CN109801852A - Ultrasonic effect assessment component and method - Google Patents

Ultrasonic effect assessment component and method Download PDF

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Publication number
CN109801852A
CN109801852A CN201711140503.9A CN201711140503A CN109801852A CN 109801852 A CN109801852 A CN 109801852A CN 201711140503 A CN201711140503 A CN 201711140503A CN 109801852 A CN109801852 A CN 109801852A
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China
Prior art keywords
ultrasonic
film layer
effect
cleaning device
frame
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CN201711140503.9A
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Chinese (zh)
Inventor
魏超锋
邓浩
谢志宴
高攀红
张超
辛丽
李瑛�
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Longi Green Energy Technology Co Ltd
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Longi Green Energy Technology Co Ltd
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Priority to CN201711140503.9A priority Critical patent/CN109801852A/en
Publication of CN109801852A publication Critical patent/CN109801852A/en
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Abstract

Ultrasound effect assessment component disclosed by the invention includes at least a braced frame, has film layer in braced frame, ultrasonic cleaning device applies ultrasonication to film layer for evaluating the ultrasonic effect of ultrasonic cleaning device.Ultrasound effect evaluation method disclosed by the invention, it is completed using ultrasonic effect assessment component as described above, it is ultrasonically treated comprising steps of ultrasonic effect assessment component is placed in ultrasonic cleaning device, then the surface for checking film layer, according to the ultrasonic effect for determining ultrasonic cleaning device the case where film surface.Ultrasonic effect assessment establishment of component of the invention is simple, and consumptive material input cost is low.Ultrasonic effect evaluation method is easy to operate, easy to implement, and common operating personnel only needs simple training, can quickly grasp;Detection effect is intuitive, can qualitatively judge to the cleaning ability of different manufacturers ultrasonic cleaning apparatus, reflects the ultrasonic effect of silicon wafer ultrasonic cleaning device, therefore, it is determined that the ability of ultrasonic cleaning apparatus cleaning silicon chip.

Description

Ultrasonic effect assessment component and method
Technical field
The invention belongs to Defect detection technique fields, and in particular to a kind of ultrasound effect assessment component further relates to one The method that kind evaluates ultrasonic cleaning device performance using the component.
Background technique
With the continuous development of world economy, modernization construction constantly increases high efficient energy sources demand.Photovoltaic power generation conduct One kind of the main energy sources of green energy resource and human kind sustainable development is increasingly subject to the attention of countries in the world and is sent out energetically Exhibition.The basic material of monocrystalline silicon piece, polysilicon chip as the solar battery sheet of photovoltaic power generation, possesses the extensive market demand. According to the estimation of International Energy Agency (IEA), it is contemplated that the 16% of whole world power generation total amount will be accounted for the year two thousand fifty solar power generation, the sun It can will become following one of human being's production and the main energy sources of life.According to the statistical data of photovoltaic association, China, silicon wafer at present Annual output alreadys exceed 10,000,000,000.
In the process of silicon wafer, in order to guarantee silicon chip surface cleanliness with higher, a large amount of cleaning solutions is needed to rush It washes and the chemistry such as fiting chemical burn into supersonic oscillations and heating, physical action is to remove the pollutant of silicon chip surface.Silicon wafer The equipment of washing and cleaning operation assembly line generally comprises silicon wafer stripping machine (also known as silicon wafer precleaning machine), plug-in sheet machine and Wafer Cleaning Machine.Silicon wafer stripping machine is the equipment for carrying out cleaning and degumming process to the silicon wafer after cutting, mostly uses groove-type cleaning machine.Inserted sheet Machine is to the silicon wafer fragment after degumming and the equipment be inserted into the special gaily decorated basket.Silicon wafer cleaner, be to the silicon wafer after cutting into The equipment of row washing and drying treatment.It is provided in silicon wafer stripping machine, silicon wafer cleaner and supersonic oscillations is carried out to silicon wafer Ultrasonic cleaner.In ultrasonic cleaner, silicon wafer is under the carrying of the mechanisms such as the gaily decorated basket, perpendicular to the vertical of horizontal plane State, by ultrasonication to remove the dirty of silicon chip surface.The cleaning effect of silicon wafer as silicon wafer quality inspection target it One, the undesirable subsequent manufacturing processes and generating efficiency that will will affect solar battery of the cleaning effect of silicon wafer.
The factors such as uniformity, the power of ultrasonic wave of the ultrasonic wave in ultrasonic cleaner directly affect the cleaning effect of silicon wafer Fruit.In order to determine the ultrasonic performance of ultrasonic cleaning device, ultrasonic meter (five-spot measurement) measurement ultrasound is mostly used at present Ultrasonic wave in wave rinse bath is strong and weak.But due to the difference between ultrasonic meter itself, and use ultrasonic meter Measurement ultrasonic wave power be difficult to obtain accurate data, cause the ultrasonic performance judgment of ultrasonic cleaning device generates often erroneous judgement with Dispute.Therefore, the ultrasonic performance of ultrasonic cleaning device how is detected by quick, effective, low-cost method, it is clear to ultrasound It washes device fabrication producer and its user all has important realistic meaning.
Summary of the invention
The purpose of the present invention is to provide a kind of ultrasonic effect assessment component, is measured from qualitative angle, determines that ultrasound is clear Equipment performance is washed, reflects the ultrasonic effect of ultrasonic cleaning device, for example can be used for determining cleaning of the ultrasonic cleaning device to silicon wafer Ability.
Ultrasonic cleaning device is evaluated using above-mentioned ultrasonic effect assessment component the object of the invention is also to provide a kind of The method of energy.
A kind of technical solution of the present invention is: ultrasonic effect assessment component, for evaluating ultrasonic cleaning device Ultrasonic effect, the ultrasound effect assessment component include at least a braced frame, have film layer in the braced frame, described Ultrasonic cleaning device applies ultrasonication to the film layer.
Further, the braced frame includes the frame in outside, and the film layer is removably disposed in the framework The surface in portion simultaneously at least partly covers the region that the frame surrounds.
Preferably, the braced frame is one, and the film layer is fixed on the frame and the framework is completely covered The region that portion surrounds.
Or it is preferred, the braced frame is two, and the film layer is clamped in the frame of two braced frames Between, and the region that one of them described frame surrounds at least is completely covered in the film layer.
Example, shape, the size in the region that the frame surrounds are identical as silicon wafer.
Further, the film layer is single layer or multilayer, and the film layer is metal foil.
Preferably, the film layer is single layer and selects tinfoil.
Another technical solution of the present invention is: ultrasonic effect evaluation method, is imitated using ultrasound as described above Fruit evaluation component is completed, comprising steps of
By in the ultrasonic effect assessment component merging ultrasonic cleaning device, make the liquid-immersed institute in ultrasonic cleaning device State ultrasonic effect assessment component;
The ultrasonic effect assessment component is ultrasonically treated using the ultrasonic cleaning device;And
The surface for checking the film layer, according to the ultrasonic effect for determining ultrasonic cleaning device the case where the film surface.
Preferably, the thicknesses of layers is no more than 20 μm, and ultrasonic time is set as being no more than 1min.
Specifically, there is hole and/or spot in the film surface after being ultrasonically treated, according to hole and/or spot Size and number evaluation ultrasound it is strong and weak;According to the film surface situation evaluation for being located at different location in the ultrasonic cleaning device Ultrasonic uniformity coefficient.
