CN109665486B - Micro-cup and transfer printing preparation method and application thereof - Google Patents
Micro-cup and transfer printing preparation method and application thereof Download PDFInfo
- Publication number
- CN109665486B CN109665486B CN201811582504.3A CN201811582504A CN109665486B CN 109665486 B CN109665486 B CN 109665486B CN 201811582504 A CN201811582504 A CN 201811582504A CN 109665486 B CN109665486 B CN 109665486B
- Authority
- CN
- China
- Prior art keywords
- layer
- transfer printing
- chapped
- substrate
- microcup
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000010023 transfer printing Methods 0.000 title claims abstract description 25
- 238000002360 preparation method Methods 0.000 title claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 54
- 239000000758 substrate Substances 0.000 claims abstract description 49
- 238000004519 manufacturing process Methods 0.000 claims abstract description 11
- 239000010410 layer Substances 0.000 claims description 82
- 238000000034 method Methods 0.000 claims description 27
- 238000001723 curing Methods 0.000 claims description 16
- 229910010272 inorganic material Inorganic materials 0.000 claims description 10
- 239000011147 inorganic material Substances 0.000 claims description 10
- 239000011368 organic material Substances 0.000 claims description 10
- 239000000084 colloidal system Substances 0.000 claims description 9
- 238000000151 deposition Methods 0.000 claims description 8
- 230000008021 deposition Effects 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000007605 air drying Methods 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 4
- 239000004973 liquid crystal related substance Substances 0.000 claims description 4
- 238000006116 polymerization reaction Methods 0.000 claims description 4
- 239000002344 surface layer Substances 0.000 claims description 4
- 239000003054 catalyst Substances 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 claims description 3
- 230000008020 evaporation Effects 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 238000000016 photochemical curing Methods 0.000 claims description 3
- 238000009832 plasma treatment Methods 0.000 claims description 3
- 238000006557 surface reaction Methods 0.000 claims description 3
- 238000001029 thermal curing Methods 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 2
- 238000009462 micro packaging Methods 0.000 abstract description 7
- 238000001259 photo etching Methods 0.000 abstract description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 14
- 239000010408 film Substances 0.000 description 13
- 239000004205 dimethyl polysiloxane Substances 0.000 description 11
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 229920000139 polyethylene terephthalate Polymers 0.000 description 8
- 239000005020 polyethylene terephthalate Substances 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 7
- 239000004408 titanium dioxide Substances 0.000 description 7
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 5
- 241000842539 Rhagades Species 0.000 description 4
- 206010040849 Skin fissures Diseases 0.000 description 4
- -1 polyethylene terephthalate Polymers 0.000 description 4
- 239000008367 deionised water Substances 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- 238000000861 blow drying Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- UHKJHMOIRYZSTH-UHFFFAOYSA-N ethyl 2-ethoxypropanoate Chemical compound CCOC(C)C(=O)OCC UHKJHMOIRYZSTH-UHFFFAOYSA-N 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000003094 microcapsule Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00349—Creating layers of material on a substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/025—Duplicating or marking methods; Sheet materials for use therein by transferring ink from the master sheet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00349—Creating layers of material on a substrate
- B81C1/00373—Selective deposition, e.g. printing or microcontact printing
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/165—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field
- G02F1/166—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field characterised by the electro-optical or magneto-optical effect
- G02F1/167—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field characterised by the electro-optical or magneto-optical effect by electrophoresis
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Nonlinear Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Molecular Biology (AREA)
- Electrochemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Laminated Bodies (AREA)
Abstract
The invention relates to a micro-cup and a transfer printing preparation method and application thereof. The microcups are manufactured in a transfer printing mode, specifically, a chap line layer with chap lines is formed on one side surface of a substrate, the surface of the chap line layer is contacted with an uncured microcup material layer to be formed into the microcups, so that the chap lines on the chap line layer can be transferred to the microcup material layer, and the microcup material layer is cured to form the required microcups. The preparation method is simple and easy to implement, directly adopts a transfer printing mode, does not need to manufacture a complicated and fine imprinting mold compared with the traditional photoetching or imprinting mode and the like, can obviously reduce the cost, can avoid imprinting material residues and ensures the quality of products. By controlling the forming condition of the chapped grains, the size and the specific shape of the formed chapped grains can be controlled, so that the microcups with the required size or shape can be finally obtained to meet the corresponding micro-packaging requirement.
Description
Technical Field
The invention relates to the technical field of micro-packaging, in particular to a micro-cup and a transfer printing preparation method and application thereof.
Background
In the field of electronic paper, flexible liquid crystal display and some biological related fields, the microcups play a very important role as packaging carriers. The microcups have the advantages of micro-packaging, transparency, flexibility, uniform thickness and the like. In the field of electronic paper, the encapsulation of the microcups is more stable than that of microcapsules, and the microcups are not sensitive to the external environment and have good wear resistance. The traditional manufacturing method of the microcups comprises a hot stamping method, an ultraviolet stamping method, a mask photoetching method and the like. Wherein, the hot stamping method can leave residual stamping materials at the bottom of the micro-cup; the ultraviolet imprinting method needs to prepare a fine mold, and has complex working procedures and high cost; mask lithography is very costly.
Disclosure of Invention
Accordingly, there is a need for a microcup, a transfer printing method and an application thereof, which are free from residual imprint material, simple in manufacturing process and low in cost.
A transfer printing preparation method of a microcup comprises the following steps:
providing or manufacturing a substrate, and forming a chapped grain layer on one side surface of the substrate;
contacting the surface of the substrate with the chapped texture layer with an uncured microcup material layer to be manufactured, and transferring the surface of the microcup material layer to enable the microcup material layer to penetrate into cracks of the chapped texture layer;
and curing the transferred micro-cup material layer, and removing the substrate to obtain the micro-cup.
In one embodiment, the chapped texture layer is a thin film layer formed on the substrate, or the chapped texture layer is an intrinsic skin layer of the substrate.
In one embodiment, the method for preparing the chapped line layer on the substrate is selected from one or more of deposition, coating, surface reaction, evaporation and liquid curing;
correspondingly, the cracks on the chapped line layer are formed by one or more methods selected from the group consisting of drying, air drying, plasma treatment, colloid polymerization, deposition, surface shrinkage, surface expansion and a mode of changing the surface stress of the material.
In one embodiment, the cracks on the chapped texture layer form random textures, regular textures or textures formed by combining random textures and regular textures, wherein the regular textures are one-way regular textures or multi-way regular textures.
In one embodiment, the surface of the substrate is anisotropic or isotropic.
In one embodiment, the substrate is selected from one or more of an inorganic material and an organic material; and/or
The chapped grain layer is made of one or more materials selected from inorganic materials and organic materials; and/or
The material of the microcup material layer is selected from one or more of inorganic materials and organic materials.
In one embodiment, the microcup material layer is cured by one or more selected from the group consisting of photo-curing, thermal curing, catalyst curing, and chemical reaction curing.
In one embodiment, the transfer is performed by one or more transfers.
A microcup prepared by the transfer printing preparation method of any one of the microcups described in any one of the above embodiments.
The microcups can be applied to the preparation of electronic paper, flexible liquid crystal displays or biological micro-packaging materials.
The invention provides a method for manufacturing a microcup by a transfer printing mode, which is characterized in that a chapping line layer with cracks is formed on one side surface of a substrate, the surface of the chapping line layer is contacted with an uncured microcup material layer of the microcup to be formed, for example, a microcup material layer can be directly formed on the surface of the chapping line layer, one side of the chapping line layer of the substrate can also be placed on the surface of the formed microcup material layer, so that the microcup material layer can be infiltrated into the cracks of the chapping line layer, the chapping lines on the chapping line layer are transferred to the microcup material layer, and the required microcup can be formed after the microcup material layer is cured and the substrate is removed. The preparation method is simple and easy to implement, directly adopts a transfer printing mode, does not need to manufacture a complicated and fine imprinting mold compared with the traditional photoetching or imprinting mode and the like, can obviously reduce the cost, can avoid imprinting material residues and ensures the quality of products.
