CN109762515A - A kind of bonding Embedding Material and preparation method thereof and the application in dry-type transformer - Google Patents
A kind of bonding Embedding Material and preparation method thereof and the application in dry-type transformer Download PDFInfo
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Abstract
Application the present invention relates to a kind of bonding Embedding Material and preparation method thereof and in dry-type transformer, the bonding Embedding Material includes component A and B component, it is in terms of 100% by the gross mass of component A, the component A includes following reaction raw materials: methyl vinyl dimethicone 30%-50%, methylhydrogenpolysi,oxane 3%-10%, heat filling 10%-40%, reinforced filling 5%~20%, inorganic agent 0.01%~1%, inhibitor 0.01%~0.1%；It is in terms of 100% by the gross mass of B component, the B component includes following reaction raw materials: methyl vinyl dimethicone 30%-50%, heat filling 10%-40%, reinforced filling 5%~20%, inorganic agent 0.01%~1%, catalyst 0.05%~0.2%, tackifier 1%~2%.The Embedding Material makes it have excellent thermal conductivity, high tensile strength and good cementability by the reasonable selection and collocation of each component and its mass percentage.
Description
Technical field
The invention belongs to Embedding Material field, it is related to a kind of bonding Embedding Material and its preparation method and application, especially relates to
And a kind of bonding Embedding Material and preparation method thereof and the application in dry-type transformer.
Background technique
Dry-type transformer has fire safety, and pollution-free, energy saving low-loss, low noise, adapts to high humility and other are severe
The features such as being run in environment, therefore it is widely used in the places such as local lighting, skyscraper, airport, harbour.The safety of dry-type transformer
Operation and service life are heavily dependent on Embedding Material, and pouring dry transformer uses epoxy resin or organic at present
Silicon materials are as insulating materials encapsulating into device.
CN108410416A discloses kind of encapsulating silica gel and its preparation method and application.Encapsulating silica gel of the invention, by A group
Part and B component composition, wherein the component A by weight, including following component: 20-45 parts of vinyl silicone oil, 2-7 parts
Containing hydrogen silicone oil, 40-80 parts of surface modifying stuffing, 0.01-0.1 parts of inhibitor；The B component by weight, including
Following component: 20-45 parts of vinyl silicone oil, 30-70 parts of surface modifying stuffing, 0.05-0.2 parts of catalyst.The present invention
Preparation method made from encapsulating silica gel, the coefficient of expansion is low, and the good leveling property in solidification, and surfacing is beautiful, in severe cold and
It is able to maintain good encapsulating effect under heat climatic environment, prevents cracking or the damage of component, but in thermal conductivity, tension
There is also defects in terms of intensity and cementability.
CN103242799A discloses a kind of low viscosity and solidifies high flexibility two-component condensed type encapsulating silica gel and its preparation fastly
Method, the encapsulating silica gel are grouped as by two groups of A, B, and the mass ratio of two component of A, B is (8-12): 1；Component A: 100 parts of end hydroxyls
Based polysiloxane, 20-100 part filler, 5-50 parts of plasticizer, 0.1-5 parts of colorants；B component: 1-5 parts of crosslinking agents, 1-5 parts of couplings
Agent, 0.01-0.5 parts of catalyst, 5-10 parts of plasticizer, 0.5-5 parts of chain extenders.The two-component condensed type encapsulating silicon of invention preparation
Glue has low viscosity, solidifies fastly, the performance of high flexibility, and levelability is improved, but its thermal conductivity, tensile strength and cementability have
Wait further increase.
CN105623593A discloses a kind of two-component encapsulating silica gel, including two component of A and B, and the component A includes following
The raw material of mass parts: 100 parts of vinyl silicone oil, 0-100 parts of non-reactive silicone oil, 0.05-10 parts of hollow powder, transition metal network
0.01-1.5 parts of mixture catalyst, 0-3 parts of stock white；The B component includes the raw material of following mass parts: vinyl silicone oil 100
Part, 0-100 parts of non-reactive silicone oil, 0.05-10 parts of hollow powder, 0.01-1 parts of alkyne inhibitor, containing hydrogen silicone oil 10-40
Part, 0-3 parts of black slurry.The encapsulating silica gel has excellent impact resistance, least, flexibility, sound-proofing, waterproofness and vapour proof
Property, but thermal conductivity and cementability need to be further increased.
To sum up, develop that a kind of excellent heat conductivity, tensile strength are high and cementability is good, and preparation method and application method are simple
Single easy dry-type transformer bonding Embedding Material is meaningful.
Summary of the invention
In view of the deficiencies of the prior art, the purpose of the present invention is to provide a kind of bonding Embedding Material and preparation method thereof and
Using especially providing a kind of bonding Embedding Material and preparation method thereof and the application in dry-type transformer.
In order to achieve that object of the invention, the invention adopts the following technical scheme:
On the one hand, the present invention provides a kind of bonding Embedding Material, and the bonding Embedding Material includes component A and B component；
It is in terms of 100% by the gross mass of component A, the component A includes that following mass percentage prepares raw material: methyl
Vinyldimethicone 30%-50%, methylhydrogenpolysi,oxane 3%-10%, heat filling 10%-40%, reinforcement are filled out
Expect 5%~20%, inorganic agent 0.01%~1%, inhibitor 0.01%~0.1%；
It is in terms of 100% by the gross mass of B component, the B component includes that following mass percentage prepares raw material: methyl
Vinyldimethicone 30%-50%, heat filling 10%-40%, reinforced filling 5%~20%, inorganic agent
0.01%~1%, catalyst 0.05%~0.2%, tackifier 1%~2%.
Dry-type transformer Embedding Material of the present invention is a kind of material of organic silicon, and good insulating, soil resistance is excellent,
Radiation hardness is waterproof and dampproof, and the present invention adds heat filling, reinforced filling, tackifier by preparing in Embedding Material in raw material, and
By the reasonable selection and collocation of each component and its mass percentage, make the Embedding Material that there is excellent thermal conductivity, high
Tensile strength and good cementability.
In component A, the mass percentage of methyl vinyl dimethicone can be 30%, 31%, 32%,
33%, 34% or 35% etc..
In component A, the mass percentage of methylhydrogenpolysi,oxane can be 3%, 4%, 5%, 6%, 7%, 8%,
9% or 10% etc..
In component A, the mass percentage of heat filling can be 10%, 15%, 20%, 25%, 30%, 35% or
40% etc..
In component A, the mass percentage of reinforced filling can be 5%, 8%, 10%, 12%, 15%, 18% or
20% etc..
In component A, the mass percentage of inorganic agent can be 0.01%, 0.05%, 0.1%, 0.2%, 0.5%,
0.8% or 1% etc..
In component A, the mass percentage of inhibitor can be 0.01%, 0.02%, 0.03%, 0.04%,
0.05%, 0.06%, 0.07%, 0.08%, 0.09% or 0.1% etc..
In B component, the mass percentage of methyl vinyl dimethicone can be 30%, 31%, 32%,
33%, 34% or 35% etc..
In B component, the mass percentage of heat filling can be 10%, 15%, 20%, 25%, 30%, 35% or
40% etc..
In B component, the mass percentage of reinforced filling can be 5%, 8%, 10%, 12%, 15%, 18% or
20% etc..
In B component, the mass percentage of inorganic agent can be 0.01%, 0.05%, 0.1%, 0.2%, 0.5%,
0.8% or 1% etc..
In B component, the mass percentage of catalyst can be 0.05%, 0.06%, 0.08%, 0.1%, 0.15%
Or 0.2% etc..
In B component, the mass percentage of tackifier can be 1%, 1.1%, 1.2%, 1.4%, 1.6%, 1.8%
Or 2% etc..
Preferably, the mass ratio of component A and B component be 1:(0.8-1.3), such as 1:0.8,1:0.9,1:1.0,1:1.1,
1:1.2 or 1:1.3 etc..
Preferably, the structural formula of the methyl vinyl dimethicone is CH2=CHSi (R1R2)O[(R1R2)
SiO2/2]m(R1R2) SiCH=CH2, wherein R1And R2Independently selected from-CH3、-C2H5Or-C6H5In any one, and R1And R2
It is not simultaneously-C6H5, m is selected from any integer of 50-400, for example, m can for 50,60,70,80,100,150,200,250,
300,350 or 400 etc..
Any integer within the scope of the specific selection 50-400 of m, because the tension of Embedding Material can be made less than this value range
Intensity, elongation and the equal sharp fall of shear strength, can make the viscosity of Embedding Material excessive, mobility is not more than this range
It is good.
Preferably, the structural formula of the methylhydrogenpolysi,oxane is (CH3)3SiO[R3R4SiO2/2]p[(R3)2SiO2/2]qSi
(CH3)3, wherein R3Independently selected from-CH3、-C2H5Or-C6H5In any one, R4Selected from-H, p is selected from any whole of 24-75
Number, q are selected from any integer of 24-75, such as p can be 24,30,35,40,45,50,55,60 or 75 etc., q can for 24,
30,35,40,45,50,55,60 or 75 etc..
Preferably, the heat filling includes any one in aluminum oxide, boron nitride or aluminium nitride or at least two
Kind combination, the described at least two combination combination of such as aluminum oxide and boron nitride, the combination of boron nitride and aluminium nitride,
Aluminum oxide and the combination of boron nitride and aluminium nitride etc..
Preferably, the reinforced filling includes any in precipitated silica, fume colloidal silica, calcium carbonate or carbon black
It is a kind of or at least two combination, described at least two combination such as precipitated silica and fume colloidal silica combination,
Combination, fume colloidal silica and the calcium carbonate of calcium carbonate and carbon black and the combination of carbon black etc., preferably precipitated silica.
Preferably, the specific surface area of the precipitated silica is 120-200m2, such as 120m2、130m2、140m2、
150m2、160m2、170m2、180m2、190m2Or 200m2Deng.
Preferably, the inorganic agent includes hexamethyldisilazane, methyltrimethoxysilane, vinyl trimethoxy silicon
In alkane, methyltriethoxysilane or vinyltriethoxysilane any one or at least two combination, it is described at least
Combination, vinyltrimethoxysilane and the methyl of two kinds of combination such as hexamethyldisilazane and methyltrimethoxysilane
Combination, methyltriethoxysilane and combination of vinyltriethoxysilane of triethoxysilane etc..
Preferably, the inhibitor includes alkynol, vinyl ring body, ether compound, fumaric acid esters compound or cyanogen
In class compound any one or at least two combination, described at least two combination such as alkynol and vinyl ring body
It combines, combination, ether compound and the fumaric acid esters compound and cyanides of vinyl ring body and ether compound
Combination etc..
Preferably, the catalyst is platinum catalyst.
Preferably, the platinum catalyst is the complex and the mixture of end-vinyl polysiloxanes or the chelating of platinum of platinum
The mixture of object and end-vinyl polysiloxanes.
Preferably, the tackifier include aminopropyl triethoxysilane, aminopropyl trimethoxysilane, glycidol ether
In oxygen propyl trimethoxy silicane or methacryloxypropyl trimethoxy silane any one or at least two group
It closes, the combination of described at least two combination such as aminopropyl triethoxysilane and aminopropyl trimethoxysilane, aminopropyl
Combination, aminopropyl triethoxysilane and the aminopropyl three of trimethoxy silane and glycidyl ether oxygen propyl trimethoxy silicane
Methoxy silane and the combination of glycidyl ether oxygen propyl trimethoxy silicane etc..
On the other hand, the present invention provides a kind of preparation method of bonding Embedding Material as described above, the preparation method
Are as follows:
(1) based on mass percentage, by 30%-50% methyl vinyl dimethicone, 3%-10% methyl
Blender the is added in hydrogen polysiloxanes, 10%-40% heat filling, 5%~20% reinforced filling and 0.01%~1% inorganic agent
Primary heating stirring, adds 0.01%~0.1% inhibitor, second of heating stirring, obtains component A；
(2) based on mass percentage, 30%-50% methyl vinyl dimethicone, 10%-40% is thermally conductive
Filler, 5%~20% reinforced filling, 0.01%~1% inorganic agent and 1%~2% tackifier are added blender and heat for the first time
Stirring, adds 0.05%~0.2% catalyst, second of heating stirring, obtains B component.
Preparation method is simple for this.
Preferably, the temperature of step (1) the first time heating stirring is 80-90 DEG C, such as 80 DEG C, 81 DEG C, 82 DEG C, 83
DEG C, 84 DEG C, 85 DEG C, 86 DEG C, 87 DEG C, 88 DEG C, 89 DEG C or 90 DEG C etc..
Preferably, the time of step (1) the first time heating stirring be 30-40min, such as 30min, 31min,
32min, 34min, 35min, 36min, 37min, 38min or 40min etc..
Preferably, the temperature of step (1) second of heating stirring is 80-90 DEG C, such as 80 DEG C, 81 DEG C, 82 DEG C, 83
DEG C, 84 DEG C, 85 DEG C, 86 DEG C, 87 DEG C, 88 DEG C, 89 DEG C or 90 DEG C etc..
Preferably, the time of step (1) second of heating stirring be 5-10min, such as 5min, 6min, 7min,
8min, 9min or 10min etc..
Preferably, the temperature of step (2) the first time heating stirring is 80-90 DEG C, such as 80 DEG C, 81 DEG C, 82 DEG C, 83
DEG C, 84 DEG C, 85 DEG C, 86 DEG C, 87 DEG C, 88 DEG C, 89 DEG C or 90 DEG C etc..
Preferably, the time of step (2) the first time heating stirring be 2-3h, such as 2h, 2.2h, 2.4h, 2.6h,
2.8h, 2.9h or 3h etc..
Preferably, the temperature of step (2) second of heating stirring is 80-90 DEG C, such as 80 DEG C, 81 DEG C, 82 DEG C, 83
DEG C, 84 DEG C, 85 DEG C, 86 DEG C, 87 DEG C, 88 DEG C, 89 DEG C or 90 DEG C etc..
Preferably, the time of step (2) second of heating stirring be 5-10min, such as 5min, 6min, 7min,
8min, 9min or 10min etc..
In another aspect, the present invention provides one kind bonding Embedding Material as described above in dry-type transformer bonding encapsulating
Using.
Preferably, the method for the application are as follows: component A and B component are mixed, can be used to dry type after vacuum defoamation
The bonding encapsulating of transformer, the application method are simple and easy.
Compared with the existing technology, the invention has the following advantages:
Dry-type transformer bonding Embedding Material of the present invention is a kind of material of organic silicon, and good insulating is antifouling
Property it is excellent, radiation hardness is waterproof and dampproof, and the present invention is by preparing in raw material addition heat filling, reinforced filling, thickening in Embedding Material
Agent, and by the reasonable selection and collocation of each component and its mass percentage, make the Embedding Material have excellent thermal conductivity,
High tensile strength and good cementability.
Specific embodiment
Further to illustrate technological means and its effect adopted by the present invention, below in conjunction with preferred implementation of the invention
Example to further illustrate the technical scheme of the present invention, but the present invention is not limited in scope of embodiments.
Embodiment 1
The present embodiment provides a kind of dry-type transformers to be bonded Embedding Material, and the bonding Embedding Material includes component A and B group
Point；
Component A is to prepare raw material including following mass percentage based on 100% by gross mass: the poly- diformazan of methyl ethylene
Radical siloxane 50%, methylhydrogenpolysi,oxane 5%, aluminum oxide 29.75%, precipitated silica 15%, two silicon of hexamethyl
Azane 0.2%, acetylene alcohol 0.05%；
B component is to prepare raw material including following mass percentage based on 100% by gross mass: the poly- diformazan of methyl ethylene
Radical siloxane 50%, aluminum oxide 33.2%, precipitated silica 15%, hexamethyldisilazane 0.2%, platinum catalyst
0.1%, aminopropyl triethoxysilane 1.5%.
Wherein, the structural formula of methyl vinyl dimethicone is CH2=CHSi (R1R2)O[(R1R2)SiO2/2]m
(R1R2) SiCH=CH2, wherein R1For-CH3、R2For-C2H5, m 350；The structural formula of methylhydrogenpolysi,oxane is (CH3)3SiO
[R3R4SiO2/2]p[(R3)2SiO2/2]qSi(CH3)3, wherein R3For-CH3, R4For-H, p 50, q 55.
The dry-type transformer be bonded Embedding Material the preparation method comprises the following steps:
It will be stirred in component A in addition to each raw material of inhibitor is heated at 80 DEG C by above-mentioned mass percentage addition blender
40min is mixed, the acetylene alcohol of the above-mentioned mass percentage heating stirring 10min at 80 DEG C is added, obtains component A；
It will be stirred in B component in addition to each raw material of catalyst is heated at 90 DEG C by above-mentioned mass percentage addition blender
2h is mixed, the platinum catalyst of the above-mentioned mass percentage heating stirring 5min at 90 DEG C is added, obtains B component.
It is in mass ratio that 1:1 is mixed by component A and B component, it is spare after progress vacuum defoamation.
Embodiment 2
The present embodiment provides a kind of dry-type transformers to be bonded Embedding Material, and the bonding Embedding Material includes component A and B group
Point；
Component A is to prepare raw material including following mass percentage based on 100% by gross mass: the poly- diformazan of methyl ethylene
Radical siloxane 30%, methylhydrogenpolysi,oxane 10%, boron nitride 40%, fume colloidal silica 19.75%, methyl trimethoxy oxygroup silicon
Alkane 0.2%, propilolic alcohol 0.05%；
B component is to prepare raw material including following mass percentage based on 100% by gross mass: the poly- diformazan of methyl ethylene
Radical siloxane 40%, boron nitride 40%, fume colloidal silica 18.2%, methyltrimethoxysilane 0.2%, platinum catalyst
0.1%, glycidyl ether oxygen propyl trimethoxy silicane 1.5%.
Wherein, the structural formula of methyl vinyl dimethicone is CH2=CHSi (R1R2)O[(R1R2)SiO2/2]m
(R1R2) SiCH=CH2, wherein R1For-CH3、R2For-C5H6, m 350；The structural formula of methylhydrogenpolysi,oxane is (CH3)3SiO
[R3R4SiO2/2]p[(R3)2SiO2/2]qSi(CH3)3, wherein R3For-CH3, R4For-H, p 50, q 55.
The dry-type transformer be bonded Embedding Material the preparation method comprises the following steps:
It will be stirred in component A in addition to each raw material of inhibitor is heated at 90 DEG C by above-mentioned mass percentage addition blender
30min is mixed, the acetylene alcohol of the above-mentioned mass percentage heating stirring 5min at 90 DEG C is added, obtains component A；
It will be stirred in B component in addition to each raw material of catalyst is heated at 80 DEG C by above-mentioned mass percentage addition blender
3h is mixed, the platinum catalyst of the above-mentioned mass percentage heating stirring 10min at 80 DEG C is added, obtains B component.
It is in mass ratio that 1:1.3 is mixed by component A and B component, it is spare after progress vacuum defoamation.
Embodiment 3
The present embodiment provides a kind of dry-type transformers to be bonded Embedding Material, and the bonding Embedding Material includes component A and B group
Point；
Component A is to prepare raw material including following mass percentage based on 100% by gross mass: the poly- diformazan of methyl ethylene
Radical siloxane 30%, methylhydrogenpolysi,oxane 10%, aluminium nitride 40%, carbon black 19.75%, vinyltrimethoxysilane
0.2%, propilolic alcohol 0.05%；
B component is to prepare raw material including following mass percentage based on 100% by gross mass: the poly- diformazan of methyl ethylene
Radical siloxane 40%, aluminium nitride 40%, carbon black 18.2%, vinyltrimethoxysilane 0.2%, platinum catalyst 0.1%, ammonia
Propyl trimethoxy silicane 1.5%.
Wherein, the structural formula of methyl vinyl dimethicone is CH2=CHSi (R1R2)O[(R1R2)SiO2/2]m
(R1R2) SiCH=CH2, wherein R1For-C2H5、R2For-C2H5, m 350；The structural formula of methylhydrogenpolysi,oxane is (CH3)3SiO
[R3R4SiO2/2]p[(R3)2SiO2/2]qSi(CH3)3, wherein R3For-C2H5, R4For-H, p 50, q 55.
The dry-type transformer be bonded Embedding Material the preparation method comprises the following steps:
It will be stirred in component A in addition to each raw material of inhibitor is heated at 80 DEG C by above-mentioned mass percentage addition blender
40min is mixed, the acetylene alcohol of the above-mentioned mass percentage heating stirring 10min at 80 DEG C is added, obtains component A；
It will be stirred in B component in addition to each raw material of catalyst is heated at 90 DEG C by above-mentioned mass percentage addition blender
2h is mixed, the platinum catalyst of the above-mentioned mass percentage heating stirring 5min at 90 DEG C is added, obtains B component.
It is in mass ratio that 1:0.8 is mixed by component A and B component, it is spare after progress vacuum defoamation.
Embodiment 4
The present embodiment provides a kind of dry-type transformers to be bonded Embedding Material, and the bonding Embedding Material includes component A and B group
Point, the difference with embodiment 1 is only that methyl vinyl dimethicone structural formula CH2=CHSi (R1R2)O
[(R1R2)SiO2/2]m(R1R2) SiCH=CH2In m be 400, other compositions are consistent；
The preparation method that the dry-type transformer is bonded Embedding Material is same as Example 1；
It is in mass ratio that 1:0.8 is mixed by component A and B component, it is spare after progress vacuum defoamation.
Embodiment 5
The present embodiment provides a kind of dry-type transformers to be bonded Embedding Material, and the bonding Embedding Material includes component A and B group
Point, the difference with embodiment 1 is only that methyl vinyl dimethicone structural formula CH2=CHSi (R1R2)O
[(R1R2)SiO2/2]m(R1R2) SiCH=CH2In m be 50, other compositions are consistent；
The preparation method that the dry-type transformer is bonded Embedding Material is same as Example 1；
It is in mass ratio that 1:0.8 is mixed by component A and B component, it is spare after progress vacuum defoamation.
Embodiment 6
The present embodiment provides a kind of dry-type transformers to be bonded Embedding Material, and the bonding Embedding Material includes component A and B group
Point, the difference with embodiment 1 is only that methyl vinyl dimethicone structural formula CH2=CHSi (R1R2)O
[(R1R2)SiO2/2]m(R1R2) SiCH=CH2In m be 40, other compositions are consistent；
The preparation method that the dry-type transformer is bonded Embedding Material is same as Example 1；
It is in mass ratio that 1:0.8 is mixed by component A and B component, it is spare after progress vacuum defoamation.
Embodiment 7
The present embodiment provides a kind of dry-type transformers to be bonded Embedding Material, and the bonding Embedding Material includes component A and B group
Point, the difference with embodiment 1 is only that methyl vinyl dimethicone structural formula CH2=CHSi (R1R2)O
[(R1R2)SiO2/2]m(R1R2) SiCH=CH2In m be 450, other compositions are consistent；
The preparation method that the dry-type transformer is bonded Embedding Material is same as Example 1；
It is in mass ratio that 1:0.8 is mixed by component A and B component, it is spare after progress vacuum defoamation.
Comparative example 1
The present embodiment provides a kind of dry-type transformers to be bonded Embedding Material, and the bonding Embedding Material includes component A and B group
Point, the difference with embodiment 1 is only that the heat filling aluminum oxide removal in component A and B component, component A and B group
Mass ratio in point between other each ingredients remains unchanged；
The preparation method that the dry-type transformer is bonded Embedding Material is same as Example 1；
It is in mass ratio that 1:0.8 is mixed by component A and B component, it is spare after progress vacuum defoamation.
Comparative example 2
The present embodiment provides a kind of dry-type transformers to be bonded Embedding Material, and the bonding Embedding Material includes component A and B group
Point, the difference with embodiment 1 is only that the reinforced filling precipitated silica removal in component A and B component, component A and B
Mass ratio between each ingredient of other in component remains unchanged；
The preparation method that the dry-type transformer is bonded Embedding Material is same as Example 1；
It is in mass ratio that 1:0.8 is mixed by component A and B component, it is spare after progress vacuum defoamation.
Comparative example 3
The present embodiment provides a kind of dry-type transformers to be bonded Embedding Material, and the bonding Embedding Material includes component A and B group
Point, the difference with embodiment 1, which is only that, removes the tackifier aminopropyl triethoxysilane in B component, other in B component
Mass ratio between each ingredient remains unchanged；
The preparation method that the dry-type transformer is bonded Embedding Material is same as Example 1；
It is in mass ratio that 1:0.8 is mixed by component A and B component, it is spare after progress vacuum defoamation.
The spare dry-type transformer bonding Embedding Material that embodiment 1-7 and comparative example 1-3 are obtained carries out following performance
Test:
(1) cementability is tested, and specific test method is carried out according to GB/T 529-2008；
(2) heating conduction is tested, and specific test method is carried out according to ASTM D5470；
(3) tensile strength test, specific test method are carried out according to GB/T 528-2009；
(4) test of elongation rate, specific test method are carried out according to GB/T 528-2009.
Test result is as shown in table 1:
Table 1
From 1 data of table: Embedding Material of the present invention is filled out by adding heat filling, reinforcement in preparing raw material
Material and tackifier, and by the reasonable selection and collocation of each component and its mass percentage, there is the Embedding Material excellent
Thermal conductivity, high elongation and good cementability, thermal coefficient is up to 1-1.8W/mK, and elongation is up to 60%-
380%, shear strength is up to 0.4-1.2MPa.
The Applicant declares that the present invention is explained by the above embodiments bonding Embedding Material and preparation method thereof of the invention
With the application in dry-type transformer, but the present invention is not limited to the above embodiments, that is, does not mean that the present invention must rely on
Above-described embodiment could be implemented.It should be clear to those skilled in the art, any improvement in the present invention, to the present invention
The equivalence replacement of each raw material of product and addition, the selection of concrete mode of auxiliary element etc., all fall within protection scope of the present invention
Within the open scope.
The preferred embodiment of the present invention has been described above in detail, still, during present invention is not limited to the embodiments described above
Detail within the scope of the technical concept of the present invention can be with various simple variants of the technical solution of the present invention are made, this
A little simple variants all belong to the scope of protection of the present invention.
It is further to note that specific technical features described in the above specific embodiments, in not lance
In the case where shield, can be combined in any appropriate way, in order to avoid unnecessary repetition, the present invention to it is various can
No further explanation will be given for the combination of energy.
Claims (10)
1. a kind of bonding Embedding Material, which is characterized in that the bonding Embedding Material includes component A and B component；
It is in terms of 100% by the gross mass of component A, the component A includes that following mass percentage prepares raw material: ethylene methacrylic
Base dimethyl silicone polymer 30%-50%, methylhydrogenpolysi,oxane 3%-10%, heat filling 10%-40%, reinforced filling
5%~20%, inorganic agent 0.01%~1%, inhibitor 0.01%~0.1%；
It is in terms of 100% by the gross mass of B component, the B component includes that following mass percentage prepares raw material: ethylene methacrylic
Base dimethyl silicone polymer 30%-50%, heat filling 10%-40%, reinforced filling 5%~20%, inorganic agent 0.01%~
1%, catalyst 0.05%~0.2%, tackifier 1%~2%.
2. bonding Embedding Material as described in claim 1, which is characterized in that the mass ratio of component A and B component is 1:(0.8-
1.3)；
Preferably, the structural formula of the methyl vinyl dimethicone is CH2=CHSi (R1R2)O[(R1R2)SiO2/2]m
(R1R2) SiCH=CH2, wherein R1And R2Independently selected from-CH3、-C2H5Or-C6H5In any one, and R1And R2When different
For-C6H5, any integer of the m selected from 50-400.
3. bonding Embedding Material as claimed in claim 1 or 2, which is characterized in that the structural formula of the methylhydrogenpolysi,oxane
For (CH3)3SiO[R3R4SiO2/2]p[(R3)2SiO2/2]qSi(CH3)3, wherein R3Independently selected from-CH3、-C2H5Or-C6H5In
Any one, R4It is selected from any integer of 24-75 selected from-H, p, q is selected from any integer of 24-75.
4. bonding Embedding Material as claimed in any one of claims 1-3, which is characterized in that the heat filling includes three oxygen
Change in two aluminium, boron nitride or aluminium nitride any one or at least two combination；
Preferably, the reinforced filling includes any one in precipitated silica, fume colloidal silica, calcium carbonate or carbon black
Or at least two combination, preferred precipitated silica；
Preferably, the specific surface area of the precipitated silica is 120-200m2。
5. such as bonding Embedding Material of any of claims 1-4, which is characterized in that the inorganic agent includes hexamethyl
Disilazane, methyltrimethoxysilane, vinyltrimethoxysilane, methyltriethoxysilane or vinyl triethoxyl
In silane any one or at least two combination；
Preferably, the inhibitor includes alkynol, vinyl ring body, ether compound, fumaric acid esters compound or cyanogen class
Close object in any one or at least two combination.
6. bonding Embedding Material according to any one of claims 1 to 5, which is characterized in that the catalyst is platinum catalysis
Agent；
Preferably, the platinum catalyst be platinum complex and end-vinyl polysiloxanes mixture or platinum chelate with
The mixture of end-vinyl polysiloxanes.
7. such as bonding Embedding Material of any of claims 1-6, which is characterized in that the tackifier include aminopropyl
Triethoxysilane, aminopropyl trimethoxysilane, glycidyl ether oxygen propyl trimethoxy silicane or methacryloxy
In propyl trimethoxy silicane any one or at least two combination.
8. such as the preparation method of bonding Embedding Material of any of claims 1-7, which is characterized in that the preparation side
Method are as follows:
(1) based on mass percentage, 30%-50% methyl vinyl dimethicone, 3%-10% methyl hydrogen are gathered
Blender is added for the first time in siloxanes, 10%-40% heat filling, 5%~20% reinforced filling and 0.01%~1% inorganic agent
Heating stirring adds 0.01%~0.1% inhibitor, second of heating stirring, obtains component A；
(2) based on mass percentage, by 30%-50% methyl vinyl dimethicone, 10%-40% is thermally conductive fills out
Blender is added in material, 5%~20% reinforced filling, 0.01%~1% inorganic agent and 1%~2% tackifier, and heating is stirred for the first time
It mixes, adds 0.05%~0.2% catalyst, second of heating stirring, obtain B component.
9. the preparation method of bonding Embedding Material as claimed in claim 8, which is characterized in that step (1) first time adds
The temperature of thermal agitation is 80-90 DEG C；
Preferably, the time of step (1) the first time heating stirring is 30-40min；
Preferably, the temperature of step (1) second of heating stirring is 80-90 DEG C；
Preferably, the time of step (1) second of heating stirring is 5-10min；
Preferably, the temperature of step (2) the first time heating stirring is 80-90 DEG C；
Preferably, the time of step (2) the first time heating stirring is 2-3h；
Preferably, the temperature of step (2) second of heating stirring is 80-90 DEG C；
Preferably, the time of step (2) second of heating stirring is 5-10min.
10. such as application of the bonding Embedding Material of any of claims 1-7 in dry-type transformer bonding encapsulating；
Preferably, the method for the application are as follows: component A and B component are mixed, can be used to dry type transformation after vacuum defoamation
The bonding encapsulating of device.
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