CN109752027B - Sensor packaging structure convenient to disassemble and packaging method - Google Patents
Sensor packaging structure convenient to disassemble and packaging method Download PDFInfo
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- CN109752027B CN109752027B CN201910025450.9A CN201910025450A CN109752027B CN 109752027 B CN109752027 B CN 109752027B CN 201910025450 A CN201910025450 A CN 201910025450A CN 109752027 B CN109752027 B CN 109752027B
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Abstract
The invention provides a sensor packaging structure convenient to disassemble, a packaging method and an intelligent garment. The sensor package structure includes: the sensor packaging device comprises a sensor packaging unit, a forming fabric layer for coating the sensor packaging unit, a first conductive buckle made of metal and fixedly connecting the sensor packaging unit and the forming fabric layer, and a signal outgoing line; the sensor packaging unit comprises a sensor and a double-layer shielding shell which completely covers the sensor; one end of the signal outgoing line is connected with a wiring pin of the sensor, the other end of the signal outgoing line is connected with a first conductive buckle, a first positioning hole for the first conductive buckle structure to penetrate is formed in the double-layer shielding shell, and the first conductive buckle is in non-electrical connection with the double-layer shielding shell through adhesion. The sensor packaging structure has the advantages of good packaging effect, high signal shielding effect, high signal acquisition precision, convenience in rapid disassembly and assembly, recycling and reuse, high utilization rate and wide application range.
Description
Technical Field
The invention relates to the technical field of sensor packaging, in particular to a sensor packaging structure convenient to disassemble and a packaging method.
Background
At present, sensors are widely used in various fields. The truth and accuracy of the acquired signals of the sensor are critical to the anti-interference capability of the sensor to external interference signals. Various sensor shielding structures have appeared, such as a PVDF piezoelectric film adhesive base packaging strain gauge with a patent name of "metallic shielding layer shielding", with publication No. CN2874423Y, and electromagnetic interference is shielded by disposing a metallic shielding net outside the substrate, so as to improve the anti-interference performance of the sensor. Although shielding is carried out to a certain degree, the technology has the defects that the shielding layer does not cover the sensor wiring rivet, the signal outgoing line is not subjected to shielding treatment, and the electromagnetic signal interference to a certain degree still exists at the two positions, so that the signal acquired by the technology is low in accuracy. Moreover, the utility model discloses above-mentioned utility model product and current sensor of taking shielding structure all have the dismouting of being not convenient for, the shortcoming that the utilization ratio is low, are unfavorable for the maintenance and the recycle of sensor. Therefore, the improvement of the detachable shielding structure of the sensor is a problem to be solved.
Disclosure of Invention
The invention provides a sensor packaging structure convenient to disassemble and a packaging method thereof, the sensor packaging structure is simple in structure, convenient to disassemble and assemble quickly, good in shielding effect, and solves the problems that the existing sensor packaging structure cannot be disassembled, the utilization rate is low, and the shielding effect is poor.
The technical scheme of the invention is realized as follows:
in a first aspect, the present invention provides a sensor package structure convenient to disassemble, which includes: the sensor packaging unit comprises a sensor packaging unit, a forming fabric layer for coating the sensor packaging unit, a first conductive buckle for fixedly connecting the sensor packaging unit and the forming fabric layer, and a signal outgoing line;
the sensor packaging unit comprises a sensor and a double-layer shielding shell which completely covers the sensor; one end of the signal outgoing line is connected with a wiring pin of the sensor, the other end of the signal outgoing line is connected with a first conductive buckle, a first positioning hole for the first conductive buckle structure to penetrate through is formed in the double-layer shielding shell, and the first conductive buckle is in non-electrical connection with the double-layer shielding shell through adhesion; the forming fabric layer comprises a top surface fabric and a bottom surface fabric which are respectively covered on the top surface and the bottom surface of the double-layer shielding shell. The molding fabric layer is bonded with the sensor packaging unit, is connected with the sensor packaging unit in a buckling mode or is combined with the sensor packaging unit in two modes.
In the sensor packaging structure, a double-layer shielding shell comprises a top layer shielding shell and a bottom layer shielding shell which are connected, the double-layer shielding shell is bonded with a sensor through non-conductive glue, the glue preparation surface of the shielding shell is bonded with the sensor, the glue-free surface of the shielding shell faces outwards to form a conductive surface, and the sensor is integrally wrapped in the middle of the two shielding shells to form a closed shell;
in the sensor packaging structure, the double-layer shielding shell is made of aluminum foil, copper foil, conductive adhesive, conductive cloth or aluminized PET (polyethylene terephthalate); the double-layer shielding shell is folded into an integral structure or arranged in a split way.
In the sensor packaging structure, the first conductive buckle is a snap buckle, a snap buckle or an I-shaped buckle made of metal; wherein, first electrically conductive buckle sets up to two, and first electrically conductive buckle includes that first son detains and first box, sets up the first locating hole that is used for fixing a position first electrically conductive buckle on the shielding shell, and the first son of first electrically conductive buckle is detained and is carried out the buckle with first box after running through bottom shielding shell and adjacent shaping precoat and be connected, and the basal portion that two first sons were detained is connected with two signal outgoing lines respectively, and the first locating hole diameter that supplies first son to detain to run through is greater than the diameter that first son was detained, and first son is detained and is wrapped up by insulating cement and bonds with the shielding shell.
The sensor packaging structure comprises a second conductive buckle, wherein the second conductive buckle is a metal snap buckle, a snap buckle or an I-shaped buckle; second positioning holes for the second sub buckles of the second conductive buckle to penetrate through are correspondingly formed in the top layer shielding shell and the bottom layer shielding shell; the second son of the electrically conductive buckle of second is buckled and is run through top layer shielding shell, bottom shielding shell and adjacent shaping precoat setting to with the female lock of the second in the shaping precoat outside, the top surface fabric covers and bonds the second son and detains, the son of the electrically conductive buckle of second is detained and is carried out the electricity with top layer shielding shell, bottom shielding shell respectively and is connected.
The second conductive buckle is in contact with the aluminum foil shielding layer, so that the second conductive buckle is connected with the signal conditioning circuit to be grounded, and the signal shielding effect is improved.
Preferably, the second conductive clip is located at the center of the two first conductive clips.
The sensor packaging structure also comprises at least one third buckle, a third positioning hole matched with the third buckle is formed in the forming fabric layer, the third buckle is a snap buckle, a snap buckle or an I-shaped buckle, and a third sub-buckle of the third buckle only penetrates through the top fabric and the bottom fabric and then is connected with the third female buckle in a buckling mode; the third buckles are arranged to be one or more than one side edges far away from the first conductive buckles; or the third buckles are symmetrically distributed on two corresponding sides or the periphery of the sensor packaging structure.
In the sensor packaging structure, the sensor is a piezoelectric film sensor or a piezoelectric ceramic sensor.
In another aspect, the present invention further provides a method for packaging the sensor package structure, which includes the following steps:
s1, placing the double-layer shielding shell and the hole of the bottom fabric in an aligned mode, and enabling the outer side of the shielding shell without glue to be in contact with and bonded with the bottom fabric;
s2, connecting one end of the signal outgoing line with a wiring pin of the sensor, and connecting the other end of the signal outgoing line with a first sub buckle of the first conductive buckle;
s3, placing first sub buckles of the two first conductive buckles in two first positioning holes of the bottom layer shielding shell respectively, enabling the first sub buckles not to be in contact with the edges of the first positioning holes, and bonding the sub buckles with the shielding shell through insulating glue; meanwhile, the sensor is placed on the side, with the adhesive, of the shielding shell, and the covered top shielding shell can completely cover the sensor, the signal outgoing line, the sub-buckle and the insulating adhesive;
s4, placing a second sub buckle of a second conductive buckle into a second positioning hole of a conductive surface of the top surface shielding shell, bonding one side of the top surface fabric with the adhesive surface with the conductive surface of the top surface shielding shell, and completely wrapping the double-layer shielding shell and the sensor;
and S5, placing the third sub buckle of the third buckle into the third positioning hole, and pressing various female buckles and corresponding sub buckles into a whole by using a buckle pressing machine to finish packaging.
The invention also provides an intelligent garment, which comprises a garment main body and the sensor packaging structure convenient to disassemble, wherein the sensor packaging structure outputs the acquired human physiological signals to detection information through the connected signal conditioning circuit.
The invention has the beneficial effects that:
(1) sensor packaging structure convenient to dismantle through setting up double-deck shielding shell, improves the signal acquisition precision of sensor, reduces signal interference, through the bonding with the shaping precoat that outside set up, encapsulates sensor packaging unit, strengthens the fixed connection of sensor packaging structure and outside shaping precoat through three kinds of buckle structures simultaneously. The structure improves the connection stability of the whole structure of the sensor packaging structure, has good signal shielding effect, improves the signal acquisition precision, is convenient to disassemble, assemble and maintain, can be recycled, and has high utilization rate.
(2) Through the first conductive buckle, the electric connection between the sensor and an external circuit is realized, and meanwhile, the shielding shell and the molding fabric layer are mechanically connected; the arrangement of the second conductive buckle further strengthens the fixed connection between the whole sensor packaging structure and the clothing fabric, strengthens the packaging stability of the shielding shell, facilitates the grounding arrangement of the shielding shell and improves the signal shielding effect; the third buckle is arranged to further improve the overall stability of the sensor packaging structure by enhancing the connection strength between the top surface fabric and the bottom surface fabric. The three buckle structures are arranged, so that the sensor packaging structure is convenient to rapidly position and disassemble, the structural stability is high, and the service life of the sensor is effectively prolonged.
(3) The packaging method of the sensor packaging structure is simple, easy to operate, high in packaging efficiency and convenient for industrial production, the prepared sensor packaging structure is high in structural stability, excellent in signal shielding performance, the signal acquired by the sensor is obviously improved in the aspects of bottom noise, sensitivity and anti-interference capacity, and the application range is wide; the sensor packaging structure is convenient to disassemble, assemble and maintain, and improves the recycling rate.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a perspective schematic view of a sensor package structure for easy disassembly according to the present invention;
FIG. 2 is a schematic structural view of an alternative embodiment of a sensor;
FIG. 3 is a schematic view of a folded configuration of an alternative embodiment of the shield enclosure;
fig. 4 is a schematic view of a tiling configuration of an alternative embodiment of a shield can;
FIG. 5 is a schematic structural view of two embodiments of a snap structure;
FIG. 6 is a schematic view of a lay-up configuration of formed facestock layers in an alternative embodiment;
FIG. 7 is a schematic view of an alternative embodiment of a sensor coupled to a snap feature;
FIG. 8 is a schematic packaging flow diagram of an alternative embodiment of a sensor package structure of the present invention;
FIG. 9 is an exploded view of a sensor package structure according to an alternative embodiment of the present invention;
FIG. 10 is a comparison of a plot of sensor background noise after packaging versus no packaging; wherein, the upper part is a bottom noise oscillogram of the sensor after encapsulation, and the lower part is a bottom noise oscillogram of the sensor without encapsulation;
FIG. 11 is a comparison of the same input waveform pattern for a packaged and unpackaged sensor; wherein, the upper part is the oscillogram of the sensor without encapsulation, and the lower part is the oscillogram of the sensor after encapsulation.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
FIG. 1 illustrates an alternative embodiment of a sensor package structure that facilitates disassembly.
In this embodiment, the sensor package structure includes: the sensor packaging unit, the molding fabric layer 5 for coating the sensor packaging unit, the first conductive buckle for fixedly connecting the sensor packaging unit and the molding fabric layer 5, and the signal outgoing line 3.
The sensor packaging unit comprises a sensor 1 and a double-layer shielding shell 2 which completely covers the sensor 1; one end of the signal outgoing line 3 is connected with a wiring pin 11 of the sensor, the other end of the signal outgoing line is connected with a first conductive buckle 401, a first positioning hole for the first conductive buckle 401 to penetrate through is formed in the double-layer shielding shell 2, and the first conductive buckle and the double-layer shielding shell 2 are in non-electrical connection through adhesion; the molding fabric layer 5 includes a top fabric 51 and a bottom fabric 52 respectively covering the top and bottom surfaces of the double-layered shield case 2. The molding fabric layer 5 and the sensor packaging unit are bonded or connected in a buckling mode or in a combined and reinforced mode.
The shapes of the top surface fabric 51 and the bottom surface fabric 52 are the same as the shape of the shielding shell 2, the specifications are slightly larger, and the sensor packaging unit is completely wrapped by adhesion with the shielding shell. Preferably, the top surface fabric 51 and the bottom surface fabric 52 are respectively and uniformly coated with insulating glue, so that the position of the shielding shell can be fixed, and the top surface fabric 51 and the bottom surface fabric 52 can be firmly bonded without affecting signals.
Above-mentioned sensor packaging structure, through setting up double-deck shielding shell 2, improve sensor 1's signal acquisition precision, reduce signal interference, through the bonding with the shaping precoat 5 of outside setting, encapsulate sensor packaging unit, strengthen sensor packaging structure and outside shaping precoat 5's fixed connection through buckle structure simultaneously. The structure improves the connection stability of the whole structure of the sensor packaging structure, has good signal shielding effect, improves the signal acquisition precision, is convenient to disassemble, assemble and maintain, can be recycled, and has high utilization rate.
Wherein, the sensor 1 is a piezoelectric film sensor or a piezoelectric ceramic sensor. In this embodiment, as shown in fig. 2, the sensor 1 is a piezoelectric film sensor, and is configured to collect real-time physiological signals of an object to be measured. The PVDF piezoelectric film sensor has the advantages of being thin in whole body, light in weight, soft, capable of working passively, durable, high in sensitivity, wide in bandwidth range and the like, and is particularly suitable for monitoring human physiological signals.
The double-layer shielding shell 2 comprises a top layer shielding shell 21 and a bottom layer shielding shell 22 which are connected, wherein the top layer shielding shell 21 and the bottom layer shielding shell 22 can be arranged in a split mode and are adhered through mechanical connection or non-conductive glue; as shown in fig. 3-4, in this embodiment, the top shield shell 21 and the bottom shield shell 22 are folded as a unitary structure, such as being formed by folding a sheet of aluminum foil.
In order to achieve the electromagnetic shielding effect, the double-layer shielding shell is made of aluminum foil, copper foil, conductive adhesive, conductive cloth or aluminized PET (polyethylene terephthalate). Preferably, in this embodiment, the double-layer shielding shell 2 is made of aluminum foil, and since the aluminum foil is made of metal, has soft texture, good ductility, excellent conductivity, and low processing cost and material cost, the prepared shielding shell 2 has a good signal shielding effect. Preferably, the thickness of the aluminum foil ranges from 0.01mm to 0.1mm, and the shielding effect of the aluminum foil with such thickness is further improved.
The double-layer shielding shell 2 is bonded with the sensor 1 through non-conductive glue, the glue preparation side of the shielding shell 2 is bonded with the sensor, the glue-free side faces outwards to form a conductive surface, and the sensor 1 is integrally wrapped in the middle by the two shielding shells to form a closed shell, so that electromagnetic shielding is realized. The shielding shell 2 is mainly used for shielding the interference of signals coming from human body accidents to the sensor in the acquisition process of the original signals of the sensor main body, and comprises electromagnetic signals, skin electricity, static electricity and the like, so that the original signals acquired by the sensor are prevented from being mixed with external electromagnetic waves to a great extent, and the acquired original signals are closer to actual original signals.
The shape of the double-layer shielding shell 2 is slightly larger than that of the sensor, so that the double-layer shielding shell can completely cover the sensor 1 and reduce the cost. The double-layer shielding shell 2 is provided with a positioning hole for the buckle structure to penetrate through. Preferably, in order to facilitate the engagement with the first conductive clip, the width of the clip structure connection end of the shield case 2 is enlarged.
Optionally, the signal lead-out wire 3 is a copper braided wire. The other end of the copper braided wire is connected to the bottom surface of the sub-buckle 421 of the first conductive buckle. The connection mode can be selected from welding and other connection modes with conductive performance. Optionally, the two copper braided wires are respectively welded on the corresponding wiring pins 11 of the sensor, and the copper braided wires and the sensor wiring pins at the welding position are wrapped by insulating glue, so as to avoid short circuit with a shielding shell (aluminum foil).
