CN109795100A - Coating system and method for adhering film - Google Patents
Coating system and method for adhering film Download PDFInfo
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- CN109795100A CN109795100A CN201910147693.XA CN201910147693A CN109795100A CN 109795100 A CN109795100 A CN 109795100A CN 201910147693 A CN201910147693 A CN 201910147693A CN 109795100 A CN109795100 A CN 109795100A
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Abstract
This application provides a kind of coating system and method for adhering film, which includes load carrier, transshipment acitivity, film pasting mechanism and auxiliary body.Load carrier is for carrying electronic equipment, transshipment acitivity is for drawing protective film, and for protective film to be transported to above electronic equipment, film pasting mechanism can be moved to second end from the first end of load carrier to attachment film surface along electronic equipment, so that protective film be attached at electronic equipment to attachment film surface, auxiliary body is set to the second end of load carrier, for desorbing state in protective film and transshipment acitivity, and film pasting mechanism do not make protective film be attached at electronic equipment when attachment film surface, protective film can not fall to electronic equipment to attachment film surface.By the above-mentioned means, can effectively avoid protective film close to the end of load carrier second end fall in advance electronic equipment to attachment film surface, to prevent trapped gas between protective film and electronic equipment, and then improve pad pasting quality and pad pasting efficiency.
Description
Technical field
This application involves the technical field of electronic equipment, it is specifically related to a kind of coating system and method for adhering film.
Background technique
It is sold or during routine use in electronic equipment factory, it usually needs on electronic equipment surface (such as display screen
Outer surface) be sticked layer protecting film, to protect electronic equipment, avoid unnecessary scratch.
Summary of the invention
The embodiment of the present application provides a kind of coating system, for by protective film be attached at electronic equipment to pad pasting table
Face, which includes: load carrier, for carrying electronic equipment；Transshipment acitivity, for drawing protective film, and being used for will
Protective film is transported to above electronic equipment；Film pasting mechanism, can along electronic equipment to attachment film surface from the of load carrier
One end is moved to second end so that protective film be attached at electronic equipment to attachment film surface；And auxiliary body, it is set to
The second end of load carrier, for desorbing state in protective film and transshipment acitivity, and film pasting mechanism does not paste protective film
Set on electronic equipment when attachment film surface, protective film can not fall to electronic equipment to attachment film surface.
The embodiment of the present application also provides a kind of method for adhering film to attachment film surface that protective film is attached to electronic equipment,
The method for adhering film includes: that electronic equipment is placed in load carrier；Transshipment acitivity draws protective film, and protective film is transported to electronics
Above equipment；Film pasting mechanism is moved to second end from the first end of load carrier to attachment film surface along electronic equipment, so that
Protective film be attached at electronic equipment to attachment film surface；State, and film pasting mechanism are desorbed in protective film and transshipment acitivity
Do not make protective film be attached at electronic equipment when attachment film surface, auxiliary body enables to protective film not fall to electronics to set
It is standby to attachment film surface.
The beneficial effect of the application is: coating system provided by the present application be used for by protective film be attached at electronic equipment to
Attachment film surface, the coating system include load carrier, transshipment acitivity, film pasting mechanism and auxiliary body.Load carrier is for carrying
Electronic equipment, for transshipment acitivity for drawing protective film, and for protective film to be transported to above electronic equipment, film pasting mechanism can
It is moved to second end from the first end of load carrier to attachment film surface along electronic equipment, so that protective film is attached at electronics
Equipment to attachment film surface, auxiliary body is set to the second end of load carrier, inhales for releasing in protective film and transshipment acitivity
Attached state, and film pasting mechanism do not make protective film be attached at electronic equipment when attachment film surface, protective film can not be fallen to
Electronic equipment to attachment film surface.By the above-mentioned means, can effectively avoid protective film close to the end of load carrier second end
Fall in advance electronic equipment to attachment film surface, to prevent trapped gas between protective film and electronic equipment, and then improve pad pasting
Quality and pad pasting efficiency.
Detailed description of the invention
In order to more clearly explain the technical solutions in the embodiments of the present application, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, the drawings in the following description are only some examples of the present application, for
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing.
