CN109801666A - The test device of memory chip in a kind of hybrid circuit - Google Patents

The test device of memory chip in a kind of hybrid circuit Download PDF

Info

Publication number
CN109801666A
CN109801666A CN201910064323.XA CN201910064323A CN109801666A CN 109801666 A CN109801666 A CN 109801666A CN 201910064323 A CN201910064323 A CN 201910064323A CN 109801666 A CN109801666 A CN 109801666A
Authority
CN
China
Prior art keywords
test
memory
bus
chip
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201910064323.XA
Other languages
Chinese (zh)
Other versions
CN109801666B (en
Inventor
李俊玲
沈拉民
颜伟
屈博强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xian Microelectronics Technology Institute
Original Assignee
Xian Microelectronics Technology Institute
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xian Microelectronics Technology Institute filed Critical Xian Microelectronics Technology Institute
Priority to CN201910064323.XA priority Critical patent/CN109801666B/en
Publication of CN109801666A publication Critical patent/CN109801666A/en
Application granted granted Critical
Publication of CN109801666B publication Critical patent/CN109801666B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Tests Of Electronic Circuits (AREA)
  • For Increasing The Reliability Of Semiconductor Memories (AREA)

Abstract

The test device of memory chip, can be achieved at the same time fault location and diagnosis in a kind of hybrid circuit of the present invention;It includes built-in self-test circuit and bus complexing circuit;Built-in self-test circuit and bus complexing circuit are arranged on master control protocol chip;Built-in self-test circuit connects the selection signal port of bus complexing circuit, and built-in self-test circuit connects bus complexing circuit with test pattern data bus by test pattern control bus, test pattern address bus;Master control protocol chip further includes functional memory controller;The control port of the control bus connection memory chip of master control protocol chip, the data port of the data/address bus connection memory chip of master control protocol chip, the address port of the address bus connection memory chip of master control protocol chip;The output data port of the output data bus connection memory chip of master control protocol chip;Built-in self-test circuit and functional memory controller read the data of storage core on piece by output data bus.

