CN109852952B - Hydrazine hydrate chemical nickel plating solution, preparation method thereof and nickel plating method - Google Patents
Hydrazine hydrate chemical nickel plating solution, preparation method thereof and nickel plating method Download PDFInfo
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Abstract
The invention discloses a hydrazine hydrate chemical nickel plating solution, a preparation method thereof and a nickel plating method, belongs to the technical field of chemical nickel plating, and solves the problems that phosphorus in a sodium hypophosphite chemical nickel plating solution damages and pollutes the nickel plating solution and the environment in the prior art, and the chemical nickel plating speed is low when hydrazine hydrate is adopted. The plating solution for chemical nickel plating of hydrazine hydrate consists of nickel sulfate, hydrazine hydrate, sodium citrate, potassium sodium tartrate, cobalt sulfate and lead acetate. Is suitable for chemical nickel plating of base materials.
Description
Technical Field
The invention belongs to the technical field of chemical nickel plating, and particularly relates to hydrazine hydrate chemical nickel plating solution, a preparation method thereof and a nickel plating method.
Background
The chemical nickel plating has simple process, no need of external power supply and good uniformity; depositing on various non-metal substrates such as high polymer materials, inorganic non-metal materials and the like; the characteristics of corrosion resistance, wear resistance, strong plating binding force and the like are rapidly developed and widely applied. The plating solution composition of chemical nickel plating is very important, and the common chemical nickel plating solution comprises metal salt, a reducing agent, a complexing agent, a buffering agent, a stabilizing agent, a pH regulator and the like.
The reducing agent provides electrons for nickel ions in the solution, and mainly comprises sodium hypophosphite, dimethylamino borane, potassium borohydride, hydrazine hydrate and the like. At present, most of reducing agents in chemical nickel plating solution are sodium hypophosphite, the chemical nickel plating solution has the characteristics of low price, good stability of the plating solution and the like, and simultaneously has some defects such as poor welding performance of a formed nickel plating layer, and the biggest defect is that phosphorus elements in the plating solution have poor environmental protection and damage to the plating solution, which is in contradiction with the development of green science and technology and chemical nickel plating, so that the development of other reducing agents in the chemical nickel plating solution is inevitable and has huge prospect.
When hydrazine hydrate is used as a reducing agent, the nickel plating product is nitrogen, is safe and environment-friendly, meets the expected requirement of environmental protection, but also has the problems of low reaction speed, easy decomposition of hydrazine hydrate at high temperature, unstable plating solution, large internal stress of the formed nickel plating layer and the like. At present, the main reason that the hydrazine hydrate chemical nickel plating process is not applied in a large scale is that the hydrazine hydrate reduction reaction speed is slow, the deposition speed of a chemical nickel plating layer is too slow, so that the chemical nickel plating efficiency is too low, and the general chemical nickel plating speed of the hydrazine hydrate is 1-2 μm/h.
The research on the hydrazine hydrate chemical nickel plating solution is more, for example, hydrazine hydrate is used as an initiator, hydrazine hydrate and sodium hypophosphite are used as a common reducing agent to deposit nickel-phosphorus alloy on a copper matrix, and the hydrazine hydrate in the research does not play an important role in the subsequent nickel plating process; some researches use hydrazine hydrate to chemically plate nickel on the surface of the nano-micro particle with larger specific surface area, which is consistent with the property of slower oxidation reaction speed of hydrazine hydrate, such as preparing iron-nickel binary alloy micro particles and forming a core-shell structure by using nickel coated carbon; some researches have been carried out to prepare a compact pure nickel layer on a high polymer material such as a nylon fabric by using hydrazine hydrate chemical nickel plating, and to coat silicon nitride powder on an inorganic non-metal material such as nano nickel by using hydrazine hydrate chemical plating. We find that because hydrazine hydrate has the properties of slow oxidation-reduction reaction, instability at high temperature and the like, the hydrazine hydrate chemical nickel plating method is rarely applied to macroscopic substrates such as iron sheets, nickel preplating substrates and other materials in research.
