductance value, a method of providing a capacitive structure on the transmission line or the antenna is generally adopted such that the antenna presents a high capacitive impedance at the input end.
However, these methods are difficult to compensate for the inductance introduced by the bond wires in a wide bandwidth, and the additionally introduced capacitive structure may have some negative effect on the performance of the antenna, and thus these antennas are usually narrow-band. This greatly limits the performance of the overall communication system, such as bandwidth and transmission rate.
Therefore, a new technical solution is needed to solve the above problems.
Disclosure of Invention
The purpose of the invention is as follows: in order to overcome the defects in the prior art, a chip-bonded broadband patch antenna structure is provided, which can compensate high inductance introduced by a metal bonding wire in a wider bandwidth, maintain good radiation performance of an antenna and have no negative influence on the performance of the antenna.
The technical scheme is as follows: in order to achieve the above object, the present invention provides a chip-bonded wideband patch antenna, which comprises a first layer structure, a second layer structure and a third layer structure sequentially arranged from top to bottom, wherein the first layer structure comprises a main radiation patch, a plurality of capacitive patches and a side ground; the second layer structure comprises a dielectric substrate, a substrate integrated waveguide cavity is arranged on the dielectric substrate, an accommodating groove is formed in the top of the substrate integrated waveguide cavity, and the main radiation patch and the capacitive patch are located in the accommodating groove; the third layer structure comprises a metal bottom layer; one end of the feed structure is connected with the main radiation patch, and the other end of the feed structure is connected with the chip through a metal bonding wire.
Furthermore, the antenna structure design of the present invention can adopt two feeding modes, which are specifically as follows:
the feed structure comprises a grounding coplanar waveguide, the grounding coplanar waveguide is arranged on the first layer structure, one end of the grounding coplanar waveguide is directly connected with the main radiation patch, the other end of the grounding coplanar waveguide is connected with the chip through a metal bonding wire, and the third layer structure is a whole metal ground without any notch or opening.
The feed structure comprises two grounded coplanar waveguides which are an upper grounded coplanar waveguide and a lower grounded coplanar waveguide respectively, the upper grounded coplanar waveguide and the lower grounded coplanar waveguide are arranged on the first layer structure and the third layer structure respectively, one end of the lower grounded coplanar waveguide is connected with the main radiation patch through a first metalized through hole and used for feeding, the other end of the lower grounded coplanar waveguide is connected with the upper grounded coplanar waveguide through a second metalized through hole and used for ensuring that the bonded structure and the antenna are in the same plane, and the upper grounded coplanar waveguide is connected with the chip through a metal bonding wire.
Furthermore, a main slot along the current direction of the main radiating patch is formed in the main radiating patch, and the current on the main radiating patch is interfered by the slot, so that an extra resonance point is formed to expand the bandwidth.
Furthermore, according to the specific current distribution condition on the capacitive patch, a capacitive slot along the current direction of the main radiating patch is formed on the capacitive patch, and the slot cuts off the current perpendicular to the E surface direction of the antenna on the capacitive patch, so that the radiation performance of the antenna is improved. Meanwhile, the slot changes the current path on the patch and plays a certain role in widening the bandwidth.
Furthermore, the grounded coplanar waveguide on the first layer structure is provided with a central conduction band which is in a tapered or inverted-tapered shape, and the impedance of the feeder line can be finely adjusted by the aid of the tapered structure, so that the grounded coplanar waveguide can be better matched with a bonding wire; the two sides of the central conduction band are directly connected with the side ground, and at the moment, an additional capacitor structure is formed between the central conduction band and the side of the bonding structure, so that the input capacitance of the antenna can be improved again.
Further, before the feeding is performed when the ground coplanar waveguide adopts the first feeding mode or the second feeding mode, the shape of the central conduction band has a step change, and the width of the central conduction band is increased or decreased. The impedance of the feeder line can be finely adjusted by changing the width of the central conduction band of the feeder line, so that the good matching of the feeder line and the antenna is better realized.
