CN109753185A - A kind of manufacturing method and touch display unit of touch display unit - Google Patents
A kind of manufacturing method and touch display unit of touch display unit Download PDFInfo
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- CN109753185A CN109753185A CN201910030946.5A CN201910030946A CN109753185A CN 109753185 A CN109753185 A CN 109753185A CN 201910030946 A CN201910030946 A CN 201910030946A CN 109753185 A CN109753185 A CN 109753185A
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Abstract
The present embodiments relate to display device manufacturing technology fields, specifically, it is related to the manufacturing method and touch display unit of a kind of touch display unit, this method is by the way of " upside-down mounting ", based on glass cover-plate, successively touch screen, Minitype LED array and thin film transistor backplane are bonded, are integrated and are encapsulated, can be avoided that light image caused by the reflection of each interlayer is fuzzy or color distortion, it so, it is possible the display effect of improvement touch display unit.
Description
Technical field
The present embodiments relate to display device manufacturing technology fields, in particular to a kind of touch display unit
Manufacturing method and touch display unit.
Background technique
Display technology develops rapidly in recent years, and the appearance of touching technique greatly facilitates man-machine interactive operation, therefore, more
Has touch operation function come more display devices.With the development of touching technique, the shape of display device becomes more light
Thin, fashion has caused warmly pursuing for consumer, however the display effect of existing big multi-display apparatus is to be improved.
Summary of the invention
In view of this, the present invention provides a kind of manufacturing method of touch display unit and touch display units.
A kind of manufacturing method of touch display unit provided by the embodiment of the present invention, comprising:
The touch screen that preparation is completed is fitted in the one side of glass cover-plate；
Adhesive is coated on one side of the touch screen far from the glass cover-plate；
Minitype LED array is picked up from initial substrates using thermal release glue, it will be described miniature using the thermal release glue
LED array fits in one side of the described adhesive far from the touch screen；
The thermal release glue is heated so that the Minitype LED array is located away from the heat according to the first set temperature
Separation gel；
Described adhesive is solidified so that the Minitype LED array is fixed in the touch screen；
By thin film transistor backplane and the Minitype LED array connection and it is bonded and is packaged in the touch screen.
Optionally, the step of Minitype LED array being picked up from initial substrates using thermal release glue, comprising:
The thermal release glue laminated is covered into the one side to Minitype LED array far from the initial substrates at room temperature, by
The thermal release glue is picked up along direction initialization to pick up the Minitype LED array from the initial substrates after one setting duration
It rises.
Optionally, a length of 2~3min when the described first setting.
Optionally, the step of thermal release glue being heated according to the first set temperature, comprising:
According to first set temperature to the thermal release glue heating on one side far from the Minitype LED array,
The thermal release glue is picked up along the direction initialization after the second setting duration.
Optionally, first set temperature is 60~200 DEG C, described second a length of 0.5~5min when setting.
Optionally, the step of described adhesive being solidified, comprising:
The ultraviolet light for using power to be 365nm for 425W, wavelength irradiates 5~300s to described adhesive.
Optionally, the touch screen is attached at glass cover-plate, and described adhesive is optical cement or shadowless glue, and adhesive is applied
The step of being overlying on the one side of touch screen, comprising:
The optical cement or the shadowless glue are coated on far from the glass cover-plate by the touch screen using Meyer stick method
One side.
Optionally, the method also includes:
The touch screen of the optical cement or the shadowless glue is coated with 10-2~10-43 are placed in the vacuum environment of Pa
~10min is so that the optical cement or the shadowless glue precuring.
Optionally, the method also includes:
The optical cement or the shadowless glue are toasted with the second set temperature so that the optical cement or the nothing
Shadow glue precuring, wherein second set temperature is 30~40 DEG C.
The embodiment of the invention also provides a kind of touch display unit, the touch display unit is by the above-mentioned manufacture method
Manufacture obtains.
The manufacturing method and touch display unit of a kind of touch display unit provided in an embodiment of the present invention, with glass cover-plate
Based on, successively touch screen, Minitype LED array and thin film transistor backplane are bonded, are integrated and are encapsulated, compared to tradition
The assembling mode based on thin film transistor backplane, " upside-down mounting " mode used in the embodiment of the present invention can avoid effectively respectively
Gap is generated between layer, and then avoids that light image caused by the reflection of each interlayer is fuzzy or color distortion, so, it is possible to change
The display effect of kind touch display unit.
Further, Minitype LED array is integrated in by touch screen using thermal release glue, can accurately, flexibly realized micro-
The flood tide of type LED array shifts and realizes the seamless applying of Minitype LED array and touch screen, and Minitype LED array can be improved aobvious
Show brightness, contrast and color saturation, moreover it is possible to guarantee display density, further improve the display effect of touch display unit
Fruit.
Further, optical cement or shadowless glue are coated on by one side of the touch screen far from glass cover-plate using Meyer stick method,
The generation that gluing bubble can effectively be avoided, avoids and generates gap between Minitype LED array and touch screen, further improve
The display effect of touch display unit.
Further, Minitype LED array has compared to technology of traditional capacitive touch screen in conjunction with liquid crystal display
The advantages of low-power consumption, high response speed.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as pair
The restriction of range for those of ordinary skill in the art without creative efforts, can also be according to this
A little attached drawings obtain other relevant attached drawings.
Fig. 1 is a kind of flow chart of the manufacturing method of touch display unit provided by the embodiment of the present invention.
Fig. 2 to Figure 12 is the knot of the touch display unit in each step of manufacturing method of touch display unit shown in FIG. 1
Structure changes schematic diagram.
Icon:
1- glass cover-plate；
2- touch screen；
3- adhesive；
4- Minitype LED array；41- buffer layer；42- sacrificial layer；43-N type layer；44- Quantum Well；45-P type layer；46- support
Riveting；
5- thin film transistor backplane；
6- encapsulated layer；
7- thermal release glue；
8- initial substrates.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment only
It is a part of the embodiments of the present invention, instead of all the embodiments.The present invention being usually described and illustrated herein in the accompanying drawings
The component of embodiment can be arranged and be designed with a variety of different configurations.
Therefore, the detailed description of the embodiment of the present invention provided in the accompanying drawings is not intended to limit below claimed
The scope of the present invention, but be merely representative of selected embodiment of the invention.Based on the embodiments of the present invention, this field is common
Technical staff's every other embodiment obtained without creative efforts belongs to the model that the present invention protects
It encloses.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need that it is further defined and explained in subsequent attached drawing.
In the description of the present invention unless specifically defined or limited otherwise, term " setting ", " connected ", " connection " are answered
It is interpreted broadly, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can be mechanical connect
It connects, is also possible to be electrically connected；It can be directly connected, can also can be in two elements indirectly connected through an intermediary
The connection in portion.For the ordinary skill in the art, the tool of above-mentioned term in the present invention can be understood with concrete condition
Body meaning.
Inventor further investigation reveals that, the assembling mode of traditional touch display unit is usually with thin film transistor (TFT) (Thin
Film Transistor, TFT) based on backboard, it is integrated that display device, sensor and cover board etc. are successively subjected to assembling, due to
The reason of glass figure layer and package technique often each interlayer generate gap, it is difficult to guarantee it is seamless applying between each layer, this
It will lead to light reflecting between the layers, cause image fuzzy or color distortion, therefore, existing most touch display unit
Display effect is to be improved.
Defect present in the above scheme in the prior art, is that inventor is obtaining after practicing and carefully studying
As a result, therefore, the solution that the discovery procedure of the above problem and the hereinafter embodiment of the present invention are proposed regarding to the issue above
Scheme all should be the contribution that inventor makes the present invention in process of the present invention.
Based on the studies above, the embodiment of the invention provides a kind of manufacturing method of touch display unit and display dress is touched
Set, can based on glass cover-plate, successively by touch screen, Minitype LED array, TFT backplate be bonded, integrated and encapsulated with
" upside-down mounting " for realizing touch display unit, can effectively avoid generating gap between each layer, and light is avoided to make in the reflection of each interlayer
At image is fuzzy or color distortion, and then improve the display effect of touch display unit.
In the present embodiment, Minitype LED array can be Mini-LED/Micro-LED array, wherein Micro-LED is
Refer to LED unit of the size less than 100 μm that traditional LED carries out filming, microminiaturization and array obtain, Micro-LED with
Organic Light Emitting Diode (Organic Light-Emitting Diode, OLED) equally can be realized independent addressing and individually drive
Dynamic luminous (self-luminous).And Mini-LED is properly termed as time millimeter light emitting diode, refers to size about at 100 μm or more
LED, it will be understood that Mini-LED is between traditional LED and Micro-LED.
Mini-LED/Micro-LED array is in power consumption, brightness, response speed, contrast, color saturation and display
Density etc. has more apparent advantage, manufactures, uses to touch display unit compared to using traditional LED array
The touch display unit that Mini-LED/Micro-LED array produces can be avoided the reflection of light, and size is frivolous and display is imitated
Fruit is good.
Manufacturing method provided by the present embodiment will be described in detail by Fig. 1 below.
The touch screen that preparation is completed is fitted in the one side of glass cover-plate based on glass cover-plate by step S21.
Please refer to Fig. 2, the type of touch screen 2 can there are many, such as resistive touch screen and capacitive touch screen,
In the present embodiment, touch screen 2 can be capacitive touch screen.Wherein, capacitive touch screen can be one piece of MULTILAYER COMPOSITE glass
Glass screen, the inner surface and interlayer of glass screen, which are respectively coated with one layer, to be done figuratum transparent conductive electrode and for example aoxidizes cigarette tin (Indium
Tin oxide, ITO) or silver nanowires, outermost layer is a thin layer silica protective layer for glass, interlayer ITO coating as working face,
Four electrodes are drawn on four angles, internal layer ITO is shielded layer to guarantee good working environment.
Wherein, the modes systems such as evaporation, sputtering, reactive ion plating, chemical vapor deposition and spray pyrolysis deposition can be used in ITO
Standby, silver nanowires can be used the modes such as spraying, printing and prepare, the excellent translucency of silver nanowires, flexible resistance, for it is flexible, can
Bending LED is shown, the preparations such as touch screen provide guarantee.It optionally, can be even using silane to the deposition of transparent conductive electrode
Symbasis substance carries out surface to substrate and is modified, and realization transparent conductive electrode coupling and being permanently bonded with glass cover-plate.
It is appreciated that the structure of capacitive touch screen can appropriately adjust according to the actual situation, it is above-mentioned to capacitive touch
The explanation for touching screen is only used for illustrating, and is not the limitation to the type and structure of touch screen in this programme.For purposes of illustration only, below
Signified touch screen 2 is illustrated by example of capacitive touch screen.
Further, based on glass cover-plate 1, touch screen 2 is fitted in into glass cover-plate 1, in the present embodiment, glass
Cover board 1 can be transparent bendable material such as colorless polyimide (Colorless Polyimide, CPI), glass cover-plate
1 can be set anti-scratch figure layer, such as sapphire etc. far from touch screen 2 on one side.
It is appreciated that touch display unit manufacturing method provided by the present embodiment and traditional touch display unit manufacture
The difference of method is " upside-down mounting ": realizing fitting, the integrated and encapsulation of each layer based on glass cover-plate 1, so, it is possible
Effect avoids the gap between each layer, improves display effect.
Adhesive is coated on one side of the touch screen far from glass cover-plate and carries out precuring to adhesive by step S22.
Fig. 3 is please referred to, adhesive 3 can be coated on one side of the touch screen 2 far from glass cover-plate 1.In this implementation
In example, adhesive 3 can be optical cement or shadowless glue.Wherein, optical cement is OCA (Optically Clear Adhesive) light
Glue is learned, cementing transparent optical element is used for, has many advantages, such as that colorless and transparent, light transmittance is high, glue-joint strength is high, shadowless glue is photosensitive
Glue, can also be UV (Ultraviolet Rays) glue, shadowless glue be it is a kind of need to irradiate by ultraviolet light it is just curable
A kind of adhesive, UV can be understood as ultraviolet light, and it is one section of electromagnetic radiation other than visible light, wave that UV, which is invisible,
Grow the range in 10~400nm, the shadowless glue principle of solidification is photoinitiator (photosensitizer) in shadowless glue curing materials ultraviolet
Living radical or cation are generated after absorbing ultraviolet light under the irradiation of line, causes monomer polymerization, cross-linking chemistry reaction, makes no shadow
Glue is converted into solid-state in a short time.It is appreciated that optical cement or shadowless glue can effectively reduce temperature by illumination curing
Influence to entire touch display unit.
