CN109794664B - Soldering tin propelling and sucking multipurpose device based on single chip microcomputer - Google Patents
Soldering tin propelling and sucking multipurpose device based on single chip microcomputer Download PDFInfo
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- CN109794664B CN109794664B CN201910164513.9A CN201910164513A CN109794664B CN 109794664 B CN109794664 B CN 109794664B CN 201910164513 A CN201910164513 A CN 201910164513A CN 109794664 B CN109794664 B CN 109794664B
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- 238000005476 soldering Methods 0.000 title claims abstract description 40
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 26
- 238000003466 welding Methods 0.000 claims abstract description 33
- 238000000034 method Methods 0.000 claims abstract description 12
- 239000003990 capacitor Substances 0.000 claims description 28
- 229910000679 solder Inorganic materials 0.000 claims description 20
- 238000007664 blowing Methods 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 239000013078 crystal Substances 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 101100339482 Colletotrichum orbiculare (strain 104-T / ATCC 96160 / CBS 514.97 / LARS 414 / MAFF 240422) HOG1 gene Proteins 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000004891 communication Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000012840 feeding operation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a multipurpose device for pushing and sucking soldering tin based on a single chip microcomputer, which comprises a barrel, an air pump and a single chip microcomputer control unit, wherein one end of the barrel is communicated with the air pump, the other end of the barrel is provided with a needle seat, the barrel is sleeved with a control mechanism, and the control mechanism and a driver on the air pump are both connected with the single chip microcomputer control unit; when the multipurpose device is used as a soldering tin propelling device, the needle head is arranged on the cylinder body. The multipurpose device well solves the problems that the tin supply of the welding spot welding pad is difficult to control, the virtual welding is difficult to carry out and the like in the manual pcb welding process, can effectively shorten the time for manually welding the pcb, improves the welding efficiency, and provides a plurality of convenience for small-batch welding.
Description
Technical Field
The invention belongs to the technical field of welding equipment, relates to a soldering tin propelling and sucking device of a surface mounting technology, and particularly relates to a soldering tin propelling and sucking multipurpose device based on a single chip microcomputer.
Background
The surface mounting technology is an electronic mounting technology for mounting various electronic components on a printed circuit board or a substrate, and is one of key technologies for realizing the development of electronic products to high integration, high reliability, high precision and low cost. Among the technologies related to the surface mounting technology, the soldering technology is the core technology of the surface mounting technology, along with the development of the technology, especially the application of technologies such as reflow soldering and the like, the used soldering paste is high in use amount and high in requirement, and particularly bubbles cannot be left in the soldering paste, otherwise, the bubbles can be coated on the welding spot positions in the use process, the phenomenon of missing soldering or poor soldering occurs, meanwhile, although the application of a steel mesh in the large-scale flow soldering operation can effectively and high-speed precisely smear the soldering paste on a PCB (Printed Circuit Board printed circuit board), compared with the PCB produced in batch, the problem of the soldering of PCB electronic chips manufactured in small batch and personal production cannot be avoided, and the method is time-consuming and labor-consuming, low in precision, difficult to control and vision-impaired; in addition, in the process of welding the circuit board, the problem that the solder is too much is unavoidable, especially for chips with a plurality of pins and dense distribution, the problem that the circuit function detection cannot pass due to the fact that the excessive solder is light, the problem is difficult to find out, the circuit is short-circuited due to time and labor consumption, the chip is burnt out, unnecessary resource waste is caused, the current mainstream solution is to suck out the excessive solder by using a solder suction device or a copper braided wire, and the two modes are needed to purchase related devices for use, so that the cost is increased.
Patent application "an automatic syringe type propeller and its application method" (application number 201810239424.1, publication number CN108313541A, publication date 2018.07.24) discloses a syringe type propeller, its barrel structure is too complicated, is unfavorable for the combined installation of production and processing and later stage, and the electric motor, automatic gas generator, power etc. mechanism that the barrel is inside and upper portion installation increase manufacturing cost, also increased the whole weight of barrel simultaneously, influence the use flexibility of propeller, and most importantly, this syringe type propeller only is applicable to automatically controlled flow, can't solve the problem that manual welding used.
Disclosure of Invention
The invention aims to provide a soldering tin pushing and sucking multipurpose device based on a singlechip, which can effectively simplify the process of manually welding pcb, reduce welding time and improve welding efficiency.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows: a multi-purpose device for propelling and sucking soldering tin based on a single chip microcomputer comprises a barrel, a needle head, an air pump and a single chip microcomputer control unit, wherein one end of the barrel is communicated with the air pump, a needle seat is arranged at the other end of the barrel, a control mechanism is sleeved on the barrel, and the control mechanism and a driver on the air pump are connected with the single chip microcomputer control unit; when the multipurpose device is used as a soldering tin propelling device, the needle head is arranged on the cylinder body.
The multipurpose device uses the singlechip as a main control chip controller and uses the air pump capable of setting the air feeding direction and the air flow. The method comprises the steps of realizing quantitative supply of soldering tin paste, guiding the soldering tin paste into a cylinder, selecting a needle head with proper thickness and proper shape according to the actual requirement of the size of a welding spot, plugging a rubber piston, and starting tin feeding operation by pressing a first button through a button switch which can be conveniently detached; under the condition that the cylinder body is empty (namely, the piston is taken out from the shell), the state of the air pump is switched to be an air suction state through a button switch which can be conveniently detached, the solder is sucked, then the position where the redundant solder is required to be sucked is aligned, and the solder soldering iron can start solder sucking operation by pressing a button one after heating.
The multipurpose device is easy to operate manually, can control the tin feeding amount, well solves the problem that the tin feeding of a welding spot welding pad is difficult to control in the manual pcb welding process, and simultaneously reduces the series of problems such as cold joint and the like. The multipurpose device can effectively shorten the time for manually welding the pcb, improve the welding efficiency, provide a plurality of convenience for small-batch welding, and has various purposes, simple structure and lower cost.
Drawings
Fig. 1 is a schematic view of a multi-purpose device of the present invention.
Fig. 2 is a schematic view of a cartridge in the multi-purpose device of the present invention.
FIG. 3 is a schematic view of a needle set that may be used in the multi-purpose device of the present invention.
Fig. 4 is a schematic view of a control mechanism in the multi-purpose device of the present invention.
Fig. 5 is a schematic circuit diagram of a single chip microcomputer control unit in the multipurpose device of the present invention.
In the figure: 1. the air hose comprises an air hose, a sealing cylinder cover, a cylinder body, a control mechanism, a main control switch, a needle, a first button, a second button, a communication wire, an air pump port, an air pump, a single chip microcomputer control unit, an air pump power cord, a casing, a piston, a needle seat, a rear cover, a mounting plate, a cross beam, a flexible belt, a magic tape and a driver.
Detailed Description
The invention is described in further detail below with reference to the drawings and the detailed description.
As shown in fig. 1, the multipurpose device comprises a cylinder 3, a needle 6, an air pump 11 and a singlechip control unit 12, wherein one end of the cylinder 3 is provided with an air inlet which is communicated with an air pump air port 10 on the air pump 11 through an air hose 1, the other end of the cylinder 3 is provided with the needle 6, the cylinder 3 is sleeved with a control mechanism 4, the control mechanism 4 is connected with the singlechip control unit 12 through a communication wire 9, and a driver 22 on the air pump 11 is connected with the singlechip control unit 12.
The driver 22 employs a portable vacuum pump.
As shown in fig. 2, the cylinder 3 in the multipurpose device comprises a barrel-shaped shell 14, a barrel-shaped needle seat 16 is arranged on an end cover of the shell 14, an inner hole of the needle seat 16 is communicated with the inside of the shell 14, external threads are machined on the outer wall of the needle seat 16, a piston 15 made of rubber capable of moving along the inner wall of the shell 14 is arranged in the shell 14, a barrel-shaped rear cover 17 is arranged at an opening end of the shell 14, the rear cover 17 is in threaded connection with the shell 14, and the end cover of the rear cover 17 is fixedly connected with one end of the gas hose 1.
When the piston 15 reciprocates in the housing 14, if the length of the piston 15 itself is too short, the piston 15 is easily angularly offset when moving in the housing 14, and normal movement of the piston cannot be realized, and the piston 15 with a proper length can effectively avoid such problems. Thus, the length of the piston 15 is greater than the inner diameter of the housing 14.
The needle heads 6 are arranged on the needle seat 16, the size, the number and the shape of the needle heads 6 can be customized according to different requirements of specific pcb welding spots and welding pads and different operation habits of users, and standardized production and manufacturing can be realized; thus, there are a series of needles 6 of different shapes, as shown in fig. 3, one end of the needle 6 is screwed with the needle holder 16, and the other end of the different needles 6 is different in size and shape, and may be a pointer tube or a curved needle tube.
After the needle seat 16 is in threaded connection with the needle 6, the air tightness of the cylinder 3 can be enhanced.
As shown in fig. 4, the control mechanism 4 in the multipurpose device comprises a mounting plate 18 and two cross beams 19, wherein a first button 7 and a second button 8 are arranged on the mounting plate 18, two sides of the mounting plate 18 are fixedly connected with one cross beam 19 respectively, two ends of the cross beam 19 are fixedly connected with the mounting plate 18 through connecting rods, a gap is reserved between the cross beam 19 and the mounting plate 18, one end of an elastic band 20 penetrates into the gap between one cross beam 19 and the mounting plate 18, after the end of the elastic band 20 bypasses the cross beam 19, the elastic band 20 is stitched with the end of the elastic band 20, namely, a sleeve is formed at the end of the elastic band 20, the sleeve is sleeved on the cross beam 19, a magic tape 21 is stitched at the other end of the elastic band 20, the mounting plate 18 is placed on the outer wall of the shell 14, one end of the elastic band 20 stitched with the magic tape 21 bypasses the shell 14, penetrates into the gap between the other cross beam 19 and the mounting plate 18, and the magic tape 21 is pasted after bypassing the other cross beam 19.
The first button 7 and the second button 8 are connected with a singlechip control unit 12 through communication wires 9.
As shown in fig. 5, the single-chip microcomputer control unit 12 in the multipurpose device of the invention comprises a first chip U1, wherein the first chip U1 adopts a PIC16F877A single-chip microcomputer; the VSS pin of the first chip U1 is respectively connected with one end of the first capacitor C1, one end of the second capacitor C2 and one end of the third capacitor C3, and the VDD pin of the first chip U1, the other end of the first capacitor C1, the other end of the second capacitor C2 and the other end of the third capacitor C3 are grounded; the RC2 pin and the RC3 pin of the first chip U1 are both connected with the driver 22, the RC1 pin of the first chip U1 is connected with one end of a second resistor R2, one end of a second key K2 at the other end of the second resistor R2 and one end of a seventh capacitor C7 are both connected with a power supply VDD, the other end of the second key K2 and the other end of the seventh capacitor C7 are grounded, the RC0 pin of the first chip U1 is connected with one end of the first resistor R1, the other end of the first resistor R1, one end of the first key K1 and one end of a sixth capacitor C6 are both connected with the power supply VDD, and the other end of the first key K1 and the other end of the sixth capacitor C6 are grounded; the OSC1/CLKOUT pin of the first chip U1 is connected with one end of the crystal oscillator Y and one end of the fourth capacitor C4, the OSC2/CLKOUT pin of the first chip U1 is connected with the other end of the crystal oscillator Y and one end of the fifth capacitor C5, and the other end of the fourth capacitor C4 and the other end of the fifth capacitor C5 are grounded.
The first key K1 is a first button 7, and the second key K2 is a second button 8.
The first chip U1 receives the control level signal command input by the first key K1 and the second key K2, and outputs the level signal from the pins RC2 and RC3 to control the driver 22, and the working voltage of the air pump is 220V, and the working voltage of the first chip U1 is 3.3V-5V, so that the output signal of the first chip can realize the control of the air pump 11 only through one driver 22.
The first button 7 is used for controlling the starting and stopping of the air pump 11, when the first button 7 is not released, the air pump 11 is in a continuous working state (i.e. continuously inhaling or blowing), and when the first button 7 is released again after being pressed, the air pump 11 stops working.
The second button 8 is used for controlling the air flow direction of the air pump 11, namely, the second button 8 is pressed down, and the air pump 11 is in an air blowing state; if the second button 8 is pressed continuously, the air pump 11 is in the suction state.
When the first button 7 and the second button 8 are used together, the air pump 11 is in a continuous air suction state or a continuous air blowing state. The second button 8 is pressed once, and the first button 7 is pressed again without releasing, so that the air pump 11 is in a continuous air suction state; if the second button 8 is pressed twice continuously, the first button 7 is pressed again without being released, and the air pump 11 is in a continuous blowing state.
The multipurpose device has two functions of soldering tin pushing and soldering tin sucking. When the device is used as a soldering tin propelling device, firstly, a needle head 6 with corresponding thickness and shape is selected according to different PCB soldering points, and the selected needle head 6 is arranged on a needle seat 16; the rear cap 17 is unscrewed, the piston 15 is taken out of the housing 14, a proper amount of solder paste is injected into the housing 14, then the piston 15 is put into the housing 14, and the rear cap 17 is screwed on the housing 14, thereby completing the filling of the solder paste. The air pump power line 13 is connected with a power supply. The second button 8 is pressed down to confirm that the working state of the air pump 11 is switched into the blowing state, then the first button 7 is pressed for a long time, the air flow output by the air pump 11 enters the shell 14 through the air hose 1, the piston 15 is pushed to move towards the needle seat 16, the soldering paste in the shell 14 is pushed to move towards the needle seat 16 in the moving process of the piston 15, the soldering paste enters the needle 6 through the inner hole of the needle seat 16 and flows out from the outlet of the needle 6, after a certain amount of soldering paste flows out of the needle 6, the first button 7 is released, and at the moment, the air pump 11 stops working (in this way, redundant air in the shell 14 can be discharged, and the occurrence of cold joint in the welding process caused by the formation of air bubbles in the subsequent pushing process of the soldering paste is avoided). Then, the first button 7 is pressed for a long time, the air pump 11 is started, the air pump 11 is still in an air blowing state, the outlet of the needle 6 is aligned to a position to be welded, the time for pressing the first button 7 for a long time is controlled according to the required length of a welding point, the cylinder 3 is moved until the solder paste is uniformly filled on the welding point of the PCB, the first button 7 is loosened (the quantitative supply of the solder paste can be realized by controlling the time for pressing the first button 7 for a long time), and the air pump 11 stops working to finish welding.
When used as a solder pick-up device, the needle 6 and the back cover 17 are removed, the piston 15 is removed from the housing 14, and the back cover 17 is screwed onto the housing 14, with no piston 15 in the housing 14. The air pump power line 13 is used for switching on the power supply, the two second buttons 8 are pressed down to confirm that the working state of the air pump 11 is switched into the air suction state, the first button 7 is pressed down for a long time, the needle seat 16 is aligned with the welding spot to be cleaned, the soldering iron is aligned with the welding spot to be heated, and molten soldering tin is sucked and removed.
The air pump power line 13 is connected with a common 220V voltage to supply power to the air pump 11, and the air pump 11 is provided with a rotary switch for adjusting the air flow.
Claims (2)
1. The utility model provides a multi-purpose device of soldering tin impels, soldering tin absorbs based on singlechip, its characterized in that includes barrel (3), syringe needle (6), air pump (11) and singlechip control unit (12), and the one end of barrel (3) communicates with air pump (11), and the other end of barrel (3) is equipped with needle file (16), has control mechanism (4) on barrel (3) cover, and control mechanism (4) and air pump (11) are last driver (22) all with singlechip control unit (12); when the multipurpose device is used as a soldering tin propelling device, a needle head (6) is arranged on a cylinder body (3);
The cylinder body (3) comprises a barrel-shaped shell (14), a barrel-shaped needle seat (16) is arranged on an end cover of the shell (14), an inner hole of the needle seat (16) is communicated with the inside of the shell (14), an external thread is processed on the outer wall of the needle seat (16), a piston (15) capable of moving along the inner wall of the shell (14) is arranged in the shell (14), a barrel-shaped rear cover (17) is arranged at an opening end of the shell (14), the rear cover (17) is in threaded connection with the shell (14), the end cover of the rear cover (17) is fixedly connected with one end of a gas hose (1), and the other end of the gas hose (1) is communicated with an air pump (11); when the multipurpose device is used as a soldering tin propelling device, a needle head (6) is arranged on a needle seat (16);
The control mechanism (4) comprises a mounting plate (18) and two cross beams (19), wherein a first button (7) and a second button (8) are arranged on the mounting plate (18), two sides of the mounting plate (18) are fixedly connected with one cross beam (19) respectively, two ends of the cross beam (19) are fixedly connected with the mounting plate (18) through connecting rods respectively, a gap is reserved between the cross beam (19) and the mounting plate (18), one end of an elastic band (20) penetrates into the gap between the cross beam (19) and the mounting plate (18), after bypassing the cross beam (19), the end of the elastic band (20) is stitched with the elastic band (20), the end of the elastic band (20) forms a sleeve pipe, the sleeve pipe is sleeved on the cross beam (19), the other end of the elastic band (20) is stitched with a magic tape (21), the mounting plate (18) is placed on the outer wall of a shell (14), one end of the elastic band (20) bypasses the shell (14) and then penetrates into the gap between the other cross beam (19) and the mounting plate (18), and after bypassing the other cross beam (19), the magic tape (21) is pasted; the first button (7) and the second button (8) are connected with the singlechip control unit (12);
The single chip microcomputer control unit (12) comprises a first chip (U1), and the first chip (U1) adopts a PIC16F877A single chip microcomputer; the VSS pin of the first chip (U1) is respectively connected with one end of the first capacitor (C1), one end of the second capacitor (C2) and one end of the third capacitor (C3), and the VDD pin of the first chip (U1), the other end of the first capacitor (C1), the other end of the second capacitor (C2) and the other end of the third capacitor (C3) are grounded; the RC2 pin and the RC3 pin of the first chip (U1) are both connected with the driver (22), the RC1 pin of the first chip (U1) is connected with one end of a second resistor (R2), the other end of the second resistor (R2), one end of a second key (K2) and one end of a seventh capacitor (C7) are both connected with a power supply VDD, the other end of the second key (K2) and the other end of the seventh capacitor (C7) are grounded, the RC0 pin of the first chip (U1) is connected with one end of the first resistor (R1), the other end of the first resistor (R1), one end of the first key (K1) and one end of a sixth capacitor (C6) are both connected with the power supply VDD, and the other end of the first key (K1) and the other end of the sixth capacitor (C6) are grounded; the OSC1/CLKOUT pin of the first chip (U1) is connected with one end of the crystal oscillator (Y) and one end of the fourth capacitor (C4), the OSC2/CLKOUT pin of the first chip (U1) is connected with the other end of the crystal oscillator (Y) and one end of the fifth capacitor (C5), and the other end of the fourth capacitor (C4) and the other end of the fifth capacitor (C5) are grounded;
