CN109668861A - The component backboard method of inspection after a kind of MWT lamination - Google Patents
The component backboard method of inspection after a kind of MWT lamination Download PDFInfo
- Publication number
- CN109668861A CN109668861A CN201811589117.2A CN201811589117A CN109668861A CN 109668861 A CN109668861 A CN 109668861A CN 201811589117 A CN201811589117 A CN 201811589117A CN 109668861 A CN109668861 A CN 109668861A
- Authority
- CN
- China
- Prior art keywords
- backboard
- light source
- inspection
- mwt
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/55—Specular reflectivity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
- G01N2021/0106—General arrangement of respective parts
- G01N2021/0112—Apparatus in one mechanical, optical or electronic block
Abstract
It the invention discloses the component backboard method of inspection after a kind of MWT lamination, comprises the following steps that and the component after lamination is flowed out into the completely black region of closing along assembly line, make backboard side towards upper and put in order positioning；Light source emitter emits mutual collimated light beam irradiation backboard, and light beam is after backboard reflects to light source receiver；Light source receiver converts optical signals into digital signal；Transmitting optical information that light source receiver is converted is compared to judge backboard with the presence or absence of bad phenomenon with pre-stored data information for industrial personal computer.Method of the invention improves detection accuracy, has saved the production cost of product, has huge economic benefit.
Description
Technical field
The invention belongs to solar cell module inspection technology fields, and in particular to component backboard is examined after a kind of MWT lamination
Proved recipe method.
Background technique
MWT(Metal Wrap Through, metal piercing winding technique), application is in solar cells.By swashing
Light punching, the technology of back wiring eliminate the main gate line of front electrode, the electrode of battery front side are threaded to the back side, electric in this way
The positive and negative electrode point in pond is all distributed in the back side of cell piece, effectively reduces the shading of front gate line, to improve conversion effect
Rate.
Backboard be MWT photovoltaic component encapsulating one of critical material, MWT photovoltaic module by tempered glass, battery pack, GPS,
Conductive core plate and backboard are bonded under certain temperature and pressure by the solidification of EVA.In lamination process, each encapsulating material
Thermal stability is inconsistent, easily leads to backboard and the bad phenomenons such as bulge, pit occur, therefore the inspection for being laminated postnotum is particularly important,
Backboard inspection at this stage relies primarily on artificial range estimation and examines, and be easy to cause missing inspection, it is more likely that and cause defective products to flow out, therefore,
It is necessary to provide a kind of methods to meet the method for inspection after backboard lamination.
Summary of the invention
Above-mentioned the deficiencies in the prior art are directed to, the purpose of the present invention is to provide component backboards after a kind of MWT lamination to examine
Proved recipe method is examined with to solve artificial range estimation in the prior art and be easy to cause missing inspection, it is more likely that the problem of causing defective products to flow out.
Method of the invention improves detection accuracy, has saved the production cost of product, has huge economic benefit.
In order to achieve the above objectives, The technical solution adopted by the invention is as follows:
The component backboard method of inspection after a kind of MWT lamination of the invention, comprises the following steps that
Component after lamination is flowed out into the completely black region of closing along assembly line, makes backboard side towards upper and put in order positioning；Light source hair
Emitter emits mutual collimated light beam irradiation backboard, and light beam is after backboard reflects to light source receiver；Light source receiver believes light
Number it is transformed into digital signal；Industrial personal computer compares the reflected light information that light source receiver is converted with pre-stored data information
It is right, judge backboard with the presence or absence of bad phenomenon.
Preferably, the method also includes bad phenomenons if it exists, then issue early warning, remind personnel to carry out secondary
Detection；Bad phenomenon if it does not exist, then along pipeline flow to subsequent processing.
Preferably, the method also includes: industrial personal computer by light source receiver receive light time sequencing and light source it is strong
Degree is to judge bad phenomenon existing for backboard.
Preferably, the light source emitter is semiconductor light source, light emitting diode (LED), laser diode or infrared
Emitting diode transmitter.
Preferably, the intensity of illumination of the light source emitter is 1000Lux.
Preferably, the light source emitter/light source receiver is 200mm apart from backboard.
Preferably, the light source receiver includes: photodiode, phototriode and photocell.
Preferably, the bad phenomenon includes: the bulge of backboard, pit.
Beneficial effects of the present invention:
Of the invention method operation, using easier, improve the efficiency and precision of inspection, quality control made to be improved,
Production cost can be greatly saved, huge economic benefit is brought for enterprise, there is extensive prospect of the application.
Detailed description of the invention
Fig. 1 is the schematic diagram of the method for the present invention.
Specific embodiment
For the ease of the understanding of those skilled in the art, the present invention is made further below with reference to embodiment and attached drawing
Bright, the content that embodiment refers to not is limitation of the invention.
The component backboard method of inspection uses light source emitter and light source receiver after MWT lamination of the invention, wherein light source
Transmitter is semiconductor light source, light emitting diode (LED), laser diode or infrared-emitting diode transmitter；Light source receives
Device includes: photodiode, phototriode and photocell.
In example, referring to Fig.1 shown in, the component backboard method of inspection after a kind of MWT lamination comprises the following steps that setting light
The intensity of illumination of source transmitter transmitting is 1000Lux, resets the reflectance data information of back veneer material, last set backboard
Data information when bulge, pit etc. are bad.
Component after lamination is flowed out into the completely black region of closing along assembly line, makes backboard side towards upper and put in order positioning, away from
From light source emitter/light source receiver 200mm；Light source emitter emits mutual collimated light beam irradiation backboard, and light beam is through backboard
To light source receiver after reflection, the reflected light that each item light of light source emitter transmitting generates after backboard reflects is returned along original route
It returns；Light source receiver converts optical signals into digital signal；Reflected light information that industrial personal computer converts light source receiver and in advance
The data information of storage is compared to judge backboard with the presence or absence of bad phenomenons such as backboard bulge, pits.
Bulge bad phenomenon if it exists, because bulge is there are difference in height, light source receiver is initially received reflection light, and
Due to reflection light a part because bulge reflects, part light source is made to be refracted to the area that light source receiver can not receive
Domain, industrial personal computer the case where judging bulge and issue early warning by the time sequencing for receiving light and the intensity of light source received
Prompt reminds personnel to carry out secondary detection；Bad phenomenon if it does not exist, then along pipeline flow to subsequent processing.
Pit bad phenomenon if it exists, because pit is there are difference in height, light source receiver finally receives reflection light, and
Due to reflection light a part because pit reflects, part light source is made to be refracted to the area that light source receiver can not receive
Domain, industrial personal computer the case where judging pit and issue early warning by the time sequencing for receiving light and the intensity of light source received
Prompt reminds personnel to carry out secondary detection；Bad phenomenon if it does not exist, then along pipeline flow to subsequent processing.
There are many concrete application approach of the present invention, the above is only a preferred embodiment of the present invention, it is noted that for
For those skilled in the art, without departing from the principle of the present invention, it can also make several improvements, this
A little improve also should be regarded as protection scope of the present invention.
Claims (9)
1. the component backboard method of inspection after a kind of MWT lamination, which is characterized in that comprise the following steps that
Component after lamination is flowed out into the completely black region of closing along assembly line, makes backboard side towards upper and put in order positioning；Light source hair
Emitter emits mutual collimated light beam irradiation backboard, and light beam is after backboard reflects to light source receiver；Light source receiver believes light
Number it is transformed into digital signal；Industrial personal computer compares the transmitting optical information that light source receiver is converted with pre-stored data information
To judging the backboard with the presence or absence of bad phenomenon.
2. the component backboard method of inspection after MWT lamination according to claim 1, which is characterized in that the method also includes:
Industrial personal computer receives time sequencing and the intensity of light source of light by light source receiver to judge bad phenomenon existing for backboard.
3. the component backboard method of inspection after MWT lamination according to claim 1 or 2, which is characterized in that the method is also wrapped
Include: bad phenomenon if it exists then issues early warning, and personnel is reminded to carry out secondary detection；Bad phenomenon if it does not exist, then along stream
Waterline flows to subsequent processing.
4. the component backboard method of inspection after MWT lamination according to claim 1, which is characterized in that the method also includes:
The reflected light that each item light of light source emitter transmitting generates after backboard reflects is returned along original route.
5. the component backboard method of inspection after MWT lamination according to claim 1, which is characterized in that the light source transmitting
Device is semiconductor light source, light emitting diode, laser diode or infrared-emitting diode transmitter.
6. the component backboard method of inspection after MWT lamination according to claim 1, which is characterized in that the light source transmitting
The intensity of illumination of device is 1000Lux.
7. the component backboard method of inspection after MWT lamination according to claim 1, which is characterized in that the light source transmitting
Device/light source receiver is 200mm apart from backboard.
8. the component backboard method of inspection after MWT lamination according to claim 1, which is characterized in that the light source receives
Device includes: photodiode, phototriode and photocell.
9. the component backboard method of inspection after MWT lamination according to claim 1, which is characterized in that the bad phenomenon
Include: the bulge of backboard, pit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811589117.2A CN109668861A (en) | 2018-12-25 | 2018-12-25 | The component backboard method of inspection after a kind of MWT lamination |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811589117.2A CN109668861A (en) | 2018-12-25 | 2018-12-25 | The component backboard method of inspection after a kind of MWT lamination |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109668861A true CN109668861A (en) | 2019-04-23 |
Family
ID=66146905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811589117.2A Pending CN109668861A (en) | 2018-12-25 | 2018-12-25 | The component backboard method of inspection after a kind of MWT lamination |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109668861A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56158904A (en) * | 1980-05-12 | 1981-12-08 | Nippon Sheet Glass Co Ltd | Method and device for measuring surface strain of surface having light reflexibility |
| JPS5973712A (en) * | 1982-10-20 | 1984-04-26 | Canon Inc | Flatness measuring device |
| CN1696672A (en) * | 2004-05-10 | 2005-11-16 | 富士通株式会社 | Surface inspecting apparatus and surface inspecting method |
| CN201615890U (en) * | 2009-10-10 | 2010-10-27 | 曹丽娟 | Non-contact plate glass surface crack detection device |
| CN102539441A (en) * | 2011-12-29 | 2012-07-04 | 中国科学院长春光学精密机械与物理研究所 | Inspection method for inspecting welding correctness of the device of device on circuit board in batch |
| CN205656148U (en) * | 2016-05-10 | 2016-10-19 | 深圳市恒达无限通信设备有限公司 | Novel mobile phone test tool |
| CN106370674A (en) * | 2016-08-29 | 2017-02-01 | 武汉华星光电技术有限公司 | Detection device and detection method for glass substrate |
| JP2017138119A (en) * | 2016-02-01 | 2017-08-10 | 株式会社リコー | Optical sensor system and shape recognition method |
| CN207423721U (en) * | 2017-11-16 | 2018-05-29 | 冠翔太阳能科技海安有限公司 | A kind of solar battery sheet printing quality on-line measuring device |
-
2018
- 2018-12-25 CN CN201811589117.2A patent/CN109668861A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56158904A (en) * | 1980-05-12 | 1981-12-08 | Nippon Sheet Glass Co Ltd | Method and device for measuring surface strain of surface having light reflexibility |
| JPS5973712A (en) * | 1982-10-20 | 1984-04-26 | Canon Inc | Flatness measuring device |
| CN1696672A (en) * | 2004-05-10 | 2005-11-16 | 富士通株式会社 | Surface inspecting apparatus and surface inspecting method |
| CN201615890U (en) * | 2009-10-10 | 2010-10-27 | 曹丽娟 | Non-contact plate glass surface crack detection device |
| CN102539441A (en) * | 2011-12-29 | 2012-07-04 | 中国科学院长春光学精密机械与物理研究所 | Inspection method for inspecting welding correctness of the device of device on circuit board in batch |
| JP2017138119A (en) * | 2016-02-01 | 2017-08-10 | 株式会社リコー | Optical sensor system and shape recognition method |
| CN205656148U (en) * | 2016-05-10 | 2016-10-19 | 深圳市恒达无限通信设备有限公司 | Novel mobile phone test tool |
| CN106370674A (en) * | 2016-08-29 | 2017-02-01 | 武汉华星光电技术有限公司 | Detection device and detection method for glass substrate |
| CN207423721U (en) * | 2017-11-16 | 2018-05-29 | 冠翔太阳能科技海安有限公司 | A kind of solar battery sheet printing quality on-line measuring device |
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Application publication date: 20190423 |