CN109705790B - Bonding and stripping method of electronic equipment - Google Patents
Bonding and stripping method of electronic equipment Download PDFInfo
- Publication number
- CN109705790B CN109705790B CN201811633719.3A CN201811633719A CN109705790B CN 109705790 B CN109705790 B CN 109705790B CN 201811633719 A CN201811633719 A CN 201811633719A CN 109705790 B CN109705790 B CN 109705790B
- Authority
- CN
- China
- Prior art keywords
- bonding
- adhesive
- vinyl acetate
- stripping
- ethylene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention provides an adhesion and stripping method of electronic equipment, which is used for adhering and stripping a first adhesion part and a second adhesion part of the electronic equipment through a UV adhesive, wherein the UV adhesive can be cured through ultraviolet irradiation to adhere an object and can be used for stripping the object through heating. The bonding method comprises the step of applying pressure at a low temperature of 60-70 ℃ for curing under the irradiation of ultraviolet light, and the stripping method comprises the step of blowing and heating at 100-110 ℃ for stripping. In the bonding step, the thermoplastic components are locked through UV glue solidification to form a firm bonding effect; in the stripping step, the thermoplastic component is heated to destroy the crystal lattices of the UV adhesive, so that the whole adhesive layer can be stripped at one time, no residual adhesive is left on the stripped surface, and a perfect stripping effect can be obtained.
Description
Technical Field
The present invention relates to a method for adhering a screen or a case of an electronic device such as a mobile phone, and more particularly, to a method for adhering and peeling a screen or a case of an electronic device.
Background
The screens or shells of electronic devices such as mobile phones, tablet computers and portable notebook computers are mostly required to be bonded by glue, so that the waterproof property of the connecting part is ensured. As electronic devices are increasingly designed to be light and thin, screens and casings of the electronic devices are particularly prone to being broken, and the screens or casings in the bonding mode are very difficult to disassemble and separate.
In order to solve the above technical problems, the prior art has a kind of materials capable of being repeatedly hot-melt bonded, which can be bonded by heating or disassembled and peeled by heating. For example, CN103781869A discloses an adhesive composition which can be prepared in the form of a tape sandwiched between two members, which is bonded by heating the tape by laser irradiation to impart tackiness to the tape, and which can also be heated by laser irradiation to reduce tackiness to cause peeling of the two members. Wherein the adhesive composition is provided between a first member and a second member having light transmittance, and is heated and softened by irradiation heat of laser light irradiated to a pattern layer provided in the first member, the adhesive composition containing a styrene-butadiene-styrene copolymer and a terpene-based tackifier; the terpene tackifier is contained in an amount of 60 parts by weight or less, and the diblock component in the styrene-butadiene-styrene copolymer is 40 parts by weight or more and 60 parts by weight or less, when the styrene-butadiene-styrene copolymer is contained in 100 parts by weight. Similarly, CN 102161233B discloses a method of joining a first member and a second member having optical transparency with laser, wherein, of the first member and the second member, at least one member is made of a material having laser transparency; providing a laser non-transmissive pattern layer on at least one of the first and second members such that a pattern is presented on an outer side of the first member; providing, between the first member and the second member, an intermediate member for laser bonding for bonding the first member and the second member adjacent to the pattern layer; the intermediate member is heated by the heat of the pattern layer by irradiating the laser beam, which heats the pattern layer to a predetermined temperature not exceeding the melting or decomposition temperature of the pattern layer, toward the pattern layer from the member side having laser transmissivity, and the first member and the second member are joined. The intermediate member for laser bonding mentioned in the prior art is a material similar to the laser bonding glue mentioned in the prior art CN103781869a, such as an adhesive of rubber, acrylic, urethane, silicon, etc., or a thermoplastic elastomer such as styrene elastomer, olefin elastomer, polyester elastomer, vinyl chloride elastomer, polyamide elastomer, polybutadiene elastomer, isoprene elastomer, ion beam and amorphous polyethylene elastomer, chlorinated polyethylene and amorphous polyethylene elastomer, fluorine elastomer, polyurethane elastomer, acrylic elastomer.
However, when the laser-bonded adhesive of the prior art is applied to an electronic device, the electronic device intermittently generates heat and cools during use, so that the adhesive tends to be repeatedly bonded and peeled locally at a position close to a heat source (e.g., a CPU), which is prone to a degumming phenomenon during use, and the connection performance is unreliable. Moreover, because such materials are hot-melt bonded, the viscosity increases after heating, a large amount of residual glue is left on the bonded surface after the bonded object is separated, scraping or repeated wiping and removing by using a solvent after cooling is often needed, the operation is very labor-consuming, and the reworking or maintenance efficiency is not high.
In view of the above-mentioned drawbacks of the prior art, there is a need in the market for a method for adhering and peeling a screen and a housing of an electronic device, which can be easily disassembled and peeled while satisfying excellent adhesion strength.
Disclosure of Invention
The technical problem underlying the present invention is to provide a method for bonding and peeling off an electronic device, which reduces or avoids the aforementioned problems.
In order to solve the technical problems, the invention provides an adhesion and stripping method of electronic equipment, which is used for adhering and stripping a first adhesion part and a second adhesion part of the electronic equipment through a UV adhesive, wherein the UV adhesive is composed of a UV adhesive and an ethylene-vinyl acetate copolymer, wherein the UV adhesive contains one or the combination of epoxy acrylate resin, polyurethane resin, polyacrylate resin, polyether acrylate resin and polyurethane acrylic resin; the mass percentage of the ethylene-vinyl acetate copolymer is 30-40% of that of the UV adhesive, and preferably 35%; the bonding method comprises the following steps: uniformly coating the UV adhesive on the surfaces to be bonded of a first bonding component and a second bonding component, overlapping the first bonding component and the second bonding component, pressing the first bonding component and the second bonding component on an operation table by using a transparent pressing plate, irradiating by using ultraviolet light, and blowing hot air at 60-70 ℃; and (4) curing the product for 10-60 seconds by using ultraviolet light, removing the pressing plate, removing the product from the operating table, and recovering the product to room temperature for storage. The peeling method comprises the following steps: blowing air to the bonding surfaces of the first bonding part and the second bonding part and heating to 100-110 ℃; sucking one side of the first bonding component or the second bonding component by a sucker to separate the bonded surfaces of the first bonding component and the second bonding component; and cooling the UV adhesive glue layer between the bonded surfaces to be below 75 ℃, and completely stripping the glue layer from the whole bonded surfaces by using tweezers.
Preferably, the mass percentage of the vinyl acetate polymer contained in the ethylene-vinyl acetate copolymer is 20-40%.
Preferably, the ethylene-vinyl acetate copolymer is EVA 230 of dupont, usa, and the mass percentage of the contained vinyl acetate polymer is 28%.
Preferably, the curing temperature of the UV adhesive under the irradiation of ultraviolet light is 60-70 ℃.
Preferably, the heating stripping temperature of the UV adhesive is 100-110 ℃.
Preferably, the first adhesive member or the second adhesive member is a light-permeable object.
In the bonding step, the thermoplastic components are locked through UV glue solidification to form a firm bonding effect; in the stripping step, the thermoplastic component is heated to destroy the crystal lattices of the UV adhesive, so that the whole adhesive layer can be stripped at one time, no residual adhesive is left on the stripped surface, and a perfect stripping effect can be obtained.
Detailed Description
Hereinafter, the present invention will be described in detail by way of specific embodiments thereof in order to more clearly understand the technical features, objects and effects of the present invention.
Based on the defects of the prior art in the background art, the invention provides an adhering and peeling method of electronic equipment, which is particularly suitable for adhering and peeling a screen or a shell of the electronic equipment. The bonding and stripping method of the electronic equipment is used for bonding and stripping the first bonding part and the second bonding part of the electronic equipment through the UV adhesive. The electronic device can be a mobile phone, a tablet computer, a portable notebook computer and the like, the first bonding part can be a display screen or a rear body of the electronic device, and the second bonding part can be a glass cover plate or a glass rear cover matched with the first bonding part.
The UV adhesive used in the application is a specially improved UV adhesive based on the existing UV adhesive, and can be used for bonding an object after being cured in an ultraviolet irradiation mode and peeling the object in a heating mode.
In the latest consumer brand, the screen or the glass shell of the electronic device is mostly bonded by using UV glue. The UV glue is also called shadowless glue or ultraviolet glue, and is a single-component UV visible light curing modified acrylate structural glue. UV is an abbreviation for Ultraviolet Rays, the term UV light. Ultraviolet (UV) radiation is invisible to the naked eye and is a segment of electromagnetic radiation other than visible light, with wavelengths in the range of 10-400 nm. It refers to a type of adhesive that must be cured by irradiation with ultraviolet light. The curing principle of the UV adhesive is that a photoinitiator (or photosensitizer) in a UV curing material generates active free radicals or cations after absorbing ultraviolet light under the irradiation of ultraviolet rays, and initiates the chemical reactions of monomer polymerization, crosslinking and grafting, so that the adhesive is converted from a liquid state to a solid state within several seconds. The UV adhesive has the advantages of high bonding strength, high transparency, no yellowing, no whitening, good weather resistance, moderate viscosity, higher bonding strength for plastics and metals, good application effect on bonding, reinforcing and reinforcing of metals and various plastics such as PMMA, PC, ABS, PVC and the like, and wide application in industries such as microelectronics, optical communication, photoelectricity, medical treatment, home furnishing, aerospace and the like.
That is to say, the screen and the glass casing of the existing electronic device are bonded by using the UV glue, the bonding strength is high, and the screen and the glass casing can be cured only by irradiating through an ultraviolet lamp. However, bonding with UV glue has a significant drawback in that the curing of the UV glue is irreversible. After the casing of the electronic device is irradiated with the UV glue by the ultraviolet light, although a good bonding strength can be obtained, it is very difficult to disassemble and rework, and the cured UV glue cannot be softened by heating or the like. When a screen or a shell is broken, broken glass needs to be scratched off little by little through external force, so that a lot of labor hours are needed, scratches are easily left after the external force is forcedly stripped, and a display part can be permanently damaged when the scratch is serious, so that the machine dismantling failure is easily caused.
Based on the characteristics of the existing UV glue, the UV adhesive is particularly improved, the UV adhesive can be solidified and bonded in an ultraviolet irradiation mode like the existing UV glue, and compared with the prior art, the bonding method basically has no change, and is easy to operate and master. Compared with the non-strippable UV adhesive in the prior art, the UV adhesive can be heated and stripped at a lower temperature, so that the operation time can be greatly saved, and the reworking maintenance efficiency is improved.
In one embodiment of the present application, the UV adhesive of the present application is composed of a UV adhesive containing one or a combination of epoxy acrylate resin, polyurethane resin, polyacrylate resin, polyether acrylate resin, polyurethane acrylic resin, and ethylene-vinyl acetate copolymer; the mass percentage of the ethylene-vinyl acetate copolymer is 30-40% of that of the UV adhesive, and preferably 35%.
The main component of the UV adhesive is also the UV adhesive, but the ethylene-vinyl acetate copolymer accounting for 30-40% of the total mass is added into the UV adhesive. Ethylene-vinyl acetate copolymer, EVA for short, is a chemical raw material widely used in the fields of foamed shoe materials, functional greenhouse films, packaging molds, hot melt adhesives, wires and cables, toys and the like, and can be easily purchased from the market by technicians in the field. For example, in one embodiment of the present application, the ethylene vinyl acetate copolymer may be EVA 230 from dupont, usa, which contains 28% by weight of vinyl acetate polymer.
The UV adhesive used in the present application may be any commercially available UV adhesive, for example, ND-5204MJ series UV adhesive available from Nano photonics chemical company, waterproof UV adhesive disclosed in Chinese patent document CN 105505287A, or UV adhesive disclosed in Chinese patent document CN 106281057A may be used.
Particularly preferably, the UV glue of the UV adhesive of the present application contains one of epoxy acrylate resin, polyurethane resin, polyacrylate resin, polyether acrylate resin, polyurethane acrylic resin or a combination thereof. Namely, the ethylene-vinyl acetate copolymer of the UV adhesive is easily soluble in the ester compounds, and the UV adhesive containing epoxy acrylate resin, polyurethane resin, polyacrylate resin, polyether acrylate resin and polyurethane acrylic resin is adopted, so that the dosage of the solvent can be reduced, the influence of volatile substances on the environment can be avoided, the cost input of harmless treatment equipment in the production link can be reduced, and the production cost is reduced.
Further, in order to improve the adhesion performance, the mass percentage of the vinyl acetate polymer contained in the ethylene-vinyl acetate copolymer is preferably 20-40%, and the ethylene-vinyl acetate copolymer in the proportion range can obtain better toughness, impact resistance, filler compatibility and heat sealing performance under the condition of dissolving the ester-containing UV adhesive in the application due to the introduction of a certain proportion of the vinyl acetate monomer into the molecular chain.
In yet another embodiment, the UV adhesive is preferably used to bond objects that are transparent on at least one side, such as a glass cover plate that can be used to bond a screen surface, or to bond a peel-off back cover of an electronic device such as a cell phone, etc., to facilitate irradiation of the underlying UV adhesive of the present application through the glass to facilitate curing thereof.
In addition, since the UV adhesive of the present application is added with the ethylene-vinyl acetate copolymer having excellent hot-melt adhesive property, in order to improve the adhesion firmness, it is preferable to apply a certain pressure (pressure curing) to both sides of the adhered object to eliminate air bubbles while maintaining the surface temperature of the adhered object at 60-70 degrees celsius (infrared laser irradiation of the surface of the object or hot air blowing from the operation table) when irradiating with ultraviolet light. And (4) curing the product for 10-60 seconds by using ultraviolet light, removing the pressing plate, removing the product from the operating table, and recovering the product to room temperature for storage.
Further, the biggest characteristic of the present application compared with the prior art is that the UV adhesive of the present application can peel off the bonded object under the condition of heating to 100-. Namely, the heating and peeling temperature of the UV adhesive is 100-110 ℃.
That is, the ordinary UV glue has irreversible lattice solidification, the UV glue is tightly infiltrated into the surface of the object to be bonded, and after being irradiated by ultraviolet light, a firm lattice structure is formed with the surface to be bonded, and the lattice structure cannot be softened and recrystallized by heating, and can only be used once. Due to the characteristic of the common UV glue, objects bonded by the UV glue are difficult to disassemble and peel, and rework or maintenance is very difficult. However, it is this feature that also provides additional advantages to the present application.
For example, there are also known a type of repeatedly hot-melt-bondable substance that can be bonded by heating or detached by heating. However, when such a substance is applied to an electronic device, since the electronic device intermittently generates heat and cools during use, a tendency of repeated local adhesion and peeling occurs at a position close to a heat source (e.g., CPU), a phenomenon of adhesive failure easily occurs during use, and the connection performance is not reliable. Moreover, because such materials are hot-melt bonded, the viscosity increases after heating, a large amount of residual glue is left on the bonded surface after the bonded object is separated, scraping or repeated wiping and removing by using a solvent after cooling is often needed, the operation is very labor-consuming, and the reworking or maintenance efficiency is not high.
According to the UV adhesive, the ethylene-vinyl acetate copolymer accounting for 30-40% of the total mass is added into the UV adhesive, the UV adhesive and the ethylene-vinyl acetate copolymer are fully mixed, the UV adhesive components are cured through ultraviolet light, meanwhile, the hot melting curing process at 60-70 ℃ is assisted, and the UV adhesive components and the ethylene-vinyl acetate copolymer jointly form a firm bonding structure. When disassembly is needed, although the lattice strength of the UV adhesive after curing is very high and cannot be peeled off by hot melting, the ethylene-vinyl acetate copolymer cured by the lattice has excellent hot melting performance, and the volume expansion of the ethylene-vinyl acetate copolymer can damage the lattice structure of the UV adhesive component at the temperature of 100-110 ℃, so that the adhesion failure of the UV adhesive component is caused. The ethylene-vinyl acetate copolymer which breaks through the lattice limitation is in a molten state, so that the whole adhesive layer can be easily stripped off from the surface of the bonded object at one time, almost no residual adhesive is left, and the operation is very simple and convenient.
On the other hand, when the temperature is lower than the stripping temperature of 100-110 ℃, the lattice structure of the UV adhesive component can lock the ethylene-vinyl acetate copolymer, and under the condition that the lattice is not damaged, the UV adhesive cannot lose effectiveness, so that the phenomenon of degumming on electronic equipment is avoided, and the bonding performance is very reliable.
Moreover, when the UV adhesive is disassembled, the UV adhesive components are still in a solid state, although the ethylene-vinyl acetate copolymer is in a molten state, the UV adhesive components are mixed with the ethylene-vinyl acetate copolymer into a whole, so that all the adhesive layers form a whole, and the whole adhesive layers can be stripped off from the surface of an adhered object at one time like a soaked cloth piece, the residual adhesive is less, the subsequent operation is very easy, and the reworking and maintenance efficiency is greatly improved. Moreover, due to the irreversible characteristic of the UV adhesive component in the UV adhesive after curing, after the UV adhesive is subjected to heating stripping operation, the proportion of the ethylene-vinyl acetate copolymer locked by most parts on the adhered surface is very small, the adhesive force is not strong, when the temperature is reduced to be below 75 ℃, the ethylene-vinyl acetate copolymer after re-curing and the failed UV adhesive component form a whole, the whole adhesive layer can be easily stripped from the adhered surface, any residual adhesive cannot be left on the stripped surface, and a perfect stripping effect can be obtained. That is, in one embodiment of the present application, after the bonded objects are separated by heating to 100-.
The components, preparation method, application scenario, application method and the like of the UV adhesive of the present application are specifically described below.
Example 1
The components are as follows:
60 parts of UV adhesive, namely ND-5204MJ series UV adhesive of Nano photonics chemical company;
40 parts by weight of ethylene-vinyl acetate copolymer, EVA 230 from DuPont, USA, wherein the mass percent of the contained vinyl acetate polymer is 28%.
The preparation method comprises the following steps:
and crushing the ethylene-vinyl acetate copolymer into 50 meshes, adding the crushed ethylene-vinyl acetate copolymer into the UV adhesive, stirring at the temperature of 60 ℃ to completely dissolve the ethylene-vinyl acetate copolymer into the UV adhesive, removing bubbles, preserving heat and standing for 60 minutes to obtain the curable ultraviolet adhesive.
Application scenarios:
and (4) adhering a mobile phone screen glass cover plate. The mobile phone screen is a first bonding part, and the glass cover plate is a second bonding part.
The bonding method comprises the following steps:
and uniformly coating the UV adhesive on the surfaces to be bonded of the first bonding component and the second bonding component, and overlapping the first bonding component and the second bonding component. For example, the UV adhesive is uniformly coated on the surface of the mobile phone screen, and the glass cover plate covers the mobile phone screen. Pressing the first bonding part and the second bonding part on an operation table by using a transparent pressing plate, irradiating by using ultraviolet light, and blowing hot air at 60 ℃; and (4) curing by ultraviolet light for 10 seconds, removing the pressing plate, removing the product from the operating table, and returning to room temperature for storage.
Tests show that the 180-degree stripping adhesion force of the glass cover plate stripped from the surface of the mobile phone screen at 25 ℃ is more than 20N/25mm, and the adhesion interface cannot be damaged and cannot be stripped at all.
The disassembling and stripping method comprises the following steps:
blowing air to the bonding surfaces of the first bonding component and the second bonding component and heating to 100 ℃; sucking the first adhesive part or the second adhesive part with a sucking disc to separate the adhered surfaces. For example, the glass cover plate is heated to 100 ℃ by blowing air; and sucking the glass cover plate by using a sucking disc to separate the glass cover plate from the mobile phone screen. And then cooling the UV adhesive glue layer between the bonded surfaces to be below 75 ℃, and completely stripping the whole glue layer from the bonded surfaces by using tweezers.
Tests show that the 180-degree stripping adhesion force of the glass cover plate stripped from the surface of the mobile phone screen is more than 5N/25mm at 100 ℃, the adhesion interface is thoroughly destroyed, and the glass cover plate is completely stripped.
Example 2
The components are as follows:
70 parts of UV glue; 30 parts of ethylene-vinyl acetate copolymer.
The UV adhesive consists of resin, a monomer and a photoinitiator. The resin comprises one of epoxy acrylate resin, polyurethane resin, polyacrylate resin, polyether acrylate resin and polyurethane acrylic resin or the combination of the epoxy acrylate resin, the polyurethane resin and the polyurethane acrylic resin. The monomers include monofunctional monomers (IBOA, IBOMA, HEMA, etc.), difunctional monomers (TPGDA, HDDA, DEGDA, NPGDA, etc.), trifunctional or multifunctional monomers (TMPTA, PETA, etc.); the initiator comprises benzophenone.
The ethylene-vinyl acetate copolymer was EVA 220 (DuPont, USA) with a vinyl acetate polymer content of 28 wt%.
The preparation method comprises the following steps:
and (2) crushing the ethylene-vinyl acetate copolymer into 100 meshes, adding the crushed ethylene-vinyl acetate copolymer into the UV glue, stirring at the temperature of 70 ℃ to completely dissolve the ethylene-vinyl acetate copolymer into the UV glue, removing bubbles, preserving heat and standing for 120 minutes to obtain the curable ultraviolet adhesive.
Application scenarios:
and (4) bonding the rear cover of the mobile phone glass. The rear body of the mobile phone is a first bonding part, and the rear cover of the glass is a second bonding part.
The bonding method comprises the following steps:
and uniformly coating the UV adhesive on the surfaces to be bonded of the first bonding component and the second bonding component, and overlapping the first bonding component and the second bonding component. For example, the UV adhesive is uniformly applied to the surface of the rear part of the mobile phone, and the rear cover of the glass covers the rear part of the mobile phone. Pressing the first bonding component and the second bonding component on an operation table by using a transparent pressing plate, irradiating by using ultraviolet light, and blowing hot air at 70 ℃; and (4) curing by ultraviolet light for 60 seconds, removing the pressing plate, and moving the product out of the operating table to return to room temperature for storage.
Tests show that the 180-degree stripping adhesion force of the glass cover plate stripped from the surface of the mobile phone screen at 25 ℃ is more than 20N/25mm, and the adhesion interface cannot be damaged and cannot be stripped at all.
The disassembling and stripping method comprises the following steps:
blowing air to the bonding surfaces of the first bonding part and the second bonding part and heating to 110 ℃; sucking the first adhesive part or the second adhesive part with a sucking disc to separate the adhered surfaces. For example, the glass cover plate is heated to 110 ℃ by blowing; and sucking the glass cover plate by using a sucking disc to separate the glass cover plate from the mobile phone screen. And then cooling the UV adhesive glue layer between the bonded surfaces to be below 75 ℃, and completely stripping the whole glue layer from the bonded surfaces by using tweezers.
Tests show that the 180-degree stripping adhesion force of the glass cover plate stripped from the surface of the mobile phone screen is more than 5N/25mm at 100 ℃, the adhesion interface is thoroughly destroyed, and the glass cover plate is completely stripped.
Example 3
The components are as follows:
65 parts of UV glue; 35 parts of ethylene-vinyl acetate copolymer.
The UV adhesive is composed of resin, a monomer and a photoinitiator. The resin comprises 20-40 parts by weight of epoxy acrylate resin and 15-35 parts by weight of polyacrylate resin. The monomer is hydroxypropyl methacrylate 10-25 weight parts and isobornyl acrylate 10-25 weight parts; the initiator is 1-5 parts by weight of 1-hydroxycyclohexyl phenyl ketone.
The ethylene-vinyl acetate copolymer was EVA 150 (DuPont, USA), wherein the mass percentage of the vinyl acetate polymer contained therein was 33%.
The preparation method comprises the following steps:
and crushing the ethylene-vinyl acetate copolymer into 80 meshes, adding the crushed ethylene-vinyl acetate copolymer into the UV adhesive, stirring at the temperature of 65 ℃ to completely dissolve the ethylene-vinyl acetate copolymer into the UV adhesive, removing bubbles, preserving heat and standing for 100 minutes to obtain the curable ultraviolet adhesive.
Application scenarios:
and (4) bonding the flat computer screen glass cover plate. The screen of the tablet computer is a first bonding part, and the rear cover of the glass is a second bonding part.
The bonding method comprises the following steps:
and uniformly coating the UV adhesive on the surfaces to be bonded of the first bonding component and the second bonding component, and overlapping the first bonding component and the second bonding component. For example, the UV adhesive is uniformly applied to the surface of the tablet computer screen, and the glass rear cover covers the tablet computer screen. Pressing the first bonding part and the second bonding part on an operation table by using a transparent pressing plate, irradiating by using ultraviolet light, and blowing hot air at 65 ℃; and (4) curing the product by ultraviolet light for 30 seconds, removing the pressing plate, and moving the product out of the operating table to return to room temperature for storage.
Tests show that at 25 ℃, the 180-degree stripping adhesion force of the glass rear cover for stripping from the surface of the screen of the flat computer is more than 20N/25mm, and the adhesion interface cannot be damaged and cannot be stripped at all.
The disassembling and stripping method comprises the following steps:
blowing air to the bonding surfaces of the first bonding part and the second bonding part and heating to 105 ℃; sucking the first adhesive part or the second adhesive part with a sucking disc to separate the adhered surfaces. For example, the glass rear cover is heated to 105 ℃ by blowing; and sucking the glass rear cover by using a sucking disc to separate the glass rear cover from the screen of the tablet computer. And then cooling the UV adhesive glue layer between the bonded surfaces to be below 75 ℃, and completely stripping the whole glue layer from the bonded surfaces by using tweezers.
Tests show that the 180-degree stripping adhesion force of the glass rear cover stripped from the surface of the screen of the flat computer is more than 5N/25mm at 100 ℃, the adhesion interface is thoroughly damaged and stripped completely.
In conclusion, in the bonding step, the thermoplastic components are locked through UV glue curing to form a firm bonding effect; in the stripping step, the thermoplastic component is heated to destroy the crystal lattices of the UV adhesive, so that the whole adhesive layer can be stripped at one time, no residual adhesive is left on the stripped surface, and a perfect stripping effect can be obtained.
It should be appreciated by those of skill in the art that while the present invention has been described in terms of several embodiments, not every embodiment includes only a single embodiment. The description is given for clearness of understanding only, and it is to be understood that all matters in the embodiments are to be interpreted as including technical equivalents which are related to the embodiments and which are combined with each other to illustrate the scope of the present invention.
The above description is only an exemplary embodiment of the present invention, and is not intended to limit the scope of the present invention. Any equivalent alterations, modifications and combinations can be made by those skilled in the art without departing from the spirit and principles of the invention.
Claims (4)
1. A method for bonding and stripping electronic equipment is used for bonding and stripping a first bonding part and a second bonding part of the electronic equipment through a UV adhesive, wherein the UV adhesive is composed of a UV adhesive containing one or a combination of epoxy acrylate resin, polyurethane resin, polyacrylate resin, polyether acrylate resin and polyurethane acrylic resin and an ethylene-vinyl acetate copolymer; wherein the ethylene-vinyl acetate copolymer accounts for 30-40% of the UV adhesive in percentage by mass; the method is characterized in that: the bonding method comprises the following steps: uniformly coating the UV adhesive on the surfaces to be bonded of a first bonding component and a second bonding component, overlapping the first bonding component and the second bonding component, pressing the first bonding component and the second bonding component on an operation table by using a transparent pressing plate, irradiating by using ultraviolet light, and blowing hot air at 60-70 ℃; the ultraviolet curing time is 10-60 seconds, then the pressing plate is removed, and the product is moved out of the operation table and restored to room temperature for storage; the peeling method comprises the following steps: blowing air to the bonding surfaces of the first bonding part and the second bonding part and heating to 100-110 ℃; sucking one side of the first bonding part or the second bonding part by using a sucking disc to separate the bonded surfaces of the first bonding part and the second bonding part; and cooling the UV adhesive glue layer between the bonded surfaces to be below 75 ℃, and completely stripping the glue layer from the whole bonded surfaces by using tweezers.
2. The bonding and peeling method according to claim 1, wherein the ethylene-vinyl acetate copolymer contains 20 to 40 mass% of a vinyl acetate polymer.
3. The bonding and peeling method according to claim 2, wherein the ethylene-vinyl acetate copolymer is EVA 230 of dupont, usa, and contains a vinyl acetate polymer in a mass percentage of 28%.
4. The bonding and release method according to claim 1, wherein the first bonding member or the second bonding member is a light-permeable object.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811633719.3A CN109705790B (en) | 2018-12-29 | 2018-12-29 | Bonding and stripping method of electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811633719.3A CN109705790B (en) | 2018-12-29 | 2018-12-29 | Bonding and stripping method of electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109705790A CN109705790A (en) | 2019-05-03 |
| CN109705790B true CN109705790B (en) | 2021-07-27 |
Family
ID=66259316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811633719.3A Active CN109705790B (en) | 2018-12-29 | 2018-12-29 | Bonding and stripping method of electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109705790B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114109984A (en) * | 2020-08-31 | 2022-03-01 | 北京小米移动软件有限公司 | Electronic device |
| CN113791503A (en) * | 2021-09-13 | 2021-12-14 | 信利光电股份有限公司 | Method for removing hot melt adhesive in LCD blind hole |
| CN119114534A (en) * | 2024-11-12 | 2024-12-13 | 浙江摩克激光智能装备有限公司 | Method for selectively removing transparent coating on surface of workpiece by laser scanning |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101454418A (en) * | 2006-06-21 | 2009-06-10 | 日立化成高分子株式会社 | Thermally conductive thermoplastic adhesive composition |
| CN102909937A (en) * | 2012-10-19 | 2013-02-06 | 合肥工业大学 | Thermo-plastic hot-melt-adhesive active disassembling structure and disassembling method |
| CN103820043A (en) * | 2014-02-27 | 2014-05-28 | 深圳市友联亨达光电有限公司 | UV curing-type thermal-melt optical clear adhesive (TOCA) and bonding method |
| CN104812858A (en) * | 2012-08-20 | 2015-07-29 | 汉高股份有限公司 | Liquid optically clear photo-curable adhesive for display application |
-
2018
- 2018-12-29 CN CN201811633719.3A patent/CN109705790B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101454418A (en) * | 2006-06-21 | 2009-06-10 | 日立化成高分子株式会社 | Thermally conductive thermoplastic adhesive composition |
| CN104812858A (en) * | 2012-08-20 | 2015-07-29 | 汉高股份有限公司 | Liquid optically clear photo-curable adhesive for display application |
| CN102909937A (en) * | 2012-10-19 | 2013-02-06 | 合肥工业大学 | Thermo-plastic hot-melt-adhesive active disassembling structure and disassembling method |
| CN103820043A (en) * | 2014-02-27 | 2014-05-28 | 深圳市友联亨达光电有限公司 | UV curing-type thermal-melt optical clear adhesive (TOCA) and bonding method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109705790A (en) | 2019-05-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109705790B (en) | Bonding and stripping method of electronic equipment | |
| KR101917266B1 (en) | Method for manufacturing double-sided adhesive sheet for image display device | |
| KR101483385B1 (en) | Method of manufacturing image display device | |
| CN102869736B (en) | Adhesive composite | |
| KR101975622B1 (en) | Method of manufacturing image display device | |
| CN103756600A (en) | Method for producing laminate for configuring image display device, and image display device using the same | |
| CN103228751A (en) | Adhesive composition for touch panel, adhesive film, and touch panel | |
| CN103582908A (en) | Method for manufacturing image display device | |
| CN104937059A (en) | Transparent double-sided adhesive sheet, laminate obtained using same for constituting image display device, process for producing said laminate, and image display device obtained using said laminate | |
| CN109722199B (en) | UV adhesive capable of being peeled off in heating mode and preparation method thereof | |
| CN104272370B (en) | The manufacture method of image display device | |
| KR20170086514A (en) | Photocurable resin composition | |
| KR101400554B1 (en) | Doble sided adhesive tape | |
| JP2012188595A (en) | Method for producing optical device, optical double-sided pressure-sensitive adhesive tape, and optical member and optical device having optical double-sided pressure-sensitive adhesive tape | |
| KR101667000B1 (en) | Composition and adhesive | |
| CN108072923A (en) | Cascade optics thin film and image display device | |
| CN109796883A (en) | Bonding film and the optical device for using the bonding film | |
| KR101432886B1 (en) | Adhesive composition having improved rework properties in high temperature | |
| JP2010077384A (en) | Curable composition, and film laminate | |
| CN109666415A (en) | A kind of UV adhesive tape for electronic equipment heating removing | |
| KR102435111B1 (en) | Assembly processes using uv curable pressure sensitive adhesives (psa) or stageable psa systems | |
| JP2016056244A (en) | Transparent adhesive film | |
| TWI854305B (en) | Enhanced thermal release adhesive material, structure thereof and manufacturing method thereof | |
| JP2003105043A (en) | Photocurable composition | |
| JP2004326042A (en) | Sticker protecting agent for glass polishing |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |