CN109781038A - A kind of method of selective laser sintering powdering thickness measurement and uniformity characterization - Google Patents
A kind of method of selective laser sintering powdering thickness measurement and uniformity characterization Download PDFInfo
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Abstract
The invention discloses a kind of measurement of selective laser sintering powdering thickness and the method for uniformity characterization, specific steps include two kinds of different the laser sintered of powder, test specimen cutting and cleaning, sinter layer thickness measure, sinter layer THICKNESS CALCULATION and powdering Evaluation for Uniformity etc.;Powders A and powder B are attached separately to the different powder feeding cylinder in left and right first, the multiple test specimens for carrying out laser sintered different direction are overlapped again, then the test specimen cleaned up is put under scanning electron microscope, it is sintered the measurement of thickness, powdering thickness is calculated by sintering thickness and sintering number, further according to the powdering thickness of different direction, powdering uniformity is characterized using standard deviation.The method of the present invention is simple and practical, can solve the problem of experimental field can not measure and calculate powdering thickness and its uniformity, is conducive to further study influence of the powder layer thickness to powdering quality.
Description
Technical field
It is a kind of selective laser sintering powdering thickness measurement and uniformity the present invention relates to selective laser sintering field
The method of characterization.
Background technique
Selective laser sintering is one kind of increases material manufacturing technology, its working principle is that: one is spread on moulding cylinder first
Layer dusty material, computerized control laser, according to interface profile information, is sintered to solid section powder, then constantly
Circulation, layer upon layer molding.Such forming method manufacturing process is simple, and flexibility is high, and material selection range is wide, material price
Low, utilization rate is high, and shaping speed is fast, thus using than wide.
But during thermal sintering, due to the poor fluidity or powdering technological parameter and forming parameters of powder
Match it is unreasonable, will lead to generate powder spreading property it is poor, sintering when generation warpage and hole, sintering after part be unable to satisfy ruler
The problem of very little precision and mechanical property requirements.Therefore, Proper Match powdering and forming parameters are to realize that powdering quality is controllable
And improve the effective way of sintered part consistency and mechanical property.It is existing due to the complexity of working environment and non-ease for operation
Technology and methods cannot still measure powdering thickness well, therefore how fast and convenient powdering thickness of measuring is to need to solve
Certainly the problem of.
Summary of the invention
To solve the above-mentioned problems, the present invention provides a kind of measurement of selective laser sintering powdering thickness and uniformity characterization
Method, be it is a kind of simple and practical, the measurement method of powdering thickness is convenient for measuring, for grinding for selective laser sintering powdering quality
Offer technical support is provided.
The present invention is achieved by following technical solution, a kind of selective laser sintering powdering thickness measurement and
The method of even property characterization, the specific steps are as follows:
(1) two kind of different powder it is laser sintered:
(a) sintering of powders A: powders A is first routed to moulding cylinder from powder feeding cylinder I with powdering roller I, is carried out continuously powdering
With sintering T times, and it is sintered M test specimen simultaneously;
(b) sintering of powder B: powder B is routed to moulding cylinder from powder feeding cylinder II with powdering roller II, in the M being sintered
Powdering and sintering T times are carried out continuously on a test specimen again;
(c) it overlaps repeatedly and carries out (a) (b), repeat n times;
(2) test specimen cutting and cleaning: after completion to be sintered, test specimen is taken out, by test specimen cutting along its length, and table
Face wiped clean;
(3) it measures sinter layer thickness and calculates the average sinter layer thickness of single test specimen: cleaned test specimen being put into and is swept
It retouches under electron microscope, recycles backscattered electron spectrum, measure W different location of single test specimen powders A single layer sinter layer
Thickness, such as i-th layer of j-th of position thickness, be denoted as Lij(i=1,2,3 ... N;J=1,2,3 ... W), calculate single test specimen
The average thickness of powders A single layer sinter layer, such as k-th of i-th layer of test specimen of average thickness, are denoted as Qki(k=1,2,3 ... M;I=1,
2,3 ... N) and single test specimen powders A sinter layer average thickness, such as average sintering thickness of k-th of test specimen is denoted as Rk, in which:
The average thickness of single test specimen powders A single layer sinter layer is (for i-th layer):
The average thickness of single test specimen powders A sinter layer is (by taking k-th of test specimen as an example):
Similarly: the thickness of i-th layer of j-th of position of single test specimen powder B is denoted as Pij(i=1,2,3 ... N;J=1,2,
3 ... W), k-th of i-th layer of test specimen of average thickness is denoted as Yki(k=1,2,3 ... M;I=1,2,3 ... N), k-th test specimen it is flat
Equal thickness is sintered thickness, is denoted as Uk, in which:
The average thickness of single test specimen powder B single layer sinter layer is (for i-th layer):
The average thickness of single test specimen powder B sinter layer is (by taking k-th of test specimen as an example):
(4) it calculates average sinter layer thickness: the data of each single test specimen being obtained according to the above measurement, the M of all sintering
The sinter layer average thickness of a test specimen carries out cumulative summation, be calculated identical sintering process parameter condition next time powdering when burning
The average thickness of layer is tied, and uses the numerical representation method powdering thickness, is denoted as V1And V2, in which:
(5) it analyzes the uniformity of powdering: mathematical derivation point is carried out to the average sinter layer thickness that all test specimen measurements obtain
Analysis, obtains the uniformity of test specimen powdering, using standard deviation S1And S2Characterization, in which:
The method of the above-mentioned a kind of measurement of selective laser sintering powdering thickness and uniformity characterization, it is characterised in that described
The step of (1) in powder be two different materials.
The method of the above-mentioned a kind of measurement of selective laser sintering powdering thickness and uniformity characterization, it is characterised in that described
The step of (1) in, T be carried out continuously powdering and sintering number, T >=10;The test specimen that M is while being sintered, M >=9;N is to hand over repeatedly
Folded sintering number, N >=3;Sintering process parameter remains unchanged during laser sintered.
The method of the above-mentioned a kind of measurement of selective laser sintering powdering thickness and uniformity characterization, it is characterised in that described
The step of (1) in M test specimen by equally distributed regular array in sintering zone.
The method of the above-mentioned a kind of measurement of selective laser sintering powdering thickness and uniformity characterization, it is characterised in that described
The step of (3) in, W is the different position number of every layer of sinter layer, W >=5, LijIt is W of single test specimen powders A single layer sinter layer
The thickness of different location, QkiFor the average thickness of single test specimen powders A single layer sinter layer, RkFor single test specimen powders A sinter layer
Average thickness;PijFor the thickness of W different location of single test specimen powder B single layer sinter layer, YkiFor single test specimen powder B
The average thickness of single layer sinter layer, UkFor the average thickness of single test specimen powder B sinter layer.
The method of the above-mentioned a kind of measurement of selective laser sintering powdering thickness and uniformity characterization, it is characterised in that described
The step of (3) in scanning electron microscope can observe surface of test piece powder sintered thickness of the same race.
The method of the above-mentioned a kind of measurement of selective laser sintering powdering thickness and uniformity characterization, it is characterised in that described
The step of (4), it is assumed that V1And V2Respectively laser sintered one layer of the average thickness of powders A and powder B and be used to characterize powdering thickness
Degree.
The method of the above-mentioned a kind of measurement of selective laser sintering powdering thickness and uniformity characterization, it is characterised in that described
The step of (5), with standard deviation S1And S2Characterize the uniformity of powdering, S1And S2The bigger expression powdering uniformity of value differ greatly,
S1> 0, S2>0。
The medicine have the advantages that the measurement method of thickness is convenient for measuring the present invention provides simple and practical, for selectivity
The research of laser sintered powdering quality provides technical support.
Detailed description of the invention
Fig. 1 is sintering schematic diagram.
Fig. 2 is sintering workspace top view.
Fig. 3 is single test specimen instrumentation plan.
Fig. 4 is the partial enlarged view in Fig. 3.
In figure: 1- powdering roller I, 2- powder feeding cylinder I, 3- moulding cylinder, 4- powder feeding cylinder II, 5- powdering roller.
Specific implementation method
A kind of method of selective laser sintering powdering thickness measurement and uniformity characterization, the specific steps are as follows:
(1) two kind of different powder it is laser sintered:
(a) sintering of powders A: powders A is first routed to moulding cylinder from powder feeding cylinder I with powdering roller I, is carried out continuously powdering
With sintering T times, and it is sintered M test specimen simultaneously;
(b) sintering of powder B: powder B is routed to moulding cylinder from powder feeding cylinder II with powdering roller II, in the M being sintered
Powdering and sintering T times are carried out continuously on a test specimen again;
(c) it overlaps repeatedly and carries out (a) (b), repeat n times;
(2) test specimen cutting and cleaning: after completion to be sintered, test specimen is taken out, by test specimen cutting along its length, and table
Face wiped clean;
(3) it measures sinter layer thickness and calculates the average sinter layer thickness of single test specimen: cleaned test specimen being put into and is swept
It retouches under electron microscope, recycles backscattered electron spectrum, measure W different location of single test specimen powders A single layer sinter layer
Thickness, such as i-th layer of j-th of position thickness, be denoted as Lij(i=1,2,3 ... N;J=1,2,3 ... W), calculate single test specimen
The average thickness of powders A single layer sinter layer, such as k-th of i-th layer of test specimen of average thickness, are denoted as Qki(k=1,2,3 ... M;I=1,
2,3 ... N) and single test specimen powders A sinter layer average thickness, such as average sintering thickness of k-th of test specimen is denoted as Rk, in which:
The average thickness of single test specimen powders A single layer sinter layer is (for i-th layer):
The average thickness of single test specimen powders A sinter layer is (by taking k-th of test specimen as an example):
Similarly: the thickness of i-th layer of j-th of position of single test specimen powder B is denoted as Pij(i=1,2,3 ... N;J=1,2,
3 ... W), k-th of i-th layer of test specimen of average thickness is denoted as Yki(k=1,2,3 ... M;I=1,2,3 ... N), k-th test specimen it is flat
Equal thickness is sintered thickness, is denoted as Uk, in which:
The average thickness of single test specimen powder B single layer sinter layer is (for i-th layer):
The average thickness of single test specimen powder B sinter layer is (by taking k-th of test specimen as an example):
(4) it calculates average sinter layer thickness: the data of each single test specimen being obtained according to the above measurement, the M of all sintering
The sinter layer average thickness of a test specimen carries out cumulative summation, be calculated identical sintering process parameter condition next time powdering when burning
The average thickness of layer is tied, and uses the numerical representation method powdering thickness, is denoted as V1And V2, in which:
(5) it analyzes the uniformity of powdering: mathematical derivation point is carried out to the average sinter layer thickness that all test specimen measurements obtain
Analysis, obtains the uniformity of test specimen powdering, using standard deviation S1And S2Characterization, in which:
Embodiment:
(1) two kind of different powder it is laser sintered:
(a) sintering of powders A: powders A is first routed to moulding cylinder from powder feeding cylinder I with powdering roller I, is carried out continuously powdering
With sintering 10 times, and simultaneously be sintered 9 test specimens;
(b) sintering of powder B: powder B is routed to moulding cylinder from powder feeding cylinder II with powdering roller II, in 9 be sintered
Powdering and sintering 10 times are carried out continuously on a test specimen again;
(c) it overlaps repeatedly and carries out (a) (b), be repeated 3 times;
(2) test specimen cutting and cleaning: after completion to be sintered, test specimen is taken out, by test specimen cutting along its length, and table
Face wiped clean;
(3) it measures sinter layer thickness and calculates the average sinter layer thickness of single test specimen: cleaned test specimen being put into and is swept
It retouches under electron microscope, recycles backscattered electron spectrum, measure 5 different locations of the single test specimen single layer sinter layer of powders A
Thickness, obtain:
The average thickness of 1st test specimen powders A single layer sinter layer are as follows:
1st layer:
2nd layer:
10th layer:
The average thickness of 1st test specimen powders A sinter layer are as follows:
And so on:
The average thickness of 9th test specimen powders A single layer sinter layer are as follows:
1st layer:
2nd layer:
10th layer:
The average thickness of 9th test specimen powders A single layer sinter layer are as follows:
Similarly:
1st test specimen powder B single layer sinter layer average thickness are as follows: the 1st layer:
2nd layer:
10th layer:
The average thickness of 1st test specimen powder B sinter layer are as follows:
And so on:
9th test specimen powder B single layer sinter layer average thickness are as follows:
1st layer:
2nd layer:
10th layer:
The average thickness of 9th test specimen powder B sinter layer are as follows:
(4) it calculates average sinter layer thickness: the data of each single test specimen being obtained according to the above measurement, the 9 of all sintering
A test specimen carries out cumulative summation, sinter layer when powdering of powders A and powder B under the conditions of identical sintering process parameter is calculated
Average thickness, and use the numerical representation method powdering thickness, in which:
(5) it analyzes the uniformity of powdering: mathematical derivation point is carried out to the average sinter layer thickness that all test specimen measurements obtain
Analysis, obtains the uniformity of test specimen powdering, using standard deviation S1And S2Characterization are as follows:
Claims (8)
1. a kind of method of selective laser sintering powdering thickness measurement and uniformity characterization, which is characterized in that specific steps are such as
Under:
(1) two kind of different powder it is laser sintered:
(a) sintering of powders A: powders A is first routed to moulding cylinder from powder feeding cylinder I with powdering roller I, is carried out continuously powdering and burning
Knot T times, and it is sintered M test specimen simultaneously;
(b) powder B: being routed to moulding cylinder from powder feeding cylinder II with powdering roller II by the sintering of powder B, in M examination being sintered
Powdering and sintering T times are carried out continuously on part again;
(c) it overlaps repeatedly and carries out (a) (b), repeat n times;
(2) test specimen cutting and cleaning: after completion to be sintered, test specimen is taken out, by test specimen cutting along its length, and surface is wiped
It wipes clean;
(3) it measures sinter layer thickness and calculates the average sinter layer thickness of single test specimen: cleaned test specimen is put into scanning electricity
Under sub- microscope, backscattered electron spectrum is recycled, the thickness of W different location of single test specimen powders A single layer sinter layer is measured
Degree, such as thickness of i-th layer of j-th of position, are denoted as Lij(i=1,2,3 ... N;J=1,2,3 ... W), calculate single test specimen powders A
The average thickness of single layer sinter layer, such as k-th of i-th layer of test specimen of average thickness, are denoted as Qki(k=1,2,3 ... M;I=1,2,3 ...
N) and the average thickness of single test specimen powders A sinter layer, such as average sintering thickness of k-th of test specimen are denoted as Rk, in which:
The average thickness of single test specimen powders A single layer sinter layer is (for i-th layer):
The average thickness of single test specimen powders A sinter layer is (by taking k-th of test specimen as an example):
Similarly: the thickness of i-th layer of j-th of position of single test specimen powder B is denoted as Pij(i=1,2,3 ... N;J=1,2,3 ...
W), k-th of i-th layer of test specimen of average thickness, is denoted as Yki(k=1,2,3 ... M;I=1,2,3 ... N), the average thickness of k-th of test specimen
Degree sintering thickness, is denoted as Uk, in which:
The average thickness of single test specimen powder B single layer sinter layer is (for i-th layer):
The average thickness of single test specimen powder B sinter layer is (by taking k-th of test specimen as an example):
(4) it calculates average sinter layer thickness: the data of each single test specimen is obtained according to the above measurement, M examination of all sintering
The sinter layer average thickness of part carries out cumulative summation, be calculated identical sintering process parameter condition next time powdering when sinter layer
Average thickness, and use the numerical representation method powdering thickness, be denoted as V1And V2, in which:
(5) it analyzes the uniformity of powdering: mathematical derivation analysis being carried out to the average sinter layer thickness that all test specimen measurements obtain, is obtained
To the uniformity of test specimen powdering, using standard deviation S1And S2Characterization, in which:
。
2. the method for a kind of selective laser sintering powdering thickness measurement according to claim 1 and uniformity characterization,
The powder in step (1) described in being characterized in that is two different materials.
3. the method for a kind of selective laser sintering powdering thickness measurement according to claim 1 and uniformity characterization,
In step (1) described in being characterized in that, T is to be carried out continuously powdering and sintering number, T >=10;The test specimen that M is while being sintered, M >=
9;N is to overlap sintering number, N >=3 repeatedly;Sintering process parameter remains unchanged during laser sintered.
4. the method for a kind of selective laser sintering powdering thickness measurement according to claim 1 and uniformity characterization,
M test specimen is by equally distributed regular array in sintering zone in step (1) described in being characterized in that.
5. the method for a kind of selective laser sintering powdering thickness measurement according to claim 1 and uniformity characterization,
In step (3) described in being characterized in that, W is the different position number of every layer of sinter layer, W >=5, LijFor single test specimen powders A list
The thickness of W different location of layer sinter layer, QkiFor the average thickness of single test specimen powders A single layer sinter layer, RkIndividually to try
The average thickness of part powders A sinter layer;PijFor the thickness of W different location of single test specimen powder B single layer sinter layer, YkiFor
The average thickness of single test specimen powder B single layer sinter layer, UkFor the average thickness of single test specimen powder B sinter layer.
6. the method for a kind of selective laser sintering powdering thickness measurement according to claim 1 and uniformity characterization,
Scanning electron microscope can observe surface of test piece powder sintered thickness of the same race in step (3) described in being characterized in that.
7. the method for a kind of selective laser sintering powdering thickness measurement according to claim 1 and uniformity characterization,
It is characterized in that the step (4), it is assumed that V1And V2Respectively laser sintered one layer of the average thickness of powders A and powder B and it is used to
Characterize powdering thickness.
8. the method for a kind of selective laser sintering powdering thickness measurement according to claim 1 and uniformity characterization,
The step (5) is characterized in that, with standard deviation S1And S2Characterize the uniformity of powdering, S1And S2The bigger expression powdering of value it is equal
Even sex differernce is larger, S1> 0, S2>0。
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