CN109712965B - Antistatic circuit packaging structure with pin point discharge - Google Patents
Antistatic circuit packaging structure with pin point discharge Download PDFInfo
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- CN109712965B CN109712965B CN201811458519.9A CN201811458519A CN109712965B CN 109712965 B CN109712965 B CN 109712965B CN 201811458519 A CN201811458519 A CN 201811458519A CN 109712965 B CN109712965 B CN 109712965B
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Abstract
The invention discloses an antistatic circuit packaging structure with pin point discharge, which comprises: the improved static electricity protection device comprises a static electricity cover, a resistance plate, a connecting bolt, reinforcing pins, IC outer pins and a packaging block, wherein the static electricity cover is horizontally arranged at the bottom of the resistance plate, the contact surfaces of the static electricity cover and the resistance plate are tightly attached, the connecting bolt vertically penetrates through the center of the resistance plate and is meshed with threads of a metal block at the top of the packaging block, more than two IC outer pins are arranged and are arranged around the packaging block in an array mode, and the reinforcing pins are welded and fixed at the bottoms of four opposite corners of the static electricity cover.
Description
Technical Field
The invention relates to a circuit packaging structure, in particular to an antistatic circuit packaging structure with pin point discharge.
Background
The circuit encapsulation is integrated with little circuit, forms a very multi-functional control circuit on the PCB sheet layer through outside pin welded, because the integrated nature of encapsulation can make the modularization that the circuit is more strong, consequently in high-tech trade wide use, but the encapsulation circuit receives static influence easily:
static can reach kilovolt, because the encapsulation circuit ware of SOP packaging mode, in order to guarantee that the stability pin of signal feedback is short and intensive, because the component adsorbs the dust under the dry environment, change the impedance between the circuit, influence the function and the life-span of component, make static directly carry out the electrically conductive breakdown to a plurality of pins moreover, and in order to avoid the encapsulation chip to receive the influence of static and adopt the metal covering to cover it, the heat dissipation receives certain influence to some operating condition more abominable and the chip in the action very easily causes the condition of desoldering.
Disclosure of Invention
In view of the above problems, the present invention provides an anti-static circuit package structure with pin point discharge.
In order to achieve the purpose, the invention is realized by the following technical scheme: the utility model provides an antistatic circuit packaging structure with pin point discharge, its structure includes: static cover, resistance board, connection bolt, reinforcement pin, IC outer foot, encapsulation piece, the static cover level is installed in the bottom of resistance board and the contact surface closely laminates, connect the bolt perpendicularly run through the center of resistance board and with the screw thread interlock of the metal block at encapsulation piece top, the IC outer foot is equipped with more than two and be the array and install around the encapsulation piece, reinforcement pin welded fastening is in four diagonal bottoms of static cover, static cover inner structure includes: the bottom end conductive frame is provided with four plates and is arranged inside the plate surface of the double-prevention outer frame, the heat conduction layer is arranged on the inner wall of the double-prevention outer frame and is connected with the tops of the heat conduction fins, the bottom end conductive frame is arranged on the left side of the memory metal, and the center shaft of the heat conduction fins is opposite to the axis of the metal groove on the top end of the packaging block.
As a further improvement of the invention, the bottom end conductive frame consists of a rotary block, a limiting connecting shaft, a bolt, an isolating outer frame and a conductive plate, wherein a rotary shaft at the upper end of the rotary block central shaft is fixed with a rotary shaft at the upper end of the limiting connecting shaft, the limiting connecting shaft is connected with a connecting round hole at the top of the conductive plate through the bolt, the isolating outer frame is fixed on the outer side of the conductive plate in a welding way and penetrates through a groove of the double-protection outer frame, and the left side of a bottom plate of the conductive plate is fixed with a movable shaft at the.
As a further improvement of the invention, the limiting connecting shaft consists of an extrusion shaft, a rod body, a connecting spring strip, a guide tooth and an auxiliary limiting ring, wherein the extrusion shaft is welded and fixed on the right side of the rod body and forms an integral structure with the auxiliary limiting ring on the left side, the connecting spring strip is obliquely fitted in a groove of the rod body, the end head of the connecting spring strip penetrates through the outer ring of the auxiliary limiting ring, and the guide tooth is buckled in an inner groove of the rod body and is arranged at the upper end and the lower end of the surface of the connecting spring strip.
As a further improvement of the invention, the auxiliary limiting ring consists of a rotating inner ring, an outer ring and a dislocation elastic ring, wherein the rotating inner ring is nested in the outer ring, the axes of the rotating inner ring and the outer ring are opposite, the two end heads of the dislocation elastic ring are buckled in the groove of the outer ring in an arc shape, a small gap is formed between the dislocation elastic ring and the outer wall of the rotating inner ring, and a through hole at the top end of the outer ring is connected with the connecting spring strip.
As a further improvement of the invention, the memory metal consists of a fixed manifold frame, a composite metal strip, a heat conductor, heat conducting blocks and a rotating shaft, wherein the fixed manifold frame and the branches at the top of the composite metal strip are mutually nested and form an integral structure, the metal strip penetrates through the inner wall of the heat conductor, the two heat conducting blocks are connected, and the rotating shaft is arranged at the lower end of the metal strip and is connected with a groove at the bottom of the current conducting plate.
As a further improvement of the invention, the position of the hole position where the isolation outer frame is contacted with the isolation outer frame and the position close to the bottom groove is an inclined surface.
As a further improvement of the invention, the end head connected with the left side of the spring strip is in a pointed shape, and is not contacted with the dislocated elastic ring when the memory metal is cooled and the conductive plate falls down.
As a further improvement of the invention, the two branched branch bars at the upper end of the composite metal bar are arranged in the fixed branch frame.
As a further improvement of the invention, the surface of the guide tooth is smooth and is in contact with the surface of the connecting spring.
The invention has the beneficial effects that:
according to the invention, the static cover protects the important chip in the process of overhauling the circuit board by a worker, the built-in memory metal can enable the conductive plate to be close to the IC outer pin at the bottom under the condition that the chip does not generate heat, once static electricity exists, the static electricity can be firstly absorbed by the conductive plate, and the static electricity is prevented from directly puncturing an internal circuit through the IC outer pin.
In summary, the improved package block can change the shape of the conductive plate during operation and shutdown through the thermal deformation characteristic of the memory metal, so as to effectively protect the internal circuit of the package block from electrostatic breakdown, and achieve better heat dissipation effect.
Drawings
Fig. 1 is a schematic structural diagram of an anti-static circuit package structure with pin point discharge according to the present invention.
Fig. 2 is a schematic structural view of the electrostatic shield of the present invention.
Fig. 3 is a schematic structural view of a bottom conductive frame according to the present invention.
Fig. 4 is a schematic structural view of the limiting connecting shaft of the invention.
FIG. 5 is a schematic structural diagram of a memory metal according to the present invention.
FIG. 6 is a schematic view of an auxiliary stop collar according to the present invention.
FIG. 7 is a schematic view of the contact structure between the auxiliary stop collar and the connecting spring strip according to the present invention.
Fig. 8 is a schematic view of a partial three-dimensional structure of the double-prevention outer frame and the isolation outer frame of the invention.
Fig. 9 is a schematic perspective view of the package block and the electrostatic cover according to the present invention.
In the figure: the device comprises an electrostatic cover-1, a resistor plate-2, a connecting bolt-3, a reinforcing pin-4, an IC outer pin-5, a packaging block-6, a bottom end conductive frame-11, a memory metal-12, a heat conductive layer-13, a double-protection outer frame-14, a heat conductive fin-15, a rotary block-111, a limiting connecting shaft-112, a plug-113, an isolation outer frame-114, a conductive plate-115, an extrusion shaft-1121, a rod body-1122, a connecting spring strip-1123, a guide tooth-1124, an auxiliary limiting ring-1125, a rotary inner ring-11251, an outer ring-11252, a staggered elastic ring-11253, a fixed manifold frame-121, a composite metal strip-122, a heat conductor-123, a heat conductive block-124 and a rotary shaft-125.
Detailed Description
In order to make the technical means, the creation features, the achievement objects and the effects of the present invention easy to understand, fig. 1 to 9 schematically show the structure of the electrostatic cover according to the embodiment of the present invention, and the present invention is further described below with reference to the detailed embodiment.
Examples
As shown in fig. 1 to 9, the present invention provides an anti-static circuit package structure with pin point discharge, which comprises: static cover 1, resistance board 2, connection bolt 3, reinforcement pin 4, IC outer foot 5, encapsulation piece 6, 1 level of static cover is installed in the bottom of resistance board 2 and the contact surface closely laminates, 3 perpendicular through resistance board 2 centers of connection bolt and the screw thread interlock of the metal block at encapsulation piece 6 top, IC outer foot 5 is equipped with more than two and is the array and installs around encapsulation piece 6, 4 welded fastening of reinforcement pin are in four diagonal bottoms of static cover 1, 1 inner structure of static cover includes: bottom conducting frame 11, memory metal 12, heat-conducting layer 13, two prevent frame 14, heat conduction fin 15, bottom conducting frame 11 is equipped with four and installs inside the face of two preventing frame 14 slope all around, heat-conducting layer 13 is installed at the inner wall of two preventing frame 14 and is connected with heat conduction fin 15 top, bottom conducting frame 11 is installed in the left side of memory metal 12, heat conduction fin 15 center pin is relative with the axle center of the metal slot on encapsulation piece 6 top, foretell encapsulation piece 6 upper end is equipped with metal cover plate and gives details see figure 9 and be equipped with the screw post, can make the mode of static cover 1 installation more various, avoids some circuits because the high contact that can't reserve welding reinforcement pin 4 on the circuit board of integrated level, and metal cover plate can dispel the heat simultaneously to and direct ground connection carries out the protection of static.
As a further improvement of the present invention, the bottom end conductive frame 11 is composed of a rotation block 111, a limit connecting shaft 112, a plug pin 113, an isolation outer frame 114 and a conductive plate 115, a central shaft of the rotation block 111 is fixed with a rotating shaft at the upper end of the limit connecting shaft 112, the limit connecting shaft 112 is connected with a connecting round hole at the top of the conductive plate 115 through the plug pin 113, the isolation outer frame 114 is fixed at the outer side of the conductive plate 115 in a welding manner and penetrates through a groove of the double-prevention outer frame 14, the left side of the bottom plate of the conductive plate 115 is fixed with a movable shaft at the bottom of the memory metal 12 in a nesting manner, the interior of the isolation outer frame 114 is welded at the outer side of the conductive plate 115 in a through structure, on one hand, the heat dissipation area can be increased, and meanwhile, a downward slot can enable the conductive plate 115.
As a further improvement of the present invention, the limiting connecting shaft 112 comprises an extrusion shaft 1121, a rod body 1122, a connecting spring bar 1123, a guiding tooth 1124 and an auxiliary limiting ring 1125, the extrusion shaft 1121 is welded and fixed on the right side of the rod body 1122 and forms an integral structure with the auxiliary limiting ring 1125 on the left side, the connecting spring bar 1123 is obliquely fitted in a groove of the rod body 1122, and the end of the connecting spring bar passes through the outer ring of the auxiliary limiting ring 1125, and the guiding tooth 1124 is fastened in the inner groove of the rod body 1122 and is arranged at the upper end and the lower end of the surface of the connecting spring bar 1123.
As a further improvement of the present invention, the auxiliary limit ring 1125 is composed of a rotating inner ring 11251, an outer ring 11252, and a shifting ring 11253, wherein the rotating inner ring 11251 is nested inside the outer ring 11252 with opposite axes, two ends of the shifting ring 11253 are buckled in the groove of the outer ring 11252 in an arc shape, and there is a slight gap with the outer wall of the rotating inner ring 11251, a through hole at the top end of the outer ring 11252 is connected with a connecting spring 1123, the inner ring of the rotating inner ring 11251 is fixed on the top of the conductive plate 115, because the conductive plate 115 is a light metal sheet, when the shifting ring 11253 presses the rotating inner ring 11251, the conductive plate 115 and the outer ring 11252 will be fixed together, and it is ensured that the isolating outer frame 114 on the conductive plate 115 can be correctly nested inside the dual-proof outer frame 14 within a certain angle for heat dissipation.
As a further improvement of the present invention, the memory metal 12 is composed of a fixing manifold 121, a composite metal strip 122, a heat conductor 123, heat conducting blocks 124, and a rotating shaft 125, the fixing manifold 121 and the branches at the top of the composite metal strip 122 are nested with each other and form an integral structure, the metal strip 122 penetrates through the inner wall of the heat conductor 123 and connects the two heat conducting blocks 124, and the rotating shaft 125 is installed at the lower end of the metal strip 122 and connects with the groove at the bottom of the conductive plate 115.
As a further improvement of the present invention, the position of the hole position where the isolation outer frame 114 contacts the dual-protection outer frame 14 and is close to the bottom groove is an inclined surface, and the inclined surface is configured to prevent the isolation outer frame 114 from being jammed with the corner of the dual-protection outer frame 14 in the descending process, which affects the protection of the IC outer leg in the stop state.
As a further improvement of the invention, the end of the left side of the contact spring bar 1123 is pointed, and does not contact the dislocated coil 11253 when the memory metal 12 cools and the conductive plate 115 falls.
As a further improvement of the present invention, two bifurcated branch bars are disposed at the upper end of the composite metal bar 122 and are installed inside the fixed branch frame 121, a plurality of branch bars can conduct heat better, the temperature sensing effect of the composite metal bar 122 is more obvious, and excessive heating of the package block 6 is avoided.
As a further improvement of the present invention, the surface of the guiding teeth 1124 is smooth and contacts with the surface of the connecting spring 1123, so that the auxiliary double-protection outer frame 14 with the guiding teeth 1124 is more smooth and labor-saving in the working process, and avoids the occurrence of additional load on the composite metal strip 122.
The working principle is as follows:
During normal operation, the package block 6 generates heat, a part of the heat is transferred to the position of the fixed manifold frame 121 of the memory metal 12 through the heat conduction layer 13 and the heat conduction fins 15, a part of the heat is intermittently contacted with the heat conductor 123 and the heat conduction block 124 through air due to rising of hot air, and the composite metal strip 122 deforms due to heat, so that the angle of the conductive plate 115 of the bottom end conductive frame 11 changes and expands outwards.
The isolation outer frame 114 of the conductive plate 115 is outwardly extended along the limit connecting shaft 112 until penetrating through the slot of the dual-protection outer frame 14 for external heat dissipation, and the extrusion shaft 1121 at the top in the action process of the limit connecting shaft 112 pushes the connection spring 1123 in the rod body 1122, the connection spring 1123 deforms the dislocation spring ring 11253 under the assistance of the guide teeth 1124 to clamp the rotating inner ring 11251, so that when the limit connecting shaft 112 and the conductive plate 115 approach the slot of the dual-protection outer frame 14, the connection spring cannot be pressed by the dislocation spring ring 11253, and only the extrusion shaft 1121 at the top acts, so that the isolation outer frame 114 can be lifted by a small distance when reaching the dual-protection outer frame 14, and can more easily enter the slot.
When the package block 6 stops working, the conductive plate 115 is restored to cover the front end of the IC outer pin 5, and once static electricity occurs, the static electricity will be discharged to the conductive plate 115, thereby avoiding damaging the internal integrated circuit.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (1)
1. The utility model provides an antistatic circuit packaging structure with pin point discharge, its structure includes: static cover (1), resistance board (2), connecting bolt (3), reinforcement pin (4), IC outer foot (5), encapsulation piece (6), its characterized in that: the electrostatic cover (1) is horizontally arranged at the bottom of the resistance plate (2) and the contact surfaces are tightly attached, the connecting bolt (3) vertically penetrates through the center of the resistance plate (2) and is meshed with the threads of the metal block at the top of the packaging block (6), more than two IC outer pins (5) are arranged and are arranged around the packaging block (6) in an array manner, and the reinforcing pins (4) are welded and fixed at the bottoms of four opposite angles of the electrostatic cover (1); the electrostatic cover (1) comprises an internal structure comprising: the packaging structure comprises a bottom end conductive frame (11), memory metal (12), a heat conduction layer (13), a double-prevention outer frame (14) and heat conduction fins (15), wherein the number of the bottom end conductive frame (11) is four, the four bottom end conductive frame is arranged inside a plate surface inclined around the double-prevention outer frame (14), the heat conduction layer (13) is arranged on the inner wall of the double-prevention outer frame (14) and connected with the tops of the heat conduction fins (15), the bottom end conductive frame (11) is arranged on the left side of the memory metal (12), and the central axis of each heat conduction fin (15) is opposite to the axis of a metal groove at the top end of a packaging block (6);
the bottom end conductive frame (11) is composed of a rotary block (111), a limiting connecting shaft (112), a bolt (113), an isolating outer frame (114) and a conductive plate (115), a central shaft of the rotary block (111) is fixed with a rotating shaft at the upper end of the limiting connecting shaft (112), the limiting connecting shaft (112) is connected with a connecting round hole at the top of the conductive plate (115) through the bolt (113), the isolating outer frame (114) is fixed on the outer side of the conductive plate (115) in a welding mode, when the encapsulation block (6) generates heat, the isolating outer frame (114) penetrates through a groove of the double-prevention outer frame (14), the left side of a bottom plate of the conductive plate (115) is fixed with a movable shaft at the bottom of the memory metal (12) in a nesting mode, the limiting connecting shaft (112) is composed of an extrusion shaft (1121), a rod body (1122), a connecting spring strip (1123), a guide tooth (1124) and an auxiliary limiting ring (1125), the extrusion shaft (1121) is fixed on the right side of the rod body (, the connecting spring bar (1123) is obliquely fitted in a groove of the rod body (1122), the end head of the connecting spring bar penetrates through the outer ring of the auxiliary limiting ring (1125), the guide teeth (1124) are buckled in the inner groove of the rod body (1122) and are arranged at the upper end and the lower end of the surface of the connecting spring bar (1123), the auxiliary limiting ring (1125) consists of a rotating inner ring (11251), an outer ring (11252) and a dislocation elastic ring (11253), the rotating inner ring (11251) is nested in the outer ring (11252) and the axes of the rotating inner ring and the outer ring are opposite, the ends of the two ends of the dislocation elastic ring (11253) are buckled in the groove of the outer ring (11252) in an arc shape, a tiny gap exists between the rotating inner ring (11251) and the outer wall of the outer ring (11252), a through hole in the top end of the outer ring (11252) is connected with the connecting spring bar (3), and the memory metal (12) is composed of a fixed manifold frame (121), a composite metal bar (122, The fixed manifold frame (121) and the branches at the top of the composite metal strip (122) are mutually nested and form an integral structure, the composite metal strip (122) penetrates through the inner wall of the heat conductor (123), the two heat conducting blocks (124) are connected with each other, the rotating shaft (125) is arranged at the lower end of the composite metal strip (122) and is connected with a groove at the bottom of the heat conducting plate (115), and the position, close to the bottom groove, of a hole position of the isolation outer frame (114) in contact with the isolation outer frame (114) is an inclined plane;
the packaging block (6) generates heat in normal work, one part of the packaging block is transmitted to the position of a fixed manifold frame (121) of the memory metal (12) through the heat conduction layer (13) and the heat conduction fins (15), the other part of the packaging block is intermittently contacted with the heat conductor (123) and the heat conduction block (124) through air due to the rising of hot air, and the composite metal strip (122) deforms due to heat, so that the angle of the current conduction plate (115) of the bottom end current conduction frame (11) is changed and the composite metal strip expands outwards;
the isolation outer frame (114) of the conductive plate (115) stretches outwards along the limiting connecting shaft (112) until penetrating through the slot of the double-prevention outer frame (14) for external heat dissipation, and the extrusion shaft (1121) at the top in the action process of the limiting connecting shaft (112) can push the connecting spring strips (1123) in the rod body (1122), the connecting spring strips (1123) enable the dislocation elastic ring (11253) to deform to clamp the rotating inner ring (11251) under the assistance of the guide teeth (1124), so that when the limiting connecting shaft (112) and the conductive plate (115) approach the slot of the double-prevention outer frame (14), the dislocation elastic ring (11253) extrudes to be incapable of acting, and only the extrusion shaft (1121) at the top acts, so that the isolation outer frame (114) can lift a small distance when reaching the double-prevention outer frame (14), and can more easily enter the groove;
when the packaging block (6) stops working, the conductive plate (115) is restored to be covered at the front end of the IC outer pin (5), and once static electricity occurs, the static electricity can be released to the conductive plate (115), so that the internal integrated circuit is prevented from being damaged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811458519.9A CN109712965B (en) | 2018-11-30 | 2018-11-30 | Antistatic circuit packaging structure with pin point discharge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811458519.9A CN109712965B (en) | 2018-11-30 | 2018-11-30 | Antistatic circuit packaging structure with pin point discharge |
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| Publication Number | Publication Date |
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| CN109712965A CN109712965A (en) | 2019-05-03 |
| CN109712965B true CN109712965B (en) | 2020-10-23 |
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| CN201811458519.9A Active CN109712965B (en) | 2018-11-30 | 2018-11-30 | Antistatic circuit packaging structure with pin point discharge |
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Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040261946A1 (en) * | 2003-04-24 | 2004-12-30 | Tokyo Electron Limited | Plasma processing apparatus, focus ring, and susceptor |
| US20050108877A1 (en) * | 2003-11-24 | 2005-05-26 | Peterson Eric C. | Apparatus and method for coupling a thermal dissipation device to an electronic substrate |
| CN101273456B (en) * | 2005-09-27 | 2012-04-18 | 康奈尔研究基金公司 | Shape memory device |
| US10366970B2 (en) * | 2009-10-12 | 2019-07-30 | Monolithic 3D Inc. | 3D semiconductor device and structure |
| CN203910787U (en) * | 2014-05-19 | 2014-10-29 | 美的集团股份有限公司 | A static electricity eliminating apparatus used for a power module |
| JP6851171B2 (en) * | 2016-10-14 | 2021-03-31 | 株式会社アルバック | Microfunctional element and manufacturing method of microfunctional element |
| CN207624693U (en) * | 2017-12-27 | 2018-07-17 | 深圳市阿赛姆科技有限公司 | A kind of novel high-performance ESD transistor arrangements |
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Effective date of registration: 20200925 Address after: 225326 north side of Chuangye Avenue, Gaogang science and Innovation Park, Taizhou City, Jiangsu Province Applicant after: TAIZHOU TAIHUIDA TECHNOLOGY INFORMATION CONSULTING CENTER Address before: 325215, Chengjiang Town, Ruian City, Zhejiang Province, Tao Tong Village, Wenzhou Applicant before: Xie Hongyuan |
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Effective date of registration: 20230803 Address after: 712000, 1st and 2nd floors, Building 204, Zone A, Sino Korean Industrial Park, Gaoke 3rd Road, Qindu District, Xianyang City, Shaanxi Province Patentee after: Shaanxi Huaxin Semiconductor Technology Co.,Ltd. Address before: 225326 north of Chuangye Avenue, Gaogang science and Innovation Park, Taizhou City, Jiangsu Province Patentee before: TAIZHOU TAIHUIDA TECHNOLOGY INFORMATION CONSULTING CENTER |