CN109887928B - Flexible display panel - Google Patents
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- CN109887928B CN109887928B CN201910066974.2A CN201910066974A CN109887928B CN 109887928 B CN109887928 B CN 109887928B CN 201910066974 A CN201910066974 A CN 201910066974A CN 109887928 B CN109887928 B CN 109887928B
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Abstract
The application discloses a flexible display panel, which comprises a flexible substrate and a TFT (thin film transistor) driving substrate positioned on the flexible substrate, wherein a bending area is arranged on the TFT driving substrate, a plurality of metal wires are arranged in the bending area of the TFT driving substrate, at least one through hole is correspondingly arranged in each metal wire, and the through holes penetrate through the corresponding metal wires and other structural layers of the TFT driving substrate; a first organic buffer layer is arranged between the flexible substrate and the TFT drive substrate and corresponds to the bending region; and each through hole is filled with an organic buffer material which is the same as the first organic buffer layer in material, and the organic buffer material in the through hole covers the first organic buffer layer. The application effectively strengthens the buffer effect of the organic buffer on the bending area of the TFT driving substrate, avoids the metal wiring fracture of the bending area, and improves the yield of the flexible display panel.
Description
Technical Field
The application relates to the technical field of display panels, in particular to a flexible display panel.
Background
The OLED (Organic Light-Emitting Diode) display rapidly occupies a high-end market of the display panel due to its advantages of high contrast, wide color gamut, wide viewing angle, being lighter and thinner, and the like. Another advantage of OLED displays is that they are bendable, foldable, and rollable, which makes them useful in a wide range of applications, including curved, foldable, or narrow-bezel (frameless) screens.
In order to achieve smaller boundary and high screen ratio, the flexible OLED display screen is bent in an Outer Lead Bonding (OLB) area to form a bending area. But to conventional flexible OLED display screen design structure, the radius of buckling is bigger usually, and thickness occupation space is more, so can't satisfy the demand of ultra-thin cell-phone design, if will buckle the radius and reduce by force, will appear the condition that display screen rete fracture and metal were walked the fracture, lead to the unable conduction of the signal of telecommunication in the display screen. Aiming at the problems, the open pore structure perpendicular to the flexible OLED display screen is generally arranged on the metal wiring of the bending area, and the buffer is filled to reduce the bending stress of the metal wiring, so that the condition that the metal wiring is broken in the bending process of the flexible OLED display screen is prevented.
However, the through hole on the metal wire in the bending region is not well connected with the buffer coated in the through hole, and each layer structure corresponding to the bending region has high hardness and poor toughness, and stress concentration occurs during bending, which easily causes the metal wire to crack or even break, thereby causing poor display of the flexible OLED display screen.
Disclosure of Invention
The embodiment of the application provides a flexible display panel to solve the problem that the flexible display panel display is bad due to the fact that metal wiring in a bending area of the flexible display panel is prone to breaking.
The embodiment of the application provides a flexible display panel, which comprises a flexible substrate and a TFT (thin film transistor) driving substrate positioned on the flexible substrate, wherein a bending area is arranged on the TFT driving substrate, a plurality of metal wires are arranged in the bending area of the TFT driving substrate, at least one through hole is correspondingly arranged in each metal wire, and the through holes penetrate through the corresponding metal wires and other structural layers of the TFT driving substrate;
a first organic buffer layer is arranged between the flexible substrate and the TFT drive substrate and corresponds to the bending region;
and each through hole is filled with an organic buffer material which is the same as the first organic buffer layer in material, and the organic buffer material in the through hole covers the first organic buffer layer.
Optionally, a second organic buffer layer is arranged on one side, away from the flexible substrate, of the TFT driving substrate, the second organic buffer layer is arranged corresponding to the bending region, and the second organic buffer layer is made of the same material as the first organic buffer layer and is integrally formed with the organic buffer in the through hole.
Optionally, a plurality of small holes are formed around each through hole, openings of the small holes are deviated from the flexible substrate, the small holes are communicated with the through holes, and the organic buffer is filled in the small holes.
Optionally, the plurality of small holes are symmetrically arranged around the through hole.
Optionally, an annular groove is further formed around each through hole, an opening of the annular groove deviates from the flexible substrate, the small holes are distributed around the annular groove, and the annular groove is communicated with the through holes and the small holes respectively.
Optionally, the two sides of the projection of the metal trace on the flexible substrate are wavy lines, and the two sides are symmetrically arranged with the center line of the projection of the metal trace on the flexible substrate as a symmetry axis; the center of the projection of the through hole on the flexible substrate is positioned on the connecting line of the maximum distance between the two edges and is positioned on the central line of the projection of the metal routing on the flexible substrate.
Optionally, each metal trace is penetrated by a plurality of through holes, and the through holes are distributed in a single row along the corresponding metal trace.
Optionally, the cross-sectional shape of the through hole is circular, oval or polygonal.
Optionally, a display area and an outer pin binding area are further disposed on the TFT driving substrate, the bending area is located between the display area and the outer pin binding area, and the metal routing is led out from the display area and extends to the outer pin binding area.
Optionally, the flexible display panel further includes an organic electroluminescent layer disposed on the TFT driving substrate.
The beneficial effect of this application does: the first organic buffer layer is arranged between the flexible substrate and the TFT driving substrate, so that the contact area of the first organic buffer layer and the bending area of the TFT driving substrate is increased, the organic buffer substance in the through hole directly covers the first organic buffer layer, and the organic buffer substance and the first organic buffer layer are made of the same material, so that the bonding force between the organic buffer substance in the through hole and the first organic buffer layer is good, the buffer effect of the organic buffer substance on the bending area of the TFT driving substrate is effectively enhanced, and the metal wiring breakage of the bending area is avoided; in addition, material stress caused by different materials in the bending process of the bending area of the TFT driving substrate can be avoided, so that poor reliability caused by cracks generated by metal wiring and organic buffers is avoided, and the yield of the flexible display panel is improved.
Drawings
The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.
Fig. 1 is a top view of a flexible display panel according to an embodiment of the present disclosure;
fig. 2 is a schematic cross-sectional view of a flexible display panel according to an embodiment of the present disclosure;
FIG. 3 is a top view of a bending region provided in accordance with an embodiment of the present disclosure;
FIG. 4 is a schematic cross-sectional view of a bending region according to an embodiment of the present disclosure;
fig. 5 is a top view of a metal trace in a bending region according to an embodiment of the present disclosure;
FIG. 6 is a schematic cross-sectional view of another bending region provided in the present application;
fig. 7 is a top view of another metal trace in a bending region according to an embodiment of the present disclosure;
fig. 8 is a top view of another metal trace in a bending region according to an embodiment of the present disclosure.
Detailed Description
Specific structural and functional details disclosed herein are merely representative and are provided for purposes of describing example embodiments of the present application. This application may, however, be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.
In the description of the present application, it is to be understood that the terms "center," "lateral," "upper," "lower," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and therefore should not be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified. Furthermore, the term "comprises" and any variations thereof is intended to cover non-exclusive inclusions.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used herein, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
The present application is further described below with reference to the accompanying drawings and examples.
As shown in fig. 1 to 4, an embodiment of the present application provides a flexible display panel 1, including a flexible substrate 2 and a Thin Film Transistor (TFT) driving substrate located on the flexible substrate 2, a bending region 31 is disposed on the TFT driving substrate 3, the bending region 31 of the TFT driving substrate 3 is provided with a plurality of metal traces 32, each metal trace 32 is correspondingly provided with at least one through hole 33, a cross-sectional size of the through hole 33 is smaller than a width of the metal trace 32, the through hole 33 penetrates through the corresponding metal trace 32 and other structural layers of the TFT driving substrate 3 along a direction perpendicular to the flexible substrate 2, and the other structural layers include a TFT array layer; a first organic buffer layer 4 is arranged between the flexible substrate 2 and the TFT driving substrate 3, and the first organic buffer layer 4 is arranged corresponding to the bending region 31; each of the through holes 33 is filled with an organic buffer 5 of the same material as the first organic buffer layer 4, and the organic buffer 5 in the through hole 33 covers the first organic buffer layer 4.
Specifically, the TFT driving substrate 3 is further provided with a display area 34 and an outer pin bonding area 35, the outer pin bonding area 35 is used for bonding a driving chip or a flexible circuit board, the bending area 31 is located between the display area 34 and the outer pin bonding area 35, and the metal wire 32 is led out from the display area 34 and extends to the outer pin bonding area 35. The flexible display panel 1 further includes an organic electroluminescent layer 9 disposed in the display region 34 of the TFT driving substrate 3, and emits light under the driving action of the TFT driving substrate 3.
As shown in fig. 2 and fig. 3, in the bending process, bending of the bending region 31 of the TFT driving substrate 3 is involved, and connectivity between the through hole 33 on the metal trace 32 of the bending region 31 and the organic buffer 5 coated in the through hole 33 is not good, and each layer of the TFT driving substrate 3 has large structural hardness and poor toughness, so that a stress concentration phenomenon occurs in the bending process, the stress concentration position is mainly located in a narrow region between one side of the edge of the through hole 33 close to the metal trace 32 and the edge of the metal trace 32, and cracks or even fractures easily occur in these regions in the bending process, thereby causing poor display of the flexible display panel 1. As shown in fig. 4, in the present embodiment, the first organic buffer layer 4 is disposed between the flexible substrate 2 and the TFT driving substrate 3, so as to increase a contact area between the first organic buffer layer 4 and the bending region 31 of the TFT driving substrate 3, the organic buffer 5 in the through hole 33 directly covers the first organic buffer layer 4, and the two layers are made of the same material, so that the bonding force between the organic buffer 5 in the through hole 33 and the first organic buffer layer 4 is good, the buffering effect of the organic buffer 5 on the bending region 31 of the TFT driving substrate 3 is effectively enhanced, and the metal trace 32 of the bending region 31 is prevented from being broken; in addition, material stress caused by different materials in the bending process of the bending region 31 of the TFT driving substrate 3 can be avoided, so that poor reliability caused by cracks generated in the metal routing 32 and the organic buffer 5 is avoided, and the yield of the flexible display panel 1 is improved.
Further, as shown in fig. 4, a second organic buffer layer 6 is disposed on a side of the TFT driving substrate 3 away from the flexible substrate 2, the second organic buffer layer 6 is disposed corresponding to the bending region 31, and the second organic buffer layer 6 is made of the same material as the first organic buffer layer 4 and is integrally formed with the organic buffer 5 in the through hole 33.
In this embodiment, the organic buffer 5 in the through hole 33 is formed by coating the organic buffer 5 on the side of the TFT driving substrate 3 away from the flexible substrate 2, in this process, the second organic buffer layer 6 is formed on the side of the TFT driving substrate 3 away from the flexible substrate 2, the second organic buffer layer 6 and the organic buffer 5 in the through hole 33 are integrally formed, so that the first organic buffer layer 4 and the second organic buffer layer 6 wrap the bending region 31 of the TFT driving substrate 3 in the largest range, and the first organic buffer layer 4 and the second organic buffer layer 6 are directly connected with the organic buffer 5 in the through hole 33 in a contact manner, so as to increase the coverage area of the organic buffer 5, increase the bonding force between the organic buffer 5 and the bending region 31 in the through hole 33, effectively enhance the buffering effect of the organic buffer 5, and avoid the cracking or breaking of the bending region 31 of the TFT driving substrate 3 during the bending process, the yield of the flexible display panel 1 is improved.
Optionally, each metal trace 32 is penetrated by a plurality of through holes 33, and the plurality of through holes 33 are distributed along the corresponding metal trace 32 in a single row. Of course, the plurality of through holes 33 may also be distributed along the corresponding metal traces 32 in two or more rows, depending on the size of the through holes 33 and the width of the metal traces 32. Specifically, the cross-sectional shape of the through-hole 33 is circular, elliptical, or polygonal.
As shown in fig. 5 and fig. 6, an embodiment of the present application further provides a flexible display panel 1, which is different from the above embodiments in that a plurality of small holes 7 are formed around each through hole 33, an opening of each small hole 7 faces away from the flexible substrate 2, the small holes 7 are communicated with the through holes 33, and the small holes 7 are filled with the organic buffer 5. Specifically, the number of the small holes 7 around each through hole 33 may be 4, 6, 8, or the like, and the number of the small holes 7 is not limited herein.
In this embodiment, the small holes 7 communicated with the through holes 33 are formed around each through hole 33, the same organic buffer 5 is filled in the small holes 7 and the through holes 33, the contact area between the organic buffer 5 and the TFT driving substrate 3 is increased, and the small holes 7 are filled with the organic buffer 5 to form a structure similar to a nail, so that the organic buffer 5 and the TFT driving substrate 3 have better bonding force, the organic buffer 5 and the TFT driving substrate 3 are more closely connected, and it is ensured that in the bending process of the bending region 31, the organic buffer 5 can more effectively protect the bending region 31, and the metal wiring 32 or other structural layers of the bending region 31 are prevented from being broken.
Alternatively, the plurality of apertures 7 are symmetrically disposed around the through hole 33. In this embodiment, the plurality of small holes 7 around the through hole 33 are symmetrically arranged, so that the stress is uniformly dispersed during the bending process, cracks of the metal wire 32 or other structural layers around the through hole 33 are reduced, and the buffering effect of the organic buffer 5 is better exerted.
Optionally, as shown in fig. 5 and 6, an annular groove 8 is further provided around each through hole 33, an opening of the annular groove 8 faces away from the flexible substrate 2, the plurality of small holes 7 are distributed around the annular groove 8, and the annular groove 8 is respectively communicated with the through hole 33 and the plurality of small holes 7.
In this embodiment, the through hole 33 is communicated with the plurality of small holes 7 around through the annular groove 8, when the organic buffer 5 is filled, the same organic buffer 5 is filled in the groove, and is also integrally formed with the second organic buffer layer 6, so that the second organic buffer layer 6 and the through hole 33, the small hole 7 and the organic buffer 5 in the groove form a whole, the contact area of the second organic buffer layer 6 and the organic buffer 5 with the bending region 31 of the TFT driving substrate 3 is increased, and better buffering and combining effects are achieved.
As shown in fig. 7 and fig. 8, an embodiment of the present application further provides a flexible display panel 1, which is different from the above embodiments in that the two sides of the projection of the metal trace 32 on the flexible substrate 2 are wavy lines, and the two sides are symmetrically disposed with respect to the center line of the projection of the metal trace 32 on the flexible substrate 2 as a symmetry axis, so that the projection of the metal trace 32 on the flexible substrate 2 is "beaded"; the center of the projection of the through hole 33 on the flexible substrate 2 is located on the connection line of the maximum distance between the two sides, and is located on the center line of the projection of the metal trace 32 on the flexible substrate 2.
In this embodiment, the distance between the two projected edges of the metal trace 32 on the flexible substrate 2 includes the maximum distance and the minimum distance, and the through hole 33 is disposed at the maximum distance, so that the distance between one side of the edge of the through hole 33 close to the metal trace 32 and the edge of the metal trace 32 tends to be consistent, the stress concentration in the edge area of the metal trace 32 is avoided, and the metal trace 32 or other structural layers corresponding to the metal trace 32 are prevented from being broken in the bending process.
As shown in fig. 6 and 8, the present embodiment also provides a flexible display panel 1, which includes a flexible substrate 2, a TFT driving substrate 3 on the flexible substrate 2, and an organic electroluminescent layer 9 on the TFT driving substrate 3; the TFT driving substrate 3 is provided with a display area 34, a bending area 31 and an outer pin binding area 35, the outer pin binding area 35 is used for binding a driving chip or a flexible circuit board, and the bending area 31 is positioned between the display area 34 and the outer pin binding area 35; a plurality of metal wires 32 are arranged in the bending area 31 of the TFT driving substrate 3, and the metal wires 32 are led out from the display area 34 and extend to the outer pin binding area 35; each metal wire 32 is correspondingly provided with at least one through hole 33, the cross-sectional dimension of each through hole 33 is smaller than the width of the metal wire 32, the through hole 33 penetrates through the corresponding metal wire 32 and other structural layers of the TFT drive substrate 3, and the other structural layers comprise a TFT array layer; an annular groove 8 is formed around each through hole 33, a plurality of symmetrical small holes 7 are formed around each annular groove 8, openings of the annular grooves 8 and the small holes 7 deviate from the flexible substrate 2, and the annular grooves 8 are respectively communicated with the through holes 33 and the small holes 7; a first organic buffer layer 4 is arranged between the flexible substrate 2 and the TFT driving substrate 3, and the first organic buffer layer 4 is arranged corresponding to the bending region 31; the organic buffer 5 with the same material as the first organic buffer layer 4 is filled in each through hole 33, the small hole 7 and the groove, and the organic buffer 5 in the through hole 33 covers the first organic buffer layer 4; the side of the TFT driving substrate 3 away from the flexible substrate 2 is provided with a second organic buffer layer 6, the second organic buffer layer 6 is disposed corresponding to the bending region 31, the second organic buffer layer 6 is made of the same material as the first organic buffer layer 4, and is integrally formed with the through hole 33, the small hole 7 and the organic buffer 5 in the groove.
Specifically, the two sides of the projection of the metal trace 32 on the flexible substrate 2 are wavy lines, and the two sides are symmetrically arranged with the center line of the projection of the metal trace 32 on the flexible substrate 2 as a symmetry axis, so that the projection of the metal trace 32 on the flexible substrate 2 is "beaded"; the center of the projection of the through hole 33 on the flexible substrate 2 is located on the connection line of the maximum distance between the two sides, and is located on the center line of the projection of the metal trace 32 on the flexible substrate 2.
In this embodiment, the first organic buffer layer 4 and the second organic buffer layer 6 are in direct contact with the organic buffer 5 in the through hole 33, and the materials are the same, so as to tightly wrap the TFT driving substrate 3, thereby effectively reducing the generation of cracks in the bending region 31 of the TFT driving substrate 3 during the bending process, and avoiding the fracture of the metal routing 32 or other structural layers; a plurality of symmetrical small holes 7 are formed around each through hole 33 and filled with the organic buffer 5, the small holes 7 are communicated with the through holes 33 through grooves filled with the same organic buffer 5, so that the second organic buffer layer 6, the through holes 33, the small holes 7 and the organic buffer 5 in the grooves form a whole, the contact area and the bonding force of the second organic buffer layer 6, the organic buffer 5 and the TFT drive substrate 3 are increased, the generation of cracks in the bending process of the bending region 31 of the TFT drive substrate 3 is reduced, and the performance of the flexible display panel 1 after bending is guaranteed to be unchanged; in addition, the distance between the two projected edges of the metal trace 32 on the flexible substrate 2 includes a maximum distance and a minimum distance, and the through hole 33 is disposed at the maximum distance, so that the distance between one side of the edge of the through hole 33 close to the metal trace 32 and the edge of the metal trace 32 tends to be consistent, the stress concentration of the edge area of the metal trace 32 is avoided, and the metal trace 32 or other structural layers corresponding to the metal trace 32 are prevented from being broken in the bending process.
In summary, although the present application has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present application, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present application, so that the scope of the present application shall be determined by the appended claims.
Claims (8)
1. A flexible display panel is characterized by comprising a flexible substrate and a TFT drive substrate positioned on the flexible substrate, wherein a bending area is arranged on the TFT drive substrate, a plurality of metal wires are arranged in the bending area of the TFT drive substrate, each metal wire is correspondingly provided with at least one through hole, and the through holes penetrate through the corresponding metal wires and other structural layers of the TFT drive substrate;
a first organic buffer layer is arranged between the flexible substrate and the TFT drive substrate and corresponds to the bending region;
each through hole is filled with an organic buffer substance which is made of the same material as the first organic buffer layer, and the organic buffer substance in the through hole covers the first organic buffer layer;
a second organic buffer layer is arranged on one side, away from the flexible substrate, of the TFT driving substrate and corresponds to the bending region, and the second organic buffer layer is made of the same material as the first organic buffer layer and is integrally formed with the organic buffer in the through hole;
the two sides of the projection of the metal wire on the flexible substrate are wavy lines, and the two sides are symmetrically arranged by taking the center line of the projection of the metal wire on the flexible substrate as a symmetry axis; the center of the projection of the through hole on the flexible substrate is positioned on the connecting line of the maximum distance between the two edges and is positioned on the central line of the projection of the metal routing on the flexible substrate.
2. The flexible display panel according to claim 1, wherein a plurality of small holes are formed around each of the through holes, openings of the small holes are opposite to the flexible substrate, the small holes are communicated with the through holes, and the organic buffer is filled in the small holes.
3. The flexible display panel of claim 2, wherein the plurality of apertures are symmetrically disposed around the through-hole.
4. The flexible display panel of claim 2, wherein an annular groove is further disposed around each through hole, an opening of the annular groove faces away from the flexible substrate, the plurality of small holes are distributed around the annular groove, and the annular groove is respectively communicated with the through hole and the plurality of small holes.
5. The flexible display panel of claim 1, wherein each of the metal traces is penetrated by a plurality of vias, and the plurality of vias are distributed in a single row along the corresponding metal trace.
6. The flexible display panel of claim 1, wherein the cross-sectional shape of the through-hole is circular, elliptical, or polygonal.
7. The flexible display panel according to claim 1, wherein a display region and an outer lead bonding region are further disposed on the TFT driving substrate, the bending region is located between the display region and the outer lead bonding region, and the metal trace is led out from the display region and extends to the outer lead bonding region.
8. The flexible display panel of claim 1, further comprising an organic electroluminescent layer disposed on the TFT driving substrate.
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| CN110246885B (en) * | 2019-06-28 | 2021-10-01 | 上海天马有机发光显示技术有限公司 | Display panel |
| CN110634885B (en) | 2019-08-20 | 2021-06-22 | 武汉华星光电技术有限公司 | Array substrate and preparation method thereof |
| CN110473985B (en) * | 2019-08-27 | 2022-10-28 | 云谷（固安）科技有限公司 | Flexible substrate, flexible display panel and manufacturing method of flexible substrate |
| CN110874988B (en) * | 2019-11-29 | 2022-05-24 | 京东方科技集团股份有限公司 | Display device |
| CN111403453B (en) * | 2020-03-26 | 2023-06-30 | 武汉华星光电半导体显示技术有限公司 | Flexible display panel and display device |
| CN111508370B (en) * | 2020-05-19 | 2023-01-24 | 武汉华星光电半导体显示技术有限公司 | Foldable display device |
| CN111757592B (en) * | 2020-06-18 | 2021-12-10 | 昆山国显光电有限公司 | Flexible circuit board and display screen body assembly |
| CN112341949B (en) * | 2020-11-03 | 2022-11-01 | 京东方科技集团股份有限公司 | Protective film, protective film attaching method, display module and display device |
| CN112397453B (en) * | 2020-11-18 | 2023-06-27 | 武汉华星光电半导体显示技术有限公司 | Display panel and electronic equipment |
| CN112687725B (en) * | 2020-12-24 | 2022-09-13 | 昆山工研院新型平板显示技术中心有限公司 | Flexible display panel and manufacturing method thereof |
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| CN107768403A (en) * | 2016-08-18 | 2018-03-06 | 三星显示有限公司 | Display device |
| CN106328810A (en) * | 2016-10-17 | 2017-01-11 | 武汉华星光电技术有限公司 | Flexible OLED substrate structure and the design method thereof |
| CN106653818A (en) * | 2017-01-23 | 2017-05-10 | 上海天马有机发光显示技术有限公司 | Display panel, display apparatus and preparation method for display panel |
| CN106935728A (en) * | 2017-03-22 | 2017-07-07 | 京东方科技集团股份有限公司 | OLED encapsulating structures, display panel and the method for preparing encapsulating structure |
| CN108231839A (en) * | 2017-12-27 | 2018-06-29 | 武汉华星光电半导体显示技术有限公司 | Bending region structure of flexible display panels and preparation method thereof |
| CN108550612A (en) * | 2018-05-29 | 2018-09-18 | 武汉华星光电半导体显示技术有限公司 | Display panel and preparation method thereof |
| CN109256398A (en) * | 2018-10-26 | 2019-01-22 | 武汉华星光电半导体显示技术有限公司 | Have the flexible display panels of signal wire resistant to bending |
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