Description

The test device of memory chip in a kind of hybrid circuit
Technical field
The invention belongs to memory chip the field of test technology;More particularly to a kind of survey of memory chip in hybrid circuit Trial assembly is set.
Background technique
Hybrid-intergated-circuit technique is widely used in due to the features such as its packing density is big, high reliablity, good electrical property The numerous areas such as computer, automobile, communication and space flight and aviation.However, how for the storage core in hybrid circuit form Piece carries out effective high spreadability test, to examine the packaging technology of hydrid integrated circuit to lack the manufacture that memory introduces It falls into, is that circuit test Qualify Phase suffers from a problem that.
MBIST (Memory Build in Self Test) is industry approval for the excellent of single-chip embedded memory Elegant test Solution, but not can be used directly in hydrid integrated circuit, for hybrid circuit memory chip, it is then more It is tested by the way of function read and write access in traditional sense.However, which asking there are the following aspects Topic: firstly, function access mode is realized by way of memory write associated control registers, control sequential is complex, Test vector generation difficulty is big, and the judgement for reading result to memory is not intuitive;Second, the specific structure of memory determines it There are a variety of dependent failure modes such as fixation, coupling, address decoding, and function access is limited to the function of processor or main controller Behavior, it is difficult to the test vector for having higher test coverage is generated according to special algorithm for the fault type of memory, Test coverage is insufficient;Third, the exploitation of function testing vector and debugging are more difficult, and testing time and testing cost are higher. Furthermore functional test access mode is difficult to carry out fault location and diagnosis to dead-file.
Summary of the invention
The present invention provides a kind of self-test devices of hybrid circuit memory chip;The device can be achieved at the same time failure Positioning and diagnosis.
The technical scheme is that in a kind of hybrid circuit memory chip test device, including built-in self-test Circuit and bus complexing circuit;The built-in self-test circuit and bus complexing circuit are arranged on master control protocol chip;It is described Built-in self-test circuit connects the selection signal port of bus complexing circuit, and built-in self-test circuit is controlled total by test pattern Line, test pattern address bus connect bus complexing circuit with test pattern data bus;The master control protocol chip further includes Functional memory controller, functional memory controller pass through functional mode control bus, functional mode address bus and function Mode data bus connects bus complexing circuit;The control terminal of the control bus connection memory chip of the master control protocol chip Mouthful, the data port of the data/address bus connection memory chip of master control protocol chip, the address bus connection of master control protocol chip The address port of memory chip;The output data end of the output data bus connection memory chip of the master control protocol chip Mouthful;The built-in self-test circuit and functional memory controller read the number of storage core on piece by output data bus According to.
Further, the features of the present invention also characterized in that:
Wherein built-in self-test circuit includes BIST controller, and BIST controller connects comparator, and comparator reads storage Data on device chip;BIST controller interconnects diagnostor, and diagnostor carries out diagnosis positioning to the memory chip of failure, And export diagnostic data;The BIST controller generates test and excitation and is sent to memory chip to be measured.
The data for the memory chip that wherein comparator will acquire are compared with expected data, and generate Tag memory The test failure mark of test result.
Wherein test and excitation includes that memory control test and excitation, storage address test and excitation and memory write data survey Examination excitation.
Wherein BIST kernel also obtains test starting signal, and exports test end mark.
Wherein bus complexing circuit obtains functional mode memory control signal and test pattern memory control signal simultaneously Output storage controls signal, obtains functional mode memory address signal and the output storage of test pattern memory address signal Device address signal obtains functional mode memory data signal and test pattern memory data signal output storage data letter Number.
Wherein memory to be measured obtains memory control signal, memory address signal and memory data signal.
Compared with prior art, the beneficial effects of the present invention are: test device provided by the invention, control operation letter Single, Self -adaptive is easy, test coverage is high, while can be realized the validity test approach of fault location and diagnosis, to realize Test to hydrid integrated circuit internal embedded memory chip.The device starts test pattern by external, is controlled by BIST Device processed generates test and excitation, and the height for being directed to memory is realized by the access interface of BIST controller and memory chip to be measured Spreadability test, external resource expense is small, and control is simple, and is by test completion marking signal and test failure marking signal It can be from the test result of external directly Tag memory.
Test device provided by the invention, structure control is simple, can realize in meaning and deposit to hybrid circuit mounting completely The built-in self-test and fault diagnosis of reservoir position;Using the industry mainstream testing algorithm for being directed to memory, can be realized to depositing The high spreadability of the various failures of reservoir is tested;Using functional memory bus interface, the external connection of memory is simplified, is reduced Test cost;The test of hybrid circuit built-in storage chip is realized by built-in self-test mode, Self -adaptive is easy, and is surveyed Try vector small scale.The device is suitable for the plug-in memory test of SIP, 3DIC and board-level circuit.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of one embodiment of the invention;
Fig. 2 is the structure chart of built-in self-test circuit in the present invention;
Fig. 3 is the structure chart of bus complexing circuit in the present invention.
Specific embodiment
Technical solution of the present invention is further illustrated in the following with reference to the drawings and specific embodiments.
The present invention provides a kind of test device of memory chip in hybrid circuit, the device in hybrid circuit using depositing The characteristics of memory chip and the data interaction of master control protocol chip, built-in self-test circuit is designed in hybrid circuit main control chip, And performance data, control bus are multiplexed to realize the test access to memory chip, which mainly includes built-in Self testing circuit and bus complexing circuit.
As shown in Figure 1, the device includes built-in self-test circuit, functional memory controller and bus complexing circuit, and Built-in self-test circuit, functional memory controller and bus complexing circuit are arranged on master control protocol chip;Simultaneously it is built-in from Test circuit is not arranged on the same chip with memory chip to be tested.
Wherein built-in self-test circuit passes through test pattern control bus, test pattern data bus and test pattern address Bus connects bus complexing circuit;Wherein functional memory control passes through functional mode control bus, functional mode address bus Bus complexing circuit is connected with functional mode data/address bus;Bus complexing circuit connects memory chip to be measured by control bus Control port, bus complexing circuit connects the address port of memory chip to be measured, bus complexing circuit by address bus The data port of memory chip to be measured is connected by data/address bus.Built-in self-test circuit and functional memory controller are also logical Cross the data-out port that output data bus connects memory chip to be measured.
As shown in Fig. 2, built-in self-test circuit includes BIST controller, BIST controller connects comparator and diagnostor, Wherein BIST controller and diagnostor interconnect, i.e., are able to carry out data interaction between BIST controller and diagnostor.BIST Controller obtains test starting signal, after the triggering of test starting signal, by the control of state of a control machine, according to testing algorithm Generate test and excitation;Testing algorithm includes MARCH2 or CHECKERBOARD etc., can also according to the read-write sequence of memory and The customized testing algorithm of fault type tests the high spreadability of the various fault types of memory to realize;Wherein test swashs It encourages and writes data test excitation including memory control test and excitation, storage address test and excitation and memory, and will test Excitation is applied to tested memory chip.
Preferably, it is provided with state of a control machine in BIST controller, is additionally provided with control signal generator, address generator And Data Generator, above three generator are used to generate the test and excitation.
Wherein comparator will read data from memory to be measured and compare with expected data, while generate test failure Whether mark, test failure mark are correct for Tag memory test result.
Object in view of the BIST Structure is the plug-in memory of chip, and the memory interface of master chip has There is diversity, which is mapped outside built-in self-test circuit, is increased bus-sharing mechanism, is made built-in self-test circuit External memory to be tested can be directly accessed by the memory interface of master control protocol chip.The device avoids master control associations View chip additionally increases a set of test memory interface, and simplifies external interconnection.As shown in figure 3, bus complexing circuit Purpose be realize function memory access and test memory access channel switch.Under circuit normal mode of operation, selection function memory control The signal of device processed exports, and the test signal for selecting BIST controller to generate when test pattern, multiple by selection function and test With the memory bus interface of former control chip, the interface connection type of primary circuit is not changed.Only increase in function access path Level-one multi-path choice structure is added, the influence to timing performance is very small, and the memory data that memory output port reads back It does not need to control, the comparator for being directly inputted into built-in self-test is compared, while being sent to functional module.
The interconnection of master control protocol chip and external memory is unaffected in the present apparatus, and realizes memory chip Efficiently test.Bus-sharing design further reduces test cost, reduces external switch logic bring interconnection difficulty.
In certain 0.5um technique hydrid integrated circuit, using test device of the invention, realize for hybrid circuit The test of internal storage chip.
The hybrid circuit mainly includes two chip, is respectively as follows: master control protocol chip and the asynchronous single port bi-directional data of 16K Bus memory.Two chip carries out assembling interconnection by the thick-film technique of hydrid integrated circuit.Wherein memory chip is mark Quasi- interface, master control protocol chip initiate the access to memory, control, address, number by host interface in the functional mode It is drawn from chip pin according to bus.
Firstly, the read-write sequence in master control protocol chip for the asynchronous one-port memory of 16K is modeled, using industry Boundary's mainstream is able to detect MarchC+ the and Checkboard algorithm of most storage failures, carries out setting for MBIST circuit Meter, this circuit are that the MBIST circuit only includes the state machine kernel that algorithm executes with the tradition MBIST difference designed, compare With diagnosis etc. BIST control circuit, do not include memory ontology.
In order to be the standard interface of memory chip, while the outside of facilitating chip by standard built-in self-test interface mappings Connection is designed using the bus-sharing in invention.The MBIST Memory Controller signal for testing signal and function is carried out Switching, to guarantee under MBIST test pattern, can normally complete the test operation to hybrid circuit inside separate memory, The memory operation under normal functioning mode is not influenced simultaneously.Bus-sharing inside configuration is multiple multiplexer circuits, test It is selected with performance data by multiple selector, is interacted communicate with memory by original function access interface later. So that entire controller external interface does not change.Scheme control, the testing and diagnosing of MBIST circuit pass through JTAG Realization, test failure and test complement mark, directly in piece External Observation, need exist for infusing by way of with function pin multiplexing The controller chip port of meaning multiplexing must be the pin of hybrid circuit top layer.
Since this circuit measurand is the memory of single port BDB Bi-directional Data Bus, in BIST circuit design, The read-write control signal generated with BIST circuit is needed to control the enable signal of memory BDB Bi-directional Data Bus accordingly. To guarantee memory in reading and write-in, the data flow of BDB Bi-directional Data Bus is correct.In addition, for MBIST circuit The structure failure defect of itself can then be guaranteed by the design for Measurability technology of inner scanning.
After structure of the invention, the test of hydrid integrated circuit memory chip is significantly simplified, although from surveying Examination hardware configuration increases some expenses on area, but bring direct effect is reduction of Self -adaptive difficulty, reduces Test vector scale, it is often more important that, it can realize to 100% address searching the high spreadability test to memory, improve The test quality of memory.Based on the structure, we are successfully realized to this hydrid integrated circuit on V93K test platform The test of memory chip has reached expected good result.

Claims (7)

1. the test device of memory chip in a kind of hybrid circuit, which is characterized in that including built-in self-test circuit and bus Multiplex circuit;
The built-in self-test circuit and bus complexing circuit are arranged on master control protocol chip;
The built-in self-test circuit passes through test pattern control bus, test pattern address bus and test pattern data bus Connect bus complexing circuit;
The master control protocol chip further includes functional memory controller, and functional memory controller is controlled total by functional mode Line, functional mode address bus connect bus complexing circuit with functional mode data/address bus;
The control port of the control bus connection memory chip of the master control protocol chip, the data/address bus of master control protocol chip Connect the data port of memory chip, the address port of the address bus connection memory chip of master control protocol chip;
The output data port of the output data bus connection memory chip of the master control protocol chip;
The built-in self-test circuit and functional memory controller read the number of storage core on piece by output data bus According to.
2. the test device of memory chip in a kind of hybrid circuit according to claim 1, which is characterized in that in described Building self testing circuit includes BIST controller, and BIST controller connects comparator, and comparator reads the data of storage core on piece; BIST controller interconnects diagnostor, and diagnostor carries out diagnosis positioning to the memory chip of failure, and exports diagnostic data; The BIST controller generates test and excitation and is sent to memory chip to be measured.
3. the test device of memory chip in a kind of hybrid circuit according to claim 2, which is characterized in that the ratio The data for the memory chip that will acquire compared with device are compared with expected data, and generate the test of Tag memory test result Failure mark.
4. the test device of memory chip in a kind of hybrid circuit according to claim 2, which is characterized in that described BIST kernel also obtains test starting signal, and exports test end mark.
5. the test device of memory chip in a kind of hybrid circuit according to claim 2, which is characterized in that the survey Examination excitation includes that memory control test and excitation, storage address test and excitation and memory write data test excitation.
6. the test device of memory chip in a kind of hybrid circuit according to claim 1, which is characterized in that described total Line multiplex circuit obtains functional mode memory control signal and test pattern memory control signal and output storage control Signal obtains functional mode memory address signal and test pattern memory address signal output storage address signal, obtains Take functional mode memory data signal and test pattern memory data signal output storage data-signal.
7. the test device of memory chip in a kind of hybrid circuit according to claim 6, which is characterized in that be measured to deposit Reservoir obtains memory control signal, memory address signal and memory data signal.
CN201910064323.XA 2019-01-23 2019-01-23 Testing device for memory chip in hybrid circuit Active CN109801666B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910064323.XA CN109801666B (en) 2019-01-23 2019-01-23 Testing device for memory chip in hybrid circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910064323.XA CN109801666B (en) 2019-01-23 2019-01-23 Testing device for memory chip in hybrid circuit

Publications (2)

Publication Number Publication Date
CN109801666A true CN109801666A (en) 2019-05-24
CN109801666B CN109801666B (en) 2020-12-29

Family

ID=66560010

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910064323.XA Active CN109801666B (en) 2019-01-23 2019-01-23 Testing device for memory chip in hybrid circuit

Country Status (1)

Country Link
CN (1) CN109801666B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110892483A (en) * 2019-10-17 2020-03-17 长江存储科技有限责任公司 Method for testing memory device using limited number of test pins and memory device using the same
CN115480960A (en) * 2021-05-31 2022-12-16 西安紫光国芯半导体有限公司 Many-core computing circuit with self-test function, and test method and device thereof
CN116521466A (en) * 2023-07-03 2023-08-01 武汉芯必达微电子有限公司 Built-in self-test circuit and method for embedded Flash
CN116758968A (en) * 2023-08-16 2023-09-15 英诺达(成都)电子科技有限公司 Built-in self-test method for memory and circuit and chip thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1272696A (en) * 1999-05-04 2000-11-08 三星电子株式会社 Semiconductor storage device and method for fetch said device in test pattern
CN101069149A (en) * 2004-12-04 2007-11-07 海珀斯通股份公司 Memory system with sector buffers
CN101727980A (en) * 2008-10-20 2010-06-09 联发科技股份有限公司 Multi-chip module
CN103617810A (en) * 2013-11-26 2014-03-05 中国科学院嘉兴微电子与系统工程中心 Test structure and test method for embedded memory
CN107731264A (en) * 2016-08-10 2018-02-23 英飞凌科技股份有限公司 Nonvolatile memory is tested

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1272696A (en) * 1999-05-04 2000-11-08 三星电子株式会社 Semiconductor storage device and method for fetch said device in test pattern
CN101069149A (en) * 2004-12-04 2007-11-07 海珀斯通股份公司 Memory system with sector buffers
CN101727980A (en) * 2008-10-20 2010-06-09 联发科技股份有限公司 Multi-chip module
CN103617810A (en) * 2013-11-26 2014-03-05 中国科学院嘉兴微电子与系统工程中心 Test structure and test method for embedded memory
CN107731264A (en) * 2016-08-10 2018-02-23 英飞凌科技股份有限公司 Nonvolatile memory is tested

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110892483A (en) * 2019-10-17 2020-03-17 长江存储科技有限责任公司 Method for testing memory device using limited number of test pins and memory device using the same
CN110892483B (en) * 2019-10-17 2021-01-29 长江存储科技有限责任公司 Method for testing memory device using limited number of test pins and memory device using the same
US11125816B2 (en) 2019-10-17 2021-09-21 Yangtze Memory Technologies Co., Ltd. Method of testing memory device employing limited number of test pins and memory device utilizing same
US11719748B2 (en) 2019-10-17 2023-08-08 Yangtze Memory Technologies Co., Ltd. Method of testing memory device employing limited number of test pins and memory device utilizing same
CN115480960A (en) * 2021-05-31 2022-12-16 西安紫光国芯半导体有限公司 Many-core computing circuit with self-test function, and test method and device thereof
CN116521466A (en) * 2023-07-03 2023-08-01 武汉芯必达微电子有限公司 Built-in self-test circuit and method for embedded Flash
CN116521466B (en) * 2023-07-03 2023-09-15 武汉芯必达微电子有限公司 Built-in self-test circuit and method for embedded Flash
CN116758968A (en) * 2023-08-16 2023-09-15 英诺达(成都)电子科技有限公司 Built-in self-test method for memory and circuit and chip thereof
CN116758968B (en) * 2023-08-16 2023-12-08 英诺达(成都)电子科技有限公司 Built-in self-test method for memory and circuit and chip thereof

Also Published As

Publication number Publication date
CN109801666B (en) 2020-12-29

Similar Documents

Publication Publication Date Title
CN109801666A (en) The test device of memory chip in a kind of hybrid circuit
CN103154753B (en) The test of high speed input/output unit
US7007215B2 (en) Test circuit capable of testing embedded memory with reliability
US7313739B2 (en) Method and apparatus for testing embedded cores
KR101256976B1 (en) Simultaneous core testing in multi-core integrated circuits
CN100399473C (en) Built-in self test system and method
US6080203A (en) Apparatus and method for designing a test and modeling system for a network switch device
JP5667644B2 (en) Multisite inspection of computer memory devices and serial IO ports
US6249889B1 (en) Method and structure for testing embedded memories
US7203873B1 (en) Asynchronous control of memory self test
KR20010104363A (en) Efficient parallel testing of integrated circuit devices using a known good device to generate expected responses
US7844867B1 (en) Combined processor access and built in self test in hierarchical memory systems
CN103137212A (en) Synchronous dynamic random access memory (SDRAM) testing method
US20130275824A1 (en) Scan-based capture and shift of interface functional signal values in conjunction with built-in self-test
TWI389129B (en) Intergrated circuit device
CN101923897A (en) SIC (semiconductor integrated circuit) and the method for testing that is used for SIC (semiconductor integrated circuit)
US20140229778A1 (en) At-speed scan testing of interface functional logic of an embedded memory or other circuit core
CN110415751B (en) Memory built-in self-test circuit capable of being configured in parameterization mode
US8516318B2 (en) Dynamic scan
Taouil et al. Post-bond interconnect test and diagnosis for 3-D memory stacked on logic
Kim et al. At-speed interconnect test and diagnosis of external memories on a system
Han et al. A New Multi‐site Test for System‐on‐Chip Using Multi‐site Star Test Architecture
CN109065093A (en) On-chip memory tests circuit and method
CN203573309U (en) Testing structure for embedded system memory
Ehrenberg et al. IEEE Std 1581—A standardized test access methodology for memory devices

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant