CN109804475A - 在承载件上安装矩阵阵列的电致发光部件的方法 - Google Patents

在承载件上安装矩阵阵列的电致发光部件的方法 Download PDF

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CN109804475A
CN109804475A CN201780056989.XA CN201780056989A CN109804475A CN 109804475 A CN109804475 A CN 109804475A CN 201780056989 A CN201780056989 A CN 201780056989A CN 109804475 A CN109804475 A CN 109804475A
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component
load
bearing part
substrate
conductive trace
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CN109804475B (zh
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尼古拉斯·利夫德路丝
安托万·德拉姆勃特力
桂拉姆·辛
托马斯·卡侬
萨米拉·姆巴塔
文森特·杜布瓦
弗兰克斯-泽维尔·阿米耶尔
黄范泰
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Valeo Vision SAS
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Abstract

本发明提出了一种将光部件安装在承载件上的方法。光部件包括大致平坦的基板，亚毫米尺寸的电致发光半导体元件以矩阵的形式在基板的第一面上外延生长。该方法的特征在于，它消除了对在部件和承载件之间的一层填充材料的需要，同时在部件和承载件之间提供良好的导热性和导电性以及较高的机械强度。

Description

在承载件上安装矩阵阵列的电致发光部件的方法
技术领域
本发明涉及在基板上组装光部件的方法，所述光部件用于机动车辆的光模块。特别地，本发明涉及部件至基板的连接，所述部件包括以矩阵的形式布置的多个基于电致发光半导体的基本光源的装置。
背景技术
在机动车辆领域中越来越多地推荐使用功耗通常较低的发光二极管(LED)，以用于实现诸如日间行车灯、信号指示灯或转向指示灯之类的灯功能。当在其端子上施加具有至少一个预定值的负载电压时，LED发光。LED发出的光的强度通常取决于流过其中的负载电流的强度。
在用于机动车辆的光装置的领域中，已知的做法是利用涉及以大致矩形矩阵的形式安装的多个LED的模块。每个LED是基本光源，基本光源有利地分别被电流驱动，并且独立于矩阵中的其他LED。实际上，可以认为每个LED代表矩形块中的像素，其发光强度可以根据目标应用的需要来确定。当这种模块的所有LED均匀地发光时，该模块可以被比作形成大致矩形光学覆盖区域的光源。然而，通过选择性地向像素子集供电，可以创建各种几何形状的光学覆盖区域。举例来说，这样的配置使得可以通过仅选择性地降低照亮道路的中心或左侧的那些像素的亮度，同时仍然基本上照亮道路右侧，来产生不会使迎面而来的车辆眩目的前照灯。当然，也可以设想使用这种装置的更复杂的配置。
为了能够充分利用LED矩阵技术提供的各种可能性，越来越需要具有高像素密度的光源。这使得矩阵阵列的光源的基本光源或LED之间的距离变得越来越小。所谓的“整体式(monolithic)”光部件可具有特别高密度的光源，这使得它们对于许多应用特别有利。这些部件包括多个亚毫米尺寸的电致发光半导体元件，多个亚毫米尺寸的电致发光半导体元件直接在共同的基板上外延生长，所述基板通常由硅形成。与传统的LED矩阵不同，在传统的LED矩阵中，每个基本光源是安装在诸如印刷电路板(PCB)的基板上的单独制造的电子部件，整体式部件被认为是单个电子部件，在其生产过程中多个电致发光半导体结贴片以矩阵的形式形成在共同的基板上。该制造技术允许每个用作基本光源的电致发光贴片彼此非常接近地形成。基本光源之间的间隙可以是亚毫米尺寸的。该生产技术的一个优点是可以在单个基板上实现高水平的像素密度。
为了驱动这种类型的整体式矩阵阵列的部件的电源，特别是驱动矩阵的各个光元件，必须在用于驱动电源的装置和每个光源之间提供电连接，从而导致部件与其所在的承载件之间的复杂连接网络。这些连接通常在整体式部件的后表面上产生相当大的体积，形成与承载件表面的界面，该界面仅随着基本光源更靠近在一起而增加。然而，该表面也必须用作热交换表面，并且部件上的高密度光源逐渐使其成为较大的热源。已知的做法是用填充材料(通常是导热树脂)填充整体式矩阵阵列的部件的电线之间的间隙，以便将由此产生的热散发到承载件的表面。然而，这些已知的解决方案在部件在承载件上的组装期间需要额外的步骤(添加填充材料)。
发明内容
本发明的目标是克服现有技术提出的至少一个问题。特别地，本发明的一个目的是提供一种允许产生具有高像素密度的电致发光光源的矩阵而不会牺牲这种矩阵的分辨能力的方法。本发明的另一个目的是提供一种由这种方法产生的装置。
本发明的一个主题是一种将光部件安装在承载件上的方法。光部件包括大致平坦的基板，亚毫米尺寸的电致发光半导体元件以矩阵的形式在基板的第一面上外延生长。该方法的特征在于，它包括以下步骤：
-在光部件的基板的第二面上形成至少一个导电迹线；
-在承载件的面上形成至少一个导电迹线；
-将光部件定位在承载件的所述面上，使得部件的导电迹线和承载件的导电迹线接触；
-在200℃至400℃之间的温度下对由承载件和光部件组成的组件进行退火。
外延生长是一种用于晶体定向生长的技术，通常用于形成半导体结。
优选地，形成在光部件的基板的第二面上的导电迹线可以布置成允许向光部件的每个电致发光半导体元件供应电流。
导电迹线可以优选地是包括铜的迹线。有利地，迹线由铜制成。
光部件的基板可以优选地包括硅、蓝宝石、碳化硅或氮化镓。
优选地，承载件可包括硅或玻璃。
在光部件上和基板上形成含铜的迹线可以优选地包括使用光刻过程在基板和承载件中产生空隙。优选地，铜可以沉积在空隙中。
优选地，承载件和/或光部件可以包括对准标记，所述对准标记旨在便于部件在承载件上的定位。
本发明的另一主题是一种用于机动车辆的光模块。光模块的特征在于，它包括用于驱动多个亚毫米尺寸的电致发光半导体元件的电源的装置，所述多个亚毫米尺寸的电致发光半导体元件以矩阵的形式在至少一个光部件的大致平坦的基板上外延生长，并且使用根据本发明的方法将所述光部件安装在承载件上。
承载件可以优选地电连接到在其一个面上的用于驱动电源的装置，或者可以包括在其一个面上的用于驱动电源的装置。
优选地，在承载件上形成的导电迹线可以电连接到用于驱动电源的装置。
根据本发明的措施允许简化已知的在承载件上安装整体式矩阵阵列的光部件的方法。在光部件和其承载件之间使用铜-铜连接使得可以避免在光部件和承载件之间使用诸如导热树脂的填充材料。铜-铜连接同时提供在电气部件与其承载件之间的机械连接、整体式矩阵阵列的部件的每个基本电致发光光源之间的必要电连接、以及部件与其承载件之间的良好热交换，这是更重要的，因为整体式矩阵阵列的部件上的高密度光源使整体式矩阵阵列的部件成为不可忽略的热源。
附图说明
借助于示例性描述和附图将更好地理解本发明的其他特征和优点，其中：
-图1示意性地示出了根据现有技术的已知方法由被连接到承载件的矩阵阵列的电致发光光部件组成的组件；
-图2示意性地示出了根据本发明的方法的优选实施例的主要步骤；
-图3示意性地示出了在根据本发明方法的一个步骤的处理过程中穿过矩阵阵列的电致发光光部件的截面；
-图4示意性地示出了根据本发明的方法的优选实施例由被连接到承载件的矩阵阵列的电致发光光部件所组成的组件。
具体实施方式
除非另有说明，否则针对一个给定实施例详细描述的技术特征可以与在通过非限制性示例描述的其他实施例的情况下描述的技术特征组合。
图1示意性地示出了现有技术中已知的技术方案，根据该技术方案，光部件10连接到大致平坦或平面的承载件20。部件10是所谓的“整体式”部件，其包括基板12，亚毫米尺寸的基本电致发光光源14在基板12上外延生长。由导线30表示的电连接设置在部件10和其承载件20之间。这些连接确保矩阵阵列的部件10的每个基本光源14被供电。导线30之间的空隙填充有导热树脂32，导热树脂32将部件10牢固地保持于承载件20并在部件10和承载件20之间提供热交换。
图2中示出了根据本发明的方法的优选实施例的主要步骤。在第一步骤a)中，在矩阵阵列的光部件的基板的背面上形成至少一个包括例如铜的导电迹线(conductivetrack)。这是不包括基本光源的面。类似地，至少一个导电迹线(包括例如铜)形成在承载件的连接至矩阵阵列的部件的面上。这对应于步骤b)。不言而喻，在不背离本发明的范围的情况下，步骤a)和b)的顺序可以颠倒或者它们可以并行地同时进行。在随后的步骤c)中，将以这种方式制备的光部件和承载件定位成使得在前述步骤中形成的包含铜的迹线接触。
然而在不背离本发明的范围的情况下，只要其它导电金属或材料具有与铜相似的性能，就可以使用其他导电金属或材料代替铜。
接下来，由承载件和光部件组成的组件在为此目的设置的炉中在200℃至400℃之间的温度下退火。这对应于最后的步骤d)。在退火操作期间，在矩阵阵列的部件与其承载件之间形成所谓的“混合键合”连接。这种部件-承载件连接是导电和导热的，并且同时在矩阵阵列的部件和承载件之间提供较高的机械保持强度。该方法既不需要使用粘合剂，也不需要在组装到承载件上时对部件施加压力，并且在部件和承载件之间没有产生空隙的情况下形成直接连接。
图3提供了上述方法的步骤a)中的电致发光部件100的图示。部件100包括第一面106，电致发光源104以矩阵的形式在第一面106上外延生长。空隙101形成在第二面108上，第二面108位于第一面106的背面。基板106优选地包括硅、GaN、蓝宝石或碳化硅。空隙被设计成对应于为每个基本光源104供电所需的电连接网络。为了实现这一点，可以使用现有技术中本身已知的并且将不在本发明的上下文中详细描述的光刻过程。一旦空隙已经形成，就在空隙的底部沉积铜，以便填充空隙。可以设想可选择的抛光步骤，以便在如此填充的空隙101和表面108之间提供大致光滑的界面。使用类似的方法在承载件的表面上形成含铜迹线。
图4显示了根据本发明的方法的结果。部件100包括第一面106，电致发光源104以矩阵的形式在第一面106上外延生长。在第二面108上，空隙在所需电连接的图像中形成肋网络。肋或空隙填充有铜105。包括硅或玻璃的承载件128在其表面128上具有铜迹线125，铜迹线125对应于部件100的背面108上的迹线105。在退火操作期间，在由部件100和承载件120形成的组件中，所需的混合键合连接分别形成在焊盘(land)105和125的位置处。
在优选实施例中，导电迹线125在功能上连接到用于驱动光源104的电源的装置。这种装置在本领域中是已知的并且通常需要转换器元件，转换器元件被配置为将第一强度的直流电流转换为第二强度的负载电流，第一强度的直流电流通常通过其中使用部件100的机动车辆内部的电流源提供，第二强度的负载电流适于选择性地向部件100的光源104供电。用于机动车辆的光模块还可以有利地包括以微控制器元件的形式制造的控制装置，该装置允许控制用于驱动电源的装置，以便满足从机动车辆的其它构件接收的设定点。

Claims (11)

1.一种将光部件安装在承载件上的方法，其特征在于，
所述光部件包括大致平坦的基板，亚毫米尺寸的电致发光半导体元件以矩阵的形式在所述基板的第一面上外延生长，并且所述方法包括以下步骤：
a)在所述光部件的基板的第二面上形成至少一个导电迹线；
b)在所述承载件的面上形成至少一个导电迹线；
c)将所述光部件定位在所述承载件的所述面上，使得所述光部件的导电迹线和所述承载件的导电迹线接触；
d)在200℃至400℃之间的温度下对由所述承载件和所述光部件组成的组件进行退火。
2.根据权利要求1所述的方法，其特征在于，
形成在所述光部件的基板的第二面上的导电迹线被布置成允许向所述光部件的每个电致发光半导体元件供应电流。
3.根据权利要求1和2中任一项所述的方法，其特征在于，
导电迹线是包括铜的迹线。
4.根据权利要求1至3中任一项所述的方法，其特征在于，
所述光部件的基板包括硅、蓝宝石、碳化硅或氮化镓。
5.根据权利要求1至4中任一项所述的方法，其特征在于，
所述承载件包括硅或玻璃。
6.根据权利要求1至5中任一项所述的方法，其特征在于，
在所述光部件和所述基板上形成导电迹线包括使用光刻过程在所述基板和所述承载件中产生空隙。
7.根据权利要求6所述的方法，其特征在于，
铜沉积在所述空隙中。
8.根据权利要求1至7中任一项所述的方法，其特征在于，
所述承载件和所述光部件包括对准标记，所述对准标记旨在便于所述部件在所述承载件上的定位。
9.一种用于机动车辆的光模块，其特征在于，
所述光模块包括用于驱动多个亚毫米尺寸的电致发光半导体元件的电源的装置，所述多个亚毫米尺寸的电致发光半导体元件以矩阵的形式在至少一个光部件的大致平坦的基板上外延生长，并且使用根据权利要求1至8中任一项所述的方法将所述光部件安装在承载件上。
10.根据权利要求9所述的光模块，其特征在于，
所述承载件在其一个面上电连接到用于驱动所述电源的装置或者包括用于驱动所述电源的装置。
11.根据权利要求9和10中任一项所述的光模块，其特征在于，
形成在所述承载件上的导电迹线电连接到用于驱动所述电源的装置。
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