CN109696678A - Ultrasonic sensing module - Google Patents
Ultrasonic sensing module Download PDFInfo
- Publication number
- CN109696678A CN109696678A CN201910141274.5A CN201910141274A CN109696678A CN 109696678 A CN109696678 A CN 109696678A CN 201910141274 A CN201910141274 A CN 201910141274A CN 109696678 A CN109696678 A CN 109696678A
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- circuit board
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 55
- 239000002184 metal Substances 0.000 claims abstract description 55
- 239000000919 ceramic Substances 0.000 claims abstract description 45
- 230000006698 induction Effects 0.000 claims abstract description 23
- 230000001939 inductive effect Effects 0.000 claims abstract description 10
- 238000005476 soldering Methods 0.000 claims abstract description 6
- 239000011347 resin Substances 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 16
- 230000009970 fire resistant effect Effects 0.000 claims description 15
- 230000035939 shock Effects 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 8
- 238000012545 processing Methods 0.000 claims description 8
- 238000002604 ultrasonography Methods 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
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- 239000006071 cream Substances 0.000 claims description 6
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 6
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 150000002739 metals Chemical class 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- -1 polytetrafluoroethylene Polymers 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 230000009477 glass transition Effects 0.000 claims description 2
- 238000001514 detection method Methods 0.000 abstract description 11
- 238000005259 measurement Methods 0.000 abstract description 6
- 230000005611 electricity Effects 0.000 description 5
- 238000013016 damping Methods 0.000 description 4
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- 238000012986 modification Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
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- 230000000712 assembly Effects 0.000 description 1
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S15/00—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems
- G01S15/02—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems using reflection of acoustic waves
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S15/00—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems
- G01S15/88—Sonar systems specially adapted for specific applications
- G01S15/93—Sonar systems specially adapted for specific applications for anti-collision purposes
- G01S15/931—Sonar systems specially adapted for specific applications for anti-collision purposes of land vehicles
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/52—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00
- G01S7/521—Constructional features
Abstract
The invention discloses a kind of ultrasonic sensing modules, including ultrasonic circuit plate and control circuit board.It is provided with patch becket, patch metal block, piezoelectric ceramics block, metal oscillator and netted signal shielding shell on the ultrasonic circuit plate and forms hexa-atomic formula ultrasonic sensor；The piezoelectric ceramics block of the ultrasonic sensor is mounted on above patch becket；The patch metal block is located in patch becket, becket soldering patch is mounted on double-sided PCB, ultrasonic resonator chamber is formed with patch metal block, the control circuit board drives hexa-atomic formula ultrasonic sensor transmitting and received ultrasonic signal to detect obstructing objects, and inductive signal is exported by control circuit board.Ultrasonic sensing module of the present invention utilizes the hexa-atomic formula ultrasonic sensor above control circuit board driving ultrasonic circuit plate, when for obstructing objects detection, using multiple groups working sensor mode, it realizes remote object search, locking and short range rotation formula precise measurement, improves the detection accuracy and reliability of induction module.
Description
Technical field
The present invention relates to supersonic sensings to answer field, and in particular to ultrasonic sensing module.
Background technique
Ultrasonic sensing module is the ultrasonic signal launched using ultrasonic sensor, and control circuit utilizes reception object
The echo-signal of body reflection calculates the time difference, to realize required control.
Ultrasonic sensing module is the circuit module combined by ultrasonic sensor and control circuit board, be can be used for
Collision prevention of vehicle detection, range measurement and Obstacle avoidance remind the fields such as control, and module, which directly powers up, can be used, induction control
Signal processed is exported by control circuit board, and modular construction keeps ultrasonic sensor easy to use.
