CN109696992A - Touch control display apparatus, display panel and array substrate and its manufacturing method - Google Patents
Touch control display apparatus, display panel and array substrate and its manufacturing method Download PDFInfo
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- CN109696992A CN109696992A CN201910123860.7A CN201910123860A CN109696992A CN 109696992 A CN109696992 A CN 109696992A CN 201910123860 A CN201910123860 A CN 201910123860A CN 109696992 A CN109696992 A CN 109696992A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/046—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by electromagnetic means
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Abstract
The invention discloses a kind of touch control display apparatus, display panel and array substrate and its manufacturing method, the array substrate includes: the light emitting device driver circuit layer for being integrated with the light emitting functional layer of OLED device and multiple electromagnetic coils and driving the OLED device luminous；Wherein, the first electrode of the metal of the OLED device and the electromagnetic coil are laid in same metal layer；The second electrode of the OLED device has many places aperture, and each electromagnetic coil at least one section of metal wire is relative to tapping.The integral thickness of touch-control display panel can further be thinned using the present invention.
Description
Technical field
The present invention relates to technical field of touch-control display, a kind of touch control display apparatus, display panel and array are particularly related to
Substrate and its manufacturing method.
Background technique
With the development of display technology, touch technology has been increasingly being applied to the friendship of user and touch-control display panel
Mutual process.Touch technology refers to that user can be directly with hand or the contact of other objects or close to the display of touch-control display panel
Screen is to input information or operational order, so that dependence of the user to input equipments such as mouse, keyboards is decreased or even eliminated, it is convenient
The operation of user improves user experience.Classify according to principle, touch technology includes electric resistance touch-control technology, capacitance touching control skill
Art, electromagnetic touch-control technology and optical touch control technology etc..Wherein, electromagnetism touch control technology is to utilize the object with magnetic field
(for example, magnet or time writer etc.) has the object and touch-control display panel in magnetic field by changing close to touch-control display panel
Between relative tertiary location, electromagnetic induction coil in touch-control display panel can be made to generate changes of magnetic field, to generate faint
Electric current can be detected out corresponding touch point coordinate according to the faradic variation on two different directions, obtains and touches position
It sets.
The board of electromagnetic-type touch of external hanging type is generallyd use using the touch-control display panel of electromagnetic touch-control technology, the external hanging type
Electromagnetic touch plate and display panel combination formed electromagnetic touch-control display panel, cause touch-control display panel integral thickness compared with
It is thick.In order to solve this problem, electromagnetic touch mould group can be integrated in the array base-plate structure of display panel.
As shown in Figure 1, a kind of array base-plate structure for being integrated with electromagnetic touch mould group includes: underlay substrate, luminescent device
Drive circuit layer, light emitting functional layer and the electromagnetic touch induction between underlay substrate and light emitting device driver circuit layer
Layer.Wherein, light emitting device driver circuit layer is between electromagnetic touch inductive layer and light emitting functional layer.
Wherein, OLED (Organic Light Emitting Diode, Organic Light-Emitting are integrated in light emitting functional layer
Diode) device；OLED device of the thin film transistor (TFT) to drive control light emitting functional layer is integrated in light emitting device driver circuit layer
Part shines, and the luminescent color of light emitting functional layer can be the colors such as red, green, blue.It include multiple in electromagnetic touch inductive layer
Electromagnetic coil.
As shown in Fig. 2, when carrying out touch control operation, capacitance variations, quilt and electromagnetic coil between hand (stylus) and electromagnetic coil
IC (Integrated Circuit, the integrated circuit) chip of connection detects positioning.When carrying out touch-control feedback: according to different
Show content (protrusion, the bumps of such as picture) control unit the electromagnetic coil forward direction of corresponding position is powered, it is reversed be powered or
The operation such as power-off realizes electromagnetic coil and the magnet on stylus top and attracts, repels, operating without active force etc., realizes tactile
Feedback function.
Although above-mentioned be integrated into electricity of the technical solution in array base-plate structure compared to external hanging type for electromagnetic touch mould group
Magnetic-type Trackpad can be reduced the thickness of touch-control display panel, but with the development of display technology, it is difficult to meet more frivolous display
The requirement of device.
