CN109855520B - Micro-nano precision measurement displacement sensor, system and preparation method - Google Patents
Micro-nano precision measurement displacement sensor, system and preparation method Download PDFInfo
- Publication number
- CN109855520B CN109855520B CN201910001926.5A CN201910001926A CN109855520B CN 109855520 B CN109855520 B CN 109855520B CN 201910001926 A CN201910001926 A CN 201910001926A CN 109855520 B CN109855520 B CN 109855520B
- Authority
- CN
- China
- Prior art keywords
- electrode
- displacement
- moving
- sensor
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
Description
技术领域technical field
本发明涉及传感器技术领域,尤其涉及一种微纳米精度测量位移传感器。The invention relates to the technical field of sensors, in particular to a micro-nano precision measuring displacement sensor.
背景技术Background technique
位移传感器根据测量原理的不同,可分为多种类型,其中,电容式位移传感器被广泛应用于机构的位移测量中;传统电容传感器通过调整电极的安装布置方式,可以实现位移的精确测量;但是对于微纳米位移的测量来说,传统的电容传感器由于精度误差较大无法测量微纳米级别的位移量,所以,要实现微纳米位移的精确测量,不仅对电容电极的安装有极大的要求,而且对于电路设计也有着极大的挑战。Displacement sensors can be divided into various types according to different measurement principles. Among them, capacitive displacement sensors are widely used in the displacement measurement of mechanisms; traditional capacitive sensors can achieve accurate displacement measurement by adjusting the installation and arrangement of electrodes; but For the measurement of micro-nano displacement, the traditional capacitive sensor cannot measure the displacement at the micro-nano level due to the large accuracy error. Therefore, to achieve accurate measurement of micro-nano displacement, not only the installation of capacitive electrodes has great requirements, but also And it also has great challenges for circuit design.
发明内容SUMMARY OF THE INVENTION
本发明提供了一种微纳米精度测量位移传感器、系统及制备方法,以解决传统传感器无法对微纳米位移进行精确测量的技术问题,从而实现对微纳米级别的位移进行精确测量。The invention provides a micro-nano precision measurement displacement sensor, a system and a preparation method, so as to solve the technical problem that the traditional sensor cannot accurately measure the micro-nano displacement, so as to realize the precise measurement of the micro-nano level displacement.
为了解决上述技术问题,本发明实施例提供了一种微纳米精度测量位移传感器,包括具有反向增益的柔顺机构、位移测量电极和用于整体封装的传感器外壳;In order to solve the above technical problems, the embodiments of the present invention provide a micro-nano precision measurement displacement sensor, including a compliance mechanism with reverse gain, a displacement measurement electrode, and a sensor housing for integral packaging;
所述柔顺机构采用一体化加工成型技术连接在所述传感器外壳上,所述柔顺机构的首端具有被测位移接触输入端,所述柔顺机构的末端具有输出端运动电极;The compliance mechanism is connected to the sensor housing by integrated processing and molding technology, the head end of the compliance mechanism has a measured displacement contact input end, and the end of the compliance mechanism has an output end moving electrode;
所述位移测量电极包括第一电极、第二电极、第三电极和第四电极,所述第一电极和第二电极分别设置在所述运动电极的左端的上下方,所述第三电极和第四电极分别设置在所述运动电极的右端的上下方,所述第一电极、所述第二电极、所述第三电极和所述第四电极均固定连接与所述传感器外壳上,所述运动电极与所述第一、第二电极和所述第三、第四电极共同构成两组差动式位移测量电路,通过外接读取处理电路,实现微纳米位移测量。The displacement measuring electrode includes a first electrode, a second electrode, a third electrode and a fourth electrode, the first electrode and the second electrode are respectively arranged above and below the left end of the moving electrode, the third electrode and the The fourth electrodes are respectively arranged above and below the right end of the moving electrode, the first electrode, the second electrode, the third electrode and the fourth electrode are all fixedly connected to the sensor housing, so the The moving electrodes together with the first and second electrodes and the third and fourth electrodes form two sets of differential displacement measurement circuits, and the micro-nano displacement measurement is realized by connecting an external reading processing circuit.
作为优选方案,所述运动电极为金属薄片。As a preferred solution, the moving electrode is a metal sheet.
相应地,本发明实施例还提供了一种微纳米精度测量系统,包括信号处理模块、显示器和本发明所述的传感器;Correspondingly, the embodiment of the present invention also provides a micro-nano precision measurement system, including a signal processing module, a display, and the sensor of the present invention;
所述第一电极、第二电极、第三电极、第四电极和运动电极通过导线与所述信号处理模块的输入端连接,所述信号处理模块的输出端与所述显示器的输入端连接,所述信号处理模块用于接收两组差动式电容电压信号,通过分析处理将该信号转变为输入端位移大小,并将位移大小传输到所述显示器进行显示。The first electrode, the second electrode, the third electrode, the fourth electrode and the moving electrode are connected to the input end of the signal processing module through wires, and the output end of the signal processing module is connected to the input end of the display, The signal processing module is used to receive two sets of differential capacitor voltage signals, convert the signals into displacement magnitudes of the input terminals through analysis and processing, and transmit the displacement magnitudes to the display for display.
作为优选方案,所述测量系统还包括服务器,所述服务器上具有控制系统接口,所述信号处理模块的输出端与所述控制系统接口连接,可以通过所述服务器对所述位移大小进行控制,实现人机交互功能。As a preferred solution, the measurement system further includes a server, the server has a control system interface, the output end of the signal processing module is connected to the control system interface, and the displacement can be controlled through the server, Realize the function of human-computer interaction.
相应地,本发明实施例还提供了一种用于制备本发明所述传感器的方法,包括:Correspondingly, an embodiment of the present invention also provides a method for preparing the sensor of the present invention, comprising:
优化几何模型的准备,采用矩形板划分单元网格,对划分后的网格采用SIMP方法建立模型;Optimize the preparation of the geometric model, use a rectangular plate to divide the unit mesh, and use the SIMP method to build the model for the divided mesh;
对建立后的模型进行优化迭代,得到具有最大化反向增益的柔顺机构;Optimize and iterate the established model to obtain a compliant mechanism with maximized reverse gain;
采用一体化加工成型技术将所述柔顺机构固定连接在传感器外壳上;The compliant mechanism is fixedly connected to the sensor housing by using integrated processing and molding technology;
在所述传感器外壳上设置四个位移测量电极,所述四个位移测量电极分别设置于柔顺机构运动电极的左端上下方和右端上下方。Four displacement measuring electrodes are arranged on the sensor housing, and the four displacement measuring electrodes are respectively arranged on the upper and lower left ends and the upper and lower right ends of the moving electrodes of the compliance mechanism.
作为优选方案,所述建立的模型为:As a preferred solution, the established model is:
find(x1,x2,...,xn)find(x 1 ,x 2 ,...,x n )
min uout/uin min u out /u in
s.t.V/V0=fstV/V 0 =f
式中:xn(n=1,2,…,,n)为设计区域的单元密度,uout为柔顺机构输出端位移,uin为柔顺机构输入端位移,v为设计区域当前体积,v0为设计区域初始体积,f为允许保留的材料体积分数。In the formula: x n (n=1,2,…,,n) is the element density of the design area, u out is the displacement of the output end of the compliance mechanism, u in is the displacement of the input end of the compliance mechanism, v is the current volume of the design area, v 0 is the initial volume of the design area, and f is the allowed material volume fraction to be retained.
作为优选方案,所述进行优化迭代运用了优化准则算法进行优化迭代。As a preferred solution, the optimization iteration uses an optimization criterion algorithm to perform the optimization iteration.
作为优选方案,所述矩形板的长和宽根据应用场合与所测量位移模型大小进行变化。As a preferred solution, the length and width of the rectangular plate vary according to the application and the size of the measured displacement model.
相比于现有技术,本发明实施例具有如下有益效果:Compared with the prior art, the embodiments of the present invention have the following beneficial effects:
通过使用具有反向增益的柔顺机构,以解决传统传感器无法对微纳米位移进行精确测量的技术问题,从而实现对微纳米级别的位移进行精确测量。By using a compliant mechanism with reverse gain, the technical problem that traditional sensors cannot accurately measure the micro-nano displacement can be solved, so that the micro-nano level displacement can be accurately measured.
附图说明Description of drawings
图1:为本发明实施例中的微纳米精度测量位移系统的结构示意图;FIG. 1 is a schematic structural diagram of a micro-nano precision displacement measurement system in an embodiment of the present invention;
其中,说明书附图的附图标记如下:Wherein, the reference signs of the drawings in the description are as follows:
1、具有反向增益的柔顺机构,2、位移测量电极,3、传感器外壳,4、被测位移接触输入端,5、输出端运动电极。1. Compliant mechanism with reverse gain, 2. Displacement measuring electrode, 3. Sensor housing, 4. The measured displacement contacts the input end, 5. The output end moves the electrode.
具体实施方式Detailed ways
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
请参照图1,本发明优选实施例提供了一种微纳米精度测量位移传感器,包括具有反向增益的柔顺机构1、位移测量电极2和用于整体封装的传感器外壳3;Please refer to FIG. 1 , a preferred embodiment of the present invention provides a micro-nano precision measurement displacement sensor, including a compliance mechanism 1 with reverse gain, a
所述柔顺机构1采用一体化加工成型技术连接在所述传感器外壳3上,所述柔顺机构1的首端具有被测位移接触输入端4,所述柔顺机构1的末端具有输出端运动电极5;The compliance mechanism 1 is connected to the
所述位移测量电极2包括第一电极、第二电极、第三电极和第四电极,所述第一电极和第二电极分别设置在所述运动电极5的左端的上下方,所述第三电极和第四电极分别设置在所述运动电极5的右端的上下方,所述第一电极、所述第二电极、所述第三电极和所述第四电极均固定连接与所述传感器外壳3上,所述运动电极5与所述第一、第二电极和所述第三、第四电极共同构成两组差动式位移测量电路,通过外接读取处理电路,实现微纳米位移测量。The
在本实施例中,所述运动电极5为金属薄片。In this embodiment, the moving electrode 5 is a metal sheet.
相应地,本发明优选实施例还提供了一种微纳米精度测量系统,包括信号处理模块、显示器和本发明所述的传感器;Correspondingly, a preferred embodiment of the present invention also provides a micro-nano precision measurement system, including a signal processing module, a display, and the sensor of the present invention;
所述第一电极、第二电极、第三电极、第四电极和运动电极5通过导线与所述信号处理模块的输入端4连接,所述信号处理模块的输出端与所述显示器的输入端4连接,所述信号处理模块用于接收两组差动式电容电压信号,通过分析处理将该信号转变为输入端4位移大小,并将位移大小传输到所述显示器进行显示。The first electrode, the second electrode, the third electrode, the fourth electrode and the moving electrode 5 are connected to the input end 4 of the signal processing module through wires, and the output end of the signal processing module is connected to the input end of the display. 4 is connected, the signal processing module is used to receive two sets of differential capacitor voltage signals, convert the signal into the displacement size of the input terminal 4 through analysis and processing, and transmit the displacement size to the display for display.
在本实施例中,所述测量系统还包括服务器,所述服务器上具有控制系统接口,所述信号处理模块的输出端与所述控制系统接口连接,可以通过所述服务器对所述位移大小进行控制,实现人机交互功能。In this embodiment, the measurement system further includes a server, the server has a control system interface, the output end of the signal processing module is connected to the control system interface, and the displacement size can be measured by the server. control, realize the function of human-computer interaction.
相应地,本发明优选实施例还提供了一种用于制备本发明所述传感器的方法,包括:Correspondingly, a preferred embodiment of the present invention also provides a method for preparing the sensor of the present invention, comprising:
优化几何模型的准备,采用矩形板划分单元网格,对划分后的网格采用SIMP方法建立模型;Optimize the preparation of the geometric model, use a rectangular plate to divide the unit mesh, and use the SIMP method to build the model for the divided mesh;
对建立后的模型进行优化迭代,得到具有最大化反向增益的柔顺机构;Optimize and iterate the established model to obtain a compliant mechanism with maximized reverse gain;
采用一体化加工成型技术将所述柔顺机构固定连接在传感器外壳上;The compliant mechanism is fixedly connected to the sensor housing by using integrated processing and molding technology;
在所述传感器外壳上设置四个位移测量电极,所述四个位移测量电极分别设置于柔顺机构运动电极的左端上下方和右端上下方。Four displacement measuring electrodes are arranged on the sensor housing, and the four displacement measuring electrodes are respectively arranged on the upper and lower left ends and the upper and lower right ends of the moving electrodes of the compliance mechanism.
在本实施例中,所述建立的模型为:In this embodiment, the established model is:
find(x1,x2,...,xn)find(x 1 ,x 2 ,...,x n )
min uout/uin min u out /u in
s.t.V/V0=fstV/V 0 =f
式中:xn(n=1,2,…,,n)为设计区域的单元密度,uout为柔顺机构输出端位移,uin为柔顺机构输入端位移,v为设计区域当前体积,v0为设计区域初始体积,f为允许保留的材料体积分数。In the formula: x n (n=1,2,…,,n) is the element density of the design area, u out is the displacement of the output end of the compliance mechanism, u in is the displacement of the input end of the compliance mechanism, v is the current volume of the design area, v 0 is the initial volume of the design area, and f is the allowed material volume fraction to be retained.
在本实施例中,所述进行优化迭代运用了优化准则算法进行优化迭代。In this embodiment, the optimization iteration is performed using an optimization criterion algorithm to perform the optimization iteration.
在本实施例中,所述矩形板的长和宽根据应用场合与所测量位移模型大小进行变化。In this embodiment, the length and width of the rectangular plate vary according to the application and the size of the measured displacement model.
下面结合具体实施例,对本发明进行详细说明。The present invention will be described in detail below with reference to specific embodiments.
本发明所采用的技术方案是机械式结构位移放大和位移检测相结合的方法,主要分为三个部分:The technical solution adopted in the present invention is a method combining mechanical structure displacement amplification and displacement detection, which is mainly divided into three parts:
一是柔顺机构,区别于传统机构传递运动、力和能量的方式,柔顺机构通过自身结构构件弹性变形来实现的,本发明中,柔顺机构通过拓扑优化方法设计得到,在设计过程中,通过对机构体积的约束,得到具有给定反向增益系数的位移放大机构。其设计步骤如下:The first is the compliance mechanism, which is different from the way traditional mechanisms transmit motion, force and energy. The compliance mechanism is realized by elastic deformation of its own structural components. In the present invention, the compliance mechanism is designed by the topology optimization method. Constrained by the volume of the mechanism, a displacement amplifying mechanism with a given reverse gain coefficient is obtained. The design steps are as follows:
1、优化模型准备1. Optimization model preparation
优化几何模型采用长宽分别为a和b的矩形板(a和b根据传感器所应用场合与所测量位移模型大小给定),划分有限单元网格,对划分后的网格进行采用SIMP方法进行如下建模:The optimized geometric model adopts a rectangular plate with length and width of a and b respectively (a and b are given according to the application of the sensor and the size of the measured displacement model), and the finite element grid is divided, and the SIMP method is used for the divided grid. Modeled as follows:
find(x1,x2,...,xn)find(x 1 ,x 2 ,...,x n )
min uout/uin min u out /u in
s.t.V/V0=fstV/V 0 =f
式中:xn(n=1,2,…,,n)为设计区域的单元密度,uout为柔顺机构输出端位移,uin为柔顺机构输入端位移,v为设计区域当前体积,v0为设计区域初始体积,f为允许保留的材料体积分数。In the formula: x n (n=1,2,…,,n) is the element density of the design area, u out is the displacement of the output end of the compliance mechanism, u in is the displacement of the input end of the compliance mechanism, v is the current volume of the design area, v 0 is the initial volume of the design area, and f is the allowed material volume fraction to be retained.
2、优化计算2. Optimization calculation
对上述模型运用OC算法进行优化迭代,得到具有最大化反向增益的柔顺机构,对优化后的模型提取得到图1中1所示的柔顺机构。该机构由单个零件组成,在位移输入端和输出端具有确定增益关系,这样设计的好处是柔顺机构运动无需润滑,同时避免了安装定位间隙带来的误差,大大提高了位移从输入端到输出端的传递效率与精度,为微纳米位移测量提供了保障;The OC algorithm is used to optimize and iterate the above model, and a compliant mechanism with maximized reverse gain is obtained, and the compliant mechanism shown in Figure 1 is obtained by extracting the optimized model. The mechanism is composed of a single part and has a definite gain relationship between the displacement input end and the output end. The advantage of this design is that the movement of the compliant mechanism does not require lubrication, and at the same time, the error caused by the installation and positioning gap is avoided, and the displacement from the input end to the output is greatly improved. The transfer efficiency and accuracy of the end-point provide a guarantee for the measurement of micro-nano displacement;
二是位移测量,柔顺机构末端粘接有金属薄片,其运动方式和在输入作用下输出端运动方式相同,将该金属薄片作为电容的运动电极,该运动电极与固定电极(分别设置在运动电极左端的上下方的第一电极、第二电极)和固定电极(分别设置在运动电极右端的上下方的第三电极、第四电极)共同构成两组差动式电容。将四个固定电极和运动电极5通过导线引出至传感器外部,连接至外部信号处理模块;The second is displacement measurement. The end of the compliance mechanism is bonded with a metal sheet, and its movement mode is the same as that of the output end under the action of input. The metal sheet is used as the moving electrode of the capacitor. The upper and lower first electrodes and second electrodes on the left end) and the fixed electrodes (the third electrodes and fourth electrodes respectively arranged on the upper and lower sides of the moving electrodes) together constitute two sets of differential capacitors. The four fixed electrodes and the moving electrode 5 are led out to the outside of the sensor through wires and connected to the external signal processing module;
三是外部信号处理模块:该模块主要用来检测两组差动式电容电压信号的变化情况,并且通过分析处理,将该信号转变为输入端位移大小,并予显示,同时,该信号还可以进一步输送至控制系统中,便于对输入位移进行控制。其信号处理过程为:The third is the external signal processing module: this module is mainly used to detect the changes of the two sets of differential capacitor voltage signals, and through analysis and processing, the signal is converted into the displacement of the input terminal and displayed. At the same time, the signal can also be It is further sent to the control system to facilitate the control of the input displacement. Its signal processing process is:
当电容传感器的εr和S为常数,两极板间间距为d0时,可知该电容初始电容量C0为: When ε r and S of the capacitive sensor are constants and the distance between the two plates is d 0 , it can be known that the initial capacitance C 0 of the capacitor is:
当柔顺机构输入端位移发生变化,引起输出端位移变化时,电容两极板间的板件距离发生变化,引起电容变化,其变化后电容总的电容量C为:When the displacement of the input end of the compliance mechanism changes, causing the displacement of the output end to change, the plate distance between the two polar plates of the capacitor changes, causing the capacitance to change. The total capacitance C of the capacitor after the change is:
由运动电极5与固定电极(分别设置在运动电极左端的上下方的第一电极、第二电极)和固定电极(分别设置在运动电极右端的上下方的第三电极、第四电极)共同构成两组差动式电容,则由上式进行展开,得到在差动电容下电容量的变化与电容电极间距离变化的关系为:It is composed of the moving electrode 5, the fixed electrode (the first electrode and the second electrode respectively arranged above and below the left end of the moving electrode) and the fixed electrode (the third electrode and the fourth electrode respectively arranged above and below the right end of the moving electrode) The two groups of differential capacitors are expanded from the above formula, and the relationship between the change of capacitance under the differential capacitor and the change of the distance between the capacitor electrodes is:
由于有两组差动式电容,可以分别计算得到两个电极间的距离变化量Δd,对二者Δd取平均值作为柔顺机构输出端位移变化量以减少误差。将该平均位移大小通过柔顺机构的反向增益系数计算即可求得输入端位移大小,即被测位移的大小。Since there are two sets of differential capacitors, the distance variation Δd between the two electrodes can be calculated separately, and the average value of the two Δd is taken as the displacement variation of the output end of the compliance mechanism to reduce errors. The displacement of the input end, that is, the measured displacement, can be obtained by calculating the average displacement through the reverse gain coefficient of the compliance mechanism.
采用该传感器进行微纳米位移的测量,对设计具有特定运动方式的精密定位机构具有一定的指导意义;采用上述设计方法得到的柔顺机构,与传感器外壳进行一体化加工制造,一同一体化制造的还有四个固定电极,一体化加工制造确保了传感器的各个部件之间的连接,不存在任何安装间隙,提高了整体精度,在柔顺机构输入位移端处,传感器外壳为薄膜式结构,用于实现被测位移的输入;将传感器内部五个电极分别引出导线,同外部数据处理模块进行连接,实现位移数据的采集;在进行位移测量过程中,需要对传感器进行适当的安装,以实现被测位移在位移方向作用于薄膜的输入。Using this sensor to measure micro-nano displacement has certain guiding significance for designing a precise positioning mechanism with a specific movement mode; the compliant mechanism obtained by the above design method is processed and manufactured in an integrated manner with the sensor shell, and is also manufactured in an integrated manner. There are four fixed electrodes, and the integrated manufacturing ensures the connection between the various components of the sensor, there is no installation gap, and the overall accuracy is improved. The input of the measured displacement; the five electrodes inside the sensor are respectively drawn out of wires and connected to the external data processing module to realize the collection of displacement data; in the process of displacement measurement, the sensor needs to be properly installed to realize the measured displacement. The input acting on the membrane in the displacement direction.
以上所述的具体实施例,对本发明的目的、技术方案和有益效果进行了进一步的详细说明,应当理解,以上所述仅为本发明的具体实施例而已,并不用于限定本发明的保护范围。特别指出,对于本领域技术人员来说,凡在本发明的精神和原则之内,所做的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。The specific embodiments described above further describe the purpose, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above descriptions are only specific embodiments of the present invention, and are not intended to limit the protection scope of the present invention. . It is particularly pointed out that for those skilled in the art, any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910001926.5A CN109855520B (en) | 2019-01-02 | 2019-01-02 | Micro-nano precision measurement displacement sensor, system and preparation method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910001926.5A CN109855520B (en) | 2019-01-02 | 2019-01-02 | Micro-nano precision measurement displacement sensor, system and preparation method |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109855520A CN109855520A (en) | 2019-06-07 |
CN109855520B true CN109855520B (en) | 2020-09-11 |
Family
ID=66893634
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910001926.5A Expired - Fee Related CN109855520B (en) | 2019-01-02 | 2019-01-02 | Micro-nano precision measurement displacement sensor, system and preparation method |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN109855520B (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2390194Y (en) * | 1999-06-22 | 2000-08-02 | 大连理工大学 | Bootstrap differential capacitance sensor |
CN104075652A (en) * | 2014-07-02 | 2014-10-01 | 中国科学院长春光学精密机械与物理研究所 | Calibration device for capacitance displacement sensor |
CN105691485A (en) * | 2016-03-16 | 2016-06-22 | 北京理工大学 | Active-softening mechanism of hydraulic robot |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100542012C (en) * | 2007-11-07 | 2009-09-16 | 北京航空航天大学 | A low noise amplifier for wireless communication and navigation receiver and its realization method |
US7707738B2 (en) * | 2008-05-23 | 2010-05-04 | Mitutoyo Corporation | Digital ruler with low-friction sliding contact |
CN102072383B (en) * | 2010-11-27 | 2012-09-05 | 江西理工大学 | Spatial four-degree-of-freedom oligodynamic ultra-precision positioning platform with full-compliant branched chains |
CN202048884U (en) * | 2011-02-16 | 2011-11-23 | 吴书贵 | Nano micro-displacement measuring sensor |
CN104088871B (en) * | 2014-06-27 | 2016-03-02 | 华南理工大学 | A kind of precision positioning drive end pre-tightening apparatus |
CN108875162B (en) * | 2018-05-31 | 2022-07-26 | 广州大学 | A Topology Optimization Method for Spatial Configuration of Compliant Mechanisms |
-
2019
- 2019-01-02 CN CN201910001926.5A patent/CN109855520B/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2390194Y (en) * | 1999-06-22 | 2000-08-02 | 大连理工大学 | Bootstrap differential capacitance sensor |
CN104075652A (en) * | 2014-07-02 | 2014-10-01 | 中国科学院长春光学精密机械与物理研究所 | Calibration device for capacitance displacement sensor |
CN105691485A (en) * | 2016-03-16 | 2016-06-22 | 北京理工大学 | Active-softening mechanism of hydraulic robot |
Also Published As
Publication number | Publication date |
---|---|
CN109855520A (en) | 2019-06-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103344377B (en) | Capacitive barometric sensor of micro electro mechanical system | |
CN108680287B (en) | High-sensitivity five-degree-of-freedom array type touch sensor | |
CN203365045U (en) | Capacitive air pressure sensor of microelectronic mechanical system | |
CN109974916B (en) | A structure of a variable pole distance capacitive three-dimensional force sensor | |
CN103954382A (en) | Dielectric-varied capacitive flexible three-dimensional force tactile sensor | |
CN103954793B (en) | A MEMS accelerometer | |
CN103792267B (en) | A kind of differential capacitance type humidity sensor | |
CN111982383A (en) | Differential pressure contact type MEMS capacitance film vacuum gauge | |
CN100487461C (en) | Metal capacitance microaccelerator | |
CN112001036A (en) | An accelerometer based on artificial intelligence design and distributed manufacturing | |
CN116625326A (en) | A Highly Linear Depth Gauge Used in Bathymetric Surveying | |
CN109855520B (en) | Micro-nano precision measurement displacement sensor, system and preparation method | |
WO2021035741A1 (en) | Force sensing apparatus, force sensing method and device | |
CN111721963A (en) | A wind speed sensor and wind speed detection device | |
CN115575661B (en) | Two-dimensional capacitive differential MEMS wind speed and direction sensor | |
CN207280514U (en) | A kind of PZT sensors based on MEMS | |
CN204788762U (en) | Differential three -dimensional power pressure sensor of contact parallel -plate | |
Achouch et al. | Improvement of the performance of a capacitive relative pressure sensor: case of large deflections | |
CN114486046B (en) | Three-dimensional pressure sensor based on flexible tactile capacitance | |
CN210108570U (en) | E-type double-signal double-sensitivity capacitance sensor device for detecting bending moment of logistics vehicle | |
CN115752820A (en) | Sensitization type graphene pressure sensor and control method thereof | |
CN114671399A (en) | Capacitive pressure sensor and preparation method thereof | |
CN202216778U (en) | Surface Acoustic Wave Temperature Sensor Based on Multiple Couplers | |
CN208833403U (en) | A metal drop electrode type three-dimensional capacitive tactile sensor | |
CN114609412B (en) | Intelligent sensor for gesture recognition of electric iron based on MEMS capacitive acceleration sensor |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information |
Inventor after: Zhu Dachang Inventor after: Zhan Wanghu Inventor after: He Xianghua Inventor after: Yang Jiamou Inventor after: Lai Junhao Inventor after: Zhong Yun Inventor before: Zhu Dachang Inventor before: Zhan Wanghu Inventor before: He Xianghua Inventor before: Yang Jiamou Inventor before: Lai Junhao Inventor before: Zhong Yun |
|
CB03 | Change of inventor or designer information | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200911 |
|
CF01 | Termination of patent right due to non-payment of annual fee |