The ultrasonic sensor that ultrasonic sensing module uses belongs to sensitive kinds electronic component, induction mould used at present
Block majority is made of the design of transceiver type ultrasonic sensor.When one-piece type ultrasonic sensor works, ultrasonic signal
Transmitting and reception are completed in the same supersonic sensing device assembly, after the completion of one group of ultrasonic signal emits, again by
The component receives the ultrasonic signal of reflection.After the completion of ultrasonic signal transmitting, sensor can generate inertia remained shock, receive
Signal has several milliseconds or more of signal delay, and control circuit generates the corresponding waiting time, therefore will appear the sense of short distance
The phenomenon that answering blind area.When ultrasonic sensor carries out long-range detection, the transmitting of ultrasonic signal and reception influence each other compared with
Greatly, the distance of blind area can increase therewith, closely detect so that cannot achieve.The influence of environment is detected simultaneously and incudes angle
Difference also reduces the reliability of ultrasonic sensing module.
Summary of the invention
In view of the above problems, the present invention provides a kind of ultrasonic sensing module, is provided in ultrasonic circuit plate
Six groups of ultrasonic sensing bodies form a kind of hexa-atomic formula ultrasonic sensor.Sensor has the resonance chamber of special construction, to
The remained shock interference generated after ultrasonic wave transmitting is eliminated, six groups of independent sensors are distributed on circular circuit board, control circuit
Plate can realize that any combination between received 1-6 occurs for ultrasonic signal, effectively eliminates short distance according to sensing requirement
Sense blind area realizes that remote, closely highly reliable induction detects.
In order to solve the above-mentioned technical problem, the application has following technical solution:
A kind of ultrasonic sensing module, including ultrasonic circuit plate and control circuit board, it is characterised in that: the ultrasonic wave electricity
It is hexa-atomic that patch becket, patch metal block, piezoelectric ceramics block, metal oscillator and netted signal shielding shell composition are provided on the plate of road
Formula ultrasonic sensor；
The piezoelectric ceramics block of the ultrasonic sensor is mounted on above patch becket；
The patch metal block is located in patch becket；
The becket soldering patch is mounted on double-sided PCB, forms ultrasonic resonator chamber with patch metal block；
The control circuit board drives hexa-atomic formula ultrasonic sensor transmitting and received ultrasonic signal to detect obstructing objects, sense
Induction signal is exported by control circuit board.
Preferably, in which:
Piezoelectric ceramics block on the ultrasonic circuit plate is provided with six groups, is that 60o is mounted on double-sided PCB with angle
On circular flat, hexa-atomic formula ultrasonic sensor is formed；
Preferably, in which:
The inductor that every group of piezoelectric ceramics block is formed can emit and also can receive ultrasonic signal；
Preferably, in which:
The ultrasonic resonator chamber, for eliminating the remained shock generated after the completion of ultrasonic signal transmitting；
Preferably, in which:
The metal oscillator is mounted on above piezoelectric ceramics block；
Preferably, in which:
The double-sided PCB of the electroceramics block assembly is embedded in netted signal shielding shell, and the signal of ultrasonic sensor draws
Foot is exported by circuit board bottom.
Preferably, in which:
The Curie temperature of the piezoelectric ceramics block is 420oC-500oC；The piezoelectric ceramics block upper and lower surface is signal electricity
Pole is coated with the conductive silver serous coat with a thickness of 12um；The piezoelectric ceramics block of material is PZT-4-PZT-8 class lead zirconate titanate piezoelectric
Ceramics.
Preferably, in which:
The piezoelectric ceramics block top surface is fluted, and there is convex block in bottom surface, is embedded into becket；The metal oscillator is to have
The round speaker shape metal dome of salient point, is welded in the groove of piezoelectric ceramics block.
Preferably, in which:
Have in the patch becket one it is with step, above for trapezoidal shape metal block, patch is welded on the Y of circuit board
Above the circular pad of shape, with patch metal ring at a ultrasonic resonator chamber；
The patch metal block height is lower than patch becket 0.2mm, and the cylindrical cavity space that inside is formed is filled high
Spend the fire resistant resin of 0.8-1.7mm.
Preferably, in which:
Thermal expansion coefficient of the fire resistant resin in 300 DEG C is less than or equal to 75ppm/ DEG C；The fire resistant resin
Glass transition temperature is greater than 300 DEG C；The fire resistant resin material is polytetrafluoroethylene (PTFE) or polyimides.
Preferably, in which:
The sensor manufacturing process and step include:
Step 1: patch becket and patch metal block are soldered to circuit board top, form ultrasound by coating 5-30% argentiferous tin cream
Wave resonance chamber；
Step 2: in the fire resistant resin dry solidification that ultrasonic resonator chamber injecting height is 0.8-1.7mm；
Step 3: piezoelectric ceramics block and metal oscillator are soldered to above patch becket by coating 5-30% argentiferous tin cream.
Preferably, in which:
The sensor has six groups, and every group can occur ultrasonic signal, can also receive ultrasonic signal.
Preferably, in which:
The ultrasonic circuit plate is circular double-face circuit, and the circuit components with circuit board top, being mounted on front end is net
In the signal shielding shell of shape；
Preferably, in which:
The ultrasonic signal leg diameter 1.0mm silver plated metals line, in the bottom margin circular arrangement of circuit board；Ultrasonic wave
The public foot of signal, position is in wiring board center, edge above；
Preferably, in which:
The netted signal shielding shell is cylindrical metal shell, and netted case is in metal-back front end, with shell one-pass molding system
At there are a circular metal plate, fixing circuit board in rear end.
Preferably, in which:
The control circuit module unit and induction module signal enhanced processing module list of the induction module of the control circuit board
In the horizontal center of circuit board, partial below is power module of voltage regulation unit for first position；External power supply input and inductive signal are defeated
Out position is also on 4 feet of circuit board；Fixed screw hole site is in circuit board level center edge.
Compared with prior art, structures and methods described herein achieving the following effects:
First: control circuit board drives the hexa-atomic formula ultrasonic sensor above ultrasonic circuit plate, detects for obstructing objects
When, it using multiple groups working sensor mode, realizes remote object search, locking and short range rotation formula precise measurement, improves induction
The detection accuracy and reliability of module.
Second: using the Y shape of circuit board copper foil setting, circular pad, by patch becket and patch metal block soldering
Face on circuit boards forms the ultrasonic sensor bracket for having ultrasonic resonator chamber, in resonance chamber, packed height
The fire resistant resin of 0.8-1.7mm forms a ultrasonic signal damped harmonic oscillation chamber, to eliminate ultrasonic signal transmitting rapidly
The remained shock interference generated afterwards.
Detailed description of the invention
The drawings described herein are used to provide a further understanding of the present application, constitutes part of this application, this Shen
Illustrative embodiments and their description please are not constituted an undue limitation on the present application for explaining the application.In the accompanying drawings:
Fig. 1 is ultrasonic sensing module working principle fundamental block diagram of the present invention.
Fig. 2 is the hexa-atomic formula ultrasonic sensor component locations fundamental block diagram of ultrasonic sensing module of the present invention.
Fig. 3 is ultrasonic sensing module single group ultrasonic sensing body device junction composition of the present invention.
Fig. 4 is ultrasonic sensing module ultrasonic sensor of the present invention encapsulation and signal pins position assumption diagram.
Fig. 5 is ultrasonic sensing module control circuit board component locations structure chart of the present invention.
Specific embodiment
As used certain titles, vocabulary or term to censure specific components and circuit in the specification and claims
Constitute, those skilled in the art should understand that engineers and technicians, hardware, component manufacturer may with different nouns and
Vocabulary calls the same component and title.For ease of understanding, description and explanation, technical staff also will use identical title or
Term describes inductor, induction module and the ultrasonic sensing module that component and element circuit are constituted, as the application is said in the whole text
Circuit board mentioned in of bright book and claim, double-sided PCB, patch becket, patch metal block, piezoelectric ceramics block,
Metal oscillator and netted signal shielding shell；The circular pad of Y shape, ultrasonic resonator chamber, the public foot of ultrasonic signal, ultrasonic wave
Signal pins, control circuit board, external power input mouth, control circuit module unit, inductive mode circuit module unit, letter
Number enhanced processing modular unit, control circuit board set screw hole, induction module power module of voltage regulation unit, ultrasonic sensing mould
Block control signal output port etc., these titles or vocabulary all appear in the application in the form of modular assembly or circuit unit
In.PZT-4-PZT-8 class lead titanate piezoelectric ceramics, polytetrafluoroethylene (PTFE) or polyimide high temperature-resistant resin and corresponding temperature
Parameter occurs in this application in the form of the general designations such as material, parameter.
The description of the present application, Figure of description, abstract of description, abstract echo figure claim not with the difference of title
The different mode formed as differentiation component or circuit, but with component or circuit formation or material application, in structure, function
It is upper, using in rule, design method and using conception it is first-class, for the use of the technical solution of the application existing for difference as area
The criterion divided.
Specification subsequent descriptions are to implement the better embodiment of the application, and so the description is one to illustrate the application
As for the purpose of principle, be not intended to limit the scope of the present application.The protection scope of the application is worked as to be defined depending on appended claims
Subject to person.
"comprising" is an open language, therefore should be construed to " including but not limited to "." substantially " refer to receivable
In error range, those skilled in the art can solve the technical problem within a certain error range, basically reach the skill
Art effect.In addition, " coupling " word includes any direct and indirect electric property coupling means herein.Therefore, if it is described herein that one
First device is coupled to a second device, then representing the first device can be directly electrically coupled to the second device, or logical
It crosses other devices or coupling means and is electrically coupled to the second device indirectly.Not it is described as reality to limit to continue after specification
The better embodiment of the application is applied, so the description is determining the model of the application for the purpose of the rule for illustrating the application
It encloses.The protection scope of the application is as defined by the appended claims.
It is a kind of herein described ultrasonic sensing module specific embodiment referring to Fig. 1, Fig. 2, Fig. 3, Fig. 4 and Fig. 5,
In figure: the hexa-atomic formula ultrasonic sensor of 1 circular double-face circuit board, 1-1,2(2-1-2-6) patch becket, the vibration of 3 metals
Son, 4 piezoelectric ceramics blocks, 5 patch metal blocks, 6 netted signal shielding shells, the public foot of 7 ultrasonic signals, 8(8-1-8-6) ultrasound
Wave signal pins, 9 control circuit boards, 9-1 external power input mouth, 9-2 control circuit module unit, 9-7 inductive mode electricity
Road modular unit, 9-3 signal enhanced processing modular unit, 9-4 control circuit board set screw hole, 9-5 induction module pressure stabilizing electricity
Source module unit, 9-6 control signal output mouth.
As shown in Figure 1, Figure 2, shown in Fig. 3, Fig. 4 and Fig. 5,
A kind of ultrasonic sensing module, including ultrasonic circuit plate and control circuit board.Patch is provided on ultrasonic circuit plate
Becket, patch metal block, piezoelectric ceramics block, metal oscillator and netted signal shielding shell form hexa-atomic formula ultrasonic sensor,
To realize the transmitting and reception of ultrasonic signal.External power supply passes through the external power input mouth above control circuit board, warp
Working power, fixed peace of the set screw hole due to module are provided to ultrasonic sensing module after power module of voltage regulation unit pressure stabilizing
Dress.
Power module of voltage regulation unit, signal enhanced processing modular unit, control circuit mould are provided with above control circuit board
The modular circuits such as module unit and inductive mode circuit module unit.Control circuit module unit is according to control circuit module unit
Setting requirements drive hexa-atomic formula ultrasonic sensor to emit and receive ultrasonic listening signal.In remote probe, to make ultrasound
Wave signal generates farther away detection range, and six groups of sensors can be used as transmitting-receiving integrated sensor and use, while emitting and receiving
Ultrasonic signal carries out long-distance barrier object search and lock onto target with this；In short-range detecting, control circuit module list
Six groups of inductors are divided into tri- kinds of different operating modes of 1+5,2+4 and 3+3, carry out rotation formula precise measurement, for real by member
The control requirement on border, and signal output will be controlled by the signal output port on circuit board.
The piezoelectric ceramics block of ultrasonic sensor is mounted on above patch becket；Becket is with the fixed piezoelectricity of rack form
Ceramic block forms ultrasonic signal inductor component, for transmitting and receiving ultrasonic sensing signal.
Patch metal block is located in patch becket；Becket soldering patch is mounted on double-sided PCB, with patch gold
Belong to block and form ultrasonic resonator chamber, after the completion of ultrasonic signal generation, resonant cavity space generates ultrasonic wave inertial signal
Damping vibration attenuation is reduced rapidly signal amplitude, to eliminate the remained shock interference generated after the completion of ultrasonic signal transmitting.
Metal oscillator is welded on above piezoelectric ceramics block, for transmitting and receiving ultrasonic signal.Equipped with six groups of ultrasonic waves
The circuit board of inductor is encapsulated in one with netted letter by the signal pins and external connection of circuit board bottom are arranged in
In number shielding case, a kind of hexa-atomic formula ultrasonic sensor is formed, for the sensor composite welding on control circuit board, composition is super
Sound wave induction module.
Control circuit board drives hexa-atomic formula ultrasonic sensor transmitting and received ultrasonic signal to detect obstructing objects, work
Under remote object search and short range induction precise measurement state, inductive signal is exported by control circuit board signal port.
Piezoelectric ceramics block on ultrasonic circuit plate is provided with six groups, is the circle that 60o is mounted on double-sided PCB with angle
In shape plane, hexa-atomic formula ultrasonic sensor is formed；6 six groups of independent supersonic sensings on circuit board answer structural body, can be same
When complete ultrasonic signal generation and reception, can according to detection environmental requirement, realize 1-6 between any combination, close
When distance is with long-range detection, induction sensitivity and reliability with higher.
The inductor that every group of piezoelectric ceramics block is formed can emit and also can receive ultrasonic signal；To meet control electricity
Road plate remotely with the TT&C requirement of short range.
Ultrasonic resonator chamber, for eliminating the remained shock generated after the completion of ultrasonic signal transmitting；When ultrasonic signal occurs
After the completion, resonant cavity space generates damping vibration attenuation to ultrasonic wave inertial signal, is reduced rapidly signal amplitude, to eliminate ultrasound
The remained shock interference generated after the completion of the transmitting of wave signal.
Metal oscillator is mounted on above piezoelectric ceramics block；The transmitting and reception of ultrasonic signal can efficiently be completed.
Double-sided PCB equipped with six groups of piezoelectric ceramics block assemblies is embedded in netted signal shielding shell, to eliminate the external world
Noise interference, the signal pins of ultrasonic sensor are exported by circuit board bottom, and sensor is facilitated to connect with external circuit.
The sensitive material of ultrasonic sensor is high temperature modification piezoelectric ceramics block, and the Curie temperature of piezoelectric ceramics block is 420oC-
500oC, piezoelectric ceramics block upper and lower surface are signal electrodes, are coated with the conductive silver serous coat with a thickness of 12um, connect with external circuit,
Piezoelectric ceramics block of material is PZT-4-PZT-8 class lead titanate piezoelectric ceramics, be mainly used for the production of ultrasonic sensor with
Manufacture.
Piezoelectric ceramics block top surface is fluted, and there is convex block in bottom surface, is embedded into becket, to guarantee convex portion and resonant cavity
Body space generates resonance.The metal oscillator is the round speaker shape metal dome with salient point, is welded on piezoelectric ceramics block
Transmitting and reception in groove, for ultrasonic signal.
Have in patch becket one it is with step, above for trapezoidal shape metal block, patch is welded on the Y word of circuit board
Above the circular pad of shape, with patch metal ring at a ultrasonic resonator chamber, this structure can be with efficient transmission ultrasound
Wave signal, after the completion of signal transmitting, signal amplitude is damped rapidly decaying, achievees the purpose that eliminate remained shock.
Patch metal block height is lower than patch becket 0.2mm, the cylindrical cavity space that inside is formed, packed height
The fire resistant resin of 0.8-1.7mm reaches optimal damping effect to match the ultrasonic signal of different frequency, rapidly more than elimination
Vibration interference.
Patch metal block height is lower than patch becket 0.2mm, the cylindrical cavity space that inside is formed, packed height
The fire resistant resin of 0.8-1.7mm reaches optimal damping effect to match the ultrasonic signal of different frequency, rapidly more than elimination
Vibration interference.
The sensor manufacturing process and step include:
Step 1: patch becket and patch metal block are soldered to circuit board top, form ultrasound by coating 5-30% argentiferous tin cream
Wave resonance chamber, inductor bracket component is fixedly mounted.
Step 2: in the fire resistant resin dry solidification that ultrasonic resonator chamber injecting height is 0.8-1.7mm, matching is super
Acoustic signals frequency determines resonance chamber space structure.
Step 3: piezoelectric ceramics block and metal oscillator are soldered to above patch becket by coating 5-30% argentiferous tin cream, Gu
Dingan County fills ultrasonic sensing body component.
Sensor on circuit board has six groups, and every group can occur ultrasonic signal, can also receive ultrasonic signal,
For meeting the detection of the induction under varying environment.
Ultrasonic sensor double-sided PCB is circle, and the circuit components with circuit board top, being mounted on front end is net
In the signal shielding shell of shape, is interfered with being isolated with extraneous noise, the reliability of sensor is provided.
Ultrasonic signal leg diameter 1.0mm silver plated metals line, in the bottom margin circular arrangement of circuit board, ultrasonic wave letter
Number public placement of foot is in wiring board center, edge above, and convenient to be connected together with control circuit composite board welding, composition surpasses
Sound wave induction module.
Netted signal shielding shell is cylindrical metal shell, and netted case is made in metal-back front end with shell one-pass molding,
There are a circular metal plate, fixing circuit board in rear end, this encapsulating structure makes sensor mask in a metal-back, eliminates signal
It is interfered with each other with the external world, improves the reliability of ultrasonic sensor.
The control circuit module unit and induction module signal enhanced processing modular unit of the induction module of control circuit board
The horizontal center of position and circuit board, control unit are used for the ultrasonic signal of output different frequency, and according to inductive mode
It is required that controlling hexa-atomic ultrasonic sensor carries out long-range and short range obstructing objects detection.Induction module signal enhanced processing mould
Module unit after the ultrasonic signal enhanced processing that will reflect back into, is supplied to control module unit.Partial below is power module of voltage regulation
Unit is supplied to module working power.External power supply input is used for on inductive signal output position also 4 feet of circuit board
Power input and control signal output.Fixed screw hole site is in circuit board level center edge, with the fixed ultrasound of installation
Wave induction module.
As can be seen from the above embodiments beneficial effect existing for the application is:
First: control circuit board drives the hexa-atomic formula ultrasonic sensor above ultrasonic circuit plate, detects for obstructing objects
When, it using multiple groups working sensor mode, realizes remote object search, locking and short range rotation formula precise measurement, improves induction
The detection accuracy and reliability of module.
Second: using the Y shape of circuit board copper foil setting, circular pad, by patch becket and patch metal block soldering
Face on circuit boards forms the ultrasonic sensor bracket for having ultrasonic resonator chamber, in resonance chamber, packed height
The fire resistant resin of 0.8-1.7mm forms a ultrasonic signal damped harmonic oscillation chamber, to eliminate ultrasonic signal transmitting rapidly
The remained shock interference generated afterwards.
Above description shows and describes several preferred embodiments of the present application, but as previously described, it should be understood that the application
Be not limited to forms disclosed herein, should not be regarded as an exclusion of other examples, and can be used for various other combinations,
Modification and environment, and the above teachings or related fields of technology or knowledge can be passed through within that scope of the inventive concept describe herein
It is modified.And changes and modifications made by those skilled in the art do not depart from spirit and scope, then it all should be in this Shen
It please be in the protection scope of appended claims.
Claims (10)
1. a kind of ultrasonic sensing module, including ultrasonic circuit plate and control circuit board, it is characterised in that: the ultrasonic wave
Patch becket, patch metal block, piezoelectric ceramics block, metal oscillator and netted signal shielding shell composition six are provided on circuit board
First formula ultrasonic sensor；The piezoelectric ceramics block of the ultrasonic sensor is mounted on above patch becket；The patch
Piece metal block is located in patch becket；The becket soldering patch is mounted on double-sided PCB, with patch metal block
Form ultrasonic resonator chamber；The control circuit board drives hexa-atomic formula ultrasonic sensor transmitting and received ultrasonic signal to visit
Obstructing objects are surveyed, inductive signal is exported by control circuit board.
2. ultrasonic sensing module according to claim 1, it is characterised in that:
Piezoelectric ceramics block on the ultrasonic circuit plate is provided with six groups, is that 60o is mounted on double-sided PCB with angle
On circular flat, hexa-atomic formula ultrasonic sensor is formed；
The inductor that every group of piezoelectric ceramics block is formed can emit and also can receive ultrasonic signal；
The ultrasonic resonator chamber, for eliminating the remained shock generated after the completion of ultrasonic signal transmitting；
The metal oscillator is mounted on above piezoelectric ceramics block；
The double-sided PCB of the electroceramics block assembly is embedded in netted signal shielding shell, and the signal of ultrasonic sensor draws
Foot is exported by circuit board bottom.
3. ultrasonic sensing module according to claim 1, it is characterised in that: the Curie temperature of the piezoelectric ceramics block
For 420oC-500oC；The piezoelectric ceramics block upper and lower surface is signal electrode, is coated with the conductive silver serous coat with a thickness of 12um；
The piezoelectric ceramics block of material is PZT-4-PZT-8 class lead titanate piezoelectric ceramics.
4. ultrasonic sensing module according to one of claims 1 or 2, it is characterised in that: the piezoelectric ceramics block top
Face is fluted, and there is convex block in bottom surface, is embedded into becket；The metal oscillator is that the round speaker shape pot with salient point is young
Piece is welded in the groove of piezoelectric ceramics block.
5. ultrasonic sensing module according to claim 1, it is characterised in that: there is a band in the patch becket
Have step, above for trapezoidal shape metal block, patch is welded on above the circular pad of Y shape of circuit board, with patch metal
Ring forms a ultrasonic resonator chamber；
The patch metal block height is lower than patch becket 0.2mm, and the cylindrical cavity space that inside is formed is filled high
Spend the fire resistant resin of 0.8-1.7mm.
6. ultrasonic sensing module according to claim 5, it is characterised in that: the fire resistant resin is in 300 DEG C
Thermal expansion coefficient be less than or equal to 75ppm/ DEG C；The fire resistant resin glass transition temperature is greater than 300 DEG C；Described
Fire resistant resin material is polytetrafluoroethylene (PTFE) or polyimides.
7. ultrasonic sensing module according to claim 1, it is characterised in that:
The sensor manufacturing process and step include:
Step 1: patch becket and patch metal block are soldered to circuit board top, form ultrasound by coating 5-30% argentiferous tin cream
Wave resonance chamber；
Step 2: in the fire resistant resin dry solidification that ultrasonic resonator chamber injecting height is 0.8-1.7mm；
Step 3: piezoelectric ceramics block and metal oscillator are soldered to above patch becket by coating 5-30% argentiferous tin cream.
8. ultrasonic sensing module according to claim 7, it is characterised in that: the sensor has six groups, and every group is
Ultrasonic signal can occur, ultrasonic signal can also be received.
9. ultrasonic sensing module according to claim 1, it is characterised in that:
The ultrasonic circuit plate is circular double-face circuit, and the circuit components with circuit board top, being mounted on front end is net
In the signal shielding shell of shape；
The ultrasonic signal leg diameter 1.0mm silver plated metals line, in the bottom margin circular arrangement of circuit board；Ultrasonic wave
The public foot of signal, position is in wiring board center, edge above；
The netted signal shielding shell is cylindrical metal shell, and netted case is in metal-back front end, with shell one-pass molding system
At there are a circular metal plate, fixing circuit board in rear end.
10. ultrasonic sensing module according to claim 1, it is characterised in that: the induction mould of the control circuit board
The control circuit module unit of block and induction module signal enhanced processing modular unit position are in the horizontal center of circuit board, partially
Lower section is power module of voltage regulation unit；External power supply input and inductive signal output position are also on 4 feet of circuit board；Fixed spiral shell
Wire hole position is in circuit board level center edge.
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| CN201910141274.5A CN109696678A (en) | 2019-02-26 | 2019-02-26 | Ultrasonic sensing module |
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| CN201910141274.5A CN109696678A (en) | 2019-02-26 | 2019-02-26 | Ultrasonic sensing module |
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