Disclosure of Invention
In view of the above analysis, the present invention aims to provide a hydrazine hydrate chemical nickel plating solution, a preparation method thereof and a nickel plating method thereof, so as to solve the problem that phosphorus in a sodium hypophosphite chemical nickel plating solution in the prior art damages and pollutes the nickel plating solution and the environment, and solve the problem of low hydrazine hydrate chemical nickel plating speed.
The purpose of the invention is mainly realized by the following technical scheme:
a plating solution for chemical nickel plating of hydrazine hydrate is composed of nickel sulfate, hydrazine hydrate, sodium citrate, potassium sodium tartrate, cobalt sulfate and lead acetate.
Further, the concentration ranges of the components in the plating solution are as follows: 20-30 g/L of nickel sulfate, 50-70 ml/L of 65 wt.% hydrazine hydrate, 60-90 g/L of sodium citrate, 8-14 g/L of potassium sodium tartrate, 6-15 g/L of cobalt sulfate and 5-15 mg/L of lead acetate.
Further, the concentration ranges of the components in the plating solution are as follows: 25-30 g/L of nickel sulfate, 60-70 ml/L of 65 wt.% hydrazine hydrate, 60-80 g/L of sodium citrate, 8-12 g/L of potassium sodium tartrate, 6-10 g/L of cobalt sulfate and 5-10 mg/L of lead acetate.
Further, the pH value of the plating solution is 12-13, and sodium hydroxide is adopted to adjust the pH value.
A preparation method of hydrazine hydrate alkaline chemical nickel plating solution comprises the following steps:
step 1, measuring various raw materials according to the concentration of each component in the chemical nickel plating solution;
and 5, adjusting the pH value of the solution D to be more than 9 by using a 5 wt% sodium hydroxide solution, adding hydrazine hydrate, uniformly stirring and mixing, adding deionized water until the volume of the solution is close to that of the volumetric flask, adjusting the pH value to 12-13 by using a small amount of sodium hydroxide to obtain a solution E, transferring the solution into the volumetric flask, and fixing the volume by using a small amount of deionized water to obtain the hydrazine hydrate chemical nickel plating solution.
A nickel plating method adopts the hydrazine hydrate alkaline chemical nickel plating solution, and comprises the following steps:
step 1, preprocessing a base material;
and 4, obtaining a nickel-plated layer of the base material.
Further, in the step 1, the pretreatment comprises corner polishing, cleaning, degreasing, washing, pickling and cleaning in sequence.
Further, in the step 2, the water bath temperature of the plating solution is 70-90 ℃.
Further, in the step 3, the nickel plating time is 1-2 h.
Further, in step 1, the base material is pretreated and then plated.
Compared with the prior art, the invention can at least realize one of the following technical effects:
1) in the prior art, most of reducing agents in the chemical nickel plating solution are sodium hypophosphite, phosphorus elements in the plating solution are poor in environmental protection and damage to the plating solution, hydrazine hydrate is used as the reducing agent, a nickel plating product is nitrogen, the chemical nickel plating solution is safe and environment-friendly and meets the environmental protection requirement, and the chemical nickel plating solution is alkaline, so that a bright nickel plating layer can be formed on the surface of a base material.
2) The chemical plating speed of the invention is fast, the problem of the deposition speed of chemical nickel plating is well solved by adding the accelerant cobalt sulfate, the highest deposition speed can reach about 7 mu m/h, and the deposition speed can completely meet the requirement of commercial application; the chemical nickel plating solution is stable, has long service life, and the product is green and environment-friendly, and can directly carry out chemical nickel plating on a substrate material, and the obtained nickel plating layer is bright and flat, uniform and compact in crystal grains and good in corrosion resistance.
3) The preparation method of the plating solution can ensure the complexation between the nickel sulfate, the sodium citrate and the potassium sodium tartrate, nickel ions exist in the solution in the form of nickel complexes, and the nickel ions after complexation can improve the quality of a nickel plating layer. The invention is green and environment-friendly, has simple process and potential industrial application value.
4) The chemical nickel plating layer in the invention is used as a surface layer to play a role in sealing holes and enhancing corrosion resistance. The thickness of the nickel plating layer can be effectively reduced by the way of electroplating the base material firstly and then chemically plating the base material, the chemically plated nickel layer plays a role in hole sealing of the electroplated layer, and a relatively thin plated layer can achieve a relatively good corrosion resistance effect.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the invention. The objectives and other advantages of the invention will be realized and attained by the embodiments and drawings particularly pointed out in the written description.
