CN109799138A - Polishing disk elasticity modulus and creep properties on-position measure device and measurement method - Google Patents
Polishing disk elasticity modulus and creep properties on-position measure device and measurement method Download PDFInfo
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The present invention relates to polishing disk elasticity modulus in unified polishing and creep properties on-position measure device, the controller including being fixed on burnishing machine cross rail top;With the display terminal of controller communication connection;The loading force actuator being fixed on crossbeam, and be electrically connected with controller;Test board is circular slab;Its top is hinged with loading force actuator, and bottom is abutted with the polishing disk of burnishing machine;And displacement sensor, it is fixed on loading force actuator by connector, is communicated to connect with controller, and the detection direction of displacement sensor is directed toward the top of test board.The present invention also provides measurement methods, realize the on-position measure of polishing disk elasticity modulus or creep properties, easy to operate without dismantling polishing disk, and precision is high;Special measurement equipment is not needed to buy simultaneously, testing cost is reduced;Without dismantling polishing disk when due to measurement, it is therefore prevented that the change of the form accuracy of polishing disk, and then extend the service life of polishing disk.
Description
Technical field
The present invention relates to the unified polishing technology field of optical element, polished in more particularly to unified polishing
Disk elasticity modulus and creep properties on-position measure device and measurement method.
Background technique
Unified polishing is one of main processing technology of large-sized optical elements, and unified polishing is thrown using large scale
CD processing dimension optical element less than that, large scale polishing disk covers the whole surface of element when processing.It has compared with
The evener cunning of element surface of high material removal efficiency and processing, has many advantages, such as lower intermediate frequency error.Wherein, full mouth
The polishing disk type of diameter is more, polyurethane polishing disk, the pitch lap of viscoplasticity material including elastic material etc..And polishing disk
It is one of the key element of unified polishing, the elasticity modulus and creep properties of polishing disk generate component side shape very important
It influences.In polishing process, with the extension of polishing time, the processing performance of polishing disk is gradually degenerated, the elasticity modulus of polishing disk
It changes therewith with creep properties.
Currently, the measurement for the elasticity modulus and creep properties of polishing disk is all offline mode, need using dedicated
Measuring device, but due to unified polishing use large scale polishing disk be typically secured on the turntable of lathe, torn open
Unload form accuracy very troublesome, and influencing polishing disk down, therefore inconvenient offline inspection its material property, and offline
Detection accuracy is poor.
Therefore, how to provide polishing disk elasticity modulus and creep properties in unified polishing is ability in level detecting apparatus
The problem of field technique personnel's urgent need to resolve.
Summary of the invention
In view of this, the present invention provides polishing disk elasticity modulus in unified polishing and creep properties on-position measure to fill
It sets, realizes the detection in place for polishing disc material properties in unified polishing.
To achieve the goals above, the present invention adopts the following technical scheme:
Polishing disk elasticity modulus and creep properties on-position measure device, are equipped on burnishing machine in unified polishing,
Include:
Controller, controller are fixed on the cross rail top of burnishing machine;
Display terminal, display terminal and controller communicate to connect;
Loading force actuator, loading force actuator are fixed on crossbeam, and are electrically connected with controller;
Test board, test board are circular slab;Its top, polishing of bottom and burnishing machine hinged with loading force actuator
Disk abuts;
And displacement sensor, displacement sensor are fixed on loading force actuator by connector, with controller communication link
It connects, and the detection direction of displacement sensor is directed toward the top of test board.
It can be seen via above technical scheme that compared with prior art, the present disclosure provides throw in unified polishing
CD elasticity modulus and creep properties on-position measure device, by directly carrying measuring device, controller control on burnishing machine
Loading force is directly acted on polishing panel surface by test board by loading force actuator processed, by displacement sensor in loading procedure
The altitudes of the polishing panel surface of middle acquisition feed back to controller, and controller records data and display number by display terminal
According to realizing the on-position measure of polishing disk elasticity modulus or creep properties, and then without dismantling polishing disk, easy to operate, precision
It is high;Special measurement equipment is not needed to buy simultaneously, testing cost is reduced;Without dismantling polishing disk when due to measurement, it is therefore prevented that
The change of the form accuracy of polishing disk, and then extend the service life of polishing disk.
