CN109750284A - A kind of method of big part substrate surface chemical plating - Google Patents
A kind of method of big part substrate surface chemical plating Download PDFInfo
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- CN109750284A CN109750284A CN201910235371.0A CN201910235371A CN109750284A CN 109750284 A CN109750284 A CN 109750284A CN 201910235371 A CN201910235371 A CN 201910235371A CN 109750284 A CN109750284 A CN 109750284A
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- big part
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Abstract
The invention discloses a kind of methods of big part substrate surface chemical plating, the following steps are included: catalyst ion solution is added after silane, surface modification auxiliary agent, active material are placed in dispersion machine high speed stirring 5-10min in (1), continue to stand after stirring 60min, and the surface tension for adjusting solution is less than the surface tension of big part substrate to get functional activation liquid is arrived；(2) big part substrate surface oil removing, and clean with deionized water, dried, the then functional activation liquid in substrate surface coating step (1), then 5-10min is dried under conditions of being placed in 80-150 DEG C, obtain the big part substrate of surface active；(3) chemical plating fluid that the big part substrate surface of the surface active obtained in step (2) coats 40-80 DEG C carries out plating, uses 80 DEG C of hot winds to blow 5-10min after chemical plating, obtains the big part substrate of surface metalation；(4) the big part substrate of surface metalation obtained by deionized water cleaning step (3), and 5-10min is blown with 80 DEG C of hot winds, obtain the big part substrate of surface metalation.
Description
Technical field
The present invention relates to substrate surface metallizing art, especially a kind of method of big part substrate surface chemical plating.
Background technique
The advantages that big part substrate that metallizes is high with hardness, good corrosion resistance, at low cost, is widely used in electronics, machine
The various aspects such as tool, chemical industry preparation, aerospace, biomedicine field.It can be seen that improving substrate surface performance, substrate surface can be made heavy
One layer of metallic film of product, also can be used as the metal conductive layers of substrate.Wherein, the method for deposited metal film is roughly divided into physics
Vapour deposition process and chemical vapour deposition technique, physical vaporous deposition include sputter, vacuum evaporation, metal ions plating
Deng chemical vapour deposition technique includes plasma chemical vapor deposition, organic chemical vapor deposition etc..Wherein deposited metal electricity
Plating method is easy to operate, at low cost and be not easy affected by environment and be widely applied.Such as it is used in patent 201810507270
Soaking technology makes substrate surface activation and chemical plating, but cannot achieve the soaking process of big part substrate；Substrate drying process uses
Drying, and big part substrate not can be realized the environment space of drying.Such as substrate chemical plating in patent 201810454132.X
Process needs heating water bath, and experiment condition is complicated, is difficult to realize big part substrate surface metallization.
Summary of the invention
The object of the present invention is to provide a kind of method of big part substrate surface chemical plating, with solve it is in the prior art not
Foot, it can reduce the content of complexant in the ingredient of plating solution, and big part substrate surface gold can be fast implemented in the techniques such as sprinkling
Categoryization.
The present invention provides a kind of methods of big part substrate surface chemical plating, comprising the following steps:
(1) silane, surface modification auxiliary agent, active material are placed in after dispersion machine high speed stirring 5-10min to be added and are catalyzed
The surface tension that agent solion continues to stand after stirring 60min, and adjusts solution is less than the surface tension of big part substrate, i.e.,
Obtain functional activation liquid；
(2) big part substrate surface oil removing, and cleaned with deionized water, dried, then in substrate surface coating step (1)
Functional activation liquid, then dry 5-10min under conditions of being placed in 80-150 DEG C obtains the big part substrate of surface active；
(3) chemical plating fluid that the big part substrate surface of the surface active obtained in step (2) coats 40-80 DEG C is applied
It plates, blows 5-10min using 80 DEG C of hot winds after chemical plating, obtain the big part substrate of surface metalation；
(4) the big part substrate of surface metalation obtained by deionized water cleaning step (3), and 5- is blown with 80 DEG C of hot winds
10min obtains the big part substrate of surface metalation.
Preferably, silane described in step (1) is 3-aminopropyltriethoxysilane, propyl trimethoxy silicon
At least one of alkane, 5,6- epoxy group hexyl triethoxysilane, four glycidyl group-diamines propyl-tetramethyl siloxanes.
The adhesive force of epoxy radicals silicone hydride is good, makes coating adhesive force with higher, and then catalytic chemistry plating reaction, when activating solution is attached to
When big part substrate surface, while realizing modified big part substrate and big part substrate surface.
Preferably, surface modification auxiliary agent described in step (1) is sodium carboxymethylcellulose, triethanolamine, 12 carbon
At least one of alcohol ester, propylene glycol phenylate.Facilitate substrate surface film forming and it is not easily to fall off；Active material is ethyl alcohol, methanol,
Propyl alcohol, at least one of organic solvents such as propyl ether, can make substrate Quick-air-drying；The surface of solution is adjusted using ethylene glycol
Power.
Preferably, active material described in step (1) is ethyl alcohol, methanol, propyl alcohol, in the organic solvents such as propyl ether at least
It is a kind of.
Preferably, the concentration of catalyst ion solution described in step (1) is 50-200g/L, the catalyst ion
For gold ion, at least one of silver ion and palladium ion.
Preferably, silane described in step (1), surface modification auxiliary agent, active material and catalyst ion liquor capacity
Than for (30-40): 1:30:(40-30).
Preferably, the surface tension of solution is adjusted in step (1) using ethylene glycol.
Preferably, big part substrate described in step (2) is plastics, metal and its alloy, and glass is ceramic, in timber
At least one.
Preferably, chemical plating described in step (3) is at least one of electroless copper and chemical nickel plating.
Preferably, the electroless copper bath element are as follows: electroless copper (a) liquid: cupric sulfate pentahydrate 15g/L, ethylenediamine
Tetraacethyl disodium 14g/L, sodium potassium tartrate tetrahydrate 10g/L, potassium ferrocyanide 0.1g/L, 2,2 '-bipyridyl 0.02g/L, polyethylene glycol
1g/L, formaldehyde 15ml/L, sodium hydroxide 14.5g/L or electroless copper (b) liquid: sodium potassium tartrate tetrahydrate 12g/L, ethylenediamine tetra-acetic acid two
Sodium g/L, cupric sulfate pentahydrate 8g/L, nickel sulfate 2g/L, 2,2 '-bipyridyl 10mg/L, potassium ferrocyanide 20mg/L, formic acid 10, hydrogen
Sodium oxide molybdena 10g/L；The chemical nickel-plating plating solution composition be nickel sulfate 1g/L, cupric sulfate pentahydrate 14g/L, sodium hypophosphite 25g/L,
Sodium citrate 12.5g/L, boric acid 30ml/L.It is flash-metallised that reduction coordination agent content facilitates substrate surface.
Compared with prior art, the invention has the benefit that big part substrate surface chemical plating, work may be implemented in the present invention
Skill is simple；Coating adhesion is high.Preparation method of the invention is simple, and energy conservation and environmental protection is nontoxic, may be implemented to industrialize.
Detailed description of the invention
Fig. 1 is 1 gained surface metalation PET base material schematic diagram of embodiment.
Fig. 2 is 5 gained surface metalation paper base material schematic diagram of embodiment.
Specific embodiment
The embodiments described below with reference to the accompanying drawings are exemplary, for explaining only the invention, and cannot be construed to
Limitation of the present invention.
A kind of method of big part substrate surface chemical plating, comprising the following steps:
(1) silane, surface modification auxiliary agent, active material are placed in after dispersion machine high speed stirring 5-10min to be added and are catalyzed
The surface tension that agent solion continues to stand after stirring 60min, and adjusts solution is less than the surface tension of big part substrate, i.e.,
Obtain functional activation liquid；
(2) big part substrate surface oil removing, and cleaned with deionized water, dried, then in substrate surface coating step (1)
Functional activation liquid, then dry 5-10min under conditions of being placed in 80-150 DEG C obtains the big part substrate of surface active；
(3) chemical plating fluid that the big part substrate surface of the surface active obtained in step (2) coats 40-80 DEG C is applied
It plates, blows 5-10min using 80 DEG C of hot winds after chemical plating, obtain the big part substrate of surface metalation；
(4) the big part substrate of surface metalation obtained by deionized water cleaning step (3), and 5- is blown with 80 DEG C of hot winds
10min obtains the big part substrate of surface metalation.
Silane described in step (1) is 3-aminopropyltriethoxysilane, propyl trimethoxy silicane, 5,6- epoxy
At least one of base hexyl triethoxysilane, four glycidyl group-diamines propyl-tetramethyl siloxanes.
Surface modification auxiliary agent described in step (1) is sodium carboxymethylcellulose, triethanolamine, Lauryl Alcohol ester, the third two
At least one of alcohol phenylate.
Active material described in step (1) is ethyl alcohol, methanol, propyl alcohol, at least one of organic solvents such as propyl ether.
The concentration of catalyst ion solution described in step (1) is 50-200g/L, and the catalyst ion is gold ion,
At least one of silver ion and palladium ion.
Silane described in step (1), surface modification auxiliary agent, active material and catalyst ion liquor capacity ratio are (30-
40): 1:30:(40-30).
The surface tension of solution is adjusted in step (1) using ethylene glycol.
Big part substrate described in step (2) is plastics, metal and its alloy, and glass is ceramic, at least one in timber
Kind.
Chemical plating described in step (3) is at least one of electroless copper and chemical nickel plating.
The electroless copper bath element are as follows: electroless copper (a) liquid: cupric sulfate pentahydrate 15g/L, disodium ethylene diamine tetraacetate
14g/L, sodium potassium tartrate tetrahydrate 10g/L, potassium ferrocyanide 0.1g/L, 2,2 '-bipyridyl 0.02g/L, polyethylene glycol 1g/L, formaldehyde
15ml/L, sodium hydroxide 14.5g/L or electroless copper (b) liquid: sodium potassium tartrate tetrahydrate 12g/L, disodium ethylene diamine tetraacetate g/L, five
Brochanite 8g/L, nickel sulfate 2g/L, 2,2 '-bipyridyl 10mg/L, potassium ferrocyanide 20mg/L, formic acid 10, sodium hydroxide
10g/L；The chemical nickel-plating plating solution composition is nickel sulfate 1g/L, cupric sulfate pentahydrate 14g/L, sodium hypophosphite 25g/L, citric acid
Sodium 12.5g/L, boric acid 30ml/L.
The embodiment of the present invention 1:
A kind of method of big part substrate surface chemical plating, comprising the following steps:
(1) multiple using 10% sodium hydroxide solution sprinkling PET base material, and with cleaning, be dried for standby in ionized water.It will
3-aminopropyltriethoxysilane, sodium carboxymethylcellulose, ethyl alcohol and silver nitrate solution volume ratio are 30:1:30:40, nitric acid
The concentration of silver-colored solution is 150g/L, is placed a period of time after stirring 60min, and wanted using the surface tension that ethylene glycol adjusts solution
Less than PET base material surface tension to get functional activation liquid.
(2) using spray processing in PET base material surface spraying function activating solution, 10min under conditions of being placed in 120 DEG C.
Plating in 40 DEG C of chemical bronze plating liquid a is sprayed, 120 DEG C of dry 5min after chemical plating obtain surface metalation PET base material.
The embodiment of the present invention 2:
A kind of method of big part substrate surface chemical plating, comprising the following steps:
(1) multiple using 10% sodium hydroxide solution sprinkling ceramic base material, and with cleaning, be dried for standby in ionized water.
By propyl trimethoxy silicane, triethanolamine, methanol and silver nitrate solution volume ratio be 40:1:30:30, silver nitrate solution it is dense
Degree is 150g/L, is placed a period of time after stirring 60min, and be less than ceramic base using the surface tension that ethylene glycol adjusts solution
The surface tension of material is to get functional activation liquid.
(2) using spray processing in ceramic substrate surface spraying function activating solution, drying under conditions of being placed in 100 DEG C
10min.Plating in 80 DEG C of chemical bronze plating liquid b is sprayed, 100 DEG C of dry 5min after chemical plating obtain surface metallised ceramic base
Material.
The embodiment of the present invention 3:
A kind of method of big part substrate surface chemical plating, comprising the following steps:
(1) multiple using 10% sodium hydroxide solution spray wood substrates, and with cleaning, be dried for standby in ionized water.
It is 40:1:30:30 by 5,6- epoxy group hexyl triethoxysilane, Lauryl Alcohol ester, propyl alcohol and palladium chloride solution volume ratio, urges
The concentration of agent solion is 50g/L, is placed a period of time after stirring 60min, and the surface of solution is adjusted using ethylene glycol
Tension is less than the surface tension of wood substrates to get functional activation liquid.
(2) using spray process in wood substrates surface spraying functional activation liquid, drying under conditions of being placed in 80 DEG C
10min.50 DEG C of chemical nickel plating plating is sprayed, 80 DEG C of dry 5min after chemical plating obtain surface metalation wood substrates.
The embodiment of the present invention 4:
A kind of method of big part substrate surface chemical plating, comprising the following steps:
(1) multiple using 10% sodium hydroxide solution sprinkling metal base, and with cleaning, be dried for standby in ionized water.
It is 40:1 by four glycidyl group-diamines propyl-tetramethyl siloxanes, propylene glycol phenylate, propyl ether and palladium chloride solution volume ratio:
30:30, the concentration of catalyst ion solution are 200g/L, are placed a period of time after stirring 60min, and it is molten to use ethylene glycol to adjust
The surface tension of liquid is less than the surface tension of wood substrates to get functional activation liquid.
(2) using roll coating process in wood substrates surface roller coating functional activation liquid, drying under conditions of being placed in 80 DEG C
10min.80 DEG C of roller coating of chemical nickel plating plating, 80 DEG C of dry 5min after chemical plating, obtains surface metalation metal base.
The embodiment of the present invention 5:
A kind of method of big part substrate surface chemical plating, comprising the following steps:
(1) multiple using 10% sodium hydroxide solution sprinkling paper base material, and with cleaning, be dried for standby in ionized water.It will
3-aminopropyltriethoxysilane, propylene glycol phenylate, methanol and silver nitrate solution volume ratio be 30:1:30:40, catalyst from
The concentration of sub- solution is 50g/L, is placed a period of time after stirring 60min, and wanted using the surface tension that ethylene glycol adjusts solution
Less than PET base material surface tension to get functional activation liquid.
(2) using spray processing in paper base material surface spraying function activating solution, 10min under conditions of being placed in 150 DEG C.Spray
Plating in 60 DEG C of chemical bronze plating liquid a is spilt, 150 DEG C of dry 5min after chemical plating obtain surface metalation paper base material.
Structure, feature and effect of the invention, the above institute are described in detail based on the embodiments shown in the drawings
Only presently preferred embodiments of the present invention is stated, but the present invention does not limit the scope of implementation as shown in the drawings, it is all according to structure of the invention
Think made change or equivalent example modified to equivalent change, when not going beyond the spirit of the description and the drawings,
It should all be within the scope of the present invention.
Claims (10)
1. a kind of method of big part substrate surface chemical plating, it is characterised in that: the following steps are included:
(1) by silane, surface modification auxiliary agent, active material be placed in dispersion machine high speed stirring 5-10min after be added catalyst from
The surface tension that sub- solution continues to stand after stirring 60min, and adjusts solution is less than the surface tension of big part substrate to get arriving
Functional activation liquid；
(2) big part substrate surface oil removing, and cleaned with deionized water, dried, the then function in substrate surface coating step (1)
Energy property activating solution, then 5-10min is dried under conditions of being placed in 80-150 DEG C, obtain the big part substrate of surface active；
(3) chemical plating fluid that the big part substrate surface of the surface active obtained in step (2) coats 40-80 DEG C carries out plating, changes
It uses 80 DEG C of hot winds to blow 5-10min after learning plating, obtains the big part substrate of surface metalation；
(4) the big part substrate of surface metalation obtained by deionized water cleaning step (3), and 5-10min is blown with 80 DEG C of hot winds, it obtains
To the big part substrate of surface chemical plating.
2. the method for big part substrate surface chemical plating according to claim 1, it is characterised in that: described in step (1)
Silane is 3-aminopropyltriethoxysilane, propyl trimethoxy silicane, 5,6- epoxy group hexyl triethoxysilane, four contractings
At least one of water glyceryl-diamines propyl-tetramethyl siloxanes.
3. the method for big part substrate surface chemical plating according to claim 1, it is characterised in that: described in step (1)
Surface modification auxiliary agent is at least one of sodium carboxymethylcellulose, triethanolamine, Lauryl Alcohol ester, propylene glycol phenylate.
4. the method for big part substrate surface chemical plating according to claim 1, it is characterised in that: living described in step (1)
Property substance be ethyl alcohol, methanol, propyl alcohol, at least one of organic solvents such as propyl ether.
5. the method for big part substrate surface chemical plating according to claim 1, it is characterised in that: step is urged described in (1)
The concentration of agent solion is 50-200g/L, and the catalyst ion is gold ion, at least one in silver ion and palladium ion
Kind.
6. the method for big part substrate surface chemical plating according to claim 1, it is characterised in that: silicon described in step (1)
Alkane, surface modification auxiliary agent, active material and catalyst ion liquor capacity ratio are (30-40): 1:30:(40-30).
7. the method for big part substrate surface chemical plating according to claim 1, it is characterised in that: use second in step (1)
The surface tension of glycol adjusting solution.
8. the method for big part substrate surface chemical plating according to claim 1, it is characterised in that: described in step (2)
Big part substrate is plastics, metal and its alloy, glass, ceramics, at least one of timber.
9. the method for big part substrate surface chemical plating according to claim 1, it is characterised in that: described in step (3)
Chemical plating is at least one of electroless copper and chemical nickel plating.
10. the method for big part substrate surface chemical plating according to claim 9, it is characterised in that: the electroless copper plating
Liquid composition are as follows: electroless copper (a) liquid: cupric sulfate pentahydrate 15g/L, disodium ethylene diamine tetraacetate 14g/L, sodium potassium tartrate tetrahydrate 10g/L,
Potassium ferrocyanide 0.1g/L, 2,2 '-bipyridyl 0.02g/L, polyethylene glycol 1g/L, formaldehyde 15ml/L, sodium hydroxide 14.5g/L or
Electroless copper (b) liquid: sodium potassium tartrate tetrahydrate 12g/L, disodium ethylene diamine tetraacetate g/L, cupric sulfate pentahydrate 8g/L, nickel sulfate 2g/L,
2,2 '-bipyridyl 10mg/L, potassium ferrocyanide 20mg/L, formic acid 10, sodium hydroxide 10g/L；
The chemical nickel-plating plating solution composition is nickel sulfate 1g/L, cupric sulfate pentahydrate 14g/L, sodium hypophosphite 25g/L, sodium citrate
12.5g/L, boric acid 30ml/L.
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Cited By (5)
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|---|---|---|---|---|
| CN110724941A (en) * | 2019-11-26 | 2020-01-24 | 贺州学院 | Method for preparing porous metal film by chemical plating process |
| CN110932067A (en) * | 2019-11-28 | 2020-03-27 | 中国人民解放军军事科学院国防科技创新研究院 | Method for preparing optical fiber cladding light filter based on chemical Cu plating method |
| CN111074247A (en) * | 2020-03-04 | 2020-04-28 | 安徽江东科技粉业有限公司 | Simple inorganic powder surface chemical plating method |
| CN111996517A (en) * | 2020-08-03 | 2020-11-27 | 贺州学院 | Preparation method of self-repairing chemical coating |
| CN113956527A (en) * | 2021-12-07 | 2022-01-21 | 深圳大学 | Surface-metallized liquid crystal polymer and preparation method thereof |
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| CN110932067A (en) * | 2019-11-28 | 2020-03-27 | 中国人民解放军军事科学院国防科技创新研究院 | Method for preparing optical fiber cladding light filter based on chemical Cu plating method |
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| CN111074247A (en) * | 2020-03-04 | 2020-04-28 | 安徽江东科技粉业有限公司 | Simple inorganic powder surface chemical plating method |
| CN111996517A (en) * | 2020-08-03 | 2020-11-27 | 贺州学院 | Preparation method of self-repairing chemical coating |
| CN113956527A (en) * | 2021-12-07 | 2022-01-21 | 深圳大学 | Surface-metallized liquid crystal polymer and preparation method thereof |
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