CN109705790A - The bonding and stripping means of a kind of electronic equipment - Google Patents
The bonding and stripping means of a kind of electronic equipment Download PDFInfo
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- CN109705790A CN109705790A CN201811633719.3A CN201811633719A CN109705790A CN 109705790 A CN109705790 A CN 109705790A CN 201811633719 A CN201811633719 A CN 201811633719A CN 109705790 A CN109705790 A CN 109705790A
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Abstract
The invention proposes the bonding of a kind of electronic equipment and stripping means, for the first adhering part of electronic equipment and the second adhering part to be bonded and are removed by UV adhesive, sticky object after the UV adhesive can be solidified by way of ultraviolet light, and object can be removed by way of heating.Wherein adhering method includes 60-70 degrees Celsius of the low temperature solidification that press under ultraviolet light, and the stripping means includes 100-110 degrees Celsius of removing of blowing heating.Bonding step of the invention locks thermoplastic composition by UV adhesive curing and forms firm adhesive effect；Strip step makes UV glue lattice damage by heating thermoplastic ingredient, entire glue-line can disposably be removed, and being stripped surface will not leave any residue glue, can obtain perfect peeling effect.
Description
Technical field
The present invention relates to the methods of the screen of the electronic equipment for being bonded such as mobile phone etc or shell, especially one
The screen of kind electronic equipment or the bonding and stripping means of shell.
Background technique
The screen or shell of the electronic equipments such as mobile phone, tablet computer, portable notebook computer are needed mostly using glue
Water bonding, to guarantee the waterproofness of coupling part.As electronic equipment becomes more and more popular thin design, lead to these thin designs
Electronic equipment screen and shell be particularly easy to be crushed, using the screen or shell of bonding way be very difficult to dismantling point
From.
In order to solve the above technical problems, the prior art exist it is a kind of can hot melt adhesion repeatedly substance, can be by adding
The mode of heat is bonded, and removing can also be disassembled by way of heating.For example, CN103781869A discloses a kind of binder group
Object is closed, which can be prepared into adhesive tape form clamping between the two parts, make glue by laser irradiation heating
It is sticky to which described two parts bondings get up with generating, and two portions can be made by laser irradiation heating reduction viscosity
Part is peeling-off.Wherein, the adhesive composition is arranged between the first component and second component with translucency, and by
It exposes to the irradiation heat heating of the laser for the pattern layer that the first component has and softens, the adhesive composition contains benzene
Ethylene-butadiene-styrene copolymer and terpenes tackifier；When the content of styrene-butadiene-styrene is
When 100 parts by weight, the content of the terpenes tackifier is in 60 parts by weight hereinafter, in styrene-butadiene-styrene
Diblock ingredient be more than or equal to 40 parts by weight and less than 60 parts by weight.Similar, 102161233 B of CN discloses a kind of use
Laser is to the first component and the method that is engaged of second component with translucency, wherein in the first component and described
In second component, at least one component is made of the material with laser-transmissible；In the first component and second described
Laser non-permeable pattern layer is set at least one component in part so that pattern is presented on the outside of the first component；Institute
It states between the first component and second component, is adjacent to the pattern layer and is arranged for the first component and the second component
The laser engagement intermediate member engaged；It is irradiated from the component side with laser-transmissible towards the pattern layer
For the pattern layer to be heated to becoming the laser no more than the melting of the pattern layer or the predetermined temperature of decomposition temperature, this is utilized
Intermediate member described in the heat of pattern layer engages the first component and the second component.Wherein, this is existing
The laser engagement referred in technology is that the laser referred in aforementioned 103781869 A of prior art CN combines with intermediate member
The bonding agents such as the similar material of glue, such as rubber, acrylic compounds, carbamates, silicon class, or such as phenylethylene bullet
Property body, olefin type elastomer, polyester elastomer, polyvinyl chloride-base elastomer, polyamide-based elastomer, polybutadiene elasticity
Body, isoprenoid elastomer, ion beam and amorphous polyethylene class elastomer, haloflex and amorphous polyethylene class bullet
The thermoplastic elastomer (TPE) of property body, fluorine class elastomer, polyurethane elastomer, acrylic elastomer etc.
However, the bonding of the laser combination glue of the above-mentioned prior art and removing are realized by heating, when this laser
When being applied on electronic equipment in conjunction with glue, since electronic equipment intermittence can occur generating heat and cool down in use
In the process, thus in the position of certain close heat sources (such as CPU) it will appear the trend that part is bonded and removes repeatedly, be easy
Occurs degumming phenomenon in use process, switching performance is simultaneously unreliable.Also, since this substance is hot melt adhesion, heat it
Viscosity increases afterwards, after the separation of glued object, on glued surface can leave a large amount of residue glue, generally requires etc. to be cooled
It strikes off later or is wiped repeatedly removing using solvent, operate also labor intensive, the efficiency done over again or repaired
It is not high.
In view of defect present in the above-mentioned prior art, it is badly in need of a kind of screen and shell that can be used for electronic equipment in the market
Bonding and stripping means, dismantling removing can also be simply carried out under the premise of meeting excellent adhesive strength.
Summary of the invention
The technical problem to be solved in the present invention is to provide the bonding of a kind of electronic equipment and stripping means, to be reduced or avoided
The problem of being formerly mentioned.
In order to solve the above technical problems, the invention proposes the bonding of a kind of electronic equipment and stripping means, for passing through
UV adhesive is bonded and is removed to the first adhering part of electronic equipment and the second adhering part, and the UV adhesive is by containing
There are Epocryl, polyurethane resin, polyacrylate resin, polyether acrylate resins, polyurethane acroleic acid tree
The UV glue and ethylene-vinyl acetate copolymer of one or a combination set of rouge form；The quality hundred of the ethylene-vinyl acetate copolymer
Point than the 30-40% for the UV adhesive, preferably 35%；Wherein, the adhering method includes the following steps: the UV
Adhesive be uniformly applied to the first adhering part and the second adhering part to gluing of surfaces, by first adhering part and
First adhering part and the second adhering part, are pressed on station, use is ultraviolet by the overlapping of two adhering parts with transparent pressing plate
Light irradiation, while blowing 60-70 degrees Celsius of hot wind；Ultraviolet light curing time 10-60 seconds, pressing plate is removed later, and product removes behaviour
Make platform, restores to room temperature to store.The stripping means includes the following steps: to first adhering part and the second adhering part
Bonding plane blowing be heated to 100-110 degrees Celsius；With sucker first adhering part or the second adhering part is sucked more than one
Side separates glued surface between the two；Make the UV adhesive glue-line between glued surface be cooled to 75 degrees Celsius with
Under, the glue-line is completely exfoliated from glued entire surface using tweezers.
Preferably, the mass percent of the vinyl acetate polymer contained in the ethylene-vinyl acetate copolymer is 20-
40%.
Preferably, the ethylene-vinyl acetate copolymer is preferably the EVA 230 of DuPont Corporation, vinegar contained therein
The polyvinyl mass percent of acid is 28%.
Preferably, the solidification temperature under the ultraviolet light of the UV adhesive is 60-70 degrees Celsius.
Preferably, the heating exfoliation temperature of the UV adhesive is 100-110 degrees Celsius.
Preferably, first adhering part or the second adhering part are the object of light-permeable.
Bonding step of the invention locks thermoplastic composition by UV adhesive curing and forms firm adhesive effect；Removing step
Suddenly UV glue lattice damage is made by heating thermoplastic ingredient, entire glue-line can be disposably removed, being stripped surface will not lose
Any residue glue is stayed, perfect peeling effect can be obtained.
Specific embodiment
For a clearer understanding of the technical characteristics, objects and effects of the present invention, below by tool of the invention
The present invention is described in detail for body embodiment.
Based on defect present in the prior art described in background technique, the invention proposes the bonding of a kind of electronic equipment and
Stripping means is particularly suitable for the screen of electronic equipment or the bonding of shell and removing.The electronic equipment of the application glues
It connects and stripping means, for being glued by a kind of UV adhesive to the first adhering part of electronic equipment and the second adhering part
It connects and removes.Wherein, the electronic equipment can be mobile phone, tablet computer, portable notebook computer etc., first bonding
Component can be the display screen or rear fuselage of electronic equipment, and second adhering part can be and the first bonding portion
The glass cover-plate or glass back cover of cooperation.
Wherein, UV adhesive used in this application is that a kind of UV gluing being especially improved is provided on the basis of existing UV glue
Agent, sticky object after can be used for by way of ultraviolet light solidifying, and object can be removed by way of heating.
The consumption brand of existing newest model, the screen or glass shell of electronic equipment mostly use greatly UV glue to carry out
Bonding.UV glue is called shadowless glue water or UV glue, is a kind of one pack system UV visible-light curing modified acroleic acid rouge structure glue.
UV is the abbreviation of English Ultraviolet Rays, i.e. ultraviolet light.Ultraviolet light (UV) is invisible, be visible light with
One section of outer electromagnetic radiation, range of the wavelength in 10-400nm.It refers to must be by ultraviolet light irradiation ability curable one
Class adhesive.UV adhesive curing principle is that the photoinitiator (or photosensitizer) in UV curing materials absorbs purple under ultraviolet irradiation
Living radical or cation are generated after outer light, are caused monomer polymerization, are crosslinked and connect branch chemical reaction, make adhesive in the several seconds
It is interior that solid-state is converted by liquid.Not only adhesive strength is high for UV glue, and transparency is high, non yellowing, non-whitening, good weatherability, and viscous
Spend moderate, to plastics and plastics, plastics and metal adhesive have higher intensity, are directed to metal and PMMA, PC, ABS, PVC etc.
Various plastic bondings, reinforcement, reinforcing have good application effect, are widely used in microelectronics, optic communication, photoelectricity, medical treatment, family
The industries such as residence, aerospace.
That is, the screen and glass shell of existing electronic equipment are relatively often used UV glue bonding, adhesive strength
It is high, it is only necessary to be irradiated by ultraviolet lamp i.e. curable.But as soon as be bonded using UV glue there are an apparent defect,
It is the solidification of UV glue is irreversible.After the shell of electronic equipment passes through ultraviolet light UV glue, although can obtain preferably
Adhesive strength, but be intended to dismantling and do over again extremely difficult, UV glue after solidification can not also be softened by modes such as heating.Work as chance
In the case where screen or shell breakage, generally require to snap out broken glass to need bit by bit by external force
Very more working hours is spent, and external force forces removing to be easy to leave scratch, and display unit permanent damage can be made when serious, held
It easily leads to and tears machine failure open.
The characteristics of based on existing UV glue, this application provides a kind of UV adhesives being especially improved, can be as existing
UV glue is the same, and solidification bonding is carried out by way of ultraviolet light, and compared with the prior art, adhering method is substantially absent
What variation, easily operated grasp.And for not strippable UV glue compared with the prior art, the UV adhesive of the application is can
To carry out heating strip operation at a lower temperature, working hour can be greatlyd save, the efficiency for maintenance of doing over again is improved.
In the specific embodiment of the application, the UV adhesive of the application is by containing Epocryl, gathering
The UV glue of one or a combination set of urethane resin, polyacrylate resin, polyether acrylate resins, polyurethane acrylic resin with
Ethylene-vinyl acetate copolymer composition；Wherein, the mass percent of the ethylene-vinyl acetate copolymer is the UV gluing
The 30-40% of agent, preferably 35%.
Wherein, in the UV adhesive of the application, main ingredient or UV glue, but be added in UV glue and account for gross mass
The ethylene-vinyl acetate copolymer of 30-40%.Ethylene-vinyl acetate copolymer, abbreviation EVA are that one kind is widely used in foaming
The industrial chemicals in the fields such as footwear material, functional greenhouse film, packaging mould, hot melt adhesive, wire and cable and toy, those skilled in the art can
To be easy to commercially obtain.For example, in the specific embodiment of the application, ethylene-vinyl acetate copolymer
It can be the EVA 230 of DuPont Corporation, the mass percent of vinyl acetate polymer contained therein is 28%.
In addition, UV glue used by the application, can be any one commercially available UV glue, such as it can use Nano
The ND-5204MJ series UV glue of photonics chemical company can also use Chinese patent literature CN 105505287A
Disclosed in waterproof UV glue, or using UV glue disclosed in Chinese patent literature CN 106281057A.
It is particularly preferred that the UV glue of the UV adhesive of the application contains Epocryl, polyurethane resin, poly- third
One or a combination set of alkene acid ester resin, polyether acrylate resins, polyurethane acrylic resin.That is, the UV adhesive of the application
Ethylene-vinyl acetate copolymer be to be soluble in above-mentioned ester type compound, using contain Epocryl, polyurethane
Resin, polyacrylate resin, polyether acrylate resins, polyurethane acrylic resin UV glue, it is possible to reduce the use of solvent
Amount, avoids influence of the volatile materials to environment, it is possible to reduce the cost input of production link innocent treatment equipment reduces
Production cost.
Further, to improve cementability can, the vinyl acetate polymer contained in optimal ethylene-acetate ethylene copolymer
Mass percent be 20-40%, the ethylene-vinyl acetate copolymer of the proportional region is certain due to introducing in strand
The vinyl acetate monomer of ratio can obtain better toughness, anti-impact in the case where being dissolved into the glue of UV containing esters of the application
Hitting property, filler intermiscibility and heat sealing performance.
In another specific embodiment, the preferably described UV adhesive is used to be bonded the object of at least side light-permeable, example
It such as can be used for being bonded the glass cover-plate of screen surface, or the removing rear cover of electronic equipment etc. of bonding such as mobile phone etc,
In favor of the UV adhesive of the application through glass irradiation lower section, in favor of its solidification bonding.
In addition, due to increasing the ethene-vinyl acetate with excellent hot melt adhesion performance in the UV adhesive of the application
Copolymer preferably when passing through ultraviolet light, applies to improve the fastness of bonding in glued object two sides
Certain pressure (pressure solidification) makes glued body surface temperature be maintained at 60-70 degrees Celsius (infrared to eliminate bubble
Laser irradiation body surface or station blowing hot-air).Ultraviolet light curing time 10-60 seconds, pressing plate is removed later, and product removes
Station restores to room temperature to store.
Further, the maximum feature of the application compared with the prior art is, the UV adhesive of the application can heat
To removing glued object in the case where 100-110 degrees Celsius.That is the heating exfoliation temperature of the UV adhesive of the application is
100-110 degrees Celsius.
Also that is, common UV glue, lattice solidification are irreversible, UV glue and the close leaching of glued body surface generation
Profit, after ultraviolet light, forms firm lattice structure with glued surface, which can not be soft by heating
Change recrystallization, it can only be disposable.This feature of common UV glue causes to be difficult dismantling stripping by the object of UV glue sticking
From doing over again or repair very difficult.However, exactly this feature is also that this application provides additional advantages.
For example, in the prior art there is also it is a kind of can hot melt adhesion repeatedly substance, can be glued by way of heating
It connects, removing can also be disassembled by way of heating.But when this substance is applied on electronic equipment, due to electricity
Sub- equipment intermittence can occur during generating heat and cooling down in use, thus in certain close heat sources (such as CPU)
Position will appear part repeatedly be bonded and remove trend, be easy occur degumming phenomenon in use, switching performance is simultaneously
It is unreliable.Also, since this substance is hot melt adhesion, viscosity increases after heating, after the separation of glued object, meeting
Leave a large amount of residue glue on glued surface, generally require etc. it is to be cooled after strike off or be wiped repeatedly removing using solvent,
It operates also labor intensive, the efficiency done over again or repaired is not also high.
And the UV adhesive of the application, it is that the ethene-vinyl acetate copolymerization for accounting for gross mass 30-40% is added in UV glue
Object, by being sufficiently mixed, UV glue composition is solidified the two by ultraviolet light, while assisting 60-70 degrees Celsius of hot melt solidification process,
UV glue composition and ethylene-vinyl acetate copolymer together form firm bonded structure.When needing to disassemble, although UV
Lattice intensity after adhesive curing is very high, can not heat removing, but is had by the cured ethylene-vinyl acetate copolymer of lattice excellent
Different hot molten characteristic, when 100-110 degrees Celsius, the volume expansion of ethylene-vinyl acetate copolymer can destroy UV glue at
The lattice structure of part, leads to UV glue composition adhesive failure.The ethylene-vinyl acetate copolymer for breaking through lattice limitation is in molten state,
It is easy to from glued body surface disposably strip down entire glue-line, hardly leaves what residue glue, operation is very
It is easy.
On the other hand, when temperature is lower than 100-110 degrees Celsius of exfoliation temperature, the lattice structure meeting of UV glue composition
Ethylene-vinyl acetate copolymer is lockked, in the case where lattice is not destroyed, the UV adhesive of the application can't be lost
Effect, it is ensured that will not occur the phenomenon that degumming on an electronic device, adhesive property is very reliable.
Moreover, the UV adhesive of the application is when dismantling, UV glue composition therein is still in solid-state, although ethylene-
Acetate ethylene copolymer is in molten state, but since UV glue composition blendes together one therewith so that whole glue-lines form one it is whole
Body can integrally strip down, residue glue is seldom, non-quickly as the pieces of cloth soaked from the surface of glued object
Often it is easy to subsequent operation, substantially increases and do over again and maintenance efficiency.Also, due to the UV glue composition in the UV adhesive of the application
Irreversible feature after solidification causes the application in the ethyl vinyl acetate second after heating strip operation, largely lockked
Alkene copolymer ratio very little shared by glued surface, bonding force is not strong, when temperature be reduced to 75 degree hereinafter, again solidify after
Ethylene-vinyl acetate copolymer and the UV glue composition of failure form entirety, can be easy to entire glue-line from glued table
Face removing, and be stripped surface and will not leave any residue glue, perfect peeling effect can be obtained.Also that is, the application's
In one specific embodiment, preferably after being heated to 100-110 degrees Celsius of separated glued object, make UV adhesive glue-line
75 degrees Celsius are cooled to hereinafter, the glue-line is completely exfoliated from glued body surface.
Component, preparation method, application scenarios and the application method of UV adhesive etc. of the application is specifically described below.
Embodiment 1
Component:
60 parts by weight of UV glue, using the ND-5204MJ series UV glue of Nano photonics chemical company；
40 parts by weight of ethylene-vinyl acetate copolymer, using the EVA 230 of DuPont Corporation, acetic acid second contained therein
The mass percent of alkene polymer is 28%.
Preparation method:
Ethylene-vinyl acetate copolymer is ground into 50 mesh, is added in UV glue, 60 degree of temperature lower stirrings make ethylene-vinegar
Sour ethylene copolymer is completely dissolved in UV glue, and de-bubble heat preservation stands 60 minutes, can be prepared by the curable ultraviolet light gluing
Agent.
Application scenarios:
It is bonded cell phone screen glass cover board.Wherein, mobile phone screen is the first adhering part, and glass cover-plate is the second adhesive portion
Part.
Adhering method:
By the UV adhesive be uniformly applied to the first adhering part and the second adhering part to gluing of surfaces, will be described
First adhering part and the overlapping of the second adhering part.For example, UV adhesive is uniformly applied to mobile phone screen surface, by glass cover
Plate covers mobile phone screen.First adhering part and the second adhering part are pressed on station with transparent pressing plate, use is ultraviolet
Light irradiation, while blowing 60 degrees Celsius of hot wind；Ultraviolet light curing time 10 seconds, pressing plate is removed later, product removes station, extensive
It is stored again to room temperature.
After tested, 25 DEG C when, the 180 degree removing cohesive force that glass cover-plate is removed from mobile phone screen surface is in 20N/
25mm or more, bonding interface can not destroy, and can not remove completely.
Disassemble stripping means:
100 degrees Celsius are heated to the bonding plane blowing of first adhering part and the second adhering part；It is inhaled with sucker
The first adhering part or the more sides of the second adhering part are stated in residence, separate glued surface between the two.For example, to glass
Cover board blowing is heated to 100 degrees Celsius；Glass cover-plate is sucked with sucker, separates glass cover-plate with mobile phone screen.Then make by
UV adhesive glue-line between gluing of surfaces is cooled to 75 degrees Celsius hereinafter, using tweezers that the glue-line is whole from glued surface
Body is completely exfoliated.
After tested, 100 DEG C when, the 180 degree removing cohesive force that glass cover-plate is removed from mobile phone screen surface is in 5N/
25mm or more, bonding interface thoroughly destroy, and are completely exfoliated.
Embodiment 2
Component:
70 parts by weight of UV glue；30 parts by weight of ethylene-vinyl acetate copolymer.
UV glue is made of resin, monomer, photoinitiator.The resin include Epocryl, polyurethane resin,
One or a combination set of polyacrylate resin, polyether acrylate resins, polyurethane acrylic resin.The monomer includes single official
It can single group body (IBOA, IBOMA, HEMA etc.), two monomers (TPGDA, HDDA, DEGDA, NPGDA etc.), trifunctional monomer
Or polyfunctional monomer (TMPTA, PETA etc.)；The initiator includes benzophenone.
Ethylene-vinyl acetate copolymer uses the EVA 220 of DuPont Corporation, vinyl acetate polymer contained therein
Mass percent is 28%.
Preparation method:
Ethylene-vinyl acetate copolymer is ground into 100 mesh, is added in UV glue, 70 degree of temperature lower stirrings make ethylene-
Acetate ethylene copolymer is completely dissolved in UV glue, and de-bubble heat preservation stands 120 minutes, can be prepared by the curable UV glue
Glutinous agent.
Application scenarios:
It is bonded mobile phone glass rear cover.Wherein, the rear fuselage of mobile phone is the first adhering part, and glass back cover is the second bonding
Component.
Adhering method:
By the UV adhesive be uniformly applied to the first adhering part and the second adhering part to gluing of surfaces, will be described
First adhering part and the overlapping of the second adhering part.For example, UV adhesive is uniformly applied to arranged at rear of mobile phone surface, after glass
Lid covering arranged at rear of mobile phone.First adhering part and the second adhering part are pressed on station with transparent pressing plate, use is ultraviolet
Light irradiation, while blowing 70 degrees Celsius of hot wind；Ultraviolet light curing time 60 seconds, pressing plate is removed later, product removes station, extensive
It is stored again to room temperature.
After tested, 25 DEG C when, the 180 degree removing cohesive force that glass cover-plate is removed from mobile phone screen surface is in 20N/
25mm or more, bonding interface can not destroy, and can not remove completely.
Disassemble stripping means:
110 degrees Celsius are heated to the bonding plane blowing of first adhering part and the second adhering part；It is inhaled with sucker
The first adhering part or the more sides of the second adhering part are stated in residence, separate glued surface between the two.For example, to glass
Cover board blowing is heated to 110 degrees Celsius；Glass cover-plate is sucked with sucker, separates glass cover-plate with mobile phone screen.Then make by
UV adhesive glue-line between gluing of surfaces is cooled to 75 degrees Celsius hereinafter, using tweezers that the glue-line is whole from glued surface
Body is completely exfoliated.
After tested, 100 DEG C when, the 180 degree removing cohesive force that glass cover-plate is removed from mobile phone screen surface is in 5N/
25mm or more, bonding interface thoroughly destroy, and are completely exfoliated.
Embodiment 3
Component:
65 parts by weight of UV glue；35 parts by weight of ethylene-vinyl acetate copolymer.
The UV glue is made of resin, monomer, photoinitiator.The resin is Epocryl 20-40 weight
Part and polyacrylate resin 15-35 parts by weight.The monomer is hydroxy propyl methacrylate 10-25 parts by weight and acrylic acid
Isobornyl thiocyanoacetate 10-25 parts by weight；The initiator is 1- hydroxycyclohexyl phenyl ketone 1-5 parts by weight.
Ethylene-vinyl acetate copolymer uses the EVA 150 of DuPont Corporation, vinyl acetate polymer contained therein
Mass percent is 33%.
Preparation method:
Ethylene-vinyl acetate copolymer is ground into 80 mesh, is added in UV glue, 65 degree of temperature lower stirrings make ethylene-vinegar
Sour ethylene copolymer is completely dissolved in UV glue, and de-bubble heat preservation stands 100 minutes, can be prepared by the curable ultraviolet light gluing
Agent.
Application scenarios:
It is bonded tablet computer screen glass cover board.Wherein, tablet computer screen is the first adhering part, glass back cover the
Two adhering parts.
Adhering method:
By the UV adhesive be uniformly applied to the first adhering part and the second adhering part to gluing of surfaces, will be described
First adhering part and the overlapping of the second adhering part.For example, UV adhesive is uniformly applied to tablet computer screen surface, by glass
Glass rear cover covers tablet computer screen.First adhering part and the second adhering part are pressed in station with transparent pressing plate
On, with ultraviolet light, while blowing 65 degrees Celsius of hot wind；Ultraviolet light curing time 30 seconds, pressing plate is removed later, and product removes
Station restores to room temperature to store.
After tested, 25 DEG C when, the 180 degree removing cohesive force that glass back cover is removed from tablet computer screen surface exists
20N/25mm or more, bonding interface can not destroy, and can not remove completely.
Disassemble stripping means:
105 degrees Celsius are heated to the bonding plane blowing of first adhering part and the second adhering part；It is inhaled with sucker
The first adhering part or the more sides of the second adhering part are stated in residence, separate glued surface between the two.For example, to glass
Rear cover blowing is heated to 105 degrees Celsius；Glass back cover is sucked with sucker, separates glass back cover with tablet computer screen.Then
The UV adhesive glue-line between glued surface is set to be cooled to 75 degrees Celsius hereinafter, using tweezers by the glue-line from glued table
Face is integrally completely exfoliated.
After tested, 100 DEG C when, the 180 degree removing cohesive force that glass back cover is removed from tablet computer screen surface exists
5N/25mm or more, bonding interface thoroughly destroy, and are completely exfoliated.
In conclusion bonding step of the invention, locks thermoplastic composition by UV adhesive curing and forms firm bonding effect
Fruit；Strip step makes UV glue lattice damage by heating thermoplastic ingredient, entire glue-line can disposably be removed, be stripped table
Face will not leave any residue glue, can obtain perfect peeling effect.
It will be appreciated by those skilled in the art that although the present invention is described in the way of multiple embodiments,
It is that not each embodiment only contains an independent technical solution.So narration is used for the purpose of for the sake of understanding in specification,
The skilled in the art should refer to the specification as a whole is understood, and by technical solution involved in each embodiment
Regard as and can be combined with each other into the modes of different embodiments to understand protection scope of the present invention.
The foregoing is merely the schematical specific embodiment of the present invention, the range being not intended to limit the invention.It is any
Those skilled in the art, made equivalent variations, modification and combination under the premise of not departing from design and the principle of the present invention,
It should belong to the scope of protection of the invention.
Claims (6)
1. the bonding and stripping means of a kind of electronic equipment, for by UV adhesive to the first adhering part of electronic equipment and
Second adhering part is bonded and is removed, and the UV adhesive is by containing Epocryl, polyurethane resin, poly- third
The UV glue and ethene-vinyl acetate of one or a combination set of alkene acid ester resin, polyether acrylate resins, polyurethane acrylic resin
Copolymer composition；Wherein, the mass percent of the ethylene-vinyl acetate copolymer is the 30-40% of the UV adhesive, excellent
It is selected as 35%；It is characterized by: the adhering method includes the following steps: the UV adhesive being uniformly applied to the first bonding
Component and the second adhering part to gluing of surfaces, first adhering part and the second adhering part are overlapped, with transparent pressure
First adhering part and the second adhering part are pressed on station by plate, with ultraviolet light, while blowing 60-70 degrees Celsius
Hot wind；Ultraviolet light curing time 10-60 seconds, pressing plate is removed later, and product removes station, restores to room temperature to store.It is described
Stripping means includes the following steps: to be heated to 100- to the bonding plane blowing of first adhering part and the second adhering part
110 degrees Celsius；First adhering part or the more sides of the second adhering part is sucked with sucker, makes glued table between the two
Face separation；Make the UV adhesive glue-line between glued surface be cooled to 75 degrees Celsius hereinafter, using tweezers by the glue-line from
Glued entire surface is completely exfoliated.
2. bonding as described in claim 1 and stripping means, which is characterized in that contain in the ethylene-vinyl acetate copolymer
The mass percent of some vinyl acetate polymers is 20-40%.
3. bonding as claimed in claim 2 and stripping means, which is characterized in that the ethylene-vinyl acetate copolymer is preferred
For the EVA 230 of DuPont Corporation, the mass percent of vinyl acetate polymer contained therein is 28%.
4. bonding as described in claim 1 and stripping means, which is characterized in that under the ultraviolet light of the UV adhesive
Solidification temperature is 60-70 degrees Celsius.
5. bonding as described in claim 1 and stripping means, which is characterized in that the heating exfoliation temperature of the UV adhesive is
100-110 degrees Celsius.
6. bonding as described in claim 1 and stripping means, which is characterized in that preferred first adhering part is second viscous
Relay part is the object of light-permeable.
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| CN201811633719.3A CN109705790B (en) | 2018-12-29 | 2018-12-29 | Bonding and stripping method of electronic equipment |
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| CN201811633719.3A CN109705790B (en) | 2018-12-29 | 2018-12-29 | Bonding and stripping method of electronic equipment |
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| CN109705790B CN109705790B (en) | 2021-07-27 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113791503A (en) * | 2021-09-13 | 2021-12-14 | 信利光电股份有限公司 | Method for removing hot melt adhesive in LCD blind hole |
| CN114109984A (en) * | 2020-08-31 | 2022-03-01 | 北京小米移动软件有限公司 | Electronic device |
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| CN104812858A (en) * | 2012-08-20 | 2015-07-29 | 汉高股份有限公司 | Liquid optically clear photo-curable adhesive for display application |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114109984A (en) * | 2020-08-31 | 2022-03-01 | 北京小米移动软件有限公司 | Electronic device |
| CN113791503A (en) * | 2021-09-13 | 2021-12-14 | 信利光电股份有限公司 | Method for removing hot melt adhesive in LCD blind hole |
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| Publication number | Publication date |
|---|---|
| CN109705790B (en) | 2021-07-27 |
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