CN109714918A - The manufacturing method of the shell of electronic device, electronic device and shell - Google Patents
The manufacturing method of the shell of electronic device, electronic device and shell Download PDFInfo
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- CN109714918A CN109714918A CN201811516784.8A CN201811516784A CN109714918A CN 109714918 A CN109714918 A CN 109714918A CN 201811516784 A CN201811516784 A CN 201811516784A CN 109714918 A CN109714918 A CN 109714918A
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Abstract
This application discloses the manufacturing methods of a kind of shell of electronic device, electronic device and shell; shell includes: bottom plate and the side plate that connect with bottom plate; bottom plate and side plate limit holding tank; bottom plate and side plate include perspex layer and transparent protective layer; transparent protective layer and perspex layer stackup are arranged; and perspex layer is located at the side of the close holding tank of transparent protective layer, transparent protective layer is glassy layer or sapphire layer.According to the shell of the electronic device of the application; by the way that transparent protective layer and perspex layer stackup are arranged; it can not only guarantee the structural strength of shell; it can also realize the transparent of shell; user can observe directly the structure inside electronic device through transparent protective layer and perspex layer, so as to promote the technology sense of electronic device.In addition, the difficulty of processing of perspex layer is lower, processing cost is less, is conducive to the production cycle for shortening shell.
Description
Technical field
This application involves technical field of electronic device, more particularly, to a kind of shell of electronic device, electronic device and outer
The manufacturing method of shell.
Background technique
With the development of electronic technology, requirement of the user to the technology sense of electronic device is also higher and higher.In the related technology,
Electronic device is more and more beautiful in configuration design, but beautiful shape can only meet the aesthetic requirement of user, and can not be to use
Bring a kind of high-tech feeling in family.
Summary of the invention
The application aims to solve at least one of the technical problems existing in the prior art.For this purpose, the application proposes a kind of electricity
The shell of sub-device, the shell of the electronic device have the advantages that technology sense height and manufacturing cost are low.
The application also proposed a kind of electronic device, and the electronic device includes the shell of above-mentioned electronic device.
The application also proposed a kind of manufacturing method of the shell of electronic device, utilize the system of the shell of the electronic device
The method of making can manufacture the shell of above-mentioned electronic device.
According to the shell of the electronic device of the embodiment of the present application, the shell includes: bottom plate and connect with the bottom plate
Side plate, the bottom plate and the side plate limit holding tank, and the bottom plate and the side plate include perspex layer and transparent
Protective layer, the transparent protective layer and the perspex layer stackup are arranged, and the perspex layer is located at the transparent guarantor
The side close to the holding tank of sheath, the transparent protective layer are glassy layer or sapphire layer.
According to the shell of the electronic device of the embodiment of the present application, by the way that transparent protective layer and perspex layer stackup are set
It sets, can not only guarantee the structural strength of shell, can also realize the transparent of shell, user can through transparent protective layer and thoroughly
Bright plastic layer observes directly the structure inside electronic device, so as to promote the technology sense of electronic device.In addition, transparent modeling
The difficulty of processing of glue-line is lower, and processing cost is less, is conducive to the production cycle for shortening shell.
According to the electronic device of the embodiment of the present application, comprising: the shell of above-mentioned electronic device.
According to the electronic device of the embodiment of the present application, by the way that transparent protective layer and perspex layer stackup to be arranged, not only
It can guarantee the structural strength of shell, can also realize the transparent of shell, user can penetrate transparent protective layer and perspex
Layer observes directly the structure inside electronic device, so as to promote the technology sense of electronic device.In addition, perspex layer
Difficulty of processing is lower, and processing cost is less, is conducive to the production cycle for shortening shell.
According to the manufacturing method of the shell of the electronic device of the embodiment of the present application, the shell include: bottom plate and with it is described
The side plate of bottom plate connection, the bottom plate and the side plate limit holding tank, and the bottom plate and the side plate include transparent modeling
Glue-line and transparent protective layer, the perspex layer is located at the side close to the holding tank of the transparent protective layer, described
Transparent protective layer is glassy layer or sapphire layer, and the manufacturing method includes: perspex layer described in machine-shaping；Machine-shaping
The transparent protective layer；The perspex layer is stacked with the transparent protective layer, to be formed described in the shell
Bottom plate and the side plate.
According to the manufacturing method of the shell of the electronic device of the embodiment of the present application, by by transparent protective layer and perspex
Layer stackup setting, can not only guarantee the structural strength of shell, can also realize the transparent of shell, user can penetrate transparent guarantor
Sheath and perspex layer observe directly the structure inside electronic device, so as to promote the technology sense of electronic device.This
Outside, the difficulty of processing of perspex layer is lower, and processing cost is less, is conducive to the production cycle for shortening shell.
The additional aspect and advantage of the application will be set forth in part in the description, and will partially become from the following description
It obtains obviously, or recognized by the practice of the application.
Detailed description of the invention
The above-mentioned and/or additional aspect and advantage of the application will become from the description of the embodiment in conjunction with the following figures
Obviously and it is readily appreciated that, in which:
Fig. 1 is the structural schematic diagram according to the electronic device of the embodiment of the present application；
Fig. 2 is the shell according to the electronic device of the embodiment of the present application one；
Fig. 3 is the sectional view in Fig. 2 at A-A；
Fig. 4 is the enlarged drawing in Fig. 3 at B；
Fig. 5 is the shell according to the electronic device of the embodiment of the present application two；
Fig. 6 is the sectional view in Fig. 5 at C-C；
Fig. 7 is the enlarged drawing in Fig. 6 at D.
Appended drawing reference:
Electronic device 1000,
Shell 100, perspex layer 1,
Transparent protective layer 2, viscous layer 3,
Bottom plate 4, side plate 5, holding tank 6,
Display screen 200.
Specific embodiment
Embodiments herein is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, and is only used for explaining the application, and should not be understood as the limitation to the application.
Below with reference to the accompanying drawings the shell 100 of electronic device 1000 according to the embodiment of the present application is described, shell 100 is transparent
Part, shell 100 can also be called rear cover.
As shown in Figure 1, Figure 2 and Figure 4, according to the shell 100 of the electronic device of the embodiment of the present application 1000, comprising: bottom plate 4
With the side plate 5 connecting with bottom plate 4, bottom plate 4 and side plate 5 are limited holding tank 6 (with reference to Fig. 3), and bottom plate 4 and side plate 5 include saturating
Bright plastic layer 1 and transparent protective layer 2, transparent protective layer 2 are stacked with perspex layer 1, and perspex layer 1 is positioned at transparent
The side of the close holding tank 6 of protective layer 2.
The structural strength that can not only guarantee shell 100 as a result, can also realize the transparent of shell 100, and user can be saturating
It crosses transparent protective layer 2 and perspex layer 1 observes directly structure inside electronic device 1000, so as to promote electronics dress
Set 1000 technology sense.
For example, in the embodiment shown in fig. 3, transparent protective layer 2 can be located at the outside of perspex layer 1, and transparent
Protective layer 2 is stacked with perspex layer 1.
In the related technology, the inner surface of shell is glassy layer or metal layer, and shell also needs to use after machine-shaping
CNC (Computerized Numerical Control, computer numerical control technology) carry out grinding and buffing, process time and plus
Work higher cost.And in this application, the inner surface of shell 100 is perspex layer 1, and the plasticity of perspex layer 1 is stronger,
Difficulty of processing is lower, and does not need grinding and buffing process, and processing cost is lower, is conducive to the production cycle for shortening shell 100.
In addition, in the related technology, electronic device is laid out using three-stage, display screen, center and shell, center are specifically included
Holding tank is limited with shell.And in the embodiment of the present application, side plate 5 and bottom plate 4 can limit holding tank 6, so as to
Cancel middle frame structure, saves cost.
As shown in Figure 1, Figure 2 and Figure 4, transparent protective layer 2 can be glassy layer or sapphire layer.Glassy layer or sapphire layer
Hardness it is higher, while guaranteeing 100 structural strength of shell, the wearability of shell 100 can also be promoted.Glassy layer is blue precious
The appearance of rock layers is relatively smooth, can promote the experience effect of user.In addition, the chemical property of glassy layer or sapphire layer is steady
It is fixed, it is not easy by acid and alkali corrosion, service life is longer.
According to the shell 100 of the electronic device 1000 of the embodiment of the present application, by by transparent protective layer 2 and perspex layer
1 is stacked, and can not only guarantee the structural strength of shell 100, can also realize the transparent of shell 100, and user can penetrate
Transparent protective layer 2 and perspex layer 1 observe directly the structure inside electronic device 1000, so as to promote electronic device
1000 technology sense.In addition, the difficulty of processing of perspex layer 1 is lower, processing cost is less, is conducive to shorten shell 100
Production cycle.
According to some embodiments of the present application, as shown in Figures 2 and 3, perspex layer 1 is PC layers, PMMA layers or PET
Layer.PC, i.e. Polycarbonate, Chinese are polycarbonate, are that a kind of tough thermoplastic resin polycarbonate is colourless
Bright, heat-resisting, shock resistance is BI grades fire-retardant, there is good mechanical performance in commonly used temperature.PMMA, i.e.,
PolymethylMethacrylate, Chinese are polymethyl methacrylate, are commonly called as organic glass, are to synthesize so far
Quality is most excellent in transparent material, and price is again than convenient kind.Sharp fragment, and aesthetic appearance are not likely to produce when broken
It can good, easy processing.PET, i.e. polyethylene terephthalate, Chinese are poly terephthalic acid class plastics, PET
Plastics have good optical property and weatherability, and amorphous PET plastic has good optical transparence.
According to some embodiments of the present application, as shown in Figure 3 and Figure 4, between transparent protective layer 2 and perspex layer 1 also
Equipped with viscous layer 3.Viscous layer 3 can preferably bond together transparent protective layer 2 and perspex layer 1, to be promoted saturating
The integraty of bright protective layer 2 and perspex layer 1.In addition, guaranteeing transparent protective layer 2 and 1 adhesive strength of perspex layer
Cost can also be reduced simultaneously.
Optionally, viscous layer 3 is PVB (PolyVinyl Butyral, polyvinyl butyral) glue, OCA glue
(Optically Clear Adhesive, optical cement) or UV glue (UVglue, shadowless glue).PVB glue, OCA glue and UV glue are equal
Have the advantages that adhesive strength is high, the transparency is good and corrosion resistance is strong.Thus, it is possible to realize transparent protective layer 2 and perspex
The close connection of layer 1.In addition, certain rush can be absorbed in PVB glue, OCA glue and UV glue when electronic device 1000 falls
Energy is hit, so as to preferably protect electronic device 1000.For example, viscous layer 3 is PVB glue.
According to some embodiments of the present application, shell 100 further includes antireflection layer, and antireflection layer is located at perspex layer 1 and thoroughly
Between bright protective layer 2, antireflection layer includes at least one layer Ti3O5Layer and at least one layer SiO2Layer, or including at least one layer Nb2O5Layer
With at least one layer of SiO2.For example, antireflection layer can be Ti3O5Layer, SiO2The composite layer that layer construction is formed, wherein Ti3O5Layer has
Two layers, SiO2Layer is located at two layers of Ti3O5Between layer and stacking is arranged.For another example, antireflection layer can be SiO2Layer, Nb2O5Layer construction shape
At composite layer, wherein Nb2O5Layer has two layers, SiO2Layer is located at two layers of Ti3O5Between layer and stacking is arranged.It is measured through experiment,
Utilize Ti3O5Layer, SiO2The antireflection layer and utilize SiO that layer construction is formed2Layer, Nb2O5The antireflection layer that layer construction is formed all has good
Good antireflective effect.
In some embodiments of the present application, as shown in Fig. 2, Fig. 4 and Fig. 5, bottom plate 4 and side plate 5 are integrally formed part.By
This, integrally formed structure can not only guarantee the properity stability of bottom plate 4 and side plate 5, and facilitate molding, manufacture
Simply, and extra assembly parts and connection process are eliminated, substantially increases the assembly efficiency of bottom plate 4 and side plate 5, guarantees
The connection reliability of bottom plate 4 and side plate 5, furthermore, the integral strength and high stability of integrally formed structure assemble more square
Just, longer life expectancy.
Further, as shown in Figure 5 and Figure 6, on the direction of the open ports of the bottom wall of holding tank 6 to holding tank 6, shell
100 periphery wall is first directed away from the direction inclination of holding tank 6, is re-directed towards and tilts close to the direction of holding tank 6.Thus, it is possible to
Increase the contact area of shell 100 and palm, promotes the comfort that user holds.In addition, curved surface is visually also more beautiful.
For example, in the embodiment shown in fig. 6, using CNC, (Computerized Numerical Control is calculated
Machine Numeric Control Technology) periphery wall of shell 100 is processed so that holding tank 6 bottom wall to holding tank 6 open ports side
Upwards, the periphery wall of shell 100 is first directed away from the direction inclination of holding tank 6, is re-directed towards and tilts close to the direction of holding tank 6.
Preferably, as shown in Figure 6 and Figure 7, the perspex layer 1 of one end of the separate bottom plate 4 (referring to Fig. 5) of side plate 5
The surface exposed portion perimeter wall to form shell 100 far from holding tank 6.The sense of touch of perspex layer 1 is preferable, and user is in one's hands
When holding shell 100, the palm or finger of user can touch the periphery wall of perspex layer 1.Thus, it is possible to promote user
The comfort of gripping, thus promoted the experience sense of user by.
Preferably, as shown in Fig. 1, Fig. 5 and Fig. 6, the periphery wall of shell 100 is round and smooth curved surface.Thus, it is possible to be promoted outer
The smoothness of the periphery wall of shell 100 further increases palm and 100 contact area of shell, further promotes relaxing for user's gripping
Adaptive.In addition, when curved surface is impacted, impact force can be uniformly diffused into it by curved surface when electronic device 1000 falls
His position is unlikely to damage structure, protects electronic device 1000.
Preferably, as shown in Figure 5 and Figure 6, the part of the open ports of the close holding tank 6 of the periphery wall of shell 100 is arc
Face.Thus, it is possible to further promote the comfort that user uses, opening wide for the close holding tank 6 of the periphery wall of shell 100 is avoided
The part of mouth scratches finger, so that the safety of shell 100 can also be promoted.
Below with reference to the accompanying drawings electronic device 1000 according to the embodiment of the present application is described.
According to the electronic device 1000 of the embodiment of the present application, comprising: the shell 100 of above-mentioned electronic device 1000.
According to the electronic device 1000 of the embodiment of the present application, by the way that transparent protective layer 2 and the stacking of perspex layer 1 are set
It sets, can not only guarantee the structural strength of shell 100, can also realize the transparent of shell 100, user can penetrate transparency protected
Layer 2 and perspex layer 1 observe directly the structure inside electronic device 1000, so as to promote the section of electronic device 1000
Skill sense.In addition, the difficulty of processing of perspex layer 1 is lower, processing cost is less, is conducive to the production cycle for shortening shell 100.
In some embodiments of the present application, electronic device 1000 further includes display screen 200, and display screen 200 is embedded outside
In the holding tank 6 of shell 100.
It should be noted that electronic device 1000 can be game device, music player, storage device, AR
(Augmented Reality, augmented reality) equipment, or the equipment applied to automobile etc..In addition, as used herein
" electronic device 1000 " includes, but are not limited to be configured to connect via Wireline (such as via Public Switched Telephone Network
(PSTN), digital subscriber line (DSL), digital cable, Direct cable connection and/or another data connection/network) and/or
Via (for example, for cellular network, WLAN (WLAN), the digital TV network of such as DVB-H network, satellite network,
AM-FM broadcasting transmitter and/or another communication electronic device 1000) wireless interface receives/sends the dress of signal of communication
It sets.It is configured to that " wireless communication device " can be referred to as by the communication electronic device 1000 of radio interface communication, " without traditional thread binding
Set " and/or " mobile device ".The example of mobile device includes, but are not limited to satellite or cellular phone；Can with combination cellular without
PCS Personal Communications System (PCS) device of line electricity phone and data processing, fax and communication ability；It may include radio
Phone, pager, the Internet/intranet access, Web browser, memo pad, calendar and/or global positioning system (GPS) connect
Receive the PDA of device；And conventional laptop and/or palmtop receiver or other electronic devices including radiotelephone transceiver
1000。
Below with reference to the accompanying drawings the manufacturing method of the shell 100 of electronic device 1000 according to the embodiment of the present application is described.
According to the manufacturing method of the shell 100 of the electronic device 1000 of the embodiment of the present application, shell 100 includes: 4 He of bottom plate
The side plate 5 connecting with bottom plate 4, bottom plate 4 and side plate 5 limit holding tank 6 (with reference to Fig. 3), and bottom plate 4 and side plate 5 include transparent
Plastic layer 1 and transparent protective layer 2, perspex layer 1 are located at the side of the close holding tank 6 of transparent protective layer 2, transparent protective layer
2 be glassy layer or sapphire layer, and the manufacturing method of shell 100 includes: machine-shaping perspex layer 1, the transparent guarantor of machine-shaping
Perspex layer 1 and transparent protective layer 2 are stacked by sheath 2, to form the bottom plate 4 and side plate 5 of shell 100.
According to the manufacturing method of the shell 100 of the electronic device 1000 of the embodiment of the present application, by by transparent protective layer 2 with
Perspex layer 1 is stacked, and can not only guarantee the structural strength of shell 100, can also realize the transparent of shell 100, is used
Family can observe directly the structure inside electronic device 1000 through transparent protective layer 2 and perspex layer 1, so as to mention
Rise the technology sense of electronic device 1000.In addition, the difficulty of processing of perspex layer 1 is lower, processing cost is less, is conducive to shorten
The production cycle of shell 100.
According to some embodiments of the present application, perspex layer 1 passes through Shooting Technique machine-shaping.Shooting Technique development
It is more mature, and the step of Shooting Technique is relatively simple, the acceptance rate of the perspex layer 1 processed using Shooting Technique compared with
Height, and have the advantages that high in machining efficiency low with processing cost.In addition, by Shooting Technique formed perspex layer 1 in
Surface is relatively smooth, it is no longer necessary to grinding and buffing processing is carried out to the inner surface of perspex layer 1, so as to reduce manufacture
Cost, shorten the period of production.
According to some embodiments of the present application, transparent protective layer 2 passes through hot bending process machine-shaping.Hot bending process development
It is more mature, and the step of hot bending process is relatively simple, the acceptance rate of the transparent protective layer 2 processed using hot bending process compared with
Height, and have the advantages that high in machining efficiency low with processing cost.
According to some embodiments of the present application, manufacturing method further include: by cutting technique to the side plate 5 of shell 100 into
Row cutting, so that the periphery wall of shell 100 is first directed away from the bottom wall to the direction of the open ports of holding tank 6 of holding tank 6
The direction of holding tank 6 tilts, and is re-directed towards and tilts close to the direction of holding tank 6.Thus, it is possible to increase connecing for shell 100 and palm
Contacting surface product promotes the comfort that user holds.In addition, curved surface is visually also more beautiful.
Preferably, cutting technique is CNC technique.The entitled computer numerical control technology of CNC Chinese, by defeated in computer in advance
The program entered can be accurately controlled track and the stroke of cutting process.CNC technique has the advantages that machining accuracy is high, passes through
Shell 100 after the processing of CNC technique is visually also more beautiful.
Preferably, manufacturing method further include: using polishing machine to the perspex layer 1 and transparent protective layer 2 by cutting
Periphery wall polishing treatment.It is understood that the appearance of the side plate 5 after cutting is relatively coarse.By external
Peripheral wall is processed by shot blasting, can promote the smoothness of periphery wall, promotes the feel that user uses.
In some embodiments of the present application, viscous layer 3 is additionally provided between transparent protective layer 2 and perspex layer 1, it will be saturating
Before bright plastic layer 1 is stacked with transparent protective layer 2, first by viscous layer 3 be coated in transparent protective layer 2 towards perspex
On the surface of layer 1, then viscous layer 3 is heated.It can be bonded by viscous layer 3 with transparent protective layer 2 and perspex layer 1
Together, so that transparent protective layer 2 and 1 integraty of perspex layer enhance, while the structure that can also promote shell 100 is strong
Degree.
Further, the heating temperature of viscous layer 3 is T, and is met: 150 DEG C≤T≤200 DEG C.Viscous layer 3 can be with as a result,
Melt, to adequately contact with perspex layer 1 and transparent protective layer 2, and then the area of connection can be increased, guarantees
The intensity of connection.
Preferably, before to perspex layer 1 and 2 cutting process of transparent protective layer, by perspex layer 1 with it is transparency protected
Layer 2 is cooled to room temperature.Thus, it is possible to guarantee well-bonded between perspex layer 1 and transparent protective layer 2, and then guarantee saturating
The adhesion strength of bright plastic layer 1 and transparent protective layer 2.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " illustrative examples ",
The description of " example ", " specific example " or " some examples " etc. means specific features described in conjunction with this embodiment or example, knot
Structure, material or feature are contained at least one embodiment or example of the application.In the present specification, to above-mentioned term
Schematic representation may not refer to the same embodiment or example.Moreover, specific features, structure, material or the spy of description
Point can be combined in any suitable manner in any one or more of the embodiments or examples.
While there has been shown and described that embodiments herein, it will be understood by those skilled in the art that: not
A variety of change, modification, replacement and modification can be carried out to these embodiments in the case where being detached from the principle and objective of the application, this
The range of application is defined by the claims and their equivalents.
Claims (18)
1. a kind of shell of electronic device, which is characterized in that the shell includes: bottom plate and the side plate that connect with the bottom plate,
The bottom plate and the side plate limit holding tank, and the bottom plate and the side plate include perspex layer and transparency protected
Layer, the transparent protective layer and the perspex layer stackup are arranged, and the perspex layer is located at the transparent protective layer
Close to the holding tank side, the transparent protective layer be glassy layer or sapphire layer.
2. the shell of electronic device according to claim 1, which is characterized in that the perspex layer is PC layers, PMMA
Layer or pet layer.
3. the shell of electronic device according to claim 1, which is characterized in that the transparent protective layer and the transparent modeling
Viscous layer is additionally provided between glue-line.
4. the shell of electronic device according to claim 3, which is characterized in that the viscous layer be PVB glue, OCA glue or
Person's UV glue.
5. the shell of electronic device according to claim 1, which is characterized in that it further include antireflection layer, the antireflection layer position
Between the perspex layer and the transparent protective layer, the antireflection layer includes at least one layer Ti3O5Layer and at least one layer
SiO2Layer, or including at least one layer Nb2O5Layer and at least one layer SiO2。
6. the shell of electronic device according to claim 1, which is characterized in that the holding tank bottom wall to the appearance
Receive slot open ports direction on, the periphery wall of the shell be first directed away from the holding tank direction inclination, be re-directed towards and lean on
The direction inclination of the nearly holding tank.
7. the shell of electronic device according to claim 6, which is characterized in that one far from the bottom plate of the side plate
The surface exposed portion perimeter wall to form the shell far from the holding tank of the perspex layer at end.
8. the shell of electronic device according to claim 6, which is characterized in that the periphery wall of the shell is round and smooth song
Face.
9. the shell of electronic device according to claim 8, which is characterized in that the periphery wall of the shell close to described
The part of the open ports of holding tank is cambered surface.
10. a kind of electronic device characterized by comprising outside electronic device according to claim 1 to 9
Shell.
11. a kind of manufacturing method of the shell of electronic device, which is characterized in that the shell include: bottom plate and with the bottom plate
The side plate of connection, the bottom plate and the side plate limit holding tank, and the bottom plate and the side plate include perspex layer
And transparent protective layer, the perspex layer is located at the side close to the holding tank of the transparent protective layer, described transparent
Protective layer is glassy layer or sapphire layer, and the manufacturing method includes:
Perspex layer described in machine-shaping；
Transparent protective layer described in machine-shaping；
The perspex layer is stacked with the transparent protective layer, with formed the shell the bottom plate and the side
Plate.
12. the manufacturing method of the shell of electronic device according to claim 11, which is characterized in that the perspex layer
Pass through Shooting Technique machine-shaping.
13. the manufacturing method of the shell of electronic device according to claim 11, which is characterized in that the transparent protective layer
Pass through hot bending process machine-shaping.
14. the manufacturing method of the shell of electronic device according to claim 11, which is characterized in that the manufacturing method is also
Include: cut by the side plate of the cutting technique to the shell so that the holding tank bottom wall to the appearance
Receive slot open ports direction on, the periphery wall of the shell be first directed away from the holding tank direction inclination, be re-directed towards and lean on
The direction inclination of the nearly holding tank.
15. the manufacturing method of the shell of electronic device according to claim 14, which is characterized in that the cutting technique is
CNC technique.
16. the manufacturing method of the shell of electronic device according to claim 14, which is characterized in that the manufacturing method is also
It include: the periphery wall polishing treatment using polishing machine to the perspex layer and the transparent protective layer by cutting.
17. the manufacturing method of the shell of electronic device according to claim 11, which is characterized in that the transparent protective layer
It is additionally provided with viscous layer between the perspex layer, the perspex layer and the transparent protective layer are stacked it
Before, first by the viscous layer be coated in the transparent protective layer towards on the surface of the perspex layer, then to described
Viscous layer heat treatment.
18. the manufacturing method of the shell of electronic device according to claim 17, which is characterized in that the viscous layer adds
Hot temperature is T, and is met: 150 DEG C≤T≤200 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811516784.8A CN109714918A (en) | 2018-12-12 | 2018-12-12 | The manufacturing method of the shell of electronic device, electronic device and shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811516784.8A CN109714918A (en) | 2018-12-12 | 2018-12-12 | The manufacturing method of the shell of electronic device, electronic device and shell |
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| CN109714918A true CN109714918A (en) | 2019-05-03 |
Family
ID=66255648
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| CN201811516784.8A Pending CN109714918A (en) | 2018-12-12 | 2018-12-12 | The manufacturing method of the shell of electronic device, electronic device and shell |
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|---|---|---|---|---|
| CN112123884A (en) * | 2020-10-14 | 2020-12-25 | Oppo广东移动通信有限公司 | Composite board, preparation method thereof, shell assembly and electronic equipment |
| WO2022078101A1 (en) * | 2020-10-14 | 2022-04-21 | Oppo广东移动通信有限公司 | Composite sheet and preparation method therefor, housing assembly, and electronic device |
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Application publication date: 20190503 |
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