Summary of the invention
The invention proposes a kind of touch control display apparatus, display panel and array substrate and its manufacturing method, Ke Yijin
The integral thickness of touch-control display panel is thinned in one step.
Based on above-mentioned purpose, the present invention provides a kind of array substrate, comprising: is integrated with OLED device and multiple electromagnetic coils
Light emitting functional layer and the luminous light emitting device driver circuit layer of the driving OLED device；Wherein,
The first electrode of the metal of the OLED device and the electromagnetic coil are laid in same metal layer；
The second electrode of the OLED device has a many places aperture, and each electromagnetic coil at least one section of metal wire is relative to opening
At hole.
Wherein, the electromagnetic coil is single turn；And
The input terminal and output end of the electromagnetic coil are connected to IC chip from metal layer extraction.
Alternatively, the electromagnetic coil is multiturn；And
One end of the electromagnetic coil is connected to IC chip from metal layer extraction；
The other end of the electromagnetic coil by metallize via hole be connected to in the light emitting device driver circuit layer
Metal wire；Wherein, which is connected to the IC chip.
Wherein, thin film transistor (TFT) is integrated in the light emitting device driver circuit layer；And
The metal wire is specially the metal wire with the grid same layer of the thin film transistor (TFT), or is brilliant with the film
The metal wire of the source/drain same layer of body pipe.
The present invention also provides a kind of touch-control display panels, comprising: array substrate as described above.
The present invention also provides a kind of touch control display apparatus, comprising: touch-control display panel as described above.
The present invention also provides a kind of manufacturing methods of array substrate, comprising:
It is also formed in the first electrode for manufacturing the metal of OLED device of the array substrate, in Yu Tongyi metal layer more
A electromagnetic coil；
When manufacturing the second electrode of the OLED device, the OLED device of many places aperture is formed in a manner of patterned
Second electrode；
Wherein, each electromagnetic coil at least one section of metal wire is relative to tapping.
Wherein, the electromagnetic coil is multiturn；And one end of electromagnetic coil company of extraction from the metal layer
It is connected to IC chip；And
Described before manufacturing the first electrode of the metal of OLED device of the array substrate, the method also includes:
Form the metal of the metal wire in the light emitting device driver circuit layer for connecting the metal layer and the array substrate
The via hole of change, so that the other end of the electromagnetic coil, which is connected to the luminescent device by the via hole of the metallization, drives electricity
Metal wire in the floor of road；Wherein, which is connected to the IC chip.
Wherein, the light emitting device driver circuit layer is integrated with thin film transistor (TFT)；And
Before the first electrode of the metal of the OLED device of the manufacture array substrate, the method also includes:
When forming the grid of the thin film transistor (TFT), the metal wire is formed.
Alternatively, the method is also wrapped before the first electrode of the metal of the OLED device of the manufacture array substrate
It includes:
When forming the source/drain of the thin film transistor (TFT), the metal wire is formed.
In technical solution of the present invention, removes the electromagnetic touch inductive layer in array substrate, electromagnetic coil is integrated in battle array
In the light emitting functional layer of column substrate；Due to the first electrode of the metal of the OLED device integrated in electromagnetic coil and light emitting functional layer
It is laid in same metal layer, therefore, not will increase the thickness of light emitting functional layer, simultaneously as eliminating electromagnetic touch induction
Layer, to achieve the purpose that the integral thickness that touch-control display panel is further thinned；And the OLED device integrated in light emitting functional layer
The second electrode of part has many places aperture, so that each electromagnetic coil at least one section of metal wire is relative to tapping；To touch-control
When finger and coil be capable of forming capacitor will not by the electrode screening of OLED device, carry out touch-control when, the electricity between hand and coil
Appearance changes, and causes touching signals to change and then detects position or stylus and electromagnetic coil that touch-control occurs
Between effect generate induction field cause electromagnetic coil generate induced current realize touch function；When carrying out touch feedback, control
After the electromagnetic coil forward direction of corresponding position can be powered by unit processed, reversely energization etc. operates, electromagnetism caused by electromagnetic coil
Magnet of the field action in stylus top realizes haptic feedback functions.
