CN109696994A - Electronic device, touch screen and touch panel - Google Patents
Electronic device, touch screen and touch panel Download PDFInfo
- Publication number
- CN109696994A CN109696994A CN201710983515.1A CN201710983515A CN109696994A CN 109696994 A CN109696994 A CN 109696994A CN 201710983515 A CN201710983515 A CN 201710983515A CN 109696994 A CN109696994 A CN 109696994A
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- China
- Prior art keywords
- layer
- touch panel
- circuit layer
- insulating layer
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
- C03C17/3644—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the metal being silver
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
- C03C17/3649—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer made of metals other than silver
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M2250/00—Details of telephonic subscriber devices
- H04M2250/22—Details of telephonic subscriber devices including a touch pad, a touch sensor or a touch detector
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Organic Chemistry (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Signal Processing (AREA)
- Position Input By Displaying (AREA)
Abstract
The present invention discloses a kind of touch panel.The touch panel includes cover board, the adhesive layer being formed directly on the cover board and the pixel control layer being formed on the adhesive layer.The adhesive force of lid surface can be improved by forming adhesive layer on the cover board, reduce the potential failure risk of product.The pixel control layer includes first circuit layer, the first insulating layer being formed in the first circuit layer and the second circuit layer being formed on first insulating layer.First insulating layer is between the first circuit layer and the second circuit layer.The first circuit layer and the second circuit layer are worked in coordination to detect the operation on the touch panel.The invention discloses a kind of touch screens.Touch screen includes above-mentioned touch panel.The invention also discloses a kind of electronic devices.Electronic device includes shell and above-mentioned touch panel.
Description
Technical field
The present invention relates to technical field of touch control, more particularly, to a kind of electronic device, touch screen and touch panel.
Background technique
The glass surface surface of unlike material glass or different vendor's production cannot can reach uniformity level, exist
Product potential failure risk.
Summary of the invention
Embodiments of the present invention provide a kind of electronic device, touch screen and touch panel.
The touch panel of embodiment of the present invention includes cover board, the adhesive layer being formed directly on the cover board and is formed in
Pixel control layer on the adhesive layer.The pixel control layer is used to detect the operation on the touch panel.
The adhesive force of lid surface can be improved by forming adhesive layer on the cover board, reduce the potential failure risk of product.
In some embodiments, the pixel control layer includes first circuit layer, is formed in the first circuit layer
The first insulating layer and the second circuit layer that is formed on first insulating layer.First insulating layer is located at first electricity
Between road floor and the second circuit layer.The first circuit layer and the second circuit layer are worked in coordination to detect the touch-control
Operation on panel.
Using the first insulating layer using silica or high transparency insulating oil, the thickness of touch panel can be reduced.
In some embodiments, the cover board includes glass substrate or thin-film material.
Above-mentioned material is used to have the advantages that translucency is good, easy to process as cover board.
In some embodiments, the adhesive layer and/or the first insulating layer use silica or high transparency insulating oil
It is made.
Using the first insulating layer using silica or high transparency insulating oil, the thickness of touch panel can be reduced.
In some embodiments, the thickness of the adhesive layer and/or the first insulating layer is in 0.005-1.6 microns.
Using the adhesive layer and/or the first insulating layer using silica or high transparency insulating oil, touch surface can be reduced
The thickness of plate.
In some embodiments, the thickness of the adhesive layer and/or the first insulating layer is in 0.005 microns.
If the materials'use silica of adhesive layer and/or the first insulating layer, the thickness of adhesive layer and/or the first insulating layer
Degree is in 0.005 microns.
In some embodiments, the thickness of the adhesive layer and/or the first insulating layer is in 1.1-1.6 microns.
If the materials'use high transparency insulating oil of adhesive layer and/or the first insulating layer, adhesive layer and/or the first insulating layer
Thickness in 1.1-1.6 microns.
In some embodiments, the first circuit layer and/or the second circuit layer are made of metal.
The material of first circuit layer and/or the second circuit layer reduces the impedance of circuit layer using metal.
In some embodiments, the impedance of the first circuit layer and/or the second circuit layer is less than 40 ohm.
The impedance for reducing circuit layer is easy to use felt pen to be debugged, and can enable the developing direction for adapting to touch panel.
In some embodiments, the first circuit layer and/or the second circuit layer using metallic silver, molybdenum aluminium molybdenum or
Metallic copper is made.
In this way, readily available material, reduces cost.
In some embodiments, the thickness of the first circuit layer and/or the second circuit layer is micro- 1.2 to 1.3
Between rice.
In this way, electrode to be set up directly on circuit layer to the thickness that can reduce circuit layer.
In some embodiments, the first circuit layer is by being deposited, being lithographically formed on the cover board.Described first
Insulating layer is formed in the first circuit layer by vapor deposition.The first circuit layer is located at the cover board and first insulation
Between layer.The second circuit layer is by vapor deposition and is lithographically formed on first insulating layer.First insulating layer is located at
Between the first circuit layer and the second circuit layer.
In this way, the thickness of touch panel can be reduced.
The touch screen of embodiment of the present invention includes touch panel described in any of the above-described embodiment.
Touch screen can be made to reach lightening and reduce using the touch panel causes because inter-module adhesive force is bad
Failure risk.
The electronic device of embodiment of the present invention includes touch panel described in shell and any of the above-described embodiment.
Electronic device can be made to reach lightening and reduce using the touch panel to lead because inter-module adhesive force is bad
The failure risk of cause.
Detailed description of the invention
The above-mentioned and/or additional aspect and advantage of embodiments of the present invention are from combination following accompanying drawings to embodiment
It will be apparent and be readily appreciated that in description, in which:
Fig. 1 is the schematic diagram for the electronic device that embodiment of the present invention provides.
