Cutting liquid filtering circulating device
Technical field
The present invention relates to silicon wafers to cut field, specifically a kind of cutting liquid filtering circulating device.
Background technique
The closed loop that existing gold steel wire silicon wafer cutting uses is cut, in entire diced system in cutting process, cutting liquid
In will contain silicon powder and large granular impurity, and content can be higher and higher, can largely effect on the cut quality of silicon wafer, typically
It is solved by changing cutting liquid, not only considerably increases production cost, while also exacerbating environmental pollution.
Summary of the invention
The technical problem to be solved by the present invention is to the shortcomings that overcoming the prior art, provide a kind of cutting liquid filtration cycle
Device, structure is simple, can recycle to cutting liquid, and at the same time also can be reduced the silicon powder content in cutting process.
The technical solution that the present invention solves the above technical problem is: providing cutting liquid filtering circulating device, including cutting liquid
Cylinder, cutup pool and filter device, the cutting fluid cylinder are sealing tubular structure, are provided with inlet on the cutting fluid cylinder,
It is provided with liquid feeding pump in the cutting fluid cylinder, and cutup pool inlet, the mistake are connected by the liquid outlet pipe of one side
Filter device includes wastewater collection pond, filter press and film clear liquid collecting pit, the wastewater collection pond inlet and cutup pool liquid outlet
It is connected by waste pipe, and is provided with drain valve at the liquid outlet of the cutup pool, the wastewater collection pond liquid outlet
It is connected with the filter press inlet by filter pipe, the filter press liquid outlet passes through with film clear liquid collecting pit inlet
Input duct is connected, and the film clear liquid collecting pit liquid outlet connects cutting fluid cylinder by input duct.
Of the invention further limits technical solution:
It is above-mentioned to be equipped with liquidometer on cutting fluid cylinder, convenient for observing the dosage of cutting liquid, it is replenished in time.
It is above-mentioned that flow control valve is equipped in liquid outlet pipe.
It is above-mentioned that cutup pool side is provided with overflow port, and it is provided with overflow pipe on the overflow port, the overflow pipe
Road is connected with waste pipe.
It is above-mentioned that purge valve, existing pressure in discharge line are provided on overflow pipe.
There is two-layer ceramic film in film clear liquid collecting pit above-mentioned, filtering metal ion and microorganism retain solution simultaneously
Middle cutting organic matter effectively cuts ingredient.
The beneficial effects of the present invention are: the configuration of the present invention is simple, silicon slice linear cutter passes through liquid feeding pump when cutting silicon wafer
Required cutting liquid is disposably sent into cutup pool, for the cutting of silicon wafer, while in cutting process, passes through flow control valve
Cutting liquid is conveyed into cutup pool, constantly replaces the cutting liquid containing silicon powder and sediment impurity, guarantees that silicon wafer cutting process is cut
Quality is cut, overflow port is set in cutup pool side, has exceeded setting liquid level, will will be expelled to containing silicon powder and sediment impurity
In wastewater collection pond, it is provided with drain valve at the liquid outlet of cutup pool, will disposably be given up after entire silicon wafer capable of having been cut
Liquid is expelled in wastewater collection pond;Waste liquid is cut through to filter press by the filter press cloth filtering in filter press in wastewater collection pond
The silicon powder and large granular impurity generated in journey, by being equipped with two-layer ceramic film in film clear liquid collecting pit, filtering metal ion is micro-
Biology, while ingredient will not be effectively cut by cutting organic matter in filtering solution, it is then that filtered cutting liquid is again defeated
It is sent in cutting fluid cylinder, follows bad utilization, substantially increase economic benefit, while also ensuring the cut quality of silicon wafer.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the invention.
Specific embodiment
Embodiment 1
The present embodiment provides cutting liquid filtering circulating device, structure is as shown in Figure 1, include cutting fluid cylinder 1, cutup pool 2 and filtering
Device, cutting fluid cylinder are sealing tubular structure, are equipped with liquidometer 3 on cutting fluid cylinder, are provided with inlet on cutting fluid cylinder
4, liquid feeding pump 5 is provided in cutting fluid cylinder, and by the liquid outlet pipe of one side connection 2 inlet of cutup pool, and
Liquid outlet pipe is equipped with flow control valve 6, and filter device includes wastewater collection pond 7, filter press 8 and film clear liquid collecting pit 9, waste water
Collecting pit inlet is connect with cutup pool liquid outlet by waste pipe, and is provided with drain valve at the liquid outlet of cutup pool
10, cutup pool side is provided with overflow port, and overflow pipe 11 is provided on the overflow port, the overflow pipe and waste pipe
Road is connected, and purge valve 12 is provided on overflow pipe, and wastewater collection pond liquid outlet and filter press inlet pass through filtering
Pipeline is connected, and filter press liquid outlet is connected with film clear liquid collecting pit inlet by input duct, and film clear liquid collecting pit
Interior to have two-layer ceramic film 13, film clear liquid collecting pit liquid outlet connects cutting fluid cylinder by input duct.
The present embodiment structure is simple, and silicon slice linear cutter is primary by required cutting liquid by liquid feeding pump when cutting silicon wafer
Property is sent into cutup pool, for the cutting of silicon wafer, while in cutting process, is conveyed and is cut into cutup pool by flow control valve
Liquid is cut, the cutting liquid containing silicon powder and sediment impurity is constantly replaced, guarantees silicon wafer cutting process cut quality, in cutup pool one
Overflow port is arranged in side, has exceeded setting liquid level, will will be expelled in wastewater collection pond, and cut containing silicon powder and sediment impurity
It cuts and is provided with drain valve at the liquid outlet in pond, waste liquid is disposably expelled to wastewater collection pond after entire silicon wafer capable of having been cut
It is interior;Waste liquid is to filter press in wastewater collection pond, filters the silicon powder generated in cutting process and big by the filter press cloth in filter press
Granule foreign is equipped with two-layer ceramic film passing through in film clear liquid collecting pit, filtering metal ion, microorganism, while will not mistake
Organic matter is cut in drainage solution and effectively cuts ingredient, and then filtered cutting liquid is re-delivered in cutting fluid cylinder, is followed
It is bad to utilize, economic benefit is substantially increased, while also ensuring the cut quality of silicon wafer.
In addition to the implementation, the present invention can also have other embodiments.It is all to use equivalent substitution or equivalent transformation shape
At technical solution, fall within the scope of protection required by the present invention.