CN109777306A - Electronic apparatus material becomes more adhesive, adhesive tape structure and its preparation process with heat - Google Patents
Electronic apparatus material becomes more adhesive, adhesive tape structure and its preparation process with heat Download PDFInfo
- Publication number
- CN109777306A CN109777306A CN201811653707.7A CN201811653707A CN109777306A CN 109777306 A CN109777306 A CN 109777306A CN 201811653707 A CN201811653707 A CN 201811653707A CN 109777306 A CN109777306 A CN 109777306A
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- CN
- China
- Prior art keywords
- adhesive
- electronic apparatus
- heat
- layers
- becomes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses electronic apparatus material heat to become more adhesive, it include: acrylate glue and plasticity curing agent, the weight percent of the acrylate glue formula includes: butyl acrylate 33~41%, acrylic acid hydroxyl second rouge 31~37%, ethyl acetate 2~6%, staple fibre 18~32%, acrylic copolymer resin 1~3%；The formula combination that the present invention passes through adhesive, so that the initial bonding strength of this use repeatly adhesive tape improves, in order to can be with use repeatly adhesive tape, about 60%~90% can be reduced compared with the peeling force at initial stage after placing according to temperature range (40~90 DEG C) process operation, improve the service life in splicing face.
Description
Technical field
The present invention relates to electronic apparatus technical fields, and in particular to a kind of electronic apparatus material heat change more adhesive, glue
Band structure and its preparation process.
Background technique
For electronic apparatus be not in glue-line seperator residue glue on the goods, materials and equipments of fitting the phenomenon that, classical repetitive uses adhesive tape
Initial bonding strength it is lower, and its room temperature (23 DEG C of about 30min~1H) place or exposure if will return to original peeling force.
Original peeling force refers to the common failure mode of gluing tieing, and when gluing junction is by external force, power is concentrated
The region of relatively narrower in joint, when this power is greater than the adhesive strength of conducting resinl, bonded joint is acted on just edge by peeling force
Splicing face destroy.
It would therefore be highly desirable to which a kind of electronic apparatus material becomes the appearance of more adhesive, adhesive tape structure and its preparation process with heat, lead to
The formula combination of adhesive is crossed, so that the initial bonding strength of this use repeatly adhesive tape improves, in order to press with use repeatly adhesive tape
About 60%~90% can be reduced compared with the peeling force at initial stage after placing according to temperature range (40~90 DEG C) process operation, improved
It is glued the service life in face.
Summary of the invention
In order to solve the above-mentioned technical problem, the invention proposes a kind of electronic apparatus material heat to become more adhesive, adhesive tape
Structure and its preparation process, by the formula combination of adhesive, so that the initial bonding strength of this use repeatly adhesive tape improves, in order to can
With use repeatly adhesive tape, can be dropped compared with the peeling force at initial stage after being placed according to temperature range (40~90 DEG C) process operation
Low about 60%~90%, improve the service life in splicing face.
In order to achieve the above object, technical scheme is as follows:
Electronic apparatus material becomes more adhesive with heat, comprising: acrylate glue and plasticity curing agent, the acrylate glue are matched
The weight percent of side includes: butyl acrylate 33~41%, acrylic acid hydroxyl second rouge 31~37%, ethyl acetate 2~6%, people
Make fiber 18~32%, acrylic copolymer resin 1~3%.
A kind of electronic apparatus material provided by the invention becomes more adhesive, adhesive tape structure and its preparation process with heat, passes through
The formula combination of this adhesive, so that the initial bonding strength of this use repeatly adhesive tape is higher, in order to be pressed with use repeatly adhesive tape
About 60%~90% can be reduced compared with the peeling force at initial stage after placing according to temperature range (40~90 DEG C) process operation, improved
It is glued the service life in face.
Based on the above technical solution, following improvement can also be done:
As a preferred option, electronic apparatus material becomes more adhesive with heat, comprising: acrylate glue and plasticity hardening
Agent, the weight percent of the acrylate glue formula include: butyl acrylate 33~37%, acrylic acid hydroxyl second rouge 31~34%,
Ethyl acetate 2~4%, staple fibre 18~25%, acrylic copolymer resin 1~2%.
As a preferred option, electronic apparatus material becomes more adhesive with heat, comprising: acrylate glue and plasticity hardening
Agent, the weight percent of the acrylate glue formula include: butyl acrylate 37~41%, acrylic acid hydroxyl second rouge 34~37%,
Ethyl acetate 4~6%, staple fibre 25~32%, acrylic copolymer resin 2~3%.
It as a preferred option, include: plasticiser and elastomer in the acrylic copolymer resin.
As a preferred option, the staple fibre is rosin.
As a preferred option, electronic apparatus material becomes more adhesive adhesive tape structure with heat, comprising: one layer, two layers, three layers
Or four layers or more transparent poly terephthalic acid class plastics peeling liner bed courses, when transparent poly terephthalic acid class plastics peeling liner bed course
When being two layers or more, this two layers perpendicular symmetrically arranged transparent poly terephthalic acid class plastics peeling liner bed course are first transparent
Poly terephthalic acid class plastics peeling liner bed course and the second transparent poly terephthalic acid class plastics peeling liner bed course, described first thoroughly
It is equipped between bright poly terephthalic acid class plastics peeling liner bed course and the second transparent poly terephthalic acid class plastics peeling liner bed course
Adhesive tape layer.
As a preferred option, the adhesive tape layer includes: adhesive hot soarfing from A layers and adhesive B layers, adhesive hot soarfing from
Film layer is equipped between A layers and B layers of adhesive.
As a preferred option, the film layer is acid copper layers of foil, poly terephthalic acid class plastic layer, polypropylene layer
Or any one of aluminium foil layer.
As a preferred option, electronic apparatus material becomes the preparation process of more adhesive with heat, comprising the following steps:
1) nickel powder is sieved in screening machine；
2) adhesive and solvent are mixed to obtain mixed solution；
3) nickel powder and catalyst stirring after screening is added in mixed solution carry out catalysis reaction；
4) synthetic reaction is finally stirred in blender；
5) investment coating apparatus carries out surface coating after mixing synthetic reaction；
6) aging is carried out after the completion of coating.
As a preferred option, the nickel powder granularity after screening is -350 mesh of 250 mesh, and the coating apparatus includes blade coating
Any one of equipment, gravure coating apparatus or slot coated equipment.
Detailed description of the invention
Fig. 1 is that electronic apparatus material heat provided in an embodiment of the present invention becomes more adhesive adhesive tape structure figure；
Wherein: 1. first transparent poly terephthalic acid class plastics peeling liner bed courses, 2. adhesive hot soarfings are from A layers, 3. films
Layer, 4. B layers of adhesives, 5. adhesive tape layers, 6. second transparent poly terephthalic acid class plastics peeling liner bed courses.
Specific embodiment
The technical scheme in the embodiments of the invention will be clearly and completely described below, it is clear that described implementation
Example is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, the common skill in this field
Art personnel every other embodiment obtained without creative efforts belongs to the model that the present invention protects
It encloses.
The preferred embodiment that the invention will now be described in detail with reference to the accompanying drawings.
In order to reach the purpose of the present invention, as shown in Figure 1, the electronic apparatus material in the present embodiment becomes more gluing with heat
Agent, comprising: acrylate glue and plasticity curing agent, the weight percent of the acrylate glue formula include: butyl acrylate 33
~41%, acrylic acid hydroxyl second rouge 31~37%, ethyl acetate 2~6%, staple fibre 18~32%, acrylic copolymer resin 1
~3%.