When the device is used as a soldering tin propelling device, firstly, needles (6) with corresponding thickness and shape are selected according to different PCB soldering points, and the selected needles (6) are arranged on a needle seat (16); unscrewing the rear cover (17), taking out the piston (15) from the shell (14), injecting a proper amount of solder paste into the shell (14), then loading the piston (15) into the shell (14), and screwing the rear cover (17) on the shell (14) to finish the filling of the solder paste; connecting an air pump power line (13) with a power supply; pressing a second button (8) to switch the working state of the air pump (11) into an air blowing state, pressing the first button (7) for a long time, enabling air flow output by the air pump (11) to enter the shell (14) through the air hose (1), pushing the piston (15) to move towards the needle seat (16), pushing solder paste in the shell (14) to move towards the needle seat (16) in the moving process of the piston (15), enabling the solder paste to enter the needle head (6) through an inner hole of the needle seat (16) and flow out of an outlet of the needle head (6), and loosening the first button (7) after a certain amount of solder paste flows out of the needle head (6), wherein the air pump (11) stops working at the moment; then, the first button (7) is pressed for a long time, the air pump (11) is started, at the moment, the air pump (11) is still in an air blowing state, the outlet of the needle head (6) is aligned to a position to be welded, the time for pressing the first button (7) for a long time is controlled according to the required length of a welding point, the cylinder (3) is moved until solder paste is uniformly filled on the welding point of the PCB, the first button (7) is loosened, the air pump (11) stops working, and welding is completed;
when the device is used as a soldering tin sucking device, the needle (6) and the rear cover (17) are taken down, the piston (15) is taken out of the shell (14), and then the rear cover (17) is screwed on the shell (14), and at the moment, the piston (15) is not arranged in the shell (14); the air pump is powered on through an air pump power line (13), the second buttons (8) are pressed down to confirm that the working state of the air pump (11) is switched to an air suction state, the first buttons (7) are pressed down for a long time, the needle seat (16) is aligned with a welding spot to be cleaned, the soldering iron is aligned with the welding spot to be heated, and molten soldering tin is sucked and removed.
2. The multipurpose device for pushing and sucking solder based on single chip microcomputer according to claim 1, wherein the length of the piston (15) is larger than the inner diameter of the housing (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201910164513.9A CN109794664B (en) | 2019-03-05 | 2019-03-05 | Soldering tin propelling and sucking multipurpose device based on single chip microcomputer |
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| CN201910164513.9A CN109794664B (en) | 2019-03-05 | 2019-03-05 | Soldering tin propelling and sucking multipurpose device based on single chip microcomputer |
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| CN109794664B true CN109794664B (en) | 2024-06-14 |
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| CN117483902B (en) * | 2023-12-26 | 2024-07-16 | 天津卡雷尔机器人技术有限公司 | Constant thrust electric tin injector |
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| CN206139944U (en) * | 2016-10-20 | 2017-05-03 | 肇庆市小凡人科技有限公司 | Special intelligence of robot welding is welded and is inhaled dual -purpose electric iron |
| CN108381002A (en) * | 2018-04-28 | 2018-08-10 | 蒋春霞 | A kind of soldering tin jet device |
| CN209664515U (en) * | 2019-03-05 | 2019-11-22 | 西北师范大学 | A kind of device for reducing rosin joint and improving welding efficiency |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5350282A (en) * | 1993-05-10 | 1994-09-27 | Ting Chi Hung | Pneumatic tin sucker |
| CN202367313U (en) * | 2011-12-21 | 2012-08-08 | 黄满 | Tin-sucking electric soldering iron |
| CN203649606U (en) * | 2013-12-20 | 2014-06-18 | 北京燕东微电子有限公司 | Electric tin absorbing device for electronic components |
| CN204339083U (en) * | 2014-11-12 | 2015-05-20 | 郑毅 | Multi-functional electric soldering iron |
| CN206241420U (en) * | 2016-12-05 | 2017-06-13 | 辽宁工程技术大学 | A kind of integrated soldering handle |
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2019
- 2019-03-05 CN CN201910164513.9A patent/CN109794664B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206139944U (en) * | 2016-10-20 | 2017-05-03 | 肇庆市小凡人科技有限公司 | Special intelligence of robot welding is welded and is inhaled dual -purpose electric iron |
| CN108381002A (en) * | 2018-04-28 | 2018-08-10 | 蒋春霞 | A kind of soldering tin jet device |
| CN209664515U (en) * | 2019-03-05 | 2019-11-22 | 西北师范大学 | A kind of device for reducing rosin joint and improving welding efficiency |
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