CN109719089A - A kind of device for realizing metal surface reducing adhesion using interface electric osmose pulse - Google Patents
A kind of device for realizing metal surface reducing adhesion using interface electric osmose pulse Download PDFInfo
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- CN109719089A CN109719089A CN201910101628.3A CN201910101628A CN109719089A CN 109719089 A CN109719089 A CN 109719089A CN 201910101628 A CN201910101628 A CN 201910101628A CN 109719089 A CN109719089 A CN 109719089A
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Abstract
The present invention relates to a kind of devices that metal surface reducing adhesion is realized using interface electric osmose pulse, including electrode plate and the pulse power, the electrode plate includes positive plate part and negative plate part, the positive plate part of the surface is distributed with the positive contact of protrusion, and the edge of the positive plate part of the surface and positive contact is laid with insulating materials;Preformed hole is distributed on the negative plate part, the positive contact is identical as the position that preformed hole is distributed in negative plate part in the position that positive plate part is distributed, after the positive plate part and the combination of negative plate part the positive contact is embedded in the preformed hole, so that positive plate part and negative plate are partially disposed on same surface;The positive plate part and negative plate part are separately connected the anode and cathode of the pulse power.The present invention can be improved security performance, reduce system energy consumption.
Description
Technical field
The present invention relates to dope desorption technology fields, realize metal watch using the pulse of interface electric osmose more particularly to a kind of
The device of face reducing adhesion.
Background technique
Sticky material is generally existing in many industry or civil equipment in the adhesion of working metal parts surface,
All there is the sticking problem of sticky material in the industries such as food, chemical industry, coal and environmental protection, to the normal operation of equipment to some extent
There is significant negative effect.Wherein, municipal administration or industrial sludge are typical sticky materials, and sludge is at conveying, dehydration or desiccation
Adhesion during reason etc. is most significant, also most representative.
Currently, the industrial application of sludge reducing adhesion and research pass through the side of chemical modification mainly from sludge characteristics
Method carries out visbreaking, but this method visbreaking effect is limited, and practical application also faces many limitations, and it is still necessary to seek more Universal efficient
Reducing adhesion method.In fact, adherency behavior and the interfacial characteristics of metal are closely related.There is scholar to propose utilization both at home and abroad
The method that sludge is adhered in metal surface during electric osmosis principle reduction heat drying, and achieve good effect.Its principle is
Hydrated cation in sludge is to metal interface (cathode) directional migration under electric field force effect, and hydrated cation is again in viscous effect
Moisture should be driven to be enriched with together to interface down, the mesh of sludge reducing adhesion is reached using the lubricating action of metal interface liquid film
's.But traditional electric osmose is positive and negative and separation arranges that voltage across poles is higher (50~300V), and energy consumption is larger, works also dangerous, no
Conducive to commercial introduction application.
Summary of the invention
Realize that metal surface visbreaking is de- using the pulse of interface electric osmose technical problem to be solved by the invention is to provide a kind of
Attached device can be improved security performance, reduce system energy consumption.
The technical solution adopted by the present invention to solve the technical problems is: providing a kind of golden using interface electric osmose pulse realization
The device of metal surface reducing adhesion, including electrode plate and the pulse power, the electrode plate include positive plate part and negative plate portion
Point, the positive contact of protrusion, the edge of the positive plate part of the surface and positive contact is distributed in the positive plate part of the surface
It is laid with insulating materials;Preformed hole is distributed on the negative plate part, the positive contact is distributed in positive plate part
Position is identical as the position that preformed hole is distributed in negative plate part, makes institute after the positive plate part and the combination of negative plate part
It states positive contact to be embedded in the preformed hole, so that positive plate part and negative plate are partially disposed on same surface;The anode
Plate part and negative plate part are separately connected the anode and cathode of the pulse power.
The voltage of the pulse power is 5~50V, and pulse frequency is 10~100Hz.
The positive contact and the shape of preformed hole are round, ellipse or polygon.
The insulating materials is organic polymer flexible coating or high temperature ceramic material coating.
The positive contact and the area ratio of negative plate part are 0.01~0.3.
Beneficial effect
Due to the adoption of the above technical solution, compared with prior art, the present invention having the following advantages that and actively imitating
Fruit: electric osmose positive and negative electrode is arranged in same surface by the present invention, and applies the pulse power according to certain spectrum signature, to realize
Hydrated cation directional migration formed moisture film, achieve the purpose that metal surface visbreaking, due to the pulse power improve hydration sun from
The transfer ability of son, interpolar spacing are not limited by a space, and can reduce spacing to greatest extent, so that voltage significantly reduces, are improved
Security performance, reduces system energy consumption.
Detailed description of the invention
Fig. 1 is electrode plate negative plate fragmentary front view;
Fig. 2 is electrode plate positive plate fragmentary front view;
Fig. 3 is the cross-sectional view after electrode plate positive plate part and the combination of negative plate part;
Fig. 4 is interface electric osmose pulser schematic diagram;
Fig. 5 is pulse signal waveform variation schematic diagram;
Fig. 6 is the visbreaking effect picture of different water cut sludge under the electric osmose impulse action of interface.
Specific embodiment
Present invention will be further explained below with reference to specific examples.It should be understood that these embodiments are merely to illustrate the present invention
Rather than it limits the scope of the invention.In addition, it should also be understood that, after reading the content taught by the present invention, those skilled in the art
Member can make various changes or modifications the present invention, and such equivalent forms equally fall within the application the appended claims and limited
Range.
Embodiments of the present invention are related to a kind of device that metal surface reducing adhesion is realized using interface electric osmose pulse, such as
Shown in Fig. 1-Fig. 4, including electrode plate and the pulse power 6, the electrode plate includes positive plate part 3 and negative plate part 1, described
The round positive contact 4 of protrusion, the edge on positive plate part 3 surface and positive contact 4 is distributed in 3 surface of positive plate part
It is laid with insulating materials 5;Round preformed hole 2 is distributed on the negative plate part 1, the positive contact 4 is in positive plate portion
Divide the position of 3 distributions identical as the position that preformed hole 2 is distributed in negative plate part 1, the positive plate part 3 and negative plate part
It is embedded in the round positive contact 4 in the round preformed hole 2, so that positive plate part 3 and negative plate part
1 is arranged in same surface;The positive plate part 3 and negative plate part 1 are separately connected the positive and negative of the pulse power 6
Pole.
It is noted that the positive contact 4 and preformed hole 2 in present embodiment can also be other shapes, for example it is
Ellipse or other polygons.Insulating materials 5 can be organic polymer flexible coating, be also possible to high temperature ceramic material painting
Layer.Positive contact 4 and the area ratio of negative plate part 1 are preferably 0.01~0.3.
It can be seen that the interface iontophoresis device is made of positive plate part, negative plate part and the pulse power, positive plate portion
Divide and negative plate is partially disposed on same surface, is filled with insulating materials between the two;By to positive plate part and negative plate
Part applies the pulse power of certain spectrum signature, and the hydrated cation in material can be made to form water to cathode directional migration
Film achievees the purpose that metal surface reducing adhesion.
Wherein, the pulse power is mainly made of DC power supply, relay, pulse signal generator etc., voltage be 5~
50V, frequency are 10~100Hz.
Below for being derived from the municipal sludge of Shanghai sewage treatment plant, different water cut sludge is introduced in interface electric osmose
The visbreaking effect of pulse metal electrode surface, the specific steps are as follows:
(1) moisture percentage in sewage sludge is adjusted to 35%, 45%, 60 and 70% etc. four kind of different water cut;
(2) unbalanced pulse power supply 6, and pulse voltage is adjusted to by 10V, pulse frequency 30Hz, duty ratio according to Fig. 5
It is 50%;
(3) viscosity break ratio using shear stress method measurement different water cut sludge in metal surface, as a result as shown in Figure 6.
From fig. 6, it can be seen that under the electric osmose impulse action of interface, visbreaking effect of the different water cut sludge in metal surface
Between 25~50%, excellent visbreaking performance is embodied, in 35%-45%, viscosity break ratio exists especially moisture percentage in sewage sludge
38% or more.
Claims (5)
1. a kind of device that metal surface reducing adhesion is realized using interface electric osmose pulse, including electrode plate and the pulse power,
It is characterized in that, the electrode plate includes positive plate part and negative plate part, and protrusion is distributed in the positive plate part of the surface
The edge of positive contact, the positive plate part of the surface and positive contact is laid with insulating materials;On the negative plate part
It is distributed with preformed hole, the position that the position and preformed hole that the positive contact is distributed in positive plate part are distributed in negative plate part
It is identical, after the positive plate part and the combination of negative plate part the positive contact is embedded in the preformed hole, so that just
Pole plate part and negative plate are partially disposed on same surface;The positive plate part and negative plate part are separately connected the pulse
The anode and cathode of power supply.
2. the device according to claim 1 for being realized metal surface reducing adhesion using interface electric osmose pulse, feature are existed
In the voltage of the pulse power is 5~50V, and pulse frequency is 10~100Hz.
3. the device according to claim 1 for being realized metal surface reducing adhesion using interface electric osmose pulse, feature are existed
In the shape of the positive contact and preformed hole is round, ellipse or polygon.
4. the device according to claim 1 for being realized metal surface reducing adhesion using interface electric osmose pulse, feature are existed
In the insulating materials is organic polymer flexible coating or high temperature ceramic material coating.
5. the device according to claim 1 for being realized metal surface reducing adhesion using interface electric osmose pulse, feature are existed
In the area ratio of the positive contact and negative plate part is 0.01~0.3.
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CN201910101628.3A CN109719089A (en) | 2019-01-30 | 2019-01-30 | A kind of device for realizing metal surface reducing adhesion using interface electric osmose pulse |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112362579A (en) * | 2020-11-13 | 2021-02-12 | 上海电力大学 | Testing device for metal surface adhesion force in presence of surface electroosmosis |
CN112405834A (en) * | 2020-11-13 | 2021-02-26 | 景德镇陶瓷大学 | Bionic electroosmosis structure for pug mill |
CN115301635A (en) * | 2022-07-15 | 2022-11-08 | 江苏徐工工程机械研究院有限公司 | Low-pressure electroosmosis visbreaking desorption structure and desorption method |
WO2023165104A1 (en) * | 2022-05-31 | 2023-09-07 | 江苏徐工工程机械研究院有限公司 | Electroosmosis adhesion reduction system positive electrode module, electroosmosis adhesion reduction system and engineering machinery |
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JPS55119182A (en) * | 1979-03-08 | 1980-09-12 | Nippon Steel Corp | Cleaning of surface of steel plate |
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JPS55119182A (en) * | 1979-03-08 | 1980-09-12 | Nippon Steel Corp | Cleaning of surface of steel plate |
CN1382878A (en) * | 2002-02-20 | 2002-12-04 | 吉林大学 | Electroosmotic desorption method for bionic surface |
CN101397678A (en) * | 2007-09-29 | 2009-04-01 | 宝山钢铁股份有限公司 | Laser desorption processing method for steel plate surface |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112362579A (en) * | 2020-11-13 | 2021-02-12 | 上海电力大学 | Testing device for metal surface adhesion force in presence of surface electroosmosis |
CN112405834A (en) * | 2020-11-13 | 2021-02-26 | 景德镇陶瓷大学 | Bionic electroosmosis structure for pug mill |
WO2023165104A1 (en) * | 2022-05-31 | 2023-09-07 | 江苏徐工工程机械研究院有限公司 | Electroosmosis adhesion reduction system positive electrode module, electroosmosis adhesion reduction system and engineering machinery |
CN115301635A (en) * | 2022-07-15 | 2022-11-08 | 江苏徐工工程机械研究院有限公司 | Low-pressure electroosmosis visbreaking desorption structure and desorption method |
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Application publication date: 20190507 |