CN109822712B - Processing method of terahertz waveband photonic crystal - Google Patents
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Abstract
The invention provides laser additive manufacturing equipment and a processing method of a terahertz waveband photonic crystal thereof, wherein the processing method comprises a printer frame, wherein a carrying platform is arranged in the printer frame; a feed port is formed in the carrying platform and communicated with a storage box below the carrying platform; the scraper mechanism and the printing platform are arranged on the carrying platform, the printing platform is arranged in the middle of the carrying platform, and the printing platform is arranged in the forming mechanism below the carrying platform; and a laser scanning system is arranged above the printing platform. According to the invention, the laser additive manufacturing equipment is utilized to process the terahertz waveband photonic crystal without adding any support or vacuum freeze drying, the post-treatment is simple, the cost is low, the strength is high, and the large-scale industrial production of the photonic terahertz waveband photonic crystal is facilitated.
Description
Technical Field
The invention belongs to the technical field of three-dimensional photonic crystal manufacturing, and particularly relates to a processing method of a terahertz waveband photonic crystal.
Background
The terahertz wave has wide application prospect in the technical fields of astronomy, biology, computer science, information communication, environmental monitoring, medical diagnosis and the like due to the characteristics of short pulse, high frequency, low photon energy, high spatial coherence and the like. However, because the terahertz wave has great transmission loss in free space and is difficult to control and guide the propagation of the terahertz wave, the appearance of the photonic crystal with the photonic band gap, low loss and small dispersion opens up a new path for the transmission of the terahertz wave.
The traditional preparation method of the photonic crystal has complex process and great difficulty, and the main methods for preparing the three-dimensional photonic crystal in the industry comprise the following steps:
in the existing chinese patent No. 201310754514.1, the method is to layer the three-dimensional model of the photonic crystal, and then print and cure the three-dimensional model layer by using the colloidal particle material. The method adopts a Teflon plate, a glass slide subjected to Teflon surface treatment or a silicon wafer subjected to Teflon surface treatment as a substrate, and due to the large linear expansion coefficient and the non-adhesiveness of the Teflon material, the position deviation can be caused during layer-by-layer printing, and finally the accuracy of the prepared photonic crystal is low. In addition, the concentration range of the material used by the method is 20% -40%, the concentration is low, the intensity of the photonic crystal is low, the concentration range is too small, and the application range is narrow.
In the existing chinese patent No. 200910023923.8, a three-dimensional software is used to support and layer a photonic crystal model, then ceramic slurry is used to perform photocuring layer by layer in a forming device to obtain a photonic crystal, and the prepared photonic crystal is dried and calcined. However, in the patent, the photonic crystal is prepared by using the water-based material, a three-dimensional model needs to be supported, and the photonic crystal has small size and is difficult to support in the later period. In addition, vacuum freezing is required for drying after molding, but photonic crystals are easy to crack at low temperature and have relatively high cost.
In the prior chinese patent No. 201210446050.3, the method uses femtosecond micro-processing direct writing technology, which is first discrete processing and then assembly stacking. Although the technology can prepare the terahertz waveband photonic crystal of hundred microns, the assembly method is relatively complicated and difficult, the assembly precision requirement is high, and the cost is high.
