CN109755263A - Photosensory assembly and preparation method thereof and camera module - Google Patents
Photosensory assembly and preparation method thereof and camera module Download PDFInfo
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- CN109755263A CN109755263A CN201711070039.0A CN201711070039A CN109755263A CN 109755263 A CN109755263 A CN 109755263A CN 201711070039 A CN201711070039 A CN 201711070039A CN 109755263 A CN109755263 A CN 109755263A
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Abstract
The present invention relates to a kind of photosensory assembly and preparation method thereof and camera modules.The photosensory assembly, comprising: circuit board；Sensitive chip is connected on circuit board, and sensitive chip includes photosensitive surface；First adhesive layer, between sensitive chip and circuit board；Second adhesive layer, the material of the second adhesive layer is different from the first adhesive layer, and the second adhesive layer includes Bonded Ring, and Bonded Ring surround the first adhesive layer between sensitive chip and circuit board；Packaging body, encapsulated moulding is on circuit board and covering part photosensitive surface.In above-mentioned photosensory assembly, circuit board and sensitive chip are connected using the first different adhesive layer of material and the second adhesive layer, the stress that the injection molding region and non-injection molding region that sensitive chip can be balanced are subject to, to balanced entire packaging body stress distribution, reduce the stress difference in injection molding region and non-injection molding region, and then the reliability of above-mentioned photosensory assembly is promoted, namely sensitive chip is avoided to heave warpage, promote the quality of above-mentioned photosensory assembly.
Description
Technical field
The present invention relates to field of camera technology, more particularly to a kind of photosensory assembly and preparation method thereof and camera shooting mould
Group.
Background technique
As shown in Figure 1, traditional camera module generally includes photosensory assembly 10 and lens assembly (not shown), photosensory assembly
10 include circuit board 11, sensitive chip 12, adhesive layer 13, conductor wire 14 and packaging body 15.Sensitive chip 12 passes through adhesive layer
13 are fixedly connected with circuit board 11, and sensitive chip 12 is electrically connected by conductor wire 14 with circuit board 11.Using what is be molded
Mode (molding processing procedure) forms packaging body 15, and the edge of sensitive chip 12 and conductor wire 14 is made to be packaged in packaging body 15
It is interior.Lens assembly is set to the one end of packaging body 15 far from circuit board 11.
Since the fringe region of sensitive chip 12 is injection molding region, the central area of sensitive chip 12 is non-injection molding region,
The high temperature and pressure of molding processing procedure will lead to the fringe region of sensitive chip 12, and there are stress differences with central area.
Summary of the invention
Based on this, it is necessary to provide it is a kind of can balance sensitive chip injection molding region and it is non-be molded region stress it is photosensitive
Component and preparation method thereof and camera module.
A kind of photosensory assembly, comprising:
Circuit board；
Sensitive chip, is connected to the circuit board, and the sensitive chip includes photosensitive surface；
First adhesive layer, between the sensitive chip and the circuit board；
Second adhesive layer, the material of second adhesive layer is different from first adhesive layer, the second adhesive layer packet
Bonded Ring is included, the Bonded Ring surround first adhesive layer between the sensitive chip and the circuit board；And
Packaging body, encapsulated moulding is on the circuit board and photosensitive surface described in covering part.
In above-mentioned photosensory assembly, circuit board and sensitive chip are connected using the different adhesive layer of material and Bonded Ring,
The stress that the injection molding region and non-injection molding region that sensitive chip can be balanced are subject to, thus balanced entire packaging body stress distribution,
The stress difference in injection molding region and non-injection molding region is reduced, and then promotes the reliability of above-mentioned photosensory assembly, namely avoid photosensitive core
Piece heaves warpage, promotes the quality of above-mentioned photosensory assembly.
The second adhesive layer material is any in epoxy resin, silica gel and acrylic acid in one of the embodiments,
It is a kind of.The material of second adhesive layer is any one in epoxy resin, silica gel and acrylic acid, in packaging body high temperature molding
In processing procedure, the second adhesive layer is not affected by high temperatures generation deformation, and sensitive chip is avoided to heave warpage, promotes the matter of photosensory assembly
Amount.
The sensitive chip further includes the connection surface opposite with the photosensitive surface, institute in one of the embodiments,
State the 2%~90% of the area of connection surface described in bonding ring cover.The area for bonding ring cover connection surface is too small, cannot be very
The stress that the injection molding region of good balance sensitive chip and non-injection molding region are subject to, and since the second adhesive flows into photosensitive core
There is resistance between piece and circuit board, if the area of bonding ring cover connection surface is too big, the manufacture difficulty of Bonded Ring increases,
In summary, the 2%~90% of the area of setting bonding ring cover connection surface.
First adhesive layer covers the 10%~95% of the area of the connection surface in one of the embodiments,.
First adhesive layer covers the area of connection surface and the area of bonding ring cover connection surface cooperates, and guarantees sensitive chip and circuit
Plate securely connects.When the area of the first adhesive layer covering connection surface is minimized (10%), bonding ring cover connection surface
When area is maximized (90%), at this point, connection surface is completely capped, sensitive chip can securely be connect with circuit board；When
When the area of first adhesive layer covering connection surface is maximized (95%), it also can guarantee that sensitive chip securely connects with circuit board
It connects, and when the area for bonding ring cover connection surface is minimized (2%), at this point, between Bonded Ring and the first adhesive layer
There may be gap, gap can further balance the stress that the injection molding region of sensitive chip is subject to non-injection molding region.
Second adhesive layer further includes the bonding cylinder on the circuit board in one of the embodiments, described
Bonding cylinder connects the Bonded Ring and closes the side wall of the sensitive chip, and the packaging body covers the appearance of the bonding cylinder
Face.Packaging body is directly connected with the side wall of sensitive chip, be will lead to the stress that encapsulation generates and is directly acted on sensitive chip
On.Cylinder is bonded by setting, and to bond the side wall of cylinder covering sensitive chip and the lateral wall of Bonded Ring, it can be to avoid envelope
Dress body is directly contacted with the side wall of sensitive chip, and the stress so as to avoid encapsulation from generating directly acts on sensitive chip.
The photosensory assembly further includes conductor wire in one of the embodiments, and the circuit board is equipped with the first solder joint,
The sensitive chip is equipped with the second solder joint, and the both ends of the conductor wire connect with first solder joint and second solder joint respectively
It connects, first solder joint is located in the bonding cylinder.First solder joint is directly connected with packaging body, will lead to what encapsulation generated
Stress directly acts on the junction of the first solder joint and conductor wire, causes conductor wire and the first solder joint to disconnect, is electrically connected
Bad problem.It bonds cylinder and closes the first solder joint, can directly be contacted with the first solder joint to avoid packaging body, so as to effectively keep away
Exempt from the case where conductor wire and disconnection of the first solder joint occur.
Photosensitive surface described in the bonding cylinder covering part, second solder joint are located at institute in one of the embodiments,
It states in bonding cylinder.Second solder joint is directly connected with packaging body, be will lead to the stress that encapsulation generates and is directly acted on the second weldering
The junction of point and conductor wire causes conductor wire and the second solder joint to disconnect, occurs being electrically connected bad problem.Bond cylinder closing
Second solder joint can directly be contacted with the second solder joint to avoid packaging body, so as to effectively avoid the occurrence of conductor wire and the second weldering
The case where point disconnects.
A kind of production method of photosensory assembly, includes the following steps:
There is provided circuit board and sensitive chip, the sensitive chip includes photosensitive surface and opposite with the photosensitive surface
Connection surface；
First adhesive is provided, forms the first adhesive layer in the circuit board and the sensitive chip；
There is provided material second adhesive different from the first adhesive, so that second adhesive flows into the circuit board
Between the sensitive chip, and form the second adhesive layer；
Solidify first adhesive layer to form the first adhesive layer, while it is viscous to form second to solidify second adhesive layer
Tie layer；And
Molding forms packaging body, and packaging body encapsulated moulding is on circuit board and covering part photosensitive surface.