Alternatively, FIGS. 6-9 illustrate another alternative embodiment of the present invention.
In this embodiment, the first conductive fastener 401 is a snap fastener, a snap fastener or an i-shaped fastener made of metal; wherein, first electrically conductive buckle 401 sets up to two, first electrically conductive buckle includes that first son detains 421 and first box, set up the first locating hole 81 that is used for fixing a position first electrically conductive buckle on the shielding shell, the first son of first electrically conductive buckle detains 421 and runs through and carry out the buckle with first box behind bottom shielding shell 22 and the adjacent shaping precoat 5 and be connected, the basal portion of two first son detains 421 is connected with two signal outgoing lines 3 respectively, the diameter of the first locating hole 81 that supplies first son to detain 421 to run through is greater than the diameter that first son detains 421, first son detains 421 and is wrapped up by insulating cement and bonds with shielding shell 2. The above arrangement is to avoid the problem of short circuit due to the direct contact of the first conductive clip 401 with the shield case 2. Through the arrangement of the first conductive buckle 401, the electric connection between the sensor 1 and an external circuit (such as a signal conditioning circuit) is realized, and meanwhile, the shielding shell 2 is connected with the buckle of the molding fabric layer 5. During the actual use, the box of two first electrically conductive buckles is connected with the positive pole, the negative pole of circuit respectively.
The sensor packaging structure further comprises a second conductive fastener 402, wherein the second conductive fastener 402 is a metal snap fastener, a snap fastener or an I-shaped fastener; the top layer shielding shell and the bottom layer shielding shell are correspondingly provided with second positioning holes 82 for the second sub buckles 422 of the second conductive buckle to penetrate through; the second sub buckle 422 of the second conductive buckle penetrates through the top layer shielding shell 21, the bottom layer shielding shell 22 and the adjacent forming fabric layer 52 and is buckled with the second female buckle on the outer side of the forming fabric layer, the top surface fabric 51 covers and bonds the second sub buckle 422, and the sub buckle 422 of the second conductive buckle is electrically connected with the top layer shielding shell 21 and the bottom layer shielding shell 22 respectively.
The above arrangement is to electrically connect the second conductive snap 422 to the aluminum foil shielding layer, so that the second female snap of the second conductive snap 402 can be conveniently connected to the ground terminal of a circuit (such as a signal conditioning circuit), thereby improving the signal shielding effect. And secondly, the arrangement of the sub-buckles of the second conductive buckle further enhances the structural stability of the whole sensor packaging unit and the fixed connection between the whole sensor packaging unit and the external molding fabric layer. In this embodiment, in order to reduce the manufacturing and processing cost and simplify the structure, the number of the sub-buckles 422 of the second conductive buckle is 1, and the position between the sub-buckles 421 of the two first conductive buckles is better in the connecting effect and the signal shielding effect.
Further, the sensor packaging structure further comprises at least one third buckle 403, a third positioning hole 83 matched with the third buckle is formed in the molding fabric layer 5, the third buckle 403 is a snap buckle, a snap buckle or an i-shaped buckle, and a third sub-buckle 423 of the third buckle penetrates through the top fabric 51 and the bottom fabric 52 and is connected with the third female buckle in a buckling manner; the third buckles are arranged to be one or more than one side edges far away from the first conductive buckles; or the third buckles are symmetrically distributed on two corresponding sides or the periphery of the sensor packaging structure. The third catch 403 is not in contact with the shield case.
The three snap structures of the present invention can all be snap, or i-shaped, and fig. 5 shows two alternative snap (including female snap 41 and male snap 42 that snap together) and snap structures (including female snap 41 'and male snap 42' that snap together).
The performance of the sensor packaged by the method of the present invention and the unpackaged sensor was tested, as shown in fig. 10, which is a comparison of the noise floor of the two sensors, the unpackaged sensor (lower waveform 92) having a noise floor that is tens of times that of the unpackaged sensor (upper waveform 91) of the sensor packaged by the present invention. Fig. 11 is a graph of the signal waveforms of two sensors under the same input excitation, and the signal strength of the packaged sensor (upper waveform 93) of the present invention is significantly higher than the signal strength of the unpackaged sensor (lower waveform 94), with an increase in strength of about four times. Obviously, compared with a sensor which is not packaged, the sensor packaged by the invention has obvious improvement and improvement on the background noise, the sensitivity and the anti-interference capability.
