CN109887905B

CN109887905B - Packaging method of full-color LED

Info

Publication number: CN109887905B
Application number: CN201910091661.2A
Authority: CN
Inventors: 林成通; 孙亚婕
Original assignee: Zhejiang Inteled Optoeletronic Technology Co ltd
Current assignee: Zhejiang Inteled Optoeletronic Technology Co ltd
Priority date: 2019-01-30
Filing date: 2019-01-30
Publication date: 2020-12-11
Anticipated expiration: 2039-01-30
Also published as: CN109887905A

Abstract

The invention discloses a full-color LED packaging method, which comprises the following steps of firstly, preparing a blue LED light-emitting unit, a cyan LED light-emitting unit and a purple LED light-emitting unit, wherein the blue LED light-emitting unit is a blue inverted LED chip, the cyan LED light-emitting unit is manufactured by stirring and mixing green fluorescent powder with wave bands of 500 nanometers and 540 nanometers and silica gel into green glue, pressing the green glue to the front side and the periphery of a short-wave-band blue inverted chip with the wavelength of less than 447.5 nanometers by using a CSP packaging technology, stirring and mixing red fluorescent powder with the wave bands of 630 nanometers and 650 nanometers and silica gel into red glue, and pressing the red glue to the front side and the periphery of a long-wave-band blue inverted chip with the wavelength of more than 470 nanometers by using the CSP packaging technology; next, a blue LED light emitting unit, a cyan LED light emitting unit, and a violet LED light emitting unit are uniformly mounted on the LED substrate. The scheme realizes the color changing effect of the full-color LED, realizes the lighting effect of a full-spectrum product and reduces the production cost.

Description

Packaging method of full-color LED

Technical Field

The invention relates to the technical field of LEDs, in particular to a packaging method of a full-color LED.

Background

With the development of lighting technology and the deepening of intelligent concepts, intelligent lighting is popular among many lighting enterprises and intelligent control enterprises. The full-color intelligent LED lamp can adjust the color and brightness of light at will and provide professional white light illumination, so that the full-color intelligent LED lamp is popular among people.

The full-color LED lamp light source on the existing market all packages up the LED lamp pearl chip of four kinds of colours white, red, green, blue with multiple mode, and every colour all can the exclusive use, can mix out different colours with three kinds of colours red, green, blue according to certain proportion again, realizes the effect of discolouing of full-color gradual change. It is known that the lamps with three colors of red, green and blue can mix white light, but the white light mixed by the chips with three colors is not suitable for white light illumination, because the half-wave width of the spectrum of the white light directly mixed by the chips is narrow, the emitted light is sharp, and the comfort of human eyes is poor. However, people now pursue sunlight-like light sources and pursue light naturalness and comfortableness, although the full-color lamp is added with a white light emitting chip, the requirements of people are difficult to achieve, and meanwhile, the production cost of the full-color lamp is increased.

Disclosure of Invention

In order to solve the above problems, the present invention provides a method for packaging a full-color LED with only three light-emitting units, which adopts the following technical scheme:

a packaging method of full-color LED is characterized in that:

firstly, preparing a COB substrate, wherein circuit lines are arranged on the COB substrate, three flip-chip bonding areas are arranged on the COB substrate, the flip-chip bonding areas with the same pattern are connected in series, and the flip-chip bonding areas with different patterns are independent;

secondly, preparing a first LED light-emitting unit, a second LED light-emitting unit and a third LED light-emitting unit, wherein the first LED light-emitting unit is prepared by pressing silica gel glue to the front and the periphery of a blue flip-chip LED chip by using a CSP packaging technology, the second LED light-emitting unit is prepared by stirring and mixing green fluorescent powder with wave bands of 500 nanometers and 540 nanometers and the silica gel to form green glue, the green glue is pressed to the front and the periphery of a short-wave-band blue flip-chip with the wavelength of below 447.5 nanometers by using the CSP packaging technology, the third LED light-emitting unit is prepared by stirring and mixing red fluorescent powder with the wave bands of 630 nanometers and 650 nanometers and the silica gel to form red glue, and the red glue is pressed to the front and the periphery of a long-wave-band blue flip-chip with the wavelength of above 470 nanometers by using the CS;

and thirdly, the first LED light-emitting unit, the second LED light-emitting unit and the third LED light-emitting unit are respectively fixed on corresponding patterns on the COB substrate.

Preferably, the COB substrate on which the first, second, and third LED light-emitting units are mounted is finally coated with a resin.

The scheme is that three CSP packaging chips are welded on a substrate with a circuit, each CSP packaging chip can be separately used and is respectively connected with a driving circuit and a single chip microcomputer, and the color changing effect is realized by adjusting the brightness of the chips. One CSP packaging chip uses a short wave band (less than or equal to 447.5nm) blue flip chip, green fluorescent powder with wave bands of 500nm and 540nm and silica gel are stirred and mixed and are pressed to the front and the periphery of the chip, the other CSP uses a long wave band (more than or equal to 470nm) blue chip, red fluorescent powder with wave bands of 630nm and 650nm and silica gel are stirred and mixed and are pressed to the front and the periphery of the chip. Therefore, the light source can realize the color changing effect, and the effect of a full spectrum product is achieved in a white light illumination mode, the spectrum of the light source is close to sunlight, the color quality is close to the sunlight, and the ultrahigh-quality quasi-sunlight type illumination is realized. The scheme can realize the color changing effect of the full-color LED and the lighting effect of a full-spectrum product, and greatly reduces the production cost.

Drawings

FIG. 1 is a schematic diagram of a COB circuit arrangement according to an embodiment of the present invention

FIG. 2 is a schematic structural diagram of the CSP and the flip chip after being soldered according to the embodiment of the present invention

FIG. 3 is a schematic cross-sectional view of a COB package according to an embodiment of the present invention

1, COB substrate; 2. a flip-chip bonding area; 3. a first LED light emitting unit; 4. a second LED light emitting unit; 5. a third LED light-emitting unit; 6. and a resin protective layer.

Detailed Description

The following are specific embodiments of the present invention and are further described with reference to the drawings, but the present invention is not limited to these embodiments.

What this embodiment used is COB base plate 1, has arranging of circuit line on COB base plate 1, is equipped with three kinds of flip-chip bonding region 2 on COB base plate 1, and the flip-chip bonding region 2 of the same pattern is established ties, and the flip-chip bonding region 2 of different patterns is independent.

The first LED light-emitting unit 3, the second LED light-emitting unit 4 and the third LED light-emitting unit 5 are respectively fixed on the COB substrate 1 on corresponding patterns, the first LED light-emitting unit 3 is prepared by pressing silica gel glue to the front and the periphery of a blue flip LED chip by using a CSP packaging technology, the second LED light-emitting unit 4 is prepared by stirring and mixing green fluorescent powder with silica gel in wave bands of 500 nanometers and 540 nanometers into green glue, the green glue is pressed to the front and the periphery of a short wave band blue flip chip with the wavelength of 447.5 nanometers by using the CSP packaging technology, the third LED light-emitting unit 5 is prepared by stirring and mixing red fluorescent powder with the red fluorescent powder and the silica gel in wave bands of 630 nanometers and 650 nanometers into red glue, and the red glue is pressed to the front and the periphery of a long wave band blue chip with the wavelength of 470 nanometers by using the CSP packaging technology.

After the first, second, and third

LED lighting units

3, 4, and 5 are fixedly mounted, the COB substrate 1 is covered with a resin to form a resin protection layer 6 to ensure the reliability of the COB light source.

The above description and drawings are illustrative of the preferred embodiments of the present invention and are not to be construed as limiting the invention, but rather, the invention is intended to cover all similar constructions, devices, features, and equivalents thereof, which are encompassed by the invention.

Claims

1. A packaging method of full-color LED is characterized in that:

2. The method for packaging a full-color LED according to claim 1, wherein: and finally, covering resin on the COB substrate on which the first LED light-emitting unit, the second LED light-emitting unit and the third LED light-emitting unit are installed.