CN109732900B - 3D printing device for integrally manufacturing stretchable electronic product and working method - Google Patents
3D printing device for integrally manufacturing stretchable electronic product and working method Download PDFInfo
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- CN109732900B CN109732900B CN201910205002.7A CN201910205002A CN109732900B CN 109732900 B CN109732900 B CN 109732900B CN 201910205002 A CN201910205002 A CN 201910205002A CN 109732900 B CN109732900 B CN 109732900B
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Abstract
The application provides a 3D printing device for integrally manufacturing a stretchable electronic product and a working method thereof, wherein the device comprises a base and a control module, a three-dimensional workbench, a placing platform, a swinging platform and a printing bed are arranged on the base, the printing bed is arranged on the swinging platform, and the printing bed with vacuum adsorption and electric heating functions is driven to swing and rotate; the three-dimensional workbench comprises at least four devicesZToward the working table, the firstZA manipulator for grabbing and placing electronic components is arranged on the workbench, and the rest parts are arranged on the workbenchZA printing nozzle is arranged on the workbench, and the printing actions of the flexible substrate, the protective layer, the connecting circuit, the embedded electronic element and the packaging layer of the stretchable electronic product are executed by each printing nozzle according to a set sequence through controlling the movements of the three-dimensional workbench, the swinging table, the manipulator and the feeding module, so that integrated manufacturing is realized.
Description
Technical Field
The disclosure belongs to the technical field of additive manufacturing and flexible electronic products, and relates to a 3D printing device for integrally manufacturing a stretchable electronic product and a working method.
Background
The statements in this section merely provide background information related to the present disclosure and may not necessarily constitute prior art.
Unlike existing electronic products, stretchable electronic products are new electronic products that have appeared in recent years, in which flexible, in particular deformable, elastomers are used as a base (base or substrate), flexible electronic components (or rigid electronic components) are fixed or embedded in the flexible base, functional electronic components are connected by stretchable connection circuits, and finally the electronic components and connection circuits on the base are packaged. The stretchable electronic product can still work well and maintain its function under large deformations such as bending, torsion, stretching and compression. The stretchable electronic product has remarkable advantages of flexibility, stretchability and conformality, and has very wide application prospects in various fields of wearable electronic products, soft robots, electronic skins, implanted electronic devices, novel flexible human-computer interfaces, medical appliances and the like.
However, as known by the inventors, the existing processing technology is difficult to realize the manufacture of stretchable electronic products with complex structures, especially cannot realize the integrated manufacture of substrates, electronic components, connection circuits, packages and the like, and cannot effectively solve the problem that the electronic components and the connection circuits are damaged due to over-stretching, which limits the performance of the stretchable electronic products, shortens the service life and cannot be widely applied in industry.
Disclosure of Invention
In order to solve the above problems, the present disclosure proposes a 3D printing device and a working method for integrally manufacturing a stretchable electronic product, which can realize a flexible substrate (polydimethylsiloxane,PDMS) Printing, protective layer (toPDMSFunctional material of the main body), embedding of electronic components, connection circuits (circuits such as resistors, capacitors and antennas), and structure packaging.
According to some embodiments, the present disclosure employs the following technical solutions:
the 3D printing device for integrally manufacturing the stretchable electronic product comprises a base and a control module, wherein a three-dimensional workbench, a placing platform, a swinging table and a printing bed are arranged on the base, the printing bed is arranged on the swinging table, and the printing bed with vacuum adsorption and electric heating functions is driven to swing and rotate;
the three-dimensional workbench comprises at least four devicesZToward the working table, the firstZA manipulator for grabbing and placing the electronic components is arranged on the workbench, and the placing platform is used for bearing the electronic components to be grabbed;
the rest areZA printing spray head is arranged on the workbench, the printing spray head comprises a feed inlet and conductive nozzles arranged at the lowest end of the spray head, each conductive nozzle is connected with a high-voltage pulse power supply, the feed inlet is respectively connected with a feed module, and the feed modules are respectively used for providing a flexible substrate, conductive ink and functional materials;
the control module controls the movements of the three-dimensional workbench, the swing platform, the manipulator and the feeding module to enable each printing nozzle to execute printing actions of the flexible substrate, the protective layer, the connecting circuit, the embedded electronic element and the packaging layer of the stretchable electronic product according to a set sequence, so that integrated manufacturing is realized.
In the scheme, the flexible substrate, the conductive ink and the functional material are respectively conveyed to different conductive nozzles by using the feeding module, and the spray deposition 3 is driven by using the electric field comprehensively by using the high-voltage pulse power supplyDThe printing and material extrusion forming process can respectively manufacture a stretchable substrate (substrate, base material), a protective layer (structural layer), a stretchable connection circuit or a micro circuit, and can place electronic components needing to be embedded on the position set by the stretchable substrate by combining a manipulator, and then package by using different materials, so that integrated printing is realized.
Meanwhile, the heating function of the printing bed can be combined, the thermal curing of each material is realized, the printing time is saved, and the printing effect is optimized.
For convenience of description, the rest of eachZAnd printing spray heads arranged on the workbench are respectively named as a first printing spray head, a second printing spray head and a third printing spray head.
As a further limitation, the first printing nozzle comprises a feed inlet, a conductive nozzle arranged at the lowest end of the nozzle, and an air inlet hole at the top of the nozzle, wherein the feed inlet is positioned on the side wall of the nozzle and is used for receiving the feed of the feed module, the air inlet hole is connected with a pressure pipeline and is used for providing stable and adjustable back pressure to drive the liquid flexible substrate material of the printing material in the printing process, and the conductive nozzle is a metal nozzle or a conductive nozzle coated with the conductive material.
By printing the flexible substrate material, the substrate and the encapsulation layer can be configured.
As a further limitation, the printing material of the second printing nozzle is conductive ink, the nozzle comprises a feed inlet, a conductive nozzle arranged at the lowest end of the nozzle, and an air inlet hole at the top of the nozzle, the air inlet hole is connected with a pressure pipeline, stable and adjustable back pressure is provided to drive the conductive ink in the printing process, and the conductive nozzle is a metal nozzle or a conductive nozzle coated with the conductive material.
The second print head prints conductive ink is a print and simple electronic component for manufacturing a connection circuit.
In the above scheme, the conductive ink comprises conductive silver paste, nano silver conductive ink, nano copper conductive ink, carbon nano tube conductive ink, graphene, liquid metal or conductive silver paste and the like.
As a further limitation, the third printing nozzle comprises a feed inlet, a conductive nozzle arranged at the lowest end of the nozzle, and an air inlet hole at the top of the nozzle, wherein the feed inlet is positioned on the side wall of the nozzle, the air inlet hole is connected with a pressure pipeline, stable and adjustable back pressure is provided in the printing process to drive the printing functional material, and the conductive nozzle is a metal nozzle or a conductive nozzle coated with the conductive material.
The third print head is used for printing the protective layer and the structural layer, and the functional materials comprise: to be used forPDMSAs a main body, reinforcing and modifying materials such as silicon carbide and silicon dioxide are added to provide physical properties such as thermal conductivity and hardness of the functional material.
As a further limitation, the high voltage pulse power supply is capable of outputting a dc high voltage; outputting alternating-current high voltage; the output pulse is high voltage and can set bias voltage, and the set bias voltage range is 0-2KVContinuously adjustable, direct current high voltage 0-5KVOutputting pulse DC voltage 0- + -4KVContinuously adjustable, output pulse frequency 0HZ-3000HZContinuously adjustable, alternating high voltage 0- + -4KV。
As a further limitation, the heating temperature of the printing bed is 0-160 ℃, the flatness of the printing bed is high, the heating device is an electric heating rod or an electric heating sheet, and the electric heating device realizes the alignmentPDMSRapid curing of materials and functional materials, and curing of conductive inks.
As a further limitation, the swing table is a tiltable rotary table capable of windingXTilting within + -90 degrees in the axial direction can be realizedZThe axial direction achieves a 360 degree range of swivel.
As a further limitation, theXHaving a drive mechanism for the table, said drive mechanismXThe working stroke of the workbench is 0-1000 mm, the repeated positioning precision is not lower than +/-5 microns, the absolute positioning precision is not lower than +/-8 microns, and the maximum speed is 700mm/sMaximum acceleration 500m/s 2 。
As a further limitation, theYHaving a drive mechanism for the table, said drive mechanismYThe working stroke of the workbench is 0-1000 mm, the repeated positioning precision is not lower than +/-5 microns, the absolute positioning precision is not lower than +/-8 microns, and the maximum speed is 700mm/sMaximum acceleration 500m/s 2 。
Through the arrangement of the precise movement of the workbench in each direction, the accuracy of the movement can be ensured.
The working method based on the device comprises the following steps:
(1) Printing a flexible substrate material by using a first printing nozzle, and completing the manufacture of the substrate and/or the flexible substrate according to a designed model;
(2) Printing functional materials by using a second printing nozzle, and finishing printing the structural layer according to the designed model;
(3) Taking down the electronic components to be embedded from the placement platform by using a mechanical arm, and sequentially placing the electronic components to be embedded into the grooves of the structural layer;
(4) Printing conductive ink materials by using a second printing nozzle to finish printing of a connecting circuit and manufacturing of a simple electronic element;
(5) Conducting treatment of the connecting circuit, namely taking down the printing bed, the formed substrate and protective layer, the embedded electronic element, the printed connecting circuit and the like from the printer, placing the printing bed, the formed substrate and protective layer, the embedded electronic element, the printed connecting circuit and the like into a heating furnace, and sintering the printing bed and the printed connecting circuit at low temperature;
(6) Reinstalling the printing bed and the formed structure, embedded electronic element, printed connection circuit and the like on the printing bed on the printer, printing functional materials by utilizing a third printing nozzle, and completing printing of the protective layer according to model data, so that the electronic element and the connection circuit are completely wrapped by the protective layer;
(7) Printing flexible substrate materials by using a first printing nozzle, and completing the final packaging and structure manufacturing according to the model data;
(8) And heating the manufactured stretchable electronic product to fully cure the flexible substrate.
As a further limitation, the heating temperature of the print bed ranges from 80 to 100 degrees in the steps (1), (2), (6) and (7).
As a further limitation, the heating temperature of the print bed of step (4) ranges from 90 to 110 degrees.
As a further limitation, the steps (1), (2) and (6) use electric field driven spray deposition 3DPrinting and material extrusion processes perform the printing of structures.
As a further limitation, in the step (4), micro-nano 3 is deposited using electric field driven sprayDThe printing process prints.
By way of further limitation, the flexible substrate material is printed in step (7) using a material extrusion process.
In the scheme, two printing modes are set, wherein the first mode adopts micro extrusion deposition 3DPrinting forming (extrusion forming) is used for printing the feature structure with low macroscopic structure and precision requirements, and the mode has high printing efficiency; the second mode employs electric field driven spray deposition 3DThe printing technology (spray forming) is used for printing micro-nano characteristic structures, and is mainly used for manufacturing stretchable connection circuits and micro-circuits. The two printing modes can simultaneously give consideration to printing efficiency and printing precision, and meet the requirements of macro/micro cross-scale manufacturing.
Compared with the prior art, the beneficial effects of the present disclosure are:
(1) By matching the precise control and the action sequence among the components, the integrated manufacture of the stretchable/flexible substrate, the protective layer, the connecting circuit, the embedded electronic element and the packaging layer can be realized.
(2) Combined with electric field driven jet deposition 3DPrinting and material extrusion forming processes, and simultaneously printing precision and printing efficiency are considered, macro/micro cross-scale manufacturing is realized, and the requirements of manufacturing large-size stretchable electronic products are met.
(3) Using five-axis tables (three-dimensional tables and pendulum tables) in combination with electric field jet deposition 3DAnd the printing process realizes the high-precision manufacture of the complex three-dimensional stretchable structure. The shape and structure are almost unlimited.
(4) Deposition 3 using electric field driven jettingDPrinting, realizing micro-scale connection circuit printing, expanding the variety of conductive ink and improving the performance of manufacturing stretchable electronic products.
(5) By introducing the structural layer and the functional material, the performance, the service life and the reliability of the stretchable electronic product are improved (the embedded connecting circuit, the electronic components and the like are effectively protected).
(6) The manufacturing process is simple, the equipment cost is low, the production efficiency is high, the requirement of industrial-grade batch manufacturing can be met, and some stretchable electronic products which cannot be manufactured in the prior art can be manufactured.
(7) In the printing process, a bonding process is not needed, so that the interface problem is avoided, the performance of a product is improved, the organic integration of a flexible electronic device and a hard rigid electronic component can be realized by using one composite substrate (base plate), the problem and limitation caused by a plurality of base plates and bonding are avoided, in addition, the manufacturing process can be effectively simplified, the manufacturing time is shortened, and the manufacturing cost is reduced.
(8) The product produced by the present disclosure can be applied to wearable electronic products, soft robots, electronic skins, implanted electronic devices, novel flexible human-machine interfaces, 3DThe method has good industrial application prospect in the fields of structural electronics and the like.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application.
FIG. 1 is a schematic diagram of a 3D printing device for integrated manufacturing of stretchable electronics of the present disclosure;
FIG. 2 [ ]a）-（c) Is a schematic diagram of an integrated manufacturing method of the stretchable electronic product based on the device.
1 base, 2XThe printing device comprises a workbench, a 3 swing table, a 4 printing bed, a 5 printing platform, a 6 first spray head, a 601 conductive nozzle, a 7 second spray head, a 701 conductive nozzle, a 8 third spray head, a 801 conductive nozzle, a 9 manipulator and 10ZTo the working tableI、11ZTo the working tableII、12ZTo the working tableIII、13ZTo the working tableIV14 moving support, 15YWorkbench, 16 fixed support and 17 high-voltage pulse power supplyIHigh-voltage 18 pulse power supplyII19 high-voltage pulse power supplyIIIA 20 substrate (substrate and packaging structure) material feeding module, a 21 conductive ink material feeding module, a 22 functional material feeding module, a 23 placement embedded electronic component working platform, a 24 pressure pipeline, a 25 vacuum pipeline, a 26 control module, a 27 substrate (substrate), a 28 structural layer, an electronic component groove reserved for 2801, a groove of 2802 connecting circuits, a 2803 reserved embedded electronic component groove, 29 embedded electronic components, a 30 connecting circuit, a 31 protection layer and a 32 packaging layer.
The specific embodiment is as follows:
the disclosure is further described below with reference to the drawings and examples.
It should be noted that the following detailed description is illustrative and is intended to provide further explanation of the application. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the present application. As used herein, the singular is also intended to include the plural unless the context clearly indicates otherwise, and furthermore, it is to be understood that the terms "comprises" and/or "comprising" when used in this specification are taken to specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof.
In the present disclosure, terms such as "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "side", "bottom", and the like indicate an azimuth or a positional relationship based on the azimuth or the positional relationship shown in the drawings, are merely relational terms determined for convenience in describing structural relationships of the various components or elements of the present disclosure, and do not denote any one of the components or elements of the present disclosure, and are not to be construed as limiting the present disclosure.
In the present disclosure, terms such as "fixedly coupled," "connected," and the like are to be construed broadly and refer to either a fixed connection or an integral or removable connection; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the terms in the disclosure may be determined according to circumstances, and should not be interpreted as limiting the disclosure, for relevant scientific research or a person skilled in the art.
In an exemplary embodiment of the present application, as shown in fig. 1, there is provided a 3D printing apparatus for integrated manufacturing of stretchable electronic products, comprising: a base 1,XA workbench 2, a swinging table 3, a printing bed 4, a printing platform 5, a first spray head 6, a second spray head 7, a third spray head 8, a manipulator 9,ZTo the working tableI10、ZTo the working tableII11、ZTo the working tableIII12、ZTo the working tableIV13. A movable support 14,YWork bench 15, fixed support 16, heightVoltage pulse power supplyI17. High-voltage pulse power supplyII18. High-voltage pulse power supplyIII19. A substrate (substrate and package structure) material supply module 20, a conductive ink material supply module 21, a functional material supply module 22, a work platform 23 for placing embedded electronic components, a pressure line 24, a vacuum line 25, and a control module 26.
Wherein the method comprises the steps ofXA workbench 2 is fixed on the base 1, and a swinging table 3 is fixed on the baseXOn the workbench 2, a printing bed 4 is fixed on the swinging table 3, a printing platform 5 is arranged on the printing bed 4, a first spray head 6, a second spray head 7, a third spray head 8 and a mechanical arm 9 are respectively arranged above the printing platform 5, and the first spray head 6 and the mechanical arm 9 are respectively arranged on the upper part of the printing platform 5ZTo the working tableI10 are connected with the second nozzle 7ZTo the working tableII11 are connected with the third nozzle 8 andZto the working tableIII2 are connected with each other, and the manipulator 9ZTo the working tableIV13 are connected with each other,Zto the working tableI10、ZTo the working tableII11、ZTo the working tableIII12 andZto the working tableIV13 are fixed on a movable support 14, the movable support 14 andYthe work table 15 is connected to the machine frame,Ythe workbench 15 is fixed on a fixed bracket 16, the fixed bracket 16 is fixed on the base 1, and the conductive nozzle 601 at the bottom of the first spray head 6 and the high-voltage pulse power supplyI17-way connection, conductive nozzle 701 at the bottom of second nozzle 7 and high-voltage pulse power supplyII1, a conductive nozzle 801 at the bottom of the third spray head 8 and a high-voltage pulse power supply which are connected with each other by a first electrode 18III19 are connected, the top end of the first nozzle 6 is respectively connected with a substrate material feeding module 20 and a pressure pipeline 24, the top end of the second nozzle 7 is respectively connected with a conductive material feeding module 21 and the pressure pipeline 24, the top end of the third nozzle 8 is respectively connected with a functional material feeding module 22 and the pressure pipeline 24, and the manipulator 9 is respectively connected with the pressure pipeline 24 and a vacuum pipeline 25.
The robot arm 9 is used for gripping and placing (placing to a position where embedding in a substrate is required) of the electronic component 30. In the present embodiment, a vacuum chuck and a connecting air path are provided, wherein the vacuum chuck is connected with the pressure pipeline 23 and the vacuum pipeline 24.
Of course, in other embodiments, other forms of existing precision robots may be employed. And will not be described in detail herein.
The working platform 23 for placing embedded electronic components is fixed on the base 1, and the connection circuits of the control module 26 are respectively connected withXA workbench 2,YA working table 15,ZTo the working tableI10、ZTo the working tableII11、ZTo the working tableIII12、ZTo the working tableIV13. Swing table 3, printing bed 4, first nozzle 6, second nozzle 7, third nozzle 8, manipulator 9, high-voltage pulse power supplyI17. Voltage pulse power supplyII18. High-voltage pulse power supplyIII19. The substrate material supply module 20, the conductive material supply module 21, the functional material supply module 22, the pressure line 23, the vacuum line 24, and the like are connected.
The first nozzle 6 is made of printing materialPDMSFor printing of the base plate (substrate) 27, and printing of the encapsulation layer 33. It comprises a feed inlet, a conductive nozzle 601 arranged at the lowest end of the spray head, and an air inlet hole at the top of the spray head. The feed inlet is positioned on the side wall of the spray head, a precise peristaltic pump is used for feeding, the air inlet is connected with the pressure pipeline 23, and stable and precisely adjustable back pressure is provided in the printing process to drive the printing material to be in liquid statePDMSThe conductive nozzle in this embodiment is a metal nozzle.
The second nozzle 7 printing material is conductive silver paste for printing of the connection circuit and simple electronic component manufacturing. The spray head 7 comprises a feed inlet, a conductive nozzle 701 arranged at the lowest end of the spray head and an air inlet hole at the top of the spray head. The air inlet is connected to a pressure line 23 which provides a stable and precisely adjustable back pressure to drive the conductive ink during printing, the conductive nozzle being a metal nozzle.
In some embodiments, the conductive silver paste may be replaced with other conductive ink materials. The conductive ink can be nano silver conductive ink, nano copper conductive ink, carbon nano tube conductive ink, graphene, liquid metal or conductive silver adhesive and the like.
The third nozzle 8 is made of functional material, which is formed byPDMSThe silicon carbide reinforced modified material is added for printing the protective layer and the structural layer. The third nozzle 8 comprises a feed inlet and is arranged at the lowest end of the nozzleConductive nozzle 801, air inlet holes at the top of the spray head. The feed inlet is positioned on the side wall of the spray head, and is fed by a precise peristaltic pump, and the air inlet is connected with the pressure pipeline 23, so that stable and precisely adjustable back pressure is provided to drive the printing functional material in the printing process.
In some embodiments, the functional material comprises: to be used forPDMSAs a main body, reinforcing and modifying materials such as silicon carbide and silicon dioxide are added to provide physical properties such as thermal conductivity and hardness of the functional material.
Of course, in other embodiments, the feed module may be implemented using other feed mechanisms instead of a precision peristaltic pump.
ZTo the working tableI10、ZTo the working tableII11、ZTo the working tableIII12 andZto the working tableIV13 is high precisionZTo the displacement table, a servo motor module is selected in this embodiment. The working stroke is 100 mm, the repeated positioning precision is lower than +/-1 micron, and the absolute positioning precision is +/-3 microns.
In other embodiments, it is possible toX、Y、ZAny driving mechanism in the workbench is replaced by a driving mechanism such as a stepping motor or a linear motor.
In other embodiments, the range of the working stroke of any one of the tables may be changed.
High-voltage pulse power supplyI17. High-voltage pulse power supplyII18 and high voltage pulse power supplyIII19 has the following function, and outputs direct current high voltage; outputting alternating-current high voltage; the output pulses are high voltage and can be set with a bias voltage. Set bias voltage range 0-1KVContinuously adjustable, direct current high voltage 0-4KVOutputting pulse DC voltage 0- + -3KVContinuously adjustable, output pulse frequency 0HZ-3000HZContinuously adjustable, alternating high voltage 0- + -2KV。
Of course, in other embodiments, the range of each high voltage pulse power source may be varied.
The printing bed 4 is a round table with vacuum adsorption and electric heating functions, the heating temperature of the printing bed ranges from 0 ℃ to 130 ℃, and the flatness of the printing bed is high. The heating device is an electric heating rod, and the electric heating device realizes the pairPDMSRapid curing of materials and functional materials, and curing of conductive inks.
Of course, in other embodiments, the heating temperature range of the print bed may be varied, such as the print bed heating temperature range of 0-160 ℃. Or the heating device is replaced by a heating plate.
The swinging table 3 is a tilting rotary table and can wind aroundXTilting within + -90 degrees in the axial direction can be realizedZThe axial direction achieves a 360 degree range of swivel.
XThe workbench 2 adopts a servo motor module.XThe working stroke of the shaft is 300 mm, the repeated positioning precision is +/-5 microns, the absolute positioning precision is +/-8 microns, and the maximum speed is 500mm/sMaximum acceleration 500m/s 2 。
YThe workbench 15 adopts a servo motor module.YThe working stroke of the shaft is 200 mm, the repeated positioning precision is +/-5 microns, the absolute positioning precision is +/-8 microns, and the maximum speed is 500mm/sMaximum acceleration 500m/s 2 。
In other exemplary embodiments, other motion parameter tables may be used.
In another exemplary embodiment, a method for integrally manufacturing a stretchable electronic product is provided 3DThe printing working method comprises the following specific process steps:
example 1 substrate and protective layer Material Dow Corning 184 was usedPDMSThe material, the connecting circuit adopts conductive silver paste material, and the functional material selects silicon carbide and silicon carbidePDMSThe silicon carbide can improve the hardness and the heat conductivity of the mixed material, can protect an internal circuit, can improve the sensitivity of an electronic product, and can still ensure the flexibility and the stretchability of a flexible stretchable electronic product.
As shown in figure 2 # -a）-（c) The specific procedure is as follows:
step 1: printing with the first head 6PDMSMaterial, according to the designed model, completes the fabrication of the flexible substrate 27;
step 2: printing the functional material by using the third nozzle 8, and completing printing of the structural layer 28 according to the designed model;
step 3: the electronic components 29 to be embedded are taken down from the working platform 23 for placing the embedded electronic components by the manipulator 9 and are placed in the grooves 2801 and 2803 to be embedded in the structural layer in sequence;
step 4: printing conductive ink material using the second nozzle 7, completing printing of the connection circuit 30 and simple electronic component manufacturing (e.g., antenna, resistor, capacitor, etc.);
step 5: the connection circuit 30 is electrically conducted, and the print bed 4 and the structures (the substrate 27 and the structure layer 28) formed thereon, the embedded electronic components 29, the printed connection circuit 30, and the like are removed from the printer, placed in a heating furnace, and the connection circuit 30 is sintered at a low temperature. The heating temperature cannot exceed 140 degrees.
Step 6: the print bed 4 and the structures (the substrate 27 and the structural layer 28) formed thereon, the embedded electronic component 29, the printed connection circuit 30, and the like are reinstalled on the printer, and the functional material is printed by the third head 8, and the printing of the protective layer 31 is completed according to the model data, so that the electronic component 29 and the connection circuit 30 are completely enclosed by the protective layer 31.
Step 7: printing again with the first head 6PDMSThe material, according to the model data, completes the fabrication of the encapsulation layer 32.
Step 8: placing the manufactured stretchable electronic product into a heating box to enablePDMSAnd (5) fully curing.
In some embodiments, the heating temperature of the print beds of step 1, step 2, step 6, and step 7 ranges from 80 degrees to 90 degrees.
In some embodiments, the heating temperature of the print bed of step 4 ranges from 70 to 100 degrees.
In some embodiments, step 1, step 2, and step 6 are performed using electric field driven spray deposition 3 in combination, based on structural featuresDPrinting and material extrusion processes.
In some embodiments, step 4 deposits micro-nano 3 using electric field driven jetDAnd (5) printing process.
In some embodiments, step 7 uses a material extrusion process.
Of course, in other embodiments, the heating tank may be replaced with other heating devices.
The above description is only of the preferred embodiments of the present application and is not intended to limit the present application, but various modifications and variations can be made to the present application by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.
While the specific embodiments of the present disclosure have been described above with reference to the drawings, it should be understood that the present disclosure is not limited to the embodiments, and that various modifications and changes can be made by one skilled in the art without inventive effort on the basis of the technical solutions of the present disclosure while remaining within the scope of the present disclosure.
Claims (15)
1. 3 of stretchable electronic product integrated manufacturingDThe printing device is characterized in that: comprises a base and a control module, wherein the base is provided with a three-dimensional workbench, a placement platform,XA working table,YThe printing device comprises a workbench, a swinging table and a printing bed, wherein the printing bed is arranged on the swinging table, and the printing bed with vacuum adsorption and electric heating functions is driven to swing and rotate;
the three-dimensional workbench comprises four devicesZToward the working table, the firstZThe manipulator for grabbing and placing the electronic components is arranged on the workbench, and the placing platform is used for bearing the electronic components to be grabbed;
the rest areZA printing spray head is arranged on the workbench, the printing spray head comprises a feed inlet and conductive nozzles arranged at the lowest end of the spray head, each conductive nozzle is connected with a high-voltage pulse power supply, the feed inlet is respectively connected with a feed module, and the feed modules are respectively used for providing a flexible substrate, conductive ink and functional materials;
the control module controls the movements of the three-dimensional workbench, the swing table, the manipulator and the feeding module to enable each printing nozzle to execute printing actions of the flexible substrate, the protective layer, the connecting circuit, the embedded electronic element and the packaging layer of the stretchable electronic product according to a set sequence, so that integrated manufacturing is realized;
three printing spray heads are arranged on the Z-direction workbench and are named as a first printing spray head, a second printing spray head and a third printing spray head respectively, and the first printing spray head is used for printing a substrate and a packaging layer; the second printing nozzle is used for printing the connecting circuit and the simple electronic element; the third printing nozzle is used for printing the protective layer and the structural layer;
the printing material of the first printing nozzle is liquid flexible substrate material PDMS, the printing material of the second printing nozzle is conductive ink, and the conductive ink comprises conductive silver paste, nano silver conductive ink, nano copper conductive ink, carbon nano tube conductive ink, graphene, liquid metal or conductive silver glue; the printing material of the third printing nozzle is a functional material, PDMS is taken as a main body, and silicon carbide and silicon dioxide reinforced modified materials are added.
2. 3 of integrally manufactured stretchable electronics in accordance with claim 1DThe printing device is characterized in that: the first printing nozzle comprises a feeding hole, a conductive nozzle arranged at the lowest end of the nozzle and an air inlet hole at the top of the nozzle, wherein the feeding hole is positioned on the side wall of the nozzle and is used for receiving the feed of the feeding module, the air inlet hole is connected with a pressure pipeline and is used for providing stable and adjustable back pressure in the printing process to drive the liquid flexible substrate material of the printing material, and the conductive nozzle is a metal nozzle or a conductive nozzle coated with the conductive material.
3. 3 of integrally manufactured stretchable electronics in accordance with claim 1DThe printing device is characterized in that: the second printing nozzle is made of conductive ink, the nozzle comprises a feeding hole, a conductive nozzle arranged at the lowest end of the nozzle and an air inlet hole at the top of the nozzle, the air inlet hole is connected with a pressure pipeline, stable and adjustable back pressure is provided in the printing process to drive the conductive ink, and the conductive nozzle is a metal nozzle or a conductive nozzle coated with the conductive material.
4. 3 of integrally manufactured stretchable electronics in accordance with claim 1DThe printing device is characterized in that: the third printing spray head comprises a feed inlet, a conductive nozzle arranged at the lowest end of the spray head and an air inlet hole at the top of the spray head, wherein the feed inlet is positioned on the side wall of the spray head, the air inlet hole is connected with a pressure pipeline, stable and adjustable back pressure is provided in the printing process to drive the printing functional material, and the conductive nozzle is a metal nozzle or a conductive nozzle coated with the conductive material.
5. 3 of integrally manufactured stretchable electronics in accordance with claim 1DThe printing device is characterized in that: the high-voltage pulse power supply can output direct-current high voltage; outputting alternating-current high voltage; the output pulse is high voltage and can set bias voltage, and the set bias voltage range is 0-2KVContinuously adjustable, direct current high voltage 0-5KVOutputting pulse DC voltage 0- + -4KVContinuously adjustable, output pulse frequency 0HZ-3000HZContinuously adjustable, alternating high voltage 0- + -4KV。
6. 3 of integrally manufactured stretchable electronics in accordance with claim 1DThe printing device is characterized in that: the heating temperature of the printing bed ranges from 0 ℃ to 160 ℃, the heating device is an electric heating rod or an electric heating sheet, and the electric heating device realizes the curing of materials and the curing effect of conductive ink.
7. 3 of integrally manufactured stretchable electronics in accordance with claim 1DThe printing device is characterized in that: the swinging table is a tilting rotary table and can wind aroundXTilting within + -90 degrees in the axial direction can be realizedZThe axial direction achieves a 360 degree range of swivel.
8. 3 of integrally manufactured stretchable electronics in accordance with claim 1DThe printing device is characterized in that: the saidXThe workbench is provided with a driving mechanism, theXThe working stroke of the workbench is 0-1000 mm,repeated positioning accuracy is not lower than +/-5 microns, absolute positioning accuracy is not lower than +/-8 microns, and maximum speed is 700mm/sMaximum acceleration 500m/s 2 。
9. 3 of integrally manufactured stretchable electronics in accordance with claim 1DThe printing device is characterized in that: the saidYThe workbench is provided with a driving mechanism, theYWorking stroke of the workbench is 0-1000 mm, repeated positioning accuracy is not lower than +/-5 microns, absolute positioning accuracy is not lower than +/-8 microns, and maximum speed is 700mm/sMaximum acceleration 500m/s 2 。
10. A method of operating a device according to any one of claims 1-9, characterized in that: the method comprises the following steps:
(1) Printing a flexible substrate material by using a first printing nozzle, and completing the manufacture of the substrate and/or the flexible substrate according to a designed model;
(2) Printing functional materials by using a third printing nozzle, and finishing printing the structural layer according to the designed model;
(3) Taking down the electronic components to be embedded from the placement platform by using a mechanical arm, and sequentially placing the electronic components to be embedded into the grooves of the structural layer;
(4) Printing conductive ink materials by using a second printing nozzle to finish printing of a connecting circuit and manufacturing of a simple electronic element;
(5) Conducting treatment of the connecting circuit, namely taking down the printing bed, the formed substrate and protective layer on the printing bed, the embedded electronic element and the printed connecting circuit from the printer, placing the printing bed, the substrate and the protective layer on the printing bed, the embedded electronic element and the printed connecting circuit into a heating furnace, and sintering the printing bed and the printed connecting circuit at low temperature;
(6) Reinstalling the printing bed and the formed structure, embedded electronic element and printed connection circuit on the printing bed onto a printer, printing functional materials by using a third printing nozzle, and completing printing of the protective layer according to model data, so that the electronic element and the connection circuit are completely wrapped by the protective layer;
(7) Printing flexible substrate materials by using a first printing nozzle, and completing the final packaging and structure manufacturing according to the model data;
(8) And heating the manufactured stretchable electronic product to fully cure the flexible substrate.
11. The method of operation as recited in claim 10, wherein: in the step (1), the step (2), the step (6) and the step (7), the heating temperature of the printing bed ranges from 80 degrees to 100 degrees.
12. The method of operation as recited in claim 10, wherein: the heating temperature of the printing bed in the step (4) ranges from 90 to 110 degrees.
13. The method of operation as recited in claim 10, wherein: the step (1), the step (2) and the step (6) use electric field to drive jet deposition 3DPrinting and material extrusion processes perform the printing of structures.
14. The method of operation as recited in claim 10, wherein: in the step (4), the electric field driven jet deposition micro-nano 3 is usedDThe printing process prints.
15. The method of operation as recited in claim 10, wherein: and (3) printing the flexible substrate material in the step (7) by using a material extrusion molding process.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111714104A (en) * | 2020-07-16 | 2020-09-29 | 南京师范大学 | Emergency physiological parameter monitoring patch based on 3D printing and preparation method thereof |
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| CN114745873B (en) * | 2022-04-11 | 2024-02-02 | 青岛理工大学 | Multilayer flexible and stretchable electronic circuit integrated 3D printing method |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105762096A (en) * | 2016-03-28 | 2016-07-13 | 华中科技大学 | Flexible electronics preparing, transferring, and packaging system and method |
| CN106273497A (en) * | 2016-08-31 | 2017-01-04 | 青岛理工大学 | A kind of many Material claddings 3D printer and method of work thereof and application |
| CN106965417A (en) * | 2017-04-05 | 2017-07-21 | 泉州装备制造研究所 | A kind of system and Method of printing for smart electronicses product rule 3D printing |
| CN107214945A (en) * | 2017-06-30 | 2017-09-29 | 青岛理工大学 | A kind of electric field driven jet deposition 3D printing device and its method of work |
| CN108215157A (en) * | 2018-02-27 | 2018-06-29 | 浙江大学 | The flexible circuit 3 D-printing device that a kind of macromolecule liquid metal prints altogether |
| CN108381903A (en) * | 2018-02-27 | 2018-08-10 | 浙江大学 | A kind of flexible circuit 3 D-printing method that macromolecule liquid metal prints altogether |
| CN109366976A (en) * | 2018-09-03 | 2019-02-22 | 青岛理工大学 | The 3D printing devices and methods therefor manufactured for conformal antenna and circuit integrating |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2538522B (en) * | 2015-05-19 | 2019-03-06 | Dst Innovations Ltd | Electronic circuit and component construction |
-
2019
- 2019-03-18 CN CN201910205002.7A patent/CN109732900B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105762096A (en) * | 2016-03-28 | 2016-07-13 | 华中科技大学 | Flexible electronics preparing, transferring, and packaging system and method |
| CN106273497A (en) * | 2016-08-31 | 2017-01-04 | 青岛理工大学 | A kind of many Material claddings 3D printer and method of work thereof and application |
| CN106965417A (en) * | 2017-04-05 | 2017-07-21 | 泉州装备制造研究所 | A kind of system and Method of printing for smart electronicses product rule 3D printing |
| CN107214945A (en) * | 2017-06-30 | 2017-09-29 | 青岛理工大学 | A kind of electric field driven jet deposition 3D printing device and its method of work |
| CN108215157A (en) * | 2018-02-27 | 2018-06-29 | 浙江大学 | The flexible circuit 3 D-printing device that a kind of macromolecule liquid metal prints altogether |
| CN108381903A (en) * | 2018-02-27 | 2018-08-10 | 浙江大学 | A kind of flexible circuit 3 D-printing method that macromolecule liquid metal prints altogether |
| CN109366976A (en) * | 2018-09-03 | 2019-02-22 | 青岛理工大学 | The 3D printing devices and methods therefor manufactured for conformal antenna and circuit integrating |
Non-Patent Citations (1)
| Title |
|---|
| 电场驱动喷射沉积3D打印;钱垒等;中国科学;第48卷(第07期);第773-782页 * |
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