Random or regular chap grains can be formed by controlling the forming conditions of the cracks, and the size and the specific appearance of the formed cracks can be further controlled by controlling the conditions, so that the required pattern can be finally transferred to the microcup material layer to obtain microcups with required size or appearance to meet the corresponding micro-packaging requirements.
Drawings
FIG. 1 is a graph of random chapped lines of example 1;
FIG. 2 is a schematic view of the structured chapped lines of example 2.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The invention provides a transfer printing preparation method of a microcup, which comprises the following steps:
the method comprises the following steps: providing or manufacturing a substrate, and forming a chapped grain layer on one side surface of the substrate;
step two: contacting the surface of the substrate with the chapped grain layer with an uncured microcup material layer to be made, and transferring the surface of the microcup material layer to enable the microcup material layer to penetrate into cracks of the chapped grain layer;
step three: and curing the transferred micro-cup material layer, and removing the substrate to obtain the micro-cup.
The transfer printing is to form a convex pattern matched with the cracks on the rhagades texture layer on the surface of the microcup material layer by penetrating the surface of the microcup material layer into the cracks of the rhagades texture layer, which is different from the traditional manufacturing method of stamping or integrally transferring the convex pattern on other material layers to a target layer.
The surface of the substrate is anisotropic or isotropic. The substrate may be an inorganic material substrate such as a silicon substrate, an organic material substrate such as a PET (polyethylene terephthalate) film substrate, a PDMS (polydimethylsiloxane) film substrate, or the like, or a mixed substrate of an inorganic material and an organic material. The material of the chapped grain layer can also be selected from one or more of inorganic materials and organic materials. The material of the microcup material layer may also be selected from one or more of inorganic materials and organic materials.
The chapped texture layer can be a film layer formed on the substrate or an inherent surface layer of the substrate, namely, the surface layer of the substrate is chapped. Additionally arranging a film layer on the substrate, cracking the film layer to form a chapped grain layer, and integrally penetrating the formed cracks through the whole film layer to extend to the surface of the substrate, so that the depth consistency of the cracks at all positions is high, and the depth and other dimensions of the finally obtained microcup cup body are relatively uniform; the surface layer of the substrate is directly chapped to manufacture the chapped grain layer, the manufacturing process is simple, and the cost can be reduced.
The thickness of the substrate and the chapped grain layer is not limited, and the depth and the width of the crack are not limited, and the substrate and the chapped grain layer can be designed specifically according to needs.
In one embodiment, the method for preparing the chapped texture layer on the substrate may be selected from one or more of deposition, coating, surface reaction, evaporation and liquid curing, and may be one of the above methods or a combination of the above methods. Accordingly, the cracks in the chapped grain layer are formed by one or more methods selected from the group consisting of drying (including contact heating and non-contact baking), air drying, plasma treatment, colloid polymerization, deposition, surface shrinkage, surface expansion, and changing the surface stress of the material. The specific manner in which the material is caused to crack by altering the surface stress of the material may be selected from one or more of electrical excitation, light exposure, thermal expansion and mechanical stretching.
Cracks on the chapped grain layer form grains of machine grains, regular grains or combination of random grains and regular grains. Wherein, the regular lines are unidirectional regular lines or multidirectional regular lines.
In one specific example, the curing manner of the microcup material layer may be selected from one or more of photo curing, thermal curing, catalyst curing, and chemical reaction curing.
In the transfer, a desired pattern may be transferred to the surface of the microcup material layer by primary transfer, or the pattern may be transferred to the surface of the microcup material layer by secondary, tertiary, or the like multiple transfers.
The microcups prepared by the method can be applied to the preparation of electronic paper, flexible liquid crystal displays or biological micro-packaging materials.
The micro-cup is manufactured in a transfer printing mode, the method is simple and easy to implement, compared with the traditional photoetching or imprinting modes, a complex and fine imprinting mold does not need to be manufactured, the cost can be obviously reduced, residues of imprinting materials can be avoided, and the quality of products is ensured. Random or regular rhagades can be formed by controlling the forming condition of the rhagades, and the size and the specific appearance of the formed cracks can be further controlled by controlling the condition, so that the required pattern can be finally transferred to the microcup material layer to obtain microcups with required size or appearance to meet the corresponding micro-packaging requirement.
The following are specific examples.
Example 1
Example 1 provides a method for preparing random cracks on a surface, specifically by air-drying polymerization of a colloid. Among the main materials used are titanium dioxide P25 (average particle size 25 nm) white powder, ethanol (concentration 2mol/L), ethyl acetate and PET (polyethylene terephthalate) film. The preparation method comprises the following specific steps:
1. washing the PET film with ethanol and deionized water for 20 minutes respectively, and drying;
2. ultrasonically dispersing titanium dioxide P25 powder in 2mol/L ethanol, and adding a proper amount of ethyl acetate to adjust the dispersion degree of titanium dioxide P25 particles;
3. the obtained titanium dioxide P25 colloid was added at a concentration of 30ml/cm2The volume of the solution is dropped on the surface of PET, and the solution is uniformly spun;
4. the obtained PET titanium dioxide P25 was placed in a vacuum oven at 40 ℃ and dried for several minutes until cracks spontaneously formed on the substrate.
As shown in fig. 1, random stripes may be obtained.
Example 2
Embodiment 2 provides a preparation method of uniform cracks on a surface, and the specific mode is that a mechanical external force is applied to a light and brittle film arranged in a lattice manner. Wherein the substrate selected is PDMS (polydimethylsiloxane). The preparation process comprises the following steps:
1. coating PDMS on the mother film, curing, and removing, and introducing regular groove lattice with depth of 0.5 μm, diameter of 1.5 μm and distance of 10 μm on the surface;
2. placing the obtained PDMS film in a plasma surface treatment machine, vacuumizing to 20Pa, slowly introducing oxygen into the cavity until the pressure of the cavity is 40Pa, adjusting the power to 100%, opening the plasma surface treatment machine, treating for 30min, and forming a PDMS light brittle layer with the thickness of 50-300 nm on the surface of the PDMS film;
3. and applying uniform stress to two sides of the PDMS until the PDMS film generates slight deformation, annealing, and observing the obtained PDMS under a microscope.
As shown in fig. 2, regular stripes can be obtained.
Example 3
Example 3 provides a method for preparing random surface cracks by using a deposition method, which is specifically operated as follows:
1. taking a silicon wafer, cleaning the silicon wafer for three times in 20min by using deionized water, then ultrasonically cleaning the silicon wafer for three times in alcohol for 20min, blow-drying the silicon wafer by using nitrogen, and cleaning the silicon wafer for 2min by using an oxygen plasma cleaning machine;
2. placing a silicon wafer in a chemical vapor deposition cavity, and vacuumizing;
3. introduction of N2Maintaining the gas flow rate at 100sccm (1 sccm: 1ml/min), adjusting the temperature to 750 deg.C, maintaining the temperature for 60min, and depositing a layer of Si with a thickness of 600nm on the surface of the silicon wafer3N4Naturally cooling;
4. and annealing the obtained Si wafer, and observing the surface stripes to be random under a microscope.
Example 4
Example 4 provides a method for fabricating a random-sized microcup. The specific scheme is as follows:
1. uniformly mixing 76% of aromatic acid methyl methacrylate, 3% of ethyl ethoxypropionate, 10% of 1-6-hexanediol diacrylate, 6% of beta-hydroxyethyl methacrylate and 3% of a high-molecular leveling agent 836 with 2% of a photoinitiator 4265, and uniformly coating the obtained mixed colloid in a clean culture dish to obtain a mixed colloid with the thickness of about 1 mm;
2. carefully attaching the PET substrate with the titanium dioxide chapped grain layer obtained in the example 1 on the surface of the mixed colloid, placing the mixed colloid in an ultraviolet curing box at 100% power, exposing for 30min, and taking out;
3. and taking down the PET substrate, and ultrasonically cleaning the obtained microcups in deionized water for 15min to remove the titanium dioxide P25 powder.
The obtained microcups are observed under a microscope, the obtained microcups retain random sizes, different sizes and different shapes of chapped stripes, and the crazes are generated by films additionally added to the surface of the substrate, extend to the surface of the substrate and keep more uniform thickness, so that the depth of the microcups is kept relatively uniform.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. The transfer printing preparation method of the microcups is characterized by comprising the following steps of:
providing or manufacturing a substrate, and forming a chapped grain layer on one side surface of the substrate;
contacting the surface of the substrate with the chapped texture layer with an uncured microcup material layer to be made into a microcup, and performing transfer printing on the surface of the microcup material layer, wherein the transfer printing is to enable the microcup material layer to penetrate into cracks of the chapped texture layer, and form a raised pattern matched with the cracks on the chapped texture layer on the surface of the microcup material layer;
and curing the transferred micro-cup material layer, and removing the substrate to obtain the micro-cup.
2. The method of claim 1, wherein the chapped texture layer is a film layer formed on the substrate, or the chapped texture layer is an intrinsic surface layer of the substrate.
3. The method of claim 2, wherein the chapped layer is formed on the substrate by one or more methods selected from deposition, coating, surface reaction, evaporation and liquid curing;
correspondingly, the cracks on the chapped line layer are formed by one or more methods selected from the group consisting of drying, air drying, plasma treatment, colloid polymerization, deposition, surface shrinkage, surface expansion and a mode of changing the surface stress of the material.
4. The method of claim 1, wherein the cracks of the cracked texture layer form random texture, regular texture or texture combining random texture and regular texture, wherein the regular texture is one-way regular texture or multi-way regular texture.
5. The transfer printing method of claim 1, wherein the surface of the substrate is anisotropic or isotropic.
6. The transfer printing preparation method of the microcups of any one of claims 1 to 5, wherein the substrate is made of one or more materials selected from inorganic materials and organic materials; and/or
The chapped grain layer is made of one or more materials selected from inorganic materials and organic materials; and/or
The material of the microcup material layer is selected from one or more of inorganic materials and organic materials.
7. The transfer printing preparation method of the microcup according to any one of claims 1 to 5, wherein the curing manner of the microcup material layer is selected from one or more of photo curing, thermal curing, catalyst curing and chemical reaction curing.
8. The transfer printing preparation method of the microcups of any one of claims 1-5, wherein the transfer printing is performed by one-time transfer printing or multiple transfer printing.
9. A microcup prepared by the transfer printing method of any one of claims 1 to 8.
10. Use of the microcups of claim 9 for the preparation of electronic paper, flexible liquid crystal displays or biological micro-encapsulation materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811582504.3A CN109665486B (en) | 2018-12-24 | 2018-12-24 | Micro-cup and transfer printing preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811582504.3A CN109665486B (en) | 2018-12-24 | 2018-12-24 | Micro-cup and transfer printing preparation method and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109665486A CN109665486A (en) | 2019-04-23 |
| CN109665486B true CN109665486B (en) | 2020-08-28 |
Family
ID=66145949
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811582504.3A Active CN109665486B (en) | 2018-12-24 | 2018-12-24 | Micro-cup and transfer printing preparation method and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109665486B (en) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5772905A (en) * | 1995-11-15 | 1998-06-30 | Regents Of The University Of Minnesota | Nanoimprint lithography |
| CN101567301B (en) * | 2008-04-21 | 2010-09-29 | 力成科技股份有限公司 | Method for forming viscous grain by wafer separation |
| WO2010072675A2 (en) * | 2008-12-23 | 2010-07-01 | Pfeffer, Christian | Method for producing thin, free-standing layers of solid state materials with structured surfaces |
| JP5263560B2 (en) * | 2009-08-25 | 2013-08-14 | 日産化学工業株式会社 | High hardness imprint material |
| EP3564745B1 (en) * | 2012-02-14 | 2022-05-04 | E Ink California, LLC | Microcups designs for electrophoretic display |
| CN103030098B (en) * | 2012-12-21 | 2015-08-05 | 西安交通大学 | A kind of large-area nano gap electrod-array walk abreast manufacture method |
| CN104803342B (en) * | 2014-01-23 | 2016-08-17 | 清华大学 | The preparation method of bowl-shape metal Nano structure |
| CN104045054A (en) * | 2014-05-14 | 2014-09-17 | 中国科学院合肥物质科学研究院 | Method for preparing high-adhesion micro-nano array structure film through wet etching and reverse transfer printing |
-
2018
- 2018-12-24 CN CN201811582504.3A patent/CN109665486B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN109665486A (en) | 2019-04-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2014041904A1 (en) | Method for manufacturing laminate provided with uneven shape, and transfer film | |
| CN108424543B (en) | Preparation method of light transmittance adjustable force response type surface wrinkles | |
| CN108102913B (en) | Three-dimensional cell culture chip based on soft lithography technology, preparation method and application thereof | |
| TWI386297B (en) | Method of manufacturing plastic surface with superhydrophobicity and high transparency | |
| CN105731364B (en) | PDMS elastomer micro-nano processing method based on surface oxidation control transfer printing | |
| KR102144987B1 (en) | Refractive index adjustable nano particle, Light scattering layer comprising the same, and Method for producing the same | |
| CN110642222A (en) | High-length-diameter-ratio micron column array, and preparation method and application thereof | |
| CN104960286A (en) | Controllable flexible transfer method of two-dimensional materials | |
| CN102060262A (en) | Method for manufacturing micro-nano fluid control system by using low-pressure bonding technology | |
| CN102795595A (en) | Preparation method of wrinkles by combining selected area ultraviolet ozonization and solvent swelling and application thereof | |
| CN103880001A (en) | Preparation method of patterned graphene | |
| KR102569627B1 (en) | Nanoimprint lithography processes and patterned substrates obtainable therefrom | |
| CN109665486B (en) | Micro-cup and transfer printing preparation method and application thereof | |
| KR101291727B1 (en) | Method for manufacturing implint resin and implinting method | |
| Weiss et al. | All-inorganic thermal nanoimprint process | |
| CN105731365A (en) | PDMS elastomer micro-nano processing method based on crosslinking control control transfer printing | |
| JP5655384B2 (en) | Uneven substrate and manufacturing method thereof | |
| JP2011114180A (en) | Imprinting substrate and method for imprint transfer | |
| US8465655B1 (en) | Method of manufacturing polymer nanopillars by anodic aluminum oxide membrane and imprint process | |
| CN108933193B (en) | Transfer method and application of ferromagnetic semiconductor film | |
| CN104733292B (en) | Preparing method for ultrathin self-supporting monocrystal barium titanate thin film | |
| CN105331950A (en) | Manufacturing method of two-dimensional perovskite film | |
| CN108528078A (en) | Nanostructure transfer method and the method for preparing multi-layer nano structure using stacking method | |
| CN108249773B (en) | Preparation method of glass surface antireflection coating | |
| CN112010258B (en) | Preparation method of composite film with micro-nano structure array |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |