CN109825201A - A kind of bonding structure and preparation method thereof - Google Patents
A kind of bonding structure and preparation method thereof Download PDFInfo
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- CN109825201A CN109825201A CN201811598775.8A CN201811598775A CN109825201A CN 109825201 A CN109825201 A CN 109825201A CN 201811598775 A CN201811598775 A CN 201811598775A CN 109825201 A CN109825201 A CN 109825201A
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Abstract
The invention discloses a kind of bonding structures and preparation method thereof, the bonding structure includes laminating layer, by paste layer and it is arranged in by the pretreatment layer on paste layer surface, the laminating layer and the pretreatment layer pass through chemical bonds, to improve laminating layer and the active force by paste layer, the problem of increasing the intensity of bonding structure, bonding failure will not occur easily.
Description
Technical field
The invention belongs to tape technology fields, and in particular to a kind of bonding structure and preparation method thereof.
Background technique
For adhesive tape as laminating layer, one layer of sticker is contained on surface, two or more disjunct objects can be pasted
Together.Existing laminating layer is with by the bonding of paste layer, and mainly by the viscosity of sticker itself, adhesion strength is mainly derived from viscous
The intermolecular force of junctor system, such as Van der Waals force or hydrogen bond force, thus adhesive strength is lower, in low intensive active force
Under, laminating layer is destroyed with the cohesive force for easily being removed or being bonded glue layer by paste layer, is caused to paste and be failed, influences whole
The adhesive effect of a product.
Currently, common adhesive tape mainly has foam tape, it is (poly- with EVA (ethylene-vinyl acetate copolymer) or PE
Ethylene) foam is substrate, it is coated with that solvent type (or heat molten type) pressure sensitive adhesive is multiple again to be fabricated with release paper in its one or both sides,
Have the effects that sealing, damping, incompressible morphotropism, anti-flammability, wellability.Traditional foam tape uses one layer of foam rubber
Layer, cohesiveness there is a problem of very big, do not carry out special surface processing between foam and glue-line especially, so that glue-line part sticks
Knot property is very low, easily removes, poor sealing effect.Equally, foam tape is used to paste by paste layer, due to not done by paste layer surface
Processing, foam tape with it is poor by the adhesion strength of paste layer, easily remove, not can guarantee and securely paste multiple objects together.
Summary of the invention
The purpose of the present invention is to provide a kind of bonding structure and preparation method thereof, the adhesion strength of the bonding structure compared with
Height can make to be pasted together by paste layer close and firm, so as to avoid laminating layer inside and laminating layer and by paste layer circle
Emaciated face from and the problem of bonding failure occurs.
To achieve the goals above, the present invention provides a kind of bonding structures, which is characterized in that including laminating layer, is pasted
Layer and it is arranged in by the pretreatment layer on paste layer surface, the laminating layer and the pretreatment layer pass through chemical bonds.
Further, the organic group to form chemical bond can be reacted with the laminating layer by containing in the material of pretreatment layer
Group.
Further, the compound for being Y-R-Si (OR) 3 comprising structural formula in the material of pretreatment layer, wherein Y is can
The organic group to form chemical bond is reacted with the laminating layer, R is alkyl.
Further, the organic group is unsaturated group, epoxy group, amino, isocyanate group, at least one in hydroxyl
Kind.
Further, the laminating layer includes foam glue-line and the adhesive that the foam glue-line or more two sides are arranged in
The interface of layer, the foam glue-line and described adhesive layer passes through chemical bonds.
Further, the material of described adhesive layer includes oligomer and monomer, in the oligomer and the monomer extremely
Contain a kind of active group that can be reacted with pretreatment layer less, the active group is hydroxyl, amino, sulfydryl, carboxyl, unsaturation
At least one of base, isocyanate group.
Further, degree of functionality≤3 of the oligomer and the monomer, the oligomer account for the weight of described adhesive layer
It measures percentage and is not less than 20%.
Another aspect of the present invention provides a kind of preparation method of bonding structure, includes the following steps:
S1) pretreating agent is coated in by paste layer surface, forms pretreatment layer after solidification,
S2 laminating layer is mutually pasted with by the pretreatment layer on paste layer surface), is chemically reacted, so that the laminating layer
Pass through chemical bonds between the pretreatment layer.
