CN109702357A - A kind of laser processing disk method and system - Google Patents
A kind of laser processing disk method and system Download PDFInfo
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- CN109702357A CN109702357A CN201910088007.6A CN201910088007A CN109702357A CN 109702357 A CN109702357 A CN 109702357A CN 201910088007 A CN201910088007 A CN 201910088007A CN 109702357 A CN109702357 A CN 109702357A
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Abstract
The invention belongs to automation control areas, and in particular to a kind of laser processing disk method and system.Whether the laser processing disk method, the track data including arranging laser cutting, selects two continuous straight path data, be zero to judge whether can to form corner angle progress rounded corner according to the vector product of two straight lines；And when corner angle can be formed by needing, according to the corresponding straight path data of acquisition, starting point coordinate, terminal point coordinate, radius and the circular arc direction of circular arc when calculating corner angle rounded corner, so that it is determined that the circular arc data of edges and corners rounded corner.Pass through the two straight path data obtained in system kernel, it can calculate, the circular arc data of modification and addition rounded corner, the mode that rounded corner is carried out in digital control system allows the realization of rounded corner function to become simple and reliable, and computational accuracy is higher, to meet laser processing client and tester to the relevant performance of rounded corner and technique requirement.
Description
Technical field
The invention belongs to industrial automation production fields, and in particular to a kind of laser processing disk method and system.
Background technique
Wafer discharging problem is widely present the industries such as machine-building, motor, ship, aerospace, such as: motor stator and
Rotor core is made with silicon steel disk；Pot, pot, the basin of household are made of stainless steel wafer.
Existing disk processing enterprise is generally processed using traditional punching machine, and processing efficiency is very high.But it has a certain disadvantage,
Such as: easily occur getting stuck in punching course, cracking phenomena；Mold is easy to damage, time-consuming for replacement；Processing flexibility is poor, unsuitable
The processing of various sizes small lot；Stock utilization is low；Noise is big etc..Some Enterprises have begun introduce optical-fiber laser cutting machine into
Row wafer blanking, to make up the defect of punching machine wafer blanking.But the efficiency of laser processing can not show a candle to punching machine, and according to statistics, part is swashed
The efficiency that light manufacturer processes disk is about the 1/4 of punching machine, and stock utilization is suitable with punching machine, fails to give full play to laser
The advantage of processing.
Therefore, the existing technology needs to be improved and developed.
Summary of the invention
The technical problem to be solved in the present invention is that in view of the above drawbacks of the prior art, providing a kind of laser processing circle
The problems such as piece method and system solve existing laser cutting and carry out low efficiency when wafer blanking, and stock utilization is low.
To solve this technical problem, the present invention provides a kind of laser processing disk method, comprising steps of
Step B, successively tangent multiple circles of arranging are used as one group of disk；
It step C, is cutting starting point with first upper any point of circle, along circular arc according to arbitrary direction Continuous maching to adjacent
The point of contact of two circles；The point of contact of next adjacent two circle is machined to according still further to any direction；And so on, until being machined to the last one
Behind point of contact, the cutting of the last one disk is completed along the track of the last one circle；According still further to processing method before, along undressed
Circular arc continue to be machined to cutting starting point, complete cutting.
Further, the step C comprising steps of
Step C1: being cutting starting point with the upper any point of first circle；
Step C2: along circular arc according to direction counterclockwise/clockwise Continuous maching to the point of contact of two neighboring circle, then accordingly
The direction for being converted into clockwise/counterclockwise is machined to the point of contact of next two neighboring circle, and so on, until being machined to last
A point of contact；
Step C3: according to the machine direction of the clockwise/counterclockwise before the last one point of contact, clockwise/inverse time is converted to
The machine direction of needle and the cutting that the last one disk is completed along the track of the last one circle；
Step C4: it completes to cut along unprocessed circular arc Continuous maching to starting point is cut according still further to processing method before
It cuts.
Further, it is further comprised the steps of: before the step B
Step A, one or more groups of disks are set.
Further, the step C further comprise the steps of: while carrying out cutting processing carry out coiled strip continue into
It gives.
Further, the step C1 comprising steps of
It is cutting starting point with the upper point close to cutting head initial position of first circle.
Further, the step is also to wrap in cutting starting point with the upper point close to cutting head initial position of first circle
It includes step: obtaining first round center of circle and cutting head initial position, take the connection center of circle, the straight line of cutting head initial position and the
One round intersection point is cutting starting point.
Further, in the step A: the spacing of two adjacent groups disk is 3-5mm in the multiple groups disk.
Further, in the step A: the cutting starting point of two adjacent groups disk is corresponding in the multiple groups disk.
The present invention also provides a kind of systems with laser processing disk, comprising:
Disk arranges module, for successively tangent multiple circles of arranging；
Cutting module, using first upper any point of circle as starting point, along circular arc according to arbitrary direction Continuous maching to adjacent
The point of contact of two circles；The point of contact of next adjacent two circle is machined to according still further to any direction；And so on, until being machined to the last one
Behind point of contact, the cutting of the last one circle is completed along the circular arc of last circle；According still further to processing method before, along unprocessed circle
Arc continues to be machined to starting point, completes cutting.
Further, the cutting module includes:
Starting point designating unit is cut, for specifying the upper any point of first circle for cutting starting point；
First cutter unit, for being cut along circular arc according to what direction counterclockwise/clockwise Continuous maching to adjacent two was justified
Point, then be accordingly converted into clockwise/counterclockwise direction be machined to it is next it is adjacent two circle point of contacts, and so on, until processing
To the last one point of contact；
Second cutter unit: it for the machine direction according to the clockwise/counterclockwise before the last one point of contact, is converted to suitable
The machine direction of hour hands/counterclockwise and the cutting that the last one disk is completed along the track of last circle；
Third cutter unit: for extremely being cut along unprocessed circular arc Continuous maching according still further to processing method before
Point completes cutting.
The beneficial effects of the present invention are, compared with prior art, the present invention by by multiple circles in one group of disk according to
Secondary arranged tangential, when cutting, since the first circle, the arc machining round along first is to the first point of contact, according still further to any direction
It is machined to the point of contact of next adjacent two circle；And so on, until being worked into the last one point of contact, the cutting of the last one circle is completed,
According still further to processing method before, continues to be machined to cutting starting point along unprocessed circular arc, complete cutting, the present invention passes through planning
Continuous unduplicated cutting route completes the cutting of multiple disks, it is possible to reduce the idle stroke move distance of cutting head, on laser
The number of light/decline light out, the effective efficiency for improving cutting are received in lift.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples, in attached drawing:
Fig. 1 is the flow chart of present invention laser processing disk method；
Fig. 2 is the flow chart of step S300 of the present invention；
Fig. 3 is the composition figure of present invention laser processing disk systems in compression；
Fig. 4 is existing wafer blanking layout viewing；
Fig. 5 is existing wafer blanking cutter track figure；
Fig. 6 is wafer blanking layout viewing of the invention；
Fig. 7 is the idle stroke path figure of present invention wafer blanking；
Fig. 8 is the idle stroke path figure of existing wafer blanking.
Specific embodiment
The present invention provides a kind of laser processing disk method and system, to make the purpose of the present invention, technical solution and effect
Clearer, clear, the present invention is described in more detail referring to the drawings.It should be appreciated that specific reality described herein
It applies example to be only used to explain the present invention, be not intended to limit the present invention.
Referring to Figure 1, Fig. 1 is the flow chart for the laser processing disk method that present pre-ferred embodiments provide.Shown in Fig. 1
A kind of laser processing disk method, comprising steps of
Step S200, successively tangent multiple circles of arranging are used as one group of disk；And
Step S300, be cutting starting point with first upper any point of circle, along circular arc according to arbitrary direction Continuous maching extremely
The point of contact of adjacent two circle；The point of contact of next adjacent two circle is machined to according still further to any direction；And so on, until being machined to last
Behind one point of contact, the cutting of the last one disk is completed along the track of the last one circle；According still further to processing method before, along not
The circular arc of processing continues to be machined to cutting starting point, completes cutting.
The present invention is by by the successively arranged tangential of multiple circles in one group of disk, when cutting, since the first circle, along first
The arc machining of a circle is machined to the point of contact of next adjacent two circle according still further to any direction to the first point of contact；And so on, until adding
After work to a last point of contact, the cutting of the last one circle is first completed, according still further to processing method before, along unprocessed circular arc
Continue to be machined to cutting starting point, completes cutting, the present invention is by planning continuous unduplicated cutting route to complete multiple disks
Cutting, it is possible to reduce the number of light/decline light out is received in lift on the idle stroke move distance and laser of cutting head, i.e., effectively subtracts
Few clipping time, improve the efficiency of cutting.
Further, referring to Figure 1, Fig. 2, the step S300 includes:
Step S310: being cutting starting point with the upper any point of first circle；
Step S320: along circular arc according to direction counterclockwise/clockwise Continuous maching to the point of contact of two neighboring circle, then phase
The direction that clockwise/counterclockwise should be converted into is machined to the point of contact of next two neighboring circle, and so on, until being machined to last
One point of contact；
Step S330: it according to the machine direction of the clockwise/counterclockwise before the last one point of contact, is converted to clockwise/inverse
The machine direction of hour hands and the cutting that the last one disk is completed along the track of the last one circle；
Step S340: it completes to cut along unprocessed circular arc Continuous maching to starting point is cut according still further to processing method before
It cuts.
The present invention limits the cut direction of circular arc, when a round machine direction is clockwise/counterclockwise, adjacent circle
Machine direction be converted to accordingly counterclockwise/clockwise；Two are reached when processing a round circular arc by above-mentioned setting
When point of contact between circle will enter the arc machining of next circle, since the cut direction at point of contact is identical, cut without reducing
The movement speed for cutting head can be converted directly into the arc machining of next circle, and entire cutting process can guarantee higher cut
Speed is cut, can further improve cutting efficiency.
Further, referring to Figure 1, it is further comprised the steps of: before the step S200
Step S100, one or more groups of disks are set.
The present invention can select to process one or more groups of disks on material, that is, the present invention can be improved according to the size of material
Versatility and working efficiency.
Further, referring to Figure 1, the step S300, which is further comprised the steps of:, is carrying out the progress of cutting processing while
The lasting feeding of coiled strip.The present invention is by carrying out the feeding of coiled strip while carrying out disk cutting, it is possible to reduce coiled strip feeding
Time, improve working efficiency.When it is implemented, coiled strip is fed with certain speed, by the movement for adjusting cutting head
The feed speed of speed adaption coiled strip can complete the feeding of coiled strip to complete the cutting of disk while cutting.
Further, the step S100 comprising steps of be with the upper point close to cutting head initial position of first circle
Cut starting point.In the present invention by limits cutting starting point as first justify near cutting head initial position point, can reduce
The moving distance of cutting head improves working efficiency.
Further, the step is also to wrap in cutting starting point with the upper point close to cutting head initial position of first circle
It includes step: obtaining first round center of circle and cutting head initial position, take the connection center of circle, the straight line of cutting head initial position and the
One round intersection point is cutting starting point.In the present invention, by first round center of circle of connection and cutting head initial position, then obtain
Straight line and first round intersection point can be obtained point nearest apart from cutting head initial position on first circle, convenient and efficient, have
The raising working efficiency of effect.
Further, in the step S100: the spacing of two adjacent groups disk is 3-5mm in the multiple groups disk.It is logical
Cross setting two adjacent groups disk distance be 3-5mm, can prevent in process coiled strip stick up come, collide with cutting head,
Excessive waste is not will cause simultaneously.Further, the distance of the two adjacent groups disk is 3mm, passes through setting adjacent two
The distance that the distance of group disk is 3mm can prevent anti-cutting head and coiled strip from colliding simultaneously, can further reduce coiled strip
Waste.
Further, in the step S100: the cutting starting point of two adjacent groups disk is corresponding in the multiple groups disk.
In the present invention, the processing method of the two adjacent groups is the same, and now the cutting starting point by setting two adjacent groups is corresponding, can subtract
The idle stroke move distance of few cutting head, while can guarantee that the cutting path of two adjacent groups disk is consistent, operation difficulty is reduced,
Improve working efficiency.
Further, refer to Fig. 3, the present invention also provides it is a kind of with laser processing disk system, comprising:
Disk arranges module 200, for successively tangent multiple circles of arranging as one group of disk；
Cutting module 300, using the upper any point of first circle as starting point, along circular arc according to arbitrary direction Continuous maching to phase
The point of contact of two circle of neighbour；The point of contact of next adjacent two circle is machined to according still further to any direction；And so on, until being machined to last
Behind a point of contact, the cutting of the last one circle is completed along the track of last circle；According still further to processing method before, along unprocessed
Circular arc continues to be machined to starting point, completes cutting.
Further, the cutting module includes:
Starting point designating unit is cut, for specifying the upper any point of first circle for cutting starting point；
First cutter unit, for being cut along circular arc according to what direction counterclockwise/clockwise Continuous maching to adjacent two was justified
Point, then be accordingly converted into clockwise/counterclockwise direction be machined to it is next it is adjacent two circle point of contacts, and so on, until processing
To the last one point of contact；
Second cutter unit: it for the machine direction according to the clockwise/counterclockwise before the last one point of contact, is converted to suitable
The machine direction of hour hands/counterclockwise and the cutting that the last one disk is completed along the track of last circle；
Third cutter unit: for extremely being cut along unprocessed circular arc Continuous maching according still further to processing method before
Point completes cutting.
It is elaborated below with specific embodiment to the present invention
Embodiment 1
As shown in Figure 4, Figure 5, it is most at present with the enterprise of laser cutting disk when carrying out wafer blanking, in order to avoid sharp
Shaven head collides plate in cutting process, round all to keep spacing d between circle.Machining path is as follows: laser head starts from origin,
Lost motion to A point, open the light by laser head decline, and after counterclockwise or processing first disk clockwise, laser head closes light, lift
It rises；From A point, lost motion to B point, laser head decline is opened the light, after counterclockwise or processing second disk clockwise,
Laser head closes light, lifts.So circulation, successively from A-B-C-D-E-F-G-I, in coiled strip wide direction circulation manufacture.With a week
Phase for A-B-C-D-E-F-G-I cycle period, illustrates that this machining path suffers from the drawback that 1) laser head needs to lift altogether
Rise/decline, open the light/go out light 8 times, low efficiency；2) straight line portion that the path of idle stroke movement is Fig. 1, low efficiency；3) round and circle
Between must keep a fixed spacing, utilization rate is low.
In order to improve the above problem, the present invention proposes a kind of laser processing disk method.As shown in fig. 6, adjustment is existing
Pattern type, it is round tangent between circle in the wide direction of coiled strip, and cut using 8 word cutter tracks.In a cycle,
The point of contact of wide direction is respectively point B, C, D.The spacing of d is still kept in the length direction of coiled strip.Machining path is as follows: laser head from
Origin starting, lost motion to A point, laser head decline are opened the light, and Machining Arc AB counterclockwise, process semi arch BC clockwise, is inverse
Hour hands processing semi arch CD, clockwise processing semi arch DE, clockwise processing semi arch ED (processing for completing the last one circle),
Processing semi arch DC, clockwise processing semi arch CB, Machining Arc BA counterclockwise counterclockwise；Laser head closes light, lifts, idle running fortune
F point is moved, laser head decline is opened the light, and is so recycled.During this, above-mentioned traditional cutter track is compared, advantage is as follows: 1) laser head
It only needs to lift/decline, open the light/altogether to go out light 1 time, efficiency is obviously improved；2) path of idle stroke movement only has straight line AF, imitates
Rate is obviously improved；3) it in the disk cutting in web width direction, is cut using 8 word paths, there are also half for the circle of cutting
It does not scale off, will not stick up equipped with cutting head, therefore be not no spacing in width direction；It need to only be kept in length direction
The spacing of d, stock utilization are obviously improved.
In addition, traditional fiber laser cutting disk is all using static cutting, after coiled strip is sent to position, by X, Y-axis interpolation
Showing methods are completed, one section of coiled strip is then drawn by feeding A axis.Laser head coiled strip wide direction, after processing a cycle,
It is slack that laser head returns to starting point, waits feeding A axial direction Zola's a distance, will machined disk send out after start processing the
It in two periods, circuits sequentially.Static cutting mode suffers from the drawback that process is discontinuous, needs one drawing material time, adds
Work low efficiency.
For the efficiency for promoting static cutting, the present invention proposes a kind of dynamic cutting mode, i.e., while laser cutting into
The feeding of row coiled strip.In process, coiled strip continues to feed to the left, completes cutting in the process of movement, at this point, X-axis needs
It is superimposed the movement velocity v of feeding A axis.As shown in figure 3, laser head starts while the axial left side A is with certain speed feeding
Processing, graphics processing is completed in interpolation to X-axis together with Y-axis after the movement velocity for being superimposed A axis, is processing a cycle
Afterwards, A axis is fed always, is started to process second period, be circuited sequentially.Above-mentioned static cutting is compared, advantage is as follows: process
Continuous feed is kept, the time for drawing material can be reduced, it is high in machining efficiency.
Further, it calculates below and a cycle is processed using common cutter track static mode and 8 word cutter track dynamical fashions
Time difference △ T.
As shown in Figure 7, Figure 8, dotted portion is idle stroke path, and the round spacing between circle is d, and lower edges surplus is equal
For d1, the diameter of circular piece is D, coiled strip wide direction it is maximum can stock layout circular piece number be n1。
In one cycle due to two kinds of processing methods, the circle quantity of processing is identical, then the path of light cutting is also identical out,
Setting out the path deeply concerned cut is LC:
LC=2n1*πD
(1) common cutter track static mode
Close light lost motion path are as follows:
If speed of the laser when light out is cut is v1, idle running speed is v2, since static state cutting needs to carry out one section of drawing
Material, if the time is t, drawing material speed is v3, obtain time T required for common cutter track static state cutting a cycle1:
(2) 8 word cutter track dynamical fashions
Close light lost motion path are as follows:
Since dynamic cutting does not need to carry out drawing material, when obtaining required for 8 word cutter track dynamic cutting processing a cycles
Between T2:
Therefore process the time difference of a cycle are as follows:
In the actual processing process, within the said one period, laser head lifts time with decline when common cutter track is processed
6 times more than when number is than the processing of 8 word cutter tracks, so the time difference is greater than △ T.However, due in cutting process and lost motion mistake
There are acceleration and deceleration by Cheng Zhongjun, and the above calculating is obtained at the uniform velocity.By comparing in actual production, 8 word cutter tracks are obtained
Dynamic machining integrally promotes 20-30% than common cutter track static state processing efficiency.And since 8 word cutter tracks are not stayed in coiled strip wide direction
Machining allowance, stock utilization at least promote one percentage point than common cutter track.
The present invention has the following advantages:
1) high in machining efficiency.Processing efficiency using 8 word cutter track dynamic machinings than common cutter track static state integrally promotes 20-
30%；
2) stock utilization is high.The stock utilization processed using 8 word cutter track dynamic machinings than common cutter track static state is at least
Promote one percentage point；
3) high degree of automation.The process of 8 word cutter track dynamic machinings is not interrupted continuously.
In conclusion the above is merely preferred embodiments of the present invention, being not intended to limit the scope of the present invention.
Any modification made all within the spirits and principles of the present invention, equivalent replacement, improve etc., it should be included in guarantor of the invention
It protects in range.
Claims (10)
1. a kind of laser processing disk method, which is characterized in that comprising steps of
Step B, successively tangent multiple circles of arranging are used as one group of disk；
It step C, is cutting starting point with the upper any point of first circle, along circular arc according to arbitrary direction Continuous maching to adjacent two circle
Point of contact；The point of contact of next adjacent two circle is machined to according still further to any direction；And so on, until being machined to the last one point of contact
Afterwards, the cutting of the last one disk is completed along the track of the last one circle；According still further to processing method before, along unprocessed circle
Arc continues to be machined to cutting starting point, completes cutting.
2. laser processing disk method according to claim 1, which is characterized in that the step C comprising steps of
Step C1: being cutting starting point with the upper any point of first circle；
Step C2: along circular arc according to direction counterclockwise/clockwise Continuous maching to the point of contact of two neighboring circle, then corresponding conversion
The point of contact of next two neighboring circle is machined to for the direction of clockwise/counterclockwise, and so on, it is cut until being machined to the last one
Point；
Step C3: according to the machine direction of the clockwise/counterclockwise before the last one point of contact, clockwise/counterclockwise is converted to
Machine direction and the cutting that the last one disk is completed along the track of the last one circle；
Step C4: cutting is completed along unprocessed circular arc Continuous maching to starting point is cut according still further to processing method before.
3. laser processing disk method according to claim 1, which is characterized in that before the step B further include:
Step A, one or more groups of disks are set.
4. laser processing disk method according to claim 1, which is characterized in that the step C further comprise the steps of: into
The lasting feeding of coiled strip is carried out while row cutting processing.
5. laser processing disk method according to claim 2, which is characterized in that the step C1 comprising steps of
It is cutting starting point with the upper point close to cutting head initial position of first circle.
6. laser processing disk method according to claim 5, which is characterized in that the step is upper close with first circle
The point of cutting head initial position is to further comprise the steps of: in cutting starting point
First round center of circle and cutting head initial position are obtained, the straight line and first of the connection center of circle, cutting head initial position is taken
The intersection point of a circle is cutting starting point.
7. laser processing disk method according to claim 3, which is characterized in that in the step A: the multiple groups disk
The spacing of middle two adjacent groups disk is 3-5mm.
8. laser processing disk method according to claim 3, which is characterized in that in the step A: the multiple groups disk
The cutting starting point of middle two adjacent groups disk is corresponding.
9. a kind of system with laser processing disk characterized by comprising
Disk arranges module, for successively tangent multiple circles of arranging as one group of disk；
Cutting module, using the upper any point of first circle as starting point, along circular arc according to arbitrary direction Continuous maching to adjacent two circle
Point of contact；The point of contact of next adjacent two circle is machined to according still further to any direction；And so on, until being machined to the last one point of contact
Afterwards, the cutting of the last one circle is completed along the track of last circle；According still further to processing method before, along unprocessed circular arc after
It is continuous to be machined to starting point, complete cutting.
10. the system of laser processing disk according to claim 9, which is characterized in that the cutting module includes:
Starting point designating unit is cut, for specifying the upper any point of first circle for cutting starting point；
First cutter unit, for along circular arc according to direction counterclockwise/clockwise Continuous maching to it is adjacent two circle point of contacts, then
The direction for being accordingly converted into clockwise/counterclockwise is machined to the point of contact of next adjacent two circle, and so on, until being machined to last
One point of contact；
Second cutter unit: for the machine direction according to the clockwise/counterclockwise before the last one point of contact, up time is converted to
The machine direction of needle/counterclockwise and the cutting that the last one disk is completed along the track of last circle；
Third cutter unit: complete along unprocessed circular arc Continuous maching to cutting starting point for according still further to processing method before
At cutting.
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110732788A (en) * | 2019-11-28 | 2020-01-31 | 大族激光科技产业集团股份有限公司 | method and device for improving utilization rate of laser processing round piece |
| CN110757010A (en) * | 2019-11-28 | 2020-02-07 | 大族激光科技产业集团股份有限公司 | Cutting method for avoiding collision between round piece to be machined and laser head |
| CN111531287A (en) * | 2020-05-07 | 2020-08-14 | 苏州融睿电子科技有限公司 | Packaging shell, processing method and manufacturing method thereof, laser and storage medium |
| CN113523557A (en) * | 2021-07-09 | 2021-10-22 | 奇新光电股份有限公司 | Brand-new laser cutting process method for electronic paper |
| CN113857691A (en) * | 2021-10-11 | 2021-12-31 | 申新民 | Laser glass cutting method |
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