CN109656047B - Substrate and preparation method - Google Patents
Substrate and preparation method Download PDFInfo
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- CN109656047B CN109656047B CN201811510414.3A CN201811510414A CN109656047B CN 109656047 B CN109656047 B CN 109656047B CN 201811510414 A CN201811510414 A CN 201811510414A CN 109656047 B CN109656047 B CN 109656047B
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
- G02F1/13394—Gaskets; Spacers; Sealing of cells spacers regularly patterned on the cell subtrate, e.g. walls, pillars
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
- G02F1/13396—Spacers having different sizes
Abstract
The invention relates to the technical field of display, in particular toThe substrate comprises a substrate base plate, a pixel array unit frame arranged on the substrate base plate, an optical film, a color filter and an indium tin oxide film which are arranged on the substrate base plate and are sequentially arranged from bottom to top. Also provides a substrate preparation method, a pixel array unit frame is prepared on the substrate, and SiO with a certain thickness is preparedxOr SiOxAnd SiNxThe optical film with the structure is prepared, and a color filter, an indium tin oxide film and a main support post and an auxiliary support post are prepared on the optical film. The substrate can improve the light transmittance, reduce the heat generation of the display, reduce the power consumption of the product and save the cost.
Description
Technical Field
The invention relates to the technical field of display, in particular to a substrate and a preparation method thereof.
Background
With the development of Display panel technology, various liquid Crystal displays (L liquid Crystal Display, L ED) are increasingly incorporated into life, and the application fields are wider.
In the conventional LCD industry, the backlight module of the display is composed of a substrate, a filter, a polarizer and many other devices, in these devices, since the Thin Film Transistor (TFT) array can block light to some extent, the polarizer and the color filter can absorb part of light, so that the transmittance of light becomes small, the polarizers and the Color filters reduce the transmittance of light and absorb the light, so that a part of the light emitted by the backlight plate is lost in the transmission process, statistics shows that only about 5% of the light can transmit the display, the transmittance of a common Color Filter (CF) substrate to the light is low, the transmittance of a traditional single-layer tin-doped Indium Tin Oxide (ITO) film to the light is also low, therefore, the resource waste is greatly caused, and the reduction of the power consumption of the product and the saving of the use cost are not facilitated.
In summary, the polarizer and the color filter in the conventional display absorb most of the light, so that the transmittance of the light is reduced, the light is greatly lost, and the power consumption of the product is further increased.
Disclosure of Invention
The invention provides a substrate and a preparation method thereof, which are used for solving the problems of low light transmittance and large light loss of devices such as a CF substrate in a backlight module in the conventional display device.
In order to solve the technical problems, the technical scheme provided by the invention is as follows:
according to a first aspect of embodiments of the present disclosure, there is provided a substrate including:
a substrate base plate;
a pixel array unit frame disposed on the substrate base plate;
and the optical film, the color filter and the indium tin oxide thin film are arranged on the substrate base plate in sequence from bottom to top.
According to a preferred embodiment of the present invention, the pixel array unit frame is disposed between the optical film and the base substrate.
According to a preferred embodiment of the present invention, the pixel array unit frame is disposed on the ito film.
According to a preferred embodiment of the present invention, an RGB color-resistance pixel layer is further disposed between the pixel array unit frame and the optical film.
According to a preferred embodiment of the present invention, the substrate further comprises a supporting pillar.
According to a preferred embodiment of the present invention, the supporting pillars are disposed on the indium tin oxide film.
According to a preferred embodiment of the present invention, the optical film is made of SiNx and SiOx.
According to a preferred embodiment of the present invention, the optical film is SiOx.
According to a preferred embodiment of the present invention, the optical film is a SiO2 antireflection film, and the SiO2 antireflection film has a thickness of
According to a second aspect of the present invention, there is also provided a substrate preparation method comprising:
step S100, preparing a pixel array unit frame on a substrate by a black matrix process,
step S110, based on step S100Preparing SiO with a certain thicknessxOr SiOxAnd SiNxAn optical film with the structure, and a color filter and an indium tin oxide film are prepared on the optical film,
and step S120, preparing the main and auxiliary supporting columns on the basis of the step S110.
According to a preferred embodiment of the present invention, between the step S100 and the step S110, further comprising:
step S200, preparing an RGB color-resistance pixel layer based on step S100.
According to a preferred embodiment of the present invention, the preparation processes of the step S100 and the step S110 are interchangeable.
In conclusion, the beneficial effects of the invention are as follows:
the existing substrate and the CF substrate film layer are improved, and the optical film with a certain thickness is additionally arranged on the CF substrate film system structure, so that the optical film can improve the light transmittance, reduce the loss of light in the backlight module, reduce the heating condition of the display, increase the amount of light reflected out of the display, reduce the power consumption of the product and save the cost.
Drawings
In order to illustrate the embodiments or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the invention, and it is obvious for a person skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic view of a substrate structure according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a film system according to an embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view of a substrate structure according to a second embodiment of the present invention;
FIG. 4 is a schematic cross-sectional view of a substrate structure according to a third embodiment of the present invention;
fig. 5 is a flowchart of a method for manufacturing a substrate according to an embodiment of the invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.
As shown in fig. 1, fig. 1 is a schematic structural diagram of a substrate according to the present invention, the substrate structure includes a substrate 101, an optical film 102, a color filter 103, an ITO film 104, a primary and secondary support pillars 105, and a pixel array unit frame 106, in this embodiment, the optical film 102, the color filter 103, and the ITO film 104 are sequentially disposed on the substrate 101 from bottom to top, the pixel array unit frame 106 and the primary and secondary support pillars 105 are disposed on the ITO film 104, the primary and secondary support pillars 105 support devices on the support pillars, and the primary and secondary support pillars 105 have different lengths, so as to provide secondary protection for the devices, and a color-blocking pixel layer may be disposed on the pixel array unit frame 106.
As shown in fig. 2, fig. 2 is a schematic view of a film system structure according to the present invention. The film structure comprises an optical film 202, a color filter 203, and an ITO film layer 204, wherein the optical film 202, the color filter 203, and the ITO film layer 204 are sequentially distributed from bottom to top.
The optical film 202 may be made of SiOxIs composed of or consists of SiNxAnd SiOxTogether forming. In the present embodiment, taking the optical film 202 as an antireflection film as an example, the optical films 202 are respectively SiOxAnd SiNx+SiOxThe comparison group is the conventional CF substrate with a common thickness of 135 nm. Experimental comparison data obtained by testing the transmittance of visible light having a wavelength in the range of 500nm to 650nm are shown in table 1 below:
TABLE 1 comparison of transmittance of conventional and inventive substrates
It can be seen that when the optical film 202 of the present invention is added to the substrate, the light is visible light when the wavelength of the light is in the range of 500nm to 650nm, and the transmittance of the light is enhanced when the light passes through the substrate of the present invention, so that the light passing through the display screen is also enhanced accordingly, thereby improving the performance of the device.
When the optical film is SiO2While performing SiO with different thicknesses2Film experiments, when SiO2Film thickness
The whole transmittance wave band of the substrate moves towards the long wave direction, and the transmittance of the long wave is higher than that of the short wave; film thickness
The transmittance wave band of the substrate is wholly moved to the short wave direction, and waveform deformation occurs, which shows that the transmittance is periodically changed, and in SiO2The film thickness range is:
the range of the improvement of the transmittance of the substrate is the largest.
Meanwhile, when the optical film is SiO2When the film is coated, the reflectivity of light in the backlight module substrate is 7-9% higher than that of the light in the common backlight module substrate, and the light transmittance is improved: 1.4% -2.31%, and is in a stable state.
Fig. 3 is a schematic structural cross-sectional view of a substrate according to a second embodiment of the present invention, as shown in fig. 3. In fig. 3, the substrate structure includes a substrate 301, an optical film 302, a color filter 303, an ITO film 304, main and auxiliary support pillars 305, and a pixel array unit frame 306. At this time, the pixel array unit frame 306 is firstly disposed on the substrate base plate 301, and then the optical film 302, the color filter 303, and the ITO film layer 304 are sequentially prepared from bottom to top. After the light is reflected, the light still passes through the optical film 302, the color filter 303, and the ITO film layer 304, and as can be seen from the above experiment, the transmittance of the light is also improved, and the anti-reflection rate is increased.
As shown in fig. 4, fig. 4 is a schematic structural cross-sectional view of a substrate according to a third embodiment of the present invention. The substrate structure comprises a substrate 401, an optical film 402, a color filter 403, an Indium Tin Oxide (ITO) film layer 404, a main support column 405 and an auxiliary support column 405, and a pixel array unit frame 406. During preparation, the pixel array unit frame 406 is arranged on the substrate 401, then R, G, B color-resistant pixel layers are prepared between the pixel array unit frames 406, then an optical film 402, a color filter 403 and an ITO film layer 404 with a certain thickness are sequentially arranged on the color-resistant pixel layers from bottom to top, and finally a main support pillar 405 is arranged on the ITO film layer 404. Therefore, different light still passes through the film system of the invention after passing through the color resistance pixel layer, the anti-reflection performance of the light is enhanced after passing through the film system, and the transmittance of the light is also improved.
As shown in fig. 5, the present invention further provides a method for manufacturing a substrate, and fig. 5 is a flowchart of the method for manufacturing a substrate according to the present invention.
Step S100, preparing a pixel array unit frame on a substrate by a black matrix process,
step S110, preparing SiO with a certain thickness based on step S100xOr SiOxAnd SiNxAn optical film with the structure, and a color filter and an indium tin oxide film are prepared on the optical film,
and step S120, preparing the main and auxiliary supporting columns on the basis of the step S110.
In the above manufacturing process, since the light permeability is mainly enhanced after passing through the optical film of the present invention, there may be a step S200 between the step S100 and the step S110, and R, G, B color-resistant pixel layers are prepared on the basis of the step S100. Meanwhile, the preparation sequences of the step S100 and the step S110 can be interchanged, and the light permeability is not affected after the interchange.
The substrate and the method for manufacturing the substrate provided by the embodiment of the present invention are described in detail above, and the principle and the embodiment of the present invention are explained in detail herein by applying specific examples, and the description of the above embodiments is only used to help understanding the technical scheme and the core idea of the present invention; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (9)
1. A substrate, comprising:
a substrate base plate;
a pixel array unit frame disposed on the substrate base plate;
the optical film, the color filter and the indium tin oxide thin film are arranged on the substrate base plate and are sequentially arranged from bottom to top;
the material of the optical film comprises SiOx or a mixed material of SiNx and SiOx; when the optical film is SiO2In the case of an optical film, the SiO2The optical film has a thickness of
2. The substrate according to claim 1, wherein the pixel array unit frame is disposed between the optical film and the base substrate.
3. The substrate of claim 1, wherein the pixel array cell frame is disposed over the indium tin oxide film.
4. The substrate according to claim 2, wherein an RGB color-resistance pixel layer is further disposed between the pixel array unit frame and the optical film.
5. The substrate of claim 1, further comprising support posts.
6. The substrate of claim 5, wherein the support posts are disposed on the indium tin oxide film.
7. A method for manufacturing a substrate, comprising:
step S100, preparing a pixel array unit frame on a substrate by a black matrix process,
step S110, preparing SiO with a certain thickness based on step S100xOr SiOxAnd SiNxAn optical film with the structure, and a color filter and an indium tin oxide film are prepared on the optical film, wherein when the optical film is an SiO2 optical film, the thickness of the SiO2 optical film is
And step S120, preparing the main and auxiliary supporting columns on the basis of the step S110.
8. The method for manufacturing a substrate according to claim 7, further comprising, between the step S100 and the step S110:
step S200, preparing an RGB color-resistance pixel layer based on step S100.
9. The method of claim 7, wherein the preparation sequence of the step S100 and the step S110 is interchangeable.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811510414.3A CN109656047B (en) | 2018-12-11 | 2018-12-11 | Substrate and preparation method |
| PCT/CN2019/074959 WO2020118887A1 (en) | 2018-12-11 | 2019-02-13 | Substrate and preparation method |
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| CN201811510414.3A CN109656047B (en) | 2018-12-11 | 2018-12-11 | Substrate and preparation method |
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| CN109656047A CN109656047A (en) | 2019-04-19 |
| CN109656047B true CN109656047B (en) | 2020-08-04 |
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| CN114822282B (en) * | 2021-01-29 | 2023-11-28 | 京东方科技集团股份有限公司 | Display panel, display device and method for manufacturing display panel |
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| KR20050069531A (en) * | 2003-12-31 | 2005-07-05 | 엘지.필립스 엘시디 주식회사 | Liquid crystal display device |
| CN102879948B (en) * | 2012-09-29 | 2015-10-21 | 京东方科技集团股份有限公司 | Color membrane substrates, liquid crystal indicator and method for making |
| CN103151468B (en) * | 2013-03-07 | 2015-08-19 | 深圳市华星光电技术有限公司 | A kind of Organic Light Emitting Diode and preparation method thereof, display unit |
| CN105223724B (en) * | 2015-10-08 | 2018-04-27 | 深圳市华星光电技术有限公司 | Quantum dot liquid crystal display device |
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| CN109656047A (en) | 2019-04-19 |
| WO2020118887A1 (en) | 2020-06-18 |
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