CN109735845B - Micro-etching liquid capable of preventing pore ring from whitening - Google Patents
Micro-etching liquid capable of preventing pore ring from whitening Download PDFInfo
- Publication number
- CN109735845B CN109735845B CN201910134522.3A CN201910134522A CN109735845B CN 109735845 B CN109735845 B CN 109735845B CN 201910134522 A CN201910134522 A CN 201910134522A CN 109735845 B CN109735845 B CN 109735845B
- Authority
- CN
- China
- Prior art keywords
- copper
- hydrogen peroxide
- biting
- acid
- accelerant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- ing And Chemical Polishing (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Agricultural Chemicals And Associated Chemicals (AREA)
Abstract
The invention discloses a micro-etching solution capable of preventing a hole ring from whitening, which relates to the field of circuit board production and aims to solve the problems of copper lattice change and hole ring whitening during pretreatment micro-etching after hole ring electroplating in the prior art, and the technical key points of the micro-etching solution comprise the following components: 10-20g/L of hydrogen peroxide; 90-110g/L of sulfuric acid; 5-15g/L of copper biting inhibitor; 0.5-2g/L of copper biting accelerant; the invention has the advantages that the hydrogen peroxide stabilizer is 1.5-3g/L, the low-foam surfactant is 0.2-0.3g/L and the deionized water is 1L, by adding related functional additives, the invention has stable microetching rate, mild and controllable microetching process, inhibits decomposition of hydrogen peroxide, can uniformly and effectively coarsen the copper surface, is not easy to cause oxidation of the copper surface, effectively inhibits change of copper crystal lattices and whitening of hole circles, and simultaneously has simple and easy cleaning of residual plate surfaces and small pollution.
Description
Technical Field
The invention relates to the field of printed circuit board production, in particular to a microetching liquid capable of preventing a hole ring from whitening.
Background
In the production of PCB, the copper layer of the circuit board needs to be etched by using micro-etching solution, in the micro-etching process, the circuit board is usually processed by using the micro-etching solution, the existing micro-etching solution has a composite potassium salt system, a sodium persulfate and sulfuric acid system and the like, but the problems of rough and white hole circle, color difference and the like often occur in the etching process of the common micro-etching solution.
The prior application publication No. CN105734571A discloses a metal surface micro-etching solution, which is composed of the following raw materials in percentage by mass: 15-25% of dilute sulfuric acid with the mass fraction of 50%, 10-15% of hydrogen peroxide, 2-5% of stabilizer, 0.5-1% of surfactant, 0.2% of antibacterial agent and the balance of water.
However, in the process of etching the circuit board by hydrogen peroxide, the copper atomic structure deviates from the area of an ideal crystal structure, so that the copper crystal lattice is changed, and further, the problem of whitening of the hole ring is caused.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a micro-etching solution capable of preventing pore rings from whitening, and the functional additive is added to balance the processes of copper biting and copper inhibiting, so that the pore rings are rough and whitened.
In order to achieve the purpose, the invention provides the following technical scheme:
a microetching liquid capable of preventing pore circles from whitening comprises the following components:
by adopting the technical scheme, hydrogen peroxide can be used as a main etching agent to etch a copper layer, a hydrogen peroxide stabilizer maintains hydrogen peroxide to be stable and not cracked for a long time, so that stable etching process is ensured, sulfuric acid maintains the acid environment of microetching liquid, and a copper etching inhibitor and a copper etching accelerant act together to balance the processes of copper etching and copper inhibition, so that the etching rate of the hydrogen peroxide to the copper layer reaches a balance point, the etching process is mild and controlled, and the effect of smooth copper etching is achieved.
According to a further development of the invention, the copper-occlusion inhibitor is an organic acid.
By adopting the technical scheme, in the reaction process of hydrogen peroxide and copper, generated copper ions can further catalyze the decomposition of the hydrogen peroxide, and the added organic acid can form a coordination bond with the copper ions generated by the reaction through a shared electron pair, so that the organic acid and the copper ions form a complex, the interference of the copper ions on the microetching process is reduced, and meanwhile, the copper dissolving capacity of the bath solution can be improved due to the fact that the copper ions and the organic acid form the complex.
The invention further provides that the copper-biting inhibitor is one or more of citric acid, methanesulfonic acid and tartaric acid.
By adopting the technical scheme, three carboxyl groups in the citric acid can form a coordination bond with one copper ion to further form three-coordinate copper citrate, and the methanesulfonic acid can share an electron pair with the copper ion and water molecule to form a six-coordinate complex-Cu (H) after being dissolved in water2O)4(CH3SO3)2Tartaric acid is complexed with copper ions to form C4H4CuO6·3H2And O, thereby reducing the interference of copper ions on the microetching process.
The invention further provides that the copper biting accelerant is one or more of cyclopamine, n-butyl alcohol and n-octylamine.
By adopting the technical scheme, the cyclopropanamine, the n-butanol and the n-octylamine are asymmetric organic compounds which can form non-covalent bonds with hydrogen peroxide to generate non-covalent catalysis, so that the activity of hydrogen peroxide is improved, the activation energy of the reaction is reduced in the reaction process of the hydrogen peroxide and the copper, the reaction rate of the reaction can be accelerated, and the purpose of promoting the reaction is achieved.
The invention is further configured that the hydrogen peroxide stabilizer is one or more of methanesulfonic acid, phenolsulfonic acid and p-toluenesulfonic acid.
By adopting the technical scheme, in the process of etching the copper layer by hydrogen peroxide, the hydrogen peroxide can be decomposed, and the hydrogen peroxide ions (HO) can be stabilized by the methanesulfonic acid, the phenolsulfonic acid and the p-toluenesulfonic acid2-]Inhibition of hydrogen peroxide radical [ HO ]2·]The hydrogen peroxide is formed to maintain a stable state under weak acidity or neutral conditions.
The invention is further configured that the low-foaming surfactant is fatty acid methyl ester polyoxyethylene ether or isooctyl alcohol.
By adopting the technical scheme, the fatty acid methyl ester polyoxyethylene ether and the isooctanol are used as a nonionic surfactant, so that the biting corrosion of high-density copper crystals at the ring-shaped part can be promoted, and meanwhile, the nonionic surfactant is high in stability and small in foam, the generation of air between microetching liquid and a copper layer is avoided, and the biting corrosion of hydrogen peroxide is facilitated.
The invention also aims to provide a microetching liquid proportioning process capable of preventing pore rings from whitening, which comprises the following steps:
(1) 500-800ml of deionized water is added into the micro-etching tank;
(2) adding a copper biting accelerant into the micro-etching tank in the step (1) and stirring for 3-7 min;
(3) adding 50% sulfuric acid into the micro-etching tank in the step (2);
(4) adding a copper biting inhibitor into the micro-etching tank in the step (3) and stirring for 4-8 min;
(5) adding hydrogen peroxide stabilizer and low-foaming surfactant into the micro-etching groove in the step (4);
(6) finally, hydrogen peroxide is added into the micro-etching tank, and 500ml of water is supplemented, and then the mixture is stirred for 5-13 min.
By adopting the technical scheme, the prepared sulfuric acid hydrogen peroxide series microetching agent can maintain the stability and non-cracking of hydrogen peroxide for a long time, has no oxidation points and fingerprint marks on the copper surface after microetching, has clean and bright copper surface, is suitable for pretreatment microetching of various processes of PCB, and simultaneously balances the processes of biting and inhibiting copper by adding functional additives, thereby achieving the effect of smoothly corroding copper and playing a polishing and brightening role on the copper surface, particularly around a hole ring.
In conclusion, the invention has the following beneficial effects:
1. according to the invention, the copper biting inhibitor and the copper biting accelerant are added into the microetching liquid, so that the microetching liquid and the microetching liquid act together to balance the processes of copper biting and copper inhibiting, the biting rate of hydrogen peroxide on a copper layer reaches a balance point, and the biting process is carried out mildly and controllably, so that the effect of smoothly corroding copper is achieved;
2. the invention adds hydrogen peroxide stabilizer, wherein strong negative atom in the stabilizer and free radical (HO) decomposed by hydrogen peroxide2]Formation of hydrogen bond decreases [ HO2]The decomposition of hydrogen peroxide is reduced by the activity of the groups;
3. the invention adds the low-foam surfactant to promote the biting corrosion of high-density copper crystals at the ring hole part, has higher stability and small foam, avoids the generation of air between micro-etching liquid and a copper layer, and is beneficial to the biting corrosion of hydrogen peroxide.
Detailed Description
The present invention will be described in further detail with reference to examples.
The first embodiment is as follows:
a microetching liquid capable of preventing pore rings from whitening is disclosed, wherein the microetching liquid comprises the following components in percentage by mass:
wherein the copper-biting inhibitor is citric acid;
the copper biting accelerant is ethylamine;
the hydrogen peroxide stabilizer is methanesulfonic acid;
the low-foaming surfactant is fatty acid methyl ester polyoxyethylene ether.
A microetching liquid capable of preventing pore rings from whitening comprises the following steps:
(1) adding 500 deionized water into the microetching groove;
(2) adding a copper biting accelerant into the micro-etching tank in the step (1) and stirring for 7 min;
(3) adding 50% sulfuric acid into the micro-etching tank in the step (2);
(4) adding a copper biting inhibitor into the micro-etching tank in the step (3) and stirring for 8 min;
(5) adding hydrogen peroxide stabilizer and low-foaming surfactant into the micro-etching groove in the step (4);
(6) finally, hydrogen peroxide is added into the micro-etching tank, 500ml of water is added, and then the mixture is stirred for 5 min.
Example two:
a microetching liquid capable of preventing pore rings from whitening is disclosed, wherein the microetching liquid comprises the following components in percentage by mass:
wherein the copper-biting inhibitor is methanesulfonic acid;
the copper-biting accelerant is n-butyl alcohol;
the hydrogen peroxide stabilizer is phenol sulfonic acid;
the low-foaming surfactant is fatty acid methyl ester polyoxyethylene ether.
A microetching liquid capable of preventing pore rings from whitening comprises the following steps:
(1) 600ml of deionized water is added into the microetching groove;
(2) adding a copper biting accelerant into the micro-etching tank in the step (1) and stirring for 6 min;
(3) adding 50% sulfuric acid into the micro-etching tank in the step (2);
(4) adding a copper biting inhibitor into the micro-etching tank in the step (3) and stirring for 7 min;
(5) adding hydrogen peroxide stabilizer and low-foaming surfactant into the micro-etching groove in the step (4);
(6) finally, adding hydrogen peroxide into the microetching tank, supplementing 400ml of water, and then stirring for 7 min.
Example three:
a microetching liquid capable of preventing pore rings from whitening comprises the following components in parts by weight:
wherein the mass concentration of each component of the microetching liquid is as follows:
wherein the copper-biting inhibitor is tartaric acid;
the copper biting accelerant is n-octylamine;
the hydrogen peroxide stabilizer is p-toluenesulfonic acid;
the low foam surfactant is isooctanol.
A microetching liquid capable of preventing pore rings from whitening comprises the following steps:
(1) 700ml of deionized water is added into the microetching groove;
(2) adding a copper biting accelerant into the micro-etching tank in the step (1) and stirring for 5 min;
(3) adding 50% sulfuric acid into the micro-etching tank in the step (2);
(4) adding a copper biting inhibitor into the micro-etching tank in the step (3) and stirring for 5 min;
(5) adding hydrogen peroxide stabilizer and low-foaming surfactant into the micro-etching groove in the step (4);
(6) finally, adding hydrogen peroxide into the microetching tank, supplementing 300ml of water, and stirring for 10 min.
Example four:
a microetching liquid capable of preventing pore rings from whitening is disclosed, wherein the microetching liquid comprises the following components in percentage by mass:
wherein the copper-biting inhibitor is citric acid and methanesulfonic acid;
the copper biting accelerant is cycloethylamine and n-octylamine;
the hydrogen peroxide stabilizer is methanesulfonic acid and p-toluenesulfonic acid, and the mixing ratio by weight is 1: 1;
the low-foaming surfactant is fatty acid methyl ester polyoxyethylene ether.
A microetching liquid capable of preventing pore rings from whitening comprises the following steps:
(1) adding 800ml of deionized water into the microetching groove;
(2) adding a copper biting accelerant into the micro-etching tank in the step (1) and stirring for 3 min;
(3) adding 50% sulfuric acid into the micro-etching tank in the step (2);
(4) adding a copper biting inhibitor into the micro-etching tank in the step (3) and stirring for 4 min;
(5) adding hydrogen peroxide stabilizer and low-foaming surfactant into the micro-etching groove in the step (4);
(6) finally, hydrogen peroxide is added into the micro-etching tank, 200ml of water is added, and then the mixture is stirred for 13 min.
Example five:
a microetching liquid capable of preventing pore rings from whitening is disclosed, wherein the microetching liquid comprises the following components in percentage by mass:
wherein the copper biting inhibitor is citric acid, methanesulfonic acid and tartaric acid, and the mixing ratio by weight is 1: 1: 1;
the copper biting accelerant is cycloethylamine, n-butyl alcohol and n-octylamine, and the mixing ratio by weight parts is 1: 1: 1;
the hydrogen peroxide stabilizer is methanesulfonic acid, phenolsulfonic acid and p-toluenesulfonic acid, and is prepared by mixing the following components in a weight ratio of 1: 1: 1;
the low foam surfactant is isooctanol.
A microetching liquid capable of preventing pore rings from whitening comprises the following steps:
(1) 600ml of deionized water is added into the microetching groove;
(2) adding a copper biting accelerant into the micro-etching tank in the step (1) and stirring for 4 min;
(3) adding 50% sulfuric acid into the micro-etching tank in the step (2);
(4) adding a copper biting inhibitor into the micro-etching tank in the step (3) and stirring for 6 min;
(5) adding hydrogen peroxide stabilizer and low-foaming surfactant into the micro-etching groove in the step (4);
(6) finally, adding hydrogen peroxide into the microetching tank, supplementing 400ml of water, and stirring for 10 min.
And (3) measuring the micro-etching rate:
1) taking a double-sided copper-clad plate, carrying out oil removal and water washing procedures, placing the double-sided copper-clad plate in an oven, drying the double-sided copper-clad plate for 15 minutes at 105 +/-5 ℃, and cooling the double-sided copper-clad plate to room temperature in a dryer;
2) balance weighing G1 (unit: gram, please be accurate to 2 to 3 bits after decimal point);
3) passing the copper-clad plate through a microetching cylinder according to set time or transmission speed, and recording processing time T (min);
4) washing with water for the second time, drying at 105 + -5 deg.C for 15 min, and cooling to room temperature in a dryer;
5) balance weighing G2 (unit: gram, please be accurate to 2 to 3 bits after decimal point);
6) the area S of the test panel (sum of the areas on both sides, unit: cm2)
And (3) calculating: microetching rate (um/min) { (G1-G2)/(8.96 × S × T) } × 10000.
Comparative example:
the invention takes commercially available microetching liquid, sodium persulfate microetching liquid and potassium hydrogen persulfate composite salt microetching liquid as comparative examples, and the microetching liquid in the first to fifth embodiments of the invention respectively bite circuit boards with the same specification under the same using and operating conditions.
And (3) performance comparison:
the microetching solution disclosed by the invention has the advantages that the copper biting process is balanced by adding the copper biting inhibitor and the copper biting accelerant, the biting process is mild and controllable, and the pore ring is effectively inhibited from whitening; meanwhile, the method has the advantages of high stability, convenient cleaning, low consumption, easy wastewater treatment, environmental friendliness and low cost.
The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications of the present embodiment without inventive contribution as needed after reading the present specification, but all of them are protected by patent law within the scope of the claims of the present invention.
Claims (7)
1. A microetching liquid capable of preventing pore rings from whitening is characterized by comprising the following components:
10-20g/L of hydrogen peroxide
Sulfuric acid 90-110g/L
Copper biting inhibitor 5-15g/L
0.5-2g/L of copper biting accelerant
1.5-3g/L of hydrogen peroxide stabilizer
Low foaming surfactant 0.2-0.3g/L
1L of deionized water;
the copper biting accelerant is one or more of ethylamine, n-butyl alcohol and n-octylamine, and the hydrogen peroxide stabilizer is one or more of methanesulfonic acid, phenolsulfonic acid and p-toluenesulfonic acid; the copper biting inhibitor is organic acid.
2. The microetching solution capable of preventing pore ring from whitening as claimed in claim 1, wherein the microetching solution comprises the following components in mass concentration: 90g/L of sulfuric acid, 10g/L of hydrogen peroxide, 5g/L of a copper biting inhibitor, 0.5/L of a copper biting accelerant, 1.5/L of a hydrogen peroxide stabilizer, 0.2g/L of a low-foaming surfactant and 1L of deionized water in the balance, wherein the copper biting inhibitor is citric acid, the copper biting accelerant is ethylamine, the hydrogen peroxide stabilizer is methanesulfonic acid, and the low-foaming surfactant is fatty acid methyl ester polyoxyethylene ether.
3. The microetching solution capable of preventing pore ring from whitening as claimed in claim 1, wherein the microetching solution comprises the following components in mass concentration: 95g/L of sulfuric acid, 12g/L of hydrogen peroxide, 7g/L of copper biting inhibitor, 1g/L of copper biting accelerant, 1.8g/L of hydrogen peroxide stabilizer, 0.23g/L of low-foaming surfactant and 1L of deionized water in balance; the copper biting inhibitor is methanesulfonic acid, the copper biting accelerant is n-butanol, the hydrogen peroxide stabilizer is phenolsulfonic acid, and the low foaming surfactant is fatty acid methyl ester polyoxyethylene ether.
4. The microetching solution capable of preventing pore ring from whitening as claimed in claim 1, wherein the microetching solution comprises the following components in mass concentration: 100g/L of sulfuric acid, 15g/L of hydrogen peroxide, 10g/L of copper biting inhibitor, 1.5g/L of copper biting accelerant, 2g/L of hydrogen peroxide stabilizer, 0.25g/L of low-foaming surfactant and 1L of deionized water in balance; the copper biting inhibitor is tartaric acid, the copper biting accelerant is n-octylamine, the hydrogen peroxide stabilizer is p-toluenesulfonic acid, and the low-foaming surfactant is isooctanol.
5. The microetching solution capable of preventing pore ring from whitening as claimed in claim 1, wherein the mass concentration of each component of the microetching solution is as follows: 110g/L of sulfuric acid, 20g/L of hydrogen peroxide, 15g/L of copper biting inhibitor, 2g/L of copper biting accelerant, 3g/L of hydrogen peroxide stabilizer, 0.3g/L of low-foaming surfactant and 1L of deionized water in balance; the copper biting inhibitor is citric acid and methanesulfonic acid, the copper biting accelerant is ethylamine and n-octylamine, and the hydrogen peroxide stabilizer is methanesulfonic acid and p-toluenesulfonic acid, and the mixing ratio is 1:1 by weight; the low-foaming surfactant is fatty acid methyl ester polyoxyethylene ether.
6. The microetching solution capable of preventing pore ring from whitening as claimed in claim 1, wherein the mass concentration of each component of the microetching solution is as follows: 100g/L of sulfuric acid, 20g/L of hydrogen peroxide, 15g/L of copper biting inhibitor, 1.5g/L of copper biting accelerant, 3g/L of hydrogen peroxide stabilizer, 0.3g/L of low-foaming surfactant and 1L of deionized water in balance; the copper biting inhibitor is citric acid, methanesulfonic acid and tartaric acid, and the mixing ratio by weight is 1: 1: 1; the copper biting accelerant is cycloethylamine, n-butyl alcohol and n-octylamine, and the mixing ratio by weight parts is 1: 1: 1; the hydrogen peroxide stabilizer is methanesulfonic acid, phenolsulfonic acid and p-toluenesulfonic acid, and is prepared by mixing the following components in a weight ratio of 1: 1: 1; the low foam surfactant is isooctanol.
7. A microetching solution for preventing pore ring from whitening as claimed in claim 1, wherein the proportioning process comprises the following steps:
(1) 500-800ml of deionized water is added into the micro-etching tank;
(2) adding a copper biting accelerant into the micro-etching tank in the step (1) and stirring for 3-7 min;
(3) adding 50% sulfuric acid into the micro-etching tank in the step (2);
(4) adding a copper biting inhibitor into the micro-etching tank in the step (3) and stirring for 4-8 min;
(5) adding hydrogen peroxide stabilizer and low-foaming surfactant into the micro-etching groove in the step (4);
(6) finally, hydrogen peroxide is added into the micro-etching tank, and 500ml of water is supplemented, and then the mixture is stirred for 5-13 min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910134522.3A CN109735845B (en) | 2019-02-23 | 2019-02-23 | Micro-etching liquid capable of preventing pore ring from whitening |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910134522.3A CN109735845B (en) | 2019-02-23 | 2019-02-23 | Micro-etching liquid capable of preventing pore ring from whitening |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109735845A CN109735845A (en) | 2019-05-10 |
| CN109735845B true CN109735845B (en) | 2020-11-06 |
Family
ID=66368117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910134522.3A Active CN109735845B (en) | 2019-02-23 | 2019-02-23 | Micro-etching liquid capable of preventing pore ring from whitening |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109735845B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110373672B (en) * | 2019-08-01 | 2021-09-03 | 深圳市航盛电路科技股份有限公司 | Treatment liquid for attaching copper to surface of target-flying clamp |
| CN112391627B (en) * | 2020-11-16 | 2023-04-14 | 珠海联鼎化工设备有限公司 | Ammonia-nitrogen-free environment-friendly microetching pretreatment liquid and treatment method |
| CN113210239A (en) * | 2021-04-23 | 2021-08-06 | 上海明勤金属制品有限公司 | Processing technology of metal display rack |
| CN114574863B (en) * | 2022-03-10 | 2023-12-01 | 上海富柏化工有限公司 | Low-loss black hole microetching solution and preparation method and application thereof |
| CN115233205B (en) * | 2022-06-30 | 2024-11-08 | 深圳市众望丽华微电子材料有限公司 | A circuit board color improver and preparation method thereof |
| CN116334625A (en) * | 2023-03-28 | 2023-06-27 | 广东省科学院化工研究所 | A kind of copper surface micro-etching liquid and its preparation method and application |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003138389A (en) * | 2001-10-30 | 2003-05-14 | Asahi Denka Kogyo Kk | Etching agent composition and pattern forming method |
| CN107022762A (en) * | 2017-05-08 | 2017-08-08 | 广东光华科技股份有限公司 | The application of three amido fortified phenols or three amido substituted benzene thiophenols and tiny-etching treatment fluid |
| CN108425114A (en) * | 2018-03-15 | 2018-08-21 | 昆山长优电子材料有限公司 | Low damage copper nanometer is roughened agent |
| CN108893741A (en) * | 2018-06-12 | 2018-11-27 | 江苏理工学院 | A kind of floride-free copper-molybdenum etching solution applied to thin film transistor line |
| CN109097776A (en) * | 2018-07-17 | 2018-12-28 | 东莞市广华化工有限公司 | A kind of microetch subtracts copper annex solution and technique |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7232478B2 (en) * | 2003-07-14 | 2007-06-19 | Enthone Inc. | Adhesion promotion in printed circuit boards |
-
2019
- 2019-02-23 CN CN201910134522.3A patent/CN109735845B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003138389A (en) * | 2001-10-30 | 2003-05-14 | Asahi Denka Kogyo Kk | Etching agent composition and pattern forming method |
| CN107022762A (en) * | 2017-05-08 | 2017-08-08 | 广东光华科技股份有限公司 | The application of three amido fortified phenols or three amido substituted benzene thiophenols and tiny-etching treatment fluid |
| CN108425114A (en) * | 2018-03-15 | 2018-08-21 | 昆山长优电子材料有限公司 | Low damage copper nanometer is roughened agent |
| CN108893741A (en) * | 2018-06-12 | 2018-11-27 | 江苏理工学院 | A kind of floride-free copper-molybdenum etching solution applied to thin film transistor line |
| CN109097776A (en) * | 2018-07-17 | 2018-12-28 | 东莞市广华化工有限公司 | A kind of microetch subtracts copper annex solution and technique |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109735845A (en) | 2019-05-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109735845B (en) | Micro-etching liquid capable of preventing pore ring from whitening | |
| CN109652804B (en) | PCB copper-reduction etching solution and manufacturing process | |
| CN110923713B (en) | Etching liquid for copper-molybdenum and alloy films and preparation method thereof | |
| CN101760743A (en) | Tin stripping liquid | |
| CN109913926B (en) | Aluminum alloy anodic oxide film sealant and sealing method thereof | |
| CN112064026A (en) | Novel copper surface roughness corrosion stabilizer and preparation method thereof | |
| CN111206249A (en) | Chloride ion-resistant copper surface microetching agent and preparation method thereof | |
| US4462861A (en) | Etchant with increased etch rate | |
| JP6078394B2 (en) | Etching solution composition and etching method | |
| CN102061471A (en) | Copper plating process | |
| KR100919596B1 (en) | Etching additive and etching composition comprising the same | |
| CN111876780A (en) | Ammonium persulfate system etching solution for etching TFT copper-molybdenum layer | |
| CN109594079B (en) | Molybdenum-aluminum common etching solution and etching method | |
| CN112391627B (en) | Ammonia-nitrogen-free environment-friendly microetching pretreatment liquid and treatment method | |
| CN108823555B (en) | Reduced chemical gold plating solution and preparation method, use method and application thereof | |
| CN115216771B (en) | Printed circuit board copper surface roughening liquid and application thereof | |
| CN114561633B (en) | Tinning liquid, preparation method thereof and tinning method for printed circuit board | |
| SU773063A1 (en) | Solution for removing tin-lead plating from copper base | |
| CN113860914B (en) | Soaking liquid for removing white cobblestone yellow spots, preparation method thereof and method for removing white cobblestone yellow spots | |
| CN105220156B (en) | A kind of etching agent for printed circuit board (PCB) and preparation method thereof | |
| CN113668024A (en) | Electroplating dehydrating agent and preparation method thereof | |
| CN111041487A (en) | Environment-friendly PCB electroplating rack copper stripping liquid and copper stripping method using same | |
| CN111472027A (en) | Electrotinning additive and preparation method and use method thereof | |
| EP1555335B1 (en) | Additive for plating bath | |
| CN109811343A (en) | Environmentally friendly etching solution and engraving method without ammonia nitrogen |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |