CN109714942A - A kind of sensor-packaging structure and signal pickup assembly - Google Patents
A kind of sensor-packaging structure and signal pickup assembly Download PDFInfo
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- CN109714942A CN109714942A CN201811451510.5A CN201811451510A CN109714942A CN 109714942 A CN109714942 A CN 109714942A CN 201811451510 A CN201811451510 A CN 201811451510A CN 109714942 A CN109714942 A CN 109714942A
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- sensor
- packaging structure
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Abstract
The invention proposes a kind of sensor-packaging structures, belong to sensor technical field.The sensor-packaging structure, comprising: the shell and signal lead-out wire be made of two shielded layers；Sandwiched sensor and sensor is fully wrapped around between two shielded layers；Signal lead-out wire one end connects the wiring pin of the sensor, and the other end extends the shell that the shielded layer is constituted.Using the alternative embodiment, the transmission process of sensor and signal conditioning circuit is protected, collected original signal is avoided to be polluted in transmission process by extraneous clutter, the signal for receiving signal conditioning circuit is more clear, more accurate.The invention also provides a kind of signal pickup assemblies.
Description
Technical field
The present invention relates to sensor technical field, in particular to a kind of sensor-packaging structure and signal pickup assembly.
Background technique
The encapsulating structure of sensor is most important for sensor, determines the essence of the acquisition signal of sensor output
Degree.
The Chinese patent application of publication number CN2874423Y discloses a kind of PVDF piezoelectric membrane of metal screen layer shielding
Matrix encapsulates strain gauge, is shielded by the way that metallic shield net is arranged outside substrate to electromagnetic interference.The shortcomings that technology, is
Shielded layer does not cover at sensor wire rivet, and signal lead-out wire does not do shielding processing, and that there are still electromagnetic signals at two is dry for this
It disturbs, collected signal is inaccurate.
How a kind of encapsulating structure of sensor is provided, reduces electromagnetic interference, is current urgent problem to be solved.
Summary of the invention
The present invention proposes a kind of sensor-packaging structure and signal pickup assembly, solves since electromagnetic interference causes to sense
Device acquires the low problem of signal accuracy.
The technical scheme of the present invention is realized as follows:
According to the first aspect of the invention, a kind of sensor-packaging structure is proposed.
In some optional embodiments, the sensor-packaging structure, comprising: the shell and letter being made of two shielded layers
Number lead-out wire；Sandwiched sensor and sensor is fully wrapped around between two shielded layers；Signal lead-out wire one end connects institute
The wiring pin of sensor is stated, the other end extends the shell that the shielded layer is constituted.
Optionally, described two shielded layers are bonding by glue.
Optionally, the standby glue one side bonding sensor of the shielded layer, no glue one faces outwardly, and two shielded layers are by the biography
Sensor is integrally wrapped in centre, forms closed shell.
Optionally, the material of the shielded layer is aluminium foil, and the sensor is enclosed in centre by two shielded layers, forms envelope
Enclosed aluminium foil shell.
Optionally, the sensor is piezoelectric film sensor.
Optionally, the signal lead-out wire includes a shielding line and two conducting wires, and shielding line and two conducting wires twist into one
Stock.
Optionally, one end of the conducting wire is welded on the corresponding wiring pin of the sensor, and conducting wire is by the shell
Side is stretched out, and the conducting wire other end is connected with signal conditioning circuit；Described shielding line one end is fixed on the shell direction
On the conducting surface in outside, the other end is connected to the ground potential of signal conditioning circuit.
Optionally, two conducting wires are respectively welded in the corresponding wiring pin of the sensor, use insulating cement packet
Wrap up in the conducting wire and sensor wire pin of weld.
According to the second aspect of the invention, a kind of signal pickup assembly is proposed.
In some optional embodiments, the signal pickup assembly, including sensor further include any one of aforementioned optional reality
Sensor-packaging structure described in example is applied, the sensor is encapsulated in the sensor-packaging structure.
The beneficial effects of the present invention are:
(1) transmission process of sensor and signal conditioning circuit is protected, collected original signal is avoided to pass
Defeated process is polluted by extraneous clutter, and the signal for receiving signal conditioning circuit is more clear, more accurate；
(2) double wired conductor with shielding line can not only resist a part from extraneous Electromagnetic Interference, can also reduce
Interfering with each other between twisted wire plays a protective role to transmission signal.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the structural schematic diagram of an alternative embodiment of sensor of the invention shielding construction；
Fig. 2 is the structural schematic diagram of an alternative embodiment of sensor；
Fig. 3 is the structural schematic diagram of an alternative embodiment of signal lead-out wire；
Fig. 4 is the connection relationship diagram of signal lead-out wire；
Fig. 5 is unshielded structure and has the disorderly wave signal waveforms of the sensor of shielding construction；
Fig. 6 is unshielded structure and the sensor signal output waveform figure for having shielding construction under identical input signal；
Fig. 7 is unshielded structure and the sensor signal-to-noise ratio waveform diagram for having shielding construction.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Fig. 1 shows an alternative embodiment of sensor-packaging structure.
The sensor-packaging structure draws for encapsulating sensor including the shell 3 being made of two shielded layers and signal
Outlet 2.The shielded layer size is greater than the sensor, sandwiched sensor and wraps sensor completely between two shielded layers
It wraps up in.Signal lead-out wire one end connects the wiring pin of the sensor, and the other end extends the shell that the shielded layer is constituted
Body, the signal lead-out wire are used for transmission the collected original signal of sensor, the transmission to sensor and signal conditioning circuit
Process is protected, and is avoided collected original signal from being polluted in transmission process by extraneous clutter, is connect signal conditioning circuit
The signal received is more clear, more accurate.
Optionally, the shielded layer shape is identical as the sensor shape, and size is slightly larger than the sensor.It is optional
Ground, the shielded layer shape are designed according to concrete application, the fully wrapped around sensor of Assurance of Size.
Optionally, described two shielded layers are bonding by glue, such as the glue is non-conductive double-sided adhesive.
Optionally, the standby glue one side bonding sensor of the shielded layer, no glue one faces outwardly, and two shielded layers are by the biography
Sensor is integrally wrapped in centre, forms closed shell, realizes electromagnetic shielding.
Optionally, the material of the shielded layer is aluminium foil, and the sensor is enclosed in centre by two shielded layers, forms envelope
Enclosed aluminium foil shell.Using the alternative embodiment, aluminium foil is fabricated to cover all the shape of sensor surface, is applied on one side
Non-conductive double-sided adhesive is covered, another side, which is not dealt with, makes it have electric conductivity, and aluminium foil is soft, ductility is good, electric conductivity
It is excellent.
Fig. 2 shows an alternative embodiments of sensor.
In the alternative embodiment, the shape of the sensor 2 is identical as the shape of encapsulating structure in Fig. 1 and size is less than institute
State encapsulating structure.Certainly, the shape of encapsulating structure can also be different from the shape of sensor.
Optionally, the sensor is piezoelectric film sensor, for acquiring the real-time physiological signals of object to be measured.It is optional
Ground, the piezoelectric film sensor are PVDF (Polyvinylidene Fluoride, also known as Kynoar) piezoelectric membrane biography
Sensor, PVDF piezoelectric film sensor is thin with whole matter, it is light, soft to measure, can be with non-active operation, durable, high sensitivity, bandwidth
The advantages that range is wide is particularly suitable for the monitoring of physiology signal.
Fig. 3 and Fig. 4 shows an alternative embodiment of signal lead-out wire.
In the alternative embodiment, the signal lead-out wire 2 is the double wired conductor with shielding line, including a shielding line 22 and two
Bar conducting wire, two conducting wires are respectively conducting wire 12 and conducting wire 32, and shielding line and two conducting wires twist into one.It welds one end of the conducting wire
It connects in the corresponding anode of the sensor or negative terminal pin 11, conducting wire is stretched out by the side of the shell, the conducting wire
The other end is connected with the anode of signal conditioning circuit or cathode.For the shielding line not in shielded layer, shielding line one end is solid
The shell is scheduled on towards on the conducting surface in outside, the other end is connected to the ground potential of signal conditioning circuit.
Using the alternative embodiment, it is dry from extraneous electromagnetic wave that the double wired conductor with shielding line can not only resist a part
It disturbs, interfering with each other between twisted wire can also be reduced, play a protective role to transmission signal.
Optionally, the anode on the sensor or negative terminal pin include before being located at the fixed part of rear end and being located at
The interconnecting piece at end, the interconnecting piece are mutually welded with the conducting wire, and the fixed part is connected with sensor internal circuit.It is optional
Ground, the fixed part interconnecting piece is thicker, and the fixed part is fixed in sensor body, and the interconnecting piece is relatively described
Fixed part is thinner, and the interconnecting piece is vacantly arranged, and hanging interconnecting piece and the conducting wire weld, to avoid solder horn when welding
High temperature to sensor, this body structure is had an impact.
Optionally, two conducting wires are respectively welded in the corresponding wiring pin 11 of the sensor, use insulating cement
The conducting wire and sensor wire pin for wrapping up weld avoid and shielding construction (aluminium foil) short circuit.
As shown in Figure 5, wherein waveform 51 is the disorderly wave signal waveform of the sensor of unshielded structure, and waveform 52 is to use
The disorderly wave signal waveform of the sensor of above-mentioned encapsulating structure encapsulation.The two comparison is described it is found that waveform 52 is markedly less than waveform 51
Encapsulating structure has obvious shield effectiveness to extraneous electromagnetic wave.
As shown in fig. 6, wherein waveform 53 is the signal output waveform of the sensor without encapsulating structure；Waveform 54 is using upper
State the signal output waveform of the sensor of encapsulating structure encapsulation.The two compares it is found that waveform 54 is in sensitivity and anti-interference ability
On be substantially better than waveform 53.
It is illustrated in figure 7 same sensor mask front and back signal-to-noise ratio contrast schematic diagram, wherein waveform 55 is sensor mask
The signal voltage and noise voltage ratio of signal produced by preceding, ratio (S/N) are as follows: 2.32；Waveform 56 is to use above-mentioned encapsulating structure
The signal voltage of produced signal and noise voltage ratio, ratio (S/N) are as follows: 2.05 after shielding processing.It can be seen that by above-mentioned
Sensor after encapsulating structure encapsulation, sensor signal are significantly improved and change in sensitivity and anti-interference ability
It is kind.
In other alternative embodiments, the invention also provides a kind of signal pickup assembly, the signal pickup assembly
It further include previously described sensor screen shield structure including sensor, the sensor is encapsulated in the sensor-packaging structure
In.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Within mind and principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (9)
1. a kind of sensor-packaging structure characterized by comprising the shell and signal lead-out wire be made of two shielded layers；
Sandwiched sensor and sensor is fully wrapped around between two shielded layers；Signal lead-out wire one end connects the sensor
Wiring pin, the other end extend the shell that the shielded layer is constituted.
2. a kind of sensor-packaging structure as described in claim 1, which is characterized in that described two shielded layers are mutually glued by glue
It closes.
3. a kind of sensor-packaging structure as claimed in claim 2, which is characterized in that the standby glue one side of the shielded layer is binded
Sensor, no glue one face outwardly, and the sensor is integrally wrapped in centre by two shielded layers, form closed shell.
4. a kind of sensor-packaging structure as described in claim 1, which is characterized in that the material of the shielded layer is aluminium foil,
The sensor is enclosed in centre by two shielded layers, forms closed aluminium foil shell.
5. a kind of sensor-packaging structure as described in claim 1, which is characterized in that the sensor is piezoelectric membrane sensing
Device.
6. a kind of sensor-packaging structure as described in claim 1, which is characterized in that the signal lead-out wire includes a screen
Line and two conducting wires are covered, shielding line and two conducting wires twist into one.
7. a kind of sensor-packaging structure as claimed in claim 6, which is characterized in that one end of the conducting wire is welded on described
The corresponding wiring pin of sensor, conducting wire are stretched out by the side of the shell, the conducting wire other end and signal conditioning circuit phase
Connection；Described shielding line one end is fixed on the shell towards on the conducting surface in outside, and the other end is connected to signal conditioning circuit
Ground potential.
8. a kind of sensor-packaging structure as described in claim 1, which is characterized in that two conducting wires are respectively welded at institute
It states in the corresponding wiring pin of sensor, uses the conducting wire and sensor wire pin of insulating cement package weld.
9. a kind of signal pickup assembly, including sensor, which is characterized in that further include the described in any item biographies of claim 1 to 8
Sensor encapsulating structure, the sensor are encapsulated in the sensor-packaging structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811451510.5A CN109714942A (en) | 2018-11-30 | 2018-11-30 | A kind of sensor-packaging structure and signal pickup assembly |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811451510.5A CN109714942A (en) | 2018-11-30 | 2018-11-30 | A kind of sensor-packaging structure and signal pickup assembly |
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| CN109714942A true CN109714942A (en) | 2019-05-03 |
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| CN201811451510.5A Pending CN109714942A (en) | 2018-11-30 | 2018-11-30 | A kind of sensor-packaging structure and signal pickup assembly |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110934567A (en) * | 2019-10-18 | 2020-03-31 | 青岛即发集团股份有限公司 | Sensor line implantation structure of intelligent clothing and manufacturing method |
| JP2020169832A (en) * | 2019-04-01 | 2020-10-15 | 日立金属株式会社 | Rotational speed sensor |
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| CN109480795A (en) * | 2018-10-12 | 2019-03-19 | 青岛中物云传智能科技有限公司 | A kind of sleep detection apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN201229317Y (en) * | 2008-06-16 | 2009-04-29 | 上海葛宝水处理设备有限公司 | Electrode sensor of dissolved oxygen analyzer |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2020169832A (en) * | 2019-04-01 | 2020-10-15 | 日立金属株式会社 | Rotational speed sensor |
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Application publication date: 20190503 |