CN109661111A - Flexible copper-clad plate and preparation method thereof based on liquid crystal polymer film - Google Patents

Flexible copper-clad plate and preparation method thereof based on liquid crystal polymer film Download PDF

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Publication number
CN109661111A
CN109661111A CN201811546455.8A CN201811546455A CN109661111A CN 109661111 A CN109661111 A CN 109661111A CN 201811546455 A CN201811546455 A CN 201811546455A CN 109661111 A CN109661111 A CN 109661111A
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China
Prior art keywords
liquid crystal
clad plate
flexible copper
polymer film
crystal polymer
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CN201811546455.8A
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Chinese (zh)
Inventor
刘开煌
虞成城
宋喆
刘飞华
苏聪
王凤
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Shenzhen Sunway Communication Co Ltd
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Shenzhen Sunway Communication Co Ltd
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Priority to CN201811546455.8A priority Critical patent/CN109661111A/en
Publication of CN109661111A publication Critical patent/CN109661111A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00Coating on the layer surface
    • B32B2255/06Coating on the layer surface on metal layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00Coating on the layer surface
    • B32B2255/26Polymeric coating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0137Materials
    • H05K2201/0141Liquid crystal polymer [LCP]

Abstract

The invention discloses a kind of flexible copper-clad plate and preparation method thereof based on liquid crystal polymer film, method includes: to mix the liquid crystalline polymer powders for being used to make flexible copper-clad plate with solvent, obtains suspended nitride;The suspended nitride is coated in the copper foil for being used to make flexible copper-clad plate, obtains the flexible copper-clad plate.Liquid crystal polymer is mixed with solvent in the form of a powder, is then coated on copper foil surface, due to not by shearing force in forming process, so as to obtain uniform, isotropic copper-clad plate with liquid crystal polymer film.The problem of production method of flexible copper-clad plate of the invention, manufacturing process is simple, can well solve liquid crystal polymer film anisotropy.

Description

Flexible copper-clad plate and preparation method thereof based on liquid crystal polymer film
Technical field
The present invention relates to circuit board technology fields, more particularly to flexible copper-clad plate and its system based on liquid crystal polymer film Make method.
Background technique
Flexible copper-clad plate (FCCL) is processing raw material for flexible circuit board (FPC), includes at least two materials, one is exhausted Edge substrate, such as polyimides (PI) film or liquid crystal polymer (LCP) film;Another kind is metallic conductor foil, main copper foil.
Currently, there are mainly three types of preparation methods for flexible copper-clad plate: pressing method, rubbing method and sputtering galvanoplastic.
Since communication frequency develops towards high frequency direction, the dielectric loss of insulating substrate is lower, more advantageously reduces letter Number transmission loss.Liquid crystal polymer is a kind of novel high polymer material to grow up phase early 1980s.Due in height Frequently there is lower dielectric constant and dielectric loss, the flexibility that liquid crystal polymer film is communicated in high-frequency high-speed under (1~40GHz) It is had been widely used in wiring board.
The main preparation methods of liquid crystal polymer film have: extrusion blow molding processes and extrusion are cast double daraf(reciprocals of farad).Application No. is 03156468.2 Chinese invention patent discloses a kind of production method of inflation film, and the inflation film of production has smooth Surface not will form gap and/or fold.Application No. is 200410080693.6 Chinese invention patents to disclose a kind of thermoplastic The manufacturing method of property liquid crystal polymer film, can manufacture at low temperature for flexibility circuit substrate or Mulitilayer circuit board etc. Insulating materials, the liquid crystal polymer films that control thermal expansion coefficient.
Since liquid crystal polymer has height-oriented property under shearing force, using the film of conventional method preparation in MD Mechanical property with higher on direction (Machine Direction, mechanical direction), and in the direction TD (Transverse Direction, perpendicular to mechanical direction) on tearing strength it is very poor, that is, have anisotropy.Using with anisotropic thin The flexible copper-clad plate poor reliability of film preparation.
Summary of the invention
The technical problems to be solved by the present invention are: provide a kind of flexible copper-clad plate based on liquid crystal polymer film and its Production method, the problem of liquid crystal polymer film anisotropy can be well solved.
In order to solve the above-mentioned technical problem, the technical solution adopted by the present invention are as follows:
A kind of production method of the flexible copper-clad plate based on liquid crystal polymer film, will be used to make the liquid of flexible copper-clad plate Crystalline polymer powder is mixed with solvent, obtains suspended nitride;The suspended nitride is coated in and is used to make flexible copper-clad plate On copper foil, the flexible copper-clad plate is obtained.
Another technical solution that the present invention uses are as follows:
A kind of flexible copper-clad plate based on liquid crystal polymer film is covered by the flexibility based on liquid crystal polymer film The production method of copper sheet is prepared.
The beneficial effects of the present invention are: liquid crystal polymer is mixed with solvent in the form of a powder, is then coated on copper Foil surface, due to not by shearing force in forming process, so as to obtain uniform, isotropic there is liquid The copper-clad plate of crystalline polymer film.The production method of flexible copper-clad plate of the invention, manufacturing process is simple, can solve well Certainly the problem of liquid crystal polymer film anisotropy.
Specific embodiment
To explain the technical content, the achieved purpose and the effect of the present invention in detail, it is explained below in conjunction with embodiment.
The most critical design of the present invention is: liquid crystal polymer is mixed with solvent in the form of a powder, then it is coated on Copper foil surface, available isotropic copper-clad plate with liquid crystal polymer film.
A kind of production method of the flexible copper-clad plate based on liquid crystal polymer film, will be used to make the liquid of flexible copper-clad plate Crystalline polymer powder is mixed with solvent, obtains suspended nitride;The suspended nitride is coated in and is used to make flexible copper-clad plate On copper foil, the flexible copper-clad plate is obtained.
As can be seen from the above description, the beneficial effects of the present invention are: liquid crystal polymer is mixed with solvent in the form of a powder Close, be then coated on copper foil surface, due to not by shearing force in forming process, so as to obtain uniformly, Isotropic copper-clad plate with liquid crystal polymer film.The production method of flexible copper-clad plate of the invention, manufacturing process Simply, the problem of liquid crystal polymer film anisotropy can be well solved.
Further, the flexible copper-clad plate is successively dried and is pressed together.
Seen from the above description, be dried and be conducive to make solvent volatilization clean, and make between powder and Certain adhesion strength is generated between powder and copper foil;Liquid crystal polymer film densification can be made by being pressed together, and also make liquid crystal The thickness of thin polymer film is more uniform.
Further, polymerizable mesogenic composition granule is subjected under atmosphere of inert gases pulverization process, it is poly- obtains the liquid crystal Object powder is closed, the temperature of the pulverization process is lower than -40 DEG C.
Seen from the above description, inert gas can be nitrogen and argon gas etc., and liquid crystalline polymer powders can be effectively prevented Oxidation;When temperature is lower than -40 DEG C, advantageously forms thinner powder and improve milling efficiency, pulverization process can crush It is carried out in machine.
Further, the particle size range of the liquid crystalline polymer powders is 1~100 μm.
Seen from the above description, when the partial size of liquid crystalline polymer powders is less than 1 μm, manufacture difficulty is big, and also will increase Powder explosion risk;When partial size is greater than 100 μm, it is easy to settle in a solvent, layering, is not suitable for preparing suspended nitride.
Further, the solvent is at least one of DMF, NMP, DMAC and DMSO.
Seen from the above description, the type of solvent, which can according to need, is selected.
Further, the content of liquid crystalline polymer powders is 10~70vol.% in the suspended nitride.
Seen from the above description, the content of liquid crystalline polymer powders can according to need and be configured in suspended nitride.
Further, the liquid crystalline polymer powders include the first liquid crystal components and the second liquid crystal components, first liquid Brilliant component and the second liquid crystal components are thermotropic liquid crystal, and the fusing point of first liquid crystal components is than second liquid crystal components Fusing point is 20~60 DEG C high, and the volume ratio of first liquid crystal components and the second liquid crystal components is 10:1~100:1.
Seen from the above description, two kinds of thermotropic liquid crystal polymer powders of selection be can according to need.
Further, dispersing agent is added in Xiang Suoshu suspended nitride, the dispersing agent is neopelex, second two At least one of pure and mild methyl ethyl ketone.
Seen from the above description, dispersing agent is added to be conducive to liquid crystal polymer and be uniformly dispersed in a solvent, prevents to sink Drop.
Further, the liquid crystalline polymer powders further include third liquid crystal components, and the third liquid crystal components are molten cause Type liquid crystal, and the content of third liquid crystal components is 0.1~3vol% in the liquid crystalline polymer powders.
Seen from the above description, a certain amount of molten cause type liquid crystal is added can be improved the viscosity of suspended nitride, after being also convenient for Continuous coating film forming.
Another technical solution of the present invention are as follows:
A kind of flexible copper-clad plate based on liquid crystal polymer film is covered by the flexibility based on liquid crystal polymer film The production method of copper sheet is prepared.
The embodiment of the present invention one are as follows:
A kind of production method of the flexible copper-clad plate based on liquid crystal polymer film, includes the following steps:
The liquid crystalline polymer powders for being used to make flexible copper-clad plate are mixed with solvent, obtain suspended nitride.Polymerizable mesogenic Object powder, which can be, directly obtains powder during preparing liquid crystal polymer, also by polymerizable mesogenic composition granule in inert gas Pulverization process is carried out under atmosphere, obtains the liquid crystalline polymer powders.The temperature of the pulverization process is lower than -40 DEG C, indifferent gas Body can be nitrogen and argon gas etc., and pulverization process can carry out in pulverizer.In the present embodiment, the liquid crystalline polymer powders Particle size range be preferably 1~100 μm, further preferably 10~15 μm.The solvent is DMF (dimethylformamide), NMP At least one of (N-Methyl pyrrolidone), DMAC (dimethyl acetamide) and DMSO (dimethyl sulfoxide), can be according to need It selects one or more.In the present embodiment, dispersing agent can also be added into suspended nitride, the dispersing agent is dodecyl At least one of benzene sulfonic acid sodium salt, ethylene glycol and methyl ethyl ketone.Finally, liquid crystalline polymer powders contain in the suspended nitride Amount is 10~70vol%.
In the present embodiment, the liquid crystalline polymer powders include the first liquid crystal components and the second liquid crystal components, described first Liquid crystal components and the second liquid crystal components are thermotropic liquid crystal, the fusing point (Tm of first liquid crystal components1) than second liquid Fusing point (the Tm of brilliant component2) it is 20~60 DEG C high, and the volume ratio of first liquid crystal components and the second liquid crystal components be 10:1~ 100:1.Preferably, the liquid crystalline polymer powders further include third liquid crystal components, and the third liquid crystal components are molten cause type liquid Crystalline substance, and the content of third liquid crystal components is 0.1~3vol% in the liquid crystalline polymer powders.First liquid crystal components, the second liquid Brilliant component and the content of third liquid crystal components can be configured according to specific needs.
The suspended nitride is coated in the copper foil for being used to make flexible copper-clad plate, obtains the flexible copper-clad plate, so The flexible copper-clad plate is successively dried and is pressed together afterwards.
Suspended nitride is coated on copper foil surface on coating machine, coating method can select scraper type coating, drum-type Coating, squash type coating in any one.Copper foil can be any one in calendering copper and cathode copper.In the present embodiment, root Painting parameter is adjusted according to the thickness of the solid content of liquid crystalline polymer powders, required liquid crystal polymer film.Coating thickness is preferably 50~300 μm, the liquid crystalline polymer powders that the maximum temperature of drying process is set as minimum than fusing point in coating sizing-agent are high by 2~10 ℃.Drying process preferably carries out under inert protective atmosphere, is beneficial to prevent the oxidation of liquid crystalline polymer powders coating and copper foil, It is preferably nitrogen or argon gas that inertia, which protects gas,.It is dried so that solvent and dispersing agent quickly volatilize completely, and make liquid crystal Between polymer powder, certain adhesion strength is generated between liquid crystalline polymer powders and copper foil, i.e., forms one in copper foil surface Layer liquid crystalline polymer powders coating.
It is pressed together and is carried out in laminating machine or crawler type pressing machine, by the flexible copper-clad plate after drying process in certain temperature Densification is carried out under degree and pressure, thus the good liquid crystal polymer film copper-clad plate of forming properties.Laminating machine or crawler type pressure Conjunction machine is to be parallel to thickness direction to the pressure that liquid crystal polymer film applies, the shearing force in no vertical thickness direction, because And the orientation of liquid crystal polymer film will not change.The temperature being pressed together is preferably Tm2+ 5 DEG C~Tm1Between, pressure is preferably 1~10MPa.Since the liquid crystalline polymer powders of at least two different melting points of selection are matched, high-melting-point liquid crystal polymer powder End ensure that certain melt strength during densification, it is possible to reduce glue overflow amount ensure that the thickness of film;Low melting point Liquid crystalline polymer powders can be filled in the gap between high-melting-point powder, improve the consistency of film.
The embodiment of the present invention two are as follows:
A kind of production method of the flexible copper-clad plate based on liquid crystal polymer film, exists with the difference of embodiment one In:
By VECTRA A950 (280 DEG C of fusing point), C950 (320 DEG C of fusing point) (can be bought by Alibaba's platform) Graininess liquid crystal polymer resin is crushed in Lowtemperaturepulverizer respectively, and screening obtains the fine powder that partial size is 20 μm.C950 with A950 is matched according to volume ratio 20:1, is distributed in nmp solvent, and the dispersing agent methyl ethyl ketone of 1vol% is then added, Prepare the suspended nitride that solid content is 50vol%.
It is coated in comma roller scraper coating machine, applies the copper foil that cloth base material is 12 μ m-thicks, suspended nitride coating thickness is 100 μm, coating speed 0.5m/min.The baking oven first segment temperature of drying process is 200 DEG C, and the second section is 245 DEG C, third section It is 285 DEG C, Section four is 100 DEG C, and is full of nitrogen circulation in baking oven, and baking oven length is 20m.After coating process, obtain The flexible copper-clad plate of single side.
By two flexible copper-clad plates in such a way that coating is to coating lamination, be then placed in flat plate mold, in laminating machine Carry out hot-pressing densification.The pressure 5MPa of laminating machine, temperature are 310 DEG C, and pressure-maintaining and heat-preservation 5min, then pressure maintaining is cooled to 120 DEG C It takes out, obtains double face copper.
The embodiment of the present invention three are as follows:
A kind of production method of the flexible copper-clad plate based on liquid crystal polymer film, exists with the difference of embodiment two In:
By VECTRA A950 (280 DEG C of fusing point), C950 (320 DEG C of fusing point) (can be bought by Alibaba's platform) Graininess liquid crystal polymer resin is crushed in Lowtemperaturepulverizer respectively, and screening obtains the fine powder that partial size is 1 μm.C950 and A950 It is matched, is distributed in nmp solvent according to volume ratio 10:1, the dispersing agent methyl ethyl ketone of 1vol%, preparation is then added Solid content is the suspended nitride of 10vol% out.
It is coated in comma roller scraper coating machine, applies the copper foil that cloth base material is 12 μ m-thicks, suspended nitride coating thickness is 50 μm, coating speed 0.5m/min.The baking oven first segment temperature of drying process is 200 DEG C, and the second section is 245 DEG C, third section It is 285 DEG C, Section four is 100 DEG C, and is full of nitrogen circulation in baking oven, and baking oven length is 20m.After coating process, obtain The flexible copper-clad plate of single side.
By two flexible copper-clad plates in such a way that coating is to coating lamination, be then placed in flat plate mold, in laminating machine Carry out hot-pressing densification.The pressure 4MPa of laminating machine, temperature are 310 DEG C, and pressure-maintaining and heat-preservation 5min, then pressure maintaining is cooled to 120 DEG C It takes out, obtains double face copper.
The embodiment of the present invention four are as follows:
A kind of production method of the flexible copper-clad plate based on liquid crystal polymer film, exists with the difference of embodiment two In:
By VECTRA A950 (280 DEG C of fusing point), C950 (320 DEG C of fusing point) (can be bought by Alibaba's platform) Graininess liquid crystal polymer resin is crushed in Lowtemperaturepulverizer respectively, and screening obtains the fine powder that partial size is 100 μm.C950 with A950 is matched according to volume ratio 100:1, is distributed in nmp solvent, and the dispersing agent methyl ethyl ketone of 2vol% is then added, Prepare the suspended nitride that solid content is 70vol%.
It is coated in comma roller scraper coating machine, applies the copper foil that cloth base material is 12 μ m-thicks, suspended nitride coating thickness is 200 μm, coating speed 0.3m/min.The baking oven first segment temperature of drying process is 200 DEG C, and the second section is 245 DEG C, third section It is 285 DEG C, Section four is 100 DEG C, and is full of nitrogen circulation in baking oven, and baking oven length is 20m.After coating process, obtain The flexible copper-clad plate of single side.
By two flexible copper-clad plates in such a way that coating is to coating lamination, be then placed in flat plate mold, in laminating machine Carry out hot-pressing densification.The pressure 10MPa of laminating machine, temperature are 310 DEG C, and pressure-maintaining and heat-preservation 5min, then pressure maintaining is cooled to 120 DEG C It takes out, obtains double face copper.
Performance test
It is poly- to obtain liquid crystal for the layers of copper that the flexible copper-clad plate that embodiment two to example IV is prepared is etched away to surface Object film is closed, tensile strength, consistency test is carried out, obtains test result as shown in Table 1.
1 the performance test results of table
From the test result of table 1 it is found that the prepared flexible copper-clad plate of the present invention, insulating substrate is in MD and TD two The mechanical property in direction is suitable, and isotropic is presented, and consistency is also very high.
In conclusion a kind of flexible copper-clad plate and preparation method thereof based on liquid crystal polymer film provided by the invention, Liquid crystal polymer is mixed with solvent in the form of a powder, is then coated on copper foil surface, in forming process due to not by To shearing force, so as to obtain uniform, isotropic copper-clad plate with liquid crystal polymer film.Of the invention The production method of flexible copper-clad plate, manufacturing process is simple, can well solve that liquid crystal polymer film is anisotropic to ask Topic.
The above description is only an embodiment of the present invention, is not intended to limit the scope of the invention, all to utilize this hair Equivalents made by bright specification are applied directly or indirectly in relevant technical field, similarly include of the invention In scope of patent protection.