A kind of electronic apparatus material provided by the invention becomes more adhesive, adhesive tape structure and its preparation process with heat, passes through
The formula combination of adhesive so that the initial bonding strength of this use repeatly adhesive tape improves, in order to can with use repeatly adhesive tape, according to
About 60%~90% can be reduced compared with the peeling force at initial stage after the placement of temperature range (40~90 DEG C) process operation, improved
The service life in splicing face.
In some embodiments, electronic apparatus material becomes more adhesive with heat, comprising: acrylate glue and plasticity hardening
Agent, the weight percent of the acrylate glue formula include: butyl acrylate 33~37%, acrylic acid hydroxyl second rouge 31~34%,
Ethyl acetate 2~4%, staple fibre 18~25%, acrylic copolymer resin 1~2%.
Above-described embodiment is used, so that the initial bonding strength of adhesive tape improves, peeling force is reduced, and is had excellent performance, is improved splicing face
Service life.
In some embodiments, electronic apparatus material becomes more adhesive with heat, comprising: acrylate glue and plasticity hardening
Agent, the weight percent of the acrylate glue formula include: butyl acrylate 37~41%, acrylic acid hydroxyl second rouge 34~37%,
Ethyl acetate 4~6%, staple fibre 25~32%, acrylic copolymer resin 2~3%.
Above-described embodiment is used, so that the initial bonding strength of adhesive tape improves, peeling force is reduced, and is had excellent performance, is improved splicing face
Service life.
It in some embodiments, include: plasticiser and elastomer in the acrylic copolymer resin.
Above-described embodiment is used, so that the initial bonding strength of adhesive tape improves, peeling force is reduced, and is had excellent performance, is improved splicing face
Service life.
In some embodiments, the staple fibre is rosin.
Above-described embodiment is used, so that the initial bonding strength of adhesive tape improves, peeling force is reduced, and is had excellent performance, is improved splicing face
Service life.
In some embodiments, electronic apparatus material becomes more adhesive adhesive tape structure with heat, comprising: one layer, two layers, three layers
Or four layers or more transparent poly terephthalic acid class plastics peeling liner bed courses, when transparent poly terephthalic acid class plastics peeling liner bed course
When being two layers or more, this two layers perpendicular symmetrically arranged transparent poly terephthalic acid class plastics peeling liner bed course are first transparent
Poly terephthalic acid class plastics peeling liner bed course 1 and the second transparent poly terephthalic acid class plastics peeling liner bed course 6, described first
Between transparent poly terephthalic acid class plastics peeling liner bed course 1 and the second transparent poly terephthalic acid class plastics peeling liner bed course 6
Equipped with adhesive tape layer 5.
Using above-described embodiment, structure is simple, easy to operate, and tape performance is excellent, and improve splicing face uses the longevity
Life.
In some embodiments, the adhesive tape layer 5 includes: adhesive hot soarfing from A layer 2 and adhesive B layer 4, adhesive heat
It removes and is equipped with film layer 3 between A layer 2 and adhesive B layer 4.
Using above-described embodiment, it includes: adhesive hot soarfing from A and gluing that the electronic apparatus material heat, which becomes more adhesive,
Agent B, fitting coating adhesive hot soarfing obtains adhesive hot soarfing from A layer 2 from A and adhesive B after film layer two sides is by drying
With adhesive B layer 4, the adhesive hot soarfing is from A layer 2 and the adhesive B layer 4 with a thickness of 1 μm -999 μm.
In some embodiments, the film layer 3 is acid copper layers of foil, poly terephthalic acid class plastic layer, polypropylene
Any one of layer or aluminium foil layer.
Using above-described embodiment, structure is simple, easy to operate, and tape performance is excellent, and improve splicing face uses the longevity
Life.
As a preferred option, electronic apparatus material becomes the preparation process of more adhesive with heat, comprising the following steps:
1) nickel powder is sieved in screening machine；
2) adhesive and solvent are mixed to obtain mixed solution；
3) nickel powder and catalyst stirring after screening is added in mixed solution carry out catalysis reaction；
4) synthetic reaction is finally stirred in blender；
5) investment coating apparatus carries out surface coating after mixing synthetic reaction；
6) aging is carried out after the completion of coating.
Using above-described embodiment, the solvent is alcohol, and simple process improves electronic apparatus material heat and becomes more gluing
The performance of agent.
In some embodiments, the nickel powder granularity after screening is -350 mesh of 250 mesh, and the coating apparatus includes blade coating
Any one of equipment, gravure coating apparatus or slot coated equipment.
Using above-described embodiment, the performance that electronic apparatus material heat becomes more adhesive is improved.
The above are merely the preferred embodiment of the present invention, it is noted that for those of ordinary skill in the art,
Without departing from the concept of the premise of the invention, various modifications and improvements can be made, these belong to guarantor of the invention
Protect range.
Claims (10)
1. electronic apparatus material becomes more adhesive with heat characterized by comprising acrylate glue and plasticity curing agent, it is described
The weight percent of acrylate glue formula includes: butyl acrylate 33~41%, acrylic acid hydroxyl second rouge 31~37%, ethyl acetate
2~6%, staple fibre 18~32%, acrylic copolymer resin 1~3%.
2. electronic apparatus material according to claim 1 becomes more adhesive with heat characterized by comprising acrylate glue
With plasticity curing agent, the weight percent of the acrylate glue formula includes: butyl acrylate 33~37%, acrylic acid hydroxyl second
Rouge 31~34%, ethyl acetate 2~4%, staple fibre 18~25%, acrylic copolymer resin 1~2%.
3. electronic apparatus material according to claim 2 becomes more adhesive with heat characterized by comprising acrylate glue
With plasticity curing agent, the weight percent of the acrylate glue formula includes: butyl acrylate 37~41%, acrylic acid hydroxyl second
Rouge 34~37%, ethyl acetate 4~6%, staple fibre 25~32%, acrylic copolymer resin 2~3%.
4. electronic apparatus material according to claim 3 becomes more adhesive with heat, which is characterized in that the acrylic acid copolymer
It include: plasticiser and elastomer in resin.
5. electronic apparatus material according to claim 4 becomes more adhesive with heat, which is characterized in that the staple fibre is
Rosin.
6. electronic apparatus material becomes more adhesive adhesive tape structure with heat characterized by comprising one layer, two layers, three layers or four layers
The above transparent poly terephthalic acid class plastics peeling liner bed course, when transparent poly terephthalic acid class plastics peeling liner bed course is two layers
When above, this two layers perpendicular symmetrically arranged transparent poly terephthalic acid class plastics peeling liner bed course are first transparent poly- to benzene
Diformazan acids plastics peeling liner bed course and the second transparent poly terephthalic acid class plastics peeling liner bed course, described first transparent poly- pair
Adhesive tape layer is equipped between Phthalic acids plastics peeling liner bed course and the second transparent poly terephthalic acid class plastics peeling liner bed course.
7. electronic apparatus material according to claim 6 becomes more adhesive adhesive tape structure with heat, which is characterized in that the glue
Belt includes: adhesive hot soarfing from A layers and adhesive B layers, and adhesive hot soarfing is equipped with film layer from A layers between B layers of adhesive.
8. electronic apparatus material according to claim 7 becomes more adhesive adhesive tape structure with heat, which is characterized in that described thin
Film layer is any one of acid copper layers of foil, poly terephthalic acid class plastic layer, polypropylene layer or aluminium foil layer.
9. the preparation process that electronic apparatus material becomes more adhesive with heat, which comprises the following steps:
1) nickel powder is sieved in screening machine；
2) adhesive and solvent are mixed to obtain mixed solution；
3) nickel powder and catalyst stirring after screening is added in mixed solution carry out catalysis reaction；
4) synthetic reaction is finally stirred in blender；
5) investment coating apparatus carries out surface coating after mixing synthetic reaction；
6) aging is carried out after the completion of coating.