Ultrasonic effect assessment component of the invention may include one or two braced frame, be laid on the support frame simultaneously It fixes one layer of tinfoil or tinfoil is clamped between two braced frames.Ultrasonic effect evaluation method of the invention, use are above-mentioned Ultrasonic effect assessment component is implemented, and ultrasonic effect assessment component is placed in ultrasonic groove body, opens ultrasonic cleaning device, ultrasound terminates Afterwards, the case where checking tinfoil surface, and according to the ultrasonic performance for qualitatively judging ultrasonic cleaning device the case where tinfoil surface.This hair Bright ultrasonic effect assessment establishment of component is simple, and consumptive material input cost is low.Ultrasonic effect evaluation method is easy to operate, is easy to real It applies, common operating personnel only needs simple training, can quickly grasp, and carries out tracking instruction without professional person;Detection effect is straight It sees, the cleaning ability of different manufacturers ultrasonic cleaning apparatus can be qualitatively judged, set from side reflection silicon wafer ultrasonic cleaning Standby ultrasonic effect, therefore, it is determined that the ability of ultrasonic cleaning apparatus cleaning silicon chip.Especially, the present invention is able to reflect out ultrasound The ultrasonic difference on effect in the entire space of groove body meets the actual conditions that by ultrasonic wave are acted on of the silicon wafer in ultrasonic cleaning, because This evaluation component of the invention and method are very suitable to detect Wafer Cleaning effect, and detection efficiency is higher, flexibility It is stronger.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the braced frame of ultrasonic effect assessment component of the invention;
Fig. 2 is the positive arrangement schematic diagram of the ultrasonic effect assessment component insertion gaily decorated basket of embodiment 2;
Fig. 3 is the side view of Fig. 2;
Fig. 4 is the ultrasonic effect assessment component of embodiment 3 after ultrasonic cleaning device 1# ultrasonic cleaning, different rows in the gaily decorated basket The surface condition schematic diagram of the tinfoil of cloth position;
Fig. 5 is the ultrasonic effect assessment component of embodiment 3 after ultrasonic cleaning device 2# ultrasonic cleaning, different rows in the gaily decorated basket The surface condition schematic diagram of the tinfoil of cloth position;
Fig. 6 is the ultrasonic effect assessment component of embodiment 3 after ultrasonic cleaning device 3# ultrasonic cleaning, different rows in the gaily decorated basket The surface condition schematic diagram of the tinfoil of cloth position.
In figure, 1. braced frames, 11. frames, 12. hollow portions, 13. location holes, 2. film layers, 3. gailys decorated basket, I, is arranged in The tinfoil on gaily decorated basket head;II, is arranged in the tinfoil in the middle part of the gaily decorated basket;III, is arranged in the tinfoil of gaily decorated basket tail portion.
Specific embodiment
Below by drawings and examples, technical solution of the present invention is clearly and completely described, it is clear that described Embodiment be only a part of the embodiments of the present invention, instead of all the embodiments.
Embodiment 1
The present embodiment provides a kind of ultrasonic effect assessment component, for evaluating the ultrasonic effect of ultrasonic cleaning device.It is this Ultrasonic effect assessment component includes at least one braced frame 1 as shown in Figure 1, and is arranged on 1 surface of braced frame Film layer 2, it is preferable that film layer 2 is removable installed in 1 surface of braced frame.The ultrasonic cleaning device applies to the film layer 2 Ultrasonication.
Braced frame 1 mainly plays the role of fixing and supporting to sprawling for film layer 2, is a kind of frame structure, including outer The frame 11 of side.Film layer 2 is fixed on the frame 11, at least partly covers the region that the frame 11 surrounds, here Region be the hollow portion 12 for being located at 11 inside of the frame.The laying of film layer 2 is covered in the hollow portion 12 and is fixed on The frame 11, it should be pointed out that the region surrounded by frame 11 can be completely covered in film layer 2, can also partially cover Cover the region surrounded by frame 11.Preferably, the region surrounded by frame 11 is completely covered in film layer 2.Braced frame 1 Production material can select stainless steel or plastics, or other materials for realizing phase same-action can be selected to be made.As branch Support frame frame 1 makes the preferred embodiment of material, and the braced frame 1 of the present embodiment is stainless steel frame.
Film layer 2 is laid on the surface of braced frame 1, and film layer 2 can be one layer, is also possible to multilayer, and be both secured to institute It states on the frame 11 of braced frame 1.Ultrasonic cleaning device acts on 2 application of film layer, and film layer 2, which will be able to reflect out, to be cleaned by ultrasonic The ultrasonic effect of equipment, such as the intensity and the ultrasonic uniformity of ultrasound.In the present embodiment, film layer 2 is metal foil, institute State metal foil refer to cold draw at foil, mainly have red gold/silver foil, copper foil and aluminium foil several.Preferably, this Metal foil described in embodiment selects tinfoil.
As a kind of embodiment of ultrasonic effect assessment component, this ultrasound effect assessment component includes a support frame Frame 1 and a film layer 2, film layer 2 are fixed on the frame 11 of the braced frame 1.About the consolidating on frame 11 of film layer 2 Determine mode, there are a variety of implementations, the present embodiment is not made particularly to limit.Determine as shown in Figure 1, being offered on frame 11 The fixation of film layer 2 can be realized by the way that the locating piece matched with the location hole 13 is arranged in location hole 13 in position hole 13.Institute Stating locating piece can be using screw or staple, but is not limited to screw or staple, be also possible to it is other can be by fixed Play the role of the structural member of fixed film layer 2 in position hole 13.In a further embodiment, spring clip or other classes can also be selected Film layer 2 is directly clamped in frame 11 by the locating pieces such as the clip of type, and the braced frame 1 is fixed as one with film layer 2.
It is usually placed in the ultrasonic groove body of ultrasonic cleaning device in view of the ultrasonic effect assessment component, is subjected to ultrasonic work With, and pass through the variation of 2 surface condition of film layer, to evaluate the ultrasonic effect of ultrasonic cleaning device.In order to eliminate ultrasonic effect Negative effect of the production difference to ultrasonic cleaning device ultrasound effect between evaluation component, it is past in a batch of evaluation Multiple ultrasonic effect assessment components, and multiple ultrasonic effect assessment components point are placed in ultrasonic groove body toward needs Different location of the cloth in ultrasonic groove body.
Embodiment 2
The present embodiment provides another ultrasonic effect assessment component, as shown in Figures 2 and 3, including two braced frames 1, Film layer 2 is clamped between two braced frames 1.Structure setting, production material and film layer 2 in relation to braced frame 1 exist Fixed form in braced frame 1, reference can be made to embodiment 1, this will not be repeated here.It is pointed out that two braced frames 1 Shape, size can be consistent (identical), can also slightly have difference, but this species diversity should be set not influence evaluation ultrasonic cleaning Standby ultrasonic effect is advisable.
The production method of this ultrasound effect assessment component can be described generally as: take two braced frames 1;It is supported with two Frame 1 clamps film layer 2 and carries out necessary fixation;The film layer 2 that will exceed 11 outer rim of frame crops.
In the process of silicon wafer, the cleaning of silicon wafer mostly uses ultrasonic cleaning device, to completely remove silicon chip surface It is dirty, and then promote the quality of silicon wafer.Ultrasonic effect assessment component of the invention can be used for evaluating ultrasonic cleaning device to silicon The cleaning ability and effect of piece.Under this application scenario, as a preferred embodiment, in ultrasonic effect assessment component Film layer 2 can select tinfoil, simulate silicon wafer with tinfoil, tinfoil at this time is alternatively referred to as false silicon wafer.About the selection of tinfoil, Thickness is a crucial parameter, it is however generally that, the thickness of tinfoil is no more than 20 μm.As a preferred embodiment, tinfoil Conventional barbecue tinfoil, 18~20 μm of the thickness range of tinfoil can be selected.Shape, the size (framework of the braced frame 1 11 size of portion) it is suitable or identical with silicon wafer, the thickness of braced frame 1 is no more than 2mm.In general, the thickness 1 of frame 11~ 2mm opens up number as the location hole 13 of frame 11, and the present embodiment is not particularly limited.
The sound of power ultrasonic source can be converted into mechanical oscillation by ultrasonic wave, and the microbubble in solution is made to keep vibration Dynamic, bubble can expand rapidly, then be closed suddenly again.During this section, the moment of bubble closure generates shock wave, makes bubble Surrounding generates a certain size pressure, and when acoustic pressure reaches some strength, immense pressure caused by this ultrasonic cavitation will Tinfoil surface can be made hole and/or spot occur, the size and number of hole and/or spot can reflect ultrasonic power;And it spends Different location tinfoil surface condition then can reflect ultrasonic uniformity coefficient in basket.
Embodiment 3
The present embodiment provides a kind of specific ultrasonic effect assessment component, and the ultrasound effect for evaluating ultrasonic cleaning device Fruit.Its braced frame 1 is stainless steel material, and hollow portion (inside casing) is suitable having a size of 156mm × 156mm and silicon wafer length and width dimensions; Frame (outline border) processes 16 M5 threaded holes having a size of 170mm × 170mm, thickness 1mm, and in frame, to lock tin Paper.The tinfoil of tinfoil package selection film thickness, preferably selects same producer's tinfoil, and different manufacturers tinfoil has thickness and intensity region Not, it will affect test result.Two stainless steel braced frames clamp tinfoil, and extra tinfoil is cut with scissors, is then used Screw locking stainless steel braced frame, ultrasonic effect assessment establishment of component are completed.In fixed tinfoil, guarantee tinfoil test as far as possible Face sprawls that smooth, stress is consistent, avoids sprawling process as far as possible and causes folding line and convex-concave.
Ultrasonic effect assessment component is inserted into 50 gailys decorated basket 3, and checks one of the ultrasonic effect assessment component in the gaily decorated basket 3 Whether cause property is intact.The supersonic wave cleaning machine (number is respectively 1#, 2# and 3#) of selected three producers, all experiment conditions all phases Together, the above-mentioned gaily decorated basket 3 is respectively put into ultrasonic cleaner, after ultrasonic 1min, takes out the gaily decorated basket, checks tinfoil surface condition.It will After tinfoil is put into ultrasonic tank, due to ultrasonic cavitation, after a period of time, tinfoil surface will appear hole, spot, hole, The size and number of spot can reflect the power of ultrasound, and different location tinfoil configuration of surface difference can reflect entire ultrasound in the gaily decorated basket The uniformity of groove body ultrasound, comprehensive both the ultrasonic effect that just can determine that entire ultrasonic groove body, to reflect ultrasonic groove body Cleaning ability.
According to insertion position of the ultrasonic effect assessment component in the gaily decorated basket, 50 ultrasonic effect assessment components are divided into 3 parts, As shown in Fig. 2, it is divided into the ultrasonic effect assessment component of the ultrasonic effect assessment component in head and each 15 of tail portion and 20, middle part, Wherein, I part is the tinfoil for being arranged in gaily decorated basket head, and II part is the tinfoil being arranged in the middle part of the gaily decorated basket, and III part is to be arranged in The tinfoil of gaily decorated basket tail portion.In test, tinfoil shakes plate in parallel, and submergence water surface following depth is greater than 1cm, towards the tinfoil one of shake plate Face cannot have bubble, so tinfoil is tilted into water when placement, then adjustment is horizontal;Test process tinfoil not have shifting Dynamic, shake and inclination.
After setting ultrasonic time 1min, ultrasonic 1min, each ultrasound effect in the three parts of gaily decorated basket head, middle and end is randomly selected Fruit evaluation component observes the tinfoil situation of change of three parts ultrasound effect assessment component, and main detection tinfoil surface is by ultrasound Occur the size of hole and the quantity of spot and three parts tinfoil otherness afterwards.
Fig. 4 is the surface condition schematic diagram of the tinfoil of head, middle and end three parts in the gaily decorated basket after ultrasonic cleaning device 1# ultrasound. From fig. 4, it can be seen that hole, the spot of same tinfoil surface appearance are more equal with after ultrasonic cleaning device 1# ultrasound 1min Even, hole is larger, and hole, the spot size that I, II, III three parts tinfoil of head, middle and end occurs, and position is about the same, by This can illustrate that ultrasonic cleaning device 1# ultrasound effect is preferable, and ultrasound intensity is stronger, and ultrasound is evenly distributed.
Fig. 5 is the surface feelings of the tinfoil of I, II, III three parts of head, middle and end in the gaily decorated basket after ultrasonic cleaning device 2# ultrasound Condition schematic diagram.From fig. 5, it can be seen that with after ultrasonic cleaning device 2# ultrasound 1min, the tinfoil surface on I, head and tail portion III Hole is larger, distribution uniform, and the hole that middle part tinfoil surface occurs is smaller, and hole does not occur in the position having, says Bright middle part ultrasound energy is weaker, and is unevenly distributed, from the point of view of overall effect, the ultrasound energy end to end of ultrasonic cleaning device 2# compared with By force, it is evenly distributed, but middle part ultrasound energy is weaker, and ultrasound is unevenly distributed.
Fig. 6 is the surface condition of the tinfoil of I, II, III three parts of head, middle and end in the gaily decorated basket after ultrasonic cleaning device 3# ultrasound Schematic diagram.After ultrasonic cleaning device 3# ultrasound 1min, the hole size of I, II, III three parts tinfoil of head, middle and end appearance, position It is different, and with a piece of tinfoil surface some places hole, and some regions do not have then, illustrate this ultrasonic cleaning device Not only the ultrasound energy of different location is different, but also whole ultrasound distribution is also uneven.
It can be determined that the cleaning ability of three kinds of ultrasonic cleaning devices: the ultrasound intensity of ultrasonic cleaning device 1# from the above analysis It is evenly distributed, ultrasound energy is also relatively strong;Ultrasound is stronger end to end by ultrasonic cleaning device 2#, and middle part ultrasound is weaker, and overall distribution is uneven; Ultrasonic cleaning device 3# ultrasound is all unevenly distributed, and ultrasound energy is weaker.
The foregoing description of the disclosed embodiments, convenient for can be realized professional and technical personnel in the field or use this hair It is bright.And various modifications to these embodiments will be readily apparent to those skilled in the art, herein Used technical solution can be realized in other embodiments without departing from the spirit or scope of the present invention.Cause This, protection scope of the present invention is not limited to embodiment illustrated herein, as long as identical or simple as technical solution of the present invention The scheme of replacement belongs to protection scope of the present invention.

Claims (10)

1. ultrasonic effect assessment component, which is characterized in that for evaluating the ultrasonic effect of ultrasonic cleaning device, the ultrasound effect Evaluation component includes at least a braced frame, has film layer in the braced frame, and the ultrasonic cleaning device is to the film Layer applies ultrasonication.
2. ultrasound effect assessment component as described in claim 1, which is characterized in that the braced frame includes the framework in outside Portion, the film layer are removably disposed in the surface of the frame and at least partly cover the region that the frame surrounds.
3. ultrasound effect assessment component as claimed in claim 2, which is characterized in that the braced frame is one, the film Layer is fixed on the frame and the region that the frame surrounds is completely covered.
4. ultrasound effect assessment component as claimed in claim 2, which is characterized in that the braced frame is two, the film Layer is clamped between the frame of two braced frames, and one of them described frame is at least completely covered in the film layer The region surrounded.
5. such as the described in any item ultrasonic effect assessment components of claim 2-4, which is characterized in that the area that the frame surrounds Shape, the size in domain are identical as silicon wafer.
6. ultrasound effect assessment component as described in claim 1, which is characterized in that the film layer is single layer or multilayer, and The film layer is metal foil.
7. ultrasound effect assessment component as claimed in claim 6, which is characterized in that the film layer is single layer and selects tinfoil.
8. ultrasonic effect evaluation method, which is characterized in that using such as the described in any item ultrasonic effect assessment groups of claim 1-7 Part is completed, comprising steps of
In the ultrasonic effect assessment component merging ultrasonic cleaning device, it will make liquid-immersed described super in ultrasonic cleaning device Sound effective value evaluation component;
The ultrasonic effect assessment component is ultrasonically treated using the ultrasonic cleaning device;And
The surface for checking the film layer, according to the ultrasonic effect for determining ultrasonic cleaning device the case where the film surface.
9. ultrasonic effect evaluation method according to claim 8, which is characterized in that the thicknesses of layers is no more than 20 μm, surpasses The sound time is set as being no more than 1min.
10. ultrasonic effect evaluation method according to claim 9, which is characterized in that after being ultrasonically treated, the film layer table There is hole and/or spot in face, and it is strong and weak to evaluate ultrasound according to the size and number of hole and/or spot;It is described super according to being located at The film surface situation of different location evaluates ultrasonic uniformity coefficient in sound cleaning equipment.
CN201711140503.9A 2017-11-16 2017-11-16 Ultrasonic effect assessment component and method Pending CN109801852A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112924544A (en) * 2021-01-25 2021-06-08 江西志浩电子科技有限公司 Ultrasonic treatment effect detection device and circuit board production method

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Publication number Priority date Publication date Assignee Title
CN1184250A (en) * 1996-12-05 1998-06-10 三星电管株式会社 Apparatus for measuring intensity of ultrasonic waves
JP2009285524A (en) * 2008-05-27 2009-12-10 Sakura Seiki Kk Ultrasonic cleaning indicator
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Application publication date: 20190524