Has the advantages that: compared with the prior art, the invention has the following advantages:
1. the capacitive antenna comprises a main radiating patch, a plurality of capacitive patches, a plurality of capacitor structures and a plurality of capacitor structures, wherein the plurality of capacitor structures are arranged on the periphery of the main radiating patch, the plurality of capacitive patches are arranged on the periphery of.
2. The number of the capacitive patches is not fixed, the number can be increased or decreased according to the required capacitance value, generally, the more the number of the patches, the larger the area, the smaller the mutual distance, and the higher the capacitance, and in addition, the shape of the capacitive patches is not fixed, can be changed according to a specific antenna form, and has high design flexibility.
3. The capacitive patches have no significant adverse effect on the performance of the main radiating patch, and simultaneously do not require significant changes on the parameters and design of the antenna, the main radiating patch part and the capacitive patch part of the antenna can be designed respectively, and the design flow of the antenna is simple.
Drawings
Fig. 1 is a schematic perspective view of a wideband patch antenna using a first feeding method;
fig. 2 is a top view of a wideband patch antenna using a first feeding method;
fig. 3 is a side view of a wideband patch antenna using a first feeding method;
FIG. 4 is a diagram of simulation results of a wideband patch antenna using a first feeding method;
fig. 5 is a schematic perspective view of a wideband patch antenna using a second feeding method;
fig. 6 is a top view of a wideband patch antenna using a second feeding method;
fig. 7 is a side view of a wideband patch antenna using a second feeding method;
FIG. 8 is a diagram of a simulation result of a wideband patch antenna using a second feeding method;
Detailed Description
The invention is further elucidated with reference to the drawings and the embodiments.
Example 1:
as shown in fig. 1 to 3, the broadband patch antenna includes a first layer structure, a second layer structure and a third layer structure sequentially arranged from top to bottom, the first layer structure includes a main radiation patch 1, four capacitive patches 2 and a side ground 3, wherein the four capacitive patches 2 are all rectangular structures; the second layer structure comprises a medium substrate 10, a substrate integrated waveguide cavity 4 is arranged on the medium substrate 10, an accommodating groove 41 is formed in the top of the substrate integrated waveguide cavity 4, the main radiation patch 1 and the four capacitive patches 2 are located in the accommodating groove 41, and the four capacitive patches 2 are distributed on two sides of the main radiation patch 1 in pairs and are close to the side ground 3; the third layer structure includes a metal under 12.
The feeding structure in the antenna structure of this embodiment includes two grounded coplanar waveguides, which are an upper grounded coplanar waveguide 5 and a lower grounded coplanar waveguide 8, respectively, where the upper grounded coplanar waveguide 5 and the lower grounded coplanar waveguide 8 are disposed on the first layer structure and the third layer structure, respectively, one end of the lower grounded coplanar waveguide 8 is connected to the main radiation patch 1 through a first metalized through hole 6 for feeding, and in order to ensure that the bonding structure and the antenna are on the same plane, the other end is connected to the upper grounded coplanar waveguide 5 through a second metalized through hole 13, and the upper grounded coplanar waveguide 5 is connected to the chip 11 through a metal bonding wire 7.
In this embodiment, two main slots are formed in the main radiating patch 1 along the current direction of the main radiating patch 1, and the arrangement of the slots interferes with the current on the main radiating patch 1, so that an extra resonance point expansion bandwidth is formed; the central conduction band 9 of the upper grounding coplanar waveguide 5 is gradually changed in an inverted cone shape, the width is gradually reduced from wide to narrow, two sides of the central conduction band 9 are directly connected with the lateral ground 3, and at the moment, the part of the central conduction band 9 at the bonding position and the lateral ground 3 form an additional capacitor structure; the positions of the four capacitive patches 2 and the main radiating patch 1 are not on the same central line, the capacitive patches 2 have a certain displacement along the current direction of the main radiating patch 1, and the displacement distance is determined by the specific antenna structure and current distribution.
Thus, in the broadband patch antenna structure of the present embodiment, a plate capacitor is formed between the four capacitive patches 2 around the main radiating patch 1 and the metal ground 12, and a capacitor structure is formed between the capacitive patch 2 and the main radiating patch 1, between the capacitive patch 2 and the side ground 3, and between the capacitive patch 2 and the capacitive patch 2, which greatly increases the capacitance of the antenna, so that the inductance value introduced by the metal bonding wire 7 can be cancelled in a wider frequency range.
Before the lower grounding coplanar waveguide 8 feeds power to the main radiation patch 1, the width of the central conduction band of the lower grounding coplanar waveguide 8 has a step change, the width is changed from small to large, and the impedance of the lower grounding coplanar waveguide 8 can be finely adjusted by the change of the width of the central conduction band, so that good power feeding for the antenna is realized.
The simulation result of the antenna of this embodiment is shown in fig. 4, and it can be seen that the antenna of this embodiment can achieve better matching in the frequency band of 55GHz-67.5GHz, S11All are below-10 dB. Meanwhile, the antenna keeps good radiation in a frequency band, the bandwidth of the antenna is 20%, the characteristic of a broadband is still kept after the antenna is bonded with a chip, and the bandwidth is even widened compared with that of the traditional E-type patch antenna.
Example 2:
as shown in fig. 5 to 7, the broadband patch antenna includes a first layer structure, a second layer structure and a third layer structure sequentially arranged from top to bottom, the first layer structure includes a main radiation patch 1, four capacitive patches 2 and a side ground 3, wherein the four capacitive patches 2 are all rectangular structures and are provided with capacitive slots 21 along the current direction of the main radiation patch 1; the second layer structure comprises a medium substrate 10, a substrate integrated waveguide cavity 4 is arranged on the medium substrate 10, an accommodating groove 41 is formed in the top of the substrate integrated waveguide cavity 4, the main radiation patch 1 and the four capacitive patches 2 are located in the accommodating groove 41, and the four capacitive patches 2 are distributed on two sides of the main radiation patch 1 in pairs and are close to the side ground 3; the third layer structure includes a metal under 12.
The feed structure in the antenna structure of this embodiment includes a grounded coplanar waveguide 5, the grounded coplanar waveguide 5 is disposed on the first layer structure, specifically, a window matched with the grounded coplanar waveguide 5 is disposed on the side of the substrate integrated waveguide cavity 4, the grounded coplanar waveguide 5 is directly connected to the main radiation patch 1 through one end of the window, the other end is connected to the chip 11 through the metal bonding wire 7, and the third layer structure is a whole metal ground 12 without any slot or opening, and has no any exposure.
In this embodiment, two main slots are formed in the main radiating patch 1 along the current direction of the main radiating patch 1, and the arrangement of the slots interferes with the current on the main radiating patch 1, so that an extra resonance point expansion bandwidth is formed; the central conduction band 9 of the grounding coplanar waveguide 5 is gradually changed in an inverted cone shape, the width is gradually narrowed from wide to narrow, two sides of the central conduction band 9 are directly connected with the lateral ground 3, and at the moment, the part of the central conduction band 9 at the bonding position and the lateral ground 3 form an additional capacitor structure; the positions of the four capacitive patches 2 and the main radiating patch 1 are not on the same central line, the capacitive patches 2 have a certain displacement along the current direction of the main radiating patch 1, and the displacement distance is determined by the specific antenna structure and current distribution.
Thus, in the broadband patch antenna structure of the present embodiment, a plate capacitor is formed between the four capacitive patches 2 around the main radiating patch 1 and the metal ground 12, and a capacitor structure is formed between the capacitive patch 2 and the main radiating patch 1, between the capacitive patch 2 and the side ground 3, and between the capacitive patch 2 and the capacitive patch 2, which greatly increases the capacitance of the antenna, so that the inductance value introduced by the metal bonding wire 7 can be cancelled in a wider frequency range.
Before the grounding coplanar waveguide 5 feeds power to the main radiation patch 1, the width of the central conduction band 9 of the grounding coplanar waveguide has a step change, the width is changed from small to large, and the impedance of the grounding coplanar waveguide 5 can be finely adjusted by the change of the width of the central conduction band 9, so that good power feeding for an antenna is realized.
The simulation result of the antenna of the present embodiment is shown in fig. 8, it can be seen that the antenna of the present embodiment can achieve better matching in the 55GHz-64GHz band, S11 is below-10 dB, meanwhile, the antenna keeps good radiation in the 55GHz-62.5GHz band, the antenna bandwidth is 12.5%, the antenna gain of the antenna of the present embodiment is reduced to some extent around the frequency of 63.5GHz, because the antenna radiation has a certain offset in the main lobe direction, and the problem can be solved after the antenna array. The third layer structure of the embodiment has no open pore or open groove, so that the third layer structure is convenient to integrate with a circuit or realize the common mode.
Claims (7)
1. A broadband patch antenna bonded with a chip, characterized in that: the antenna comprises a first layer structure, a second layer structure and a third layer structure which are sequentially arranged from top to bottom, wherein the first layer structure comprises a main radiation patch, a plurality of capacitive patches and a side ground; the second layer structure comprises a dielectric substrate, a substrate integrated waveguide cavity is arranged on the dielectric substrate, an accommodating groove is formed in the top of the substrate integrated waveguide cavity, and the main radiation patch and the capacitive patch are located in the accommodating groove; the third layer structure comprises a metal bottom layer; one end of the feed structure is connected with the main radiation patch, and the other end of the feed structure is connected with the chip through a metal bonding wire.
2. The chip-bonded wideband patch antenna according to claim 1, wherein: the feed structure comprises a grounding coplanar waveguide, the grounding coplanar waveguide is arranged on the first layer structure, one end of the grounding coplanar waveguide is directly connected with the main radiation patch, and the other end of the grounding coplanar waveguide is connected with the chip through a metal bonding wire.
3. The chip-bonded wideband patch antenna according to claim 1, wherein: the feed structure comprises two grounded coplanar waveguides which are an upper grounded coplanar waveguide and a lower grounded coplanar waveguide respectively, the upper grounded coplanar waveguide and the lower grounded coplanar waveguide are arranged on a first layer structure and a third layer structure respectively, one end of the lower grounded coplanar waveguide is connected with the main radiation patch through a first metalized through hole for feeding, the other end of the lower grounded coplanar waveguide is connected with the upper grounded coplanar waveguide through a second metalized through hole, and the upper grounded coplanar waveguide is connected with the chip through a metal bonding wire.
4. The chip-bonded wideband patch antenna according to claim 1, wherein: and a main groove along the current direction of the main radiation patch is formed in the main radiation patch.
5. The chip-bonded wideband patch antenna according to claim 1 or 4, wherein: and the capacitive patch is provided with a capacitive slot along the current direction of the main radiation patch.
6. A chip-bonded wideband patch antenna according to claim 2 or 3, wherein: the grounded coplanar waveguide on the first layer structure is provided with a central conduction band which is in tapered or inverted tapered, and two sides of the central conduction band are directly connected with the lateral ground.
7. A chip-bonded wideband patch antenna according to claim 2 or 3, wherein: and the grounded coplanar waveguide on the first layer structure is matched in the substrate integrated waveguide cavity.
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| CN111613890B (en) * | 2020-06-11 | 2023-07-14 | 维沃移动通信有限公司 | Antenna structure and electronic equipment |
| CN114006158B (en) * | 2020-07-27 | 2022-12-02 | 西安电子科技大学 | Millimeter wave integrated antenna based on coplanar waveguide series-feed structure |
| CN112510355B (en) * | 2020-11-23 | 2022-08-09 | 博微太赫兹信息科技有限公司 | Double-layer plate millimeter wave circularly polarized antenna based on dielectric integrated waveguide feed |
| CN112736472B (en) * | 2020-12-25 | 2021-12-14 | 无锡国芯微电子系统有限公司 | Millimeter wave broadband patch antenna |
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