Drawings
The drawings are only for purposes of illustrating particular embodiments and are not to be construed as limiting the invention, wherein like reference numerals are used to designate like parts throughout.
FIG. 1 is a scanning electron microscope photograph of a plated layer prepared in example 1 of the present invention;
FIG. 2 is a cross-sectional metallographic view of a plating layer prepared in example 2 of the present invention;
FIG. 3 is a graph showing the results of a polarization curve test of a plating layer prepared in example 3 of the present invention;
FIG. 4 is a scanning electron microscope photograph of a nickel pre-plating layer in example 4 of the present invention;
FIG. 5 is a scanning electron microscope photograph of electroless nickel plating layer of example 4 of the present invention.
Detailed Description
The hydrazine hydrate electroless nickel plating solution, the method for preparing the same and the nickel plating method will be described in further detail with reference to specific examples, which are provided for comparison and explanation purposes only and the present invention is not limited to these examples.
The invention discloses a hydrazine hydrate chemical nickel plating solution, which comprises nickel sulfate, hydrazine hydrate, sodium citrate, potassium sodium tartrate, cobalt sulfate and lead acetate. The concentration ranges of the components in the plating solution are as follows: 20-30 g/L of nickel sulfate, 50-70 ml/L of 65 wt.% hydrazine hydrate, 60-90 g/L of sodium citrate, 8-14 g/L of potassium sodium tartrate, 6-15 g/L of cobalt sulfate and 5-15 mg/L of lead acetate.
In the prior art, most of reducing agents in the chemical nickel plating solution are sodium hypophosphite, phosphorus in the plating solution is poor in environmental protection and damages the plating solution, hydrazine hydrate is used as the reducing agent, and a nickel plating product is nitrogen, so that the chemical nickel plating solution is safe and environment-friendly and meets the requirement of environmental protection.
The nickel sulfate is the main salt of the chemical nickel plating solution, the concentration is 20-30 g/L, the nickel deposition speed is reduced when the concentration is too low, the self-catalytic reaction is easy to occur when the concentration is too high, and the quality of a nickel plating layer is affected when the concentration is too high or too low.
Hydrazine hydrate is a reducing agent in the plating solution and provides electrons for nickel ions. When the concentration of hydrazine hydrate is low, the deposition speed of chemical nickel plating is low, the formed nickel layer is thin, and the performance is poor; when the concentration of hydrazine hydrate is higher, the nickel content in the solution is fixed, the deposition speed is determined by the concentration of nickel ions, and more hydrazine hydrate cannot play a role in accelerating the reaction, but volatilizes at high temperature, so that the process cost is increased. The reduction of hydrazine hydrate is weaker, and the concentration of the hydrazine hydrate in the formula is selected to be in a preferred range of 50-70 ml/L.
The sodium citrate is a complexing agent for nickel ions in the plating solution, the concentration of the sodium citrate is 60-90 g/L, the complexing effect of the nickel ions can be influenced when the concentration of the sodium citrate is too low, and the complexing agent is remained when the concentration of the sodium citrate is too high, so that the performance of the plating solution is influenced.
The potassium sodium tartrate is a compound complexing agent, the concentration of the potassium sodium tartrate is 8-14 g/L, the potassium sodium tartrate is similar to sodium citrate, the potassium sodium tartrate has a nickel ion complex complexing effect, the nickel ion complex effect is influenced when the concentration of the potassium sodium tartrate is too low, and the complexing agent is remained when the concentration of the potassium sodium tartrate is too high, so that the performance of the plating solution is influenced.
Cobalt sulfate is used as an additive, and a proper amount of cobalt element can play a role in increasing nucleation points and accelerating the deposition speed of nickel atoms, so that the nickel plating layer is compact, bright and flat; in the research process, the deposition speed of nickel is gradually increased and the performance of a nickel layer is gradually enhanced along with the increase of the concentration of cobalt sulfate, but if the content of cobalt element is too high, the competition effect with the deposition of nickel element exists, so that the content fraction of nickel element in the nickel layer is reduced, and the determination of the concentration of cobalt sulfate is more important. The concentration of the cobalt sulfate is 6-15 g/L, and a nickel plating layer with uniformity and excellent compactness can be obtained.