Fig. 1 is the structural schematic diagram of coating system first embodiment provided by the present application；
Fig. 2 is the schematic top plan view of load carrier in Fig. 1；
Fig. 3 is the schematic front view of transshipment acitivity in Fig. 1；
Fig. 4 is the schematic top plan view of transshipment acitivity in Fig. 1；
Fig. 5 is the schematic front view that protective film is pushed into electronic equipment by demoulding component from vacuum film adsorption component in Fig. 3；
Fig. 6 is the schematic front view of film pasting mechanism in Fig. 1；
Fig. 7 is the schematic front view of Tu1Zhong auxiliary body；
Fig. 8 is the schematic top plan view of Tu1Zhong auxiliary body；
Fig. 9 is that the method for adhering film to attachment film surface first provided by the present application that protective film is attached at electronic equipment is implemented
The flow diagram of example.
Specific embodiment
With reference to the accompanying drawings and examples, the application is described in further detail.It is emphasized that following implement
Example is merely to illustrate the application, but is not defined to scope of the present application.Likewise, following embodiment is only the portion of the application
Point embodiment and not all embodiments, institute obtained by those of ordinary skill in the art without making creative efforts
There are other embodiments, shall fall in the protection scope of this application.
Referenced herein " embodiment " is it is meant that a particular feature, structure, or characteristic described can wrap in conjunction with the embodiments
It is contained at least one embodiment of the application.Each position in the description occur the phrase might not each mean it is identical
Embodiment, nor the independent or alternative embodiment with other embodiments mutual exclusion.Those skilled in the art explicitly and
Implicitly understand, embodiment described herein can be combined with other embodiments.
Present inventor has found by long-term research: existing pad pasting mode is easy tired when pad pasting is soon completed
Gas causes to retain bubble between protective film and electronic equipment surface (outer surface of such as display screen).Pad pasting matter is not only influenced in this way
Amount, also results in and does over again, and reduces pad pasting efficiency.For this purpose, present applicant proposes following examples.
Refering to fig. 1, Fig. 1 is the structural schematic diagram of coating system first embodiment provided by the present application.
The coating system 10 of the application be used for by protective film 100 be attached at electronic equipment 200 to attachment film surface 201.Its
In, it can be the outer surface of the display screen (not shown) of electronic equipment 200 to attachment film surface 201, be also possible to electronics and set
The outer surface of standby 200 shell (not shown), protective film 100 to be attached at the display of electronic equipment 200 by the present embodiment
It is illustrated for the outer surface of screen.
Wherein, coating system 10 includes load carrier 11, transshipment acitivity 12, film pasting mechanism 13 and auxiliary body 14.
The pad pasting 100 of the application can be PET film, AR film etc., it has good translucency, wear-resisting and anti scuffing energy
Power will not leave a trace after tearing, and electronic equipment 200 can effectively be avoided to sell or routine use during causes in factory
Scratch.
The electronic equipment 200 of the application can be mobile phone, tablet computer, laptop, wearable device etc., wherein
The present embodiment, which takes the mobile phone as an example, to be illustrated.
Referring to Fig.2, Fig. 2 is the schematic top plan view of load carrier 11 in Fig. 1.
The load carrier 11 of the application has certain intensity, rigidity and hardness in structure, for carrying electronic equipment
200。
Wherein, load carrier 11 includes loading plate 111 and multiple limited posts 112, and multiple limited posts 112 stand on loading plate
111 the same face and around forming at least one accommodating area 113, at least one accommodating area 113 for accommodating electronic equipment 200,
Simultaneously Positioning Electronic Devices 200 can either be fixed in this way, additionally it is possible to be realized simultaneously to multiple electronic equipments 200 to attachment film surface
201 carry out pad pasting, to improve the reliability and efficiency of coating system 10.The present embodiment is with the quantity of accommodating area 113 for one
For be illustrated.
In the description of the present application, the meaning of " plurality " is at least two, such as two, three etc., unless otherwise clearly having
The restriction of body.
Optionally, loading plate 111 is made by hard materials such as stainless steels, to guarantee enough structural strengths to carry electronics
Equipment 200.In some other embodiment, loading plate 111 be used for carry electronic equipment 200 be additionally provided on one side protective pad or
Cushion (not shown) is touched during carrying out pad pasting to avoid pick-and-place electronic equipment 200 and to electronic equipment 200
Wound scratches.
Optionally, limited post 112 is made by hard materials such as stainless steel, ceramics, plastic cement, to carry out to electronic equipment 200
Limit and positioning.It is equally possible that protective pad or cushion (not shown) is arranged on the surface of limited post 112, to keep away
Exempt to pick and place electronic equipment 200 and damages or scratch during carrying out pad pasting to electronic equipment 200.Further, it limits
The shape of column 112 can be the regular shapes such as cylinder, prism, in order to which limited post 112 is processed and installed.
In some embodiments, the position-adjustable of multiple limited posts 112, to adapt to the structure size of electronic equipment 200
Variation, such as: during pad pasting, the electronic equipment 200 of 5.5 inches, 6.0 inches can be individually positioned in multiple limits
In the accommodating area 113 of different sizes that column 112 is formed, to increase the scope of application of coating system 10.
In some other embodiment, loading plate 111 be used to carry electronic equipment 200 to offer at least one on one side recessed
Slot, at least one groove can either fix simultaneously Positioning Electronic Devices 200, additionally it is possible to realize for accommodating electronic equipment 200 in this way
Pad pasting is carried out to attachment film surface 201 to multiple electronic equipments 200 simultaneously, to improve the reliability and effect of coating system 10
Rate.Further, the size of each groove can be different, to adapt to the variation of the structure size of electronic equipment 200, thus
Increase the scope of application of coating system 10.
Further, define in the embodiment of the present application: the right area of load carrier 11 is the of load carrier 11 in Fig. 1
One end 114, left area are the second end 115 of load carrier 11；It that is to say, the right area of loading plate 111 corresponds in Fig. 2
The first end 114 of load carrier 11, left area correspond to the second end 115 of load carrier 11.
Term " first ", " second " in the application are used for description purposes only, and are not understood to indicate or imply opposite
Importance or the quantity for implicitly indicating indicated technical characteristic.Define " first " as a result, the feature of " second " can be bright
Show or implicitly include at least one this feature.
It is the schematic front view of transshipment acitivity 12 in Fig. 1 refering to Fig. 3 to Fig. 4, Fig. 3 jointly, Fig. 4 is transshipment acitivity in Fig. 1
12 schematic top plan view.
The transshipment acitivity 12 of the application is used to protective film 100 being transported to electronic equipment for drawing protective film 100
200 tops.In actual production process, protective film 100 may be stored in the preset regions of neighbouring coating system 10 in advance.Turn
Fortune mechanism 12 is moved to the preset regions first, and draws protective film 100；Then it is moved to 11 top of load carrier, that is to say
200 top of electronic equipment, so that protective film 100 is transferred to 200 region of electronic equipment from preset regions.
Wherein, transshipment acitivity 12 includes vacuum film adsorption component 121 and demoulding component 122, and vacuum film adsorption component 121 is for inhaling
It goes bail for cuticula 100, demoulding component 122 is used for so that protective film 100 is partially disengaged in vacuum film adsorption component 121 and part is attached at
Electronic equipment 200 to attachment film surface 201.
Specifically, vacuum film adsorption component 121 includes vacuum generator 1211 and multiple vacuum slots 1212, vacuum generator
1211 for generating adjustable vacuum adsorption force, and multiple 1212 arrays of vacuum slot are arranged to draw protective film 100.
Optionally, vacuum generator 1211 by independent bellows and vacuum valve respectively with multiple vacuum slots 1212
Individually connection, so that each vacuum slot 1212 is adjustable to the vacuum adsorption force of protective film 100, to increase vacuum suction
The absorption effect of membrane module 121.In some other embodiment, multiple vacuum slots 1212 pass through public one or more ripples
The mode of pipe and vacuum valve is connect with vacuum generator 1211, to simplify the structure of vacuum film adsorption component 121.
Optionally, vacuum slot 1212 is by materials such as silicon rubber, polyurethane, nitrile rubber or polymer containing vinyl
It is made, to keep certain pliability；And vacuum slot 1212 is in inverted funnel shape, to increase vacuum slot 1212 and protective film
100 contact area, to increase vacuum slot 1212 to the adsorption effect of protective film 100.
Vacuum film adsorption component 121 further comprises fixed plate 1213, and fixed plate 1213 is for installing multiple vacuum slots
1212, and 1213 place plane of fixed plate is parallel to each other with 111 place plane of loading plate.Wherein, multiple vacuum slots 1212 with
The modes array arrangements such as circle, rectangle, radial or helical form are in fixed plate 1213, with multiple vacuum slots in the present embodiment
1212 are illustrated for rectangular array arrangement in fixed plate 1213.
It is jointly that demoulding component 122 pushes away protective film 100 from vacuum film adsorption component 121 in Fig. 3 refering to Fig. 3 to Fig. 5, Fig. 5
To the schematic front view of electronic equipment 200.
When drawing protective film 100 in transshipment acitivity 12, and protective film 100 being transported to 200 top of electronic equipment, demoulding group
Part 122 is arranged adjacent to the first end 114 of load carrier 11, as shown in Figure 3.Wherein, demoulding component 122 includes the first actuator
1221 and pushing block 1222, pushing block 1222 and the first actuator 1221 are sequentially connected, and pushing block 1222 can be transported towards load carrier 11
It is dynamic, protective film 100 is pushed into electronic equipment 200 from vacuum film adsorption component 121, as shown in Figure 5.
Optionally, the first actuator 1221 is servo motor or magnetostrictive member, can also be other types of actuator,
This is not restricted.
Optionally, pushing block 1222 is a part of fixed plate 1213, is also equipped with multiple vacuum slots on pushing block 1222
1212, as shown in Figures 3 to 5, to increase transshipment acitivity 12 to the absorption effect of protective film 100.Further, due to each
Vacuum slot 1212 is adjustable to the vacuum adsorption force of protective film 100, in pushing block 1222 by protective film 100 from vacuum film adsorption component
During 121 are pushed into electronic equipment 200, it on the one hand can keep or increase on pushing block 1222 vacuum slot 1212 to protective film
On the other hand 100 vacuum adsorption force can reduce the vacuum slot for even being eliminated neighbouring pushing block 1222 in fixed plate 1213
The vacuum adsorption force of 1212 pairs of protective films 100, so that protective film 100 can partially be attached at electricity under the action of pushing block 1222
Sub- equipment 200 to attachment film surface 201；And 100 part of protective film be attached at electronic equipment 200 to attachment film surface 201 it
Afterwards, as shown in figure 5, reducing or even eliminating vacuum slot 1212 on pushing block 1222 to the vacuum adsorption force of protective film 100, so that
Protective film 100 is separated with transshipment acitivity 12, be that is to say and is partially disengaged in vacuum film adsorption component 121.
In some other embodiment, since each vacuum slot 1212 is adjustable to the vacuum adsorption force of protective film 100
It saves, it is adjustable solid when drawing protective film 100 in transshipment acitivity 12, and protective film 100 being transported to 200 top of electronic equipment
The vacuum slot 1212 of neighbouring first end 114 becomes positive pressure by negative pressure on fixed board 1213, so that protective film 100 is in gas pressure intensity
Under the action of can directly be pushed to electronic equipment 200, to realize that protective film 100 is partially disengaged in vacuum film adsorption component 121.
It is the schematic front view of film pasting mechanism 13 in Fig. 1 refering to Fig. 6, Fig. 6.
The film pasting mechanism 13 of the application can along electronic equipment 200 to attachment film surface 201 from the of load carrier 11
One end 114 is moved to second end 115 so that protective film 100 be attached at electronic equipment 200 to attachment film surface 201.
Wherein, film pasting mechanism 13 includes the second actuator 131 and idler wheel 132, and idler wheel 132 and the second actuator 131 are driven
Connection, idler wheel 132 can be moved to the from the first end 114 of load carrier 11 to attachment film surface 201 along electronic equipment 200
Two ends 115 so that protective film 100 be attached at electronic equipment 200 to attachment film surface 201.
Protective film 100 be partially disengaged in vacuum film adsorption component 121 and part be attached at electronic equipment 200 to pad pasting table
After face 201, idler wheel 132 under the driving of the second actuator 131 along electronic equipment 200 to attachment film surface 201 from carrying
The first end 114 of mechanism 11 is moved to the rolling of second end 115.Under the rolling effect of idler wheel 132, protective film 100 and electronics
Equipment 200 is contacted to attachment film surface 201 (such as display screen), and gas is extruded, and between protective film 100 and electronic equipment 200
Generate silica gel Electrostatic Absorption so that protective film 100 be attached at electronic equipment 200 to attachment film surface 201.
Optionally, 132 surface of idler wheel is provided with protective pad or cushion (not shown), so that idler wheel 132 and guarantor
It is flexible contact between cuticula 100 and electronic equipment 200, to avoid occurring during carrying out pad pasting to electronic equipment 200
It damages or scratches.
It is the schematic front view of Tu1Zhong auxiliary body 14 refering to Fig. 7 to Fig. 8, Fig. 7 jointly, Fig. 8 is Tu1Zhong auxiliary body
14 schematic top plan view.
During actual pad pasting, pad pasting 100 can be first gradually disengaged with transshipment acitivity 12, then in the work of film pasting mechanism 13
It is gradually bonded with electronic equipment 200 to attachment film surface 201 under, to complete pad pasting.But when idler wheel 132 is rolled into guarantor
When 100 end of cuticula (second end 115 that is to say load carrier 11), as shown in fig. 7, not being attached at due to protective film 100
Length of the part to attachment film surface 201 of electronic equipment 200 on 132 direction of travel of idler wheel is too short, so that 100 nothing of protective film
Method, which continues to be transported mechanism 12, to be sucked, and is caused 100 end of protective film to fall in advance and is optionally attached at electronic equipment naturally
200 to attachment film surface 201, cause to occur bubble between protective film 100 and electronic equipment 200 and can not be discharged, so not only
Pad pasting quality is influenced, also results in and does over again, reduces pad pasting efficiency.
The auxiliary body 14 of the application is set to the second end 115 of load carrier 11, in protective film 100 and conveyance
Structure 12 desorbs state, and film pasting mechanism 13 do not make protective film 100 be attached at electronic equipment 200 to attachment film surface 201
When, protective film 100 can not fall to electronic equipment 200 to attachment film surface 201, as shown in Figure 7.
Desorbing state and can refer in the present embodiment: the vacuum between vacuum film adsorption component 121 and protective film 100 is inhaled
Attached power size is less than or equal to the case where self gravity size of protective film 100.In some other embodiment, shape is desorbed
State can also refer to: the case where vacuum adsorption force size between vacuum film adsorption component 121 and protective film 100 is zero；Alternatively, vacuum
The case where adsorption capacity becomes positive pressure from negative pressure.
Wherein, auxiliary body 14 includes compressed gas generator 141 and at least one compressed gas nozzle 142, compressed gas
Body generator 141 is for generating compressed gas, the second end setting of the corresponding load carrier 11 of at least one compressed gas nozzle 142
116 and for spraying compressed gas, so that compressed gas can blow afloat protective film 100.
Optionally, compressed gas generator 141 is sprayed at least one compressed gas respectively by independent pipeline and valve
Mouth 142 individually connects, so that the current rate for the compressed gas that each compressed gas nozzle 142 sprays is adjustable, thus
Increase the flexibility and reliability of auxiliary body 14.In some other embodiment, at least one gas compression nozzle 142 passes through
The mode of public one or more pipeline and valve is connect with compressed gas generator 141, to simplify the knot of auxiliary body 14
Structure.
Optionally, compressed gas nozzle 142 is flexibly connected with load carrier 11, so that the injection direction of compressed gas can
It adjusts.For example, the injection direction and electronic equipment 200 of compressed gas to the angle between attachment film surface 201 are θ, such as Fig. 7 institute
Show, and 45 °≤θ≤90 °, so that auxiliary body 14 can effectively blow afloat protective film 100.In some other embodiment
In, the range of angle theta may be 0 °≤θ≤45 °, can equally obtain good auxiliaring effect.
Optionally, the current rate for the compressed gas that compressed gas nozzle 142 sprays is adjustable, so that compressed gas
Current rate is less than or equal to protective film 100 with electronic equipment 200 to be bonded intensity between attachment film surface 201, to make
Protective film 100 has been attached at the part to attachment film surface 201 of electronic equipment 200 and will not have been blown afloat.Further, it compresses
The current rate of gas must also be greater than or equal to protective film 100 not be attached at also electronic equipment 200 to attachment film surface 201
Partial self weight, so that compressed gas can blow afloat protective film 100.
It is the method for adhering film to attachment film surface provided by the present application that protective film is attached to electronic equipment refering to Fig. 9, Fig. 9
The flow diagram of first embodiment.
The method for adhering film of the present embodiment includes:
Step S201: electronic equipment is placed in load carrier.
This step S201 can be understood in conjunction with Fig. 1 and Fig. 2.Specifically, electronic equipment 200 is placed in loading plate 111
The accommodating area 113 that multiple limited posts 112 are surrounded and formed is gone up, electronic equipment 200 is fixed and be positioned.At this point, electronics
Equipment 200 to attachment film surface 201 far from loading plate 111.
Step S202: transshipment acitivity draws protective film, and protective film is transported to above electronic equipment.
This step S202 can be understood in conjunction with Fig. 3 to Fig. 5.Specifically, in actual production process, protective film
100 may be stored in the preset regions of neighbouring coating system 10 in advance.Transshipment acitivity 12 is moved to the preset regions first, and inhales
It goes bail for cuticula 100；Then be moved to the top of load carrier 11, that is to say 200 top of electronic equipment so that protective film 100 from
Preset regions are transferred to 200 region of electronic equipment.
Optionally, protective film 100 is drawn in transshipment acitivity 12, and protective film 100 is transported to 200 top of electronic equipment
Afterwards, the demoulding component 122 in transshipment acitivity 12 enables to protective film 100 to be partially disengaged in vacuum film adsorption component 121 and part
Be attached at electronic equipment 200 to attachment film surface 201, to realize that the pre- of protective film 100 is sticked.
Step S203: film pasting mechanism is moved to second from the first end of load carrier to attachment film surface along electronic equipment
End so that protective film be attached at electronic equipment to attachment film surface.
This step S203 can be understood in conjunction with Fig. 6.Specifically, it is partially disengaged in protective film 100 in vacuum film adsorption group
Part 121 and be partially attached at electronic equipment 200 to attachment film surface 201 after, idler wheel 132 in film pasting mechanism 13 drives second
Is moved to from the first end 114 of load carrier 11 to attachment film surface 201 along electronic equipment 200 under the driving of moving part 131
Two ends 115 roll.Under the rolling effect of idler wheel 132, protective film 100 and electronic equipment 200 to attachment film surface 201 (such as
Display screen) contact, gas is extruded, and silica gel Electrostatic Absorption is generated between protective film 100 and electronic equipment 200, so that
Protective film 100 be attached at electronic equipment 200 to attachment film surface 201.
Step S204: state is desorbed in protective film and transshipment acitivity, and film pasting mechanism is not attached at protective film
Electronic equipment when attachment film surface, auxiliary body enable to protective film do not fall to electronic equipment to attachment film surface.
This step S204 can be understood in conjunction with Fig. 7 and Fig. 8.Specifically, during actual pad pasting, pad pasting 100
It can be first gradually disengaged with transshipment acitivity 12, then gradually with electronic equipment 200 to attachment film surface under the action of film pasting mechanism 13
201 fittings, to complete pad pasting.But (it that is to say the second of load carrier 11 when idler wheel 132 is rolled into 100 end of protective film
When holding 115), since the part to attachment film surface 201 for not being attached at electronic equipment 200 of protective film 100 is advanced in idler wheel 132
Length on direction is too short, so that protective film 100 can not continue to be transported mechanism 12 and be sucked, 100 end of protective film is caused to shift to an earlier date
Fall and be optionally attached at naturally electronic equipment 200 to attachment film surface 201, lead to protective film 100 and electronic equipment 200
Between there is bubble and can not be discharged.100 end of protective film is blown afloat by spraying compressed gas in the auxiliary body 14 of the application,
Can be effectively prevented from 100 end of protective film fall in advance electronic equipment 200 to attachment film surface 201, to prevent from protecting
Trapped gas between film 100 and electronic equipment 200, and then improve pad pasting quality and pad pasting efficiency.
The foregoing is merely the section Examples of the application, are not intended to limit the protection scope of the application, all utilizations
Equivalent device made by present specification and accompanying drawing content or equivalent process transformation are applied directly or indirectly in other correlations
Technical field, similarly include in the scope of patent protection of the application.
Claims (10)
1. a kind of coating system, for by protective film be attached at electronic equipment to attachment film surface, which is characterized in that the pad pasting
System includes:
Load carrier, for carrying the electronic equipment；
Transshipment acitivity, for drawing the protective film, and for the protective film to be transported to above the electronic equipment；
Film pasting mechanism can be moved to second from the first end of the load carrier to attachment film surface along the electronic equipment
End so that the protective film be attached at the electronic equipment to attachment film surface；And
Auxiliary body is set to the second end of the load carrier, inhales for releasing in the protective film and the transshipment acitivity
Attached state, and the film pasting mechanism do not make the protective film be attached at the electronic equipment when attachment film surface, the guarantor
Cuticula can not fall to the electronic equipment to attachment film surface.
2. coating system according to claim 1, which is characterized in that the auxiliary body include compressed gas generator and
At least one compressed gas nozzle, the compressed gas generator is for generating compressed gas, at least one described compressed gas
The second end that nozzle corresponds to the load carrier is arranged and is used to spray the compressed gas, so that the compressed gas can
The protective film is blown afloat.
3. coating system according to claim 2, which is characterized in that the injection direction of the compressed gas and the electronics
Equipment is θ to the angle between attachment film surface, and 45 °≤θ≤90 °.
4. coating system according to claim 2, which is characterized in that the current rate of the compressed gas is less than or equal to
The protective film is with the electronic equipment to be bonded intensity between attachment film surface.
5. coating system according to claim 1, which is characterized in that the transshipment acitivity includes vacuum film adsorption component and takes off
Membrane module, the vacuum film adsorption component include vacuum generator and multiple vacuum slots, and the vacuum generator can for generating
The vacuum adsorption force of adjusting, the multiple vacuum slot array are arranged to draw the protective film, and the demoulding component is adjacent to institute
State load carrier first end setting, for so that the protective film be partially disengaged in the vacuum film adsorption component and part be sticked
In the electronic equipment to attachment film surface.
6. coating system according to claim 5, which is characterized in that the demoulding component includes the first actuator and pushes away
Block, the pushing block and first actuator are sequentially connected, and the pushing block can be moved towards the load carrier, will be described
Protective film is pushed into the electronic equipment from the vacuum film adsorption component.
7. coating system according to claim 1, which is characterized in that the film pasting mechanism includes the second actuator and rolling
Wheel, the idler wheel and second actuator are sequentially connected, and the idler wheel can be along the electronic equipment to attachment film surface
Be moved to second end from the first end of the load carrier so that the protective film be attached at the electronic equipment to pad pasting
Surface.
8. coating system according to claim 1, which is characterized in that the load carrier includes loading plate and multiple limits
Column, the multiple limited post stand on the same face of the loading plate and around forming at least one accommodating area, it is described at least one
Accommodating area is for accommodating the electronic equipment.
9. coating system according to claim 8, which is characterized in that the position-adjustable of the multiple limited post, with suitable
Answer the variation of the structure size of the electronic equipment.
10. a kind of method for adhering film to attachment film surface that protective film is attached to electronic equipment, which is characterized in that the pad pasting side
Method includes:
Electronic equipment is placed in load carrier；
Transshipment acitivity draws protective film, and the protective film is transported to above the electronic equipment；
Film pasting mechanism is moved to second end from the first end of the load carrier to attachment film surface along the electronic equipment, with
So that the protective film be attached at the electronic equipment to attachment film surface；
State is desorbed in the protective film and the transshipment acitivity, and the film pasting mechanism does not make the protective film be sticked
In the electronic equipment when attachment film surface, the auxiliary body enables to the protective film not fall to the electronics to set
It is standby to attachment film surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201910147693.XA CN109795100A (en) | 2019-02-27 | 2019-02-27 | Coating system and method for adhering film |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910147693.XA CN109795100A (en) | 2019-02-27 | 2019-02-27 | Coating system and method for adhering film |
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| CN201910147693.XA Pending CN109795100A (en) | 2019-02-27 | 2019-02-27 | Coating system and method for adhering film |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110641003A (en) * | 2019-09-10 | 2020-01-03 | Oppo（重庆）智能科技有限公司 | Film pasting system and film pasting method |
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|---|---|---|---|---|
| CN107553891A (en) * | 2017-10-26 | 2018-01-09 | 江苏唯侓机器人科技有限公司 | A kind of automatic joint device of electronic product surface protection film |
| CN108748967A (en) * | 2018-05-22 | 2018-11-06 | Oppo广东移动通信有限公司 | Film sticking apparatus and method for adhering film |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110641003A (en) * | 2019-09-10 | 2020-01-03 | Oppo（重庆）智能科技有限公司 | Film pasting system and film pasting method |
| CN110641003B (en) * | 2019-09-10 | 2021-09-07 | Oppo（重庆）智能科技有限公司 | Film pasting system and film pasting method |
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