Preferably, loading force actuator includes fixed frame, actuator and bulb mandril;
Fixed frame is fixed on crossbeam;
Actuator is installed on fixed frame, and is electrically connected with controller;
Bulb mandril includes the bulb and mandril of integrally connected;It is hinged at the top of bulb side and test board;Mandril side and execution
The output end of device connects.Wherein, bulb mandril and test board are bulb hinged, and test board is enable to adapt to during loading force
The shape of polishing disk constantly keeps being bonded with polishing panel surface.
Preferably, actuator is driving motor or hydraulic unit driver;Driving motor or hydraulic unit driver and controller are electrical
Connection.The model of specific driving motor is selected according to service condition, and hydraulic unit driver can be hydraulic push rod structure, is led to
Cross promotion or the return that controller controls hydraulic oil pump feed or hydraulic stem is realized in oil return.
Preferably, there is the ball cap slot being adapted to bulb mandril bulb, wherein ball cap slot is with test board at the top of test board
Separate structure is fixed by screw, facilitates installation or replacement bulb mandril.
Preferably, test board is made of steel, it is not easy to deform, the type of steel can be according to the polishing disk that need to be measured
Material is selected.
Preferably, test board diameter is 10mm-100mm, and with a thickness of 5mm-20mm, wherein test board can be made muti-piece not
The plate of same specification facilitates and tests different polishing disk uses.
Preferably, connector is adjustable connecting bracket, and adjustable connecting bracket includes first connecting rod and the second connecting rod;The
One connecting rod one end and loading force actuator are hinged, and the other end and second connecting rod one end are hinged;The second connecting rod other end with
Displacement sensor connection.Using the effect of this scheme are as follows: displacement sensor is directed toward test board top during being conducive to load test
The variation for polishing panel surface is fed back to controller by portion.
Preferably, displacement sensor is laser displacement sensor, can be passed using Keyence LK-G5000 laser displacement
Sensor, response frequency 392KHz, measurement accuracy are ± 0.02%, and the on-line measurement time is long, and precision is high, and error is small.
The present invention also provides polishing disk elasticity modulus in unified polishing and creep properties on-position measure method, including with
Lower step:
Select polishing disk surface location to be measured;Fixed above-mentioned measuring device;
The preloaded force F of loading force actuator is selected in the controller0, pre-loading time t0, loading force F1And the load time
t1;
Load, according to preloaded force F0With pre-loading time t0After load, loading force actuator is by loading force F1Act on survey
It is loaded on test plate (panel), while being shown on display terminal and recording polishing disk apparent height variable quantity in test board loading procedure, directly
To reaching preset load time t1;Then terminate loading procedure, stop recording and obtain polishing disk surface deformation in loading force F1Make
With load time t under1Situation of change.
It can be seen via above technical scheme that compared with prior art, the present invention discloses polishing disk bullet in the polishing of offer
Property modulus and creep properties on-position measure method, by directly carrying measuring device, controller control load on burnishing machine
Loading force is directly acted on polishing panel surface by test board by power actuator, is obtained during loading by displacement sensor
The altitudes of polishing panel surface feed back to controller, controller passes through display terminal and records data and display data, realizes
The on-line measurement of polishing disk surface elastic modulus or creep, and then without dismantling polishing disk, easy to operate, precision is high;Simultaneously
Special measurement equipment is not needed to buy, testing cost is reduced;Since measurement is without dismantling polishing disk, it is therefore prevented that the shape of polishing disk
The change of shape precision, and then extend the service life of polishing disk;What the measurement method provided according to the present invention simultaneously was measured
Elasticity modulus or the creep for polishing panel surface, can analyze the processing performance of polishing disk, to instruct the process of polishing disk.
Preferably, the elasticity modulus of polishing disk or creep properties pass through formula:
E=4F1h/(πad2) (1) calculating;
Or it is calculated by e (t)=a (t)/h (2);
Wherein, in formula (1) e be elastic material polishing disk elasticity modulus;D is test board diameter;H is polishing disc thickness;
The size of loading force and action time are respectively F1、t1, a is the deflection for measuring elastic material polishing disk;
E (t) is the creep function of viscoplasticity material polishing disk in formula (2), i.e. the creep strain in different load moment t;a
It (t) is viscoplasticity material polishing disk in the different deflections for loading moment t;T is the effect moment of loading force, 0 < t < t1, t1It is to add
Carry the continuous action time of power;H is polishing disc thickness.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The embodiment of invention for those of ordinary skill in the art without creative efforts, can also basis
The attached drawing of offer obtains other attached drawings.
Fig. 1 attached drawing is polishing disk elasticity modulus and creep properties on-position measure device in unified polishing provided by the invention
Structural schematic diagram;
Fig. 2 attached drawing is polishing disk elasticity modulus and creep properties on-position measure device in unified polishing provided by the invention
Section B-B partial enlarged view;
Fig. 3 attached drawing is polishing disk elasticity modulus and creep properties on-position measure device in unified polishing provided by the invention
The structural schematic diagram being equipped on unified burnishing machine (polishing disk is viscoelastic material);
Fig. 4 attached drawing is the portion the A enlarged view of Fig. 3 attached drawing;
Fig. 5 attached drawing is polishing disk elasticity modulus and creep properties on-position measure device in unified polishing provided by the invention
The structural schematic diagram being equipped on unified fast throwing machine (polishing disk is elastic material);
Fig. 6 attached drawing is according to polishing disk elasticity modulus and creep properties on-position measure in unified polishing provided by the invention
The deformation map for the viscoelastic material polishing disk that method is measured;
Fig. 7 attached drawing is according to polishing disk elasticity modulus and creep properties on-position measure in unified polishing provided by the invention
The deformation map for the elastic material polishing disk that method is measured.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
The embodiment of the invention discloses polishing disk elasticity modulus in unified polishing and creep properties on-position measure device, real
The detection in place that disc material properties are polished in unified polishing is showed.
Referring to attached drawing 1-5, polishing disk elasticity modulus and creep properties on-position measure in unified polishing provided by the invention
Device is equipped on burnishing machine 1, comprising:
Controller 4, controller 4 are fixed on 2 top of crossbeam of burnishing machine 1;
Display terminal, display terminal and controller 4 communicate to connect;
Loading force actuator 5, loading force actuator 5 are fixed on crossbeam 2, and are electrically connected with controller 4;
Test board 6, test board 6 are circular slab;Its top and loading force actuator 5 are hinged, bottom and burnishing machine 1
Polishing disk abuts;
And displacement sensor 7, displacement sensor 7 are fixed on loading force actuator 5 by connector, it is logical with controller 4
Letter connection, and the detection direction of displacement sensor 7 is directed toward the top of test board 6.
The present disclosure provides polishing disk elasticity modulus in unified polishing and creep properties on-position measure device, pass through
Measuring device is directly carried on burnishing machine 1, it is by test board 6 that loading force is direct that controller 4 controls loading force actuator 5
Polishing panel surface is acted on, the altitudes of the polishing panel surface obtained during loading by displacement sensor 7 are fed back to
Controller 4, controller 4 record data and display data by display terminal, realize polishing disk elasticity modulus or creep properties
On-position measure, and then without dismantling polishing disk, easy to operate, precision is high;Do not need to buy special measurement equipment simultaneously, test at
Originally it is reduced;Without dismantling polishing disk when due to measurement, it is therefore prevented that the change of the form accuracy of polishing disk, and then extend throwing
The service life of CD.
In one embodiment of the invention, referring to attached drawing 1, loading force actuator 5 include fixed frame 51, actuator 52 and
Bulb mandril 53;
Fixed frame 51 is fixed on crossbeam 2;
Actuator 52 is installed on fixed frame 51, and is electrically connected with controller 4;
Bulb mandril 53 includes the bulb and mandril of integrally connected;Bulb side and 6 top of test board are hinged;Mandril side with hold
The output end of row device 52 connects.Wherein, bulb mandril 53 and test board 6 are bulb hinged, enable test board 6 in loading force mistake
The shape of polishing disk is adapted in journey, constantly keeps being bonded with polishing panel surface.
Specifically, actuator 52 is driving motor or hydraulic unit driver;Driving motor or hydraulic unit driver and controller 4
It is electrically connected.The model of specific driving motor is selected according to service condition, and hydraulic unit driver can be hydraulic push rod knot
Structure controls hydraulic oil pump feed by controller 4 or promotion or the return of hydraulic stem is realized in oil return.
In another embodiment of the present invention, have referring to attached drawing 2, at the top of test board 6 suitable with 53 bulb of bulb mandril
The ball cap slot matched, wherein ball cap slot and test board 6 are separate structure, are fixed by screw, facilitate installation or replacement bulb mandril
53。
Specifically, test board 6 is made of steel, it is not easy to deform, the type of steel can be according to the polishing that need to be measured
The material of disk is selected.
6 diameter of test board is 10mm-100mm, and with a thickness of 5mm-20mm, wherein test board 6 can be made muti-piece difference rule
The plate of lattice facilitates and tests different polishing disk uses.
In other embodiments of the invention, referring to attached drawing 1 and 4, connector is adjustable connecting bracket 8, adjustable connection
Bracket 8 includes first connecting rod 81 and the second connecting rod 82;81 one end of first connecting rod and loading force actuator 5 are hinged, another
It holds hinged with 82 one end of the second connecting rod;Second connecting rod, 82 other end is connect with displacement sensor 7.Using the effect of this scheme
Are as follows: displacement sensor 7 is directed toward 6 top of test board during being conducive to load test, and the variation for polishing panel surface is fed back to control
Device 4 processed.
Advantageously, displacement sensor 7 is laser displacement sensor, Keyence LK-G5000 laser displacement can be used
Sensor, response frequency 392KHz, measurement accuracy are ± 0.02%, and the on-line measurement time is long, and precision is high, and error is small.
Meanwhile the present invention also provides polishing disk elasticity modulus in unified polishing and creep properties on-position measure method,
The following steps are included:
Select polishing disk surface location to be measured;Measuring device is fixed on burnishing machine;
The preloaded force F of loading force actuator 5 is selected in controller 40, pre-loading time t0, loading force F1And when load
Between t1;
Load, according to preloaded force F0With pre-loading time t0After load, loading force actuator 5 is by loading force F1It acts on
It is loaded on test board 6, while being shown on display terminal and recording polishing disk apparent height in 6 loading procedure of test board and changed
Amount, until reaching preset load time t1;Then terminate loading procedure, stop recording acquisition polishing disk surface deformation and loading
Power F1With load time t under effect1Situation of change.
The present invention discloses polishing disk elasticity modulus and creep properties on-position measure method in the polishing of offer, by polishing
Measuring device is directly carried on lathe 1, and controller 4 controls loading force actuator 5 and loading force directly acted on by test board 6
Panel surface is polished, the altitudes of the polishing panel surface obtained during loading by displacement sensor 7 feed back to controller
4, controller 4 records data and display data by display terminal, realizes the online of polishing disk surface elastic modulus or creep
Measurement, and then without dismantling polishing disk, easy to operate, precision is high;Special measurement equipment is not needed to buy simultaneously, testing cost obtains
It reduces;Without dismantling polishing disk when due to measurement, it is therefore prevented that the change of the form accuracy of polishing disk, and then extend polishing disk
Service life;The elasticity modulus or creep properties for the polishing disk that the measurement method provided according to the present invention simultaneously is measured, can
The processing performance for analyzing polishing disk, to instruct the process of polishing disk.
Wherein, the elasticity modulus of polishing disk or creep properties pass through formula:
E=4F1h/(πad2) (1) calculating;
Or it is calculated by e (t)=a (t)/h (2);
Wherein, in formula (1) e be elastic material polishing disk elasticity modulus;D is 6 diameter of test board;H is polishing disc thickness;
The size of loading force and action time are respectively F1、t1, a is the deflection for measuring elastic material polishing disk;
E (t) is the creep function of viscoplasticity material polishing disk in formula (2), i.e. the creep strain in different load moment t;a
It (t) is viscoplasticity material polishing disk in the different deflections for loading moment t;T is the effect moment of loading force, 0 < t < t1, t1It is to add
Carry the continuous action time of power;H is polishing disc thickness.
Concrete application embodiment 1
Referring to attached drawing 3 and 4, the present embodiment measuring device is equipped in unified burnishing machine, and polishing disk is viscoplasticity drip
Green polishing disk, pitch lap thickness h are 15mm, are provided with multistation bridge mechanism and crossbeam above polishing disk;Of the invention
Measuring device includes loading force actuator, is fixed on crossbeam, and the output end of loading force actuator by bulb mandril and is surveyed
Test plate (panel) is hinged, and test board bottom is bonded with polishing panel surface;Test board diameter is 50mm, thickness 5mm;It is held in loading force actuator
Row device uses hydraulic push rod structure, and the load of hydraulic push rod or return are realized by controller control hydraulic pump pump oil or oil return;
Between 1N-200N, loading force controls precision and is less than 0.2N the loading force scope control of actuator;Keyence is used simultaneously
LK-G5000 laser displacement sensor is fixed on loading force actuator by adjustable connecting bracket, keeps laser displacement sensor
Test lead always point at the top of test board, the test value of laser displacement sensor is shown on display terminal by controller.
Preloaded force, pre-loading time, loading force and the size of load time are arranged by controller, can set manually
It sets, can also be selected in preset data, wherein preloaded force and pre-loading time are to make before load test
Test board bottom is bonded completely with polishing disk;In the present embodiment, there is key on controller, by manual setting loading force 20N,
Load time 8min, is arranged preloaded force and the load time is respectively 1N and 5s;Then control of the loading force actuator in controller
System is lower to be preloaded, and loading force acts on polishing disk through actuator, bulb mandril to test board, keeps test board and polishing disk complete
Fitting, is then loaded, and displacement sensor constantly transmits the deformation of polishing disk during loading, and controller receives simultaneously
It is shown and is recorded by display terminal.
The sampling period d of laser displacement sensort=0.1s, measurement 8min obtain the deformation data of 4800 sampling instants
It is denoted as a (ti), i=1 ..., 4800, the measured value of laser displacement sensor referring to attached drawing 6, viscoplasticity pitch lap it is compacted
Varying function e (ti) are as follows: e (ti)=a (ti)/h, ti=dt×i。
Concrete application embodiment 2
Referring to attached drawing 5, the present embodiment measuring device is equipped in unified fast throwing machine, and polishing disk is elastic polyurethane polishing
Disk, polishing disk are provided with crossbeam with a thickness of 1.2mm, polishing disk top;Measuring device of the invention includes loading force actuator,
It is fixed on crossbeam, the output end of loading force actuator is hinged by bulb mandril and test board, test board bottom and polishing disk
Surface fitting;Test board diameter d is 50mm, thickness h 5mm;Actuator uses driving motor, driving electricity in loading force actuator
The output end connecting ball head mandril of machine.The test lead of laser displacement sensor is kept to always point at the top of test board, laser displacement
The test value of sensor is shown on display terminal by controller.
Preloaded force, pre-loading time, loading force and load time are selected by controller preset data;The present embodiment
In, loading force 20N, load time 1min, are arranged preloaded force and the load time is respectively 1N and 5s;Then loading force actuator
It preloads under the control of the controller, loading force acts on polishing disk through actuator, bulb mandril to test board, makes test board
It is bonded with polishing disk, is then loaded completely, the displacement sensor constantly deformation of transmission polishing panel surface during loading
(i.e. the height change of test board) situation, controller are received and are shown by display terminal and recorded.
The sampling period d of laser displacement sensort=0.1s, measurement 1min obtain the deformation data of 600 sampling instants
It is denoted as a (ti), i=1 ..., 600, the measured value of laser displacement sensor is referring to attached drawing 7, a (ti) 5 μm of ≈, elastic polyurethane
The elasticity modulus e of polishing disk is according to e=4F1h/(πad2) carry out substituting into numerical value calculating.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with other
The difference of embodiment, the same or similar parts in each embodiment may refer to each other.For device disclosed in embodiment
For, since it is corresponded to the methods disclosed in the examples, so being described relatively simple, related place is said referring to method part
It is bright.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
Various modifications to these embodiments will be readily apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention
It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one
The widest scope of cause.
Claims (10)
1. polishing disk elasticity modulus and creep properties on-position measure device, are equipped on burnishing machine (1) in unified polishing,
It is characterised by comprising:
Controller (4), the controller (4) are fixed at the top of the crossbeam (2) of burnishing machine;
Display terminal, the display terminal and the controller (4) communicate to connect;
Loading force actuator (5), the loading force actuator (5) are fixed on the crossbeam (2), and with the controller (4)
It is electrically connected;
Test board (6), the test board (6) are circular slab;Its top with the loading force actuator (5) hingedly, bottom with
The polishing disk (3) of burnishing machine abuts;
And displacement sensor (7), institute's displacement sensors (7) are fixed on the loading force actuator (5) by connector, with
Controller (4) communication connection, and the detection direction of institute's displacement sensors (7) is directed toward the top of the test board (6).
2. polishing disk elasticity modulus and creep properties on-position measure device in unified polishing according to claim 1,
It is characterized in that, the loading force actuator (5) includes fixed frame (51), actuator (52) and bulb mandril (53);
The fixed frame (51) is fixed on the crossbeam (2);
The actuator (52) is installed on the fixed frame (51), and is electrically connected with the controller (4);
The bulb mandril (53) includes the bulb and mandril of integrally connected;It is cut with scissors at the top of the bulb side and the test board (6)
It connects;The mandril side is connect with the output end of the actuator (52).
3. polishing disk elasticity modulus and creep properties on-position measure device in unified polishing according to claim 2,
It is characterized in that, the actuator (52) is driving motor or hydraulic unit driver;The driving motor or hydraulic unit driver with it is described
Controller (4) is electrically connected.
4. polishing disk elasticity modulus and creep properties on-position measure device in unified polishing according to claim 2,
It is characterized in that there is the ball cap slot being adapted to bulb mandril (53) bulb at the top of the test board (6).
5. polishing disk elasticity modulus and creep properties on-position measure device in unified polishing according to claim 2,
It is characterized in that, the test board (6) is made of steel.
6. polishing disk elasticity modulus and creep properties on-position measure device in unified polishing according to claim 2,
It is characterized in that, test board (6) diameter is 10mm-100mm, with a thickness of 5mm-20mm.
7. polishing disk elasticity modulus and creep properties on-position measure in unified polishing according to claim 1-6
Device, which is characterized in that the connector is adjustable connecting bracket (8), and the adjustable connecting bracket (8) includes first connecting rod
(81) and the second connecting rod (82);Described first connecting rod (81) one end and the loading force actuator (5) hingedly, the other end with
Described second connecting rod (82) one end is hinged;Second connecting rod (82) other end is connect with institute's displacement sensors (7).
8. polishing disk elasticity modulus and creep properties on-position measure in unified polishing according to claim 1-6
Device, which is characterized in that institute's displacement sensors (7) are laser displacement sensor.
9. polishing disk elasticity modulus and creep properties on-position measure method in unified polishing, which is characterized in that including following step
It is rapid:
Select polishing disk surface location to be measured;The fixed such as described in any item measuring devices of claim 1-8;
The preloaded force F of loading force actuator is selected in the controller0, pre-loading time t0, loading force F1And load time t1;
Load, according to preloaded force F0With pre-loading time t0After load, loading force actuator is by loading force F1Act on test board
Upper load, while polishing disk apparent height variable quantity in test board loading procedure is shown and recorded on display terminal, until reaching
To preset load time t1;Then terminate loading procedure, stop recording and obtain polishing disk surface deformation in loading force F1Under effect
With load time t1Situation of change.
10. polishing disk elasticity modulus and creep properties on-position measure method in unified polishing according to claim 9,
It is characterized in that, the elasticity modulus or creep properties of polishing disk pass through formula: e=4F1h/(πad2) (1) calculating;
Or it is calculated by e (t)=a (t)/h (2);
Wherein, in formula (1) e be elastic material polishing disk elasticity modulus;D is test board diameter;H is polishing disc thickness;Load
The size of power and action time are respectively F1、t1, a is the deflection for measuring elastic material polishing disk;
E (t) is the creep function of viscoplasticity material polishing disk in formula (2), i.e. the creep strain in different load moment t;a(t)
It is viscoplasticity material polishing disk in the different deflections for loading moment t;T is the effect moment of loading force, 0 < t < t1, t1It is load
The continuous action time of power;H is polishing disc thickness.
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