CN109741918A - A kind of inductance and moulding process - Google Patents
A kind of inductance and moulding process Download PDFInfo
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- CN109741918A CN109741918A CN201910144127.3A CN201910144127A CN109741918A CN 109741918 A CN109741918 A CN 109741918A CN 201910144127 A CN201910144127 A CN 201910144127A CN 109741918 A CN109741918 A CN 109741918A
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- magnetic platform
- bottom plate
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- inductance
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Abstract
The invention discloses a kind of inductance and moulding process, inductance includes T shape Ci Tai, upper magnetic platform and winding, and the T shape magnetic platform is made of bottom plate and cylinder, and middle position compression has cylinder at the top of the bottom plate, the winding is socketed in cylindrical outer side, and the upper magnetic platform is wrapped at the top of bottom plate and cylindrical outer side；Inductance moulding process includes the following steps: S1, carries out pre-molding to T shape magnetic platform by stamping die, and press temperature is 10~30 DEG C, and pressure is 1~10T/cm2, using 10~30s of baking at 50~120 DEG C；S2, by coil winding machine to coil winding is carried out, form winding, operating temperature is 150~250 DEG C when coiling；The present invention, directly conductive using conducting wire, stable connection, product structure is simple, save the cost, and product thickness can be greatly reduced and meet the market demand；Make to contact close, global density increase, promotion magnetic permeability between structure, while promoting preparation work efficiency.
Description
Technical field
The present invention relates to electronic component field, specially a kind of inductance and moulding process.
Background technique
Inductance is the equipment produced electricity by electromagnetic induction principle.Existing inductance has the following deficiencies: a large amount of uses
Lead frame, at high cost, lead frame is connect there are risk with Inside coil, due to the use of lead frame, leaves the space of coil for very
It is small and product thickness can not be reduced；Powder material is unevenly distributed in molding, and global density can not be promoted, and material magnetic property is caused to play
It is low；It is assembled after the independent coiling of coil with magnetic core, process is tedious, inefficiency；For these defects, so we design a kind of electricity
Sense and moulding process are necessary.
Summary of the invention
The purpose of the present invention is to provide a kind of inductance and moulding process, directly conductive using conducting wire, stable connection, product
Structure is simple, save the cost, and product thickness can be greatly reduced and meet the market demand；Make to contact close, global density between structure
Increase, promotes magnetic permeability, while promoting preparation work efficiency.
The purpose of the present invention can be achieved through the following technical solutions:
A kind of inductance, including T shape Ci Tai, upper magnetic platform and winding, the T shape magnetic platform are made of bottom plate and cylinder, the bottom
Compressing at the position of plate top center has a cylinder, and the winding is socketed in cylindrical outer side, the upper magnetic platform be wrapped at the top of bottom plate and
Cylindrical outer side.
As a further solution of the present invention: the T shape magnetic platform and the upper magnetic platform are same magnetic material component.
A kind of inductance moulding process, includes the following steps:
S1, pre-molding is carried out to T shape magnetic platform by stamping die, press temperature is 10~30 DEG C, and pressure is 1~10T/
cm2, using 10~30s of baking at 50~120 DEG C；
S2, by coil winding machine to coil winding is carried out, form winding, operating temperature is 150~250 DEG C when coiling；
S3, the cylinder of T shape magnetic platform is placed in mold, inserts magnetic powder, magnetic powder is wrapped at the top of bottom plate and cylindrical outer side, shape
At upper magnetic platform, hot-forming, 1~10T/cm of pressure at being 80~200 DEG C in temperature2。
Beneficial effects of the present invention:
1, T shape magnetic platform is made of bottom plate and cylinder, and middle position compression has cylinder at the top of bottom plate, and winding is socketed in cylinder
Outside, upper magnetic platform is wrapped at the top of bottom plate and cylindrical outer side, and the structure is directly conductive using conducting wire, stable connection, product structure
Simply, save the cost can be greatly reduced product thickness and meet the market demand；
2, pass through step: pre-molding S1, being carried out to T shape magnetic platform by stamping die, press temperature is 10~30 DEG C, pressure
Power is 1~10T/cm2, using 10~30s of baking at 50~120 DEG C；S2, pass through coil winding machine to coil winding is carried out, formed
Winding, operating temperature is 150~250 DEG C when coiling；S3, the cylinder of T shape magnetic platform 1 is placed in mold, inserts magnetic powder, magnetic powder packet
It is rolled in bottom plate top and cylindrical outer side, magnetic platform in formation, hot-forming, 1~10T/cm of pressure at being 80~200 DEG C in temperature2,
The technique makes to contact close, global density increase, promotion magnetic permeability between structure, while promoting preparation work efficiency.
Detailed description of the invention
In order to facilitate the understanding of those skilled in the art, the present invention will be further described below with reference to the drawings.
Fig. 1 is overall structure of the present invention；
Fig. 2 is T shape magnetic platform structural schematic diagram of the present invention；
In figure: 1, T shape magnetic platform；2, upper magnetic platform；3, winding.
Specific embodiment
Technical solution of the present invention is clearly and completely described below in conjunction with embodiment, it is clear that described reality
Applying example is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field is general
Logical technical staff all other embodiment obtained without creative efforts belongs to what the present invention protected
Range.
As shown in Figs. 1-2, a kind of inductance, including T shape magnetic platform 1, upper magnetic platform 2 and winding 3, T shape magnetic platform 1 is by bottom plate and cylinder
Composition, middle position compression has a cylinder at the top of bottom plate, and winding 3 is socketed in cylindrical outer side, upper magnetic platform 2 be wrapped at the top of bottom plate and
Cylindrical outer side；
Wherein, T shape magnetic platform 1 and upper magnetic platform 2 are same magnetic material component.
A kind of inductance moulding process, includes the following steps:
S1, by stamping die to T shape magnetic platform 1 carry out pre-molding, press temperature be 10~30 DEG C, pressure be 1~
10T/cm2, using 10~30s of baking at 50~120 DEG C；
S2, by coil winding machine to coil winding is carried out, form winding 3, operating temperature is 150~250 DEG C when coiling；
S3, the cylinder of T shape magnetic platform 1 being placed in mold, inserts magnetic powder, magnetic powder is wrapped at the top of bottom plate and cylindrical outer side,
Magnetic platform 2 in formation, hot-forming, 1~10T/cm of pressure at being 80~200 DEG C in temperature2。
The working principle of the invention: T shape magnetic platform 1 is made of bottom plate and cylinder, and middle position compression has circle at the top of bottom plate
Column, winding 3 are socketed in cylindrical outer side, and upper magnetic platform 2 is wrapped at the top of bottom plate and is directly led using conducting wire with cylindrical outer side, the structure
Electricity, stable connection, product structure is simple, save the cost, and product thickness can be greatly reduced and meet the market demand；Pass through step: S1,
Pre-molding is carried out to T shape magnetic platform 1 by stamping die, press temperature is 10~30 DEG C, and pressure is 1~10T/cm2, using
10~30s is toasted at 50~120 DEG C；S2, by coil winding machine to coil winding is carried out, form winding 3, operating temperature is when coiling
150~250 DEG C；S3, the cylinder of T shape magnetic platform 1 is placed in mold, inserts magnetic powder, magnetic powder is wrapped at the top of bottom plate and outside cylinder
Side, magnetic platform 2 in formation, hot-forming, 1~10T/cm of pressure at being 80~200 DEG C in temperature2, the technique, make structure it is indirectly
Touching is close, and global density increases, and promotes magnetic permeability, while promoting preparation work efficiency.
Present invention disclosed above preferred embodiment is only intended to help to illustrate the present invention.There is no detailed for preferred embodiment
All details are described, are not limited the invention to the specific embodiments described.Obviously, according to the content of this specification,
It can make many modifications and variations.These embodiments are chosen and specifically described to this specification, is in order to better explain the present invention
Principle and practical application, so that skilled artisan be enable to better understand and utilize the present invention.The present invention is only
It is limited by claims and its full scope and equivalent.
Claims (3)
1. a kind of inductance, which is characterized in that including T shape magnetic platform (1), upper magnetic platform (2) and winding (3), the T shape magnetic platform (1) by
Bottom plate and cylinder composition, the bottom plate top middle position compression have cylinder, and the winding (3) is socketed in cylindrical outer side, institute
It states magnetic platform (2) and is wrapped in bottom plate top and cylindrical outer side.
2. a kind of inductance according to claim 1, which is characterized in that the T shape magnetic platform (1) and the upper magnetic platform (2) are equal
For same magnetic material component.
3. a kind of inductance moulding process, which comprises the steps of:
S1, pre-molding is carried out to T shape magnetic platform (1) by stamping die, press temperature is 10~30 DEG C, and pressure is 1~10T/
cm2, using 10~30s of baking at 50~120 DEG C；
S2, by coil winding machine to coil winding is carried out, formed winding (3), operating temperature is 150~250 DEG C when coiling；
S3, the cylinder of T shape magnetic platform (1) is placed in mold, inserts magnetic powder, magnetic powder is wrapped at the top of bottom plate and cylindrical outer side, shape
At upper magnetic platform (2), hot-forming, 1~10T/cm of pressure at being 80~200 DEG C in temperature2。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910144127.3A CN109741918A (en) | 2019-02-27 | 2019-02-27 | A kind of inductance and moulding process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910144127.3A CN109741918A (en) | 2019-02-27 | 2019-02-27 | A kind of inductance and moulding process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109741918A true CN109741918A (en) | 2019-05-10 |
Family
ID=66368510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910144127.3A Pending CN109741918A (en) | 2019-02-27 | 2019-02-27 | A kind of inductance and moulding process |
Country Status (1)
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| CN (1) | CN109741918A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8723629B1 (en) * | 2013-01-10 | 2014-05-13 | Cyntec Co., Ltd. | Magnetic device with high saturation current and low core loss |
| CN106252055A (en) * | 2016-08-04 | 2016-12-21 | 重庆金籁科技股份有限公司 | A kind of integrated inductance and preparation method thereof |
| CN107516571A (en) * | 2017-09-15 | 2017-12-26 | 珠海群创新材料技术有限公司 | A kind of inductor, the preparation method of inductor, the shaping mould of compacting inductor |
| CN109786066A (en) * | 2019-01-22 | 2019-05-21 | 苏州茂昌电子有限公司 | A kind of novel inductor and its forming method |
-
2019
- 2019-02-27 CN CN201910144127.3A patent/CN109741918A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8723629B1 (en) * | 2013-01-10 | 2014-05-13 | Cyntec Co., Ltd. | Magnetic device with high saturation current and low core loss |
| CN106252055A (en) * | 2016-08-04 | 2016-12-21 | 重庆金籁科技股份有限公司 | A kind of integrated inductance and preparation method thereof |
| CN107516571A (en) * | 2017-09-15 | 2017-12-26 | 珠海群创新材料技术有限公司 | A kind of inductor, the preparation method of inductor, the shaping mould of compacting inductor |
| CN109786066A (en) * | 2019-01-22 | 2019-05-21 | 苏州茂昌电子有限公司 | A kind of novel inductor and its forming method |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190510 |
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| WD01 | Invention patent application deemed withdrawn after publication |