CN109862769B - Ultra-thin and ultra-wide spectrum wave-absorbing material and preparation method thereof - Google Patents
Ultra-thin and ultra-wide spectrum wave-absorbing material and preparation method thereof Download PDFInfo
- Publication number
- CN109862769B CN109862769B CN201910079579.8A CN201910079579A CN109862769B CN 109862769 B CN109862769 B CN 109862769B CN 201910079579 A CN201910079579 A CN 201910079579A CN 109862769 B CN109862769 B CN 109862769B
- Authority
- CN
- China
- Prior art keywords
- wave
- resistive film
- annular resistive
- absorbing material
- substrate layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Aerials With Secondary Devices (AREA)
Abstract
The invention relates to an ultrathin ultra-wide beltThe wave-absorbing material comprises a metal base plate, wherein a wave-absorbing structure layer is arranged on the metal base plate, the wave-absorbing structure layer is formed by periodically arranging a plurality of wave absorbers, each wave absorber comprises a medium substrate layer and an annular resistive film arranged on the upper surface of the medium substrate layer, and the medium substrate layer is arranged on the upper surface of the metal base plate. The wave-absorbing material of the ultrathin and ultra-wide spectrum is based on a resistive film wave-absorbing structure, adopts an isotropic annular resistive film, and realizes 10 frequency multiplication S of a single-layer wave-absorbing structure body11The wave-absorbing material has the wave-absorbing characteristic below-10 dB, the ultra-wide and super-strong absorption characteristic is still kept within 30 degrees of oblique incidence, the preparation process is simple and feasible, and the size of the wave-absorbing material can be customized.
Description
Technical Field
The invention relates to the technical field of wave-absorbing materials, in particular to an ultrathin and ultra-wide spectrum wave-absorbing material and a preparation method thereof.
Background
The wave-absorbing material is a functional material which can absorb and attenuate electromagnetic waves incident in a certain frequency band, convert electromagnetic energy into heat energy or other forms of energy to be consumed or enable the electromagnetic waves to be undetectable due to interference cancellation, is widely applied to military stealth and is an important stealth material, and along with the development of the electronic industry, the application of the wave-absorbing material is far beyond the original military stealth. Electromagnetic radiation pollution generated by electromagnetic wave application in electronic equipment is increasingly serious, so that mutual interference among equipment is caused, and human health is seriously influenced. The application of the wave-absorbing material in the fields of electronic communication, electronic devices, energy conservation, emission reduction, radiation protection and the like makes the wave-absorbing material become an electronic functional material related to the national civilians.
With the development of 5G networks and millimeter wave communication, in practical application of various wave-absorbing materials, the wave-absorbing material is required to have the properties of thin thickness, light weight, wide absorption frequency band, good mechanical strength and the like besides the requirement on the wave-absorbing property of the wave-absorbing material.
There are three main techniques for improving the wave-absorbing performance of wave-absorbing materials: the material has the advantages that firstly, the good impedance matching characteristics of the wave-absorbing material and the incident end material are realized, electromagnetic energy enters the material as far as possible, and interface reflection is reduced; secondly, the loss capacity of the interior of the material to electromagnetic waves is enhanced, so that the electromagnetic energy entering the interior of the material is quickly consumed; thirdly, the scattering effect of the material on the electromagnetic wave is enhanced, so that the action times of the electromagnetic wave and the material are increased, and the specific gravity of the electromagnetic wave reflected back along the incoming wave direction is reduced.
The existing structural wave-absorbing material can be formed by adding an absorbent into light materials such as foam and the like, and can realize broadband wave-absorbing by multilayer superposition, so that the structural wave-absorbing material has the advantages of light weight and broadband. But the thickness of the multi-layer wave-absorbing structure is generally thicker, the low-frequency wave-absorbing performance is poor, the occupied space is larger, and the overall mechanical property of the multi-layer bonding process is reduced; when the thickness of the single-layer structure is less than 5mm, the broadband wave absorbing effect is difficult to realize, and the 10dB relative bandwidth is not more than 100% in the existing reports. The typical wave-absorbing screen can be formed by a foam surface loading resistive film, the thickness of the wave-absorbing screen is one quarter of the wavelength of the central working frequency, the resistive film with a proper square resistance value is selected and made into a frequency selection surface pattern, and the working frequency band of the wave-absorbing screen can be adjusted. Commonly used patterns are squares, crosses, square rings, etc. However, these patterns are limited by their characteristics, and only one absorption peak is present in the low frequency band (the frequency band with the thickness less than a quarter wavelength), which makes it difficult to achieve the ultra-wideband (2GHz-25GHz) wave-absorbing effect, so that the problem of expanding the whole frequency band absorption bandwidth of the wave-absorbing body becomes a technical problem that needs to be solved urgently in the current electromagnetic wave-absorbing technical field without changing the material and the thickness of the wave-absorbing body.
