CN109765237B - Scanning detection method for circuit board layer defects - Google Patents
Scanning detection method for circuit board layer defects Download PDFInfo
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- CN109765237B CN109765237B CN201811456766.5A CN201811456766A CN109765237B CN 109765237 B CN109765237 B CN 109765237B CN 201811456766 A CN201811456766 A CN 201811456766A CN 109765237 B CN109765237 B CN 109765237B
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Abstract
The invention provides a scanning detection method for a circuit board layer defect, which comprises the following steps: s1, placing a circuit board on a feeding table through a motion control platform; s2, feeding through a motion control platform, and reaching a grinding and brushing device area for pretreatment; s3, continuously feeding through a motion control platform to reach a line scanning device area; s4, starting a line scanning device, connecting a camera, and setting a trigger mode and an exposure mode; s5, scanning is carried out through a CCD camera of the line scanning device; s6, finding defects, and marking the defects as defective products to be removed; otherwise, the next station is entered. According to the invention, the grinding and brushing device is arranged in the scanning system, so that preprocessing can be carried out before the circuit board pattern scanning detection, the probability of error identification and error reporting of the system is effectively reduced, unnecessary waste is reduced on the basis of ensuring the yield of products, and the enterprise benefit is improved.
Description
Technical Field
The invention belongs to the technical field of PCB detection, and particularly relates to a scanning detection method for a circuit board layer defect.
Background
A Printed Circuit Board (Printed Circuit Board) is an electrical connection carrier manufactured by electronic printing. The rapid development of the society makes people's life style change, and the consumer demand to electronic product is bigger and bigger, and electronic product's renewal speed has also improved a lot, and PCB is as the basis of most electronic equipment, and whole demand presents steadily rising state. The PCB manufacturer needs to ensure the quality of the PCB, and one of the most basic requirements is that the precision of the circuit pattern is required to meet the requirement. In the detection of the automatic identification circuit board scanning system in the prior art, the circuit board which is not completely processed in the earlier stage can cause the system to be mistakenly identified as a defective product, the yield of the circuit board is influenced, unnecessary waste is caused, and the production cost is improved.
Disclosure of Invention
In view of the above, the invention provides a scanning detection method for circuit board layer defects, and the invention can perform preprocessing before circuit board pattern scanning detection by arranging a scrubbing device in a scanning system, thereby effectively reducing the probability of system misrecognition and error reporting, reducing unnecessary waste on the basis of ensuring the yield of products, and improving enterprise benefits.
The technical scheme of the invention is as follows: a scanning detection method for defects of a circuit board layer is characterized by comprising the following steps:
s1, placing a circuit board on a feeding table through a motion control platform;
s2, feeding through a motion control platform, and reaching a grinding and brushing device area for pretreatment;
s3, continuously feeding the film by the motion control platform to reach the area of the line scanning device;
s4, starting a line scanning device, connecting a camera, and setting a trigger mode and an exposure mode;
s5, scanning is carried out through a CCD camera of the line scanning device;
s6, finding defects, and marking the defects as defective products to be removed; otherwise, the next station is entered.
The device is characterized by further comprising a detection system, wherein the detection system comprises a motion control platform, the motion control platform comprises an X motion shaft, a Y motion shaft and a Z motion shaft, the X motion shaft of the motion control platform is provided with a feeding table, the Z motion shaft is respectively provided with a lighting device and a line scanning device, and one side of the Y motion shaft is provided with a grinding and brushing device. The line scanning device may be a prior art CCD device.
In the invention, a line scanning device is arranged on a Z motion axis of a console, and an illuminating device is arranged above a console moving platform. The motion control platform can realize the motion in 3 directions, the axis of the horizontal motion left and right is set as the X motion axis of the system, the motion axis vertical to the X motion axis is set as the Y motion axis, and the direction vertical to the workbench is set as the Z motion axis. The movement of the X movement axis and the Y movement axis ensures the integrity of the PCB image acquisition. The position of the line scanner device corresponds to the original point position of the Z motion axis of the software, and the distance between the line scanner device and the PCB to be tested is changed along with the motion of the Z motion axis, so that the quality of the pictures acquired by the system is ensured. The illumination device may also be moved in correspondence with the Z axis of motion.
Further, the grinding and brushing device comprises a driving part, a fixing part and a grinding and brushing part, wherein a connecting part is arranged on one side of the fixing part, the driving part is connected with the connecting part, and the grinding and brushing part is arranged below the fixing part.
Furthermore, the grinding and brushing part comprises a first grinding and brushing part, a second grinding and brushing part, a third grinding and brushing part, a cleaning part and a drying part which are sequentially arranged, the cleaning part is connected with a capillary part, and a liquid storage part is connected above the capillary part; the cleaning part is connected with an adsorption part, and the adsorption part is connected with the liquid storage part.
Furthermore, first scrubbing portion is including the rubber column of symmetry setting, the rubber column end is equipped with the rubber head. Through adopting the rubber column, because the wear resistance of rubber column is good, mechanical strength is higher, can strike off in advance to the panel foreign matter.
Further, the second brushing portion is a brush portion. And all foreign matters on the board surface can be separated from the board surface under the action of the brush part.
Furthermore, the third scrubbing portion comprises silica gel scrubbing columns which are symmetrically arranged. And then the foreign matters on the board surface treated by the brush part are hung down by the silica gel grinding and brushing column.
Further, cleaning portion includes low density sponge layer, polymer hydrogel layer, low density sponge layer symmetry sets up in polymer hydrogel layer both sides, capillary portion is connected with polymer hydrogel layer middle part. Through this setting, only a small amount of moisture in can guaranteeing the polymer hydrogel layer oozes, can ensure clean effect to can not damage circuit components and parts.
Further, the adsorption part comprises an adsorption head, a suction pipe and a pump, the adsorption head is connected with the pump through the suction pipe, and the pump passes through the suction pipe and the liquid storage part.
Further, the drying part comprises a low-density sponge layer, a high-density sponge layer and a medium-density sponge layer which are sequentially arranged, and the adsorption head is arranged inside the medium-density sponge layer. Through the water absorption effect of the three sections of sponges and the cooperation of the adsorption part for pumping water, the circuit board coming out from the scrubbing section can be kept completely dry. The low-density sponge layer is in interference contact with the PCB to be processed.
Furthermore, the upper end of the liquid storage part is provided with a water adding pipe, so that the water quantity can be properly increased.
The grinding and brushing part is connected with a mechanical part or a driving mechanism in the prior art through the connecting part and is arranged at one end of the motion control platform, the circuit board to be detected can be further finely processed, the grinding and brushing are respectively processed through the first grinding and brushing part, the second grinding and brushing part and the third grinding and brushing part, PP powder, viscose or other foreign matters adhered to the board surface of the circuit board in the processing process can be cleaned, and then the cleaning part is cleaned through washing with micro water, and the drying part is dried through water absorption, so that the board surface of the PCB can be ensured to be cleaned, and the yield of scanning detection is improved.
According to the invention, the grinding and brushing device is arranged in the scanning system, so that preprocessing can be carried out before the circuit board pattern scanning detection, the probability of error identification and error reporting of the system is effectively reduced, unnecessary waste is reduced on the basis of ensuring the yield of products, and the enterprise benefit is improved.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural view of the present invention;
FIG. 3 is a schematic view of the structure of the polishing device of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
A scanning detection method for defects of a circuit board layer is characterized by comprising the following steps:
s1, placing a circuit board on a feeding table through a motion control platform;
s2, feeding through a motion control platform, and reaching a grinding and brushing device area for pretreatment;
s3, continuously feeding the film by the motion control platform to reach the area of the line scanning device;
s4, starting a line scanning device, connecting a camera, and setting a trigger mode and an exposure mode;
s5, scanning is carried out through a CCD camera of the line scanning device;
s6, finding defects, and marking the defects as defective products to be removed; otherwise, the next station is entered.
Further, the device comprises a detection system, wherein the detection system comprises a motion control platform 1, the motion control platform comprises an X motion shaft 11, a Y motion shaft 12 and a Z motion shaft 13, the X motion shaft of the motion control platform is provided with a feeding table 2, the Z motion shaft is respectively provided with a lighting device 3 and a line scanning device 4, and one side of the Y motion shaft is provided with a grinding and brushing device 5. The line scanning device may be a prior art CCD device.