Further, the step S2) in, laminating layer is prepared by following steps:
S21) oligomer of degree of functionality≤3, the monomer of degree of functionality≤3, photoinitiator, hollow-particle are uniformly mixed and are obtained
Foam rubber layer composition is coated with foam rubber layer composition on release film, two-sided to solidify according to UV, forms the foam rubber of semi-solid preparation state
Layer;
S22) oligomer of degree of functionality≤3, the monomer of degree of functionality≤3, photoinitiator are uniformly mixed and obtain adhesive phase
At least contain a kind of active group that can be reacted with pretreating agent in composition, the oligomer and the monomer, by adhesive
Layer composition is coated on side of the foam glue-line far from release film, ultraviolet light solidification, forms adhesive phase, described adhesive layer with
The interface of the foam glue-line passes through chemical bonds;
S23 release film) is removed, in the other side coating adhesive layer composition of foam glue-line, ultraviolet light solidification is formed viscous
The interface of mixture layer, described adhesive layer and the foam glue-line forms laminating layer by chemical bonds.
Further, further include in the step S23) after, EB curing reaction is carried out to the laminating layer.
Compared with prior art, the invention has the following beneficial effects:
Bonding structure of the invention is provided with pretreatment layer by paste layer surface, passes through between laminating layer and pretreatment layer
Chemical bonds increase the intensity of bonding structure to improve laminating layer and the active force by paste layer.
Laminating layer of the present invention can also include foam glue-line and the adhesive phase that foam glue-line or more two sides are arranged in, bonding
Oxidant layer and by between paste layer pass through pretreatment layer mutually bonded.Interface and the bonding of foam glue-line and adhesive phase of the invention
The interface of oxidant layer and pretreatment layer is by chemical bonds, and the two mutually acts synergistically, and improves adhesive phase and foam
Glue-line and adhesive phase and by the cohesive force between paste layer, improve foam rubber at the problem of bonding failure will not occur easily
Intensity with fitting.
Detailed description of the invention
The Figure of description for constituting a part of the invention is used to provide further understanding of the present invention, and of the invention shows
Examples and descriptions thereof are used to explain the present invention for meaning property, does not constitute improper limitations of the present invention.
Fig. 1 is the structural schematic diagram of one embodiment of the invention bonding structure,
Fig. 2 is the structural schematic diagram of another embodiment of the present invention bonding structure,
In figure, 1 is laminating layer, and 2 be pretreatment layer, and 3 is are foam glue-line by paste layer, 10, and 11,12 be adhesive phase.
Specific embodiment
It in order to enable those skilled in the art to better understand the solution of the present invention, below will be to the skill in the embodiment of the present invention
Art scheme is clearly and completely described, it is clear that and the described embodiment is only a part of the embodiment of the present invention, without
It is whole embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not before making creative work
Every other embodiment obtained is put, should fall within the scope of the present invention.
It should be noted that term " first ", " second ", "upper" in description and claims of this specification,
"lower" etc. is to be used to distinguish similar objects, without being used to describe a particular order or precedence order.It should be understood that making in this way
Data are interchangeable under appropriate circumstances, so as to the embodiment of the present invention described herein.In addition, term " includes " and
" having " and their any deformation, it is intended that cover it is non-exclusive include, for example, containing a series of steps or units
Process, method, system, product or equipment those of be not necessarily limited to be clearly listed step or unit, but may include not having
Other step or units being clearly listed or intrinsic for these process, methods, product or equipment.
As background technique is introduced, adhesive tape in the prior art is as laminating layer, when with being bonded by paste layer, mainly
By the viscosity of adhesive tape sticker itself, adhesion strength is mainly derived from the intermolecular force of bonding system, such as Van der Waals force
Or hydrogen bond force, thus adhesive strength is lower, under low intensive active force, laminating layer and is easily removed by paste layer or laminating layer
Internal cohesive force destroys, and causes to paste and fail, influences the adhesive effect of entire product.
In view of the above-mentioned problems, the present invention provides a kind of bonding structures, as shown in Figure 1, include laminating layer 1, by paste layer 3 with
And be arranged in by the pretreatment layer 2 on 3 surface of paste layer, the laminating layer 1 passes through chemical bonds with the pretreatment layer 2.This hair
It is bright by forming pretreatment layer, passing through chemical bonded refractory between the laminating layer and pretreatment layer to by paste layer surface preparation
It closes, relative to the intermolecular force of traditional bonding structure, its binding force is stronger, and laminating layer and the bonding by paste layer can be improved
Intensity improves integrally-built intensity.
It above-mentioned pretreatment layer and can be bonded by physical adsorption way between paste layer, including but not limited to using spray
The modes such as sand, polishing, etching form certain roughness, increase by two layers of contact surface, to improve by paste layer and pretreatment
The binding force of layer;It is also possible to pretreatment layer and is combined in such a way that chemical reaction forms chemical bond between paste layer.In order to
Improve integrally-built intensity, it is preferable that pretreatment layer and by between paste layer by chemical bonds, relative to physical absorption
Intermolecular force, chemical bonded refractory resultant force it is stronger.
The organic group to form chemical bond can be reacted with the laminating layer by containing in the material of pretreatment layer of the invention,
By above-mentioned organic group, pretreatment layer and laminating layer can participate in chemical reaction and form chemical bond, to make two layers of close knot
It closes, improves the intensity of bonding structure, so that laminating layer and will not be removed easily between paste layer.
Organic group in above-mentioned pretreatment layer can be in unsaturated group, epoxy group, amino, isocyanate group, hydroxyl
At least one.In laminating layer contain at least one active group that can react with above-mentioned organic group, active group be hydroxyl,
At least one of amino, sulfydryl, carboxyl, unsaturated group, isocyanate group.The organic group and laminating layer of above-mentioned pretreatment layer
Active group reaction, such as can be reacted with unsaturated group for unsaturated group, unsaturated group can be double bond, ethylene linkage etc., ring
Oxygroup is reacted with hydroxyl, amino, and amino is reacted with isocyanate group, epoxy group, carboxyl, and isocyanate group is reacted with hydroxyl.
In a kind of preferred embodiment of the present invention, may include structural formula in the material of pretreatment layer is Y-R-Si
(OR) 3 compound, wherein Y is that the organic group to form chemical bond can be reacted with the laminating layer, and R is alkyl.Above-mentioned knot
The compound of structure formula, Y group are reacted with laminating layer through chemical bonds, and SiOR group can be reacted with by paste layer, passing through
It learns bond to close, to improve integrally-built intensity.
Above-mentioned can be metal, preferably steel plate by paste layer.Metal is as inorganic material, it is difficult to organic laminating layer
Securely connection, under low active force laminating layer with it is easily peelable by paste layer.The present invention is entirely different by property by pretreatment layer
Organic laminating layer is bonded with inorganic metallic materials, and laminating layer and the pretreatment layer pass through chemical bonds, to improve
The integral strength of bonding structure.
Pretreatment layer of the invention and the stripping being generally higher than by the peeling force between paste layer between laminating layer and pretreatment layer
From power, this is because pretreatment layer is first coated on by paste layer surface, most of group is reacted with by paste layer, and binding force is higher;It is few
The organic group of amount reacts to form chemical bond with the active group of laminating layer.Due to containing in the material of pretreatment layer of the invention
The organic group to form chemical bond can be reacted with the laminating layer, by above-mentioned organic group, pretreatment layer and laminating layer can
Chemical bond is formed to participate in chemical reaction, to make to combine closely for two layers, the intensity of bonding structure is improved, is pasted relative to tradition
Intermolecular force its binding force for closing structure is stronger, so that laminating layer and will not be removed easily between paste layer.
In another preferred embodiment of the present invention, as shown in Fig. 2, laminating layer 1 of the invention is high-intensitive bubble
Celloidin band, structure be foam glue-line 10 and be arranged in the adhesive phases 11,12 of foam glue-line or more two sides, adhesive phase with
It is mutually bonded by pretreatment layer is passed through between paste layer.The interface of above-mentioned foam glue-line and adhesive phase and adhesive phase and pre-
The interface of process layer is by chemical bonds, and the two mutually acts synergistically, improve adhesive phase and foam glue-line and
Adhesive phase and by the cohesive force between paste layer, improves foam tape fitting at the problem of bonding failure will not occur easily
Intensity.
The material of above-mentioned adhesive phase includes oligomer and monomer, can at least be located with pre- containing a kind of in oligomer and monomer
The active group of layer reaction is managed, the active group is hydroxyl, in amino, sulfydryl, carboxyl, unsaturated group, isocyanate group
It is at least one.Reacting between adhesive phase and pretreatment layer, such as can be reacted for unsaturated group with unsaturated group, it is unsaturated
Base can be double bond, ethylene linkage etc., and epoxy group is reacted with hydroxyl, amino, and amino is reacted with isocyanate group, epoxy group, carboxyl, different
Cyanic acid ester group is reacted with hydroxyl.
Further, degree of functionality≤3 of above-mentioned oligomer and monomer, using the oligomer and monomer of degree of functionality≤3, due to
Degree of functionality is lower, and viscosity is stronger after solidification, and the adhesion strength between adhesive phase and affixed object can be improved.The oligomer accounts for
The weight percent of adhesive phase is not less than 20%, if less than 20%, on the one hand, oligomer is too low, and content of monomer is opposite
For it is higher, reaction rate is excessively slow, can not form solid-state or semisolid adhesive phase, on the other hand be also not suitable for roll-to-roll
Technique production.Preferably, it is 30~50% that above-mentioned oligomer, which accounts for the weight percent of adhesive phase, can be improved adhesive phase
Reaction rate and with by the adhesion strength of paste layer.
Above-mentioned oligomer can choose the acrylate quasi-oligomer of degree of functionality≤3 of routine in the art, such as can
Think one of urethane acrylate, polyester acrylate, pure acrylate, epoxy acrylate or a variety of;Above-mentioned list
Body can choose the activity diluting monomer of single functionality common in the art, bifunctionality or three-functionality-degree.
In a preferred embodiment, above-mentioned adhesive phase further includes the tackifying assistant of 1~5% weight percent,
Tackifying assistant can be improved adhesive phase and by the adhesion strength between paste layer, such as can choose phosphate etc..
In laminating layer of the invention, the material of foam glue-line includes oligomer, monomer, photoinitiator and hollow-particle,
In, degree of functionality≤3 of oligomer and monomer.Using the oligomer and monomer of degree of functionality≤3, since degree of functionality is lower, solidification speed
Rate is slower, under the ultraviolet light solidification of low energy, is capable of forming semi-cured state, still there is the unreacted oligomer in part and list
Body has partial double bond remaining, can react with the double bond in the oligomer and monomer of adhesive phase, forms chemical bond, from
And the binding force of foam glue-line and adhesive phase is improved, improve the integral strength of foam tape.
In above-mentioned foam glue-line, oligomer accounts for the weight percent of foam glue-line not less than 20%, if less than 20%, a side
Face, oligomer is too low, and content of monomer is in contrast higher, and reaction rate is excessively slow, and the viscosity of foam glue-line is lower, after solidification
It is still the liquid of flowing, the foam glue-line of semi-solid preparation can not be formed, the viscosity of another aspect foam glue-line is lower to be also not suitable for rolling up
To volume technique production.In order to more preferably improve reaction rate and guarantee certain double bond residual volume, it is preferable that oligomer accounts for described
The weight percent of foam glue-line is 30~50%.
In above-mentioned foam glue-line, the acrylic double bond in oligomer and monomer, which is opened, carries out polymerization reaction, double bond
Conversion ratio is 40~90%, and foam glue-line can be well bonded with adhesive phase at this time.If double bond conversion rate is lower than 40%
When, the reaction of foam glue-line not exclusively, can not form semi-cured state, if double bond conversion rate is greater than 90%, to make unreacted
Double bond reduce, the chemical bonds between foamed cotton layer and adhesive phase are relatively fewer, bubble face adhesive tape binding force reduce.It is above-mentioned
Double bond conversion rate refers to the ratio of the total double bond amount of the double bond Zhan reacted, can be surveyed by infrared spectroscopy IR, nuclear-magnetism NMR etc.
It is fixed.
Above-mentioned oligomer can choose the acrylate quasi-oligomer of degree of functionality≤3 of routine in the art, such as can be with
For one of urethane acrylate, polyester acrylate, pure acrylate, epoxy acrylate or a variety of;Above-mentioned monomer
It can choose the activity diluting monomer of single functionality common in the art, bifunctionality or three-functionality-degree, such as can be (first
Base) acrylate, (methyl) isobornyl acrylate (IBOA), ethoxylated bisphenol A diacrylate (ODA), 1,6-HD
Diacrylate (HDDA), tetrahydrofurfuryl acrylate (THFA), phenoxyethyl acrylate, dipropylene glycol diacrylate
Ester, tripropylene glycol diacrylate, different certain herbaceous plants with big flowers base acrylate, ethoxyethoxyethyl acrylate, lauric acid acrylate,
One of trimethylolpropane trimethacrylate is a variety of.
Above-mentioned photoinitiator can be the common initiator in this field, such as: 1- hydroxycyclohexyl phenyl ketone (184),
2- hydroxy-methyl phenyl-propane-1- ketone (1173), 2- methyl-1-(4- methyl mercapto phenyl)-2- morpholinyl-1- acetone (907),
Benzoin dimethylether (651), benzophenone (BP), 2- isopropyl thioxanthone (ITX), 2,4,6- (trimethylbenzoyl)-
One or more of diphenyl phosphine oxide (TPO).
Above-mentioned hollow-particle can be inorganic hollow particle or organic hollow particle, and inorganic hollow particle for example can be
Hollow SiO2.In order to make foam tape that there is preferable buffering and soundproof effect, hollow-particle to account for the weight of the foam glue-line
Percentage is 0.1~30%, if hollow-particle accounts for the weight percent of foamed cotton layer less than 0.1%, the resiliency of foam tape
Can and isolation noise effect it is poor, on the contrary more than 30% when, then the usage amount that can have hollow-particle excessively leads to foamed cotton layer
Adhesion strength decline, it is preferable that the weight percent that hollow-particle accounts for foamed cotton layer is 5~20%.
The partial size of above-mentioned hollow-particle is 1-1000 μm, if partial size less than 1 μm, the sound insulation damping effect of foam tape compared with
Difference, if partial size is greater than 1000 μm, the adhesion strength decline of foamed cotton layer and adhesive phase is obvious, more preferably, above-mentioned hollow grain
The partial size of son is 10~150 μm.
In addition, above-mentioned foamed cotton layer can also contain some auxiliary addition agents, such as dispersing agent, hollow-particle is set to be uniformly dispersed anti-
Only assemble, coupling agent etc..
In foam tape of the invention, foamed cotton layer with a thickness of 0.1mm-2mm;Adhesive phase with a thickness of 50~200 μm.
The present invention also provides a kind of preparation methods of bonding structure, include the following steps:
S1) pretreating agent is coated in by paste layer surface, forms pretreatment layer after solidification,
S2 laminating layer is mutually pasted with by the pretreatment layer on paste layer surface), is chemically reacted, so that the laminating layer
Pass through chemical bonds between the pretreatment layer.
Containing the organic group that can react with laminating layer in above-mentioned pretreating agent, for example, can be unsaturated group, epoxy group,
Amino, isocyanate group, hydroxyl etc., pretreating agent can be using using sprayings, and the modes such as wiping are coated in by paste layer surface.One
In kind of embodiment, pretreating agent is silane, and silane is diluted to 1% with solvent and is contained admittedly, is then coated on by paste layer, 110
DEG C heating 5-10min, formed pretreatment layer.
Above-mentioned steps S2) in, laminating layer can be reacted with reacting for pretreatment layer for UV curing reaction or heat cure, preferably
For heat cure reaction, the condition of heat cure is to place 7 days or 80 DEG C to place 3 days at room temperature.
Above-mentioned steps S2) in, laminating layer further includes foam glue-line and the adhesive phase that foam glue-line or more two sides are arranged in,
Laminating layer the preparation method is as follows:
S21) oligomer of degree of functionality≤3, the monomer of degree of functionality≤3, photoinitiator, hollow-particle are uniformly mixed and are obtained
Foam rubber layer composition is coated with foam rubber layer composition on release film, two-sided to solidify according to UV, forms the foam rubber of semi-solid preparation state
Layer, the UV energy are 2* (200~400) mj/cm2;
S22) oligomer of degree of functionality≤3, the monomer of degree of functionality≤3, photoinitiator are uniformly mixed and obtain adhesive phase
At least contain a kind of active group that can be reacted with pretreating agent in composition, the oligomer and the monomer, by adhesive
Layer composition is coated on side of the foam glue-line far from release film, with 200~400mj/cm2UV energy ultraviolet solidification, shape
The interface of composite adhesives layer, described adhesive layer and the foamed cotton layer passes through chemical bonds;
S23 release film) is removed, in the other side coating adhesive layer composition of foam glue-line, with 200~400mj/cm2
Energy ultraviolet solidification, form adhesive phase, the interface of described adhesive layer and the foam glue-line by chemical bonds,
Form laminating layer.
Above-mentioned steps S21) in, on the one hand since foam glue-line is with 2* (200~400mj/cm2) low energy double-sided illumination
Ultraviolet light solidification, solidification rate is slower, easily formation semi-cured state;On the other hand, due to foam glue-line be only covered on one side from
Type film, there are oxygen inhibition phenomenons in Light Curing for the one side of not set release film, to make unreacted double bond residual volume
More.Two sides are respectively coated adhesive phase above and below above-mentioned foam glue-line, unreacted double bond and bonding in foam glue-line at this time
Double bond in oxidant layer reacts, and forms chemical bond, so that adhesive phase and the interface of foam glue-line be made to pass through chemical bonded refractory
It closes, improves the integral strength of foam tape, avoid the interface unbound due to adhesive phase with foam glue-line and bond
The problem of failure.
Above-mentioned foam glue-line with a thickness of 0.1mm-2mm, thickness is thicker, thus the ultraviolet light of low energy solidification under, instead
Answer rate comparatively slower, foamed cotton layer is in semi-cured state, and surface has viscosity.The double bond of above-mentioned foam rubber layer composition
Conversion ratio is 40~90%, and the double bond reaction of unreacted double bond and adhesive phase forms chemical bond, improve adhesive phase with
The binding force of foam glue-line.
Above-mentioned steps S21) in, it further include being combined before the two-sided photograph UV curing schedule or after step in foam glue-line
The step of release film is covered on object.In the two-sided covering release film of foam rubber layer composition, foam glue-line can be preferably protected, is prevented
Because the phenomenon that stick to each other occurs in the viscosity of foam film surface when only it winds.
In the step S23) after, further include the steps that carrying out EB solidification to laminating layer.EB is cured as electronic beam curing, leads to
It crosses high energy electron and converts free radical for double bond, to crosslink, its main feature is that crosslinking rate is fast, double bond conversion rate is high, and
Glue-line whether light transmission on solidification effect substantially without influence.
High-intensitive foam tape collocation pretreating agent of the invention further increases shearing to being pre-processed by paste layer
Intensity, simultaneously because the bond strength of pretreatment layer and adhesive phase is big, and foam rubber thickness degree is thicker among adhesive tape and contains big
The filler of amount, solidification are difficult completely, so causing to destroy the cohesional failure for glue layer.Therefore, after to step S23)
Laminating layer carries out EB solidification again, can enhance the cohesive force of glue-line, improve shear strength again.
Below with reference to embodiment and comparative example, beneficial effects of the present invention are further illustrated.Obviously, described implementation
Example is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field is common
Technical staff's every other embodiment obtained without making creative work belongs to the model that the present invention protects
It encloses.
Embodiment 1
Adhesive phase composition:
Foam rubber layer composition
It is first coated with foam rubber layer composition on release film, covers release film solidification with a thickness of 1mm, then surface, it is two-sided to shine UV,
Energy 2*400mj/cm2, then in foamed cotton layer both sides coating adhesive layer composition, with a thickness of 100um, overlay film solidification, energy point
It Wei not 400mj/cm2, obtain foam tape.By the foam tape of above-mentioned preparation, secondary curing is carried out again by EB equipment.
Isocyanato silanes are diluted to 1% with ethyl acetate to contain admittedly, on the steel plate after being coated on ethyl alcohol cleaning, 110
DEG C baking 5min, formed pretreatment layer.It is pasted using by the cured high-intensitive foam tape of EB, room temperature 7 days or 80
Curings in DEG C of 3 days.
Embodiment 2
Adhesive phase composition:
Foam rubber layer composition
It is first coated with foam rubber layer composition on release film, covers release film solidification with a thickness of 1mm, then surface, it is two-sided to shine UV,
Energy 2*400mj/cm2, then in foamed cotton layer both sides coating adhesive layer composition, with a thickness of 100um, overlay film solidification, energy point
It Wei not 400mj/cm2, obtain foam tape.By the foam tape of above-mentioned preparation, secondary curing is carried out again by EB equipment.
Silicol is diluted to 1% with ethyl acetate to contain admittedly, on the steel plate after being coated on ethyl alcohol cleaning, 110 DEG C of bakings
5min forms pretreatment layer.Pasted using by the cured high-intensitive foam tape of EB, room temperature 7 days or 80 DEG C 3 days
Curing.
Embodiment 3
Adhesive phase composition:
Foam rubber layer composition
It is first coated with foam rubber layer composition on release film, covers release film solidification with a thickness of 1mm, then surface, it is two-sided to shine UV,
Energy 2*400mj/cm2, then in foamed cotton layer both sides coating adhesive layer composition, with a thickness of 100um, overlay film solidification, energy point
It Wei not 400mj/cm2, obtain foam tape.By the foam tape of above-mentioned preparation, secondary curing is carried out again by EB equipment.
Isocyanato silanes are diluted to 1% with ethyl acetate to contain admittedly, on the steel plate after being coated on ethyl alcohol cleaning, 110
DEG C baking 5min, formed pretreatment layer.It is pasted using by the cured high-intensitive foam tape of EB, room temperature 7 days or 80
Curings in DEG C of 3 days.
Comparative example 1
Do not pass through EB equipment with the difference of embodiment 1: foam tape and carry out secondary curing.
Comparative example 2
With the difference of embodiment 1: by paste layer without pretreatment, directly being pasted using high-intensitive foam tape, room
Warm 7 days or 80 DEG C of curings in 3 days.
Comparative example 3
The hydroxy acrylate HPA reacted with pretreatment layer is free of with the difference of embodiment 1: adhesive phase.
Comparative example 4
With the difference of embodiment 1: without the isocyanate group reacted with adhesive phase in pretreatment layer.
Using the shear strength of stretching-machine test bonding structure, the failure mode of foam tape is visually observed.
Test result is as follows shown in table:
Shear strength | Failure mode | |
Embodiment 1 | 1277N | Glue-line cohesional failure |
Embodiment 2 | 1274N | Glue-line cohesional failure |
Embodiment 3 | 1265N | Glue-line cohesional failure |
Comparative example 1 | 1083N | Glue-line cohesional failure |
Comparative example 2 | 624N | It is failed between paste layer and adhesive phase |
Comparative example 3 | 632N | It is failed between paste layer and adhesive phase |
Comparative example 4 | 632N | It is failed between paste layer and adhesive phase |
As can be seen from the above table Examples 1 to 3 occur the shear strength needed when failure mode compared to comparative example 1~4 compared with
Height is greater than 1000N, is bonded glue-line and stronger by the adhesion strength between paste layer, under the action of big shearing force, final glue-line cohesion
It destroys.
Compared with comparative example 1, EB solidification is carried out again after 1 foam glue-line UV light of embodiment, is bonded the cohesion of glue-line
Power is enhanced, and the shear strength to fail is higher than comparative example 1.Compared with comparative example 2,1 pair of embodiment is carried out by paste layer
Pretreatment, laminating layer enhance with by the adhesion strength of paste layer, and comparative example 2 does not do any pretreatment, very by paste layer and adhesive phase
It is easily peeled off, the shear strength of total is lower, is 624N.Although having pretreatment layer, adhesive phase in comparative example 3 and 4
Without the group reacted between pretreatment layer, can not be easy to shell with adhesive phase by paste layer by chemical bonds, therefore
From shear strength is low.
It should be noted that specific embodiment is only the explanation to technical solution of the present invention, should not be managed
Solution is restriction to technical solution of the present invention, any only to make locally to change using the substantive summary of the invention of the present invention, Reng Yingluo
Enter in protection scope of the present invention.
Claims (11)
1. a kind of bonding structure, which is characterized in that including laminating layer, by paste layer and be arranged in by the pretreatment on paste layer surface
Layer, the laminating layer and the pretreatment layer pass through chemical bonds.
2. bonding structure according to claim 1, which is characterized in that containing in the material of the pretreatment layer can be with institute
It states laminating layer and reacts the organic group to form chemical bond.
3. bonding structure according to claim 2, which is characterized in that be comprising structural formula in the material of the pretreatment layer
The compound of Y-R-Si (OR) 3, wherein Y is that the organic group to form chemical bond can be reacted with the laminating layer, and R is alkyl.
4. bonding structure according to claim 2 or 3, which is characterized in that the organic group is unsaturated group, epoxy
At least one of base, amino, isocyanate group, hydroxyl.
5. bonding structure according to claim 1, which is characterized in that it is described by paste layer be metal.
6. bonding structure according to claim 1, which is characterized in that the laminating layer includes that foam glue-line and setting exist
The interface of the adhesive phase of two sides above and below the foam glue-line, the foam glue-line and described adhesive layer passes through chemical bonded refractory
It closes.
7. bonding structure according to claim 6, which is characterized in that the material of described adhesive layer includes oligomer and list
At least contain a kind of active group that can be reacted with pretreatment layer, the active group in body, the oligomer and the monomer
For at least one of hydroxyl, amino, sulfydryl, carboxyl, unsaturated group, isocyanate group.
8. bonding structure according to claim 7, which is characterized in that degree of functionality≤3 of the oligomer and the monomer,
The oligomer accounts for the weight percent of described adhesive layer not less than 20%.
9. a kind of preparation method of bonding structure, which comprises the steps of:
S1) pretreating agent is coated in by paste layer surface, forms pretreatment layer after solidification,
S2 laminating layer is mutually pasted with by the pretreatment layer on paste layer surface), is chemically reacted, so that the laminating layer and institute
It states and passes through chemical bonds between pretreatment layer.
10. the preparation method of bonding structure according to claim 9, which is characterized in that the step S2) in, laminating layer
It is prepared by following steps:
S21) oligomer of degree of functionality≤3, the monomer of degree of functionality≤3, photoinitiator, hollow-particle are uniformly mixed and obtain foam
Glue-line composition is coated with foam rubber layer composition on release film, two-sided to solidify according to UV, forms the foam glue-line of semi-solid preparation state;
S22) oligomer of degree of functionality≤3, the monomer of degree of functionality≤3, photoinitiator are uniformly mixed and obtain adhesive phase combination
At least contain a kind of active group that can be reacted with pretreating agent in object, the oligomer and the monomer, by adhesive phase group
Close object and be coated on side of the foam glue-line far from release film, ultraviolet light solidification forms adhesive phase, described adhesive layer with it is described
The interface of foam glue-line passes through chemical bonds;
S23 release film) is removed, in the other side coating adhesive layer composition of foam glue-line, ultraviolet light solidification forms adhesive
The interface of layer, described adhesive layer and the foam glue-line forms laminating layer by chemical bonds.
11. the preparation method of bonding structure according to claim 10, which is characterized in that further include in the step S23)
Afterwards, EB curing reaction is carried out to the laminating layer.
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110511693A (en) * | 2019-08-28 | 2019-11-29 | 张家港康得新光电材料有限公司 | A kind of foam tape and preparation method thereof |
CN115464964A (en) * | 2022-09-15 | 2022-12-13 | 上海爱可家科技有限公司 | Electrothermal film PET/carbon fiber composite layer, preparation method thereof and electrothermal film |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1140126A (en) * | 1995-03-29 | 1997-01-15 | 米什兰集团总公司 | Process for treating body of stainless steel so as to promote its adherence to rubber composition |
CN1172495A (en) * | 1995-01-24 | 1998-02-04 | 希巴特殊化学控股公司 | Surface treatment |
CN1414052A (en) * | 2001-10-24 | 2003-04-30 | 上海橡胶制品研究所 | Surface treatment agent for binding of fluoro rubber and metal |
CN1775882A (en) * | 2004-10-27 | 2006-05-24 | 日本油漆株式会社 | Method for treating adhesive before coating and aluminium alloy part |
CN1845977A (en) * | 2003-09-02 | 2006-10-11 | 索尼化学株式会社 | Adhesive agent and method for production thereof |
CN1926210A (en) * | 2003-10-08 | 2007-03-07 | 辛辛那提大学 | Silane compositions and methods for bonding rubber to metals |
CN1973007A (en) * | 2004-06-25 | 2007-05-30 | 日矿金属株式会社 | Metal surface-treating agents for promoting adhesion between rubber and the metal |
CN101248525A (en) * | 2005-06-07 | 2008-08-20 | 莫门蒂夫功能性材料公司 | B-stageable film, electronic device, and associated process |
CN101627071A (en) * | 2007-03-09 | 2010-01-13 | 可隆株式会社 | Organic polysiloxane, adhesive composition comprising the same, and rubber stiffener treated thereby |
CN103038706A (en) * | 2010-07-29 | 2013-04-10 | 富士胶片株式会社 | Polymerizable composition |
CN103080257A (en) * | 2010-09-30 | 2013-05-01 | 森邦夫 | Bonding method, bondability improving agent, surface modification method, surface modifying agent, and novel compound |
CN103555244A (en) * | 2013-11-06 | 2014-02-05 | 厦门大学 | Metal/fabric adhesive and preparation and using methods thereof |
CN106674417A (en) * | 2016-09-10 | 2017-05-17 | 东莞市富印胶粘科技有限公司 | Acrylic foam tape composition and method for preparing acrylic foam tape composition |
CN107216821A (en) * | 2016-03-22 | 2017-09-29 | 琳得科株式会社 | The manufacture method of double-faced pressure-sensitive adhesive sheet, display body and display body |
-
2018
- 2018-12-26 CN CN201811598775.8A patent/CN109825201A/en active Pending
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1172495A (en) * | 1995-01-24 | 1998-02-04 | 希巴特殊化学控股公司 | Surface treatment |
CN1140126A (en) * | 1995-03-29 | 1997-01-15 | 米什兰集团总公司 | Process for treating body of stainless steel so as to promote its adherence to rubber composition |
CN1414052A (en) * | 2001-10-24 | 2003-04-30 | 上海橡胶制品研究所 | Surface treatment agent for binding of fluoro rubber and metal |
CN1845977A (en) * | 2003-09-02 | 2006-10-11 | 索尼化学株式会社 | Adhesive agent and method for production thereof |
CN1926210A (en) * | 2003-10-08 | 2007-03-07 | 辛辛那提大学 | Silane compositions and methods for bonding rubber to metals |
CN1973007A (en) * | 2004-06-25 | 2007-05-30 | 日矿金属株式会社 | Metal surface-treating agents for promoting adhesion between rubber and the metal |
CN1775882A (en) * | 2004-10-27 | 2006-05-24 | 日本油漆株式会社 | Method for treating adhesive before coating and aluminium alloy part |
CN101248525A (en) * | 2005-06-07 | 2008-08-20 | 莫门蒂夫功能性材料公司 | B-stageable film, electronic device, and associated process |
CN101627071A (en) * | 2007-03-09 | 2010-01-13 | 可隆株式会社 | Organic polysiloxane, adhesive composition comprising the same, and rubber stiffener treated thereby |
CN103038706A (en) * | 2010-07-29 | 2013-04-10 | 富士胶片株式会社 | Polymerizable composition |
CN103080257A (en) * | 2010-09-30 | 2013-05-01 | 森邦夫 | Bonding method, bondability improving agent, surface modification method, surface modifying agent, and novel compound |
CN103555244A (en) * | 2013-11-06 | 2014-02-05 | 厦门大学 | Metal/fabric adhesive and preparation and using methods thereof |
CN107216821A (en) * | 2016-03-22 | 2017-09-29 | 琳得科株式会社 | The manufacture method of double-faced pressure-sensitive adhesive sheet, display body and display body |
CN106674417A (en) * | 2016-09-10 | 2017-05-17 | 东莞市富印胶粘科技有限公司 | Acrylic foam tape composition and method for preparing acrylic foam tape composition |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110511693A (en) * | 2019-08-28 | 2019-11-29 | 张家港康得新光电材料有限公司 | A kind of foam tape and preparation method thereof |
CN115464964A (en) * | 2022-09-15 | 2022-12-13 | 上海爱可家科技有限公司 | Electrothermal film PET/carbon fiber composite layer, preparation method thereof and electrothermal film |
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