CN109817362A - A kind of plasma-based resistance material - Google Patents
A kind of plasma-based resistance material Download PDFInfo
- Publication number
- CN109817362A CN109817362A CN201711155653.7A CN201711155653A CN109817362A CN 109817362 A CN109817362 A CN 109817362A CN 201711155653 A CN201711155653 A CN 201711155653A CN 109817362 A CN109817362 A CN 109817362A
- Authority
- CN
- China
- Prior art keywords
- parts
- weight content
- organic media
- glass powder
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Glass Compositions (AREA)
Abstract
The present invention relates to a kind of formula of size for being used to form resistor: a kind of resistance slurry, it include glass powder, conducting powder, organic media, the glass powder parts by weight content is 10-60 parts, and conducting powder parts by weight content is 15-70 parts, and organic media parts by weight content is 20~60 parts.The glass powder parts by weight content is 25 parts, and conducting powder parts by weight content is 35 parts, and organic media parts by weight content is 40 parts.After being sintered using resistance slurry of the invention, the current noise of circuit is substantially reduced, and resistance value dispersibility is obviously reduced.
Description
Technical field
The present invention relates to a kind of formula of size for being used to form resistor.
Background technique
Now, thick film is the main method of formation resistive film during fabrication of electronic components, and this method is by resistance
Slurry prints on a ceramic substrate, forms thick-film resistor after sintering, this method due to low in cost and high production efficiency,
Being widely used in manufacture piece is resistor and integrated-circuit resistor etc..But the resistance slurry used now makes electricity in circuit
Flow noise is big, and resistance value dispersibility is big.
Summary of the invention
The purpose of the present invention is overcoming the deficiencies of the prior art and provide, a kind of current noise is smaller, resistance is dispersed smaller
Plasma-based resistance material.
The technical scheme adopted by the invention is that: a kind of resistance slurry includes glass powder, conducting powder, organic media, institute
Stating glass powder parts by weight content is 10-60 parts, and conducting powder parts by weight content is 15-70 parts, and organic media parts by weight content is 20
~60 parts.
Preferably, the glass powder parts by weight content is 25 parts, and conducting powder parts by weight content is 35 parts, organic media weight
Part content is 40 parts.
The beneficial effect that can be realized by adopting the above technical scheme is: after being sintered using resistance slurry of the invention,
The current noise of circuit is substantially reduced, and resistance value dispersibility is obviously reduced.
Specific embodiment
Carry out the technical solution that the present invention will be described in detail below by way of specific embodiment, it should be appreciated that below specific
Embodiment be only capable of for explain the present invention and be not to be construed as limitation of the present invention.
Embodiment 1: a kind of resistance slurry, includes glass powder, conducting powder, organic media, and the glass powder parts by weight contain
Amount is 10-60g, and conducting powder parts by weight content is 15-70g, and organic media parts by weight content is 20~60g.
Embodiment 2: a kind of resistance slurry, includes glass powder, conducting powder, organic media, and the glass powder parts by weight contain
Amount is 10g, and conducting powder parts by weight content is 15g, and organic media parts by weight content is 20g.
Implement 3: a kind of resistance slurry includes glass powder, conducting powder, organic media, the glass powder parts by weight content
For 60g, conducting powder parts by weight content is 70g, and organic media parts by weight content is 60g.
Embodiment 4: a kind of resistance slurry, includes glass powder, conducting powder, organic media, and the glass powder parts by weight contain
Amount is 40g, and conducting powder parts by weight content is 35g, and organic media parts by weight content is 40g.
Embodiment 5: a kind of resistance slurry, includes glass powder, conducting powder, organic media, and the glass powder parts by weight contain
Amount is 25g, and conducting powder parts by weight content is 35g, and organic media parts by weight content is 40g.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those skilled in the art within the technical scope disclosed by the invention, can without the variation that creative work is expected or
Replacement, should be covered by the protection scope of the present invention.Therefore, protection scope of the present invention should be limited with claims
Subject to fixed protection scope.
Claims (2)
1. a kind of resistance slurry includes glass powder, conducting powder, organic media, it is characterised in that: the glass powder parts by weight contain
Amount is 10-60 parts, and conducting powder parts by weight content is 15-70 parts, and organic media parts by weight content is 20~60 parts.
2. a kind of resistance slurry according to claim 1, it is characterised in that: the glass powder parts by weight content is 25 parts,
Conducting powder parts by weight content is 35 parts, and organic media parts by weight content is 40 parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711155653.7A CN109817362A (en) | 2017-11-20 | 2017-11-20 | A kind of plasma-based resistance material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711155653.7A CN109817362A (en) | 2017-11-20 | 2017-11-20 | A kind of plasma-based resistance material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109817362A true CN109817362A (en) | 2019-05-28 |
Family
ID=66598958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711155653.7A Pending CN109817362A (en) | 2017-11-20 | 2017-11-20 | A kind of plasma-based resistance material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109817362A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113782249A (en) * | 2021-11-12 | 2021-12-10 | 西安宏星电子浆料科技股份有限公司 | Low-cost chip resistor paste |
-
2017
- 2017-11-20 CN CN201711155653.7A patent/CN109817362A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113782249A (en) * | 2021-11-12 | 2021-12-10 | 西安宏星电子浆料科技股份有限公司 | Low-cost chip resistor paste |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104505137A (en) | Conductive copper paste and preparation method and application thereof | |
| CN103426497B (en) | A kind of conductive silver paste for touch screens and preparation method thereof | |
| MY189055A (en) | Electrically conductive adhesive film and dicing-die bonding film using the same | |
| TW200731292A (en) | Conductive compositions and processes for use in the manufacture of semiconductor devices | |
| CN103361531B (en) | A kind of High Temperature Co Fired Ceramic slurry and preparation method thereof | |
| EP2886671A3 (en) | Conductive paste composition and method for manufacturing electrode | |
| MY197274A (en) | Electrically conductive adhesive film and dicing-die bonding film using the same | |
| CN104893428A (en) | Nano-silver conductive ink and preparation method thereof | |
| CN109817362A (en) | A kind of plasma-based resistance material | |
| CN103000369B (en) | The preparation method of high withstand voltage chip ceramic capacitor | |
| CN106960693A (en) | A kind of touch-screen electrocondution slurry | |
| CN105218089A (en) | The electrical condenser of a kind of barium titanate ceramic dielectric material and gained | |
| WO2014169728A8 (en) | Electrically conductive inks | |
| CN106128548A (en) | A kind of resistance slurry of high electric heating conversion ratio | |
| CN104371452A (en) | Conductive coating for electronic device and preparation method of conductive coating | |
| CN105161159B (en) | A kind of conductive paste and its manufactured ceramic substrate | |
| CN104464889A (en) | Embedded resistance paste | |
| CN104051095B (en) | A kind of quaternary system thermistor material for adding titanium oxide | |
| CN109817401A (en) | A kind of plasma-based resistance material | |
| CN106281102A (en) | Conducting resinl | |
| CN109817364A (en) | A kind of plasma-based resistance material | |
| CN104078095A (en) | Conductive oxygen-free ceramic powder/nano-graphite composite conductive silver paste and preparing method thereof | |
| CN103915248A (en) | Manufacturing method of base metal terminal electrode inductor | |
| CN106601331A (en) | Low-TCR-value high-temperature lead-free ruthenium slurry and preparation method thereof | |
| CN106699159A (en) | Ferrite powder and preparation method and application thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190528 |