In the invention, a line scanning device is arranged on a Z motion axis of a console, and an illuminating device is arranged above a console moving platform. The motion control platform can realize the motion in 3 directions, the axis of the horizontal motion left and right is set as the X motion axis of the system, the motion axis vertical to the X motion axis is set as the Y motion axis, and the direction vertical to the workbench is set as the Z motion axis. The movement of the X movement axis and the Y movement axis ensures the integrity of the PCB image acquisition. The position of the line scanner device corresponds to the original point position of the Z motion axis of the software, and the distance between the line scanner device and the PCB to be tested is changed along with the motion of the Z motion axis, so that the quality of the pictures acquired by the system is ensured. The illumination device may also be moved in correspondence with the Z axis of motion.
Further, the polishing device comprises a driving part 51, a fixing part 52 and a polishing part 53, wherein a connecting part 54 is arranged on one side of the fixing part, the driving part is connected with the connecting part, and the polishing part is arranged below the fixing part. The grinding and brushing device is provided with a slide rail mechanism 55, the front end of the slide rail mechanism is provided with a sensing device 56, and when the X moving axis is sensed to move to the area of the grinding and brushing device corresponding to the Y moving axis, the slide rail mechanism forwards pushes the grinding and brushing device to clean the circuit board of the feeding table. Preferably, the feeding table is provided with a clamping mechanism in the prior art and can fix the circuit board to be detected.
Further, the grinding and brushing part comprises a first grinding and brushing part 531, a second grinding and brushing part 532, a third grinding and brushing part 533, a cleaning part 534 and a drying part 535 which are arranged in sequence, the cleaning part is connected with a capillary part 536, and a liquid storage part 537 is connected above the capillary part; the cleaning portion is connected with an adsorption portion 538, and the adsorption portion is connected with a liquid storage portion.
Further, the first grinding and brushing part comprises symmetrically arranged rubber columns 5311, and rubber heads 5312 are arranged at the tail ends of the rubber columns. Through adopting the rubber column, because the wear resistance of rubber column is good, mechanical strength is higher, can strike off in advance to the panel foreign matter.
Further, the second brushing portion is a brush portion. And all foreign matters on the board surface can be separated from the board surface under the action of the brush part.
Further, the third brushing portion comprises silica gel brushing columns 5331 which are symmetrically arranged. And then the foreign matters on the board surface treated by the brush part are hung down by the silica gel grinding and brushing column.
Further, the cleaning portion 534 includes a low-density sponge layer 5341 and a polymer hydrogel layer 5342, the low-density sponge layer is symmetrically disposed on two sides of the polymer hydrogel layer, and the capillary tube portion is connected with the middle of the polymer hydrogel layer. Through this setting, only a small amount of moisture in can guaranteeing the polymer hydrogel layer oozes, can ensure clean effect to can not damage circuit components and parts.
Further, the absorption portion 538 comprises an absorption head 5381, a suction pipe 5382 and a pump 5383, the absorption head is connected with the pump through the suction pipe, and the pump is connected with the liquid storage portion through the suction pipe.
Further, the drying part 535 includes a low-density sponge layer 5351, a high-density sponge layer 5352 and a medium-density sponge layer 5353, which are arranged in sequence, and the adsorption head is arranged inside the medium-density sponge layer. Through the water absorption effect of the three sections of sponges and the cooperation of the adsorption part for pumping water, the circuit board coming out from the scrubbing section can be kept completely dry. The low-density sponge layer is in interference contact with the PCB to be processed.
Furthermore, the upper end of the liquid storage part is provided with a water adding pipe 5371 which can increase the water quantity properly.
The grinding and brushing mechanism arranged on the grinding and brushing section is connected with a mechanical part or a driving mechanism in the prior art through a connecting part, so that the grinding and brushing of the grinding and brushing section on the PCB can be realized, the grinding and brushing are respectively processed through the first grinding and brushing part, the second grinding and brushing part and the third grinding and brushing part, PP powder, viscose or other foreign matters adhered to the PCB surface before pretreatment can be cleaned, and then the PCB surface can be cleaned through cleaning by micro water of the cleaning part and water absorption and drying of the drying part, so that the cleaning of the PCB surface can be ensured, and the phenomena of residual copper and short circuit caused by the fact that the foreign matters are adhered to the PCB surface can be further improved.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art. It should be noted that the technical features not described in detail in the present invention can be implemented by any prior art.
Claims (4)
1. A scanning detection method for defects of a circuit board layer is characterized by comprising the following steps:
s1, placing a circuit board on a feeding table through a motion control platform; the detection system comprises a motion control platform, the motion control platform comprises an X motion shaft, a Y motion shaft and a Z motion shaft, the X motion shaft of the motion control platform is provided with a feeding table, the Z motion shaft is respectively provided with a lighting device and a line scanning device, one side of the Y motion shaft is provided with a grinding and brushing device, the grinding and brushing device comprises a driving part, a fixing part and a grinding and brushing part, one side of the fixing part is provided with a connecting part, the driving part is connected with the connecting part, and the grinding and brushing part is arranged below the fixing part; the grinding and brushing part comprises a first grinding and brushing part, a second grinding and brushing part, a third grinding and brushing part, a cleaning part and a drying part which are sequentially arranged, the cleaning part is connected with a capillary part, and a liquid storage part is connected above the capillary part; the cleaning part is connected with an adsorption part which is connected with a liquid storage part; the first grinding and brushing part comprises symmetrically arranged rubber columns, and rubber heads are arranged at the tail ends of the rubber columns; the second grinding and brushing part is a brush part; the third grinding and brushing part comprises symmetrically arranged silica gel grinding and brushing columns; the cleaning part comprises a low-density sponge layer and a high-polymer hydrogel layer, the low-density sponge layer is symmetrically arranged on two sides of the high-polymer hydrogel layer, and the capillary tube part is connected with the middle part of the high-polymer hydrogel layer;
s2, feeding through a motion control platform, and reaching a grinding and brushing device area for pretreatment;
s3, continuously feeding the film by the motion control platform to reach the area of the line scanning device;
s4, starting a line scanning device, connecting a camera, and setting a trigger mode and an exposure mode;
s5, scanning is carried out through a CCD camera of the line scanning device;
s6, finding defects, and marking the defects as defective products to be removed; otherwise, the next station is entered.
2. The method according to claim 1, wherein the adsorption unit comprises an adsorption head, a suction pipe, and a pump, the adsorption head is connected to the pump through the suction pipe, and the pump is connected to the liquid storage unit through the suction pipe.
3. The scanning detection method for the defects of the pattern layers of the circuit board according to claim 2, wherein the drying part comprises a low-density sponge layer, a high-density sponge layer and a medium-density sponge layer which are sequentially arranged, and the adsorption head is arranged inside the medium-density sponge layer.
4. The method according to claim 3, wherein a water feeding pipe is arranged at the upper end of the liquid storage part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811456766.5A CN109765237B (en) | 2018-11-30 | 2018-11-30 | Scanning detection method for circuit board layer defects |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811456766.5A CN109765237B (en) | 2018-11-30 | 2018-11-30 | Scanning detection method for circuit board layer defects |
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| Publication Number | Publication Date |
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| CN109765237A CN109765237A (en) | 2019-05-17 |
| CN109765237B true CN109765237B (en) | 2021-09-17 |
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| CN201811456766.5A Active CN109765237B (en) | 2018-11-30 | 2018-11-30 | Scanning detection method for circuit board layer defects |
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| CN112387604B (en) * | 2021-01-04 | 2021-04-20 | 深圳和美精艺半导体科技股份有限公司 | Method for detecting packaging substrate through AVI (automatic voltage indicator) detector and automatic point finder in networking mode |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN201653920U (en) * | 2010-04-02 | 2010-11-24 | 南京协力电子科技集团有限公司 | Optical tester for electronic circuit boards |
| KR101794875B1 (en) * | 2015-01-30 | 2017-11-07 | 가부시키가이샤 하리즈 | Inspection apparatus for transparent plate, and inspection system including the same |
| CN104826826B (en) * | 2015-05-06 | 2017-03-08 | 昆山市亚明磊电子科技有限公司 | A kind of cleaning device of circuit board |
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