Detailed description of the invention
Fig. 1 is integrated with the array base-plate structure schematic diagram of electromagnetic touch mould group for the prior art；
Fig. 2 is that the electromagnetic coil of the prior art realizes the schematic illustration of touch-control and haptic feedback functions；
Fig. 3 is a kind of structural schematic diagram of array substrate provided in an embodiment of the present invention；
Fig. 4 a is that the electromagnetic coil of single turn provided in an embodiment of the present invention is integrated in the top view of light emitting functional layer；
Fig. 4 b is that the electromagnetic coil of multiturn provided in an embodiment of the present invention is integrated in the top view of light emitting functional layer；
Fig. 5 a is the schematic illustration that array substrate provided in an embodiment of the present invention realizes touch function；
Fig. 5 b is the schematic illustration that array substrate provided in an embodiment of the present invention realizes haptic feedback functions；
Fig. 6 is a kind of manufacturing method process of the array substrate of integrated single turn electromagnetic coil provided in an embodiment of the present invention
Figure；
Fig. 7 is the method flow provided in an embodiment of the present invention that light emitting functional layer is formed on light emitting device driver circuit layer
Figure；
Fig. 8 is the of each OLED device provided in an embodiment of the present invention formed in light emitting functional layer in same metal layer
The schematic diagram of one electrode and multiple electromagnetic coils；
Fig. 9 is the signal of the EML provided in an embodiment of the present invention that OLED device is formed in the first electrode of OLED device
Figure；
Figure 10 be patterned second electrode provided in an embodiment of the present invention multiple tappings respectively with each electromagnetic wire
The opposite schematic diagram of the metal wire of circle；
Figure 11 is a kind of manufacturing method process of the array substrate of integrated multiturn electromagnetic coil provided in an embodiment of the present invention
Figure；
Figure 12 is the photophore that a kind of formation on underlay substrate provided in an embodiment of the present invention is integrated with thin film transistor (TFT)
The method flow diagram of part drive circuit layer；
Figure 13 is that another formed on underlay substrate provided in an embodiment of the present invention is integrated with shining for thin film transistor (TFT)
The method flow diagram of component driving circuit layer；
Figure 14 is that another kind provided in an embodiment of the present invention forms light emitting functional layer on light emitting device driver circuit layer
Method flow diagram.
Specific embodiment
To make the objectives, technical solutions, and advantages of the present invention clearer, below in conjunction with specific embodiment, and reference
Attached drawing, the present invention is described in more detail.
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, and for explaining only the invention, and is not construed as limiting the claims.
Those skilled in the art of the present technique are appreciated that unless expressly stated, singular " one " used herein, " one
It is a ", " described " and "the" may also comprise plural form.It is to be further understood that when we claim element to be " connected " or " coupling
Connect " to another element when, it can be directly connected or coupled to other elements, or there may also be intermediary elements.In addition, this
In " connection " or " coupling " that uses may include being wirelessly connected or wireless coupling.Wording "and/or" used herein includes one
A or more associated whole for listing item or any cell and all combination.
It should be noted that all statements for using " first " and " second " are for differentiation two in the embodiment of the present invention
The non-equal entity of a same names or non-equal parameter, it is seen that " first " " second " only for the convenience of statement, does not answer
It is interpreted as the restriction to the embodiment of the present invention, subsequent embodiment no longer illustrates this one by one.
In technical solution of the present invention, removes the electromagnetic touch inductive layer in array substrate, electromagnetic coil is integrated in battle array
In the light emitting functional layer of column substrate；Due to the first electrode of the metal of the OLED device integrated in electromagnetic coil and light emitting functional layer
It (such as anode) and is laid in same metal layer, therefore, not will increase the thickness of light emitting functional layer, simultaneously as eliminating
Electromagnetic touch inductive layer, to achieve the purpose that the integral thickness that touch-control display panel is further thinned；And in light emitting functional layer
The second electrode (such as cathode) of integrated OLED device has many places aperture, so that each electromagnetic coil at least one section of metal wire
Relative to tapping；To which finger and coil are capable of forming capacitor and will not be touched by the electrode screening of OLED device when touch-control
When control, the capacitor between hand and coil changes, and causes touching signals to change and then detects the position that touch-control occurs,
Or effect generation induction field causes electromagnetic coil to generate induced current realization touch function between stylus and electromagnetic coil；
When carrying out touch feedback, after the operations such as the electromagnetic coil forward direction of corresponding position can be powered, reversely be powered by control unit, electricity
Magnet of the electromagnetic field effect caused by magnetic coil in stylus top realizes haptic feedback functions.
The technical solution for embodiment that the invention will now be described in detail with reference to the accompanying drawings.
A kind of array substrate that can be set in touch-control display panel provided in an embodiment of the present invention, structure such as Fig. 3 institute
Show, comprising: underlay substrate 301, light emitting functional layer 303, and the hair between underlay substrate 301 and light emitting functional layer 303
Optical device drive circuit layer 302.
Wherein, OLED device and multiple electromagnetic coils 320 are integrated in light emitting functional layer 303；
Thin film transistor (TFT) is integrated in light emitting device driver circuit layer 302；
Light emitting device driver circuit layer 302 is to drive the OLED device in light emitting functional layer 303 to shine.
Specifically, the OLED device in light emitting functional layer 303 generally includes: the first electrode of OLED device (such as anode
Anode) 311, second electrode (such as cathode Cathode) 312, and between first electrode 311 and second electrode 312
EML (Emitting Layer, luminescent layer) 313；Further, OLED device may also include that between first electrode 311 and EML313
HTL (Hole Transport Layer, hole transmission layer) or HIL (Hole Inject Layer, hole injection layer), with
And ETL (Electron Transport Layer, electron transfer layer) or EIL between EML313 and second electrode 312
(Electron Inject Layer, electron injecting layer).
Wherein, the first electrode 311 of OLED device is metal, the second electrode 312 of OLED device be it is transparent, specifically
It can be magnesium silver layer material.
The first electrode 311 of electromagnetic coil 320 and the metal of OLED device is laid in same metal layer.That is,
When with the first electrode 311 of a patterning processes or the metal of printing technology formation OLED device, Yu Tongyi metal layer is also formed
Electromagnetic coil 320.It is separated between electromagnetic coil 320 and the first electrode of OLED device, is electrical isolation.Electromagnetic coil
320 be also to separate between each other, is electrical isolation.The width in the enclosed region of electromagnetic coil 320 can be 1~5mm.
Since the first electrode of electromagnetic coil 320 and OLED device is in same metal layer, the thickness of the metal layer can
With identical as the thickness of metal layer where the first electrode for not having OLED device when laying electromagnetic coil in light emitting functional layer.Cause
This is integrated with the array base-plate structure of electromagnetic touch inductive layer compared to existing, and technical solution of the present invention eliminates electromagnetism touching
Inductive layer is controlled, without layer where increasing electromagnetic coil, such as the thickness of light emitting functional layer, touching is further thinned to realize
Control the purpose of the integral thickness of display panel.
Electromagnetic coil 320 can be single turn, that is to say, that single electromagnetic coil 320 is only coiled by a circle metal wire；Collection
At the single turn electromagnetic coil 320 in light emitting functional layer 303 top view as shown in fig. 4 a.The electromagnetic coil 320 of single turn it is defeated
Enter end and output end (i.e. the both ends of electromagnetic coil 320) can be from 311 place metal layer (the i.e. electromagnetism of first electrode of OLED device
The first electrode 311 of coil 320 and OLED device with metal layer) draw and be connected to IC chip.
Thin film transistor (TFT) in above-mentioned light emitting device driver circuit layer 302 can specifically include: grid 331, source electrode 332,
IGZO (indium gallium zinc) semiconductor channel 334 between drain electrode 333 and source electrode 332 and drain electrode 333.
Wherein, grid 331, source electrode 332 and drain electrode 333 are metal；Typically, grid 331 is formed in photophore
A metal layer in part drive circuit layer 302, and source electrode 332 and drain electrode 333 are then formed in light emitting device driver circuit layer 302
In another metal layer.
In fact, the grid 331 of thin film transistor (TFT) needs to be connected to control chip by cabling, control signal is received, because
This is also formed as the data line of grid 331 when forming grid 331 in same metal layer.That is, with 331 same layer of grid
There are also grid 331 data line.
In addition, the source electrode 332 of thin film transistor (TFT) or drain electrode 333 are also required to be connected to other devices or power supply by cabling；
Therefore, when forming source electrode 332 and drain electrode 333, the cabling of the drain electrode of source electrode 332/ 333 is also formed in same metal layer；Namely
It says, the cabling for being also connected to source electrode 332 or drain electrode 333 with source electrode 332,333 same layers of drain electrode.
Above-mentioned electromagnetic coil 320 is also possible to multiturn, that is to say, that single electromagnetic coil 320 can be by multi-turn gold
Belong to line to be coiled into, to enhance the electromagnetic induction ability of electromagnetic coil 320；The multiturn electromagnetic wire being integrated in light emitting functional layer 303
The top view of circle 320 is as shown in Figure 4 b:
For the electromagnetic coil 320 of multiturn, one end of electromagnetic coil 320 is (for example, the input terminal of electromagnetic coil 320
Or output end) can be from 311 place metal layer of first electrode (i.e. the first electricity of electromagnetic coil 320 and OLED device of OLED device
Pole 311 with metal layer) draw be connected to the IC chip；The other end of electromagnetic coil 320 is (for example, electromagnetic coil 320
Output end or input terminal) by metallize via hole be connected to photophore from the 311 place metal layer of first electrode of OLED device
Metal wire in part drive circuit layer 302, the metal wire are connected to the IC chip.The metal wire specifically can be with it is thin
The metal wire of 331 same layer of grid of film transistor, that is to say, that be also connected to the metallization with 331 same layer of grid
The metal wire between via hole and the IC chip.
Alternatively, the metal wire between the above-mentioned via hole for being connected to the metallization and the IC chip be also possible to it is described
The metal wire of 333 same layers of drain electrode of source electrode 332/ of thin film transistor (TFT).That is, draining 333 same layers also with source electrode 332/
The metal wire being connected between the via hole of the metallization and the IC chip.
The second electrode 312 of OLED device be it is patterned, have many places aperture, so that each electromagnetic coil 320 is at least
One section of metal wire is relative to tapping；When to touch-control finger and coil be capable of forming capacitor will not be by the electrode screen of OLED device
It covers, when carrying out touch-control, the capacitor between hand and coil changes, and causes touching signals to change and then detects that touch-control is sent out
Effect, which generates induction field, between raw position or stylus and electromagnetic coil causes electromagnetic coil to generate induced current realization
Touch function；When carrying out touch feedback, the electromagnetic coil forward direction of corresponding position can be powered, reversely be powered by control unit etc.
After operation, magnet of the electromagnetic field effect caused by electromagnetic coil in stylus top realizes haptic feedback functions.
Specifically, touch function is as shown in Figure 5 a: when hand or stylus touch, the capacitor of electromagnetic coil be will increase,
Cause receiving end signal to postpone, the position that touch-control occurs can be detected by IC.
Haptic feedback functions are as shown in Figure 5 b: being detected, led to using the principle that electromagnetic coil flows through current induced magnetic field
The application of overcurrent forward direction, reversed application, revocation are realized attraction, are repelled, without active force switching.
When electromagnetic coil does not apply current signal: stylus can uniformly be streaked from panel, will not experience triangle
The pattern of shape；
When electromagnetic coil applies reverse current signal and stylus realizes repulsion: being generated when stylus streaks triangle bright
Aobvious convex power output, is outstanding so as to clearly experience triangle.
When electromagnetic coil applies forward current signal and stylus realizes attraction: being generated when stylus streaks triangle bright
Aobvious is inwardly recessed power, so that it is recessed for experiencing triangle.
A kind of touch control display apparatus including above-mentioned touch-control display panel can also be provided in inventive embodiments.
In a kind of manufacturing method of array substrate provided in an embodiment of the present invention, in the OLED device for manufacturing the array substrate
When first electrode (such as anode) of the metal of part, multiple electromagnetic coils are also formed in Yu Tongyi metal layer；Described in manufacture
When second electrode (such as cathode) of OLED device, the second electricity of the OLED device of many places aperture is formed in a manner of patterned
Pole；Wherein, each electromagnetic coil at least one section of metal wire is relative to tapping.
Specifically, for electromagnetic coil 320 be single turn the case where, a kind of system of array substrate provided in an embodiment of the present invention
Method flow is made as shown in fig. 6, including the following steps:
Step S601: light emitting device driver circuit layer 302 is formed on underlay substrate 301.
Specifically, existing method can be used and form light emitting device driver circuit layer 302 on underlay substrate 301, herein not
It repeats again.
Step S602: light emitting functional layer 303 is formed on light emitting device driver circuit layer 302.
Step S603: encapsulated layer is formed in light emitting functional layer 303.
Specifically, the method flow for light emitting functional layer 303 being formed in above-mentioned steps S602 can be as shown in fig. 7, comprises such as
Lower step:
Step S701: it is formed in light emitting functional layer 303 in same metal layer on light emitting device driver circuit layer 302
The first electrode 311 and multiple electromagnetic coils 320 of OLED device.
In this step, in first electrode (such as the anode) for manufacturing the metal of OLED device of the array substrate, in
Multiple electromagnetic coils are also formed in same metal layer.
Specifically, one layer of metal layer is deposited on light emitting device driver circuit layer 302, and then carries out exposure mask, exposure, quarter
It loses, the first electrode 311 of each OLED device in Yu Tongyi metal layer in formation light emitting functional layer 303 and multiple electromagnetic coils
320, as shown in Figure 8；
Alternatively, each OLED in light emitting functional layer 303 is printed on light emitting device driver circuit layer 302 with printing technology
The first electrode 311 and multiple electromagnetic coils 320 of device；And the height of electromagnetic coil 320 and the first electrode 311 of OLED device
Height be it is identical, be located at same metal layer in.
Step S702: the EML313 of OLED device is formed in the first electrode 311 of OLED device.
Specifically, as shown in figure 9, OLED device can be formed in the first electrode 311 of OLED device using existing method
The EML313 of part, details are not described herein again.
Preferably, existing method can be used before forming EML in this step, first in the first electrode 311 of OLED device
The upper HTL for forming OLED device, then forms the EML313 of OLED device, and then in OLED device on the HTL of OLED device
EML313 on form ETL, details are not described herein again for method detailed.
Step S703: the second electrode 312 of patterned OLED device is formed on the EML313 of OLED device.
In this step, as shown in Figure 10, when manufacturing second electrode (such as cathode) of the OLED device, with graphical
Mode be formed with many places aperture OLED device second electrode so that at least one section of metal wire of each electromagnetic coil 320
Relative to tapping.
Specifically, one layer of ito film is deposited on the ETL of OLED device, and then carries out exposure mask, etching, is obtained patterned
The second electrode 312 of the OLED device of ITO；Multiple tappings of patterned second electrode 312 respectively with each electromagnetic coil
320 metal wire is opposite.
Specifically, for electromagnetic coil 320 be multiturn the case where, a kind of system of array substrate provided in an embodiment of the present invention
It is as shown in figure 11 to make method flow, includes the following steps:
Step S1101: light emitting device driver circuit layer 302 is formed on underlay substrate 301.
Specifically, the one of the light emitting device driver circuit layer 302 for being integrated with thin film transistor (TFT) is formed on underlay substrate 301
Kind specific method, process is as shown in figure 12, may include at least following several sub-steps:
Sub-step S1201: on underlay substrate 301 formed thin film transistor (TFT) grid and with it is grid same layer, above-mentioned
Metal wire.
Specifically, in this sub-step, after depositing one layer of metal layer on underlay substrate 301, exposure mask, exposure, etching are carried out
Formed afterwards the grid of thin film transistor (TFT), grid data line and with grid same layer, above-mentioned metal wire；Metal wire connection
To above-mentioned IC chip.
Sub-step S1202: it is formed and is covered in the grid, the data line of grid and exhausted with the metal wire of grid same layer
Edge layer (GI layers).
Sub-step S1203: the semiconductor channel that thin film transistor (TFT) is formed at the position of grid is corresponded on the insulating layer.
Sub-step S1204: with the patterning processes etching insulating layer of exposure and dry etching, layer pattern is formed.
Sub-step S1205: formed be connected to the semiconductor channel both ends the thin film transistor (TFT) source electrode, drain electrode with
And the cabling of the drain electrode of source electrode 332/ 333.
Alternatively, forming the another of the light emitting device driver circuit layer 302 for being integrated with thin film transistor (TFT) on underlay substrate 301
Kind specific method, process is as shown in figure 13, may include at least following several sub-steps:
Sub-step S1301: the grid of thin film transistor (TFT) and the data line of grid are formed on underlay substrate 301.
Sub-step S1302: formed be covered in the grid, grid data line insulating layer.
Sub-step S1303: the semiconductor channel that thin film transistor (TFT) is formed at the position of grid is corresponded on the insulating layer.
Sub-step S1304: with the patterning processes etching insulating layer of exposure and dry etching, layer pattern is formed.
Sub-step S1305: formed be connected to the semiconductor channel both ends the thin film transistor (TFT) source electrode, drain electrode with
And the metal wire with source/drain same layer.
Specifically, in this sub-step, one layer of metal layer is first deposited, and then carry out exposure mask, exposure, etching, formation is connected to
The source electrode of the thin film transistor (TFT) at the semiconductor channel both ends, drain electrode and the drain electrode of source electrode 332/ 333 cabling, and
With source/drain same layer, above-mentioned metal wire；The metal wire is connected to above-mentioned IC chip.
Step S1102: light emitting functional layer 303 is formed on light emitting device driver circuit layer 302.
Specifically, the method for forming light emitting functional layer 303, process can be as shown in figure 14, including following sub-step:
Sub-step S1401: light emitting functional layer 303 is formed in same metal layer on light emitting device driver circuit layer 302
In OLED device first electrode 311 and multiple electromagnetic coils 320, and formed metallization via hole.
In this sub-step, in first electrode (such as the anode) for manufacturing the metal of OLED device of the array substrate,
Form the electromagnetic coil 320 of same metal layer, wherein one end of electromagnetic coil 320 in the metal layer extraction be connected to IC
Chip, in addition, also production connects the metal layer and the metal wire in the light emitting device driver circuit layer of the array substrate
The via hole of metallization, so that the other end of the electromagnetic coil is connected to institute from the metal layer by the via hole of the metallization
State the metal wire in light emitting device driver circuit layer；Wherein, which is connected to the IC chip.
Specifically, redeposited one layer of metal layer, is metallized after being drilled on light emitting device driver circuit layer 302
Via hole, and then carry out exposure mask, exposure, etching, formed light emitting functional layer 303 in each OLED device 311 He of first electrode
Multiple electromagnetic coils 320, as shown in Figure 4 b.
Sub-step S1402: the EML313 of OLED device is formed in the first electrode 311 of OLED device.
Specifically, the EML313 of OLED device can be formed in the first electrode 311 of OLED device using existing method,
Details are not described herein again.
Preferably, existing method can be used before forming EML in this sub-step, first in the first electrode of OLED device
The HTL that OLED device is formed on 311, then forms the EML313 of OLED device, and then in OLED device on the HTL of OLED device
ETL is formed on the EML313 of part, details are not described herein again for method detailed.
Sub-step S1403: the second electrode 312 of patterned OLED device is formed on the EML313 of OLED device.
In this sub-step, when manufacturing second electrode (such as cathode) of the OLED device, the shape in a manner of patterned
At the second electrode for the OLED device for having many places aperture, so that at least one section of metal wire of each electromagnetic coil 320 is relative to opening
At hole.
Specifically, one layer of ito film is deposited on the ETL of OLED device, and then carries out exposure mask, etching, is obtained patterned
The second electrode 312 of the OLED device of ITO；Multiple tappings of patterned second electrode 31 respectively with each electromagnetic coil
320 metal wire is opposite.
Step S1103: encapsulated layer is formed in light emitting functional layer 303.
In technical solution of the present invention, removes the electromagnetic touch inductive layer in array substrate, electromagnetic coil is integrated in battle array
In the light emitting functional layer of column substrate；Due to the first electrode of the metal of the OLED device integrated in electromagnetic coil and light emitting functional layer
Be laid in same metal layer, therefore, not will increase the thickness of light emitting functional layer, simultaneously as eliminating electromagnetic touch sense
Layer is answered, to achieve the purpose that the integral thickness that touch-control display panel is further thinned；And the OLED integrated in light emitting functional layer
The second electrode of device has many places aperture, so that each electromagnetic coil at least one section of metal wire is relative to tapping；To touch
When control finger and coil be capable of forming capacitor will not by the electrode screening of OLED device, carry out touch-control when, between hand and coil
Capacitor changes, and causes touching signals to change and then detects position or stylus and electromagnetic wire that touch-control occurs
Effect, which generates induction field, between circle causes electromagnetic coil to generate induced current realization touch function；When carrying out touch feedback,
After the electromagnetic coil forward direction of corresponding position can be powered by control unit, reversely energization etc. operates, electricity caused by electromagnetic coil
Magnet of the magnetic fields in stylus top realizes haptic feedback functions.
Those skilled in the art of the present technique have been appreciated that in the present invention the various operations crossed by discussion, method, in process
Steps, measures, and schemes can be replaced, changed, combined or be deleted.Further, each with having been crossed by discussion in the present invention
Kind of operation, method, other steps, measures, and schemes in process may also be alternated, changed, rearranged, decomposed, combined or deleted.
Further, in the prior art to have and the step in various operations, method disclosed in the present invention, process, measure, scheme
It may also be alternated, changed, rearranged, decomposed, combined or deleted.
It should be understood by those ordinary skilled in the art that: the discussion of any of the above embodiment is exemplary only, not
It is intended to imply that the scope of the present disclosure (including claim) is limited to these examples；Under thinking of the invention, above embodiments
Or can also be combined between the technical characteristic in different embodiments, step can be realized with random order, and be existed such as
Many other variations of the upper different aspect of the invention, for simplicity, they are not provided in details.Therefore, it is all
Within the spirit and principles in the present invention, any omission, modification, equivalent replacement, improvement for being made etc. be should be included in of the invention
Within protection scope.
Claims (10)
1. a kind of array substrate, comprising: be integrated with described in OLED device and the light emitting functional layer and driving of multiple electromagnetic coils
The luminous light emitting device driver circuit layer of OLED device；Wherein,
The first electrode of the metal of the OLED device and the electromagnetic coil are laid in same metal layer；
The second electrode of the OLED device has many places aperture, and each electromagnetic coil at least one section of metal wire is relative to aperture
Place.
2. the apparatus according to claim 1, which is characterized in that the electromagnetic coil is single turn；And
The input terminal and output end of the electromagnetic coil are connected to IC chip from metal layer extraction.
3. the apparatus according to claim 1, which is characterized in that the electromagnetic coil is multiturn；And
One end of the electromagnetic coil is connected to IC chip from metal layer extraction；
The other end of the electromagnetic coil is connected to and the gold in the light emitting device driver circuit layer by the via hole to metallize
Belong to line；Wherein, which is connected to the IC chip.
4. device according to claim 3, which is characterized in that be integrated with film crystalline substance in the light emitting device driver circuit layer
Body pipe；And
The metal wire is specially the metal wire with the grid same layer of the thin film transistor (TFT), or is and the thin film transistor (TFT)
Source/drain same layer metal wire.
5. a kind of touch-control display panel characterized by comprising the array substrate as described in claim 1-4 is any.
6. a kind of touch control display apparatus characterized by comprising touch-control display panel as claimed in claim 5.
7. a kind of manufacturing method of array substrate characterized by comprising
In the first electrode for manufacturing the metal of OLED device of the array substrate, multiple electricity are also formed in Yu Tongyi metal layer
Magnetic coil；
When manufacturing the second electrode of the OLED device, the of the OLED device of many places aperture is formed in a manner of patterned
Two electrodes；
Wherein, each electromagnetic coil at least one section of metal wire is relative to tapping.
8. the method according to the description of claim 7 is characterized in that the electromagnetic coil is multiturn；And the electromagnetic wire
It is drawn from the metal layer and is connected to IC chip in one end of circle；And
Described before manufacturing the first electrode of the metal of OLED device of the array substrate, the method also includes:
Form the metallization of the metal wire in the light emitting device driver circuit layer for connecting the metal layer and the array substrate
Via hole, so that the other end of the electromagnetic coil is connected to the light emitting device driver circuit layer by the via hole of the metallization
In metal wire；Wherein, which is connected to the IC chip.
9. according to the method described in claim 8, it is characterized in that, the light emitting device driver circuit layer is integrated with film crystal
Pipe；And
Before the first electrode of the metal of the OLED device of the manufacture array substrate, the method also includes:
When forming the grid of the thin film transistor (TFT), the metal wire is formed.
10. according to the method described in claim 8, it is characterized in that, the light emitting device driver circuit layer is integrated with film crystalline substance
Body pipe；And
Before the first electrode of the metal of the OLED device of the manufacture array substrate, the method also includes:
When forming the source/drain of the thin film transistor (TFT), the metal wire is formed.
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