CN109768146A - Flip LED package and manufacturing method thereof - Google Patents
Flip LED package and manufacturing method thereof Download PDFInfo
- Publication number
- CN109768146A CN109768146A CN201811634262.8A CN201811634262A CN109768146A CN 109768146 A CN109768146 A CN 109768146A CN 201811634262 A CN201811634262 A CN 201811634262A CN 109768146 A CN109768146 A CN 109768146A
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- heat sink
- conductive sheet
- plane
- mounting groove
- chip
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 238000004806 packaging method and process Methods 0.000 claims abstract description 22
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 48
- 238000009434 installation Methods 0.000 claims description 14
- 238000003780 insertion Methods 0.000 claims description 9
- 230000037431 insertion Effects 0.000 claims description 9
- 230000004888 barrier function Effects 0.000 claims description 5
- 230000005611 electricity Effects 0.000 abstract description 4
- 238000000926 separation method Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000005219 brazing Methods 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000013475 authorization Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Abstract
The invention discloses a flip LED packaging piece and a manufacturing method thereof, and the technical scheme is characterized by further comprising a heat sink, wherein the heat sink is provided with a first mounting block and a second mounting block, the first mounting block is provided with a first limiting hole, the second mounting block is provided with a second limiting hole, a chip is mounted on the heat sink, the chip is electrically connected with the heat sink, the heat sink is mounted on a base, and the heat sink is electrically connected with the outside through the base; first mounting groove and second mounting groove have been seted up to the base, there is the separation piece between first mounting groove and the second mounting groove, it holds the pipe to be equipped with first holding in the base and the second, it has first elasticity locating part to peg graft in the first holding, the spacing end of first elasticity locating part is equipped with first atress inclined plane, it has second elasticity locating part to peg graft in the second holding, the spacing end of second elasticity locating part is equipped with second atress inclined plane, it is firm to have reached the chip mounting, avoid influencing the chip and be connected with external electricity, guarantee LED's luminous and normal use purpose.
Description
Technical field
The present invention relates to LED technology fields, more specifically, it relates to a kind of flip LED packaging part and its manufacturing method.
Background technique
LED is the Light-Emitting Diode Light i.e. abbreviation of light emitting diode.Generally there are two types of encapsulation knots by LED
Structure, one is formal dress, and one is upside-down mountings.In LED formal dress encapsulating structure, the P electrode and N electrode of LED chip are respectively positioned on upper surface；
In LED flip-chip packaged structure, the P electrode and N electrode of LED chip are respectively positioned on lower end surface.
Authorization Notice No. is the Chinese invention patent of CN104576885B, and it discloses flip LED packing components comprising
Substrate, flip LED chips, conductive layer and layer of silica gel, flip LED chips are fixed on substrate by conductive layer and pass through conduction
Layer is realized to be electrically connected with extraneous.Conductive layer uses conducting resinl or brazing metal, since conductive layer is current transition layer, for a long time
Temperature can be gradually increasing when use, will affect the performance of conducting resinl or brazing metal when temperature is higher, influence the firm of LED chip
Property, it is electrically connected so as to influence flip LED chips with extraneous, influences the luminous and normal use of LED.
Summary of the invention
The technical problem to be solved by the present invention is to conductive layers to use conducting resinl or brazing metal, temperature meeting when using for a long time
It is gradually increasing, the higher performance that will affect conducting resinl or brazing metal of temperature, so as to influence flip LED chips and the external world
Electrical connection influences the luminous and normal use of LED.
The first object of the present invention is to provide a kind of flip LED packaging part, reaches chip installation and consolidates, avoids influencing chip
It is electrically connected with extraneous, guarantees the purpose of LED to shine with normal use.
Above-mentioned first technical purpose of the invention has the technical scheme that a kind of flip LED encapsulation
Part, including pedestal and chip, it is characterised in that: further include heat sink, heat sink to be equipped with the first mounting blocks and the second mounting blocks, the first peace
Fill block and be equipped with the first limit hole, the second mounting blocks are equipped with the second limit hole, and chip is mounted on heat sink, chip and it is heat sink between electricity
Connection, on the base, heat sink realized by pedestal is electrically connected with the external world for heat sink installation；
Pedestal offers the first mounting groove and the second mounting groove, has barriers between the first mounting groove and the second mounting groove,
It it is equipped with first in pedestal accommodates pipe and second and accommodate pipe, the first elastic spacing one, the first elasticity limit are plugged in the first receiving pipe
The positive stop end of position part is equipped with the first stress inclined-plane, is plugged with the second elastic spacing one, the second elastic spacing one in the second receiving pipe
Positive stop end be equipped with the second stress inclined-plane；Heat sink when being not installed at pedestal, the positive stop end of the first elastic spacing one is accommodated from first
Pipe, which stretches out, is located at the first mounting groove, and the positive stop end of the second elastic spacing one accommodates pipe and stretch out from second is located at the second mounting groove；
It is heat sink be mounted on pedestal during, the first mounting blocks squeeze the first stress inclined-plane when being inserted into the first mounting groove make
The first elastic spacing one to pedestal contract, when the first limit hole and the first elastic spacing one are aligned, the first elastic spacing one
Elastic reset extends so that its positive stop end is inserted into the first limit hole；When second mounting blocks are inserted into the second mounting groove squeeze second by
When power inclined-plane is aligned the second elastic spacing one to pedestal contract, the second limit hole and the second elastic spacing one, the second bullet
Property locating part elastic reset extend so that its positive stop end be inserted into the second limit hole.
As what is advanced optimized, the bottom of the first mounting blocks is equipped with the first force inclined-plane, the inclination on the first force inclined-plane
Angle is adapted with the tilt angle on the first stress inclined-plane；The bottom of second mounting blocks is equipped with the second force inclined-plane, the second force
The tilt angle on inclined-plane is adapted with the tilt angle on the second stress inclined-plane.
As what is advanced optimized, the bottom of the first mounting groove is equipped with first and abuts inclined-plane, the first force inclined-plane and second
Abutting inclined-plane can be bonded completely；The bottom of second mounting groove is equipped with second and abuts inclined-plane, and the second force inclined-plane is abutted with second
Inclined-plane can be bonded completely.
As what is advanced optimized, with the first limit hole when the positive stop end of the first elastic spacing one is in the first limit hole
Inner wall is bonded completely；It is pasted completely when the positive stop end of second elastic spacing one is in the second limit hole with the inner wall of the second limit hole
It closes.
As what is advanced optimized, the lower end surface of the first mounting blocks is equipped with the first lower conductive sheet, the lower end of the second mounting blocks
Face is equipped with the second lower conductive sheet, and heat sink upper surface is equipped on first conductive sheet on conductive sheet and second, the first lower conductive sheet and
Conductive sheet is connected to by conducting wire on first, and conductive sheet is connected to by conducting wire on the second lower conductive sheet and second, and chip installation is fixed
Behind heat sink upper surface, the P electrode and N electrode of chip respectively with first on conductive sheet and second conductive sheet push against and realize and be electrically connected
Lead in succession.
As what is advanced optimized, heat sink upper end offers the first holding tank and the second holding tank, the first holding tank and
There is separator between second holding tank, conductive sheet is located at the first receiving trench bottom on first, and conductive sheet is located at second and holds on second
Receive trench bottom, when chip is installed, the P motor and N electrode of chip are inserted into the first holding tank and the second holding tank respectively.
As what is advanced optimized, the bottom of the first mounting groove is equipped with the first conductive plate, and the bottom of the second mounting groove is equipped with
Second conductive plate, the first conductive plate and the second conductive plate lower end surface, which is respectively connected with, is through to pedestal for being electrically connected with the external world
Conducting wire, after heat sink installation limit is fixed, the first lower conductive sheet pushes against the first conductive plate, and it is conductive that the second lower conductive sheet pushes against second
Plate.
As what is advanced optimized, the lower end surface of the upper surface of the first conductive plate and the first lower conductive sheet, the two is wherein
One is equipped with protrusion, another is equipped with groove, and protrusion is aligned insertion with groove；The upper surface of second conductive plate and the second lower conduction
The lower end surface of piece, one of them is equipped with protrusion to the two, another is equipped with groove, and protrusion is aligned insertion with groove.