Disclosure of Invention
Aiming at the technical problems, the invention provides the processing method of the terahertz waveband photonic crystal, which has the advantages of no need of adding a support and vacuum freeze drying by adopting laser additive manufacturing equipment, simple post-processing, low cost and high strength, and is beneficial to large-scale industrial production of the photonic terahertz waveband photonic crystal. In order to solve the technical problems, the invention adopts the technical scheme that:
a processing method of a terahertz waveband photonic crystal specifically comprises the following steps:
s1, preparing ceramic slurry:
a. preparing surface functionalized graded alumina ceramic powder by using ceramic powder, a dispersant and a surface modifier;
b. preparing light-cured resin premix by using low-molecular-weight acrylic resin, a reactive diluent, a photoinitiator and an auxiliary agent;
c. mixing and stirring the graded alumina ceramic powder and the light-cured resin premixed liquid to obtain light-cured ceramic slurry with the viscosity of less than 5Pa & s;
s2, three-dimensional model importing: importing a three-dimensional photonic crystal model designed in three-dimensional modeling software into additive manufacturing equipment;
s3, setting the operation parameters of the laser additive manufacturing equipment: setting operation parameters of laser additive manufacturing equipment, wherein the operation parameters comprise laser scanning process parameters, equipment motion parameters and slice layer thickness, and initializing a control system of the laser additive manufacturing equipment according to the set operation parameters;
s4, conveying the ceramic slurry to a printing platform: uniformly mixing and hermetically stirring the ceramic slurry, and conveying the stirred ceramic slurry from a storage box to a printing platform through a pumping system;
s5, paving ceramic slurry: controlling a scraper to horizontally reciprocate, horizontally scraping the ceramic slurry on the printing platform, and enabling the redundant ceramic slurry to flow into a material recovery box of a circulating recovery system;
s6, polymerization crosslinking reaction: the laser scanning system carries out laser scanning on the ceramic slurry on the printing platform according to the set laser pulse width, power density and beam focal spot, so that the ceramic slurry is subjected to polymerization crosslinking curing reaction;
s7, controlling the thickness of the slicing layer; the printing platform is controlled to descend by ascending and descending according to the set processing speed, the lifting speed of the lifting platform, the printing layer thickness and the printing speed;
s8, finishing the formed blank: repeating the steps S4 to S7 until printing of all layered slices is completed, and obtaining a molded blank body;
s9, cleaning and degreasing the formed blank body: taking the formed blank from the printing platform, cleaning the formed blank by a cleaning solution, degreasing the cleaned formed blank in a degreasing furnace, and removing the shaped blank in the formed blank;
s10, sintering to finish the preparation of the photonic crystal: and (4) placing the degreased formed blank into a high-temperature sintering furnace for sintering, and cooling the furnace body to room temperature after sintering to take out the three-dimensional photonic crystal.
As a preference of this embodiment, in the step S1, the specific process of preparing the ceramic slurry is as follows:
1) mixing and stirring 40g of alumina, 200ml of absolute ethyl alcohol and 0.4g of organic silicate for 10 hours, and filtering and drying to prepare surface functionalized graded alumina ceramic powder;
2) 100ml of low molecular weight acrylic resin, 120ml of butyl acrylate, 20ml of methyl benzoylformate and 10ml of polydimethylsiloxane are mixed to prepare the photocuring resin premix.
3) And mixing and stirring the graded alumina ceramic powder and the light-cured resin premixed liquid to obtain the light-cured ceramic slurry.
As a preference of this embodiment, in S3, the operating parameters of the laser additive manufacturing apparatus are specifically as follows: the processing speed of the printing platform is 10-50mm/s, and the lifting speed of the forming mechanism is 0.5-3 mm/s; the thickness of the printing layer is 0.02-0.1 mm, and the printing speed is 200-500 layers/h; the laser pulse width is 19-27 ns, and the focal spot of the light beam is 0.02-0.05 mm.
Preferably, in step S9, the cleaned molded blank is placed in a degreasing furnace, an inert gas is introduced into the degreasing furnace, the temperature is adjusted to 500-600 ℃, when the highest temperature is reached, the furnace body is cooled to room temperature after the temperature is kept for about 1 hour.
Compared with the prior art, the invention has the following beneficial effects:
1. according to the processing method of the terahertz waveband photonic crystal, the levelness of ceramic slurry is ensured through a scraper mechanism; the precision of the lifting operation of the printing platform is ensured through the forming mechanism; the stability of the ceramic slurry in polymerization crosslinking curing reaction is ensured through a laser scanning system; the stability of the ceramic slurry in the preparation process is ensured through the slurry circulating and recycling system, and the deposition phenomenon of the ceramic slurry in the forming process is effectively improved.
2. The laser additive manufacturing equipment provided by the invention has the advantages that the ceramic slurry is easy to form in the preparation process, the requirement on a laser is reduced, a large amount of cost is saved, the production process is simplified, and the model manufacturing period is shortened.
3. According to the processing method of the terahertz waveband photonic crystal, the terahertz waveband photonic crystal is manufactured by adopting laser additive manufacturing equipment (sinking type), no support is needed to be added in a model in the molding process, post-processing is simplified, damage to the model caused by removing the support is reduced, the precision of a molded part is improved, and the molding rate of the model is improved.
4. According to the processing method of the terahertz waveband photonic crystal, the ceramic slurry prepared by the graded alumina ceramic powder and the light-cured resin premixed liquid has the characteristics of low slurry viscosity, good fluidity, simple post-treatment and the like, and meanwhile, slurry defoaming pretreatment is carried out before ceramic slurry pumping, so that bubbles in the ceramic slurry are reduced, and the strength of the photonic crystal is improved.
5. According to the processing method of the terahertz waveband photonic crystal, a post-treatment process of vacuum freeze drying is not needed in the process of forming the terahertz waveband photonic crystal, so that the production cost of the terahertz waveband photonic crystal is greatly reduced, and the large-scale industrial production of the photonic terahertz waveband photonic crystal is facilitated.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic view of the overall structure of the laser additive manufacturing apparatus of the present invention;
FIG. 2 is a schematic view of a partial structure of a laser additive manufacturing apparatus of the present invention;
FIG. 3 is a process flow diagram of the terahertz waveband photonic crystal processing method of the present invention;
FIG. 4 is a three-dimensional model diagram of a terahertz waveband photonic crystal;
FIG. 5 is a schematic view of a microscopic view of a terahertz waveband photonic crystal;
shown in the figure: 1. print the support, 2, cargo platform, 3, the feed inlet, 4, the storage case, 5, print platform, 6, scraper mechanism, 6.1, the scraper, 6.2, linear guide, 6.3, servo motor, 6.4, the shaft, 6.5, the synchronizing wheel, 6.6, the hold-in range, 6.7, remove the fixed block, 7, forming mechanism, 7.1, the shaping cylinder, 7.2, ball screw, 7.3, lift servo motor, 7.4, the shaft coupling, 8, laser scanning system, 8.1 laser scanner, 8.2, runing rest, 8.3, operation platform, 9, circulation recovery system, 9.1, material recovery case, 10, preceding material collecting port, 11, the back material collecting port.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
Referring to fig. 1 to 2, an embodiment of the present invention provides a laser additive manufacturing apparatus, which specifically includes a printer frame 1 that fixes and supports the entire laser additive manufacturing apparatus, a carrying platform 2 for carrying ceramic slurry is disposed in the printer frame 1, a feeding port 3 for feeding metal slurry is disposed on the carrying platform 2, and the feeding port 3 is communicated with a ceramic slurry storage tank 4 below the carrying platform 2. Still install scraper mechanism 6 and print platform 5 on cargo platform 2, wherein, print platform 5 sets up the intermediate position that is used for carrying out rapid prototyping at cargo platform 2 and prints to ceramic thick liquids, install print platform 6 in forming mechanism 7 of cargo platform 2 below, wherein, forming mechanism 7 can drive print platform 6 up-and-down motion in vertical direction, be equipped with laser scanning system 8 in print platform 5's top, can make ceramic thick liquids take place polymerization crosslinking solidification reaction through laser scanning system 8.
Referring to fig. 2, in the present embodiment, the scraper mechanism 6 comprises a scraper 6.1, a linear guide 6.2 and a horizontal motion assembly; the linear guide rails 6.2 are installed on the loading platform 1 and arranged on two sides of the printing platform 5 (specifically, on the left and right sides of the printing platform 5); the horizontal movement component drives the scraper 6.1 to do linear reciprocating motion on the linear guide rail 6.2, the scraper 6.1 is arranged above the printing platform 5, and horizontal linear reciprocating motion is carried out by controlling the scraper 6.1 to horizontally scrape the ceramic material slurry on the printing platform 5.
In this embodiment, the horizontal movement assembly comprises a servomotor 6.3, wherein the servomotor 6.3 is connected to a synchronizing wheel 6.5 via a wheel shaft 6.4, and the synchronizing wheel 6.5 is connected to the doctor blade 6.1 via a timing belt 6.6. And two ends of the scraper 6.1 are provided with movable fixed blocks 6.7, and the movable fixed blocks 6.7 are connected with corresponding synchronous belts 6.6. Wherein, realize a servo motor 6.3 drive two synchronizing wheels 6.5 through shaft 6.4 and rotate in this embodiment, install respectively at the both ends of scraper 6.1 and remove fixed block 6.7 and guaranteed the stability of scraper 6.1 when the operation.
Referring to fig. 2, in the present embodiment, the forming mechanism 7 includes a forming cylinder 7.1, a ball screw 7.2, a lifting servo motor 7.3 and a coupler 7.4; the printing platform 5 is arranged in the forming cylinder barrel 7.1, one end of the ball screw 7.2 is connected with the printing platform 5, and the other end of the ball screw is connected with the coupler 7.4; an output shaft of the lifting servo motor 7.3 is connected with the bottom of the ball screw 7.2 through a coupler 7.4. The printing platform 5 and the molding cylinder barrel 7.1 are coaxially arranged, so that the accuracy of the movement of the printing platform 6 along the vertical direction is ensured. The lifting servo motor 7.3 drives the ball screw 7.2 to rotate in the working process, so that the printing platform 5 is driven to move up and down along the vertical direction, and the stability of the movement of the printing platform is ensured.
Referring to fig. 1, in the present embodiment, the laser scanning system 8 specifically includes a laser scanner 8.1, a rotating bracket 8.2 and an operation platform 8.3; laser scanner 8.1 sets up directly over print platform 5, runing rest 8.2 is connected with laser scanner 8.1, runing rest 8.2 fixed mounting is on operation platform 8.3. When printing, the light outlet of the laser scanner 8.1 is aligned with the center position of the printing platform 5, and laser emitted by the laser scanner 8.1 irradiates the ceramic slurry on the printing platform 5 in the printing process, so that the ceramic slurry is solidified.
Referring to fig. 1 to 2, in this embodiment, the laser additive manufacturing apparatus further includes a recycling system 9, in order to facilitate recycling of the ceramic slurry on the loading platform 1 by the recycling system 9, a front receiving port 10 and a rear receiving port 11 are further provided on the loading platform 1 (the front receiving port 10 and the rear receiving port 11 are respectively provided at front and rear ends of the loading platform 1), the feeding port 3 is provided at a position between the front receiving port 10 and the rear receiving port 11, and meanwhile, the front receiving port 10 and the rear receiving port are both communicated with the recycling system 9. The scraper 6.1 is driven by the horizontal movement component to horizontally reciprocate between the front material receiving opening 10 and the rear material receiving opening 10, and the redundant ceramic slurry is collected into the front material receiving opening 10 and the rear material receiving opening 11.
In this embodiment, the recycling system 9 only includes the material recycling bin 9.1 disposed below the front receiving port 10 and the rear receiving port 10, and the material recycling bin 9.1 is connected to the material storage bin 4 through a filtering assembly (not shown). The ceramic slurry collected in the storage box 4 is communicated with the feed port 3 by a pumping system (not shown).
Referring to fig. 1 to 5, an embodiment of the present invention provides a method for processing a terahertz waveband photonic crystal, which specifically includes the following steps:
preparing ceramic slurry:
preparing surface functionalized graded alumina ceramic powder by using ceramic powder, a dispersant and a surface modifier; preparing a light-cured resin premix by using low-molecular-weight acrylic resin, a reactive diluent, a photoinitiator and an auxiliary agent; and mixing and stirring the graded alumina ceramic powder and the light-cured resin premixed liquid to obtain the light-cured ceramic slurry with the viscosity of less than 5Pa & s. In order to reduce bubbles in the ceramic slurry and increase the strength of the photonic crystal, the ceramic slurry is subjected to defoaming pretreatment, and the uniformly mixed ceramic slurry is placed into a vacuum defoaming machine for defoaming for 1 hour to ensure that no bubbles overflow from the ceramic slurry.
In this embodiment, a specific manner of the ceramic slurry is provided:
1) taking 40g of alumina, 200ml of absolute ethyl alcohol and 0.4g of organic silicate, mixing and stirring for 10 hours, and filtering and drying after stirring to prepare the surface functionalized graded alumina ceramic powder.
2) 100ml of low molecular weight acrylic resin, 120ml of butyl acrylate, 20ml of methyl benzoylformate and 10ml of polydimethylsiloxane are mixed and stirred to prepare the photocuring resin premix.
3) Mixing and stirring the graded alumina ceramic powder and the light-cured resin premix to obtain light-cured ceramic slurry (the mass percentage of alumina in the embodiment is 85%),
and (3) placing the uniformly mixed ceramic slurry into a vacuum defoaming machine for defoaming for 1 hour to ensure that no bubbles overflow from the slurry.
Importing a three-dimensional model:
a three-dimensional photonic crystal model designed in three-dimensional modeling software is introduced into an additive manufacturing apparatus (see fig. 3).
Setting the operating parameters of the laser additive manufacturing equipment:
the operation parameters of the laser additive manufacturing equipment are set through the control panel, and in this embodiment, the specific operation parameters mainly include: laser scanning process parameters, equipment motion parameters and slice layer thickness, and initializing a control system of the laser additive manufacturing equipment according to set operation parameters.
In the embodiment, the processing speed of the printing platform is 10-50mm/s, the lifting speed of the forming mechanism 7 is 0.5-3 mm/s, the thickness of the printing layer is 0.02-0.1 mm, and the printing speed is 200-500 layers/h; the laser pulse width in the laser scanning system is 19-27 ns, and the focal spot of a light beam is 0.02-0.05 mm;
conveying the ceramic slurry to a printing platform:
uniformly mixing and hermetically stirring the ceramic slurry, and conveying the stirred ceramic slurry from a storage box to a printing platform through a pumping system;
paving ceramic slurry:
the method comprises the steps of controlling a scraper to horizontally reciprocate, horizontally scraping ceramic slurry on a printing platform, and enabling redundant ceramic slurry to flow into a material recovery box of a circulating recovery system, wherein in the specific embodiment, the horizontal moving speed of the scraper is 10-50mm/s, the height of the scraper from the printing platform is 0.1mm, and the levelness of the ceramic slurry of the terahertz waveband photonic crystal in the processing process is guaranteed.
Polymerization and crosslinking reaction:
according to the set laser pulse width and the set beam focal spot, in the embodiment, the laser scanning system is controlled to irradiate by adopting an ultraviolet laser, the laser pulse width is 19-27 ns, and the beam focal spot is 0.02-0.05 mm, so that the ceramic slurry on the printing platform is subjected to laser scanning, and the ceramic slurry is subjected to polymerization crosslinking curing reaction.
Controlling the thickness of the slicing layer to finish a formed green body:
and the printing platform is controlled to descend by lifting according to the set processing speed, lifting speed of the lifting platform, printing layer thickness and printing speed. In the embodiment, the processing speed of the printing platform is 10-50mm/s, the lifting speed of the forming mechanism 7 is 0.5-3 mm/s, the printing layer thickness is 0.02-0.1 mm, and the printing speed is 200-500 layers/h, and the three steps are repeated until all layered slices are printed, so that a formed blank is obtained.
Cleaning and degreasing a formed blank body:
and taking the formed blank from the printing platform, cleaning the formed blank by using a cleaning solution, degreasing the cleaned formed blank in a degreasing furnace, removing the shaped blank in the formed blank, introducing inert gas in the process of degreasing the formed blank in the degreasing furnace, adjusting the temperature to 500-600 ℃, and preserving the heat for about 1 hour when the highest temperature is reached. After heat preservation, the furnace body is cooled to room temperature, and the whole process is always in the protective atmosphere of inert gas, so that thermal oxidation of products is prevented.
And (3) sintering to finish the preparation of the photonic crystal:
in this embodiment, the degreased molded blank is placed in a high-temperature sintering furnace to be sintered, the sintering temperature is controlled to 1700-1750 ℃, the mass shrinkage of the three-dimensional photonic crystal with the mass fraction of 85% after sintering is 20%, and the specific sintering step is as follows:
and (3) at room temperature, putting the degreased formed blank into a sintering furnace, heating to 1700 ℃ at a heating rate of 60-120 ℃/h, preserving heat for 1-2 h, cooling the furnace body to room temperature, and taking out the three-dimensional photonic crystal.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. A processing method of a terahertz waveband photonic crystal is characterized by comprising the following steps:
s1, preparing ceramic slurry:
a. preparing surface functionalized graded alumina ceramic powder by using ceramic powder, a dispersant and a surface modifier;
b. preparing a light-cured resin premix by using low-molecular-weight acrylic resin, a reactive diluent, a photoinitiator and an auxiliary agent;
c. mixing and stirring the graded alumina ceramic powder and the light-cured resin premixed liquid to obtain light-cured ceramic slurry with the viscosity of less than 5Pa & s;
s2, three-dimensional model importing: importing a three-dimensional photonic crystal model designed in three-dimensional modeling software into additive manufacturing equipment;
s3, setting the operation parameters of the laser additive manufacturing equipment: setting operation parameters of laser additive manufacturing equipment, wherein the operation parameters comprise laser scanning process parameters, equipment motion parameters and slice layer thickness, and initializing a control system of the laser additive manufacturing equipment according to the set operation parameters;
s4, conveying the ceramic slurry to a printing platform: uniformly mixing and hermetically stirring the ceramic slurry, and conveying the stirred ceramic slurry from a storage box to a printing platform through a pumping system;
s5, paving ceramic slurry: controlling a scraper to horizontally reciprocate, horizontally scraping the ceramic slurry on the printing platform, and enabling the redundant ceramic slurry to flow into a material recovery box of a circulating recovery system;
s6, polymerization crosslinking reaction: the laser scanning system carries out laser scanning on the ceramic slurry on the printing platform according to the set laser pulse width, power density and beam focal spot, so that the ceramic slurry is subjected to polymerization crosslinking curing reaction;
s7, controlling the thickness of the slicing layer; the printing platform is controlled to descend by ascending and descending according to the set processing speed, the lifting speed of the lifting platform, the printing layer thickness and the printing speed;
s8, finishing the formed blank: repeating the steps S4 to S7 until printing of all layered slices is completed, and obtaining a molded blank body;
s9, cleaning and degreasing the formed blank body: taking the formed blank from the printing platform, cleaning the formed blank by using a cleaning solution, and degreasing the cleaned formed blank in a degreasing furnace;
s10, sintering to finish the preparation of the photonic crystal: and (4) placing the degreased formed blank into a high-temperature sintering furnace for sintering, and cooling the furnace body to room temperature after sintering to take out the three-dimensional photonic crystal.
2. The method for processing the terahertz waveband photonic crystal as claimed in claim 1, wherein the method comprises the following steps: in step S1, the specific process of preparing the ceramic slurry is as follows:
1) mixing and stirring 40g of alumina, 200ml of absolute ethyl alcohol and 0.4g of organic silicate for 10 hours, and filtering and drying to prepare surface functionalized graded alumina ceramic powder;
2) mixing 100ml of low molecular weight acrylic resin, 120ml of butyl acrylate, 20ml of methyl benzoylformate and 10ml of polydimethylsiloxane to prepare light-cured resin premixed liquid;
3) and mixing and stirring the graded alumina ceramic powder and the light-cured resin premixed liquid to obtain the light-cured ceramic slurry.
3. The method for processing the terahertz waveband photonic crystal as claimed in claim 1, wherein the method comprises the following steps: in S3, the operating parameters of the laser additive manufacturing apparatus are specifically as follows: the processing speed of the printing platform is 10-50mm/s, and the lifting speed of the forming mechanism is 0.5-3 mm/s; the thickness of the printing layer is 0.02-0.1 mm, and the printing speed is 200-500 layers/h; the laser pulse width is 19-27 ns, and the focal spot of the light beam is 0.02-0.05 mm.
4. The method for processing the terahertz waveband photonic crystal as claimed in claim 1, wherein the method comprises the following steps: and in the step S9, putting the cleaned molded blank into a degreasing furnace, introducing inert gas, adjusting the temperature to 500-600 ℃, keeping the temperature for about 1 hour when the highest temperature is reached, and cooling the furnace body to the room temperature.
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| CN111070374B (en) * | 2019-11-29 | 2021-05-14 | 华南理工大学 | Automatic slurry laminated feeding device with variable area range and control method |
| CN111018499A (en) * | 2019-12-31 | 2020-04-17 | 清华大学深圳国际研究生院 | Substrate for terahertz metamaterial construction, terahertz metamaterial and preparation method |
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