In the present embodiment, adhesive 3 can be coated on by one of touch screen 2 far from glass cover-plate 1 using Meyer stick method
Face after adhesive 3 is coated on one side of the touch screen 2 far from glass cover-plate 1, needs to carry out adhesive 3 precuring to mention
The adhesion and stability of highly adhesive, convenient for the fitting of Mini-LED/Micro-LED array later.For example, the first is pre- solid
The touch screen 2 and glass cover-plate 1 that change mode can be coated with adhesive 3 are 10-2~10-4In the vacuum environment of Pa place 3~
10min is so that 3 precuring of adhesive.In another example second precuring mode can at a temperature of 30~40 DEG C to adhesive 3 into
Row baking is so that 3 precuring of adhesive, wherein the thickness of adhesive 3 can be 1~5 μm.
The present embodiment can use the first above-mentioned precuring mode, and this mode is referred to as low vacuum degassing method,
It is appreciated that the gluing bubble between adhesive 3 and touch screen 2 is effectively prevented using Meyer stick method and low vacuum degassing method,
And then it avoids and generates gap between adhesive 3 and touch screen 2.
Step S23 is picked up Minitype LED array using thermal release glue from initial substrates, based on thermal release glue in difference
At a temperature of viscosity change Minitype LED array is shifted and the one side far from touch screen that fits in adhesive.
By taking Micro-LED as an example, since the storage of Micro-LED is less than 100 μm, and the inorganic electronic materials of high quality are difficult
Directly to grow and process on flexible body, therefore three color Micro-LED arrays are difficult to realize on the same substrate graphically
Integrated preparation, so needing to realize the integrated of three color Micro-LED arrays by flood tide transfer techniques.
In the present embodiment, it is shifted using the flood tide that thermal release glue can be realized three color Micro-LED arrays, so that
Three color Micro-LED arrays can improve the display effect of touch display unit based on the advantage of itself.In addition, LED gusts miniature
The advantages of arranging, high response speed low compared to low-power consumption that the technology of traditional capacitive touch screen and liquid crystal display has, and
Minitype LED array size is small, can be realized the lightening of touch display unit volume, reduces assembling difficulty.For purposes of illustration only,
Minitype LED array referred to below is illustrated using Micro-LED array as example.
Fig. 4 is please referred to, is a kind of diagrammatic cross-section of Minitype LED array provided by the embodiment of the present invention, by scheming
As it can be seen that Minitype LED array 4 includes P-type layer 45, Quantum Well 44 and N-type layer 43 from top to bottom, Minitype LED array 4 is in original lining
It is prepared on bottom 8.Wherein it is possible to design sacrificial layer 42 on the epitaxial slice structure of Minitype LED array 4, pass through micro-nano technology
Technique is prepared into the individual LED cell that size is lower than micron level, and riveting 46 can also be supported using photoetching technique preparation and is combined
Buffer layer 41 and sacrificial layer 42 prepare the Minitype LED array 4 that can independently shift, wherein sacrificial layer 42 can pass through setting
Material is corroded, and riveting 46 is supported to be used to support the Minitype LED array 4 for the sacrificial layer 42 that has been corroded.In the present embodiment, it sacrifices
Layer 42 can be AlAs, with a thickness of 100~500nm.
The problem of being adapted at present due to lattice, it is difficult to the three color Micro-LED for preparing high quality on the same substrate, because
This, flood tide branch mode used by the present embodiment in other words can be at three by monochromatic transfer and three color integration realizations
Red, green, blue monochrome Micro-LED is prepared in initial substrates respectively, is then based on three thermal release glue 7 successively for three kinds of colors
Micro-LED array conforms to touch screen 2, and this method is referred to as surface mounting technology (Surface Mounted
Technology, SMT).Wherein, SMT is not necessarily to printed circuit twist drill plug-in opening, can be directly by the Micro- of three kinds of colors
In LED array patch print to the setting position of touch screen 2, have component micromation, high-efficient, high reliablity, at low cost etc. excellent
Point.
It is appreciated that viscosity is also different at different temperature for thermal release glue 7, for example, at room temperature, thermal release glue 7
Sticky big, when heating to thermal release glue 7, the viscosity of thermal release glue 7 can be drastically reduced, it is therefore possible to use thermal release glue 7
Temperature-adhesive character realize Minitype LED array 4 flood tide transfer.
In the present embodiment, it can be realized by transfer equipment and thermal release glue 7 and the flood tide of Minitype LED array 4 is shifted,
Wherein, transfer equipment is provided with the sample stage for glove and the lifting shaft for heat of adsorption separation gel 7, and transfer equipment is also equipped with
There are the infrared location system and microscopic system for addressing positioning.
Please continue to refer to Fig. 5, the Minitype LED array 4 that preparation is completed is placed in transfer equipment together with initial substrates 8 first
Sample stage, transfer equipment are the equipment for carrying out flood tide transfer using thermal release glue 7.Thermal release glue 7 can be set in transfer equipment,
If thermal release glue 7 is one side glue, transfer equipment can realize the fixation to thermal release glue 7 by the way of vacuum suction, if hot
Separation gel 7 is double-sided adhesive, thermal release glue 7 directly can be pasted on transfer equipment, the heating meeting due to the later period to thermal release glue 7
Leading to the viscosity of thermal release glue 7 reduces, and in the present embodiment, thermal release glue 7 is selected one side glue and inhaled using transfer equipment vacuum
Attached thermal release glue 7.
It optionally, can be according to actual needs to thermal release glue before using transfer equipment vacuum suction thermal release glue 7
7 are split, if Minitype LED array 4 to be transferred is circle, laser shear heat separation gel 7 can be used, if to be transferred is micro-
Type LED array 4 is spiral shape, can also use laser shear heat separation gel 7, so, it is possible to realize to Minitype LED array 4
Flexibly pick up.
It is appreciated that being patterned segmentation to thermal release glue 7 can shift convenient for the gradation of three color Micro-LED.?
In the present embodiment, flood tide transfer can be carried out to monochromatic Micro-LED array according to the sequence of red, green, blue, in actual production
In, the transfer sequence of monochromatic Micro-LED array can be adjusted.
Please continue to refer to Fig. 5, after the thermal release glue 7 completed is cut using transfer equipment vacuum suction at room temperature, base
The addressing of thermal release glue 7 is navigated into Minitype LED array 4 in the matched infrared location system of transfer equipment itself and microscopic system
Top, and make thermal release glue 7 be overlaid on Minitype LED array 4 close to Minitype LED array 4 in thermal release glue 7 based on lifting shaft,
Wherein, to avoid damage Minitype LED array 4, covering power be should not be too large, for example, covering power can be 0.5N, in actual conditions
In, covering power can be adjusted flexibly
After covering 2~3min, thermal release glue 7 is picked up along direction initialization based on lifting shaft, and then by Minitype LED array 4
It is picked up from initial substrates 8, wherein direction initialization is perpendicular to 4 place plane of Minitype LED array and remote towards Minitype LED array 4
Direction from initial substrates 8.
Fig. 6 is please referred to, after thermal release glue 7 and Minitype LED array 4 are picked up, continuing will be hot using transfer equipment
Separation gel 7 and Minitype LED array 4 are moved to the top of adhesive 3, based on lifting shaft that thermal release glue 7 is remote close to adhesive 3
Minitype LED array 4 is fitted in one of adhesive 3 far from touch screen 2 far from thermal release glue 7 by the one side from touch screen 2 on one side
Face so, it is possible to realize the seamless applying of Minitype LED array 4 and touch screen 2.Then 60~200 DEG C of temperature is to thermal release glue
7 heat 0.5~5min to reduce the viscosity of thermal release glue 7, pick up thermal release glue 7 along direction initialization based on lifting shaft, realize
The separation of thermal release glue 7 and Minitype LED array 4, and then realize and Minitype LED array 4 is transferred to adhesive 3 from initial substrates 8
On (touch screen 2).It being capable of flood tide transfer accurate, that Minitype LED array 4 is neatly realized by thermal release glue 7.
It is appreciated that Fig. 5, Fig. 6 are to carry out flood tide transfer to red Micro-LED array, to green Micro-LED array
The schematic diagram of flood tide transfer is carried out please continue to refer to Fig. 7 and Fig. 8.
To continue integrated green Micro-LED array in the touch screen 2 for being integrated with red Micro-LED array, need
Position based on the red Micro-LED array for being integrated in touch screen 2 is patterned cutting to thermal release glue 7, so, it is possible
The green Micro-LED array for guaranteeing that the thermal release glue 7 after graphically cutting is picked up from initial substrates 8 can fit in touch
The accurate integrated of three color Micro-LED arrays is realized in the setting position of screen 2.
Please continue to refer to Fig. 7, in other words, picked up using the thermal release glue 7 after graphical cutting from initial substrates 8
Green Micro-LED array produces " moving to right " compared with Fig. 5, wherein the distance of " moving to right " is set according to actual needs.
Correspondingly, the structure being transferred to green Micro-LED array using thermal release glue 7 after touch screen 2 is as shown in Figure 8.
Further, Fig. 9 and Figure 10 shows the schematic diagram that flood tide transfer is carried out to blue Micro-LED array, due to
The step of carrying out flood tide transfer to blue Micro-LED array and principle are similar with above-mentioned steps and principle, therefore do not make herein
More explanations.
In the present embodiment, thermal release glue 7 can be adhesive tape, carry out flood tide transfer to three color Micro-LED arrays
It may be implemented to bend in the process.
Optionally, after red Micro-LED array being transferred to touch screen 2, adhesive 3 can be carried out again pre- solid
Change, it is subsequent by green Micro-LED array and blue Micro-LED array be transferred to touch screen 2 later do not need to carry out again it is pre-
Solidification.
In other words, in the manufacturing method provided by the present embodiment, the number of precuring can be for twice.
The fitting integrated with touch screen 2 of three color Micro-LED arrays is realized using thermal release glue 7, can effectively solve the problem that
The phenomenon that encapsulating built on the sand with assembling level, and then it is effectively improved the problems such as image is fuzzy, light transmittance is low and color distortion.This
Outside, additionally it is possible to which the rigid/flexible and size limitation for effectively solving the problems, such as glass cover-plate 1 promotes large scale touch screen and flexible touching
Touch the development of screen.
Step S24 carries out illumination curing so that Minitype LED array is fixed in touch screen to adhesive.
In the present embodiment, adhesive 3 is solidified using illumination, for example, using the power to be for 425W, wavelength
The ultraviolet light of 365nm irradiates 5~300s to adhesive 3 so, it is possible so that Minitype LED array 4 is fixed in touch screen 2
It realizes the seamless applying of Minitype LED array 4 and touch screen 2, avoids light reflection bring image and obscure or color distortion, mention
High display effect, in addition, effectively reducing the influence of temperature in assembling process by illumination curing adhesive 3, improving touching
Touch the service life and quality of screen.
Step S25 by TFT backplate and Minitype LED array connection and is bonded and is packaged in touch screen.
Figure 11 and Figure 12 are please referred to, can be set based on the shape for the Minitype LED array 4 for being fixed in touch screen 2
Corresponding thin film transistor backplane 5 is counted, for example, being arranged at the position corresponding with Minitype LED array 4 of thin film transistor backplane 5
Hole.
Further, by being set to the hole of thin film transistor backplane 5 for thin film transistor backplane 5 and LED gusts miniature
Column 4 carry out connection and are bonded to be packaged in touch screen 2.
Specifically, fixed point welding binding assembling can be carried out to thin film transistor backplane 5 and Minitype LED array 4, using silver
The anode of Minitype LED array 4 and the drain of thin film transistor backplane 5 are linked together by slurry, then will be LED gusts miniature using gold thread
The cathode of column 4 welds together with line tower, forms a galvanic circle, then (can select no shadow using encapsulated layer 6
Glue) it will be packaged with thin film transistor backplane 5, Minitype LED array 4 and touch screen 2, finally use flexible circuit board
(FlexiblePrinted Circuit, FPC) is connected with host, obtains touch panel display device.
Wherein, Minitype LED array 4 is bonded with the hole of thin film transistor backplane 5, can be realized seamless applying, is reduced
The generation of assembling process intermediate gap, and then the reflection of light is avoided, improve display effect.
It is appreciated that realizing touch display unit by step S21~step S25 based on glass cover-plate 1
" upside-down mounting ", compared to traditional technology assembled based on TFT backplate, touch display unit provided by the present embodiment
Manufacturing method can effectively avoid the gap generated between each layer, so that light be avoided to reflect between the layers, improve whole
The display mode of a touch display unit.
Optionally, the embodiment of the invention also provides a kind of touch display unit, the touch display unit can by with
Upper type is prepared, it will be understood that the touch display unit being prepared in the above manner has fine definition, high response
The advantages that degree, high reduction degree, low-loss, thin thickness, it can be widely applied for various electronic, further promote electronic product
Upgrading.
To sum up, a kind of manufacturing method and touch display unit of touch display unit provided by the embodiment of the present invention, with
Based on glass cover-plate, successively touch screen, Minitype LED array and thin film transistor backplane are bonded, are integrated and are encapsulated, energy
It is enough effectively to avoid generating gap between each layer, and then avoid that light image caused by the reflection of each interlayer is fuzzy or color loses
Very, it so, it is possible the display effect of improvement touch display unit.In addition, replacing tradition with Mini-LED/Micro-LED array
LED array not only increases the display effect of touch display unit, ensure that display density, additionally it is possible to reduce power consumption, improve and ring
Speed is answered, so that entire touch display unit is lightening.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of manufacturing method of touch display unit characterized by comprising
The touch screen that preparation is completed is fitted in the one side of glass cover-plate；
Adhesive is coated on one side of the touch screen far from the glass cover-plate；
Minitype LED array is picked up from initial substrates using thermal release glue, it will be described LED gusts miniature using the thermal release glue
Column fit in one side of the described adhesive far from the touch screen；
The thermal release glue is heated so that the Minitype LED array is located away from the thermal release according to the first set temperature
Glue；
Described adhesive is solidified so that the Minitype LED array is fixed in the touch screen；
By thin film transistor backplane and the Minitype LED array connection and it is bonded and is packaged in the touch screen.
2. the manufacturing method of touch display unit according to claim 1, which is characterized in that will be miniature using thermal release glue
The step of LED array is picked up from initial substrates, comprising:
The thermal release glue laminated is covered into the one side to Minitype LED array far from the initial substrates at room temperature, process first is set
The thermal release glue is picked up along direction initialization to pick up the Minitype LED array from the initial substrates after timing is long.
3. the manufacturing method of touch display unit according to claim 2, which is characterized in that a length of when the described first setting
2~3min.
4. the manufacturing method of touch display unit according to claim 1, which is characterized in that according to the first set temperature pair
The step of thermal release glue is heated, comprising:
According to first set temperature to the thermal release glue heating on one side far from the Minitype LED array, pass through
The thermal release glue is picked up along the direction initialization after second setting duration.
5. the manufacturing method of touch display unit according to claim 4, which is characterized in that first set temperature is
60~200 DEG C, described second a length of 0.5~5min when setting.
6. the manufacturing method of touch display unit according to claim 1, which is characterized in that consolidate to described adhesive
The step of change, comprising:
The ultraviolet light for using power to be 365nm for 425W, wavelength irradiates 5~300s to described adhesive.
7. the manufacturing method of touch display unit according to claim 1, which is characterized in that the touch screen is attached at glass
Glass cover board, described adhesive be optical cement or shadowless glue, by adhesive be coated on touch screen one side the step of, comprising:
The optical cement or the shadowless glue are coated on by one of the touch screen far from the glass cover-plate using Meyer stick method
Face.
8. the manufacturing method of touch display unit according to claim 7, which is characterized in that the method also includes:
The touch screen of the optical cement or the shadowless glue is coated with 10-2~10-4In the vacuum environment of Pa place 3~
10min is so that the optical cement or the shadowless glue precuring.
9. the manufacturing method of touch display unit according to claim 7, which is characterized in that the method also includes:
The optical cement or the shadowless glue are toasted with the second set temperature so that the optical cement or the shadowless glue
Precuring, wherein second set temperature is 30~40 DEG C.
10. a kind of touch display unit, which is characterized in that the touch display unit is any described by claim 1~9
Manufacturing method manufactures to obtain.
Priority Applications (1)
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