As what is advanced optimized, conductive sheet on conductive sheet/the second on P electrode/N electrode bottom of chip and first
Top, this up and down it is both corresponding one of them be equipped with protrusion, another is equipped with groove, and protrusion is aligned insertion with groove.
2nd 1 purpose of the invention is to provide a kind of manufacturing method of flip LED packaging part, reaches chip installation and consolidates,
Avoiding influences chip is electrically connected with extraneous, guarantees the purpose of LED to shine with normal use.
Above-mentioned second technical purpose of the invention has the technical scheme that a kind of as above-mentioned any one
The manufacturing method of flip LED packaging part described in technical solution, it is characterised in that: the following steps are included:
A, a chip is provided；It is described heat sink to provide one；One pedestal is provided；
B, it heat sink is mounted on described on the pedestal；
C, by the chip be mounted on it is described it is heat sink on.
In conclusion the invention has the following advantages: the flip LED packaging part passes through the first elastic spacing one and the
The mutual limit and the mutual limit of the second elastic spacing one and the second limit hole of one limit hole, are realized heat sink between pedestal
Installation fix, carry out installation fixation compared to by glue, more consolidate and reliably；Heat sink is main electricity between pedestal
Flow transition zone, the heat sink heat generated pedestal between be apparently higher than chip and it is heat sink between, even if chip use glue consolidated
Fixed, stability is also above fixed form in the prior art.
Detailed description of the invention
Fig. 1 is the schematic diagram of the section structure of the flip LED packaging part in embodiment；
Fig. 2 is the schematic diagram of the section structure after the decomposition of the flip LED packaging part in embodiment；
Fig. 3 is the schematic diagram of the section structure of the chip in embodiment；
Fig. 4 is the heat sink the schematic diagram of the section structure in embodiment；
Fig. 5 is the schematic diagram of the section structure of the pedestal in embodiment；
Fig. 6 is the structural schematic diagram of the two half-unit point of the pedestal in embodiment；
Fig. 7 is the structural schematic diagram of the first conductive plate in embodiment；
Fig. 8 is the structural schematic diagram of the second conductive plate in embodiment.
In figure: 1, pedestal；11, the first mounting groove；111, first inclined-plane is abutted；12, the second mounting groove；121, it second abuts
Inclined-plane；13, barriers；2, heat sink；21, the first mounting blocks；211, the first limit hole；212, the first force inclined-plane；213, first
It is bonded inclined-plane；22, the second mounting blocks；221, the second limit hole；222, the second force inclined-plane；223, the second fitting inclined-plane；23,
One holding tank；24, the second holding tank；25, separator；3, chip；31, P electrode；32, N electrode；4, adhesive；51, first holds
Receive pipe；52, second pipe is accommodated；61, the first elastic spacing one；611, the first stress inclined-plane；62, the second elastic spacing one；621,
Second stress inclined-plane；71, the first conductive plate；72, the second conductive plate；81-84, conducting wire；91, the first lower conductive sheet；92, under second
Conductive sheet；93, conductive sheet on first；94, conductive sheet on second；100, raised；200, groove；300, raised；400, groove；
110, lower half portion；120, top half.
Specific embodiment
Below in conjunction with attached drawing, invention is further described in detail.
Fig. 1 shows the cross-section structure of the flip LED packaging part in embodiment, the flip LED packaging part include pedestal 1,
Heat sink 2 and chip 3, heat sink 2 are fixed on pedestal 1, and chip 3 is fixed on heat sink 2 by adhesive 4.1 He of pedestal
Heat sink 2 are made of heat-conducting insulation material, and thermal conductivity and thermal diffusivity are excellent.Fig. 2 shows the flip LED encapsulation in embodiment
Cross-section structure after the decomposition of part, pedestal 1 are equipped with the first mounting groove 11 and the second mounting groove 12, the first mounting groove 11 and the second peace
There are barriers 13 between tankage 12.The first limiting groove and the second limiting groove are equipped in pedestal 1, the first limiting groove is equipped with first and accommodates
Pipe 51, the second limiting slot are equipped with second and accommodate pipe 52.The opening of one end of the first receiving pipe 51 is connected to the first mounting groove 11, the
The first elastic spacing one 61 with telescopic resilience is plugged in one receiving pipe 51.When heat sink 2 do not install, the first elastic spacing
The positive stop end of part 61 accommodates pipe 51 and stretch out from first is located at the first mounting groove 11.Second accommodates the opening and second of one end of pipe 52
Mounting groove 12 is connected to, and is plugged with the second elastic spacing one 62 with telescopic resilience in the second receiving pipe 52.It is not installed heat sink 2
When, the positive stop end of the second elastic spacing one 62 accommodates pipe 52 and stretch out from second is located at the second mounting groove 12.First elastic spacing one
61 positive stop end is equipped with the first stress inclined-plane 611, and the positive stop end of the second elastic spacing one 62 is equipped with the second stress inclined-plane 621.Heat
Heavy 2 are equipped with the first mounting blocks 21 and the second mounting blocks 22, and the first mounting blocks 21 are equipped with the first limit hole 211, the second mounting blocks 22
Equipped with the second limit hole 221.It is electrically connected between chip 3 and heat sink 2, heat sink 2 pass through the first mounting groove 11 and the second mounting groove 12
It realizes and is electrically connected with the external world.
During heat sink 2 are mounted on pedestal 1, heat sink 2 the first mounting blocks 21 is made to be aligned the first mounting groove 11, second peace
It fills block 22 and is aligned the insertion of the second mounting groove 12；First mounting blocks 21 towards 11 bottom of the first mounting groove move when, squeeze first by
Power inclined-plane 611 makes the first elastic spacing one 61 towards 1 contract of pedestal, and the first elastic spacing one 61 is aligned the first limit hole
When 211,61 elastic reset of the first elastic spacing one extends so that its positive stop end is inserted into the first limit hole 211；Second mounting blocks 22
Towards when the movement of 12 bottom of the second mounting groove, squeezes the second stress inclined-plane 621 and make the second elastic spacing one 62 towards in pedestal 1
It shrinks, when the second elastic spacing one 62 is aligned the second limit hole 221,62 elastic reset of the second elastic spacing one extends so that it is limited
The second limit hole 221 is inserted at position end；As shown in Figure 1, the first elastic spacing one 61 and the first mutually limit of limit hole 211, second
Elastic spacing one 62 and the second mutually limit of limit hole 221, realize that the installation between pedestal 1 and heat sink 2 limits and fix.The upside-down mounting
LED encapsulation piece realizes that installation is fixed by elastic spacing one 61,62 and limit hole 211,221, is installed compared to by glue
It is fixed, it more consolidates and reliably.
As optimization, the bottom of the first mounting blocks 21 is equipped with the first force inclined-plane 212, the inclination on the first force inclined-plane 212
Angle and the tilt angle on the first stress inclined-plane 611 match, the cooperation on the first force inclined-plane 212 and the first stress inclined-plane 611,
It can preferably push the first elastic spacing one 61 mobile.The bottom of second mounting blocks 22 be equipped with second force inclined-plane 222, second
The tilt angle on inclined-plane 222 that exerts a force and the tilt angle on the second stress inclined-plane 621 match, the second force inclined-plane 222 and second
The cooperation on stress inclined-plane 621 can preferably push the movement of the second elastic spacing one 62.The bottom of first mounting groove 11 is equipped with
First abuts inclined-plane 111, and the first force inclined-plane 212 and the second abutting inclined-plane 121 can be bonded completely, so that the first mounting blocks 21
It is bigger with the contact area of the bottom of the first mounting groove 11.The bottom of second mounting groove 12 be equipped with second abut inclined-plane 121, second
Force inclined-plane 222 and the second abutting inclined-plane 121 can be bonded completely, so that the bottom of the second mounting blocks 22 and the second mounting groove 12
Contact area it is bigger.The first fitting inclined-plane 213 is equipped in first limit hole 211, the first fitting inclined-plane 213 and the first stress are oblique
Face 611 can be bonded completely, when the positive stop end of the first elastic spacing one 61 is in the first limit hole 211 with the first limit hole 211
Inner wall be bonded completely.The second fitting inclined-plane 223 is equipped in second limit hole 221, the second fitting inclined-plane 223 and the second stress are oblique
Face 621 can be bonded completely, when the positive stop end of the second elastic spacing one 62 is in the second limit hole 221 with the second limit hole 221
Inner wall be bonded completely.As advanced optimizing, the same 61 He of the first elastic spacing one of two structures is symmetrically arranged in pedestal 1
Second elastic spacing one 62, accordingly, the first limit hole 211 and the second limit hole 221 are symmetrically arranged with two.
As optimization, the bottom of the first mounting groove 11 is equipped with the first conductive plate 71, and the bottom of the second mounting groove 12 is equipped with the
The lower end surface of two conductive plates 72, the first conductive plate 71 and the second conductive plate 72 is respectively connected with to be used to be electrically connected with the external world through pedestal 1
The conducting wire 81,82 connect.First conductive plate 71 and the second conductive plate 72 are fixed without using glue, and heat sink 2 installation limit is fixed
Afterwards, the first mounting blocks 21 push against the first conductive plate 71, and the second mounting blocks 22 push against the second conductive plate 72.Under first mounting blocks 21
End face is equipped with the first lower conductive sheet 91, and the lower end surface of the second mounting blocks 22 is equipped with the second lower conductive sheet 92.First conductive plate 71/
The bottom of the upper surface of two conductive plates 72 and the first lower 91/ second conductive plate 72 of conductive sheet, this up and down both corresponding wherein one
A to be equipped with protrusion 100, another is equipped with groove 200, protrusion 100 and the alignment insertion of groove 200, effectively increases contact area,
Guarantee electrical connection.Protrusion 100 and the shape of groove 200 can be hemispherical or polygon, preferably hemispherical, hemispherical production and
Processing is more convenient.Heat sink 2 upper end is equipped with the first holding tank 23 and the second holding tank 24, the first holding tank 23 and the second holding tank
There is separator 25 between 24.Conductive sheet 93 on first is equipped in first holding tank 23, conductive sheet 93 and the first lower conduction on first
It is electrically connected between piece 91 by conducting wire 83,84.Conductive sheet 94 on second is equipped in second holding tank 24, on second conductive sheet 94 with
It is electrically connected between second lower conductive sheet 92 by conducting wire 83,84.When chip 3 is installed, P electrode 31 and N electrode 32 difference of chip 3
Conductive sheet 94 on conductive sheet 93 and second is inserted into the first holding tank 23 and the second holding tank 24 and abutting first.The P electricity of chip 3
On the bottom and first of pole 31/N electrode 32 on conductive sheet 93/ second conductive sheet 94 top, this up and down it is both corresponding wherein
One is equipped with protrusion 300, another is equipped with groove 400, protrusion 300 and the alignment insertion of groove 400, effectively increases contact surface,
Guarantee electrical connection.It is fixed between heat sink 2 upper surface and chip 3 by the installation of adhesive 4.
When flip LED packaging part more than manufacture, using following manufacturing method:
A, the chip 3 of an inverted structure is provided, the P electrode 31 and N electrode 32 of the chip 3 are equipped with (or the protrusion of groove 400
300), which can be by mold injection molding, as shown in Figure 3；
One heat sink 2 is provided, this is heat sink 2 to be equipped with the first mounting blocks 21 and the second mounting blocks 22, and the first mounting blocks 21 are equipped with the
One limit hole 211, the second mounting blocks 22 are equipped with the second limit hole 221, and the bottom of the first mounting blocks 21 is equipped with the first lower conductive sheet
91, the bottoms of the second mounting blocks 22 is equipped with the second lower conductive sheet 92, the first lower conductive sheet 91 and under the second lower conductive sheet 92
End face is equipped with groove 200 (or protrusion 100), this is heat sink, and 2 upper end is equipped with the first holding tank 23 and the second holding tank 24, and first holds
Receiving the bottom of slot 23 is equipped with conductive sheet 93 on first, and the bottom of the second holding tank 24 is equipped with conductive sheet 94 on second, leads on first
Electric piece 93 and the upper surface of conductive sheet 94 is equipped with raised 300 (or grooves 400) on second, this is heat sink 2 can to pass through mold injection
Molding, as shown in Figure 4；
A pedestal 1 is provided, which is equipped with the first mounting groove 11 and the second mounting groove 12, the first mounting groove 11 and second
There are barriers 13 between mounting groove 12, the first mounting groove 11 and the second mounting groove 12 bottom is communicated with for for conducting wire 81-
84 through holes passed through, first are equipped in the pedestal 1 accommodate pipe 51 and second and accommodate pipe 52, and the is plugged in the first receiving pipe 51
