CN109856913A - A kind of photoresist and its photoetching process applied to OGS touch screen - Google Patents

A kind of photoresist and its photoetching process applied to OGS touch screen Download PDF

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Publication number
CN109856913A
CN109856913A CN201910083785.6A CN201910083785A CN109856913A CN 109856913 A CN109856913 A CN 109856913A CN 201910083785 A CN201910083785 A CN 201910083785A CN 109856913 A CN109856913 A CN 109856913A
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mobile phone
parts
photoresist
screen
drying
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CN201910083785.6A
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Chinese (zh)
Inventor
肖新煌
张磊
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SUNOPTIC TECHNOLOGY Co Ltd
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SUNOPTIC TECHNOLOGY Co Ltd
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Priority to CN201910083785.6A priority Critical patent/CN109856913A/en
Publication of CN109856913A publication Critical patent/CN109856913A/en
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Abstract

The invention belongs to touch screen production technical fields, specifically a kind of photoresist and its photoetching process applied to OGS touch screen, wherein, photoresist applied to OGS touch screen, including photosensitive resin, sensitizer and solvent composition, photosensitive resin, the composition mass ratio of sensitizer and solvent is 20:3:60, it include following component in the synthesis material of photosensitive resin: 10-15 parts of epoxy acrylic resin, 1-2 parts of Lauxite, 2-3 parts of aqueous polyurethane, 15-17 parts of Photoepolymerizationinitiater initiater, 3-4 parts and dimethyl sulfoxide 65-75 parts of N- dimethylethanolamine, it can effectively control Mobile phone screen when carrying out photoresist coating, thickness deviation amount is within 1 μm, to which the stability of touch controlled handset screen photoetching process be effectively ensured;Also providing a kind of photoetching process includes b1-b8, and the touch controlled handset screen of technique production can effectively ensure that the link performance of Mobile phone screen is stablized, while the working efficiency relative to coating by hand and sputtering coating is higher.

Description

A kind of photoresist and its photoetching process applied to OGS touch screen
Technical field
The invention belongs to touch screen production technical field, specifically a kind of photoresist applied to OGS touch screen and Its photoetching process.
Background technique
OGS touch screen is that a kind of technology of ITO conductive film and sensor is directly formed on protection glass, can play protection The double action of glass and touch sensor, and the film layer knot of country TPSENSOR (touch screen panel/touched panel glass) at present Structure is complicated, and thickness is larger, wherein main metal conductive film, generallys use MOALMO material and SENSOR wiring is made, by AL's The limitation of conductive and etching performance, generally can only achieve 0.3-0.4 ohm of square resistance, resistance is big, and electric conductivity is bad;In hand When machine screen is glued, the surface contamination of Mobile phone screen is be easy to cause using sputtering gluing, meanwhile, Mobile phone screen uses traditional silk screen When gluing, the component and temperature and humidity of photoresist, and the technique of gluing play vital influence to Mobile phone screen photoetching quality.
Also occur the technical solution of some OGS touch screens production in the prior art, such as application No. is 201610922622.9 Chinese patent discloses a kind of production technology of OGS screen, comprising: 1, using spin-coating method black Photosensitive resin is coated in non-window area on the upside of glass substrate;2, the surface of ink layer is using magnetron sputtering at the first tin indium oxide ITO conductive film;3, the surface of the first tin indium oxide ITO conductive film is using magnetron sputtering at APC metallic conduction film layer;4, It smears to form the first OC insulation protection film layer in the surface of APC metallic conduction film layer;5, the surface of the first OC insulation protection film layer is again Using the method for magnetron sputtering at second layer tin indium oxide ITO conductive film;6, shape is smeared on second layer tin indium oxide ITO conductive film At second layer OC insulation protection film layer.The technical solution carries out the coating of photosensitive resin using traditional spin-coating method, can not To Mobile phone screen carry out silk-screen coating when control Mobile phone screen on photoresist thickness stablize, so as to cause in Mobile phone screen subsequent Drying, exposure in make photoetching process unstable, so as to cause defective products probability rise so that the use of the technical solution by Limitation is arrived.
Summary of the invention
In order to make up for the deficiencies of the prior art, the invention proposes a kind of photoresists and its light applied to OGS touch screen Carving technology, present invention is mainly used for the photoetching processes provided in a kind of production of touch controlled handset screen, and the present invention provides one kind can Make Mobile phone screen in silk-screen printing coating, the photoresist of Mobile phone screen thickness stable homogeneous;Meanwhile the present invention is a kind of new by designing Silk-screen printing photoetching process improve the stability of Mobile phone screen touch control line.It solves in actual production and is contacted not in touch screen Good problem.
The technical solution adopted by the present invention to solve the technical problems is: being applied to OGS the present invention provides one kind and touches The photoresist of screen, including photosensitive resin, sensitizer and solvent composition, the composition quality of the photosensitive resin, sensitizer and solvent Than for 20:3:60, wherein include following component in the synthesis material of the photosensitive resin:
10-15 parts of epoxy acrylic resin, 1-2 parts of Lauxite, 2-3 parts of aqueous polyurethane, Photoepolymerizationinitiater initiater 15-17 Part, 3-4 parts of N- dimethylethanolamine and 65-75 parts of dimethyl sulfoxide;
The photosensitive resin includes following synthesis step:
A1, by epoxy acrylic resin, Lauxite, aqueous polyurethane and N- dimethylethanolamine ball milling in the ball mill Revolving speed is 150r/min, and ball milling 2h forms mixture;
A2, Photoepolymerizationinitiater initiater continuation ball milling 2h is added into the mixture of step a1, the revolving speed of ball mill is 150r/ min;
Dimethyl sulfoxide is added in a3, the ball mill into step a2 and carries out wet-milling 8-12h, the revolving speed of ball mill is set as 80-90r/min forms photosensitive resin slurries;
Continue ball milling 30min after a4,5-6h that the photosensitive resin slurries in step a3 are rested, then collects spare.
Further, the epoxy acrylic resin is 13 parts, Lauxite is 2 parts, aqueous polyurethane is 2.5 parts, light Polymerization initiator is 17 parts, N- dimethylethanolamine is 3.5 parts and dimethyl sulfoxide is 70 parts.
Further, the sensitizer is sodium thiosulfate, and solvent is dimethylbenzene.
Meanwhile the present invention also provides a kind of technique for carrying out photoetching to OGS Mobile phone screen using above-mentioned photoresist, the techniques Include the following steps:
B1, it after carrying out alcohol ultrasonic cleaning 30min to mobile phone panel glass, takes out mobile phone panel glass and is dried;
B2, the mobile phone panel glass after step b1 drying is placed on screen process press, and is placed in cell phone screen glass Mold web plate, then screen process press carries out photoresist coating to cell phone screen glass by mold web plate;
B3, drying and processing is carried out to the photoresist on step b2 treated mobile phone panel glass;
B4, the mobile phone panel glass after step b3 drying is put into vacuumize and is exposed processing in exposure machine;
B5, photoresist non-polymeric on the Mobile phone screen after step b4 exposure is purged;
B6, drying and processing is carried out to the photoresist on step b5 treated Mobile phone screen;
B7, by step b6, treated that Mobile phone screen is put into performs etching into etching machine;
B8, by step b7, treated that Mobile phone screen is put into 3% sodium hydrate aqueous solution dial except photoresist.
Further, in the step b2 in screen process press the mould of mold web plate with a thickness of 5 μm.
Further, the humidity of the drying environment in the step b3 is 90%RH, and drying temperature is 60-75 DEG C, drying Time is 17-19min.
Further, the humidity of drying environment is 20%RH in the step b6, and drying temperature is 75-80 DEG C, when drying Between be 26-30min.
The beneficial effects of the present invention are:
1. the present invention carries out silk by providing a kind of photoresist applied to OGS touch screen, to solve Mobile phone screen photoresist Wire mark brushes deposited problem in uneven thickness, and since the viscosity of photoresist determines the free-running property of photoresist, viscosity is too low unfavorable In the adherency of photoresist, viscosity is too high, and photoresist is caused to concentrate on the surface of Mobile phone screen, to cause the thickness of Mobile phone screen It is excessive;Photoresist prepared by the present invention can effectively control Mobile phone screen when carrying out photoresist coating, thickness deviation amount 1 μm it It is interior, so that the stability of touch controlled handset screen photoetching process be effectively ensured.
2. the present invention additionally provides a kind of technique of Mobile phone screen photoetching simultaneously, which includes step b1- step b8, the work The touch controlled handset screen of skill production can effectively ensure that the link performance of Mobile phone screen is stablized, while relative to coating by hand and sputtering The working efficiency of coating is higher.
Specific embodiment
In order to be easy to understand the technical means, the creative features, the aims and the efficiencies achieved by the present invention, tie below Following specific embodiments are closed, the present invention is further explained.
A kind of photoresist applied to OGS touch screen, the embodiment and performance indicator of preparation process are as follows:
Embodiment 1:
A1, by 1kg epoxy acrylic resin, 0.1kg Lauxite, the aqueous polyurethane of 0.2kg and 0.3kgN- dimethyl second Rotational speed of ball-mill is 150r/min to hydramine in the ball mill, and ball milling 2h forms mixture;
A2,1.5kg Photoepolymerizationinitiater initiater continuation ball milling 2h is added into the mixture of step a1, the revolving speed of ball mill is 150r/min;
6.5kg dimethyl sulfoxide is added in a3, the ball mill into step a2 and carries out wet-milling 8h, the revolving speed setting of ball mill For 90r/min, photosensitive resin slurries are formed;
Continue ball milling 30min after a4,5h that the photosensitive resin slurries in step a3 are rested, then collects spare;
A5,1.44kg sensitizer sodium thiosulfate is subjected to ball milling, be then added in 28.8kg alcohol solvent, while to Pour into step a4 in the alcohol solvent treated photosensitive resin slurries.
Embodiment 2:
A1, by 1.5kg epoxy acrylic resin, 0.2kg Lauxite, the aqueous polyurethane of 0.3kg and 0.4kgN- dimethyl Rotational speed of ball-mill is 150r/min to ethanol amine in the ball mill, and ball milling 2h forms mixture;
A2,1.7kg Photoepolymerizationinitiater initiater continuation ball milling 2h is added into the mixture of step a1, the revolving speed of ball mill is 150r/min;
7.5kg dimethyl sulfoxide is added in a3, the ball mill into step a2 and carries out wet-milling 8-12h, the revolving speed of ball mill It is set as 80-90r/min, forms photosensitive resin slurries;
Continue ball milling 30min after a4,5-6h that the photosensitive resin slurries in step a3 are rested, then collects spare;
A5,1.74kg sensitizer sodium thiosulfate is subjected to ball milling, be then added in 34.8kg alcohol solvent, while to Pour into step a4 in the alcohol solvent treated photosensitive resin slurries.
Embodiment 3:
A1, by 1.3kg epoxy acrylic resin, 0.2kg Lauxite, the aqueous polyurethane of 0.25kg and 0.35kgN- diformazan Rotational speed of ball-mill is 150r/min to ethylethanolamine in the ball mill, and ball milling 2h forms mixture;
A2,1.7kg Photoepolymerizationinitiater initiater continuation ball milling 2h is added into the mixture of step a1, the revolving speed of ball mill is 150r/min;
7kg dimethyl sulfoxide is added in a3, the ball mill into step a2 and carries out wet-milling 8-12h, the revolving speed of ball mill is set It is set to 80-90r/min, forms photosensitive resin slurries;
Continue ball milling 30min after a4,5-6h that the photosensitive resin slurries in step a3 are rested, then collects spare;
A5,1.62kg sensitizer sodium thiosulfate is subjected to ball milling, be then added in 32.4kg alcohol solvent, while to Pour into step a4 in the alcohol solvent treated photosensitive resin slurries.
The photoresist that embodiment 1-3 is respectively adopted respectively processes 100 Mobile phone screens, and controls Mobile phone screen in same batch Production, and, Mobile phone screen carries out silk-screen gluing in 5 μm of screen templates;Its light obtained of embodiment 1, embodiment 2 and embodiment 3 Design parameter and index when photoresist is applied in Mobile phone screen coating technique is as follows,
When Mobile phone screen applies photoresist, the thickness deviation of photoresist is bigger, and the photoresist of Mobile phone screen coating is more unstable, The temperature in the applied thickness of photoresist and the viscosity and process environments of photoresist itself has a certain impact simultaneously, and the present invention is Temperature control carries out in 23 DEG C of process environments.By the data in embodiment 1-3 it is recognised that using embodiment 1 or 2 When, the quantity of Mobile phone screen of the absolute deviation amount between 0.5-1 μm is more, and uses embodiment 3 then less, illustrates embodiment 3 The rubberization thickness of Mobile phone screen is stablized, so that the stability of Mobile phone screen photoetching be effectively ensured.
When absolute deviation amount is greater than 1 μm, does not meet the Mobile phone screen of the condition in embodiment 1-3, illustrate using this When the photoresist of invention carries out silk-screen printing coating, performance is relatively stable, applies so as to which the photoresist of Mobile phone screen is effectively ensured It applies.
The technique for carrying out photoetching to OGS Mobile phone screen using above-mentioned photoresist, specific embodiment are as follows:
Embodiment 1a:
B1, it after carrying out alcohol ultrasonic cleaning 30min to mobile phone panel glass, takes out mobile phone panel glass and is dried;
B2, the mobile phone panel glass after step b1 drying is placed on screen process press, and is placed in cell phone screen glass Mold web plate, then screen process press by mould with a thickness of 5 μm mold web plate come to cell phone screen glass carry out photoresist painting Cloth;
B3, drying and processing is carried out to the photoresist on step b2 treated mobile phone panel glass, drying humid control is existed 90%, at 60 DEG C, drying time is controlled in 17min for drying temperature control;
B4, the mobile phone panel glass after step b3 drying is put into vacuumize and is exposed processing in exposure machine;
B5, photoresist non-polymeric on the Mobile phone screen after step b4 exposure is purged;
B6, drying and processing is carried out to the photoresist on step b5 treated Mobile phone screen, humid control is in drying environment 20%RH, drying temperature are 75 DEG C, drying time 30min;
B7, by step b6, treated that Mobile phone screen is put into performs etching into etching machine;
B8, by step b7, treated that Mobile phone screen is put into 3% sodium hydrate aqueous solution dial except photoresist.
Embodiment 2a:
B1, it after carrying out alcohol ultrasonic cleaning 30min to mobile phone panel glass, takes out mobile phone panel glass and is dried;
B2, the mobile phone panel glass after step b1 drying is placed on screen process press, and is placed in cell phone screen glass Mold web plate, then screen process press by mould with a thickness of 5 μm mold web plate come to cell phone screen glass carry out photoresist painting Cloth;
B3, drying and processing is carried out to the photoresist on step b2 treated mobile phone panel glass, drying humid control is existed 90%, at 75 DEG C, drying time is controlled in 19min for drying temperature control;
B4, the mobile phone panel glass after step b3 drying is put into vacuumize and is exposed processing in exposure machine;
B5, photoresist non-polymeric on the Mobile phone screen after step b4 exposure is purged;
B6, drying and processing is carried out to the photoresist on step b5 treated Mobile phone screen, humid control is in drying environment 20%RH, drying temperature are 80 DEG C, drying time 26min;
B7, by step b6, treated that Mobile phone screen is put into performs etching into etching machine;
B8, by step b7, treated that Mobile phone screen is put into 3% sodium hydrate aqueous solution dial except photoresist.
Embodiment 3a:
B1, it after carrying out alcohol ultrasonic cleaning 30min to mobile phone panel glass, takes out mobile phone panel glass and is dried;
B2, the mobile phone panel glass after step b1 drying is placed on screen process press, and is placed in cell phone screen glass Mold web plate, then screen process press by mould with a thickness of 5 μm mold web plate come to cell phone screen glass carry out photoresist painting Cloth;
B3, drying and processing is carried out to the photoresist on step b2 treated mobile phone panel glass, drying humid control is existed 90%, at 72 DEG C, drying time is controlled in 18min for drying temperature control;
B4, the mobile phone panel glass after step b3 drying is put into vacuumize and is exposed processing in exposure machine;
B5, photoresist non-polymeric on the Mobile phone screen after step b4 exposure is purged;
B6, drying and processing is carried out to the photoresist on step b5 treated Mobile phone screen, humid control is in drying environment 20%RH, drying temperature are 77 DEG C, drying time 29min;
B7, by step b6, treated that Mobile phone screen is put into performs etching into etching machine;
B8, by step b7, treated that Mobile phone screen is put into 3% sodium hydrate aqueous solution dial except photoresist.
Respectively to 100 touch controlled handset screens having in embodiment 1a-3a and 100 using manual coated techniques and The touch controlled handset screen of 100 sputtering technologies carries out performance detection, and detection project and detection data are as follows:
As can be known from the above table for traditional-handwork coating photoetching process, the technique using coating by hand, the quality of coating by The influence of staff's gimmick, dynamics is excessive, and photoresist binding force on Mobile phone screen is caused to spend the difficulty for causing stripping glue greatly, Dynamics is too small simultaneously, and the void of sizing material on Mobile phone screen is caused to fill out, to cause the conduction of touch-control line in Mobile phone screen bad;Using splashing Penetrating technique is that photoresist is splashed to the position that Mobile phone screen needs gluing by injector head, this kind of mode cause Mobile phone screen easily by To pollution, so that scavenging period and the stripping glue time of Mobile phone screen are increased, so that the sputtering technology true deadline is by shadow It rings.
Using the technical program by silk-screen printing, then carries out the photoetching obvious deadline and photoetching defective products is less than Traditional-handwork coating and sputtering coating, while embodiment 1a and reality are obviously better than using the obtained Mobile phone screen of embodiment a3 again Apply a 2a.
The basic principles, main features and advantages of the invention have been shown and described above.The technical staff of the industry should Understand, the present invention is not limited to the above embodiments, and the above embodiments and description only describe originals of the invention Reason, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes and improvements It all fall within the protetion scope of the claimed invention.The claimed scope of the invention is by appended claims and its equivalent circle It is fixed.

Claims (7)

1. a kind of photoresist applied to OGS touch screen, including photosensitive resin, sensitizer and solvent composition, it is characterised in that: institute The composition mass ratio for stating photosensitive resin, sensitizer and solvent is 20:3:60, wherein is wrapped in the synthesis material of the photosensitive resin Include following component:
10-15 parts of epoxy acrylic resin, 1-2 parts of Lauxite, 2-3 parts of aqueous polyurethane, 15-17 parts of Photoepolymerizationinitiater initiater, 3-4 parts and dimethyl sulfoxide 65-75 parts of N- dimethylethanolamine;
The photosensitive resin includes following synthesis step:
A1, by epoxy acrylic resin, Lauxite, aqueous polyurethane and N- dimethylethanolamine rotational speed of ball-mill in the ball mill Mixture is formed for 150r/min, ball milling 2h;
A2, Photoepolymerizationinitiater initiater continuation ball milling 2h is added into the mixture of step a1, the revolving speed of ball mill is 150r/min;
Dimethyl sulfoxide is added in a3, the ball mill into step a2 and carries out wet-milling 8-12h, the revolving speed of ball mill is set as 80- 90r/min forms photosensitive resin slurries;
Continue ball milling 30min after a4,5-6h that the photosensitive resin slurries in step a3 are rested, then collects spare.
2. a kind of photoresist applied to OGS touch screen according to claim 1, it is characterised in that: the propylene oxide Acid resin is 13 parts, Lauxite is 2 parts, aqueous polyurethane is 2.5 parts, Photoepolymerizationinitiater initiater is 17 parts, N- dimethyl ethanol Amine is 3.5 parts and dimethyl sulfoxide is 70 parts.
3. a kind of photoresist applied to OGS touch screen according to claim 1, it is characterised in that: the sensitizer is Sodium thiosulfate, solvent are dimethylbenzene.
4. a kind of photoetching process for carrying out OGS touch screen using photoresist as claimed in claim 2 or claim 3, it is characterised in that: should Technique includes the following steps:
B1, it after carrying out alcohol ultrasonic cleaning 30min to mobile phone panel glass, takes out mobile phone panel glass and is dried;
B2, the mobile phone panel glass after step b1 drying is placed on screen process press, and places mold in cell phone screen glass Web plate, then screen process press carries out photoresist coating to cell phone screen glass by mold web plate;
B3, drying and processing is carried out to the photoresist on step b2 treated mobile phone panel glass;
B4, the mobile phone panel glass after step b3 drying is put into vacuumize and is exposed processing in exposure machine;
B5, photoresist non-polymeric on the Mobile phone screen after step b4 exposure is purged;
B6, drying and processing is carried out to the photoresist on step b5 treated Mobile phone screen;
B7, by step b6, treated that Mobile phone screen is put into performs etching into etching machine;
B8, by step b7, treated that Mobile phone screen is put into 3% sodium hydrate aqueous solution dial except photoresist.
5. the photoetching process of OGS touch screen according to claim 4, it is characterised in that: silk-screen printing in the step b2 The mould of mold web plate is in machine with a thickness of 5 μm.
6. the photoetching process of OGS touch screen according to claim 4, it is characterised in that: the drying ring in the step b3 The humidity in border is 90%RH, and drying temperature is 60-75 DEG C, drying time 17-19min;
The humidity of drying environment is 20%RH in the step b6, and drying temperature is 75-80 DEG C, drying time 26-30min.
7. the photoetching process of OGS touch screen according to claim 6, it is characterised in that: drying temperature in the step b3 It is 72 DEG C, drying time 18min;
The drying temperature of drying environment is 77 DEG C in the step b6, drying time 29min.
CN201910083785.6A 2019-01-29 2019-01-29 A kind of photoresist and its photoetching process applied to OGS touch screen Pending CN109856913A (en)

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Application Number Priority Date Filing Date Title
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CN105676590A (en) * 2016-04-12 2016-06-15 无锡南理工科技发展有限公司 Photosensitive resin
CN106648230A (en) * 2016-12-12 2017-05-10 晟光科技股份有限公司 OGS touch screen manufacturing method with high finished product ratio

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Publication number Priority date Publication date Assignee Title
WO2011034124A1 (en) * 2009-09-18 2011-03-24 太陽インキ製造株式会社 Photosensitive resin composition, dry film and cured product thereof, and printed wiring board using the same
CN105378615A (en) * 2013-07-25 2016-03-02 东丽株式会社 Negative-type photosensitive white composition for touch panel, touch panel, and production method for touch panel
CN104750308A (en) * 2013-12-30 2015-07-01 乐金显示有限公司 Method for manufacturing touch device and resin composition thereof
CN105676590A (en) * 2016-04-12 2016-06-15 无锡南理工科技发展有限公司 Photosensitive resin
CN106648230A (en) * 2016-12-12 2017-05-10 晟光科技股份有限公司 OGS touch screen manufacturing method with high finished product ratio

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