Photosensory assembly made by the above method, can balance sensitive chip injection molding region and non-injection molding region by
Stress, so that balanced entire packaging body stress distribution, reduces the stress difference in injection molding region and non-injection molding region, and then promoted
The reliability of photosensory assembly is stated, namely sensitive chip is avoided to heave warpage, promotes the quality of above-mentioned photosensory assembly.Solidification the simultaneously
One adhesive layer and the second adhesive layer, it is possible to reduce making step.
A kind of production method of photosensory assembly, includes the following steps:
There is provided circuit board and sensitive chip, the sensitive chip includes photosensitive surface and opposite with the photosensitive surface
Connection surface；
First adhesive is provided, forms the first adhesive layer in the circuit board and the sensitive chip；
Solidify first adhesive layer to form the first adhesive layer；
There is provided material second adhesive different from the first adhesive, so that second adhesive flows into the circuit board
Between the sensitive chip, and form the second adhesive layer；
Solidify second adhesive layer to form the second adhesive layer；And
Molding forms packaging body, and packaging body encapsulated moulding is on circuit board and covering part photosensitive surface.
Photosensory assembly made by the above method, can balance sensitive chip injection molding region and non-injection molding region by
Stress, so that balanced entire packaging body stress distribution, reduces the stress difference in injection molding region and non-injection molding region, and then promoted
The reliability of photosensory assembly is stated, namely sensitive chip is avoided to heave warpage, promotes the quality of above-mentioned photosensory assembly.Preparatory shape simultaneously
At the first adhesive layer the position of circuit board and sensitive chip can be made to fix, can effectively avoid, formed the second adhesive layer
The step of in, the relative position of circuit board and sensitive chip changes.
A kind of camera module, comprising:
Above-mentioned photosensory assembly；And
Lens assembly, the lens assembly are set on the one end of the packaging body far from the circuit board.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of traditional photosensory assembly；
Fig. 2 is the structural schematic diagram of the photosensory assembly of an embodiment of the present invention；
Fig. 3 is the structural schematic diagram of the right end of the photosensory assembly in Fig. 2；
Fig. 4 is the structural schematic diagram of the photosensory assembly of another embodiment of the present invention；
Fig. 5 is the structural schematic diagram of the right end of the photosensory assembly in Fig. 4；
Fig. 6 is the structural schematic diagram of the right end of the photosensory assembly of another embodiment of the present invention.
Specific embodiment
With reference to the accompanying drawing and specific embodiment carries out further photosensory assembly and preparation method thereof and camera module
Explanation.
As shown in Figures 2 and 3, the camera module of an embodiment includes photosensory assembly 20 and lens assembly (not shown).
Photosensory assembly 20 includes circuit board 100, sensitive chip 200, the first adhesive layer 300, the second adhesive layer 400, conductor wire 500 and envelope
Fill body 600.
Sensitive chip 200 is electrically connected on circuit board 100.Sensitive chip 200 include photosensitive surface 202 and with photosensitive table
The opposite connection surface 204 in face 202.First adhesive layer 300 and the second adhesive layer 400 are set to sensitive chip 200 and circuit board
Between 100, the second adhesive layer 400 includes that Bonded Ring 410 namely the first adhesive layer 300 and Bonded Ring 410 are set to connection surface
Between 204 and circuit board 100, so that sensitive chip 200 is fixedly connected with circuit board 100.During first adhesive layer 300 is located at
Between position, Bonded Ring 410 is arranged around the first adhesive layer 300, and Bonded Ring 410 is different from the material of the first adhesive layer 300.?
In present embodiment, the material of the second adhesive layer 400 is any one in epoxy resin, silica gel and acrylic acid, in packaging body
In 600 high temperature molding processing procedures, the second adhesive layer 400 is not affected by high temperatures generation deformation, avoids sensitive chip 200 from heaving and sticks up
Song promotes the quality of photosensory assembly 20.
Circuit board 100 is equipped with the first solder joint (not shown), and sensitive chip 200 is equipped with the second solder joint (not shown), leads
The both ends of electric wire 500 are connect with the first solder joint and the second solder joint respectively, so that sensitive chip 200 is electrically connected with circuit board 100
It connects.
For 600 encapsulated moulding of packaging body on circuit board 100 and around sensitive chip 200,600 enclosure portion of packaging body is photosensitive
Surface 202.Wherein, 600 enclosure portion photosensitive surface 202 of packaging body, when molding processing procedure forms packaging body 600, fringe region
Photosensitive surface 202 be injection molding region, and the photosensitive surface 202 of central area be non-injection molding region.Lens assembly is set to encapsulation
On the one end of body 600 far from circuit board 100.
As shown in Figure 1, in the photosensory assembly 10 of traditional camera module, due to circuit board 11, sensitive chip 12 and envelope
Fill the differences such as hardness number, shrinking percentage of body 15, the high temperature and pressure of molding processing procedure will lead to the injection molding region of sensitive chip 12 with
There are stress differences in non-injection molding region, and sensitive chip 12 is caused to heave warpage.Referring to FIG. 3, being adopted in above-mentioned photosensory assembly 20
Circuit board 100 and sensitive chip 200 are connected with the first different adhesive layer 300 of material and the second adhesive layer 400, can be balanced
The stress that the injection molding region of sensitive chip 200 and non-injection molding region are subject to, thus 600 stress distribution of balanced entire packaging body, drop
The stress difference in low injection molding region and non-injection molding region, and then the reliability of above-mentioned photosensory assembly 20 is promoted, namely avoid photosensitive core
Piece 12 heaves warpage, promotes the quality of above-mentioned photosensory assembly 20.
Specifically, in the present embodiment, when making above-mentioned photosensory assembly 20, first by the first adhesive applicating in circuit
The central area of plate 100 or sensitive chip 200 forms the first adhesive layer.Flow into second adhesive with mobility
Between circuit board 100 and sensitive chip 200, and form the second adhesive layer.The first adhesive layer of final curing is to form the first bonding
Layer 300, while solidifying the second adhesive layer to form the second adhesive layer 400, i.e. Bonded Ring 410.In the present embodiment, solid simultaneously
Change the first adhesive layer and the second adhesive layer, it is possible to reduce making step.It is appreciated that in other embodiments, can first consolidate
Change the first adhesive layer to form the first adhesive layer 300, then the second adhesive layer, the second glue of final curing are formed using the second adhesive
Adhesion coating is to form Bonded Ring 410.In this way, preformed first adhesive layer 300 can make circuit board 100 and sensitive chip
200 position is fixed, and can effectively be avoided, in the step of forming the second adhesive layer, the phase of circuit board 100 and sensitive chip 200
To position change.Specifically, in the present embodiment, the mobility of the second adhesive is more than or equal to the flowing of the first adhesive
Property, the viscosity of the second adhesive is greater than the viscosity of the first adhesive, and the thixotropic index of the second adhesive is greater than the first adhesive
Thixotropic index, the elasticity modulus of Bonded Ring 410 are greater than the elasticity modulus of the first adhesive layer 300.
Further, in the present embodiment, Bonded Ring 410 covers the 2%~90% of the area of connection surface 204.Bonding
The area that ring 410 covers connection surface 204 is too small, cannot balance the injection molding region and non-injection molding area of sensitive chip 200 well
The stress that domain is subject to, and since the second adhesive flows into there is resistance between sensitive chip 200 and circuit board 100, if viscous
The area for tying the covering connection surface 204 of ring 410 is too big, and the manufacture difficulty of Bonded Ring 410 increases, and in summary, Bonded Ring is arranged
The 2%~90% of the area of 410 covering connection surfaces 204.Preferably, in the present embodiment, Bonded Ring 410 covers connection table
The 5%~50% of the area in face 204.Specifically, in the present embodiment, Bonded Ring 410 covers the area of connection surface 204
10%.
Further, in the present embodiment, the 10%~95% of the area of the first adhesive layer 300 covering connection surface 204.
The area that first adhesive layer 300 covers the area of connection surface 204 and Bonded Ring 410 covers connection surface 204 cooperates, and guarantees sense
Optical chip 200 is securely connect with circuit board 100.When the area of the first adhesive layer 300 covering connection surface 204 is minimized
(10%), when the area that Bonded Ring 410 covers connection surface 204 is maximized (90%), at this point, the quilt completely of connection surface 204
Covering, sensitive chip 200 can securely be connect with circuit board 100；When the area of the first adhesive layer 300 covering connection surface 204
When being maximized (95%), it also can guarantee that sensitive chip 200 is securely connect with circuit board 100, and when the covering of Bonded Ring 410 connects
When connecing the area on surface 204 and being minimized (2%), at this point, there may be certain between Bonded Ring 410 and the first adhesive layer 300
Gap 402, gap 402 can further balance injection molding region and the stress that is subject to of non-injection molding region of sensitive chip 200.
Further, in the present embodiment, the area that Bonded Ring 410 covers connection surface 204 is covered with the first adhesive layer 300
The sum of area of lid connection surface 204 is the area 80~100% of connection surface 204.
Further, in the present embodiment, the spacing (width of Bonded Ring 410 of the lateral wall of Bonded Ring 410 and inner sidewall
Degree) it is less than or equal to 6.5mm.Since the second adhesive flows into there is resistance between sensitive chip 200 and circuit board 100, if viscous
The width for tying ring 410 is excessive, and the manufacture difficulty of Bonded Ring 410 increases.In order to simplify manufacture craft, the width of Bonded Ring 410 is set
Degree is less than or equal to 6.5mm.Preferably, the spacing of the lateral wall of Bonded Ring 410 and inner sidewall is 0.1~0.5mm.Specifically, exist
In present embodiment, the lateral wall of Bonded Ring 410 and the spacing of inner sidewall are 0.3mm.
Further, in the present embodiment, the lateral wall of Bonded Ring 410 is flushed with the side wall of sensitive chip 200.In this way,
The stress that the injection molding region and non-injection molding region for more conducively balancing sensitive chip 200 are subject to.
As shown in Figures 4 to 6, the second adhesive layer 400 further includes the bonding cylinder 420 on circuit board 100, bonds cylinder
The 420 connections Bonded Ring 410 and the side wall for closing sensitive chip 200.At this point, the appearance of the covering bonding cylinder 420 of packaging body 600
While face, covering part photosensitive surface 202 is gone back.Packaging body 600 is directly connected with the side wall of sensitive chip 200, can be led
The stress for causing encapsulation to generate directly acts on sensitive chip 200.Cylinder 420 is bonded by setting, and to bond the closing of cylinder 420
The side wall of sensitive chip 200 and the lateral wall of Bonded Ring 410, can side to avoid packaging body 600 directly with sensitive chip 200
Wall contact, the stress so as to avoid encapsulation from generating directly act on sensitive chip 200.
Further, in the present embodiment, the material for bonding cylinder 420 is identical as the material of Bonded Ring 410.In this way, being convenient for
Production bonding cylinder 420, simplifies manufacture craft.In the present embodiment, while forming gluing ring, existed using the second adhesive
Gluing cylinder is formed on circuit board, gluing cylinder closes the side wall of sensitive chip 200 and the lateral wall of gluing ring.Namely bonding cylinder
420 are integrally formed with Bonded Ring 410.
Further, in the present embodiment, the first solder joint is located in bonding cylinder 420 namely conductor wire 500 and circuit board
One end of 100 connections is located in bonding cylinder 420.First solder joint is directly connected with packaging body 600, will lead to what encapsulation generated
Stress directly acts on the junction of the first solder joint Yu conductor wire 500, causes conductor wire 500 and the first solder joint to disconnect, electricity occurs
The problem of property bad connection.It bonds cylinder 420 and closes the first solder joint, can directly be contacted with the first solder joint to avoid packaging body 600, from
And it is possible to prevente effectively from there is the case where conductor wire 500 and disconnection of the first solder joint.
Further, in the present embodiment, the top for bonding cylinder 420 is flushed with photosensitive surface 202.Due to the second adhesive
With mobility, the top for bonding cylinder 420 is flushed with photosensitive surface 202, it is possible to prevente effectively from the second adhesive is towards photosensitive table
The middle part in face 202 is flowed, and photosensitive surface 202 is polluted.
Further, in the present embodiment, the outer surface 422 for bonding cylinder 420 is the cambered surface of evagination.In this way, can increase
The connection area of cylinder 420 and packaging body 600 is bonded, so that bonding cylinder 420 is securely connect with packaging body 600.
As shown in fig. 6, in other embodiments, the top of bonding cylinder 420 protrudes from photosensitive surface 202, cylinder 420 is bonded
Enclosure portion photosensitive surface 202, at this point, the second solder joint is located in bonding cylinder 420 namely conductor wire 500 connects with sensitive chip 200
The one end connect is located in bonding cylinder 420.Second solder joint is directly connected with packaging body 600, will lead to the stress that encapsulation generates
The junction for directly acting on the second solder joint Yu conductor wire 500 causes conductor wire 500 and the second solder joint to disconnect, and occurs electrically connecting
Connect bad problem.It bonds cylinder 420 and closes the second solder joint, can directly be contacted with the second solder joint to avoid packaging body 600, so as to
The case where effectively to avoid the occurrence of conductor wire 500 and the disconnection of the second solder joint.
In the present embodiment, a kind of production method of photosensory assembly is also provided, is included the following steps:
Step S810, provides circuit board and sensitive chip, and sensitive chip includes photosensitive surface and opposite with photosensitive surface
Connection surface.
Step S820 provides the first adhesive, forms the first adhesive layer in circuit board and sensitive chip.
In the present embodiment, the 10%~95% of the area of the first adhesive layer covering connection surface.
Step S830 provides material second adhesive different from the first adhesive, so that the second adhesive flows into circuit
Between plate and sensitive chip, and form the second adhesive layer.
In the present embodiment, the 2%~90% of the area of the second adhesive layer covering connection surface.Forming the second gluing
While layer (gluing ring), gluing cylinder is formed using the second adhesive on circuit boards, gluing cylinder connects gluing ring and sense of closure
The side wall of optical chip.
Step S840 solidifies the first adhesive layer to form the first adhesive layer, while solidifying the second adhesive layer to form second
Adhesive layer.
In the present embodiment, the first adhesive layer, the second adhesive layer cylinder solidify simultaneously, and the second adhesive layer includes by gluing ring
The Bonded Ring being formed by curing and the bonding cylinder being formed by curing by gluing cylinder.It is appreciated that in other embodiments, the first gluing
Layer can solidify before forming the second adhesive layer.
Step S850, molding form packaging body, and packaging body encapsulated moulding is on circuit board and covering part photosensitive surface.
In the present embodiment, when forming packaging body, packaging body closes the outer surface for bonding cylinder simultaneously and part is photosensitive
Surface.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of photosensory assembly characterized by comprising
Circuit board；
Sensitive chip, is connected to the circuit board, and the sensitive chip includes photosensitive surface；
First adhesive layer, between the sensitive chip and the circuit board；
Second adhesive layer, the material of second adhesive layer is different from first adhesive layer, and second adhesive layer includes viscous
Ring is tied, the Bonded Ring surround first adhesive layer between the sensitive chip and the circuit board；And
Packaging body, encapsulated moulding is on the circuit board and photosensitive surface described in covering part.
2. photosensory assembly according to claim 1, which is characterized in that the second adhesive layer material is epoxy resin, silicon
Glue or acrylic acid.
3. photosensory assembly according to claim 1, which is characterized in that the sensitive chip further includes and the photosensitive surface
Opposite connection surface, the 2%~90% of the area for bonding connection surface described in ring cover.
4. photosensory assembly according to claim 3, which is characterized in that first adhesive layer covers the connection surface
The 10%~95% of area.
5. photosensory assembly according to claim 1, which is characterized in that second adhesive layer further includes being located at the circuit
Bonding cylinder on plate, the bonding cylinder connect the Bonded Ring and close the side wall of the sensitive chip, the packaging body covering
The outer surface of the bonding cylinder.
6. photosensory assembly according to claim 5, which is characterized in that the photosensory assembly further includes conductor wire, the electricity
Road plate is equipped with the first solder joint, and the sensitive chip is equipped with the second solder joint, and the both ends of the conductor wire are respectively with described first
Solder joint and second solder joint connection, first solder joint are located in the bonding cylinder.
7. photosensory assembly according to claim 6, which is characterized in that photosensitive surface described in the bonding cylinder covering part,
Second solder joint is located in the bonding cylinder.
8. a kind of production method of photosensory assembly, which comprises the steps of:
Circuit board is provided and sensitive chip, the sensitive chip include photosensitive surface and the connection opposite with the photosensitive surface
Surface；
First adhesive is provided, forms the first adhesive layer in the circuit board and the sensitive chip；
There is provided material second adhesive different from the first adhesive, so that second adhesive flows into the circuit board and institute
It states between sensitive chip, and forms the second adhesive layer；
Solidify first adhesive layer to form the first adhesive layer, while solidifying second adhesive layer to form the second bonding
Layer；And
Molding forms packaging body, and packaging body encapsulated moulding is on circuit board and covering part photosensitive surface.
9. a kind of production method of photosensory assembly, which comprises the steps of:
Circuit board is provided and sensitive chip, the sensitive chip include photosensitive surface and the connection opposite with the photosensitive surface
Surface；
First adhesive is provided, forms the first adhesive layer in the circuit board and the sensitive chip；
Solidify first adhesive layer to form the first adhesive layer；
There is provided material second adhesive different from the first adhesive, so that second adhesive flows into the circuit board and institute
It states between sensitive chip, and forms the second adhesive layer；
Solidify second adhesive layer to form the second adhesive layer；And
Molding forms packaging body, and packaging body encapsulated moulding is on circuit board and covering part photosensitive surface.
10. a kind of camera module characterized by comprising
Such as photosensory assembly of any of claims 1-7；And
Lens assembly, the lens assembly are set on the one end of the packaging body far from the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711070039.0A CN109755263A (en) | 2017-11-03 | 2017-11-03 | Photosensory assembly and preparation method thereof and camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711070039.0A CN109755263A (en) | 2017-11-03 | 2017-11-03 | Photosensory assembly and preparation method thereof and camera module |
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| Publication Number | Publication Date |
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| CN109755263A true CN109755263A (en) | 2019-05-14 |
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| CN201711070039.0A Withdrawn CN109755263A (en) | 2017-11-03 | 2017-11-03 | Photosensory assembly and preparation method thereof and camera module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11894403B2 (en) | 2020-09-17 | 2024-02-06 | Samsung Electronics Co., Ltd. | Semiconductor package and method for fabricating same |
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2017
- 2017-11-03 CN CN201711070039.0A patent/CN109755263A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11894403B2 (en) | 2020-09-17 | 2024-02-06 | Samsung Electronics Co., Ltd. | Semiconductor package and method for fabricating same |
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Application publication date: 20190514 |