CN109831554B - Mainboard upper cover of electronic equipment, manufacturing method thereof and electronic equipment - Google Patents
Mainboard upper cover of electronic equipment, manufacturing method thereof and electronic equipment Download PDFInfo
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- CN109831554B CN109831554B CN201811642570.5A CN201811642570A CN109831554B CN 109831554 B CN109831554 B CN 109831554B CN 201811642570 A CN201811642570 A CN 201811642570A CN 109831554 B CN109831554 B CN 109831554B
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Abstract
The invention discloses a mainboard upper cover, a manufacturing method thereof and electronic equipment. The manufacturing method of the main board upper cover comprises the steps of firstly providing a forming die of the main board upper cover, wherein the forming die is provided with the structure of the decoration part and the sound-emitting part; injecting plastic into the molding die. The other manufacturing method is that a structural body with the decoration part and the sound-emitting part is provided; arranging the structure body into a forming die of the main board upper cover; injecting plastic into the forming mold, and performing secondary encapsulation forming on the structural body by the plastic. The invention integrates the existing telephone receiver decorative cover and the mainboard upper cover, thereby reducing the assembly process of the electronic equipment, avoiding the reliability risk between assemblies and increasing the sound volume of the electronic equipment.
Description
Technical Field
The present invention relates to the field of electronic devices, and in particular, to a motherboard cover of an electronic device, a manufacturing method thereof, and an electronic device.
Background
The pursuit of consumers for products is more and more intensive, and aiming at the higher sound effect requirement of electronic equipment (especially mobile phones), the space design of a sound cavity channel is expected to be large enough, and the contradiction is that the pursuit of a full-face screen is that the smaller the structural part area needing to be exposed is, the better.
At present, the telephone receiver decoration cover is assembled on the decoration part and the sound outlet part of the upper cover of the mainboard of the electronic equipment, and the telephone receiver decoration cover is arranged on the upper cover of the mainboard in an assembling mode, so that the assembling process of the electronic equipment is complicated, and the reliability risk between the assembling is easy to occur.
Disclosure of Invention
The embodiment of the invention provides a mainboard upper cover of electronic equipment, a manufacturing method thereof and the electronic equipment, which solve the problems that the telephone receiver decorative cover is assembled on the electronic equipment in an assembling mode at present, the assembling process of the electronic equipment is complex, and the reliability risk between assembling is easy to occur.
In order to solve the technical problem, the invention is realized as follows:
in a first aspect, a main board upper cover is provided, the main board upper cover has a decoration portion and a sound emitting portion connected to one side of the decoration portion, and the sound emitting portion includes a plurality of sound emitting holes.
In a second aspect, a method for manufacturing a motherboard upper cover is provided, which includes:
providing a forming die of the main board upper cover, wherein the forming die is provided with the structures of the decoration part and the sound outlet part; injecting plastic into the molding mold to form the main board upper cover with the decoration part and the sound-emitting part.
In a third aspect, a method for manufacturing a motherboard upper cover is provided, which includes:
providing a structural body having the decorative part and the sound emitting part;
arranging the structure body into a forming die of the main board upper cover;
injecting plastic into the forming die, and performing secondary encapsulation molding on the structural body by the plastic to form the main board upper cover with the decoration part and the sound outlet part.
In a fourth aspect, an electronic device is provided, which includes a motherboard lower cover and the motherboard upper cover as described above, wherein the motherboard upper cover is disposed on the motherboard lower cover.
In the embodiment of the invention, the existing telephone receiver decorative cover is integrated with the main board upper cover, so that the assembling process of the electronic equipment is reduced, the reliability risk of an assembly room is avoided, and the sound volume of the electronic equipment is increased.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic view of an electronic device of a first embodiment of the invention;
FIG. 2 is a schematic view of a motherboard cover according to a first embodiment of the present invention;
FIG. 3 is an enlarged view of area A of FIG. 2;
FIG. 4 is another schematic view of the motherboard cover according to the first embodiment of the present invention;
FIG. 5 is an enlarged view of area B of FIG. 4;
fig. 6 is a schematic view of the receiver assembly of the first embodiment of the present invention mounted on the motherboard upper cover;
FIG. 7 is an enlarged view of area C of FIG. 6;
fig. 8 is an exploded view of the receiver assembly of the first embodiment of the present invention mounted on the motherboard upper cover.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Please refer to fig. 1, fig. 2, fig. 3, fig. 4 and fig. 5, which are a schematic diagram of an electronic device, a schematic diagram of a motherboard cover, an enlarged view of a region a in fig. 2 and an enlarged view of a region B in fig. 4 according to a first embodiment of the present invention; as shown in the figure, the embodiment provides an electronic device 1, where the electronic device 1 includes a motherboard lower cover 10, a motherboard upper cover 11 and a display panel (not shown), the motherboard upper cover 11 is disposed on the motherboard lower cover 10, and the display panel is disposed on the motherboard upper cover 11 and is opposite to the motherboard lower cover 10. An accommodating space is formed between the motherboard upper cover 11 and the motherboard lower cover 10, and the accommodating space can accommodate the motherboard and a plurality of components. The receiver decoration cover of the conventional electronic device is assembled on the main board upper cover, that is, the receiver decoration cover and the main board upper cover are two components, and the main board upper cover 11 of the electronic device 1 of the embodiment integrates the conventional receiver decoration cover and the conventional main board upper cover, that is, integrates the conventional receiver decoration cover and the conventional main board upper cover into one component. The motherboard cover 11 has a first surface 111 and a second surface 112 opposite to the first surface 111, and the second surface 112 faces the motherboard cover 10. The main board cover 11 has a decorative portion 113 and a sound emitting portion 114 connected to one side of the decorative portion 113, that is, the sound emitting portion 114 is directly provided on one side of the decorative portion 113, in other words, no other structure is provided between the decorative portion 113 and the sound emitting portion 114.
In order to realize the main board cover 11 of the present embodiment, there are two methods, the first method is to provide a forming mold of the main board cover 11, the forming mold has the structure of the decoration portion 113 and the sound emitting portion 114 (corresponding to the structure of the receiver decoration cover), and then inject plastic into the forming mold to form the main board cover 11 having the decoration portion 113 and the sound emitting portion 114. The second method is to form a structural body (corresponding to a receiver decorative cover) having the decorative part 113 and the sound emitting part 114, then place the structural body having the decorative part 113 and the sound emitting part 114 in a molding die of the main board upper cover 11, then inject plastic into the molding die, and perform secondary encapsulation molding on the structural body having the decorative part 113 and the sound emitting part 114 through the plastic, thereby forming the main board upper cover 11 having the decorative part 113 and the sound emitting part 114.
Therefore, the main board upper cover 11 of the present embodiment has the structure of the receiver decoration cover, that is, the receiver decoration cover is not additionally installed on the main board upper cover 11, so as to prevent the receiver decoration cover from being separated from the main board upper cover 11, reduce the assembly process, and avoid the reliability risk between the assemblies.
Please refer to fig. 6, 7 and 8, which are a schematic view, an exploded schematic view and an enlarged view of a region C in fig. 6 of the receiver assembly of the first embodiment of the present invention installed on the motherboard upper cover; as shown in the drawings, the present embodiment illustrates that the receiver assembly 2 is installed on the motherboard upper cover 11 of the electronic device, and the receiver assembly 2 is installed on the second sound emitting channel 1141b of the sound emitting portion 114 of the motherboard upper cover 11, and the generated sound can be emitted from the second sound emitting channel 1141b, the first sound emitting channel 1141a and the plurality of sound emitting holes 1142 of the sound emitting portion 114.
The receiver assembly 2 of this embodiment includes a receiver holder 21 and a receiver (not shown), the receiver holder 21 is disposed on the second sound-emitting channel 1141b of the sound-emitting portion 114 of the main board upper cover 11, the receiver is disposed on the receiver holder 21, and the sound-emitting area of the receiver holder 21 corresponds to the second sound-emitting channel 1141b through the receiver holder 21, so that the sound emitted from the sound-emitting area of the receiver can be transmitted into the second sound-emitting channel 1141b, and then the sound is emitted from the sound-emitting holes 1142 through the first sound-emitting channel 1141 a.
The receiver holder 21 includes a receiver holding portion 211 and a sealing portion 212, the sealing portion 212 is disposed on one side of the receiver holding portion 211, and the receiver holding portion 211 has a through hole 2111. The receiver bearing portion 211 is disposed on the second sound output channel 1141b of the sound output portion 114, the through hole 2111 is communicated with the second sound output channel 1141b, and the receiver is disposed on the receiver bearing portion 211. The sealing portion 212 is provided in the passage 1131 of the decorative portion 113 and the first sound emission passage 1141a of the sound emission portion 114. The sound emitting channel 1141 is an independent space by the sealing portion 212, so that the sound transmitted in the sound emitting channel 1141 is not interfered by external sound.
In addition, a gap is formed between the sealing portion 212 disposed in the first sound emitting channel 1141a and the surface of the first sound emitting channel 1141a having the plurality of sound emitting holes 1142, so that the first sound emitting channel 1141a has a certain sound channel volume. The sound emitting portion 114 of the motherboard cover 11 of the present embodiment mainly uses the inactive portion of the existing receiver cover as the sound emitting portion 114, and increases the length of the first sound emitting channel 1141a of the sound emitting portion 114 of the motherboard cover 11, thereby expanding the volume of the first sound emitting channel 1141a of the sound emitting portion 114 of the motherboard cover 11. In addition, the two other ways of expanding the volume of the sound channel of the first sound emitting channel 1141a of the sound emitting portion 114 of the motherboard upper cover 11 are respectively to reduce the length of the channel 1131 of the decoration portion 113 and further increase the length of the first sound emitting channel 1141a of the sound emitting portion 114 of the motherboard upper cover 11, so as to expand the volume of the sound channel of the first sound emitting channel 1141a of the sound emitting portion 114; or the thickness of the sealing portion 212 disposed in the first sound emitting channel 1141a is reduced or the position of the sealing portion 212 disposed in the first sound emitting channel 1141a is adjusted to adjust the distance between the sealing portion 212 disposed in the first sound emitting channel 1141a and the surface of the first sound emitting channel 1141a having the plurality of sound emitting holes 1142, so as to expand the volume of the sound channel of the first sound emitting channel 1141a of the sound emitting portion 114, and therefore, at least one of the two manners can be selected to expand the volume of the sound channel of the first sound emitting channel 1141a of the sound emitting portion 114.
The receiver assembly 2 of this embodiment further includes a back adhesive 22, the back adhesive 22 is disposed on a surface of the receiver support 21 facing the second surface 112 of the motherboard upper cover 11, the receiver support 21 is fixed on the motherboard upper cover 11 through the back adhesive 22, the back adhesive 22 of this embodiment includes a first back adhesive 22a, a second back adhesive 22b and a third back adhesive 22c, the first back adhesive 22a is adhered between the receiver bearing portion 211 and the second surface 112 of the motherboard upper cover 11, the surface of the sealing portion 212 facing the channel 1131 is provided with the second back adhesive 22b, and the second back adhesive 22b is adhered on a surface of the channel 1131 having a plurality of decoration holes 1132. The surface of the sealing portion 212 facing the first sound emitting channel 1141a is provided with a third adhesive 22c, the third adhesive 22c is adhered to the side wall end surface of the first sound emitting channel 1141a, and a distance is provided between the side wall end surface of the first sound emitting channel 1141a adhered with the third adhesive 22c and the surface of the first sound emitting channel 1141a having the plurality of sound emitting holes 1142, so that a distance is provided between the sealing portion 212 provided on the first sound emitting channel 1141a and the surface of the first sound emitting channel 1141a having the plurality of sound emitting holes 1142. The back glue 22 of the present embodiment is located on the second surface 112 of the motherboard upper cover 11, that is, the first back glue 22a, the second back glue 22b, and the third back glue 22c are located on the same side, so only the back glue 22 needs to be disposed on the receiver support 21, and the receiver support 21 with the back glue 22 is bonded to the motherboard upper cover 11 again, which only needs one process, thereby reducing the assembly processes.
In addition, the main board upper cover 11 of the present embodiment has integrated the receiver decoration cover, that is, the receiver decoration cover is a part of the structure of the main board upper cover 11, so that it is not necessary to separately manufacture the receiver decoration cover, thereby avoiding the problem that the separately manufactured receiver decoration cover is easy to have poor adhesive shortage due to the thin adhesive position, and greatly improving the production yield. Certainly, the main board upper cover 11 of this embodiment can be formed by performing secondary rubber coating forming on the receiver decorative cover, and the part of the receiver decorative cover where the rubber shortage occurs is filled through secondary rubber coating, so that the above function can be achieved. Meanwhile, because the main board upper cover 11 of the embodiment integrates the receiver decorative cover, the area of the side wall end surface of the first sound outlet channel 1141a adhered with the second back adhesive 22b and the area of the surface of the channel 1131 adhered with the third back adhesive 22c are increased, so that the bonding strength between the receiver support 21 and the main board upper cover 11 can be increased, and the reliability of fixing the receiver support 21 on the main board upper cover 11 is improved.
The receiver assembly 2 of the present embodiment further includes a dust-proof net 23, wherein the dust-proof net 23 is disposed between the bearing portion 211 and the receiver and covers the sound-emitting area of the receiver. To block external dust entering from the sound emitting portion 114.
In summary, the present invention provides a main board top cover, a manufacturing method thereof and an electronic device, which integrate the existing receiver decorative cover with the main board top cover to reduce the assembly process of the electronic device, avoid the reliability risk between assemblies and increase the sound volume of the electronic device.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (5)
1. An electronic device, which is characterized by comprising a mainboard lower cover, a mainboard upper cover, a display panel and a receiver component, wherein the display panel is arranged on the mainboard upper cover, and is opposite to the main board lower cover, the main board upper cover is provided with a decoration part and a sound outlet part connected with one side of the decoration part, the sound outlet part comprises a plurality of sound outlet holes and a sound outlet channel, the sound outlet channel is communicated with the sound outlet holes, the sound outlet channel comprises a first sound outlet channel and a second sound outlet channel, the second sound outlet channel is arranged on one side of the first sound outlet channel, and communicated with the first sound outlet channel, a plurality of sound outlet holes are arranged on the first sound outlet channel, the decoration part is provided with a channel and a plurality of decoration holes communicated with the channel, the telephone receiver assembly is positioned between the mainboard upper cover and the mainboard lower cover, and the sound outlet area of the telephone receiver assembly is communicated with the sound outlet part of the mainboard upper cover;
the telephone receiver assembly comprises a telephone receiver support and a telephone receiver, the telephone receiver support is arranged on the decoration part and the sound outlet part, the telephone receiver is arranged on the telephone receiver support, and the sound outlet area of the telephone receiver is communicated with the sound outlet holes of the sound outlet part;
the telephone receiver support comprises a telephone receiver bearing part and a sealing part, wherein the telephone receiver bearing part is arranged on the sound outlet part and is provided with a through hole, the telephone receiver is arranged on the telephone receiver bearing part, a sound outlet area of the telephone receiver passes through the through hole and the sound outlet holes, the sealing part is arranged on the decoration part, the channel reaches the first sound outlet channel of the sound outlet part, the sealing part and the first sound outlet channel are provided with a plurality of gaps, and the first sound outlet channel is provided with a sound channel volume.
2. The electronic device according to claim 1, wherein the sound channel volume of the sound emitting portion is enlarged by increasing a distance between the sealing portion and a surface of the sound emitting portion having the plurality of sound emitting holes.
3. The electronic device of claim 1, wherein the acoustic channel volume of the sound-emitting portion is enlarged by increasing a length of the sound-emitting portion.
4. The electronic device of claim 1, wherein the receiver bracket is secured to the motherboard cover by a backing adhesive.
5. The electronic device of claim 1, wherein a dust screen is further disposed between the receiver and the receiver carrying portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811642570.5A CN109831554B (en) | 2018-12-29 | 2018-12-29 | Mainboard upper cover of electronic equipment, manufacturing method thereof and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811642570.5A CN109831554B (en) | 2018-12-29 | 2018-12-29 | Mainboard upper cover of electronic equipment, manufacturing method thereof and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109831554A CN109831554A (en) | 2019-05-31 |
| CN109831554B true CN109831554B (en) | 2021-04-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201811642570.5A Active CN109831554B (en) | 2018-12-29 | 2018-12-29 | Mainboard upper cover of electronic equipment, manufacturing method thereof and electronic equipment |
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| CN102480866A (en) * | 2010-11-29 | 2012-05-30 | 深圳富泰宏精密工业有限公司 | Shell of electronic device and manufacturing method thereof |
| CN202374310U (en) * | 2011-11-15 | 2012-08-08 | 东莞宇龙通信科技有限公司 | Mobilephone earphone structure and mobilephone using same |
| CN103384285A (en) * | 2013-07-10 | 2013-11-06 | 华为终端有限公司 | Mobile terminal |
| EP2675140A1 (en) * | 2012-06-11 | 2013-12-18 | Fujitsu Limited | Electronic device and assembly method of the same |
| CN105792560A (en) * | 2014-12-24 | 2016-07-20 | 深圳富泰宏精密工业有限公司 | Shell, electronic apparatus applying shell, and manufacturing method for shell |
| CN205490741U (en) * | 2016-03-22 | 2016-08-17 | 东莞洲煌塑胶五金制品有限公司 | Mobile phone motherboard upper cover dress escutcheon |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202014423U (en) * | 2011-01-28 | 2011-10-19 | 三星电子株式会社 | Portable terminal |
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2018
- 2018-12-29 CN CN201811642570.5A patent/CN109831554B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102480866A (en) * | 2010-11-29 | 2012-05-30 | 深圳富泰宏精密工业有限公司 | Shell of electronic device and manufacturing method thereof |
| CN202374310U (en) * | 2011-11-15 | 2012-08-08 | 东莞宇龙通信科技有限公司 | Mobilephone earphone structure and mobilephone using same |
| EP2675140A1 (en) * | 2012-06-11 | 2013-12-18 | Fujitsu Limited | Electronic device and assembly method of the same |
| CN103384285A (en) * | 2013-07-10 | 2013-11-06 | 华为终端有限公司 | Mobile terminal |
| CN105792560A (en) * | 2014-12-24 | 2016-07-20 | 深圳富泰宏精密工业有限公司 | Shell, electronic apparatus applying shell, and manufacturing method for shell |
| CN205490741U (en) * | 2016-03-22 | 2016-08-17 | 东莞洲煌塑胶五金制品有限公司 | Mobile phone motherboard upper cover dress escutcheon |
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| Publication number | Publication date |
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| CN109831554A (en) | 2019-05-31 |
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