One elastic spacing one 61, second receiving pipe 52 in be plugged with the second elastic spacing one 62, as shown in Figure 5；The pedestal 1 can pass through mould
Has injection molding, as shown in fig. 6, being partly divided into lower half as bound pair using the middle of the first limiting groove of pedestal 1 and the second limiting groove
Part 110 and top half 120 form half of limiting groove and half of mounting groove, so first with mold injection lower half portion 110
The receiving pipe 51,52 of built-in elastic locating part 61,62 is placed in half of limiting groove afterwards, is then molded top half 120；Using
The above method is molded pedestal 1, and no replacement is required for the lower die of mold, only needs to change upper mold, and midway is not necessarily to lower half portion 110
It takes out；
There is provided one first conductive plate 71 and the second conductive plate 72, the lower end surface of the first conductive plate 71 and the second conductive plate 72 is solid
Conducting wire 81,82 is set, as shown in Figure 7 and Figure 8；
B, the first conductive plate 71 is mounted on to 11 bottom of the first mounting groove of pedestal 1, the second conductive plate 72 is mounted on pedestal 1
12 bottom of the second mounting groove；
C, heat sink 2 are mounted on pedestal 1；
D, chip 3 is fixed on heat sink 2 by adhesive 4.
In other embodiments, first chip 3 can also be fixed on heat sink 2 by adhesive 4, then heat sink 2 is pacified
Mounted in pedestal 1.
Embodiments above is only explanation of the invention, is not limitation of the present invention, art technology
Personnel can according to need the modification that above embodiments are made with not creative contribution after reading this specification, but as long as
All by the protection of Patent Law in scope of the presently claimed invention.
Claims (10)
1. a kind of flip LED packaging part, including pedestal and chip, it is characterised in that: further include it is heat sink, it is heat sink to be equipped with the first installation
Block and the second mounting blocks, the first mounting blocks are equipped with the first limit hole, and the second mounting blocks are equipped with the second limit hole, and chip is mounted on heat
On heavy, chip with it is heat sink between be electrically connected, on the base, heat sink realized by pedestal is electrically connected with extraneous for heat sink installation；
Pedestal offers the first mounting groove and the second mounting groove, there is barriers, pedestal between the first mounting groove and the second mounting groove
It is inside equipped with the first receiving pipe and second and accommodates pipe, be plugged with the first elastic spacing one, the first elastic spacing one in the first receiving pipe
Positive stop end be equipped with the first stress inclined-plane, second receiving pipe in be plugged with the second elastic spacing one, the limit of the second elastic spacing one
Position end is equipped with the second stress inclined-plane；Heat sink when being not installed at pedestal, the positive stop end of the first elastic spacing one is stretched from the first receiving pipe
It is located at the first mounting groove out, the positive stop end of the second elastic spacing one accommodates pipe and stretch out from second is located at the second mounting groove；
It is heat sink be mounted on pedestal during, the first mounting blocks squeeze the first stress inclined-plane and make when being inserted into the first mounting groove
When one elastic spacing one is aligned to pedestal contract, the first limit hole and the first elastic spacing one, the first elastic spacing one elasticity
Elongation is resetted so that its positive stop end is inserted into the first limit hole；It is oblique that second mounting blocks squeeze the second stress when being inserted into the second mounting groove
When face is aligned the second elastic spacing one to pedestal contract, the second limit hole and the second elastic spacing one, the second elasticity limit
Position part elastic reset extends so that its positive stop end is inserted into the second limit hole.
2. flip LED packaging part according to claim 1, it is characterised in that: the bottom of the first mounting blocks is equipped with first and applies
The tilt angle on power inclined-plane, the first force inclined-plane is adapted with the tilt angle on the first stress inclined-plane；The bottom of second mounting blocks
Equipped with the second force inclined-plane, the tilt angle on the second force inclined-plane is adapted with the tilt angle on the second stress inclined-plane.
3. flip LED packaging part according to claim 2, it is characterised in that: the bottom of the first mounting groove is equipped with first and supports
Inclined-plane is connect, the first force inclined-plane can be bonded completely with the second abutting inclined-plane；The bottom of second mounting groove is equipped with second and abuts tiltedly
Face, the second force inclined-plane can be bonded completely with the second abutting inclined-plane.
4. flip LED packaging part according to claim 1, it is characterised in that: the positive stop end of the first elastic spacing one is
It is bonded completely when in one limit hole with the inner wall of the first limit hole；When the positive stop end of second elastic spacing one is in the second limit hole
It is bonded completely with the inner wall of the second limit hole.
5. flip LED packaging part according to claim 1, it is characterised in that: the lower end surface of the first mounting blocks is equipped with first
Lower conductive sheet, the lower end surfaces of the second mounting blocks are equipped with the second lower conductive sheet, and heat sink upper surface is equipped on first conductive sheet and the
Conductive sheet on two, first descends conductive sheet on conductive sheet and first to be connected to by conducting wire, conductive sheet on the second lower conductive sheet and second
Be connected to by conducting wire, after chip is fixed on heat sink upper surface, the P electrode and N electrode of chip respectively with first on conductive sheet
Realization is pushed against with conductive sheet on second to be connected to.
6. flip LED packaging part according to claim 5, it is characterised in that: heat sink upper end offers the first holding tank
With the second holding tank, there is separator between the first holding tank and the second holding tank, conductive sheet is located at the first holding tank bottom on first
Portion, conductive sheet is located at second and accommodates trench bottom on second, and when chip is installed, the P motor and N electrode of chip are inserted into the first appearance respectively
Receive slot and the second holding tank.
7. flip LED packaging part according to claim 5, it is characterised in that: the bottom of the first mounting groove is equipped with first and leads
Battery plate, the bottom of the second mounting groove are equipped with the second conductive plate, and the first conductive plate and the second conductive plate lower end surface is respectively connected with
It is through to conducting wire of the pedestal for being electrically connected with the external world, after heat sink installation limit is fixed, it is conductive that the first lower conductive sheet pushes against first
Plate, the second lower conductive sheet push against the second conductive plate.
8. flip LED packaging part according to claim 7, it is characterised in that: under the upper surface of the first conductive plate and first
The lower end surface of conductive sheet, one of them is equipped with protrusion to the two, another is equipped with groove, and protrusion is aligned insertion with groove；Second
The lower end surface of the upper surface of conductive plate and the second lower conductive sheet, one of them is equipped with protrusion to the two, another is equipped with groove, convex
It rises and is aligned insertion with groove.
9. flip LED packaging part according to claim 6, it is characterised in that: P electrode/N electrode bottom of chip and
On one on conductive sheet/the second conductive sheet top, this up and down it is both corresponding one of them be equipped with protrusion, another is equipped with recessed
Slot, protrusion are aligned insertion with groove.
10. a kind of manufacturing method of flip LED packaging part as described in any one of claims 1-9, it is characterised in that: including
Following steps:
A, a chip is provided；It is described heat sink to provide one；One pedestal is provided；
B, it heat sink is mounted on described on the pedestal；
C, by the chip be mounted on it is described it is heat sink on.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811634262.8A CN109768146B (en) | 2018-12-29 | 2018-12-29 | Flip LED package and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811634262.8A CN109768146B (en) | 2018-12-29 | 2018-12-29 | Flip LED package and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109768146A true CN109768146A (en) | 2019-05-17 |
| CN109768146B CN109768146B (en) | 2021-03-30 |
Family
ID=66452544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811634262.8A Active CN109768146B (en) | 2018-12-29 | 2018-12-29 | Flip LED package and manufacturing method thereof |
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Cited By (1)
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| WO2021110065A1 (en) * | 2019-12-03 | 2021-06-10 | 深圳市聚飞光电股份有限公司 | Flip led chip, circuit board and electronic device |
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| CN109768146B (en) | 2021-03-30 |
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