CN109884645A - A kind of ultrasonic distance measuring module - Google Patents
A kind of ultrasonic distance measuring module Download PDFInfo
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- CN109884645A CN109884645A CN201910278774.3A CN201910278774A CN109884645A CN 109884645 A CN109884645 A CN 109884645A CN 201910278774 A CN201910278774 A CN 201910278774A CN 109884645 A CN109884645 A CN 109884645A
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- sensor chip
- ultrasonic sensor
- ultrasonic
- distance measuring
- resistance
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Abstract
This application discloses a kind of ultrasonic distance measuring modules, in order to realize the purpose of low cost, high-performance, consistency are good.Used technical solution includes ultrasonic sensor chip, clock module, power supply, transmitting probe, the receiving transducer being welded on single side PCB, the ultrasonic sensor chip is separately connected clock module, power supply, the transmitting probe is directly or by resistance or/and capacitance connection to the ultrasonic sensor chip, and the receiving transducer is directly or by resistance or/and capacitance connection to the ultrasonic sensor chip.The present invention only uses a ultrasonic sensor chip, and transmitting probe and receiving transducer are respectively directly or by resistance or/and capacitance connection to the ultrasonic sensor chip, and device used is few, at low cost, high reliablity；And it is welded on single side PCB, it is at low cost；It is at low cost using the crystal or crystal oscillator of 8MHz.
Description
Technical field
This application involves ultrasonic technology fields, are related to a kind of ultrasonic distance measuring module.
Background technique
Traditional ultrasonic wave module or ultrasonic distance measurement circuit, is generally built with multiple chips and discrete device, comprising more
The devices such as a chip and tens resistance capacitances, generally use the crystal oscillator of 4MHz.Since component is more, circuit board need to be using double
Face cabling mode.Higher cost is thereby resulted in, homogeneity of product is poor.
Existing typical ultrasonic wave module or ultrasonic distance measurement circuit such as HC-SR04, product front is as shown in Figure 1, back
Face is as shown in Figure 2.This product uses dual platen, and transmitting probe and receiving transducer are connected on different chips, thus include
The devices such as three chips and tens resistance capacitances.In addition, using the crystal oscillator of 4MHZ.Since device is more, circuit board is using double
Face circuit board trace.Higher cost is caused in this way, and homogeneity of product is poor, and reliability is low.
The prior art is there is also the scheme that ultrasonic wave module or ultrasonic distance measurement circuit use single-chip, and the chip front side is such as
Shown in Fig. 3, the back side is as shown in Figure 4.This single-chip built-in MCU and amplifier, using devices such as more resistance capacitances, with chip
Collectively form Simulation scale-up circuit.Since device is more, circuit board need to use double-sided PCB cabling.Cause in this way cost compared with
Height, device is more, is easy to appear failure welding problem.
Summary of the invention
In order to realize the purpose of low cost, high-performance, consistency are good, the present invention provides a kind of ultrasonic distance measuring module,
Used technical solution is as follows:
A kind of ultrasonic distance measuring module, including ultrasonic sensor chip, clock module, the electricity being welded on single side PCB
Source, transmitting probe, receiving transducer, the ultrasonic sensor chip are separately connected clock module, power supply, and the transmitting probe is straight
It connects or by the way that on resistance or/and capacitance connection to the ultrasonic sensor chip, the receiving transducer is directly or by resistance
Or/and in capacitance connection to the ultrasonic sensor chip.
Specifically, the clock module selects 8MHz crystal oscillator or 7~9MHz crystal.
Specifically, the ultrasonic sensor chip selects general sensor chip.
Specifically, the ultrasonic sensor chip selects custom chip, and the custom chip is integrated with reception amplification electricity
Road, ultrasonic wave transmitting circuit, echo detecting module, Logic control module.
Specifically, the resistance selects pull-up resistor or pull down resistor.
Specifically, the resistance is one or more.
Specifically, the crystal selects 8MHz crystal.
The utility model has the advantages that ultrasonic distance measuring module provided by the invention, only uses a ultrasonic sensor chip, transmitting is visited
Head and receiving transducer are respectively directly or by resistance or/and capacitance connection to the ultrasonic sensor chip, device used
It is few, at low cost, high reliablity；And it is welded on single side PCB, it is at low cost；Use the crystal or crystal oscillator of 8MHz, cost
It is low.
Detailed description of the invention
The drawings described herein are used to provide a further understanding of the present application, constitutes part of this application, this Shen
Illustrative embodiments and their description please are not constituted an undue limitation on the present application for explaining the application.In the accompanying drawings:
Fig. 1 is the HC-SR04 product front elevation of the prior art；
Fig. 2 is the HC-SR04 product back view of the prior art；
Fig. 3 is the single flake products front elevation of the prior art；
Fig. 4 is the single flake products back view of the prior art；
Fig. 5 is ultrasonic distance measuring module schematic illustration of the invention；
Fig. 6 is ultrasonic distance measuring module product front elevation of the invention；
Fig. 7 is ultrasonic distance measuring module product back view of the invention；
Fig. 8 is customization ultrasonic sensor chip structure schematic diagram of the invention；
Fig. 9 is one structure chart of the embodiment of the present invention；
Figure 10 is two structure chart of the embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Below
Description only actually at least one exemplary embodiment be it is illustrative, never as to the present invention and its application or make
Any restrictions.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise
Under every other embodiment obtained, shall fall within the protection scope of the present invention.
Explanation of nouns
Crystal oscillator: crystal oscillator is the abbreviation for having source crystal oscillator, is called oscillator, and English name is oscillator.
Crystal: crystal is then the abbreviation of no source crystal oscillator, is also resonator, and English name is crystal, is referred to as on circuit
XTAL。
Dual platen: also known as doubling plate, 2 laminates；There is wiring on the two sides of circuit board.
Single sided board: also known as lamina, circuit board are only routed in one side；Have one side be not routed, but can have pad and
Via hole.
Referring to Fig. 5, ultrasonic distance measuring module provided in an embodiment of the present invention, including the ultrasonic wave being welded on single side PCB
Sensor chip, clock module, power supply, transmitting probe, receiving transducer, the ultrasonic sensor chip are separately connected clock mould
Block, power supply, the transmitting probe are described directly or by resistance or/and capacitance connection to the ultrasonic sensor chip
Receiving transducer is directly or by resistance or/and capacitance connection to the ultrasonic sensor chip.
Optionally, the crystal Y1 of clock module uses crystal or crystal oscillator, the error that frequency allows to have certain, and value range is
7MHz~9MHz.In a specific embodiment, 8MHz crystal oscillator or crystal are selected.
Referring to Fig. 6-Fig. 7, ultrasonic distance measuring module product provided in an embodiment of the present invention, the front of circuit board does not have cloth
Line is made of probe, single side PCB, 8MHZ crystal or crystal oscillator and a few resistance capacitance etc..
Optionally, the ultrasonic sensor chip selects general sensor chip.
Referring to Fig. 8, the custom chip of high integration is also can be selected in the ultrasonic sensor chip, and the custom chip is
It is integrated with ultrasonic wave transmitting circuit and receives amplifying circuit, the custom chip is also integrated with echo detecting module, logic control
The devices such as module, power module and clock module.Therefore, ultrasonic wave transmitting probe and receiving transducer can be directly connected to chip
On, achieve the purpose that reduce peripheral component.
Optionally, ultrasonic wave transmitting probe RT21 is directly connected to chip U1 pin, or passes through resistance, capacitor or resistance
Combination with capacitor is connected to chip U1 pin.
Optionally, ultrasonic wave receiving transducer RT11 is directly connected to chip U1 pin, or passes through resistance, capacitor or resistance
The combination of capacitor is connected to the pin of chip U1.
Optionally, R2 is pull down resistor (can also be changed to pull-up resistor), and a pin of receiving transducer RT11 connects drawing electricity
Resistance or pull down resistor, pull-up resistor and pull down resistor can also be connected to the pin of U1 chip, and pull-up resistor and pull down resistor can also connect
Onto the resistance or capacitor between receiving transducer RT11 and chip U1；Pull-up resistor or pull down resistor can also connect multiple.This measure can
To reduce the influence of offset voltage, the stability of yield rate and product is improved.
It can be seen that receiving transducer and direct-connected to the same chip of transmitting probe；Or pass through resistance, capacitor or resistance
Combination with capacitor is connected to the same chip.
Embodiment 1
Referring to Fig. 9, resistance Ra2, receiving transducer RT11 are sealed between transmitting probe RT21 and ultrasonic sensor chip U1
Resistance Ra1 is sealed between ultrasonic sensor chip U1.Pull-up resistor or pull down resistor R2 are connected to receiving transducer RT11 and core
On resistance between piece U1.
Embodiment 2
Referring to Figure 10, capacitor Ca2, receiving transducer RT11 are sealed between transmitting probe RT21 and ultrasonic sensor chip U1
Capacitor Ca1 is sealed between ultrasonic sensor chip U1.Pull-up resistor or pull down resistor R2 are connected to receiving transducer RT11 and core
On capacitor between piece U1.
In other embodiments, can be direct-connected between transmitting probe RT21 and chip U1, can also by resistance, capacitor,
Or resistance is connected with the combination of capacitor.
Can be direct-connected between receiving transducer RT11 and chip U1, the group of resistance, capacitor or resistance and capacitor can also be passed through
It closes and is connected.
Pull down resistor R2 (pull-up resistor also can) can connect on receiving transducer RT11 or chip U1, can also pass through to receive and visit
Chain road between head RT11 and chip U1.
Chain road between receiving transducer RT11 and chip U1, can connect one or more pull down resistors, can also connect 1
Or multiple pull-up resistors, or combinations thereof.
Ultrasonic distance measuring module provided by the invention only uses a ultrasonic sensor chip, transmitting probe and reception
Probe is respectively directly or by resistance or/and capacitance connection to the ultrasonic sensor chip, and device used is few, cost
It is low, high reliablity；And it is welded on single side PCB, it is at low cost；It is at low cost using the crystal or crystal oscillator of 8MHz.
In addition, above-mentioned the embodiment of the present application serial number is for illustration only, do not represent the advantages or disadvantages of the embodiments.In the upper of the application
It states in embodiment, all emphasizes particularly on different fields to the description of each embodiment, there is no the part being described in detail in some embodiment, may refer to it
The associated description of his embodiment.
These are only the preferred embodiment of the present invention, is not intended to restrict the invention, for those skilled in the art
For member, the invention may be variously modified and varied.All within the spirits and principles of the present invention, it is made it is any modification,
Equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (7)
1. a kind of ultrasonic distance measuring module, which is characterized in that including be welded on single side PCB ultrasonic sensor chip, when
Clock module, power supply, transmitting probe, receiving transducer, the ultrasonic sensor chip is separately connected clock module, power supply, described
For transmitting probe directly or by resistance or/and capacitance connection to the ultrasonic sensor chip, the receiving transducer is direct
Or by resistance or/and capacitance connection to the ultrasonic sensor chip.
2. a kind of ultrasonic distance measuring module according to claim 1, which is characterized in that the clock module selects 8MHz brilliant
Vibration or 7~9MHz crystal.
3. a kind of ultrasonic distance measuring module according to claim 1 or 2, which is characterized in that the ultrasonic sensor core
Piece selects general sensor chip.
4. a kind of ultrasonic distance measuring module according to claim 1 or 2, which is characterized in that the ultrasonic sensor core
Piece selects custom chip, and the custom chip, which is integrated with, to be received amplifying circuit, ultrasonic wave transmitting circuit, echo detecting module, patrols
Collect control module.
5. a kind of ultrasonic distance measuring module according to claim 1, which is characterized in that the resistance select pull-up resistor or
Pull down resistor.
6. a kind of ultrasonic distance measuring module according to claim 1 or 5, which is characterized in that the resistance is one or more
It is a.
7. a kind of ultrasonic distance measuring module according to claim 2, which is characterized in that the crystal selects 8MHz crystal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910278774.3A CN109884645A (en) | 2019-04-09 | 2019-04-09 | A kind of ultrasonic distance measuring module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910278774.3A CN109884645A (en) | 2019-04-09 | 2019-04-09 | A kind of ultrasonic distance measuring module |
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| Publication Number | Publication Date |
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| CN109884645A true CN109884645A (en) | 2019-06-14 |
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ID=66936511
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| CN201910278774.3A Pending CN109884645A (en) | 2019-04-09 | 2019-04-09 | A kind of ultrasonic distance measuring module |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101430381A (en) * | 2008-12-12 | 2009-05-13 | 南京邮电大学 | Ultrasonic wave transmitting-receiving node and its implementing method |
| CN103941258A (en) * | 2014-04-04 | 2014-07-23 | 陕西理工学院 | Ultrasonic rangefinder based on single-chip microcomputer |
| CN206992151U (en) * | 2017-07-13 | 2018-02-09 | 杭州士兰微电子股份有限公司 | Supersonic sensing device assembly |
| CN107991667A (en) * | 2017-12-28 | 2018-05-04 | 成都逐飞智能设备有限公司 | A kind of accurate range unit of Split ultrasonic |
| CN210199311U (en) * | 2019-04-09 | 2020-03-27 | 苏州顺憬志联新材料科技有限公司 | Ultrasonic ranging module |
-
2019
- 2019-04-09 CN CN201910278774.3A patent/CN109884645A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101430381A (en) * | 2008-12-12 | 2009-05-13 | 南京邮电大学 | Ultrasonic wave transmitting-receiving node and its implementing method |
| CN103941258A (en) * | 2014-04-04 | 2014-07-23 | 陕西理工学院 | Ultrasonic rangefinder based on single-chip microcomputer |
| CN206992151U (en) * | 2017-07-13 | 2018-02-09 | 杭州士兰微电子股份有限公司 | Supersonic sensing device assembly |
| CN107991667A (en) * | 2017-12-28 | 2018-05-04 | 成都逐飞智能设备有限公司 | A kind of accurate range unit of Split ultrasonic |
| CN210199311U (en) * | 2019-04-09 | 2020-03-27 | 苏州顺憬志联新材料科技有限公司 | Ultrasonic ranging module |
Non-Patent Citations (1)
| Title |
|---|
| 晁沛荫;郭宏;王晓玲;朱昊;: "超声波测距数字电路实验装置的设计", 实验技术与管理, no. 07, pages 59 - 60 * |
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