CN109855520B - Micro-nano precision measurement displacement sensor, system and preparation method - Google Patents
Micro-nano precision measurement displacement sensor, system and preparation method Download PDFInfo
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- CN109855520B CN109855520B CN201910001926.5A CN201910001926A CN109855520B CN 109855520 B CN109855520 B CN 109855520B CN 201910001926 A CN201910001926 A CN 201910001926A CN 109855520 B CN109855520 B CN 109855520B
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Abstract
The invention discloses a micro-nano precision measurement displacement sensor, which comprises a compliant mechanism with reverse gain, a displacement measurement electrode and a sensor shell for integral packaging; the compliant mechanism is connected to the sensor shell by adopting an integrated processing and forming technology, the head end of the compliant mechanism is provided with a measured displacement contact input end, and the tail end of the compliant mechanism is provided with an output end moving electrode; the displacement measuring electrode comprises a first electrode, a second electrode, a third electrode and a fourth electrode, the first electrode and the second electrode are respectively arranged above and below the left end of the moving electrode, the third electrode and the fourth electrode are respectively arranged above and below the right end of the moving electrode, the first electrode, the second electrode, the third electrode and the fourth electrode are fixedly connected with the sensor shell, the moving electrode, the first electrode, the second electrode, the third electrode and the fourth electrode jointly form two groups of differential displacement measuring circuits, and micro-nano displacement measurement is realized through an external reading processing circuit.
Description
Technical Field
The invention relates to the technical field of sensors, in particular to a micro-nano precision measurement displacement sensor.
Background
Displacement sensors can be divided into various types according to different measurement principles, wherein capacitive displacement sensors are widely applied to displacement measurement of mechanisms; the traditional capacitive sensor can realize accurate measurement of displacement by adjusting the installation arrangement mode of electrodes; however, for the measurement of micro-nano displacement, the conventional capacitive sensor cannot measure the displacement of micro-nano level due to large precision error, so that the precise measurement of micro-nano displacement is realized, the requirement on the installation of a capacitive electrode is great, and the circuit design is also greatly challenged.
Disclosure of Invention
The invention provides a micro-nano precision measurement displacement sensor, a micro-nano precision measurement displacement system and a preparation method, which are used for solving the technical problem that the traditional sensor cannot accurately measure micro-nano displacement, so that micro-nano displacement can be accurately measured.
In order to solve the technical problem, an embodiment of the present invention provides a micro-nano precision measurement displacement sensor, including a compliant mechanism with reverse gain, a displacement measurement electrode, and a sensor housing for integral packaging;
the compliant mechanism is connected to the sensor shell by adopting an integrated machining and forming technology, the head end of the compliant mechanism is provided with a measured displacement contact input end, and the tail end of the compliant mechanism is provided with an output end moving electrode;
the displacement measurement electrode includes first electrode, second electrode, third electrode and fourth electrode, first electrode and second electrode set up respectively the upper and lower side of the left end of motion electrode, third electrode and fourth electrode set up respectively the upper and lower side of the right-hand member of motion electrode, first electrode the second electrode the third electrode with the equal fixed connection of fourth electrode with on the sensor housing, the motion electrode with first, second electrode with third, fourth electrode constitute two sets of differential displacement measurement circuit jointly, read processing circuit through external, realize micro-nano displacement measurement.
Preferably, the moving electrode is a metal sheet.
Correspondingly, the embodiment of the invention also provides a micro-nano precision measurement system, which comprises a signal processing module, a display and the sensor;
the first electrode, the second electrode, the third electrode, the fourth electrode and the moving electrode are connected with the input end of the signal processing module through wires, the output end of the signal processing module is connected with the input end of the display, the signal processing module is used for receiving two groups of differential capacitance voltage signals, converting the signals into input end displacement through analysis and processing, and transmitting the displacement to the display for display.
As a preferred scheme, the measuring system further comprises a server, wherein a control system interface is arranged on the server, the output end of the signal processing module is connected with the control system interface, and the displacement can be controlled by the server to realize a human-computer interaction function.
Accordingly, an embodiment of the present invention further provides a method for preparing the sensor of the present invention, including:
preparing an optimized geometric model, dividing unit grids by adopting a rectangular plate, and establishing a model for the divided grids by adopting an SIMP (simple modeling of process control) method;
performing optimization iteration on the established model to obtain a compliant mechanism with maximized reverse gain;
fixedly connecting the compliant mechanism to the sensor shell by adopting an integrated machining and forming technology;
and four displacement measuring electrodes are arranged on the sensor shell and are respectively arranged above and below the left end and the right end of the compliant mechanism moving electrode.
As a preferred scheme, the established model is as follows:
find(x1,x2,...,xn)
min uout/uin
s.t.V/V0＝f
in the formula: x is the number ofn(n-1, 2, …, n) is the cell density of the design region, uoutTo accommodate the displacement of the mechanism output, uinFor the displacement of the input end of the compliant mechanism, v is the current volume of the design area, v0To design the initial volume of the region, f is the volume fraction of material allowed to remain.
As a preferred scheme, the optimization iteration uses an optimization criterion algorithm to perform the optimization iteration.
Preferably, the length and width of the rectangular plate are changed according to the application and the size of the measured displacement model.
Compared with the prior art, the embodiment of the invention has the following beneficial effects:
through using the gentle and agreeable mechanism that has reverse gain to solve traditional sensor and can't carry out the technical problem of accurate measurement to micro-nano displacement, thereby realize carrying out the accurate measurement to micro-nano level's displacement.
Drawings
FIG. 1: the structural schematic diagram of the micro-nano precision measurement displacement system in the embodiment of the invention is shown;
wherein the reference numbers of the drawings in the specification are as follows:
1. the device comprises a compliance mechanism with reverse gain, a displacement measuring electrode 2, a sensor shell 3, a measured displacement contact input end 4 and an output end moving electrode 5.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, a preferred embodiment of the present invention provides a micro-nano precision measurement displacement sensor, which includes a compliant mechanism 1 with reverse gain, a displacement measurement electrode 2, and a sensor housing 3 for integral packaging;
the compliant mechanism 1 is connected to the sensor shell 3 by adopting an integrated machining and forming technology, the head end of the compliant mechanism 1 is provided with a measured displacement contact input end 4, and the tail end of the compliant mechanism 1 is provided with an output end moving electrode 5;
In this embodiment, the moving electrode 5 is a metal foil.
Correspondingly, the preferred embodiment of the invention also provides a micro-nano precision measurement system, which comprises a signal processing module, a display and the sensor;
the first electrode, the second electrode, the third electrode, the fourth electrode and the moving electrode 5 are connected with an input end 4 of the signal processing module through wires, an output end of the signal processing module is connected with the input end 4 of the display, the signal processing module is used for receiving two groups of differential capacitance voltage signals, converting the signals into displacement of the input end 4 through analysis and processing, and transmitting the displacement to the display for displaying.
In this embodiment, the measurement system further includes a server, the server has a control system interface, the output end of the signal processing module is connected to the control system interface, and the displacement can be controlled by the server, so as to realize a human-computer interaction function.
Accordingly, a preferred embodiment of the present invention also provides a method for preparing the sensor of the present invention, comprising:
preparing an optimized geometric model, dividing unit grids by adopting a rectangular plate, and establishing a model for the divided grids by adopting an SIMP (simple modeling of process control) method;
performing optimization iteration on the established model to obtain a compliant mechanism with maximized reverse gain;
fixedly connecting the compliant mechanism to the sensor shell by adopting an integrated machining and forming technology;
and four displacement measuring electrodes are arranged on the sensor shell and are respectively arranged above and below the left end and the right end of the compliant mechanism moving electrode.
In this embodiment, the established model is:
find(x1,x2,...,xn)
min uout/uin
s.t.V/V0＝f
in the formula: x is the number ofn(n-1, 2, …, n) is the cell density of the design region, uoutTo accommodate the displacement of the mechanism output, uinFor the displacement of the input end of the compliant mechanism, v is the current volume of the design area, v0To design the initial volume of the region, f is the volume fraction of material allowed to remain.
In this embodiment, the performing optimization iteration uses an optimization criterion algorithm to perform the optimization iteration.
In this embodiment, the length and width of the rectangular plate vary depending on the application and the size of the displacement model being measured.
The present invention will be described in detail with reference to specific examples.
The technical scheme adopted by the invention is a method for combining mechanical structure displacement amplification and displacement detection, which is mainly divided into three parts:
the mechanism is a compliant mechanism, and is different from a traditional mechanism in a mode of transferring motion, force and energy, and the compliant mechanism is realized by elastic deformation of a structural member per se. The design steps are as follows:
1. optimization model preparation
The optimized geometric model adopts rectangular plates with the length and the width of a and b respectively (a and b are given according to the application occasion of the sensor and the size of the measured displacement model), a finite element grid is divided, and the divided grid is modeled by adopting an SIMP method as follows:
find(x1,x2,...,xn)
min uout/uin
s.t.V/V0＝f
in the formula: x is the number ofn(n-1, 2, …, n) is the cell density of the design region, uoutTo accommodate the displacement of the mechanism output, uinFor the displacement of the input end of the compliant mechanism, v is the current volume of the design area, v0To design the initial volume of the region, f is the volume fraction of material allowed to remain.
2. Optimizing calculations
And (3) performing optimization iteration on the model by using an OC algorithm to obtain the compliant mechanism with the maximized reverse gain, and extracting the optimized model to obtain the compliant mechanism shown in 1 in figure 1. The mechanism consists of single parts, and has a certain gain relation between the displacement input end and the displacement output end, so that the design has the advantages that the movement of the compliant mechanism is free from lubrication, meanwhile, the error caused by the installation and positioning clearance is avoided, the transmission efficiency and precision of the displacement from the input end to the output end are greatly improved, and the guarantee is provided for the measurement of the micro-nano displacement;
and secondly, displacement measurement, namely, a metal sheet is adhered to the tail end of the compliant mechanism, the movement mode of the metal sheet is the same as that of the output end under the action of input, the metal sheet is used as a movement electrode of the capacitor, and the movement electrode, a fixed electrode (a first electrode and a second electrode which are respectively arranged above and below the left end of the movement electrode) and the fixed electrode (a third electrode and a fourth electrode which are respectively arranged above and below the right end of the movement electrode) jointly form two groups of differential capacitors. The four fixed electrodes and the moving electrode 5 are led out of the sensor through leads and are connected to an external signal processing module;
and thirdly, an external signal processing module: the module is mainly used for detecting the change condition of two groups of differential capacitance voltage signals, converting the signals into the magnitude of input end displacement through analysis and processing, displaying the magnitude of the input end displacement, and meanwhile, further transmitting the signals into a control system so as to be convenient for controlling the input displacement. The signal processing process comprises the following steps:
when the capacitive sensor is usedrAnd S is constant, and the distance between two polar plates is d0Then, the initial capacitance C of the capacitor is known0Comprises the following steps:
when the displacement of the input end of the compliance mechanism changes and causes the displacement of the output end to change, the plate distance between two polar plates of the capacitor changes and causes the capacitance change, and the total capacitance C of the capacitor after the change is as follows:
two groups of differential capacitors are formed by the moving electrode 5, the fixed electrodes (the first electrode and the second electrode which are respectively arranged above and below the left end of the moving electrode) and the fixed electrodes (the third electrode and the fourth electrode which are respectively arranged above and below the right end of the moving electrode), and then the differential capacitors are developed by the above formula, and the relation between the capacitance change under the differential capacitors and the distance change between the capacitor electrodes is obtained as follows:
because two groups of differential capacitors are arranged, the distance variation delta d between two electrodes can be obtained through calculation respectively, and the average value of the distance variation delta d and the distance variation delta d is taken as the displacement variation of the output end of the compliance mechanism so as to reduce errors. The magnitude of the input end displacement, i.e., the magnitude of the measured displacement, can be obtained by calculating the magnitude of the average displacement by the inverse gain coefficient of the compliant mechanism.
The sensor is adopted to measure the micro-nano displacement, and has certain guiding significance for designing a precise positioning mechanism with a specific motion mode; the compliant mechanism obtained by the design method is integrally processed and manufactured with the sensor shell, and four fixed electrodes are integrally manufactured together, so that the connection among all parts of the sensor is ensured by the integrated processing and manufacturing, no mounting gap exists, the integral precision is improved, and the sensor shell is of a thin film type structure at the input displacement end of the compliant mechanism and is used for realizing the input of the measured displacement; leading out wires from five electrodes in the sensor respectively, and connecting the wires with an external data processing module to realize the acquisition of displacement data; during displacement measurement, the sensor needs to be properly mounted to realize the input of the measured displacement acting on the membrane in the displacement direction.
The above-mentioned embodiments are provided to further explain the objects, technical solutions and advantages of the present invention in detail, and it should be understood that the above-mentioned embodiments are only examples of the present invention and are not intended to limit the scope of the present invention. It should be understood that any modifications, equivalents, improvements and the like, which come within the spirit and principle of the invention, may occur to those skilled in the art and are intended to be included within the scope of the invention.
Claims (8)
1. A micro-nano precision measurement displacement sensor is characterized by comprising a compliant mechanism with reverse gain, a displacement measurement electrode and a sensor shell for integral packaging;
the compliant mechanism is connected to the sensor shell by adopting an integrated machining and forming technology, the head end of the compliant mechanism is provided with a measured displacement contact input end, and the tail end of the compliant mechanism is provided with an output end moving electrode;
the displacement measurement electrode includes first electrode, second electrode, third electrode and fourth electrode, first electrode and second electrode set up respectively the upper and lower side of the left end of motion electrode, third electrode and fourth electrode set up respectively the upper and lower side of the right-hand member of motion electrode, first electrode the second electrode the third electrode with the equal fixed connection of fourth electrode with on the sensor housing, the motion electrode with first, second electrode with third, fourth electrode constitute two sets of differential displacement measurement circuit jointly, read processing circuit through external, realize micro-nano displacement measurement.
2. The sensor of claim 1, wherein the moving electrode is a metal foil.
3. A micro-nano precision measurement system, characterized by comprising a signal processing module, a display and a sensor according to any one of claims 1 or 2;
the first electrode, the second electrode, the third electrode, the fourth electrode and the moving electrode are connected with the input end of the signal processing module through wires, the output end of the signal processing module is connected with the input end of the display, the signal processing module is used for receiving two groups of differential capacitance voltage signals, converting the signals into input end displacement through analysis and processing, and transmitting the displacement to the display for display.
4. The measurement system of claim 3, further comprising a server, wherein the server has a control system interface, the output end of the signal processing module is connected to the control system interface, and the displacement can be controlled by the server to realize a human-computer interaction function.
5. A method for preparing a sensor according to any one of claims 1 to 2, comprising:
preparing an optimized geometric model, dividing unit grids by adopting a rectangular plate, and establishing a model for the divided grids by adopting an SIMP (simple modeling of process control) method;
performing optimization iteration on the established model to obtain a compliant mechanism with maximized reverse gain;
fixedly connecting the compliant mechanism to the sensor shell by adopting an integrated machining and forming technology;
and four displacement measuring electrodes are arranged on the sensor shell and are respectively arranged above and below the left end and the right end of the compliant mechanism moving electrode.
6. The method of claim 5, wherein the established model is:
find(x1,x2,...,xn)
min uout/uin
s.t.V/V0＝f
in the formula: x is the number ofn(n is 1,2, …, n) is the cell density of the design region, u isoutTo accommodate the displacement of the mechanism output, uinFor the displacement of the input end of the compliant mechanism, v is the current volume of the design area, v0To design the initial volume of the region, f is the volume fraction of material allowed to remain.
7. The method of claim 5, wherein performing the optimization iteration uses an optimization criteria algorithm to perform the optimization iteration.
8. The method of claim 5, wherein the length and width of the rectangular plate vary depending on the application and the size of the displacement model to be measured.
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| CN2390194Y (en) * | 1999-06-22 | 2000-08-02 | 大连理工大学 | Bootstrap differential capacitance sensor |
| CN104075652A (en) * | 2014-07-02 | 2014-10-01 | 中国科学院长春光学精密机械与物理研究所 | Calibration device for capacitance displacement sensor |
| CN105691485A (en) * | 2016-03-16 | 2016-06-22 | 北京理工大学 | Active-softening mechanism of hydraulic robot |
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| CN100542012C (en) * | 2007-11-07 | 2009-09-16 | 北京航空航天大学 | A kind of low noise amplifier and implementation method that is used for radio communication and navigation neceiver |
| US7707738B2 (en) * | 2008-05-23 | 2010-05-04 | Mitutoyo Corporation | Digital ruler with low-friction sliding contact |
| CN102072383B (en) * | 2010-11-27 | 2012-09-05 | 江西理工大学 | Spatial four-degree-of-freedom oligodynamic ultra-precision positioning platform with full-compliant branched chains |
| CN202048884U (en) * | 2011-02-16 | 2011-11-23 | 吴书贵 | Nano micro-displacement measuring sensor |
| CN104088871B (en) * | 2014-06-27 | 2016-03-02 | 华南理工大学 | A kind of precision positioning drive end pre-tightening apparatus |
| CN108875162B (en) * | 2018-05-31 | 2022-07-26 | 广州大学 | Topological optimization method for spatial configuration of compliant mechanism |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2390194Y (en) * | 1999-06-22 | 2000-08-02 | 大连理工大学 | Bootstrap differential capacitance sensor |
| CN104075652A (en) * | 2014-07-02 | 2014-10-01 | 中国科学院长春光学精密机械与物理研究所 | Calibration device for capacitance displacement sensor |
| CN105691485A (en) * | 2016-03-16 | 2016-06-22 | 北京理工大学 | Active-softening mechanism of hydraulic robot |
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Inventor after: Zhu Dachang Inventor after: Zhan Wanghu Inventor after: He Xianghua Inventor after: Yang Jiamou Inventor after: Lai Junhao Inventor after: Zhong Yun Inventor before: Zhu Dachang Inventor before: Zhan Wanghu Inventor before: He Xianghua Inventor before: Yang Jiamou Inventor before: Lai Junhao Inventor before: Zhong Yun |
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