CN109712915A - Chip cleaner - Google Patents
Chip cleaner Download PDFInfo
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- CN109712915A CN109712915A CN201811624506.4A CN201811624506A CN109712915A CN 109712915 A CN109712915 A CN 109712915A CN 201811624506 A CN201811624506 A CN 201811624506A CN 109712915 A CN109712915 A CN 109712915A
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- wafer
- elastic membrane
- cleaning
- pump drainage
- turntable
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Abstract
The invention belongs to semiconductor production fields, specifically disclose chip cleaner, turntable including being used to support wafer, spraying mechanism is equipped with above turntable, spraying mechanism includes elastic membrane and several are threaded through the cleaning pipe in elastic membrane, and cleaning pipe is connected with plenum member, and cleaning pipe is communicated with hollow sprinkling ball, ball is sprayed between elastic membrane and turntable, is sprayed and is densely covered with spray hole on ball.The present invention can be cleaned and be dried to wafer simultaneously.
Description
Technical field
The present invention relates to semiconductor production fields, and in particular to chip cleaner.
Background technique
In electronics industry, wafer is the system for manufacturing the wafer from semiconducting material of integrated circuit or other microdevices
Claim, also referred to as silicon wafer, substrate etc..Wafer is formed to the bare chip of integrated circuit, needs very high by numerous requirements
Precision process process.Generally, the process flow of wafer is generally divided into front-end process and back-end process in industrial circle.Leading portion system
Journey refers mainly to some process flows for forming crystal on wafer and being taken for realization Crystallization；Back-end process refers mainly to
Be by the wafer of generative circuit by process flows after a series of, wafer-process, which is become, can play the part of the circuit function phase
Between manufacturing process, these processing procedures include: wafer reverse side grinding be also known as wafer be thinned, Wafer Dicing, wafer choose the processes such as grain
The good bare chip of quality is separated into carry out chip package from wafer；Just become the integrated electricity that can be used after having encapsulated
Road.
Semiconductor crystal wafer to micropollutants there are very sensitive, in order to reach the target of crystal column surface contamination-free, must
The pollutant on surface must be removed and avoid that pollutant is allowed to remain in crystal column surface again before processing procedure, therefore semiconductor crystal wafer is being made
It during making, needs by multiple surface cleaning step, to remove the metal ion of surface attachment, atom, organic matter and micro-
Grain (i.e. dedusting).The prior art mainly uses cleaning solution to clean crystal column surface, after the completion of cleaning, it is also necessary to by wafer
It is transferred to drying equipment the cleaning solution for remaining in crystal column surface is dried, operating procedure is comparatively laborious.
Summary of the invention
The purpose of the present invention is to provide a kind of chip cleaners, can wafer be cleaned and be dried simultaneously.
In order to achieve the above objectives, the present invention adopts the following technical scheme:
Chip cleaner, the turntable including being used to support wafer, turntable top are equipped with spraying mechanism, and spraying mechanism includes
Elastic membrane is threaded through the cleaning pipe in elastic membrane with several, and cleaning pipe is connected with plenum member, and cleaning pipe is communicated with hollow sprinkling
Ball sprays ball between elastic membrane and turntable, sprays and is densely covered with spray hole on ball.
The principle of this programme is:
Turntable is for driving wafer high speed rotation, and spraying mechanism is used to spray high-pressure cleaning liquid to crystal column surface, due to spray
The cleaning solution for being spread across crystal column surface is subject to centrifugal forces on high-speed rotating wafer, therefore cleaning solution reaches crystal column surface
Afterwards, it is spread apart in crystal column surface rapidly, and forms one layer of liquid film in crystal column surface, cover whole wafer surface, thus real
Now to the cleaning of crystal column surface, simultaneously because the cleaning solution for being sprayed at crystal column surface is thrown off crystal column surface by centrifugal action,
To realize the effect of cleaning solution drying, it is not necessary that the wafer after cleaning is dried.
The present invention sets spraying mechanism to the mode of multiple sprinkling ball sprinkling cleaning solutions, and sprinkling ball can have a part
Cleaning solution sprays upwards, and the cleaning solution sprayed upwards strikes elastic membrane lower surface, so that elastic membrane generates vibration, and then will hit
It hits in the cleaning solution rebound to the cleaning solution film of crystal column surface in elastic membrane, increases the pressure between cleaning solution and crystal column surface
Power enhances cleaning effect to increase the frictional force between cleaning solution and wafer.
Following technical effect can be reached using this programme:
1, cleaning solution, the centrifugation that cleaning solution is subject to are sprayed to crystal column surface while high speed rotation on turntable by wafer
Power makes cleaning solution form liquid film covering whole wafer, and is thrown off crystal column surface rapidly, can carry out to crystal column surface
While cleaning, achieve the effect that dry cleaning solution, from the prior art with use different equipment crystal column surface is carried out clearly
It washes and compares with drying, this programme cleaning and drying carry out on the same device, are not necessarily to carry out wafer after the completion of wafer cleaning
The step of shifting re-dry, reducing chip production in the prior art, to improve chip production efficiency.
2, elastic membrane tool there are four effect: (1) strike crystal column surface part cleaning solution be capable of increasing liquid film with
Pressure between wafer, to increase frictional force between the two, cleaning effect is more preferable, as well as cleaning solution by elasticity
The rebound of film strikes crystal column surface in pelletized form, can hit the fume of crystal column surface part from crystal column surface, cleaning
Effect is good；(2) cleaning solution rebounds back and forth between elastic membrane and crystal column surface, extends the scavenging period of cleaning solution；(3) due to quilt
The cleaning solution of elastic membrane rebound is perpendicular to crystal column surface or has an angle with crystal column surface when striking crystal column surface,
Can the movement to liquid film at crystal column surface towards wafer edge play certain barrier effect, thus further extend cleaning
Residence time of the liquid on wafer；(4) it is avoided that the cleaning solution for being sprayed at crystal column surface rebounds into air, causes cleaning solution
The problem of waste.
Further, it is additionally provided with lid above elastic membrane, forms airflow chamber between lid and elastic membrane, airflow chamber side is equipped with
Flow generator structure, the transverse direction of the outgassing direction of flow generator structure along airflow chamber.High-speed flow above elastic membrane passes through bullet
When property film, energy band dynamic elasticity film vibration at high speed, to increase elastic membrane vibration frequency, so that elastic membrane is to impinging upon in elastic membrane
Cleaning solution rebound it is bigger to the impact force of crystal column surface in crystal column surface.
Further, flow generator structure includes pump drainage blower, and the air inlet of pump drainage blower is located in airflow chamber, pump drainage blower
Air outlet be located at outside airflow chamber, air inlet being laterally extended along airflow chamber of pump drainage blower, offer on airflow chamber's side wall into
The air inlet of air holes, air inlet hole and pump drainage blower is oppositely arranged.The indoor gas of air-flow is sucked into pump drainage wind using pump drainage blower
Machine is then exhausted from outside airflow chamber, to form lateral high-speed flow in airflow chamber.
Further, plenum member includes fluid cylinder, and piston is slidably connected in fluid cylinder, and fluid cylinder is divided into pressurization gas chamber and storage by piston
Liquid chamber, the air outlet of pump drainage blower be connected tos with pressurization gas chamber, and pressurization gas chamber is equipped with relief valve, piston be pressurized gas chamber roof it
Between be connected with elastic component, cleaning pipe is connected to fluid reservoir.The wind of the air outlet discharge of pump drainage blower enters in pressurization gas chamber, so that increasing
Indoor air pressure of calming the anger is gradually increased, extrusion piston, so that piston slides in fluid cylinder, squeezes the indoor cleaning solution of liquid storage, from
And realize the pressurization of fluid reservoir cleaning liquid inside.
Further, fluid reservoir is communicated with supplement pipeline, and supplement pipeline is equipped with supplement valve, and supplement pipeline is connected with cleaning solution
Cylinder.After the completion of wafer cleaning, since fluid reservoir cleaning liquid inside tails off, cleaning fluid cylinder can be fluid reservoir additional clean liquid, just
In the cleaning of wafer next time.
Detailed description of the invention
Fig. 1 is the positive cross-sectional view of the embodiment of the present invention, and arrow indicates the direction of motion of air-flow indoor air flow in Fig. 1.
Specific embodiment
It is further described below by specific embodiment:
Appended drawing reference in Figure of description includes: cleaning fluid cylinder 1, supplement pipeline 2, supplement valve 3, spring 4, pressurization gas
Room 5, relief valve 6, fluid reservoir 7, fluid cylinder 8, piston 80, communicating pipe 9, pump drainage blower 10, clamping piece 11, wafer 12, support base 13,
Turntable 14, motor 15, belt 16, shaft 17, sealing shroud 18, cleaning pipe 19, sprinkling ball 20, elastic membrane 21, air inlet hole 22, lid
23, airflow chamber 24.
Embodiment is substantially as shown in Fig. 1, and the present invention includes the turntable 14 for being used to support wafer 12, and 14 upper surface of turntable is set
There are four the clamping piece 11 circumferentially distributed along turntable 14, clamping piece 11 is to be supported on wafer 12 in step-like clamping piece and turn
When on disk 14, four clamping pieces 11 realize the clamping to wafer 12, and support base 13 is equipped with below turntable 14, is worn on support base 13
There is shaft 17, connected between shaft 17 and support base 13 by bearing, 17 top of shaft is fixedly connected with 14 center of turntable, is supported
13 bottoms of seat are also equipped with a motor 15, and the output shaft of motor 15 is driven with shaft 17 by belt 16.
Spraying mechanism is equipped with above turntable 14, spraying mechanism includes lid 23, elastic membrane 21 and multiple is threaded through elastic membrane
Cleaning pipe 19 on 21, lid 23 cover on support base 13, and elastic membrane 21 is located in lid 23 and is located at 14 top of turntable, lid
Airflow chamber 24 is formed between 23 and elastic membrane 21, and air inlet hole 22 is offered on the left of airflow chamber 24, pumping is installed on the right side of airflow chamber 24
Exhaust blower 10, the air inlet of pump drainage blower 10 is located in airflow chamber 24, the air outlet of pump drainage blower 10 is located at outside airflow chamber 24, and
The air inlet of pump drainage blower 10 is laterally extended along airflow chamber 24.Elastic membrane 21 is thermoplastic polyester elastomer film layer, the film layer
Resilience is good, is sealedly and fixedly connected between cleaning pipe 19 and elastic membrane 21 by sealing shroud 18, and the connection of 19 bottom of cleaning pipe is free
The sprinkling ball 20 of the heart sprays ball 20 between elastic membrane 21 and turntable 14, sprays and is densely covered with spray hole on ball 20.Cleaning pipe 19
It is also connected with plenum member, plenum member includes the fluid cylinder 8 being mounted on lid 23, and piston 80 is slidably connected in fluid cylinder 8, and piston 80 will
Fluid cylinder 8 is divided into pressurization gas chamber 5 and fluid reservoir 7, and the air outlet of pump drainage blower 10 is connected to pressurization gas chamber 5 by communicating pipe 9, is pressurized
5 right side wall of gas chamber is equipped with relief valve 6, and spring 4 is connected between piston 80 and pressurization 5 roof of gas chamber, and cleaning pipe 19 and fluid reservoir 7 connect
It is logical, it is also equipped with cleaning fluid cylinder 1 on the left of fluid reservoir 7, cleans between fluid cylinder 1 and fluid reservoir 7 and is communicated with supplement pipeline 2, supplement pipe
Road 2 is equipped with supplement valve 3.
Cleaned that detailed process is as follows to wafer 12 using the present invention:
First wafer 12 is placed on turntable 14, wafer 12 is fixed on turntable 14 using four clamping pieces 11 on turntable 14
On, supplement valve 3 and relief valve 6 are closed, pump drainage blower 10 is opened, restarts motor 15, motor 15 is by belt 16 with turn
Axis 17 rotates on support base 13, and shaft 17 drives 12 high-speed rotation of wafer on turntable 14 and turntable 14, and pump drainage blower 10 will
Air-flow in airflow chamber 24 is sucked out and is discharged into pressurization gas chamber 5, so that the air pressure in pressurization gas chamber 5 is gradually increased, extrusion piston
80, so that the slide downward in fluid cylinder 8 of piston 80, squeezes the cleaning solution in fluid reservoir 7, to realize 7 cleaning liquid inside of fluid reservoir
Pressurization, pressurized cleaning solution escapes and enter each cleaning pipe 19 from fluid reservoir 7, then from the spray hole spray on sprinkling ball 20
Onto high-speed rotating wafer 12, the cleaning solution due to being sprayed onto 12 surface of wafer is centrifuged on high-speed rotating wafer 12
The effect of power, therefore behind cleaning solution arrival 12 surface of wafer, it is opened in 12 diffusion into the surface of wafer rapidly, and formed on 12 surface of wafer
One layer of liquid film covers 12 surface of whole wafer, simultaneously because being sprayed at the cleaning solution on 12 surface of wafer by centrifugal action
And it is thrown off 12 surface of wafer rapidly, the cleaning to crystal column surface is realized in 12 surface quick sliding of wafer by liquid film,
And the high speed rotation after the completion of cleaning by wafer is also able to achieve the effect for drying cleaning solution, without to the wafer after cleaning
12 carry out subsequent drying.
Since from the cleaning solution that sprays of sprinkling ball 20, some is sprayed upwards, simultaneously because pump drainage blower 10 is by gas
Gas in flow chamber 24 sucks pump drainage blower 10, and lateral high-speed flow, the height of 21 top of elastic membrane are formed in airflow chamber 24
When fast air-flow passes through elastic membrane 21,21 vibration at high speed of energy band dynamic elasticity film, the cleaning solution sprayed upwards is struck under elastic membrane 21
Surface, by the rebound of the elastic membrane 21 of vibration at high speed, to hit the cleaning solution film on 12 surface of wafer, increase cleaning solution with
Pressure between 12 surface of wafer increases cleaning solution and wafer 12 to increase the pressure between cleaning solution and wafer 12
Between frictional force, enhance cleaning effect.
Elastic membrane 21 of the invention has the further advantage that the rebound due to cleaning solution Jing Guo elastic membrane 21 is hit in pelletized form
To 12 surface of wafer, one biggish impact force of fume of 12 surface of wafer part is given, according to the law of conservation of momentum,
Granular cleaning solution moves in the opposite direction with fume, can hit the fume of 12 surface of wafer part from crystalline substance
12 surfaces of circle, cleaning effect are good.Cleaning solution rebounds back and forth between 12 surface of elastic membrane 21 and wafer, extends the clear of cleaning solution
Wash the time.Due to be perpendicular to when the cleaning solution to be rebounded by elastic membrane 21 strikes 12 surface of wafer 12 surface of wafer or with crystalline substance
Circle 12 surfaces have an angle, can the movement to liquid film at 12 surface of wafer towards 12 edge of wafer play certain resistance
Gear effect, to further extend residence time of the cleaning solution on wafer 12.Elastic membrane 21, which is avoided that, is sprayed at 12 table of wafer
The problem of cleaning solution in face rebounds into air, causes the waste of cleaning solution.
What has been described above is only an embodiment of the present invention, and the common sense such as well known specific structure and characteristic are not made herein in scheme
Excessive description.It, without departing from the structure of the invention, can be with it should be pointed out that for those skilled in the art
Several modifications and improvements are made, these also should be considered as protection scope of the present invention, these all will not influence what the present invention was implemented
Effect and patent practicability.The scope of protection required by this application should be based on the content of the claims, in specification
The records such as specific embodiment can be used for explaining the content of claim.
Claims (5)
1. chip cleaner, it is characterised in that: the turntable including being used to support wafer, the turntable top are equipped with spraying machine
Structure, the spraying mechanism includes elastic membrane and several are threaded through the cleaning pipe in elastic membrane, and the cleaning pipe is connected with plenum member,
The cleaning pipe is communicated with hollow sprinkling ball, and the sprinkling ball gathers on the sprinkling ball between elastic membrane and turntable
There is spray hole.
2. chip cleaner according to claim 1, it is characterised in that: be additionally provided with lid above the elastic membrane, institute
It states and forms airflow chamber between lid and elastic membrane, the airflow chamber side is equipped with flow generator structure, the flow generator structure
Outgassing direction along airflow chamber transverse direction.
3. chip cleaner according to claim 2, it is characterised in that: the flow generator structure includes pump drainage wind
Machine, the air inlet of the pump drainage blower is located in airflow chamber, the air outlet of pump drainage blower is located at outside airflow chamber, the pump drainage blower
Air inlet being laterally extended along airflow chamber, air inlet hole, the air inlet hole and pump drainage blower are offered on airflow chamber's side wall
Air inlet be oppositely arranged.
4. chip cleaner according to claim 1, it is characterised in that: the plenum member includes fluid cylinder, the fluid cylinder
Piston is inside slidably connected, fluid cylinder is divided into pressurization gas chamber and fluid reservoir, the air outlet of the pump drainage blower and institute by the piston
Pressurization gas chamber connection is stated, the pressurization gas chamber is equipped with relief valve, is connected with elastic component between the piston and pressurization gas chamber roof,
The cleaning pipe is connected to the fluid reservoir.
5. chip cleaner according to claim 4, it is characterised in that: the fluid reservoir is communicated with supplement pipeline, mends
It fills pipeline and is equipped with supplement valve, the supplement pipeline is connected with cleaning fluid cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811624506.4A CN109712915B (en) | 2018-12-28 | 2018-12-28 | Chip dust removal equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811624506.4A CN109712915B (en) | 2018-12-28 | 2018-12-28 | Chip dust removal equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109712915A true CN109712915A (en) | 2019-05-03 |
| CN109712915B CN109712915B (en) | 2020-08-21 |
Family
ID=66259238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811624506.4A Active CN109712915B (en) | 2018-12-28 | 2018-12-28 | Chip dust removal equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109712915B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110114113A1 (en) * | 2009-11-18 | 2011-05-19 | Tokyo Electron Limited | Substrate processing apparatus, cleaning method thereof and storage medium storing program |
| CN103707179A (en) * | 2012-10-03 | 2014-04-09 | 株式会社荏原制作所 | Substrate cleaning apparatus and polishing apparatus |
| CN108568419A (en) * | 2018-03-30 | 2018-09-25 | 昆山国显光电有限公司 | Basal plate cleaning system and cleaning method |
-
2018
- 2018-12-28 CN CN201811624506.4A patent/CN109712915B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110114113A1 (en) * | 2009-11-18 | 2011-05-19 | Tokyo Electron Limited | Substrate processing apparatus, cleaning method thereof and storage medium storing program |
| CN103707179A (en) * | 2012-10-03 | 2014-04-09 | 株式会社荏原制作所 | Substrate cleaning apparatus and polishing apparatus |
| CN108568419A (en) * | 2018-03-30 | 2018-09-25 | 昆山国显光电有限公司 | Basal plate cleaning system and cleaning method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109712915B (en) | 2020-08-21 |
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