Fig. 2 is the schematic diagram for the touch screen that embodiment of the present invention provides.
Fig. 3 is the stacking schematic diagram for the touch panel 10 that embodiment of the present invention provides.
Fig. 3 a is the stacking schematic diagram for the touch panel 10a that embodiment of the present invention provides.
Fig. 3 b is the stacking schematic diagram for the touch panel 10b that embodiment of the present invention provides.
Fig. 3 c is the stacking schematic diagram for the touch panel 10c that embodiment of the present invention provides.
Fig. 4 is the decomposition diagram for the touch panel that embodiment of the present invention provides.
Fig. 5 is the schematic cross-section in the manufacturing process for the touch panel that embodiment of the present invention provides.
Fig. 6 is the flow diagram of the manufacturing method for the touch panel that embodiment of the present invention provides.
Fig. 7 is the decomposition diagram for the touch panel that another embodiment of the present invention provides.
Fig. 8 is the flow diagram of the manufacturing method for the touch panel that another embodiment of the present invention provides.
Fig. 9 is the flow diagram of the manufacturing method for the touch panel that a further embodiment of this invention provides.
Figure 10 is the partial sectional schematic view for the touch panel that another embodiment of the present invention provides.
Main element symbol description:
Electronic device 1000, touch screen 100, shell 200, touch panel 10, display screen 20, cover board 12, the first ink mass
13, touch-control sensing layer 14, first circuit layer 142, first electrode 1422, first line 1424, the first insulating layer 144, leveling
1442, filled layer 1444, the second circuit layer 146, second electrode 1462, the second route 1464, the 148, second oil of second insulating layer
Ink stick 15, adhesive layer 16, third insulating layer 18.
Specific embodiment
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and for explaining only the invention, and is not considered as limiting the invention.
Following disclosure provides many different embodiments or example is used to realize different structure of the invention.In order to
Simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and
And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting
Relationship.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time
Needle ", instruction " counterclockwise " orientation or positional relationship be based on the orientation or positional relationship shown in the drawings, be merely for convenience of retouching
It states the present invention and simplifies description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with specific
Orientation construction and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for retouching
Purpose is stated, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic.By
This defines " first ", the feature of " second " can explicitly or implicitly include one or more feature.At this
In the description of invention, the meaning of " plurality " is two or more, unless otherwise specifically defined.
Any process described otherwise above or method description are construed as in flow chart or herein, and expression includes
It is one or more for realizing specific logical function or process the step of executable instruction code module, segment or portion
Point, and the range of the preferred embodiment of the present invention includes other realization, wherein can not press shown or discussed suitable
Sequence, including according to related function by it is basic simultaneously in the way of or in the opposite order, Lai Zhihang function, this should be of the invention
Embodiment person of ordinary skill in the field understood.
Fig. 1 and Fig. 2 are please referred to, the touch panel 10 of first embodiment of the invention can be applied to touch screen 100, and can
To further apply in electronic device 1000.
It is appreciated that electronic device 1000 includes touch screen 100.Electronic device 1000 can be mobile phone, tablet computer, pen
Remember this computer, intelligent wearable device etc..It takes the mobile phone as an example and is illustrated in the present embodiment.
It it is appreciated that electronic device 1000 can be not limited to example discussed above, and should include that other can be applied
The example of touch screen 100.
It is appreciated that touch screen 100 should also be not limited to be applied to electronic device 1000, and it is suitable to can be applied to other
Occasion, such as applied to equipment such as household electrical appliance or instrument and meters.
It is appreciated that touch screen 100 includes touch panel 10.Touch screen 100 generally further includes display screen 20.Display screen 20
It can be set in 10 downside of touch panel, for together constituting with graphical interface of user with touch panel 10.
It is appreciated that the shape and size of touch panel 10 can be corresponding with display screen 20 and cover the effective of display screen 20
Display area.As an example, the shape and size of touch panel 10 can the shape for referring to touch panel 10 corresponding with display screen 20
Shape and size can be identical as display screen 20, and the utilization rate of touch panel 10 and display screen 20 so can be improved.Certainly, at it
In his example, shape and display that the shape and size of touch panel 10 corresponding with display screen 20 can refer to touch panel 10
The shape of screen 20 is similar, and size can be slightly larger than or be slightly less than the size of display screen 20.
Certainly, touch panel 10 should also be not limited to be applied to touch screen 100, and can be applied to other suitable fields
It closes, for example, being applied on the input face without display function, such as Trackpad of laptop etc..
Fig. 3 and Fig. 4 are please referred to, touch panel 10 includes cover board 12, the first ink mass 13 being formed on cover board 12 and touching
Control inductive layer 14.First ink mass 13 is formed in the edge of cover board 12 and covers the edge of cover board 12.Touch-control sensing layer 14 is direct
It is formed on cover board 12 and covers the first ink mass 13 and cover board 12.Touch-control sensing layer 14 includes being formed directly on cover board 12
First circuit layer 142.First circuit layer 142 includes multiple first electrodes 1422 for detecting touch operation.
Cover board 12 can be glass cover-plate or thin-film material.
Certainly, cover board 12 can be not limited to material mentioned above, and can use suitable material according to demand.At certain
A little cover boards 12 are can also to be strengthened to promote the intensity of cover board 12 to cover board 12 in the example of glass cover-plate, help to prolong
The service life of long touch panel 10 promotes product quality.
The shape of cover board 12 can be rectangle.
Certainly, the shape of cover board 12 can be not limited to rectangle, and can be depending on actual demand, such as cover board 12
Shape is also possible to ellipse either round rectangle.
In addition to first circuit layer 142, touch panel 10 further includes the first insulation being formed directly into first circuit layer 142
Layer 144 and the second circuit layer 146 being formed directly on the first insulating layer 144.The second circuit layer 146 includes multiple second electrodes
1462.Multiple first electrodes 1422 and the cooperation of multiple second electrodes 1462 are for detecting the touch control operation on touch panel 10.
Multiple first electrodes 1422 and/or multiple second electrodes 1462 can be in array distribution.
First circuit layer 142 can be formed on cover board 12 by printing, coating, sputter, vapor deposition, certainly, first electrode
1422 manufacturing method is not limited to process above.
First circuit layer 142 can be latticed, and the grid of first circuit layer 142 can be set to arbitrary shape, example
It can be such as the combination of any one or more in rectangle, diamond shape, pentagon, hexagon.
The material of first insulating layer 144 can be silica or high transparency insulating oil, but be not limited only to this two material.
For example, the material of the first insulating layer 144 can also be TPF optical cement.
The thickness of first insulating layer 144 is in 0.005-1.6 microns.Specifically, if the material of the first insulating layer 144 makes
With silica, then the thickness of the first insulating layer 144 is in 0.005 microns.If the materials'use of the first insulating layer 144 is high thoroughly
Bright insulating oil, then the thickness of the first insulating layer 144 is in 1.1-1.6 microns.
The shape of first insulating layer 144 and the shape of first circuit layer 142 are adapted.
Please refer to fig. 5, the first insulating layer 144 includes leveling 1442 and the filled layer extended downwardly from leveling 1442
1444, filled layer 1444 is filled in first circuit layer 142 and is formed by gap, and leveling 1442 is placed in 142 table of first circuit layer
Face, the second circuit layer 146 are formed in the surface of leveling 1442.In this way, making first circuit layer 142 and the second circuit layer 146 by
One insulating layer 144 is preferably spaced, moreover, the first insulating layer 144 and the bond strength of first circuit layer 142 are larger.
Specifically, first circuit layer 142 and the second circuit layer 146 is made to be spaced to make by the way that the first insulating layer 144 is arranged
It obtains and insulate between first circuit layer 142 and the second circuit layer 146 and realize capacitance touch function.
The second circuit layer 146 can be formed on the first insulating layer 144 by printing, coating, sputter, vapor deposition, certainly, the
The manufacturing method of two circuit layers 146 is not limited to process above.
The second circuit layer 146 can be latticed, and the grid of the second circuit layer 146 can be set to arbitrary shape, example
It can be such as the combination of any one or more in rectangle, diamond shape, pentagon, hexagon.
The mesh shape of the second circuit layer 146 and the shape of first circuit layer 142 can be the same or different.
The grid of first circuit layer 142 and/or the second circuit layer 146 is made of superfine metal wire, the diameter of metal wire
Small to find out metal wire to human eye, the grid that metal wire is constituted is close to pellucidity.
The size of each grid of first circuit layer 142 and the second circuit layer 146 need to the resolution match of display screen 20,
The phenomenon that avoiding the occurrence of Moire fringe influences user experience.The shape of first circuit layer 142 and the second circuit layer 146, size are answered
It is adapted with shape, the size of display screen 20, to realize the effect of comprehensive touch-control.
First circuit layer 142 further includes first for being located on the same floor with first electrode 1422 and connecting with first electrode 1422
Route 1424.
The second circuit layer 146 further includes second for being located on the same floor with second electrode 1462 and connecting in second electrode 1462
Route 1464.
Multiple first line 1424 and multiple second routes 1464 are in array distribution.
First circuit layer 142 and/or the second circuit layer 146 are printed using whole face, whole face exposure, and whole face development will be required
Route and/or electrode (induction line and periphery cabling in face) integral production come out, and wherein route and periphery cabling exist in face
Uniform level face.
The impedance of first circuit layer 142 and/or the second circuit layer 146 is less than 40 ohm.First circuit layer 142 and the second electricity
The impedance of road floor 146 is determined by their shape and used material.Certainly, first circuit layer 142 and the second circuit layer 146
Impedance be not limited to above embodiment.
The thickness of first circuit layer 142 and/or the second circuit layer 146 is between 1.2 to 1.3 microns.First circuit layer 142
It is determined with the thickness of the second circuit layer 146 by their shape and used material.Certainly, first circuit layer 142 and second
The thickness of circuit layer 146 can be not limited to above-mentioned section.
First circuit layer 142 and/or the second circuit layer 146 can be made of metal.Specifically, first circuit layer 142
And/or the second circuit layer 146 can be made of metallic silver, molybdenum aluminium molybdenum or metallic copper.Certainly, first circuit layer 142 and second
The material and shape of circuit layer 146 can be not limited to above embodiment.
Touch panel 10 can also include second insulating layer 148 and the second ink mass 15.Second insulating layer 148 is formed in
On two circuit layers 146, the first insulating layer 144 and second insulating layer 148 are spaced by second electrode 1462.Second ink mass 15 is directly
It is formed in the edge of second insulating layer 148.The edge of second ink mass 15 covering second insulating layer 148.Second ink mass, 15 He
The second circuit layer 146 is spaced by second insulating layer 148.
The material of second insulating layer 148 can be silica or high transparency insulating oil, but be not limited only to this two material.
For example, the material of second insulating layer 148 can also be TPF optical cement.
The thickness of second insulating layer 148 is in 0.005-1.6 microns.Specifically, if the material of second insulating layer 148 makes
With silica, then the thickness of the first insulating layer 144 is in 0.005 microns.If the materials'use of second insulating layer 148 is high thoroughly
Bright insulating oil, then the thickness of the first insulating layer 144 is in 1.1-1.6 microns.
First insulating layer 144 can be formed in first circuit layer 142 by plating.Second insulating layer 148 can pass through
Plating is formed in the second circuit layer 146.The manufacturing method of certain first insulating layer 144 and second insulating layer 148 be not limited to
Upper technique.
Also referring to Fig. 3 a, the touch panel 10a of second embodiment and 10 base of touch panel of first embodiment
This is identical, and difference is that touch panel 10 further comprises the adhesive layer 16 being arranged between cover board 12 and touch-control sensing layer 14.
It is formed directly with adhesive layer 16 on cover board 12, forms the first ink mass 13 at 16 edge of adhesive layer.First ink mass
The edge of 13 covering adhesive layers 16.Touch-control sensing layer 14 is formed on adhesive layer 16, touch-control sensing layer 14 covers the first ink mass
13 and adhesive layer 16.Touch-control sensing layer 14 is used to detect the operation on touch panel 10.
The material of adhesive layer 16 can be silica or high transparency insulating oil, but be not limited only to this two material.According to
Different cover boards 12, adhesive layer 16 can use different materials to adapt to the demand of surface energy.Plasma can also be passed through
And/or deep ultraviolet light handles 12 surface of cover board.Certainly, the material of adhesive layer 16 and processing method be not limited to more than embodiment party
Formula.Adhesive layer 16 can be used for insulating and/or increasing material cohesion.
The material of adhesive layer 16 can be silica or high transparency insulating oil, but be not limited only to this two material.For example,
The material of adhesive layer 16 can also be TPF optical cement.
The thickness of adhesive layer 16 is in 0.005-1.6 microns.Specifically, if the materials'use titanium dioxide of adhesive layer 16
Silicon, then the thickness of the first insulating layer 144 is in 0.005 microns.If the materials'use high transparency insulating oil of adhesive layer 16, the
The thickness of one insulating layer 144 is in 1.1-1.6 microns.
Touch-control sensing layer 14 includes first circuit layer 142, the first insulating layer 144 and the second circuit layer 146.First circuit layer
142 include multiple first electrodes 1422.First insulating layer 144 is formed in first circuit layer 142.The formation of the second circuit layer 146
In on the first insulating layer 144, the second circuit layer 146 includes multiple second electrodes 1462.Multiple first electrodes 1422 and multiple
Two electrodes 1462 cooperate for detecting the touch control operation on touch panel 10.
Also referring to Fig. 3 b, the touch panel 10b of third embodiment and 10 base of touch panel of first embodiment
This is identical, and difference is that touch panel 10b further comprises the be arranged between the first ink mass 13 and touch-control sensing layer 14
Three insulating layers 18.
The material of third insulating layer 18 can be silica or high transparency insulating oil, but be not limited only to this two material.
For example, the material of third insulating layer 18 can also be TPF optical cement.
The thickness of third insulating layer 18 is in 0.005-1.6 microns.Specifically, if the materials'use of third insulating layer 18
Silica, then the thickness of third insulating layer 18 is in 0.005 microns.If the materials'use high transparency of third insulating layer 18 is exhausted
Edge oil, then the thickness of third insulating layer 18 is in 1.1-1.6 microns.
The shape of third insulating layer 18 and the shape of first circuit layer 142 are adapted.
Also referring to Fig. 3 c, the touch panel 10c of the 4th embodiment and the touch panel 10a base of second embodiment
This is identical, and difference is that touch panel 10c further comprises the be arranged between the first ink mass 13 and touch-control sensing layer 14
Three insulating layers 18.
Below by taking the material of first circuit layer 142 and the second circuit layer 146 is metallic silver as an example, embodiment party of the present invention is introduced
A kind of manufacturing method of touch panel 10 of formula.It is appreciated that the material of first circuit layer 142 and the second circuit layer 146 is unlimited
In metallic silver.
Referring to Figure 6 together and Fig. 7, a kind of touch panel 10 of embodiment of the present invention manufacturing method comprising steps of
S11 provides a cover board 12；
S13 forms the first silver coating on the surface of cover board 12；
S14, the first silver coating of processing are latticed to form the first silver medal clathrum 142a；
S15 forms the first insulating layer 144 on the first silver medal clathrum 142a；
S16 forms the second silver coating, the second silver coating and the first silver medal clathrum 142a on the surface of the first insulating layer 144
It is spaced by the first insulating layer 144；
S17, the second silver coating of processing are latticed to form the second silver medal clathrum 146a.
It is extra when processing silver coating to form silver-colored clathrum in the manufacturing method of embodiment of the present invention touch panel 10
Silver can recycle, the utilization rate of raw material can be improved, help to economize on resources, reduce manufacturing cost.
It is set it is appreciated that above-mentioned touch panel 10 can be applied to mobile phone, tablet computer, laptop, intelligence wearing
It is standby to wait in electronic equipments.
The grid of first silver medal clathrum 142a and the second silver medal clathrum 146a are made of superfine silver wire, and the diameter of silver wire is small
Silver wire can not be found out to human eye, and the grid that silver wire is constituted is close to pellucidity.
Specifically among step S11, cover board 12 can be glass cover-plate 12, can be strengthened to cover board 12 to promote lid
The intensity of plate 12 facilitates the service life for extending touch panel 10, promotes product quality.
Before step S13, one layer of adhesive layer 16 can be re-formed on the surface of cover board 12, the first silver coating is formed in bonding
On layer 16, adhesive layer 16 can be used for being isolated the first silver coating and cover board 12 and protect the first silver coating.Adhesive layer 16 can also change
It is apt to 12 surface of cover board to the first silver coating adhesive force.
In step S13, silver paste can be applied to the surface of cover board 12 by way of coating.Cover board 12 includes opposite up and down
Two surfaces.In embodiment of the present invention, the surface of cover board 12 is completely covered to realize full frame touch-control in the first silver coating.
In step S14, the grid of the first silver medal clathrum 142a can be set to arbitrary shape, such as can be rectangle, water chestnut
Shape, pentagon, the combination of any one or more in hexagon.
In step S15, the first silver medal clathrum 142a is completely covered to protect the first silver medal clathrum 142a in the first insulating layer 144
And make the first silver medal clathrum 142a and other structures interval.
In step S16, silver paste can be applied to the surface of the first insulating layer 144 by way of coating.The present invention is implemented
In mode, the surface of the first insulating layer 144 is completely covered to realize full frame touch-control in the second silver coating.
In step S17, the grid of the second silver medal clathrum 146a can be set to arbitrary shape, such as can be rectangle, water chestnut
Shape, pentagon, the combination of any one or more in hexagon.The mesh shape and the first silver medal net of second silver medal clathrum 146a
The shape of compartment 142a can be the same or different.
After step S17, first insulating layer 148 can be re-formed on the second silver medal clathrum 146a, to be used to protect
Second silver medal clathrum 146a.
It is appreciated that the first silver medal clathrum 142a and the second silver medal clathrum 146a may make up emitter and receiving pole, receive
Pole and emitter constitute the two poles of the earth of capacitor, and when finger is applied on touch panel 10, receiving pole and emitter induction are in one's hands
Refer to the capacitance variations at position, realizes touch-control.The first silver medal clathrum 142a be can be as emitter, the second silver medal clathrum
146a is as receiving pole；It is also possible to the first silver medal clathrum 142a as receiving pole, the second silver medal clathrum 146a as emitter.
Further, when the touch panel 10 of above-mentioned manufacturing method manufacture is applied to electronic equipment, electronic equipment is also wrapped
Include display screen 20.The size of each grid of first silver medal clathrum 142a and the second silver medal clathrum 146a need to be with point of display screen 20
The phenomenon that resolution matches, and avoids the occurrence of Moire fringe influences user experience.
Also referring to Fig. 8, in some embodiments, step S14 includes:
S142 forms photoresist layer on the first silver coating surface；
S144, exposure and imaging photoresist layer form gridding photoresist layer；
S146 etches gridding photoresist layer and the first silver coating to form the first silver medal clathrum 142a；
S148 removes the gridding photoresist layer on the first silver medal clathrum 142a.
In this way, technical process is simple, production efficiency is helped to improve.
It specifically, can be by forming latticed light-shielding pattern on light shield when exposure；Then light shield is placed in photoresist layer
On；Allow ultraviolet radiator to irradiate photoresist layer again, ultraviolet light can not by being formed with the part of latticed light-shielding pattern on light shield, and
Ultraviolet light can penetrate the transparent part of the not formed light-shielding pattern on light shield and be irradiated to photoresist layer, generate photoresist layer anti-
It answers, so that the latticed light-shielding pattern on light shield is thrown on photoresist layer, then is developed i.e. to the photoresist layer after exposure
Gridding photoresist layer can be formed；It is etched further according to the lattice on gridding photoresist layer, obtains the first silver medal clathrum
142a。
In some embodiments, before step S14, the manufacturing method of touch panel 10 is further comprised the steps of:
The first silver coating of prebake conditions.
In this way, the first silver coating is made to lose flowability, convenient for it is subsequent first silver coating is processed as it is latticed to form
One silver medal clathrum 142a.
Specifically, silver paste is the liquefied mixture comprising silver and solvent, has mobility.Therefore, need to carry out prebake conditions with
So that the solvent portion in the first silver coating is volatilized, makes the form stable of the first silver coating, carry out step S14 again later.
In some embodiments, before step S15, the manufacturing method of touch panel 10 is further comprised the steps of:
Toast the first silver medal clathrum 142a.
In this way, making the first silver medal clathrum 142a that molding be fully cured.
Specifically, so that most of solvent in the first silver medal clathrum 142a is volatilized after baking, make the first silver medal clathrum 142a
Shape remain unchanged, carry out step S15 again later.
In some embodiments, step S15 includes:
Coating insulating materials forms the first insulating layer 144 to the first silver medal clathrum 142a.
In this way, coating method makes insulating materials be evenly distributed in the first silver medal clathrum 142a, to obtain more uniform
The first insulating layer 144.
First insulating layer 144 includes leveling 1442 and the filled layer 1444 extended downwardly from leveling 1442, filled layer 1444
It is filled in the first silver medal clathrum 142a to be formed by gap, leveling 1442 is placed on the first silver medal clathrum 142a, and the second silver medal applies
Layer is formed in the surface of leveling 1442.In this way, making the first silver medal clathrum 142a and the second silver medal clathrum 146a by the first insulating layer
144 are preferably spaced, moreover, the bond strength of the first insulating layer 144 and the first silver medal clathrum 142a is larger.
Specifically, the grid of the first silver medal clathrum 142a and the second silver medal clathrum 146a are all made of superfine silver wire, are led to
Crossing the first insulating layer 144 of setting makes the first silver medal clathrum 142a and the second silver medal interval clathrum 146a so that the first silver medal grid
It insulate between layer 142a and the second silver medal clathrum 146a and realizes capacitance touch function.
Also referring to Fig. 9, in some embodiments, step S17 includes:
S172 forms photoresist layer on the second silver coating surface；
S174, exposure and imaging photoresist layer form gridding photoresist layer；
S176 etches gridding photoresist layer and the second silver coating to form the second silver medal clathrum 146a；
S178 removes the gridding photoresist layer on the second silver medal clathrum 146a.
In this way, technical process is simple, production efficiency is helped to improve.
It specifically, can be by forming latticed light-shielding pattern on light shield when exposure；Then light shield is placed in photoresist layer
On；Allow ultraviolet radiator to irradiate photoresist layer again, ultraviolet light can not by being formed with the part of latticed light-shielding pattern on light shield, and
Ultraviolet light can penetrate the transparent part of the not formed light-shielding pattern on light shield and be irradiated to photoresist layer, generate photoresist layer anti-
It answers, so that the latticed light-shielding pattern on light shield is thrown on photoresist layer, then is developed i.e. to the photoresist layer after exposure
Gridding photoresist layer can be formed；It is etched further according to the lattice on gridding photoresist layer, obtains the second silver medal clathrum
146a。
In some embodiments, before step S17, the manufacturing method of touch panel 10 is further comprised the steps of:
The second silver coating of prebake conditions.
In this way, the second silver coating is made to lose flowability, convenient for it is subsequent second silver coating is processed as it is latticed to form
Two silver medal clathrum 146a.
Specifically, silver paste is the liquefied mixture comprising silver and solvent, has mobility.Therefore, need to carry out prebake conditions with
So that the solvent portion in the second silver coating is volatilized, makes the form stable of the second silver coating, and then carry out step.
In some embodiments, after step S17, the manufacturing method of touch panel 10 is further comprised the steps of:
Toast the second silver medal clathrum 146a.
In this way, making the second silver medal clathrum 146a that molding be fully cured.
Specifically, so that most of solvent in the second silver medal clathrum 146a is volatilized after baking, make the second silver medal clathrum 146a
Shape remain unchanged.
In some embodiments, the manufacturing method of touch panel 10 further comprises the steps of:
The first ink mass 13 is formed at 12 edge of cover board；
Step S13 includes:
Coating silver paste forms the first silver coating to the surface of cover board 12, and the first silver coating covers the first ink mass 13.
In this way, the first ink mass 13 blocks electronics when touch panel 10 is applied to the electronic equipments such as mobile phone, tablet computer
Other components inside equipment, avoid user from seeing other components of electronic equipment internal from electronic device exterior, help to mention
Rise user experience.
When 12 edge of cover board forms the first ink mass 13, one layer of third insulating layer 18 can be formed on cover board 12 so that the
One silver coating and cover board 12 and the first ink mass 13 are spaced and protect the first silver coating.Third insulating layer 18 can also alleviate first
13 bring segment difference of ink mass reduces or eliminates disconnection problem caused by the first silver coating is limited because of material climbing capacity.It can be with
Understand, third insulating layer 18 covers the first ink mass 13.
In some embodiments, after step S17, the manufacturing method of touch panel 10 is further comprised the steps of:
The second ink mass 15 is formed at 12 edge of cover board, the second ink mass 15 covers the edge of the second silver medal clathrum 146a.
In this way, the second ink mass 15 can block the edge of the second silver medal clathrum 146a.
Specifically, can be arranged between the second silver medal clathrum 146a and the second ink mass 15 first insulating layer 148 with
Make other component intervals of the second silver medal clathrum 146a and the second ink mass 15 and electronic equipment, protects the second silver medal clathrum
146a。
A kind of touch panel 10 of embodiment of the present invention includes cover board 12, the first silver medal clathrum 142a, the first insulating layer
The 144 and second silver medal clathrum 146a.First silver medal clathrum 142a is formed in the surface of cover board 12.First insulating layer 144 is formed in
On first silver medal clathrum 142a.Second silver medal clathrum 146a is formed in the surface of the first insulating layer 144, the first silver medal clathrum 142a
It is spaced with the second silver medal clathrum 146a by the first insulating layer 144.
Embodiment of the present invention touch panel 10, when processing silver coating to form silver-colored clathrum, extra silver can be recycled
It utilizes, the utilization rate of raw material can be improved, help to economize on resources, reduce manufacturing cost.
Specifically, the edge of cover board 12 is additionally provided with the first ink mass 13, the first silver medal clathrum 142a covering first
Ink mass 13.In this way, the first ink mass 13 blocks electricity when touch panel 10 is applied to the electronic equipments such as mobile phone, tablet computer
Other components inside sub- equipment, avoid user from seeing other components of electronic equipment internal from electronic device exterior, facilitate
Promote user experience.
The edge of second silver medal clathrum 146a is additionally provided with the second ink mass 15, and the second ink mass 15 covers the second silver medal
The edge of clathrum 146a.
In this way, the second ink mass 15 can block the edge of the second silver medal clathrum 146a.
Further, first insulating layer 148 can be set between the second silver medal clathrum 146a and the second ink mass 15
So that other component intervals of the second silver medal clathrum 146a and the second ink mass 15 and electronic equipment, protect the second silver medal clathrum
146a.One layer of third insulating layer 18 can also be set between the first silver medal clathrum 142a and the first ink mass 13 so that the first silver medal net
Compartment 142a and the first ink mass 13 and cover board 12 are spaced, and protect the first silver medal clathrum 142a.
Also referring to Figure 10, in some embodiments, the first insulating layer 144 includes leveling 1442 and from leveling 1442
The filled layer 1444 extended downwardly, filled layer 1444 are filled in the first silver medal clathrum 142a and are formed by gap, leveling 1442
It is placed on the first silver medal clathrum 142a, the second silver medal clathrum 146a is formed in the surface of leveling 1442.In this way, making the first silver medal grid
Layer 142a and the second silver medal clathrum 146a is preferably spaced by the first insulating layer 144, moreover, the first insulating layer 144 and the first silver medal
The bond strength of clathrum 142a is larger.
Specifically, the grid of the first silver medal clathrum 142a and the second silver medal clathrum 146a are all made of superfine silver wire, are led to
Crossing the first insulating layer 144 of setting makes the first silver medal clathrum 142a and the second silver medal interval clathrum 146a so that the first silver medal grid
It insulate between layer 142a and the second silver medal clathrum 146a and realizes capacitance touch function.
The touch panel 10 of embodiment of the present invention includes cover board 12, the adhesive layer 16 being formed directly on the cover board 12
With the pixel control layer 14 being formed on the adhesive layer 16.The pixel control layer 14 is for detecting the touch panel 10
Operation.
Adhesive layer 16 is formed on cover board 12 can improve the adhesive force on 12 surface of cover board, reduce product and potentially fail wind
Danger.
In some embodiments, the pixel control layer 14 includes first circuit layer 142, is formed in first circuit
First on layer 142 insulating layer 144 and the second circuit layer 146 that is formed on first insulating layer 144.First insulation
Layer 144 is between the first circuit layer 142 and the second circuit layer 146.The first circuit layer 142 and described second
Circuit layer 146 is worked in coordination to detect the operation on the touch panel 10.
The thickness of touch panel 10 can be reduced using the first insulating layer 144 using silica or high transparency insulating oil
Degree.
In some embodiments, the cover board 12 includes glass substrate or thin-film material.
Above-mentioned material is used to have the advantages that translucency is good, easy to process as cover board 12.
In some embodiments, the adhesive layer 16 and/or the first insulating layer 144 are exhausted using silica or high transparency
Edge oil is made.
Using the first insulating layer 144 using silica or high transparency insulating oil, the thickness of touch panel 10 can be reduced
Degree.
In some embodiments, the thickness of the adhesive layer 16 and/or the first insulating layer 144 is at 0.005-1.6 microns
Left and right.
Using the adhesive layer 16 and/or the first insulating layer 144 using silica or high transparency insulating oil, touching can be reduced
Control the thickness of panel 10.
In some embodiments, the thickness of the adhesive layer 16 and/or the first insulating layer 144 is in 0.005 microns.
If the materials'use silica of adhesive layer 16 and/or the first insulating layer 144, adhesive layer 16 and/or first is absolutely
The thickness of edge layer 144 is in 0.005 microns.
In some embodiments, the thickness of the adhesive layer 16 and/or the first insulating layer 144 is on a 1.1-1.6 microns of left sides
It is right.
If the materials'use high transparency insulating oil of adhesive layer 16 and/or the first insulating layer 144, adhesive layer 16 and/or
The thickness of one insulating layer 144 is in 1.1-1.6 microns.
In some embodiments, the thickness of the first circuit layer 142 and/or the second circuit layer 146 is arrived 1.2
Between 1.3 microns.
In this way, the thickness of circuit layer can be reduced.
In some embodiments, the first circuit layer 142 and/or the second circuit layer 146 are made of metal.
The material of first circuit layer 142 and/or the second circuit layer 146 reduces the resistance of circuit layer using metal
It is anti-.
In some embodiments, the impedance of the first circuit layer 142 and/or the second circuit layer 146 is less than 40
Ohm.
The impedance for reducing circuit layer is easy to use felt pen to be debugged, and can enable the development side for adapting to touch panel 10
To.
In some embodiments, the first circuit layer 142 and/or the second circuit layer 146 use metallic silver, molybdenum
Aluminium molybdenum or metallic copper are made.
In this way, readily available material, reduces cost.Certainly, the material of first circuit layer 142 and the second circuit layer 146, shape
Shape can be not limited to above embodiment.Metal conducts electricity very well, and touch-control sensing can be made sensitiveer.
The impedance of first circuit layer 142 and the second circuit layer 146 is determined by their shape and used material.When
So, the impedance of first circuit layer 142 and the second circuit layer 146 is not limited to above embodiment.Enable impedance is lower can increase electricity
The electric conductivity of road floor can make touch-control sensing sensitiveer, reduce the energy loss on circuit.
In some embodiments, the thickness of the first circuit layer 142 and/or the second circuit layer 146 is arrived 1.2
Between 1.3 microns.Circuit layer 142 and the thickness of the second circuit layer 146 are determined by their shape and used material.When
So, the thickness of first circuit layer 142 and the second circuit layer 146 can be not limited to above-mentioned section.
The material of first insulating layer 144 can be silica or high transparency insulating oil, but be not limited only to this two material.
For example, the material of the first insulating layer 144 can also be TPF optical cement.Specifically, if the materials'use two of the first insulating layer 144
Silica, then the thickness of the first insulating layer 144 is in 0.005 microns.If the materials'use high transparency of the first insulating layer 144 is exhausted
Edge oil, then the thickness of the first insulating layer 144 is in 1.1-1.6 microns.
In some embodiments, the first circuit layer 142 is by being deposited, being lithographically formed on the cover board 12.Institute
The first insulating layer 144 is stated to be formed in the first circuit layer 142 by vapor deposition.The first circuit layer 142 is located at the lid
Between plate 12 and first insulating layer 144.The second circuit layer 146 is by vapor deposition and is lithographically formed in first insulation
On layer 144.First insulating layer 144 is between the first circuit layer 142 and the second circuit layer 146.
In this way, the thickness of touch panel 10 can be reduced.
The touch screen 100 of embodiment of the present invention includes touch panel 10 described in any of the above-described embodiment.
Using touch panel 10 can make touch screen 100 reach it is lightening and reduce because inter-module adhesive force it is bad caused by
Failure risk.
The electronic device 1000 of embodiment of the present invention includes touch surface described in shell 200 and any of the above-described embodiment
Plate 10.
Electronic device 1000 can be made to reach lightening and reduce using touch panel 10 to lead because inter-module adhesive force is bad
The failure risk of cause.
It is appreciated that electronic device 1000 includes touch screen 100.Electronic device 1000 can be mobile phone, tablet computer, pen
Remember this computer, intelligent wearable device etc..It takes the mobile phone as an example and is illustrated in the present embodiment.
It it is appreciated that electronic device 1000 can be not limited to example discussed above, and should include that other can be applied
The example of touch screen 100.
It is appreciated that touch screen 100 should also be not limited to be applied to electronic device 1000, and it is suitable to can be applied to other
Occasion, such as applied to equipment such as household electrical appliance or instrument and meters.
It is appreciated that touch screen 100 includes touch panel 10.Touch screen 100 generally further includes display screen 20.Display screen 20
It can be set in 10 downside of touch panel, for together constituting with graphical interface of user with touch panel 10.
It is appreciated that the shape and size of touch panel 10 can be corresponding with display screen 20 and cover the effective of display screen 20
Display area.As an example, the shape and size of touch panel 10 can the shape for referring to touch panel 10 corresponding with display screen 20
Shape and size can be identical as display screen 20, and the utilization rate of touch panel 10 and display screen 20 so can be improved.Certainly, at it
In his example, shape and display that the shape and size of touch panel 10 corresponding with display screen 20 can refer to touch panel 10
The shape of screen 20 is similar, and size can be slightly larger than or be slightly less than the size of display screen 20.
Certainly, touch panel 10 should also be not limited to be applied to touch screen 100, and can be applied to other suitable fields
It closes, for example, being applied on the input face without display function, such as Trackpad of laptop etc..
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected or can mutually communicate；It can be directly connected, it can also be by between intermediary
It connects connected, can be the connection inside two elements or the interaction relationship of two elements.For the ordinary skill of this field
For personnel, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
In the present invention unless specifically defined or limited otherwise, fisrt feature second feature "upper" or "lower"
It may include that the first and second features directly contact, also may include that the first and second features are not direct contacts but pass through it
Between other characterisation contact.Moreover, fisrt feature includes the first spy above the second feature " above ", " above " and " above "
Sign is right above second feature and oblique upper, or is merely representative of first feature horizontal height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " include that fisrt feature is directly below and diagonally below the second feature, or is merely representative of
First feature horizontal height is less than second feature.
Claims (14)
1. a kind of touch panel, characterized by comprising:
Cover board；
The adhesive layer being formed directly on the cover board；With
The pixel control layer being formed on the adhesive layer, the pixel control layer are used to detect the behaviour on the touch panel
Make.
2. touch panel according to claim 1, which is characterized in that the pixel control layer includes:
First circuit layer；
The first insulating layer being formed in the first circuit layer；With
The second circuit layer being formed on first insulating layer, first insulating layer are located at the first circuit layer and described
Between the second circuit layer, the first circuit layer and the second circuit layer are worked in coordination to detect the behaviour on the touch panel
Make.
3. touch panel according to claim 2, which is characterized in that the cover board includes glass substrate or thin-film material.
4. touch panel according to claim 2, which is characterized in that the adhesive layer and/or the first insulating layer use two
Silica or high transparency insulating oil are made.
5. touch panel according to claim 2, which is characterized in that the thickness of the adhesive layer and/or the first insulating layer
In 0.005-1.6 microns.
6. touch panel according to claim 2, which is characterized in that the thickness of the adhesive layer and/or the first insulating layer
In 0.005 microns.
7. touch panel according to claim 2, which is characterized in that the thickness of the adhesive layer and/or the first insulating layer
In 1.1-1.6 microns.
8. touch panel according to claim 2, which is characterized in that the first circuit layer and/or the second circuit
Layer is made of metal.
9. touch panel according to claim 2, which is characterized in that the first circuit layer and/or the second circuit
The impedance of layer is less than 40 ohm.
10. touch panel according to claim 2, which is characterized in that the first circuit layer and/or the second circuit
Layer is made of metallic silver, molybdenum aluminium molybdenum or metallic copper.
11. touch panel according to claim 2, which is characterized in that the first circuit layer and/or the second circuit
The thickness of layer is between 1.2 to 1.3 microns.
12. touch panel according to claim 2, which is characterized in that the first circuit layer is by being deposited, being lithographically formed
In on the cover board；
First insulating layer by vapor deposition is formed in the first circuit layer, the first circuit layer be located at the cover board with
Between first insulating layer；
The second circuit layer is by vapor deposition and is lithographically formed on first insulating layer, and first insulating layer is located at described
Between first circuit layer and the second circuit layer.
13. a kind of touch screen, which is characterized in that the touch screen includes:
Touch panel described in claim 1-12 any one.
14. a kind of electronic device, which is characterized in that the electronic device includes:
Shell；With
Touch panel described in claim 1-12 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710983515.1A CN109696994A (en) | 2017-10-20 | 2017-10-20 | Electronic device, touch screen and touch panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710983515.1A CN109696994A (en) | 2017-10-20 | 2017-10-20 | Electronic device, touch screen and touch panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109696994A true CN109696994A (en) | 2019-04-30 |
Family
ID=66225250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710983515.1A Pending CN109696994A (en) | 2017-10-20 | 2017-10-20 | Electronic device, touch screen and touch panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109696994A (en) |
-
2017
- 2017-10-20 CN CN201710983515.1A patent/CN109696994A/en active Pending
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Effective date of registration: 20210415 Address after: 231323 Building 1, precision electronics industrial park, Hangbu Town, Shucheng County, Lu'an City, Anhui Province Applicant after: Anhui jingzhuo optical display technology Co.,Ltd. Address before: 330013 Huang Jia Hu West Road, Nanchang Economic Development Zone, Jiangxi Applicant before: Nanchang OFilm Tech. Co.,Ltd. |
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