Disclosure of Invention
The invention aims to provide an ultra-thin and ultra-wide spectrum wave-absorbing material and a preparation method thereof, and solves the problem that the ultra-wide band wave-absorbing effect is difficult to realize in a low frequency band in the prior art.
The technical scheme adopted by the invention for solving the technical problem is as follows: the wave-absorbing material comprises a metal base plate, wherein a wave-absorbing structure layer is arranged on the metal base plate and is formed by periodically arranging a plurality of wave-absorbing bodies, each wave-absorbing body comprises a medium substrate layer and an annular resistive film arranged on the upper surface of the medium substrate layer, and the medium substrate layer is arranged on the upper surface of the metal base plate.
In the wave-absorbing material, the relative dielectric constant of the medium substrate layer is 0.9-1.1; the relative magnetic permeability of the medium substrate layer is 0.9-1.1.
In the wave-absorbing material, the square resistance of the annular resistive film is 180-220 omega/□.
In the wave-absorbing material, the medium substrate layer is made of aramid fiber honeycomb composite material or foam material; the annular resistive film is made of conductive carbon black; the metal base plate is made of gold, copper or aluminum.
In the wave-absorbing material, the annular resistive film is annular and is positioned in the center of the upper surface of the medium substrate layer.
In the wave-absorbing material, the cross section of the wave-absorbing body is square, and the side length of the square is 15-25 mm; the outer diameter of the annular resistive film is equal to the side length of the cross section of the wave absorber to be 0.4 mm; the inner diameter of the annular resistive film is equal to the side length of the cross section of the wave absorber, and is-13.4 mm.
In the wave-absorbing material, the thickness of the medium substrate layer is less than or equal to 10 mm; the thickness of the annular resistive film is 10-100 mu m; the thickness of the metal bottom plate is 10-20 μm.
The invention also provides a preparation method of the wave-absorbing material, which comprises the following steps:
s1, printing the material of the annular resistive film on the film through a screen printing technology to obtain the annular resistive film;
and S2, adhering the annular resistive film to the medium substrate layer.
In the preparation method of the present invention, step S1 specifically includes:
s11, manufacturing a complementary metal mesh according to the shape pattern of the required annular resistive film;
s12, placing the metal net on the film, printing conductive carbon black slurry, taking off the metal net, and standing and drying.
The ultra-thin and ultra-wide spectrum wave-absorbing material and the preparation method thereof have the following beneficial effects: the wave-absorbing material of the ultrathin and ultra-wide spectrum is based on a resistive film wave-absorbing structure, adopts an isotropic annular resistive film, and realizes 10 frequency multiplication S of a single-layer wave-absorbing structure body11The wave-absorbing material has the wave-absorbing characteristic below-10 dB, the ultra-wide and super-strong absorption characteristic is still kept within 30 degrees of oblique incidence, the preparation process is simple and feasible, and the size of the wave-absorbing material can be customized.
Drawings
FIG. 1 is a schematic structural diagram of a wave absorber of the ultra-thin and ultra-wide spectrum wave absorbing material of the present invention;
FIG. 2 is a schematic structural diagram of a wave-absorbing array formed by a plurality of wave-absorbing bodies of the ultra-thin and ultra-wide spectrum wave-absorbing material of the present invention arranged periodically;
FIG. 3 is a wave-absorbing characteristic curve diagram of the ultra-thin and ultra-wide spectrum wave-absorbing material of the present invention at normal incidence;
FIG. 4 is a graph showing the effect of the wave-absorbing properties of the ring-shaped resistive film with different sheet resistances of the ultra-thin and ultra-wide spectrum wave-absorbing material of the present invention;
FIG. 5 is a graph showing the relationship between the wave-absorbing performance and the incident angle of the ultra-thin and ultra-wide spectrum wave-absorbing material of the present invention.
Detailed Description
The ultra-thin and ultra-wide spectrum wave-absorbing material and the preparation method thereof are further described by combining the embodiment and the attached drawings:
as shown in fig. 1-2, the present invention provides an ultra-thin and ultra-wide spectrum wave-absorbing material, which includes a metal base plate 1, a wave-absorbing structure layer 2 disposed on the metal base plate 1, the wave-absorbing structure layer 2 being formed by a plurality of wave absorbers 21 periodically arranged in a wave-absorbing array, each wave absorber 21 including a medium substrate layer 211 and an annular resistive film 212 disposed on an upper surface of the medium substrate layer 211, the medium substrate layer 211 being disposed on the upper surface of the metal base plate 1. Wherein, preferably, the thickness of the dielectric substrate layer 211 is less than or equal to 10mm, and the thickness of the dielectric substrate layer 211 is preferably 5 mm; the thickness of the annular resistive film 212 is 10-100 μm; the thickness of the metal base plate 1 is 10 to 20 μm. The ultra-thin ultra-wide spectrum wave-absorbing material has three wave-absorbing peaks at low frequency band, intermediate frequency and high frequency, forms an ultra-wide wave-absorbing frequency band with 2.5-25GHz, 10 frequency multiplication and 163% relative bandwidth, and has low angle dependence, an incident angle within 30 degrees and wave-absorbing performance kept below-10 dB.
The dielectric substrate layer 211 may be made of an aramid honeycomb composite material, such as aramid paper or aramid cloth; or may be made of a foam material such as a lightweight polymethacrylimide foam or the like. The annular resistive film 212 is made of conductive carbon black, the annular resistive film 212 with different square resistance values can be made by conductive carbon black with different contents, and the lower the content is, the higher the square resistance value is. The metal base plate 1 is made of gold, copper or aluminum.
The relative dielectric constant of the dielectric substrate layer 211 is 0.9-1.1; the relative magnetic permeability of the medium substrate layer 211 is 0.9-1.1. The dielectric constant and the magnetic conductivity can be approximate to 1, the thickness is less than 10mm, and the ultrathin property of the wave-absorbing material is ensured.
The square resistance of the annular resistive film 212 is preferably 180-220 Ω/□, and fig. 4 shows the wave-absorbing characteristics of the annular resistive film 212 with different square resistances. The annular resistive film 212 is preferably circular in shape and is centered on the upper surface of the dielectric substrate layer 211. The wave absorber 21 has a square cross section, and the side length of the square is preferably 15mm-25 mm. The outer diameter of the annular resistive film 212 is equal to the side length of the cross section of the wave absorber 21, which is-0.4 mm; the inner diameter of the annular resistive film 212 is-13.4 mm equal to the side length of the cross section of the wave absorber 21.
Taking the preferred embodiment of the present invention as an example, the dielectric substrate layer 211 is made of lightweight polymethacrylimide foam, the thickness of the lightweight polymethacrylimide foam is 5mm, and the relative dielectric constant of the lightweight polymethacrylimide foam is 1.08; the annular resistive film 212 is circular, the square resistance of the annular resistive film 212 is 200 Ω/□, the cross section of the wave absorber 21 is square and the side length is 20mm, the outer diameter of the annular resistive film 212 is 19.6mm, and the inner diameter of the annular resistive film 212 is 6.6 mm.
The wave absorbing material with the ultrathin and ultra-wide spectrum in the preferred embodiment has the wave absorbing characteristics that: 2.5-25GHz within 10 frequency doubling range to realize S11The wave absorption curve is shown in figure 3, and the wave absorption curve is lower than-10 dB.
It should be noted that the annular resistive film 212 may also be shaped as a square ring or a hexagonal ring, which includes, but is not limited to, a circular ring, a square ring, or a hexagonal ring. The annular resistive film has good isotropy, the incident angle is within 30 degrees, the wave absorbing performance is 2.5-25GHz, and the wave absorbing performance is kept below-10 dB, as shown in figure 5.
The invention also relates to a preparation method of the wave-absorbing material, which comprises the following steps:
s1, printing the material of the annular resistive film 212 on the film through a screen printing technology to obtain the annular resistive film 212; in particular, the amount of the solvent to be used,
s11, manufacturing a complementary metal mesh according to the shape pattern of the required annular resistive film 212; the metal mesh can be a copper mesh, a stainless steel mesh and the like;
s13, placing the metal net on the film, printing conductive carbon black slurry, taking down the metal net, and standing and drying;
s2, attaching the annular resistive film 212 to the dielectric substrate layer 211;
s3, detecting whether the square resistance of the annular resistive film 212 meets the requirement, and cutting the annular resistive film into required size.
The preparation method further comprises electroplating the metal bottom plate 1 on the medium substrate layer 211 or etching the metal bottom plate on the medium substrate layer 211. In other embodiments, the dielectric substrate layer 211 of the single-layer metal-clad backplane 1 can be directly customized and used directly.
It will be understood that modifications and variations can be made by persons skilled in the art in light of the above teachings, and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.
Claims (7)
1. The wave-absorbing material is characterized by comprising a metal base plate, wherein a wave-absorbing structure layer is arranged on the metal base plate and is formed by periodically arranging a plurality of wave absorbers, each wave absorber comprises a medium substrate layer and an isotropic annular resistive film arranged on the upper surface of the medium substrate layer, and the medium substrate layer is arranged on the upper surface of the metal base plate; the thickness of the annular resistive film is 10-100 microns, the annular resistive film is obtained by printing the annular resistive film on a film through a screen printing technology, and the annular resistive film is pasted to the medium substrate layer;
the outer diameter of the annular resistive film is equal to the side length of the cross section of the wave absorber to be 0.4 mm; the inner diameter of the annular resistive film is equal to the side length of the cross section of the wave absorber to be 13.4 mm;
the annular resistive film is in a ring shape and is positioned in the center of the upper surface of the medium substrate layer, and the medium substrate layer is made of aramid fiber honeycomb composite materials.
2. The wave absorbing material as claimed in claim 1, wherein the square resistance of the annular resistive film is 180-220 Ω/□.
3. The wave absorbing material of claim 1, wherein the annular resistive film is made of conductive carbon black; the metal base plate is made of gold, copper or aluminum.
4. The wave absorbing material of claim 1, wherein the wave absorber has a square cross section, and the side length of the square is 15mm-25 mm.
5. The wave-absorbing material of claim 1, wherein the thickness of the dielectric substrate layer is less than or equal to 10 mm; the thickness of the metal bottom plate is 10-20 μm.
6. A method for preparing a wave-absorbing material according to any one of claims 1 to 5, comprising:
s1, printing the material of the annular resistive film on the film through a screen printing technology to obtain the annular resistive film;
and S2, adhering the annular resistive film to the medium substrate layer.
7. The method according to claim 6, wherein step S1 specifically includes:
s11, manufacturing a complementary metal mesh according to the shape pattern of the required annular resistive film;
s12, placing the metal net on the film, printing conductive carbon black slurry, taking off the metal net, and standing and drying.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910079579.8A CN109862769B (en) | 2019-01-28 | 2019-01-28 | Ultra-thin and ultra-wide spectrum wave-absorbing material and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910079579.8A CN109862769B (en) | 2019-01-28 | 2019-01-28 | Ultra-thin and ultra-wide spectrum wave-absorbing material and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109862769A CN109862769A (en) | 2019-06-07 |
| CN109862769B true CN109862769B (en) | 2021-03-26 |
Family
ID=66896524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910079579.8A Active CN109862769B (en) | 2019-01-28 | 2019-01-28 | Ultra-thin and ultra-wide spectrum wave-absorbing material and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109862769B (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110380223B (en) * | 2019-07-10 | 2020-10-16 | 浙江大学 | Omnidirectional perfect matching transparent material conforming to uniaxial perfect matching layer model |
| CN110366361A (en) * | 2019-08-06 | 2019-10-22 | 集美大学 | A kind of wave absorbing device based on super surface |
| CN110556632B (en) * | 2019-08-16 | 2021-01-19 | 华中科技大学 | Flexible resistive film-metal composite frequency selective surface, preparation and application thereof |
| CN111262039A (en) * | 2020-02-12 | 2020-06-09 | 成都信息工程大学 | Broadband metamaterial wave-absorbing unit based on resistive film and wave-absorbing material |
| CN112020294B (en) * | 2020-08-05 | 2022-12-23 | 深圳市佳晨科技有限公司 | Ultra-wide spectrum wave-absorbing material and preparation method thereof |
| CN113054443B (en) * | 2021-03-23 | 2024-02-06 | 广东顺德西安交通大学研究院 | Low-frequency wave absorber |
| CN113258302A (en) * | 2021-05-18 | 2021-08-13 | 中南大学 | Broadband wave absorber and preparation method thereof |
| CN113619212B (en) * | 2021-07-13 | 2024-02-02 | 中国科学院光电技术研究所 | High-strength flexible fabric wave-absorbing material and preparation method thereof |
| CN115339189B (en) * | 2022-07-21 | 2024-07-16 | 东华大学 | Flexible broadband wave-absorbing fabric and preparation method thereof |
| CN115260988B (en) * | 2022-08-15 | 2023-08-01 | 南京航空航天大学 | Composite wave-absorbing material and preparation method thereof |
| CN115742503A (en) * | 2022-11-29 | 2023-03-07 | 航天科工武汉磁电有限责任公司 | Light and thin electromagnetic isolation material and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102724856A (en) * | 2012-06-06 | 2012-10-10 | 电子科技大学 | Multi-layer electromagnetic wave absorbing structure and preparation method thereof |
| CN103249290A (en) * | 2013-05-13 | 2013-08-14 | 电子科技大学 | Single-layered composite element wideband periodic wave-absorbing structure |
| CN105244630A (en) * | 2015-10-13 | 2016-01-13 | 中国人民解放军空军工程大学 | Novel three-dimensional broadband super-light wave-absorbing material and designing method thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102732210A (en) * | 2012-06-28 | 2012-10-17 | 中国人民解放军国防科学技术大学 | Electromagnetic-wave absorption-material having periodic structure, and preparation method thereof |
| CN102769210B (en) * | 2012-06-29 | 2014-12-24 | 深圳光启创新技术有限公司 | Wideband wave-absorbing material |
| CN103579776A (en) * | 2013-10-31 | 2014-02-12 | 电子科技大学 | Electromagnetic wave-absorbing material with improved oblique incidence performance |
| WO2016200168A1 (en) * | 2015-06-10 | 2016-12-15 | 오현석 | Electromagnetic wave shielding material using nanostructure |
-
2019
- 2019-01-28 CN CN201910079579.8A patent/CN109862769B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102724856A (en) * | 2012-06-06 | 2012-10-10 | 电子科技大学 | Multi-layer electromagnetic wave absorbing structure and preparation method thereof |
| CN103249290A (en) * | 2013-05-13 | 2013-08-14 | 电子科技大学 | Single-layered composite element wideband periodic wave-absorbing structure |
| CN105244630A (en) * | 2015-10-13 | 2016-01-13 | 中国人民解放军空军工程大学 | Novel three-dimensional broadband super-light wave-absorbing material and designing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109862769A (en) | 2019-06-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109862769B (en) | Ultra-thin and ultra-wide spectrum wave-absorbing material and preparation method thereof | |
| CN110504553B (en) | Multilayer ultra-wideband wave absorber compounded by electric loss material and magnetic material | |
| CN103249290B (en) | A kind of monolayer recombiner unit broadband periodic absorbent structure | |
| CN109167181B (en) | Broadband periodic wave absorbing structure of graphical honeycomb unit | |
| CN111755835B (en) | Broadband periodic wave absorbing structure based on magnetic substrate | |
| CN112095351B (en) | Frequency band-adjustable integrated multilayer wave-absorbing planar fabric and preparation method thereof | |
| CN103490171A (en) | Composite wave-absorbing material with wide frequency bands | |
| CN113224544A (en) | Housing assembly and electronic device | |
| CN112864633B (en) | Broadband microwave absorber based on super surface | |
| CN104485515A (en) | A broadband absorbing material loaded with lumped elements | |
| CN112020294B (en) | Ultra-wide spectrum wave-absorbing material and preparation method thereof | |
| CN114336086A (en) | Ultra-wideband wave absorbing structure for reducing RCS (radar cross section) of antenna | |
| CN114725688A (en) | Wave-absorbing wave-transmitting integrated wave absorber | |
| CN105101764B (en) | A kind of stereo-unit broadband periodic absorbent structure | |
| CN111293441B (en) | Wave absorbing and transmitting integrated wave absorber | |
| CN113629406A (en) | Automobile radar ultra-wide spectrum wave absorber with magnetic patch | |
| CN116207516B (en) | High-performance metamaterial wave absorber based on three-layer super surface | |
| CN216850343U (en) | Arbitrary polarization three-dimensional broadband wave absorber | |
| CN216055191U (en) | Double-layer resonance coupling wave absorber | |
| CN113629407A (en) | Multilayer artificial structure wave-absorbing material and preparation method thereof | |
| CN113394569B (en) | Low-profile dual-band wave-absorbing surface applied to vehicle-mounted radar test environment and manufacturing method thereof | |
| CN109219335B (en) | Broadband wave absorbing plate and manufacturing method thereof | |
| CN216980883U (en) | Multilayer artificial structure wave-absorbing structure | |
| CN114122743A (en) | Wave absorbing/transmitting device with miniaturized units | |
| CN115339189B (en) | Flexible broadband wave-absorbing fabric and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |