CN109829886A - A kind of pcb board defect inspection method based on depth information - Google Patents
A kind of pcb board defect inspection method based on depth information Download PDFInfo
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- CN109829886A CN109829886A CN201811586272.9A CN201811586272A CN109829886A CN 109829886 A CN109829886 A CN 109829886A CN 201811586272 A CN201811586272 A CN 201811586272A CN 109829886 A CN109829886 A CN 109829886A
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Abstract
The invention discloses a kind of pcb board defect inspection method based on depth information, the described method comprises the following steps: acquire the depth data of pcb board to be detected, standard pcb board respectively；According to the depth data of two pcb boards, corresponding depth image is generated respectively；Standard picture is obtained according to the depth image of standard pcb board, testing image is obtained according to the depth image of pcb board to be detected；Standard picture and testing image are subjected to image registration；Image difference operation is carried out with testing image to the standard picture after registration, obtains bianry image；It determines that pcb board defect, this method carry out 3-D scanning to pcb board by line laser, obtain pcb board depth information according to bianry image, reduces the data volume that need to be handled, low to illumination condition requirement, range data processing can reduce false detection rate.
Description
Technical field
The present invention relates to electronic component detection fields, and in particular to a kind of pcb board defects detection based on depth information
Method.
Background technique:
Industrial pcb board defects detection is the Two-dimensional Color Image information based on pcb board, Two-dimensional Color Image mostly at present
Middle data volume is excessive and many garbages, and processing speed is slow, to shooting two dimensional image processing essence under the scene of illumination condition difference
To spend low, false detection rate is big, it is extracted by features such as color, angle points to two dimensional image, then be compared with on-gauge plate, thus
Detect defect present in pcb board.
Summary of the invention
The purpose of the present invention is to provide a kind of pcb board defect inspection method based on depth information, to solve existing skill
Caused above-mentioned defects in art.
A kind of pcb board defect inspection method based on depth information, the described method comprises the following steps:
The depth data of pcb board to be detected, standard pcb board is acquired respectively；
According to the depth data of two pcb boards, corresponding depth image is generated respectively；
Standard picture is obtained according to the depth image of standard pcb board, is obtained according to the depth image of pcb board to be detected to be measured
Image；
Standard picture and testing image are subjected to image registration；
Image difference operation is carried out with testing image to the standard picture after registration, obtains bianry image；
Pcb board defect is determined according to bianry image.
Preferably, the generation method of the depth image includes: that the depth data is normalized between 0~255.
Preferably, the method for described image registration includes: using Hough transform method difference examination criteria image and to mapping
The circle Mark of picture and the center of circle；It is rotated and is translated by coordinate, realize image registration.
Preferably, described to compare the difference of standard picture and testing image and preset threshold, preset threshold will be less than
Pixel set 0, rest of pixels point sets 1, to obtain differentiated bianry image.
Preferably, the calculation method of the difference includes: the picture that the pixel value of standard picture is subtracted to testing image corresponding points
Plain value or the pixel value that the pixel value of testing image is subtracted to standard picture corresponding points.
Preferably, the defect of the pcb board determines that method includes: to carry out etching operation to the bianry image, after corrosion
White area in image is defect.
The present invention has the advantages that this method carries out 3-D scanning to pcb board by line laser, pcb board depth letter is obtained
Breath reduces the data volume that need to be handled, low to illumination condition requirement, and range data processing can reduce false detection rate.
Detailed description of the invention
Fig. 1 is according to a kind of process of the pcb board defect inspection method based on depth information provided in an embodiment of the present invention
Figure.
Specific embodiment
To be easy to understand the technical means, the creative features, the aims and the efficiencies achieved by the present invention, below with reference to
Specific embodiment, the present invention is further explained.
As shown in Figure 1, a kind of pcb board defect inspection method based on depth information, the described method comprises the following steps:
The depth data for acquiring pcb board to be detected, standard pcb board respectively, using line laser structured light standard pcb board just
Face and the back side, the depth data of collection plate front and back sides；
According to the depth data of two pcb boards, corresponding depth image is generated respectively；
Standard picture is obtained according to the depth image of standard pcb board, is obtained according to the depth image of pcb board to be detected to be measured
Image is filtered operation removal noise to obtained depth image, generates on-gauge plate image, and mark different elements region；
Standard picture and testing image are subjected to image registration；
Image difference operation is carried out with testing image to the standard picture after registration, obtains bianry image；
Pcb board defect is determined according to bianry image.
In the present embodiment, the generation method of the depth image includes: that the depth data is normalized to 0~255
Between.
In the present embodiment, described image registration method include: using Hough transform method difference examination criteria image and
The circle Mark of testing image and the center of circle；It is rotated and is translated by coordinate, realize image registration.
In the present embodiment, the acquisition methods of the bianry image include: to be arranged not according to component size to be detected
Same threshold value, and compared with the difference of standard picture and testing image and threshold value, the pixel for being less than threshold value is set 0, remaining
Pixel sets 1, to obtain differentiated bianry image.
In the present embodiment, the calculation method of the difference includes: that standard picture is subtracted testing image and testing image
Subtract the value that standard picture obtains.
In the present embodiment, there are a large amount of false defects in the bianry image, carry out to differentiated bianry image rotten
Erosion operation, the white area after corrosion in image is defect.
Based on above-mentioned, in this method, if to subtract the white area in detection figure corresponding in detection plate depth image for standard drawing
The depth value of position is pcb board height, then weldering is lacked at the position；If detection figure subtracts the white area in standard drawing in on-gauge plate depth
The depth value for spending corresponding position in image is pcb board height, then welds at the position more；For white area remaining in difference image
Judge that mistake is welded at the position.
As known by the technical knowledge, the present invention can pass through the embodiment party of other essence without departing from its spirit or essential feature
Case is realized.Therefore, embodiment disclosed above, in all respects are merely illustrative, not the only.Institute
Have within the scope of the present invention or is included in the invention in the change being equal in the scope of the present invention.
Claims (6)
1. a kind of pcb board defect inspection method based on depth information, which is characterized in that the described method comprises the following steps:
The depth data of pcb board to be detected, standard pcb board is acquired respectively；
According to the depth data of two pcb boards, corresponding depth image is generated respectively；
Standard picture is obtained according to the depth image of standard pcb board, is obtained according to the depth image of pcb board to be detected to mapping
Picture；
Standard picture and testing image are subjected to image registration；
Image difference operation is carried out with testing image to the standard picture after registration, obtains bianry image；
Pcb board defect is determined according to bianry image.
2. a kind of pcb board defect inspection method based on depth information according to claim 1, it is characterised in that: described
The generation method of depth image includes:
The depth data is normalized between 0~255.
3. a kind of pcb board defect inspection method based on depth information according to claim 1, it is characterised in that: described
The method of image registration includes:
Using circle Mark and the center of circle of Hough transform method difference examination criteria image and testing image；
It is rotated and is translated by coordinate, realize image registration.
4. a kind of pcb board defect inspection method based on depth information according to claim 1, it is characterised in that: described
The acquisition methods of bianry image include:
The difference of standard picture and testing image and preset threshold are compared, the pixel for being less than preset threshold is set 0, remaining
Pixel sets 1, to obtain differentiated bianry image.
5. a kind of pcb board defect inspection method based on depth information according to claim 4, it is characterised in that: described
The calculation method of difference includes:
The pixel value of standard picture is subtracted into the pixel value of testing image corresponding points or the pixel value of testing image is subtracted into standard picture
The pixel value of corresponding points.
6. a kind of pcb board defect inspection method based on depth information according to claim 1, it is characterised in that: described
Pcb board defect determines that method includes:
Etching operation is carried out to the bianry image, the white area after corrosion in image is defect.
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Cited By (6)
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| CN110455815A (en) * | 2019-09-05 | 2019-11-15 | 西安多维机器视觉检测技术有限公司 | A kind of method and system of electronic component open defect detection |
| CN111044522A (en) * | 2019-12-14 | 2020-04-21 | 中国科学院深圳先进技术研究院 | Defect detection method and device and terminal equipment |
| CN111812545A (en) * | 2020-07-07 | 2020-10-23 | 苏州精濑光电有限公司 | Line defect detection method, device, equipment and medium |
| CN112614088A (en) * | 2020-12-01 | 2021-04-06 | 安徽维德工业自动化有限公司 | Identification and detection method based on 3D visual detection technology |
| CN113781424A (en) * | 2021-09-03 | 2021-12-10 | 苏州凌云光工业智能技术有限公司 | Surface defect detection method, device and equipment |
| CN114663430A (en) * | 2022-05-18 | 2022-06-24 | 爱科赛智能科技(浙江)有限公司 | PCB surface defect detection method based on frequency domain information double confirmation |
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| CN113781424B (en) * | 2021-09-03 | 2024-02-27 | 苏州凌云光工业智能技术有限公司 | Surface defect detection method, device and equipment |
| CN114663430A (en) * | 2022-05-18 | 2022-06-24 | 爱科赛智能科技(浙江)有限公司 | PCB surface defect detection method based on frequency domain information double confirmation |
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