Claims (10)

1. a kind of production method of the flexible copper-clad plate based on liquid crystal polymer film, which is characterized in that will be used to make flexibility The liquid crystalline polymer powders of copper-clad plate are mixed with solvent, obtain suspended nitride;The suspended nitride is soft coated in being used to make On the copper foil of property copper-clad plate, the flexible copper-clad plate is obtained.
2. the production method of the flexible copper-clad plate according to claim 1 based on liquid crystal polymer film, which is characterized in that The flexible copper-clad plate is successively dried and is pressed together.
3. the production method of the flexible copper-clad plate according to claim 1 based on liquid crystal polymer film, which is characterized in that Polymerizable mesogenic composition granule is subjected to pulverization process under atmosphere of inert gases, obtains the liquid crystalline polymer powders, the crushing The temperature of processing is lower than -40 DEG C.
4. the production method of the flexible copper-clad plate according to claim 1 based on liquid crystal polymer film, which is characterized in that The particle size range of the liquid crystalline polymer powders is 1~100 μm.
5. the production method of the flexible copper-clad plate according to claim 1 based on liquid crystal polymer film, which is characterized in that The solvent is at least one of DMF, NMP, DMAC and DMSO.
6. the production method of the flexible copper-clad plate according to claim 1 based on liquid crystal polymer film, which is characterized in that The content of liquid crystalline polymer powders is 10~70vol% in the suspended nitride.
7. the production method of the flexible copper-clad plate according to claim 1 based on liquid crystal polymer film, which is characterized in that The liquid crystalline polymer powders include the first liquid crystal components and the second liquid crystal components, first liquid crystal components and the second liquid crystal group Dividing is thermotropic liquid crystal, and the fusing point of first liquid crystal components is 20~60 DEG C higher than the fusing point of second liquid crystal components, and The volume ratio of first liquid crystal components and the second liquid crystal components is 10:1~100:1.
8. the production method of the flexible copper-clad plate according to claim 1 based on liquid crystal polymer film, which is characterized in that Dispersing agent is added into the suspended nitride, the dispersing agent is in neopelex, ethylene glycol and methyl ethyl ketone At least one.
9. the production method of the flexible copper-clad plate according to claim 7 based on liquid crystal polymer film, which is characterized in that The liquid crystalline polymer powders further include third liquid crystal components, and the third liquid crystal components are molten cause type liquid crystal.
10. a kind of flexible copper-clad plate based on liquid crystal polymer film, which is characterized in that by claim 1-9 any one institute The production method for the flexible copper-clad plate based on liquid crystal polymer film stated is prepared.
CN201811546455.8A 2018-12-18 2018-12-18 Flexible copper-clad plate and preparation method thereof based on liquid crystal polymer film Pending CN109661111A (en)

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CN110027299A (en) * 2019-04-25 2019-07-19 江阴骏驰复合材料有限公司 A kind of liquid crystal polymer high frequency double face copper and preparation method thereof and pressing device
JP2021012975A (en) * 2019-07-08 2021-02-04 Tdk株式会社 Printed wiring board, multilayer printed wiring board, and manufacturing method of printed wiring board
CN112433405A (en) * 2020-11-24 2021-03-02 中国科学技术大学 Liquid crystal polymer substrate and processing method thereof
WO2021120534A1 (en) * 2019-12-20 2021-06-24 江门市德众泰工程塑胶科技有限公司 Preparation method for copper clad laminate having low dielectric constant and high peel strength, and copper clad laminate and application thereof
WO2021134218A1 (en) * 2019-12-30 2021-07-08 瑞声声学科技(深圳)有限公司 Copper-clad plate and preparation method therefor
CN113597103A (en) * 2021-07-07 2021-11-02 安徽鸿海新材料股份有限公司 Preparation method of high-frequency high-TG copper-clad plate
CN113698864A (en) * 2020-05-22 2021-11-26 臻鼎科技股份有限公司 Liquid crystal polymer composition, copper-clad substrate and preparation method thereof
WO2022042412A1 (en) * 2020-08-24 2022-03-03 深圳市信维通信股份有限公司 Liquid crystal polymer film for 5g communication flexible copper clad laminate and preparation method therefor
TWI796650B (en) * 2021-03-16 2023-03-21 台虹科技股份有限公司 Metal-clad laminate

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CN110027299A (en) * 2019-04-25 2019-07-19 江阴骏驰复合材料有限公司 A kind of liquid crystal polymer high frequency double face copper and preparation method thereof and pressing device
CN110027299B (en) * 2019-04-25 2021-04-30 江阴骏驰新材料科技有限公司 Liquid crystal polymer high-frequency double-sided copper-clad plate and preparation method and pressing device thereof
JP2021012975A (en) * 2019-07-08 2021-02-04 Tdk株式会社 Printed wiring board, multilayer printed wiring board, and manufacturing method of printed wiring board
JP7238648B2 (en) 2019-07-08 2023-03-14 Tdk株式会社 Printed wiring board, multilayer printed wiring board, and printed wiring board manufacturing method
WO2021120534A1 (en) * 2019-12-20 2021-06-24 江门市德众泰工程塑胶科技有限公司 Preparation method for copper clad laminate having low dielectric constant and high peel strength, and copper clad laminate and application thereof
WO2021134218A1 (en) * 2019-12-30 2021-07-08 瑞声声学科技(深圳)有限公司 Copper-clad plate and preparation method therefor
CN113698864A (en) * 2020-05-22 2021-11-26 臻鼎科技股份有限公司 Liquid crystal polymer composition, copper-clad substrate and preparation method thereof
WO2022042412A1 (en) * 2020-08-24 2022-03-03 深圳市信维通信股份有限公司 Liquid crystal polymer film for 5g communication flexible copper clad laminate and preparation method therefor
CN112433405A (en) * 2020-11-24 2021-03-02 中国科学技术大学 Liquid crystal polymer substrate and processing method thereof
CN112433405B (en) * 2020-11-24 2022-04-19 中国科学技术大学 Liquid crystal polymer substrate and processing method thereof
TWI796650B (en) * 2021-03-16 2023-03-21 台虹科技股份有限公司 Metal-clad laminate
CN113597103A (en) * 2021-07-07 2021-11-02 安徽鸿海新材料股份有限公司 Preparation method of high-frequency high-TG copper-clad plate

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