10. the preparation process that electronic apparatus material according to claim 9 becomes more adhesive with heat, which is characterized in that sieve
Nickel powder granularity after point is -350 mesh of 250 mesh, and the coating apparatus includes that blade coating equipment, gravure coating apparatus or slit apply
Any one of cloth equipment.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811653707.7A CN109777306A (en) | 2018-12-29 | 2018-12-29 | Electronic apparatus material becomes more adhesive, adhesive tape structure and its preparation process with heat |
| PCT/CN2019/122004 WO2020134862A1 (en) | 2018-12-29 | 2019-11-29 | Thermal-dependent adhesive for electronic and electrical material, adhesive tape structure and preparation process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811653707.7A CN109777306A (en) | 2018-12-29 | 2018-12-29 | Electronic apparatus material becomes more adhesive, adhesive tape structure and its preparation process with heat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109777306A true CN109777306A (en) | 2019-05-21 |
Family
ID=66499123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811653707.7A Pending CN109777306A (en) | 2018-12-29 | 2018-12-29 | Electronic apparatus material becomes more adhesive, adhesive tape structure and its preparation process with heat |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109777306A (en) |
| WO (1) | WO2020134862A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020134862A1 (en) * | 2018-12-29 | 2020-07-02 | 苏州高泰电子技术股份有限公司 | Thermal-dependent adhesive for electronic and electrical material, adhesive tape structure and preparation process thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03170573A (en) * | 1989-11-30 | 1991-07-24 | Fuji Photo Film Co Ltd | Double-coated adhesive tape |
| EP1144532A1 (en) * | 1998-12-10 | 2001-10-17 | Minnesota Mining And Manufacturing Company | Adhesive compositions and adhesive sheets |
| CN1973014A (en) * | 2004-10-21 | 2007-05-30 | Lg化学株式会社 | Acrylic pressure sensitive adhesive with good antistatic property |
| CN103242750A (en) * | 2012-02-13 | 2013-08-14 | 日东电工株式会社 | Double-sided pressure-sensitive adhesive tape |
| CN104152077A (en) * | 2014-08-13 | 2014-11-19 | 隆昌羽玺新材料科技有限公司 | Ultra-thin polyester double-sided adhesive tape, glue thereof, and preparation method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109777306A (en) * | 2018-12-29 | 2019-05-21 | 苏州高泰电子技术股份有限公司 | Electronic apparatus material becomes more adhesive, adhesive tape structure and its preparation process with heat |
-
2018
- 2018-12-29 CN CN201811653707.7A patent/CN109777306A/en active Pending
-
2019
- 2019-11-29 WO PCT/CN2019/122004 patent/WO2020134862A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03170573A (en) * | 1989-11-30 | 1991-07-24 | Fuji Photo Film Co Ltd | Double-coated adhesive tape |
| EP1144532A1 (en) * | 1998-12-10 | 2001-10-17 | Minnesota Mining And Manufacturing Company | Adhesive compositions and adhesive sheets |
| CN1973014A (en) * | 2004-10-21 | 2007-05-30 | Lg化学株式会社 | Acrylic pressure sensitive adhesive with good antistatic property |
| CN103242750A (en) * | 2012-02-13 | 2013-08-14 | 日东电工株式会社 | Double-sided pressure-sensitive adhesive tape |
| CN104152077A (en) * | 2014-08-13 | 2014-11-19 | 隆昌羽玺新材料科技有限公司 | Ultra-thin polyester double-sided adhesive tape, glue thereof, and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020134862A1 (en) * | 2018-12-29 | 2020-07-02 | 苏州高泰电子技术股份有限公司 | Thermal-dependent adhesive for electronic and electrical material, adhesive tape structure and preparation process thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020134862A1 (en) | 2020-07-02 |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190521 |
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| RJ01 | Rejection of invention patent application after publication |