A small amount of lead acetate is used as a stabilizer, the concentration of the lead acetate is 5-15 mg/L, the electrode potential of low-mass-concentration lead ions in the plating solution can be increased and is difficult to reduce, the lead ions are slightly adsorbed on the surface of a matrix and strongly adsorbed on the surface of nickel hydroxide particles generated by hydrolysis, so that the particles are mutually repelled by positive charges, and the effects of masking nucleation active points of the nickel ions and stabilizing the plating solution are achieved.
Sodium hydroxide is used as pH regulator to regulate the pH value of the plating solution.
Preferably, the concentration ranges of the components in the plating solution are: 25-30 g/L of nickel sulfate, 60-70 ml/L of hydrazine hydrate, 60-80 g/L of sodium citrate, 8-12 g/L of potassium sodium tartrate, 6-10 g/L of cobalt sulfate and 5-10 mg/L of lead acetate.
The pH value of the plating solution is 12-13, and sodium hydroxide is adopted to adjust the pH value. When the pH value is lower, the hydrazine hydrate is oxidized to consume hydroxide radicals, the reaction activity is low, the deposition speed is slow, the nickel plating layer is thinner, and the performance of the plating layer is poorer; with the increase of the pH value, the oxidation-reduction reaction speed is accelerated, and the deposition speed is increased; however, when the pH is too high, the nucleation speed of nickel ions is too high, the grain size is too large, the nickel-plated layer is rough, and the plating performance is reduced. Preferably, the pH value is 12.5, the deposition speed is fastest, the nickel plating layer is thickest, and the plating performance is optimal.
The invention also discloses a preparation method of the hydrazine hydrate alkaline chemical nickel plating solution, which comprises the following steps:
step 1, measuring various raw materials according to the concentration of each component in the chemical nickel plating solution;
and 5, adjusting the pH value of the solution D to be more than 9 by using a 5 wt% sodium hydroxide solution, adding hydrazine hydrate, uniformly stirring and mixing, adding deionized water until the volume of the solution is close to that of the volumetric flask, adjusting the pH value to 12-13 by using a small amount of sodium hydroxide to obtain a solution E, transferring the solution into the volumetric flask, and fixing the volume by using a small amount of deionized water to obtain the hydrazine hydrate chemical nickel plating solution.
The preparation method can ensure the complexation between the nickel sulfate, the sodium citrate and the potassium sodium tartrate, nickel ions exist in the solution in the form of nickel complexes, and the complexed nickel ions can improve the quality of a nickel plating layer.
The invention also discloses a nickel plating method, which adopts the hydrazine hydrate chemical nickel plating solution and comprises the following steps:
step 1, preprocessing a base material;
and 4, obtaining a nickel-plated layer of the base material.
The hydrazine hydrate chemical nickel plating method can ensure that chemical nickel plating can be directly carried out on the surfaces of iron matrix and pre-nickel plating matrix materials, and the obtained nickel plating layer is bright and compact and has strong corrosion resistance.
Preferably, in step 1, the base material is an iron base or a nickel pre-plating base; the pretreatment comprises corner polishing, cleaning, degreasing, washing, pickling and cleaning in sequence.
The invention pretreats iron matrix and nickel preplating matrix material by adopting NaOH and Na3PO4Degreasing the mixed solution, adding an aqueous solution of a degreasing agent and acetone for ultrasonic degreasing to obtain the finished productThe method has the advantages that the surface of a clean matrix is obtained, subsequent chemical plating is convenient to carry out, the influence of a pickling process on the quality of a plating layer is large, and through tests, 5 wt% of dilute hydrochloric acid is adopted for pickling in the research, the pickling time is 1-2 min, and the purpose of activating the matrix is to ensure that a nickel plating layer with excellent performance is obtained. After removing the oxide on the surface of the substrate by pickling, the part to be plated is cleaned and then put into a chemical nickel plating bath as soon as possible, so that the secondary oxidation is avoided from influencing the quality of the plating layer.
In the step 2, the temperature for chemical nickel plating is 70-90 ℃. When the temperature is lower, the activity of hydrazine hydrate and nickel ions in the plating solution is lower, the deposition speed is slow, the nickel plating layer is thinner, and the performance is poorer; ni2+The reduction reaction of (2) is an endothermic reaction, the deposition rate is accelerated along with the increase of the temperature, the deposition rate and the temperature are approximately linearly increased, the deposition speed is accelerated, the thickness of the nickel plating layer is increased, and the performance is enhanced. However, when the temperature is too high, the volatilization speed of the deionized water and the hydrazine hydrate is accelerated, the content of each component in the solution is greatly changed, and the deposition speed is reduced.
And in the step 3, the nickel plating time is 1-2 h.
The thickness range of the nickel-plated layer prepared in the step 4 is 5-14 mu m. The thickness range of the plating layer is set to be 5-14 mu m, the quality of the nickel plating layer of the product is effectively ensured, the corrosion resistance of the plating layer is influenced by the excessively thin plating layer, and the chemical nickel plating cost is higher when the plating layer is excessively thick.
Example 1
The contents of the components in the hydrazine hydrate alkaline electroless nickel plating solution of the embodiment are shown in table 1:
TABLE 1 hydrazine hydrate alkaline electroless nickel plating solution
The preparation method of the hydrazine hydrate alkaline chemical nickel plating solution specifically comprises the following steps:
step 1, weighing 3kg of nickel sulfate, 8kg of sodium citrate, 1.2kg of potassium sodium tartrate, 0.6kg of cobalt sulfate, 0.5g of lead acetate and 6L of hydrazine hydrate according to the content of each component in the table 1;
The nickel plating method in the embodiment specifically comprises the following steps:
step 1, carrying out pretreatment processes such as grinding corners of an iron base material → cleaning → degreasing → washing; chamfering is carried out in a chamfering machine; using NaOH and Na3PO4Degreasing the mixed solution; the oil removal is carried out in an ultrasonic environment by using an aqueous solution added with an oil removal agent and acetone until oil stains on the surface of a product are removed completely to form a continuous water film; the pickling is carried out in a 5 wt% dilute hydrochloric acid solution for 1-2 min, and the surface rust layer is removed until the uniform metallic luster matrix is leaked out;
and 4, obtaining the thickness of the nickel plating layer of the iron base material, wherein the thickness is about 6 mu m.
In the present invention, the surface of the nickel-plated layer prepared in this example 1 was analyzed microscopically by a scanning electron microscope, as shown in fig. 1, the electroless nickel-plated layer completely covered the surface of the iron substrate, and the nickel particles were uniformly and closely arranged.
Example 2
The contents of the components in the alkaline electroless nickel hydrazine hydrate plating solution of the present example are shown in table 2:
TABLE 2 hydrazine hydrate alkaline electroless nickel plating solution
| Nickel sulfate | 25g/L |
| Hydrazine hydrate | 70ml/L |
| Citric acid sodium salt | 60g/L |
| Tartaric acid potassium sodium salt | 8g/L |
| Cobalt sulfate | 10g/L |
| Lead acetate | 10mg/L |
The preparation method of the plating solution is the same as that of the embodiment 1, and the nickel plating method of the embodiment specifically comprises the following steps:
step 1, carrying out pretreatment processes such as grinding corners of an iron base material → cleaning → degreasing → washing;
and 4, obtaining the thickness of the nickel plating layer of the iron base material, wherein the thickness is about 13.5 mu m.
In the embodiment, hydrazine hydrate alkaline chemical nickel plating is carried out after the surface of an iron base material is electroplated, metallographic analysis is carried out on the cross section of the nickel plating layer prepared in the embodiment 2 through an inverted metallographic microscope, as shown in figure 2, epoxy resin plays a role in sealing a sample and facilitating metallographic observation, and the average thickness of the nickel plating layer is about 13.5 microns, which proves that the chemical nickel plating speed of the invention is high and can reach about 6.75 microns/h. The nickel plating layer and the substrate are combined tightly.
Example 3
The contents of the components in the alkaline electroless nickel hydrazine hydrate plating solution of the present example are shown in table 3:
TABLE 3 hydrazine hydrate alkaline electroless nickel plating bath
| Nickel sulfate | 20g/L |
| 65 wt.% hydrazine hydrate | 65ml/L |
| Citric acid sodium salt | 75g/L |
| Tartaric acid potassium sodium salt | 10g/L |
| Sulfuric acidCobalt | 10g/L |
| Lead acetate | 6mg/L |
The preparation method of the plating solution is the same as that of the embodiment 1, and the nickel plating method of the embodiment specifically comprises the following steps:
step 1, taking a base material, and performing pretreatment processes such as polishing corners → cleaning → degreasing → washing; using NaOH and Na3PO4Degreasing the mixed solution; the oil removal is carried out in an ultrasonic environment by using an aqueous solution added with an oil removal agent and acetone until oil stains on the surface of a product are removed completely to form a continuous water film; the pickling is carried out in a 5 wt% dilute hydrochloric acid solution for 1-2 min, and the surface rust layer is removed until the uniform metallic luster matrix is leaked out;
and 2, pre-plating nickel on the substrate by adopting an electroplating technology, and then performing a pre-plating copper process. Taking three pieces of pre-nickel-plated copper base material, and then carrying out chemical nickel plating;
and 3, respectively carrying out chemical nickel plating for 30min, 60min and 120min under the environment with the temperature of 80 ℃.
The prior nickel plating process for the matrix material is a nickel-copper-nickel three-plating process, wherein the bottom nickel plays a role in preventing a copper plating solution from corroding a matrix, the copper layer plays a role in enhancing the corrosion resistance, and the chemical nickel plating layer in the invention serves as a surface layer to play a role in sealing holes and enhancing the corrosion resistance. The thickness of the nickel plating layer can be effectively reduced by the way of electroplating the base material firstly and then chemically plating the base material, the chemically plated nickel layer plays a role in hole sealing of the electroplated layer, and a relatively thin plated layer can achieve a relatively good corrosion resistance effect.
In the present invention, the surface of the nickel-plated layer prepared in this example 3 was electrochemically tested by a scanning electron microscope to obtain a polarization curve as shown in fig. 3, and the corrosion resistance of the electroless nickel-plated layer was enhanced with the increase of the electroless nickel-plating time.
Example 4
The contents of the components in the alkaline electroless nickel hydrazine hydrate plating solution of the present example are shown in table 4:
TABLE 4 hydrazine hydrate alkaline electroless nickel plating solution
| Nickel sulfate | 30g/L |
| 65 wt.% hydrazine hydrate | 70ml/L |
| Citric acid sodium salt | 80g/L |
| Tartaric acid potassium sodium salt | 8g/L |
| Cobalt sulfate | 8g/L |
| Lead acetate | 5mg/L |
The preparation method of the plating solution is the same as that of the embodiment 1, and the nickel plating method of the embodiment specifically comprises the following steps:
step 1, taking a base material, and performing pretreatment processes such as polishing corners → cleaning → degreasing → washing;
and 3, respectively carrying out chemical nickel plating for 1h in the environment with the temperature of 80 ℃.
The nickel-plated layer prepared by the hydrazine hydrate chemical nickel-plating process is fine and uniform in nickel particles and has the effect of sealing holes of the electroplated nickel-plated layer, the microscopic analysis of the surface of the nickel-plated layer prepared in example 4 and the surface of the chemical nickel-plated layer is carried out by a scanning electron microscope, as shown in fig. 4-5, the microscopic appearance of the nickel-plated layer is shown in fig. 4, the microscopic appearance of the chemical nickel-plated layer after the nickel-plating is shown in fig. 5, and it can be seen that the electroplated nickel particles are large, the gaps are more, the nickel particles of the chemical nickel-plated layer are smaller, and part of the nickel particles are.
In conclusion, the invention provides the hydrazine hydrate alkaline chemical nickel plating solution, the preparation method and the plating method on the iron matrix and the nickel pre-plating material, and the stable chemical nickel plating solution is prepared by optimizing the chemical nickel plating solution. The chemical plating method has the advantages of high chemical plating speed, stable chemical nickel plating solution, long service life and green and environment-friendly product, and can directly carry out chemical nickel plating on a substrate material, and the obtained nickel plating layer is bright and flat, uniform and compact in crystal grains and good in corrosion resistance. The invention is green and environment-friendly, has simple process and potential industrial application value.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention.
Claims (9)
1. The chemical nickel plating solution for hydrazine hydrate is characterized by consisting of nickel sulfate, hydrazine hydrate, sodium citrate, potassium sodium tartrate, cobalt sulfate and lead acetate;
the concentration ranges of the components in the plating solution are as follows: 20-30 g/L of nickel sulfate, 50-70 ml/L of 65 wt.% hydrazine hydrate, 60-90 g/L of sodium citrate, 8-14 g/L of potassium sodium tartrate, 6-15 g/L of cobalt sulfate and 5-15 mg/L of lead acetate;
the pH value of the plating solution is 12-13.
2. The hydrazine hydrate electroless nickel plating solution as claimed in claim 1, wherein the concentration ranges of the components in the plating solution are as follows: 25-30 g/L of nickel sulfate, 60-70 ml/L of 65 wt.% hydrazine hydrate, 60-80 g/L of sodium citrate, 8-12 g/L of potassium sodium tartrate, 6-10 g/L of cobalt sulfate and 5-10 mg/L of lead acetate.
3. An electroless nickel hydrazine hydrate plating solution as claimed in any one of claims 1 to 2, wherein sodium hydroxide is used to adjust the pH.
4. A method for preparing a hydrazine hydrate electroless nickel plating solution as claimed in any one of claims 1 to 3, comprising the steps of:
step 1, measuring various raw materials according to the concentration of each component in the chemical nickel plating solution;
step 2, dissolving nickel sulfate by using deionized water to obtain a solution A;
step 3, dissolving sodium citrate and potassium sodium tartrate by using deionized water to obtain a solution B, slowly adding the solution A into the solution B, and uniformly mixing and stirring to obtain a solution C;
step 4, adding cobalt sulfate and lead acetate into the solution C respectively, and fully and uniformly stirring to obtain a solution D;
and 5, adjusting the pH value of the solution D to be more than 9 by using a 5 wt% sodium hydroxide solution, adding hydrazine hydrate, uniformly stirring and mixing, adding deionized water until the volume of the solution is close to that of the volumetric flask, adjusting the pH value to 12-13 by using a small amount of sodium hydroxide to obtain a solution E, transferring the solution into the volumetric flask, and fixing the volume by using a small amount of deionized water to obtain the hydrazine hydrate chemical nickel plating solution.
5. A nickel plating method, characterized in that, the hydrazine hydrate chemical nickel plating solution of any one of the claims 1 to 3 is adopted; the method comprises the following steps:
step 1, preprocessing a base material;
step 2, heating the chemical nickel plating solution;
step 3, putting the base material into a chemical nickel plating solution for nickel plating;
and 4, obtaining a nickel-plated layer of the base material.
6. A nickel plating method according to claim 5, wherein in step 1, the pretreatment comprises corner polishing, cleaning, degreasing, water washing, acid washing and cleaning in sequence.
7. The nickel plating method according to claim 5, wherein the bath temperature of the plating solution in step 2 is 70 ℃ to 90 ℃.
8. The nickel plating method according to claim 5, wherein in the step 3, the nickel plating time is 1 to 2 hours.
9. The nickel plating method according to any one of claims 5 to 8, wherein in step 1, after the base material is pretreated, the base material is plated.
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| CN101302613A (en) * | 2008-01-16 | 2008-11-12 | 哈尔滨工业大学 | Nickel plating solution of inorganic oxide powder and nickel plating method |
| CN101314848B (en) * | 2008-07-16 | 2010-06-02 | 中山大学 | Non-ammonia type plating solution for chemical nickel plating |
| CN103451634B (en) * | 2013-07-29 | 2018-11-27 | 洛阳德欣石化科技有限公司 | A kind of chemical nickel plating method on micrometer silicon carbide silicon powder surface |
| CN107523816B (en) * | 2017-08-23 | 2019-08-27 | 广东光华科技股份有限公司 | Chemical nickel plating phosphor bath |
| CN109365802B (en) * | 2018-11-13 | 2020-06-16 | 中国科学院过程工程研究所 | Preparation method of core-shell structure metal ceramic composite powder |
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