The invention also provides a packaging method of the sensor packaging structure convenient to disassemble, which comprises the following steps:
s1, the double-layered shield shell 2 is aligned with the hole of the bottom surface fabric 52, and the non-adhesive outer side of the shield shell is brought into contact with and bonded to the bottom surface fabric 52.
S2, connecting one end of the signal outgoing line 3 with the wiring pin 11 of the sensor 1, and connecting the other end with the first sub-buckle 421 of the first conductive buckle.
S3, placing the first sub-buckles 421 of the two first conductive buckles in the two first positioning holes 81 of the bottom shielding shell 22 respectively, wherein the first sub-buckles 421 are not in contact with the edges of the first positioning holes 81, and bonding the sub-buckles 421 with the shielding shell 2 through the insulating glue 7; meanwhile, the sensor 1 is placed on the side, with the adhesive, of the shielding shell, and the covered top shielding shell 21 can completely cover the sensor, the signal outgoing line 3, the sub-buckle 42 and the insulating adhesive 7;
s4, placing the second sub-fastener 422 of the second conductive fastener into the second positioning hole 82 of the conductive surface of the top shielding shell 21, bonding the side of the top fabric 51 with the adhesive surface to the conductive surface of the top shielding shell 21, and completely wrapping the double-layer shielding shell and the sensor.
S6, placing the third sub-buckle 423 of the third buckle into the third positioning hole 83, and pressing the various female buckles and the corresponding sub-buckles into a whole by a buckle pressing machine, thereby completing the packaging.
The packaging method of the sensor packaging structure is simple and easy to operate, the packaging efficiency is high, industrial production expansion is facilitated, the prepared sensor packaging structure is high in connection strength, accurate in positioning and excellent in signal shielding performance, and the sensor packaging structure is convenient to disassemble, assemble and maintain. The sensor packaging structure can be widely applied to various clothes, such as clothes, scarves, other accessories and the like, and is used for collecting human physiological signals in the wearing process of the clothes.
The invention also provides an intelligent clothing, which comprises a clothing main body and the sensor packaging structure fixed on the clothing main body, wherein the sensor packaging structure outputs the acquired human physiological signals to the detection information through the connected signal conditioning circuit.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. A sensor package structure convenient to dismantle, comprising: the sensor packaging device comprises a sensor packaging unit, a molding fabric layer (5) for coating the sensor packaging unit, a first conductive buckle for fixedly connecting the sensor packaging unit and the molding fabric layer (5), and a signal outgoing line (3);
the sensor packaging unit comprises a sensor (1) and a double-layer shielding shell (2) which completely covers the sensor (1); one end of the signal outgoing line (3) is connected with a wiring pin (11) of the sensor, the other end of the signal outgoing line is connected with a first conductive buckle, a first positioning hole for the first conductive buckle structure to penetrate through is formed in the double-layer shielding shell (2), and the first conductive buckle is in non-electrical connection with the double-layer shielding shell (2) through adhesion; the forming fabric layer (5) comprises a top surface fabric (51) and a bottom surface fabric (52) which are respectively covered on the top surface and the bottom surface of the double-layer shielding shell (2).
2. The sensor packaging structure according to claim 1, wherein the double-layer shielding shell (2) comprises a top layer shielding shell (21) and a bottom layer shielding shell (22) which are connected, the double-layer shielding shell (2) is bonded with the sensor (1) through a non-conductive adhesive, the adhesive side of the double-layer shielding shell (2) is bonded with the sensor, the adhesive side faces outwards to form a conductive surface, and the double-layer shielding shell wraps the sensor (1) in the middle to form a closed shell.
3. The sensor packaging structure according to claim 1, wherein the double-layer shielding shell (2) is made of aluminum foil, copper foil, conductive adhesive, conductive cloth or aluminized PET (polyethylene terephthalate); the double-layer shielding shell (2) is folded into an integral structure or arranged in a split way.
4. The sensor package structure of claim 2, wherein the first conductive clip (401) is a snap, or i-clip of metal; wherein, first electrically conductive buckle (401) sets up to two, first electrically conductive buckle includes that first son detains (421) and first box, set up first locating hole (81) that are used for fixing a position first electrically conductive buckle on the shielding shell, first son of first electrically conductive buckle detains (421) and runs through behind bottom shielding shell (22) and the adjacent shaping precoat (5) and carries out the buckle with first box and be connected, the basal portion that two first sons detained (421) is connected with two signal lead-out wires (3) respectively, the first locating hole diameter that supplies first son to detain (421) to run through is greater than the diameter that first son detained (421), first son detains (421) and is wrapped up by insulating cement and bonds with shielding shell (2).
5. The sensor package structure of claim 4, comprising a second conductive clip (402), wherein the second conductive clip (402) is a metal snap, or I-clip; second positioning holes (82) for the second sub buckles (422) of the second conductive buckle to penetrate through are correspondingly formed in the top layer shielding shell and the bottom layer shielding shell; the second son of the electrically conductive buckle of second is detained (422) and is run through top layer shielding shell (21), bottom layer shielding shell (22) and adjacent shaping precoat (52) setting to with the second box lock in the shaping precoat outside, top surface fabric (51) cover and bond the second son and detain (422), the son of the electrically conductive buckle of second is detained (422) and is connected with top layer shielding shell (21), bottom layer shielding shell (22) electricity respectively.
6. The sensor package structure of claim 5, characterized in that the second conductive snap (402) is located in a central position of the two first conductive snaps (401).
7. The sensor packaging structure according to claim 1, further comprising at least one third buckle (403), wherein a third positioning hole (83) matched with the third buckle is formed in the molding fabric layer (5), the third buckle (403) is a snap buckle, a snap buckle or an i-shaped buckle, and a third sub-buckle (423) of the third buckle penetrates through the top fabric (51) and the bottom fabric (52) and then is connected with the third female buckle in a buckling manner; the third buckles are arranged to be one or more than one side edges far away from the first conductive buckles; or the third buckles are symmetrically distributed on two corresponding sides or the periphery of the sensor packaging structure.
8. The sensor package structure of claim 1, wherein the sensor is a piezoelectric thin film sensor or a piezoelectric ceramic sensor.
9. A method of packaging a sensor package for easy disassembly as claimed in claim 8, comprising the steps of:
s1, the double-layer shielding shell (2) is aligned with the holes of the bottom surface fabric (52), and the outer side of the shielding shell without glue is contacted and adhered with the bottom surface fabric (52);
s2, connecting one end of the signal outgoing line (3) with a wiring pin (11) of the sensor (1), and connecting the other end of the signal outgoing line with a first sub buckle (421) of the first conductive buckle;
s3, placing first sub buckles (421) of the two first conductive buckles in two first positioning holes (81) of a bottom layer shielding shell (22) respectively, enabling the edges of the first sub buckles (421) and the first positioning holes (81) not to be in contact, and bonding the sub buckles (421) and the shielding shell (2) through insulating glue (7); meanwhile, the sensor (1) is placed on the side, with the adhesive, of the shielding shell, and the covered top shielding shell (21) can completely cover the sensor, the signal outgoing line (3), the sub-button (421) and the insulating adhesive (7);
s4, placing a second sub-buckle (422) of a second conductive buckle into a second positioning hole (82) of the conductive surface of the top shielding shell (21), bonding the side, with the adhesive surface, of the top fabric (51) with the conductive surface of the top shielding shell (21), and completely wrapping the double-layer shielding shell and the sensor;
s5, placing a third sub buckle (423) of the third buckle into a third positioning hole (83), and pressing various female buckles and corresponding sub buckles into a whole by using a buckle pressing machine to finish packaging.
10. An intelligent clothing, comprising a clothing main body, characterized by comprising the sensor packaging structure convenient to disassemble as claimed in any one of claims 1-8, wherein the sensor packaging structure outputs the acquired human body physiological signal to the detection information through the connected signal conditioning circuit.
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